CN1271695C - Manufacture of wafers monitored by thermo-probe - Google Patents
Manufacture of wafers monitored by thermo-probe Download PDFInfo
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- CN1271695C CN1271695C CN 03115709 CN03115709A CN1271695C CN 1271695 C CN1271695 C CN 1271695C CN 03115709 CN03115709 CN 03115709 CN 03115709 A CN03115709 A CN 03115709A CN 1271695 C CN1271695 C CN 1271695C
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- wafer
- thermal probe
- probe
- monitoring
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Abstract
The present invention provides a manufacturing method in which wafers are monitored by a thermo-probe used to test the quality of ordinary wafers. The method comprises the following steps: a polysilicon film grows on a P type wafer in a heating furnace; the polysilicon wafer is annealed for 20 seconds at the temperature of 1025 DEG C with/ without oxidation.
Description
Technical field
The present invention relates to a kind of thermal probe the monitoring wafer method for making and make the wafer of making in this way.
Background technology
In the manufacture process of wafer, incorrect doping can cause the quality of formed wafer bad.Therefore, generally use thermal probe to be monitored.Known in the thermal probe 500, use a monitoring wafer to implant partly with the ion in the monitoring wafer manufacture process, measuring the scrambling of general disk, impurity, or lattice defect etc.
In known thermal probe, use arsenic (As) or boron (B) to implant in the wafer monitoring thermal probe, to guarantee the stability of thermal probe measurement platform.
But known arsenic (As) or boron (B) are implanted wafer needs about two weeks to prepare a suitable monitoring wafer because of the self-annealing of implanting.Therefore, quite inconvenience on efficient.In addition, even this supervision wafer of suitable preparation, monitor data also can descend (as shown in Figure 1) gradually along with service time, is unsuitable for as the monitoring wafer and become.
Summary of the invention
Because the shortcoming of the monitoring wafer of above-mentioned known use in thermal probe, the present invention has disclosed a kind of new thermal probe monitoring wafer and forming method thereof, wherein this monitoring wafer can form and use fast, and this supervision disk can use and reach 2 months, and data are very stable.
According to first viewpoint of the present invention, the invention provides the formation method of the monitoring wafer of a kind of thermal probe (thermo-probe), this thermal probe is in order to test the quality of general wafer, and this method is included in the heating furnace, the polysilicon film of growing up on P type wafer; With make this polysilicon disk and under 1025 ℃ temperature, annealed 20 seconds.
According to a viewpoint of the present invention, preferable, this polysilicon film is 2000.
According to another viewpoint of the present invention, preferable, when annealing, do not use oxygen.
According to a viewpoint more of the present invention, preferable, when annealing, use oxygen.
According to the present invention, the present invention discloses a kind of monitoring wafer, and it uses the formation method as the supervision disk of thermal probe provided by the invention to form.
Description of drawings
By the following description and accompanying drawing, can understand purpose of the present invention, feature and advantage more, wherein:
Fig. 1 is that known arsenic is implanted wafer as the time data figure of monitoring wafer use in thermal probe 500, and wherein abscissa is the time, and ordinate is TW (Thermal Wave, the measured value of a thermal probe) value;
Fig. 2 is the datagram of polysilicon handle wafer sheet of the present invention monitoring thermal probe 500, wherein ● be illustrated under 1025 ℃, annealed 20 seconds and do not use the situation of oxidation, ▲ be illustrated under 1025 ℃, annealed 20 seconds, and use 20% oxidation situation and
Be illustrated under 1025 ℃, annealed 20 seconds, and use the situation of 40% oxidation.
Embodiment
According to preferred embodiment of the present invention, the step that the formation method of thermal probe of the present invention monitoring wafer comprises is at first in heating furnace, the polysilicon film of growing up on P type wafer.Then, make this polysilicon disk, annealing is 20 seconds under 1025 ℃ temperature.
In the formation method of above-mentioned thermal probe monitoring wafer, the thickness of this polysilicon film is about 2000.
