CN1264496A - Folded fin heat sink and fan attachment - Google Patents

Abstract

A folded fin heat sink to be clamped onto circuit components in need of cooling, in particular CPUs. Ridges designed to optimise air flow. Suited to use with a fan to force air movement.

Description

The heat abstractor of folded fin and the jockey of fan

The present invention requires U. S. application No.60/042,498 (April 3 1997 applying date), and No.60/078, and the priority in 210 (March 16 1998 applying date), the full content of above-mentioned application is all as the application's list of references.

Put it briefly, the present invention relates to cooling device, specifically, relate to integrated circuit (IC) chip, for example the heat abstractor of central processing unit (CPU) usefulness.

The cooling of electronic equipment has been a principal element of the performance of this equipment of restriction.Specifically, the central processing unit in the normal domestic use computer can produce the heat up to 40 watts in less than 4 square inches area.The performance of this chip depends on its speed to a great extent, and speed is high more, and the heat of generation is many more.And the heat that produces is many more, and the operating rate of chip is slow more, and the life-span of chip is short more.

Noise also is a principal element of electronic equipment performance.Particularly when the electronic equipment that has CPU used more at home, requiring this equipment more was a kind of quiet equipment.The main method of cooling integrated circuit chip is with one or more pectinid devices, and for example fan is used to make cooling air to flow through chip area or fixing heat abstractor.The heat that is produced is many more, and the air of circulation will be many more.The air quantity of mounted fan is big more, and speed is fast more, and the noise that it produced is also big more.

Another aspect that computer system involves is the size in electronic equipment occupied space in this system.The fact that must face is that as a kind of heat abstractor, its surface area is big more, and is just high more for the cooling effectiveness of the device that is connected.Wishing very much has a kind of heat abstractor, and it has very big surface area, but in computer occupied space seldom, and it is also smaller to be used to reach the fan desired power that ventilates of cooling effect of regulation.

Weight also is the problem that will consider in the computer part.The heat abstractor that extruding is come out is the solid weight of an aluminum, in many household PCs system, specifically, is equipped with in the computer of intel pentium Pto tm chip at those, and the weight of heat abstractor will be above 1/4th pounds.If the position of these process chip is changed on the carriage from the circuit board mount pad, its weight relationships is just bigger.For example, Intel is limited within half pound (250 gram) for the heatsink weight of its nearest chip that is called Klamath.If preponderance just needs to use the extra installing force of screw, and also need the backbar of heat abstractor in many cases.Do not have extra supporting and installing force, the heat abstractor that weight is very big just may be shifted in transportation.

In common household PC, all use the combination fan that produces noise usually.Also need a heat abstractor for individual other chip.The overwhelming majority in this heat abstractor makes with the aluminium of extruding.Aluminium extruded is pressed into a kind of special-shaped section bar, on the length of the direction of extrusion thick fin is being arranged.The section bar of extruding has a flat plane that contacts with semiconductor device in the bottom.In order further to increase the surface area of fin, manufacturer usually uses the expensive thick fin of machining process " crosscut ", forms the short column of isolating along the section bar that pushes.Each root short column has four side surfaces at least, is the twice of the thick fin of vertical bar before the crosscut.But the aluminium section bar of this extruding is subjected to strict restriction.Owing to be extrusion process, so the height of fin can only be several times of clearance distance between the fin, and the height of fin is subjected to the restriction of thickness, because the thickness of extrudate bottom must be 1/5th of height at least in extruding method commonly used.Therefore, the density of fin is big more on certain area, and the height of fin is just more little.Less than 1/2nd inches, area is less than the extrudate heat abstractor that has transverse incision of 4 square inches of such volumes for height, and the total surface area of the maximum that it can reach generally is not more than 25 square inches.The fin amount of per inch is subjected to the restriction of thickness and height.This restriction for the fin density on the extrudate has reduced the efficient of eliminating heat.

