CN1273824C - Detection and control system used for sheet sticking machine - Google Patents
Detection and control system used for sheet sticking machine Download PDFInfo
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- CN1273824C CN1273824C CN 200310117627 CN200310117627A CN1273824C CN 1273824 C CN1273824 C CN 1273824C CN 200310117627 CN200310117627 CN 200310117627 CN 200310117627 A CN200310117627 A CN 200310117627A CN 1273824 C CN1273824 C CN 1273824C
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- 238000001514 detection method Methods 0.000 title claims abstract description 31
- 239000000463 material Substances 0.000 claims description 30
- 238000005476 soldering Methods 0.000 claims description 30
- 230000005622 photoelectricity Effects 0.000 claims description 17
- 239000000126 substance Substances 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 claims description 7
- 238000012423 maintenance Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 2
- 239000013078 crystal Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 238000005286 illumination Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000009418 renovation Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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Abstract
The present invention relates to a system used for detecting and controlling a sheet sticking machine, which comprises a photoelectric transducer (1), an amplifying circuit (2), a comparison circuit (3), a trigger circuit (4) and a signal processing device (5), wherein the photoelectric transducer (1) comprises a light source and a photoelectric device, and the light source is arranged in the position of crystal leakage detection; the photoelectric device is arranged in the vacuum slot of a welding head, and the output end of the photoelectric transducer (1) is connected with the input end of the amplifying circuit (2); the output end of the amplifying circuit (2) is connected with the input end of the comparison circuit (3), and the output end of the comparison circuit (3) is connected with the input end of the trigger circuit (4); the output end of the trigger circuit (4) is connected with the input end of the signal processing device (5). The light source used by the photoelectric transducer (1) is a light emitting diode LED3, and the photoelectric device is a photosensitive diode S1. The present invention not only has low price, but also satisfies the requirements of detection effects. In addition, the brightness adjustment of the light source of a sheet picking position and a sheet sticking position is integrated in the present invention, and the light source is the common light emitting diode with high brightness; an adjusting circuit is simple at low cost.
Description
1, technical field:
The present invention is that a kind of die Bonder that is used for is in die Bonder soldering tip high-speed motion process, can detect reliably rapidly whether to leak and pick up wafer or whether suction nozzle is stopped up by foreign material, and give signal processing system with this omission signal or foreign material jam signal and make detection and the control system that corresponding failure is handled, belong to the renovation technique of used detection of die Bonder and control system.
2, background technology:
Die Bonder in the course of the work, its soldering tip utilizes the vacsorb wafer picking up the sheet position, moves to the bonding die position and discharges wafer, goes up the paste weld wafer to be implemented in matrix (as lead frame or pcb board).Because soldering tip vacuum aperture minimum has only 0.18mm, is picking up the sheet position, if vacuum suction force is stopped up by foreign material less than die attach power or suction nozzle, then soldering tip is drawn less than wafer, takes place to leak and picks up wafer; Or because mechanical vibration in the soldering tip high-speed motion process, the wafer that soldering tip has been drawn drops, and causing in the matrix relevant position does not have the weldbonding wafer, and the finished product rate is descended.At present, the die Bonder of Chinese domestic use is imported product, the domestic conceptual phase that still is in.The used light source of the brilliant detection system of the leakage of imported product is a light transmitting fiber, leaks brilliant sensor and is the external high sensitive phototriode of producing, the two equal price costliness.In addition, picking up sheet position and bonding die position, the light source of its camera is regulated part and generally all is independent of the brilliant detection system of leakage, and adopts light transmitting fiber as light source, and its price is expensive equally.
3, summary of the invention:
The objective of the invention is to consider the problems referred to above and provide a kind of can not only detect reliably rapidly whether to leak pick up wafer or whether suction nozzle is stopped up by foreign material, and give signal processing system with this omission signal or foreign material jam signal and make detection that is used for die Bonder and the control system that corresponding failure is handled.The present invention is simple in structure, and assembling is easy, and cost is low, and can regulate the brightness of picking up sheet position and the used light source of bonding die position camera simply and easily.
Theory diagram of the present invention as shown in Figure 1, include electro-optical pickoff (1), amplifying circuit (2), comparator circuit (3), trigger circuit (4), signal processing apparatus (5), wherein electro-optical pickoff (1) includes light source and photoelectric device, its light source places Lou brilliant detection position, photoelectric device places the soldering tip vacuum slot, and the output terminal of electro-optical pickoff (1) is connected with the input end of amplifying circuit (2), the output terminal of amplifying circuit (2) is connected with the input end of comparator circuit (3), the output terminal of comparator circuit (3) is connected with the input end of trigger circuit (4), and the output terminal of trigger circuit (4) is connected with the input end of signal processing apparatus (5).