In the formation method of the supervision disk of above-mentioned thermal probe, when annealing, can use oxygen or not use oxygen.
With reference to figure 2, wherein ● be illustrated under 1025 ℃, annealed 20 seconds and do not use the situation of oxidation, ▲ be illustrated under 1025 ℃, annealed 20 seconds, and use 20% oxidation situation and
Be illustrated under 1025 ℃, annealed 20 seconds, and use the situation of 40% oxidation.As seen from Figure 2, under 1025 ℃, annealed 20 seconds and do not use under the situation of oxidation, the drift rate of data is about 0.89%; Under 1025 ℃, to anneal 20 seconds, and use under the situation of 20% oxidation, the data-bias degree is about 0.77%; With under 1025 ℃, to anneal 20 seconds, and use under the situation of 40% oxidation, the data-bias degree is about 0.72%.Therefore, know that best situation is under 1025 ℃, annealed 20 seconds and use the situation of oxidation by Fig. 2.
The present invention also provides a kind of thermal probe monitoring wafer, and it uses the formation method as the monitoring wafer of above-mentioned thermal probe to form.
By using as disclosed monitoring wafer, this supervisions disk can just can be used in the thermal probe after the annealing, but not as known arsenic/boron implantation wafer need wait for that the time in about 2 weeks just can use.Therefore, monitor that efficient can improve significantly.In addition, because the data of monitoring wafer of the present invention are difficult for time to time change, so it generally can use and reach 2 months, but not as known arsenic/boron data of implanting wafer be easy to descend in time.
The present invention is not limited to above-mentioned embodiment, and still can reach various changes and modification in this, but it still belongs to spirit of the present invention and category.Therefore, spirit of the present invention and category should be defined by appending claims.
Claims (5)
1. the formation method of the monitoring wafer of a thermal probe, this thermal probe is in order to test the quality of general wafer, and this method comprises:
In heating furnace, the polysilicon film of on P type wafer, growing up; With
This wafer was annealed 20 seconds under 1025 ℃ temperature.
2. the formation method of the monitoring wafer of thermal probe as claimed in claim 1 is characterized in that, this polysilicon film is 2000 .
3. the formation method of the monitoring wafer of thermal probe as claimed in claim 1 is characterized in that, does not use oxygen when annealing.
4. the formation method of the supervision disk of thermal probe as claimed in claim 1 is characterized in that, uses oxygen when annealing.
5. the monitoring wafer of a thermal probe, it uses the formation method of the monitoring wafer of thermal probe as claimed in claim 1 to form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03115709 CN1271695C (en) | 2003-03-10 | 2003-03-10 | Manufacture of wafers monitored by thermo-probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03115709 CN1271695C (en) | 2003-03-10 | 2003-03-10 | Manufacture of wafers monitored by thermo-probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1531045A CN1531045A (en) | 2004-09-22 |
| CN1271695C true CN1271695C (en) | 2006-08-23 |
Family
ID=34284398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03115709 Expired - Lifetime CN1271695C (en) | 2003-03-10 | 2003-03-10 | Manufacture of wafers monitored by thermo-probe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1271695C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101246841B (en) * | 2007-02-12 | 2010-05-19 | 中芯国际集成电路制造(上海)有限公司 | Method for reducing cornet shaped particles in STI HDP production |
| CN102623366B (en) * | 2011-01-27 | 2014-10-29 | 无锡华润上华半导体有限公司 | Method for monitoring annealing process temperature |
-
2003
- 2003-03-10 CN CN 03115709 patent/CN1271695C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1531045A (en) | 2004-09-22 |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111129 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20111129 Address after: 201203 No. 18 Zhangjiang Road, Shanghai Co-patentee after: Semiconductor Manufacturing International (Beijing) Corp. Patentee after: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) Corp. Address before: 201203 No. 18 Zhangjiang Road, Shanghai Patentee before: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) Corp. |
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| CX01 | Expiry of patent term |
Granted publication date: 20060823 |
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| CX01 | Expiry of patent term |