In order to remedy restriction for the extrudate fin density, after the extrudate that is used for heat abstractor is extruded out, can be through secondary process operation repeatedly.At first, smooth with machining under many circumstances the processing of the bottom of heat abstractor, so that allow it closely contact with the bottom part of the generation heat that is connected.Then, the 8 feet long bars that are generally that extruding is come out are cut into specific size, for an ordinary semiconductor, and normally two inches.Next step is exactly the crosscut work step.Then, usually heat abstractor being carried out punching press, so that process installing hole and alignment pin, is anodized and deburring then.Generally speaking, making this extrusion is costliness and very long processing method of duration.

U.S. Patent No. 5,329,426 (Villani) can be used as the example that is used for this extrusion directly is fixed on a method on the chip carriage that produces heat.Be clipped on a pair of pillar that is supporting the chip carriage assembly with the heat abstractor of a this rigidity of spring handle.

Because the speed of integrated circuit (IC) chip is more and more faster, the heat of generation is more and more, and the heat abstractor that uses simple extrusion process just dying.Manufacturer has increased other on this overstocked heat abstractor makes the device of air flows.Normally the fan that self has housing is screwed top at above-mentioned extrusion, flows through fin with forced air.This fan generally will increase about half inch height on the total height of this extrusion.Because having limited along the total height of the member of the dissipate heat of CPU in common computer system is about one inch, so the total height of the fin of the heat abstractor of extrusion will be limited within 1/2nd inches.In order to strengthen cooling to CPU, just must increase the speed of fan so that the time more air pass through heat abstractor.Air by a surface is many more, and pyroconductivity is just high more, and is faster because air is taken away heat.Yet the flow velocity of air is high more will to reduce energy utilization ratio, lip-deep pyroconductivity be increased be twice because the flow velocity of air increases to be twice.Usually, be used for the rotating speed of fan of 40mm of CPU heat abstractor of household PC up to 10000RPM.The high like this noise that speed caused will substantially exceed 30db.Reduce the rotating speed of fan, just can reduce noise, but also reduced the performance of heat abstractor.

In order to overcome some restriction of extruded aluminum, some manufacturer has turned to attentiveness the aluminium of collapsible fin.The taiwan products by TUV S.A. manufacturing that is called CPU cooling unit is sold in the U.S..The heat that is bonded in a side of using this CPU cooling unit passes near the folded fin aluminium strip in an edge of base plate.At the top of this piece base plate, there is a desk fan to lean against the next door of folded fin aluminium strip, base plate is laterally blown on the air water level land, and by folding fin.This product uses the grease of heat transfer adhesive tape or heat transfer the base plate that conducts heat to be bonded in the top of CPU.

U.S. Patent No. 5,494 has been described a kind of heat abstractor that fan is installed in folded fin aluminium strip top among 098 (Morosas).The process that is used to make this heat abstractor relates to the work step of many costlinesses, comprises with soldering folded fin is fixed on the solid aluminium block, and grinds the fixing top of fin and enter opening in the passage that is formed by fin with formation.

Various execution mode of the present invention all is to utilize the method that clamps folded fin to be fixed on the plate of a heat transfer, to make cooling equipment component and relevant fan component.A thin aluminum sheet or other heat-transfer matcrial are folded into bellows-shaped, form a series of convex ridges that replace and groove.This folding fin can directly be arranged on the substrate that will cool off, and perhaps is arranged on the independent conductive sole plate, forms a cooling equipment component.When needing opening on the convex ridge of the heat abstractor of collapsible fin, the method for making this folded fin heat abstractor just comprises the following steps: to be formed on the heat conduction sheet material that has the hole on spaced apart; Folding above-mentioned heat conduction sheet material forms convex ridge and groove, and make above-mentioned hole be in the top of convex ridge, and the above-mentioned heat conduction sheet material that has folded is clamped on the heat-transfer surface.