The light source of above-mentioned electro-optical pickoff (1) is a LED 3, photoelectric device is photodiode S1, LED 3 is installed in soldering tip from picking up the sheet position to the brilliant detection position of the leakage the motion path of bonding die position, and photodiode S1 is installed in and makes to leak brilliant and foreign material clogging sensor in the soldering tip vacuum slot.
Above-mentioned amplifying circuit (2) includes operational amplifier U1A and peripheral cell resistance R 2 thereof, R3, R4, R5, capacitor C 2, comparator circuit (3) includes voltage comparator U1B and peripheral cell resistance R 6 thereof, variable resistor RW2, and trigger circuit (4) include d type flip flop U2A and peripheral cell capacitor C 1 thereof, C3, C4.The output terminal of amplifier U1A is connected with the negative input end of voltage comparator U1B, and the positive input terminal of amplifier U1A is connected with resistance R 2, R5, and negative input end is connected with resistance R 5 by resistance R 4 ground connection between the positive input terminal of amplifier U1A and the output terminal; The positive input terminal of voltage comparator U1B is connected with the variable resistor RW2 of adjustable reference voltage and is connected with+5V power supply by resistance R 6, and the output terminal of voltage comparator U1B is connected with the hour hands input end of trigger U2A; The D of trigger U2A end is connected with+5V power supply, and the reversed-phase output of trigger U2A is connected with the input end of signal processing apparatus (5), and the clear terminal of trigger U2A is connected with the output terminal of signal processing apparatus (5).One termination of photodiode S1+5V power supply, another termination R2, R3.
Said signal processing device (5) is an industrial control computer, industrial control computer is isolated input-output card by photoelectricity and is connected with trigger U2A, wherein the reversed-phase output of trigger U2A is connected with the input end that photoelectricity is isolated input card, and the clear terminal of trigger U2A is connected with the output terminal that photoelectricity is isolated output card.
The output terminal of above-mentioned voltage comparator U1B also is connected with Lou crystalline substance or foreign material stop up pilot lamp LED1, and the negative electrode of pilot lamp LED1 is connected with the output terminal of voltage comparator U1B, and the anode of LED1 passes through resistance R 7 and is connected with+5V power supply.
The reversed-phase output of above-mentioned trigger U2A also is connected with Lou crystalline substance or foreign material and stops up indication and keep lamp LED2, and indication keeps the negative electrode of lamp LED2 to be connected with the reversed-phase output of trigger U2A, and the anode of LED2 passes through resistance R 10 and is connected with+5V power supply.
Above-mentioned+5V power supply also is connected with the LED 4 that sheet position camera light source is picked up in conduct by the resistance R 9 and the adjustable resistance RW1 of fixed resistance value.
Above-mentioned+5V power supply also the resistance R 8 by fixed resistance value and adjustable resistance RW3 is connected with LED 5 as bonding die position camera light source.
The present invention is owing to adopt at soldering tip and high brightness LED is installed to the motion path of bonding die position and is made light source from picking up the sheet position, the structure that photodiode makes to leak brilliant and foreign material clogging sensor is installed in the soldering tip vacuum nozzle, the present invention amplifies by the electric current of operational amplifier to photodiode, and be connected with trigger by voltage comparator, trigger is connected with signal processing system.Therefore, detection light source that the present invention is used and sensor are homemade mill run, and not only low price, and detection effect reaches requirement, to realize the production domesticization of die Bonder; In addition, the light-source brightness that the present invention is integrated picks up sheet position and bonding die position camera is regulated, and light source uses common high brightness LED, and regulating circuit is simple, and cost is low.Be that a kind of design is ingenious, function admirable, convenient and practical detection that is used for die Bonder and control system.
4, description of drawings:
Fig. 1 is a theory diagram of the present invention;
Fig. 2 is circuit theory diagrams of the present invention;
Fig. 3 is the silk-screen figure of embodiment of the invention circuit board.
5, embodiment:
Embodiment:
Theory diagram of the present invention as shown in Figure 1, include electro-optical pickoff (1), amplifying circuit (2), comparator circuit (3), trigger circuit (4), signal processing apparatus (5), wherein electro-optical pickoff (1) includes light source and photoelectric device, its light source places Lou brilliant detection position, photoelectric device places the soldering tip vacuum slot, and the output terminal of electro-optical pickoff (1) is connected with the input end of amplifying circuit (2), the output terminal of amplifying circuit (2) is connected with the input end of comparator circuit (3), the output terminal of comparator circuit (3) is connected with the input end of trigger circuit (4), and the output terminal of trigger circuit (4) is connected with the input end of signal processing apparatus (5).