The heat abstractor of one embodiment of the present of invention comprises a heat conduction thin plate that is folded at least one group of convex ridge that replaces and groove.A clamp system is used to make above-mentioned folding heat conduction thin plate to be pressed on a heat-conducting plate.Owing on many convex ridges at folding heat conduction thin plate top, have opening, thereby improved the efficient of conducting heat.Above-mentioned clamp system comprises pressured part, is used for above-mentioned folding heat conduction thin plate is pressed to above-mentioned heat-conducting plate.The convex ridge or the groove of folding heat conduction thin plate can be arranged to compress in the position of above-mentioned pressured part.The clip of above-mentioned clamp system comprises a tongue piece that is locked in below the heat-conducting plate, so that a folding heat conduction thin plate is clamped on this piece heat-conducting plate.Nipped cooling equipment component can also be clamped on a substrate that will cool off.In one embodiment, be provided with spring clip, be used for the heat-conducting plate of cooling equipment component is pressed to the substrate that will cool off.Also can use other mechanical clamp systems that cooling equipment component is connected on the substrate.For example, the tongue piece that folding fin is clipped on the heat-conducting plate can be the same with the clip on being clipped in substrate.An additional sweep can also be arranged on tongue piece, be connected on the substrate that will cool off so that help.

According to an embodiment of cooling equipment component of the present invention, can be clipped in the heat conduction thin plate on the heat-conducting plate with a cover cap.This cover cap has an annex that protrudes downwards from housing and one to be used to be locked in below, above-mentioned heat-conducting plate edge, the flange on this annex (tongue piece).On above-mentioned cover cap, also has a pressured member, so that press to the top of the many convex ridges on the heat conduction thin plate.In addition, between the top of above-mentioned pressured member and heat conduction thin plate, a compressible liner can be set, so that guarantee that clamping pressure can be pressed on all convex ridges of heat conduction thin plate basically.This clip has been strengthened the capacity of heat transmission between the heat-conducting plate of heat conduction thin plate and heat conduction thin plate below greatly.

According to another embodiment of cooling equipment component of the present invention, above-mentioned clamping device is a spring mechanism, and it is applied to pressure on the groove of folded fin.Many from the spring mechanism suspended tongue piece can lock the below that is connected bottom edge at full tilt, with tensioning spring, make folded fin press to heat-conducting plate.When above-mentioned base plate formed an independent cooling equipment component, this assembly will be fixed on the substrate that cools off so, and above-mentioned base plate is near aforesaid substrate.The spring that is used for this embodiment of the present invention can comprise many parallel link rods.Each root link rod is engaged in the groove of folded fin.In the present embodiment, a pair of cross bar vertical with link rod is connected on the opposite end of link rod.To the cross bar pressurization, just make that tongue piece moves, hook the below of base plate up to tongue piece.The heat abstractor that assembles is placed on the substrate that will cool off, continues the pushing tongue piece again, be connected on the substrate up to these tongue pieces.According to an embodiment of this heat abstractor, jagged on base plate, the tongue piece on it and the spring is combined, and just can play folded fin is locked in effect on the above-mentioned base plate on three directions.

A kind of method that is used to make cooling equipment component of the present invention comprises the heat conduction thin plate is folded, so that alternately form convex ridge at the top, forms groove in the bottom.A clamp system is placed on the above-mentioned heat conduction thin plate that folds.The heat conduction thin plate that this piece is folded is clamped on the heat-conducting plate, and the bottom that forces the heat conduction thin plate that folds forms the cooling equipment component of a clamping near above-mentioned heat-conducting plate.Then this cooling equipment component is fixed on the base plate that will cool off, and heat-conducting plate is contacted with aforesaid substrate.

Make air flow through the diffusion that heat abstractor can further strengthen heat.Can be arranged to cooling equipment component can be installed in fan the top of heat abstractor, and keep the entire heat dissipation device to be on the plane of the integrated circuit (IC) chip that will cool off simultaneously.This device that makes air flows can be installed in a cover cap inside of cooling equipment component.Under the relatively rich situation in space, can adopt cooling fan assembly of the present invention.This cooling fan assembly has the device that makes air flows in the opening that is installed in housing, for example a fan.Above-mentioned housing is installed on the heat abstractor, makes the above-mentioned device that makes air flows allow the air flow heat abstractor.Above-mentioned housing comprises a dividing plate, and this dividing plate has stopped the air flow channel that a part is come from the air flow arrangement extension.Aforementioned barriers is being extended on formed whole air ducts by folded fin.Air flows out air duct then in the dividing plate back in the aforementioned barriers flow channel.Above-mentioned housing can also have one to cover the fan housing that the overhead air-flow of heat abstractor goes out the air duct place.The air that the position of this fan housing helps to flow out flows back in the above-mentioned device that makes air flows again.