The light source of above-mentioned electro-optical pickoff (1) is a LED 3, photoelectric device is photodiode S1, LED 3 is installed in soldering tip from picking up the sheet position to the brilliant detection position of the leakage the motion path of bonding die position, and photodiode S1 is installed in and makes to leak brilliant and foreign material clogging sensor in the soldering tip vacuum slot.
Above-mentioned amplifying circuit (2) includes operational amplifier U1A and peripheral cell resistance R 2 thereof, R3, R4, R5, capacitor C 2, comparator circuit (3) includes voltage comparator U1B and peripheral cell resistance R 6 thereof, variable resistor RW2, and trigger circuit (4) include d type flip flop U2A and peripheral cell capacitor C 1 thereof, C3, C4.The output terminal of amplifier U1A is connected with the negative input end of voltage comparator U1B, and the positive input terminal of amplifier U1A is connected with resistance R 2, R5, and negative input end is connected with resistance R 5 by resistance R 4 ground connection between the positive input terminal of amplifier U1A and the output terminal; The positive input terminal of voltage comparator U1B is connected with the variable resistor RW2 of adjustable reference voltage and is connected with+5V power supply by resistance R 6, and the output terminal of voltage comparator U1B is connected with the hour hands input end of trigger U2A; The D of trigger U2A end is connected with+5V power supply, and the reversed-phase output of trigger U2A is connected with the input end of signal processing apparatus (5), and the clear terminal of trigger U2A is connected with the output terminal of signal processing apparatus (5).One termination of photodiode S1+5V power supply, another termination R2, R3.
Said signal processing device (5) is an industrial control computer, industrial control computer is isolated input-output card by photoelectricity and is connected with trigger U2A, wherein the reversed-phase output of trigger U2A is connected with the input end that photoelectricity is isolated input card, and the clear terminal of trigger U2A is connected with the output terminal that photoelectricity is isolated output card.
The output terminal of above-mentioned voltage comparator U1B also is connected with Lou crystalline substance or foreign material stop up pilot lamp LED1, and the negative electrode of pilot lamp LED1 is connected with the output terminal of voltage comparator U1B, and the anode of LED1 passes through resistance R 7 and is connected with+5V power supply.
The reversed-phase output of above-mentioned trigger U2A also is connected with Lou crystalline substance or foreign material and stops up indication and keep lamp LED2, and indication keeps the negative electrode of lamp LED2 to be connected with the reversed-phase output of trigger U2A, and the anode of LED2 passes through resistance R 10 and is connected with+5V power supply.
Above-mentioned+5V power supply also is connected with the LED 4 that sheet position camera light source is picked up in conduct by the resistance R 9 and the adjustable resistance RW1 of fixed resistance value.
Above-mentioned+5V power supply also the resistance R 8 by fixed resistance value and adjustable resistance RW3 is connected with LED 5 as bonding die position camera light source.
The silk-screen figure of embodiment of the invention circuit board as shown in Figure 3, J1, J2, J3, J4 are the three-pin connector socket among the figure, J5 is four needle connector sockets; The external high brightness light emitting diode LED 3 of J1 is done to leak brilliant detection light source, and the external work of J2 leaks the photodiode S1 of brilliant detecting sensor; The 1st, 2 pins of J5 are external+anode and the negative terminal of 5V power supply, and the photoelectricity of the external industrial control computer of the 3rd pin of J5 is isolated the input of input card, and the photoelectricity of the external industrial control computer of the 4th pin of J5 is isolated the output of output card; J3, J4 are external respectively as picking up sheet position and bonding die position high brightness light emitting diode LED 4, the LED5 of camera light source separately, R1, R2, R3, R4, R5, R6, R7, R8, R9, R10 are general resistance, RW2 is accurate adjustable resistance, and RW1, RW3 are general adjustable resistance.C1, C2, C3, C4 are filter capacitor.U1A, U1B are integrated operational amplifier LM2904, and U2A is d type flip flop integrated circuit 74LS74.