Another aspect of the present invention is the method that is used to make the folded fin heat abstractor.On the heat conduction thin plate, be provided with some holes of partition distance regularly.This piece doubling gets up, and forms top convex ridge and bottom groove alternately, and above-mentioned hole has formed the opening at the top of passing many convex ridges in the bottom.The size and dimension in these holes advantageously makes the sunk area that forms different shape below the device of air flows, rectangle for example, groove bowl-type or V-arrangement.Above-mentioned sunk area below fan can improve the efficient that air flows through heat abstractor.Will degree of branch before folded sheet, so that make the hole on the thin plate aim at the convex ridge part that will form.

Other purposes of the present invention and advantage will become more obvious in the description of preferred embodiments below in conjunction with the accompanying drawings.

Fig. 1 is the stereogram of folded fin;

Fig. 2 is the stereogram of a heat conduction thin plate making according to one embodiment of the present of invention;

Fig. 3 is the plane graph of heat conduction thin plate before folding that is used for the embodiment of shop drawings 2;

Fig. 4 is the stereogram of another embodiment of heat conduction thin plate of folding;

Fig. 5 is the stereogram of an embodiment of heat abstractor commonly used of the present invention;

Fig. 6 is the sectional drawing of the heat abstractor commonly used among Fig. 5, in order to simplify drawing, fan has been removed;

Fig. 7 is the exploded perspective view of the heat abstractor among Fig. 5;

Fig. 8 is the bottom view of the cover cap 22 among Fig. 7;

Fig. 9 is the plane graph of the heat abstractor among Fig. 5;

Figure 10 is the cross-sectional side view of another embodiment of heat abstractor of the present invention;

Figure 11 is the stereogram of microscler spring that is used for the heat abstractor of Figure 10;

Figure 12 is the stereogram of the cooling equipment component of an alternative embodiment of the invention;

Figure 13 is the stereogram of spring that is used for the cooling equipment component of Figure 12;

Figure 14 is the plane graph of base plate that is used for the heat abstractor of Figure 12;

Figure 15 is the stereogram of the cooling fan assembly of one embodiment of the invention;

Figure 16 is the stereogram that cooling equipment component among Figure 12 and the cooling fan assembly among Figure 15 are combined.

Folded fin shown in Fig. 1 once used on the heat abstractor of prior art.In the prior art, usually, above-mentioned folded fin is to adopt the method such as soldering to be welded on a flat heat-transfer surface.Folded fin is one and uses Heat Conduction Material, for example the corrugated sheet made of aluminium.Common machinery just can be used for the thin plate of an aluminium is made the convex ridge 12 that has alternately and the corrugated folded fin of groove 14.The objective of the invention is to improve the heat efficiency when in heat abstractor, using folded fin and reduce its cost.

According to the first embodiment of the present invention, as shown in Figure 2, on the end face of the convex ridge 12 of folded fin 10, opening 16 is arranged.The solid bottom surface of the groove in the folded fin heat abstractor provides a surf zone that heat is conducted from the surface that will cool off, opening 16 on the convex ridge then can allow air vertically flow, and all are dissipated near the heat on the uncovered convex ridge two side.Air always can flow up or down, and by grooved area, opening 16 then allows air vertically flow, and flows in the neutral gear between each groove.

When the device that on folded fin, makes air flows, when for example being placed on the fan at folded fin top,, just can strengthen the circulation of air if below fan, reserve a sunk area 18.Above-mentioned sunk area is formed by the wall of lacking some than the overall height of convex ridge 12.According to a preferred embodiment, as shown in Figure 2, the shape of above-mentioned sunk area 18 is flat rectangular channels.According to another embodiment, also can form the zone of a bowl-type.The cavity of next bowl-type is stayed in this bowl-type zone below the fan that is arranged on the folded fin top.