When the present invention worked, computer control system was when powering on, and photoelectricity is isolated the zero clearing input end that low level pulse of output card output is given d type flip flop, the reversed-phase output output high level of d type flip flop.In the soldering tip motion process, except that leaking brilliant detection position, in other any position, no matter whether soldering tip is drawn wafer or do not stopped up by foreign material, owing to there is not light source irradiation, photodiode is high resistant; When leaking brilliant detection position, if soldering tip has been drawn wafer or stopped up by foreign material, vacuum slot is plugged on soldering tip motion road, and the light of light emitting diode can not shine the photodiode in the suction nozzle, thereby photodiode also is high resistant; When photodiode was high resistant, the input voltage of operational amplifier was zero, and output voltage also is zero, through comparer and given voltage ratio, comparer output high level leaks crystalline substance or foreign material and stops up pilot lamp LED1 and do not work, d type flip flop does not trigger, and the reversed-phase output of d type flip flop keeps high level.Move the road when leaking brilliant detection position at soldering tip, if drawing wafer, soldering tip do not take place to leak to pick up wafer or picked up wafer to drop, vacuum slot is not blocked, photodiode in the LED source irradiation suction nozzle, thereby photodiode conducting, electric current flows through the input resistance of operational amplifier and produces voltage through photodiode, this voltage amplifies through operational amplifier, its output voltage is greater than the anode input voltage of comparer, the comparer output low level, and leaking crystalline substance or foreign material, to stop up pilot lamp LED1 bright.At soldering tip from picking up sheet position road through leaking brilliant detection position to the motion process of bonding die position, if soldering tip has been drawn wafer picking up the sheet position, then photodiode is not subjected to illumination always and is high resistant, leaks crystalline substance or foreign material obstruction pilot lamp LED1 and does not work, and the reversed-phase output of d type flip flop keeps high level; If soldering tip is not drawn wafer picking up the sheet position, then in this motion process, photodiode is not through being subjected to illumination, be subjected to illumination, be not subjected to the change procedure of illumination, thereby make the pulse of comparer output low level, it is glittering to leak crystalline substance or foreign material obstruction pilot lamp LED1, the rising edge of this pulse triggers d type flip flop, its output is overturn, the reversed-phase output output low level of d type flip flop, leaking crystalline substance or foreign material obstruction indication keeps lamp LED2 bright, the indication soldering tip is the omission wafer, the photoelectricity that this useful signal of while is given computing machine as omission wafer signal is isolated input card, handles so that control program is made corresponding failure, in this malfunction routine, should isolate the clear terminal that output card output reset signal is given d type flip flop from the photoelectricity of computing machine, make the reversed-phase output of d type flip flop recover high level.Return the motion process of picking up the sheet position from bonding die position road through leaking brilliant detection position at soldering tip, if soldering tip is not stopped up by foreign material, in like manner, photodiode is not through being subjected to illumination, be subjected to illumination, be not subjected to the change procedure of illumination, it is glittering to leak crystalline substance or foreign material obstruction pilot lamp LED1, d type flip flop output is overturn, the reversed-phase output output low level, leaking crystalline substance or foreign material obstruction indication keeps lamp LED2 bright, and this signal is isolated input card as the photoelectricity that does not have the foreign material jam signal to give computing machine, computing machine is isolated the clear terminal that output card output reset signal is given d type flip flop from photoelectricity after receiving this signal, make the reversed-phase output of d type flip flop recover high level; In this motion process, if soldering tip is stopped up by foreign material, then photodiode is not subjected to illumination always, leaking crystalline substance or foreign material obstruction pilot lamp LED1 does not work, the d type flip flop reversed-phase output keeps high level, leak crystalline substance or foreign material obstruction indication and keep lamp LED2 not work, and this signal is isolated input card as the photoelectricity that has the foreign material jam signal to give computing machine, computing machine is made corresponding failure and is handled after receiving this signal.
In addition, regulate the adjustable resistance of picking up in sheet position camera circuit of light sources and the bonding die position camera circuit of light sources respectively, can regulate simply and easily and pick up sheet position and the brightness of the LED source of camera separately of bonding die position, so that under the different light rays environment, picking up the operating mode that can clearly monitor on sheet position monitor and the bonding die position monitor separately.
Claims (7)
1, a kind of detection and control system that is used for die Bonder, it is characterized in that including electro-optical pickoff (1), amplifying circuit (2), comparator circuit (3), trigger circuit (4), signal processing apparatus (5), wherein electro-optical pickoff (1) includes light source and photoelectric device, its light source places Lou brilliant detection position, photoelectric device places the soldering tip vacuum slot, and the output terminal of electro-optical pickoff (1) is connected with the input end of amplifying circuit (2), the output terminal of amplifying circuit (2) is connected with the input end of comparator circuit (3), the output terminal of comparator circuit (3) is connected with the input end of trigger circuit (4), and the output terminal of trigger circuit (4) is connected with the input end of signal processing apparatus (5); The light source of above-mentioned electro-optical pickoff (1) is a LED 3, photoelectric device is photodiode S1, LED 3 is installed in soldering tip from picking up the sheet position to the brilliant detection position of the leakage the motion path of bonding die position, and photodiode S1 is installed in and makes to leak brilliant and foreign material clogging sensor in the soldering tip vacuum slot.