Please see Figure 3 now, have sunk area 18 and the manufacture process of the folded fin of opening 16 is arranged on convex ridge, can before folding heat conduction thin plate 110, form through hole to simplify.A kind of preferred manufacture method of the present invention comprises: the first step, heat conduction thin plate 110 is provided, and normally thickness is 0.012 inch aluminium sheet.In order to form the folded fin that has opening 16, on thin plate, go out at interval narrow slit 116 clocklike.The width of these narrow slits 116 also can expand on the later wall, so that form sunk area 18.These narrow grooves do not extend to the bottom of groove, so the bottom of groove can keep and the heat transfer contact of the flat surface of below.If form the zone of bowl-type, then can near narrow slit, cut out the semicircle of different radii, opening is expanded on the monoblock heat conduction thin plate.

The heat conduction thin plate 110 of going out the hole is sent to and is carried out folding process.Interval on the heat conduction thin plate clocklike calibration of opening is very accurate, like this, in folding process narrow slit 116 could with the top alignment of convex ridge 12.In these a series of operations, the location is a very difficult operation, because any one otch on thin plate leaves the otch that originally cut out too far or too near, its error all can be superimposed.For example, in common thin plate processing, the acceptable error is 0.005 inch.In the present embodiment, the width of above-mentioned narrow slit is 0.3 inch, and the overall height of a fin side wall is 0.45 inch, and the width of each convex ridge and groove is 0.076 inch.In the present embodiment, the quantity of the last fin side wall of each inch is 12.The size of the folded fin among the embodiment commonly used is 2 inches and takes advantage of 2 inches.These fixing error results are stacked up, as long as 0.005 inch of each skew of 38 convex ridges is arranged, whole assembly will be scrapped, because narrow slit will be positioned on the sidewall of fin, rather than is in the top of convex ridge.In the present embodiment, 38 convex ridges approximately are three parts.The difficulty that another of calibration is huge is its speed.High speed folding machine per minute can fold 300 creases.In the present embodiment, processed material in fact only pauses a very short time.In the short like this dead time, punch press must be rushed out the hole, and before folding machine spurred material forward, drift must withdraw from and dash good hole.And the thin electric conducting material resemble aluminium is very responsive for stretching, and has further complicated the issue.The way that solves is that perforating press is designed in folding machine, so that punching is as far as possible near folding place.In the present embodiment, punching is left the folding machine upstream and is had only 6 inches.In existing preferred embodiment, die-cut narrow slit is that 6 inches places carry out before leaving the corrugated machinery that flat doubling is become to have groove alternately and convex ridge.

Now, please see Figure 4, the embodiment of the another kind of folded fin heat radiation thin plate of having represented among the figure to use among the present invention.On the fin that folds, formed opening 16.In addition.Also formed a pair of sunk area 18 at the top of whole folded fin.Sunk area 18 among Fig. 4 is grooves of V-arrangement.The groove of this V-arrangement can punch out rhombus on the heat conduction thin plate before folding otch forms.Have been found that the embodiment that adopts this sunk area 18 and all sidewall to reach the folded fin top compares, and can strengthen the circulation of air with respect to folded fin.

In order to make a heat conduction thin plate that folds can play heat abstractor, need be in the heat transfer contact between folding thin plate and the surface that will cool off.Now, please see Figure 5-9,, used clamping means that the groove of heat conduction thin plate is pressed on the conductive sole plate 38 according to one aspect of the present invention.According to a preferred embodiment, above-mentioned base plate 38 is to be that the aluminium sheet 32 of some thousandths of inch is made with thickness.Base plate 38 is placed to directly and the substrate that will cool off 40, for example an integrated circuit (IC) chip contact.Also can use the clamped folded fin that does not have base plate of the present invention, at this moment, folded fin directly is clamped on the substrate that will cool off.Use efficiently, can make the clamp system that keep-ups pressure between folded fin and flat board or the substrate, than adopting method for brazing to be fixed on folded fin on the flat board more cheap.