2, detection and the control system that is used for die Bonder according to claim 1, it is characterized in that above-mentioned amplifying circuit (2) includes operational amplifier U1A and peripheral cell resistance R 2 thereof, R3, R4, R5, capacitor C 2, comparator circuit (3) includes voltage comparator U1B and peripheral cell resistance R 6 thereof, variable resistor RW2, and trigger circuit (4) include d type flip flop U2A and peripheral cell capacitor C 1 thereof, C3, C4; The output terminal of amplifier U1A is connected with the negative input end of voltage comparator U1B, and the positive input terminal of amplifier U1A is connected with resistance R 2, R5, and negative input end is connected with resistance R 5 by resistance R 4 ground connection between the positive input terminal of amplifier U1A and the output terminal; The positive input terminal of voltage comparator U1B is connected with the variable resistor RW2 of adjustable reference voltage and is connected with+5V power supply by resistance R 6, and the output terminal of voltage comparator U1B is connected with the hour hands input end of trigger U2A; The D of trigger U2A end is connected with+5V power supply, and the reversed-phase output of trigger U2A is connected with the input end of signal processing apparatus (5), and the clear terminal of trigger U2A is connected with the output terminal of signal processing apparatus (5); One termination of photodiode S1+5V power supply, another termination R2, R3.
3, detection and the control system that is used for die Bonder according to claim 1, it is characterized in that said signal processing device (5) is industrial control computer, industrial control computer is isolated input-output card by photoelectricity and is connected with trigger U2A, wherein the reversed-phase output of trigger U2A is connected with the input end that photoelectricity is isolated input card, and the clear terminal of trigger U2A is connected with the output terminal that photoelectricity is isolated output card.
4, detection and the control system that is used for die Bonder according to claim 2, the output terminal that it is characterized in that above-mentioned voltage comparator U1B also is connected with Lou crystalline substance or foreign material obstruction pilot lamp LED1, the negative electrode of pilot lamp LED1 is connected with the output terminal of voltage comparator U1B, and the anode of LED1 is connected with+5V power supply by resistance R 7.
5, detection and the control system that is used for die Bonder according to claim 2, the reversed-phase output that it is characterized in that above-mentioned trigger U2A also is connected with Lou crystalline substance or foreign material obstruction indication maintenance lamp LED2, indication keeps the negative electrode of lamp LED2 to be connected with the reversed-phase output of trigger U2A, and the anode of LED2 passes through resistance R 10 and is connected with+5V power supply.
6,, it is characterized in that above-mentioned+5V power supply also is connected with the LED 4 that sheet position camera light source is picked up in conduct by the resistance R 9 and the adjustable resistance RW1 of fixed resistance value according to claim 1 or 2 or 3 or 4 or 5 described detection and the control system that are used for die Bonder.
7,, it is characterized in that also the resistance R 8 by fixed resistance value and adjustable resistance RW3 are connected with LED 5 as bonding die position camera light source above-mentioned+5V power supply according to claim 1 or 2 or 3 or 4 or 5 described detection and the control system that are used for die Bonder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310117627 CN1273824C (en) | 2003-12-30 | 2003-12-30 | Detection and control system used for sheet sticking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310117627 CN1273824C (en) | 2003-12-30 | 2003-12-30 | Detection and control system used for sheet sticking machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1556400A CN1556400A (en) | 2004-12-22 |
| CN1273824C true CN1273824C (en) | 2006-09-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200310117627 Expired - Lifetime CN1273824C (en) | 2003-12-30 | 2003-12-30 | Detection and control system used for sheet sticking machine |
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| Country | Link |
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| CN (1) | CN1273824C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101668366B (en) * | 2008-09-03 | 2014-04-02 | 昆达电脑科技(昆山)有限公司 | Brightness balancing circuit |
| DE102010043632B4 (en) * | 2010-11-09 | 2017-08-24 | Krones Aktiengesellschaft | Method for checking the operation of an inspection device and device for inspecting a product flow |
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2003
- 2003-12-30 CN CN 200310117627 patent/CN1273824C/en not_active Expired - Lifetime
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