On above-mentioned cover cap 22, can comprise clamp system.Cover cap 22 has a top connecting elements 26 or covers the surface at convex ridge top of the corrugated sheet of all heat conduction basically, so that all convex ridges are compressed downwards.Any out-of-flatness between each convex ridge and the groove all can make pressure only be applied on some groove, and is not under pressure on other grooves.Adopt a compressible liner at the top of convex ridge,, like this, just can contact at the good face of generation between groove and the following substrate so that pressure is distributed on all convex ridges basically.This liner can be made with polyethylene film.

The coupling part, bottom of above-mentioned clamp system can form at the suspender 28 that extends downwards from the top of cover cap 22.In the present embodiment, the suspender 28 of cover cap extends downwards from four bights of cover cap.Flange or tongue hook 32 that inside extension is all arranged on each bight suspender.Each flange 32 all has an edge 42 that hooks below the base plate 38.It is enough little that distance between top connecting elements 26 and the flange 32 after unclamping is wanted, so that folding heat conduction thin plate and base plate 38 can be clamped in the middle of them tightly.Above-mentioned flange 32 following normally tilts, so base plate 38 just is easy to stick in the cover cap below folded sheet and goes in assembling.Base plate 44 upwards pushings towards the inclined-plane, force suspender outwards to move, up to base plate cross each flange top.At this moment, suspender 28 has just blocked on base plate.Like this, suspender 28 has just played hook member.Owing to folded sheet and base plate all have been clipped between top connector and the flange 126, so institute's applied pressure just helps to improve the thermo-contact between folded sheet and the base plate.Described cover cap 22 is made of plastic, for example anti-flaming PCABS.In addition, described cover cap is a Unitarily molded plastic components, and it has comprised top connecting elements 26 and suspender 28.Above-mentioned cover cap has enough elasticity, can allow suspender outwardly-bent holding base plate 38, and make flange 32 reach base plate below.

General cpu chip is to be clipped on the base plate with mode commonly used.Usually, use a ZIF socket 47.Effectively heat abstractor is placed on the top of cpu chip.A U-shaped clamp 46 is arranged on the spring clip 24 on the housing, and it is being locked on the CPU base plate below the hook-type surface 48.Above-mentioned spring clip 24 is resilient, is meshed so can move them with the hook-type surface 26 of CPU base plate to.One after locking, and spring 24 is just held cover cap 22 downwards.Like this, spring 24 has played an additional clamping element, and it constantly applies downward pressure to cover cap, again pressure is passed to corrugated heat conduction thin plate and base plate 38 then.Specifically, above-mentioned base plate 38 keeps thermo-contact closely with the substrate 40 that will cool off, and in this example, is exactly to keep closely contacting with cpu chip.According to present embodiment, spring clip 24 has two relative ends, and each end all vertically is bearing in 50 li of the columnar sleeve pipes of cover cap 22.Cover cap 22 is provided with four vertical tubular shells 50, with fixing above-mentioned spring clip 24.Clamp 24 has a sweep 52, is used for clamp is remained on sleeve pipe 50, and downward power is passed to cover cap 22.U-shaped clamp 46 extends downwards, with hook 48 engagements on the CPU socket 47.

According to another aspect of the present invention, a desk fan 30 is contained in the inside of cover cap 22, above corrugated heat conduction thin plate 10.Cover cap 22 has an opening 36, and fan 30 can ventilate by this opening.The pillar 52 of taper can be set on the cover cap 22, be used for fitting snugly in its hole of aligning 54 on the fan component, so that fan 30 is installed on the cover cap 22.Fan 30 is designed to force air flowing between the fin or between the wall of fin and heat conduction thin plate.Therefore, this heat abstractor is called the active heat removal device.This heat abstractor comprises folding heat conduction thin plate 10.Though can adopt simple folded fin as shown in Figure 1 of the prior art, owing to be provided with opening 16, and be provided with a sunk area 18, so the efficient of heat radiation has improved.

Electric power can with battery or by the power supply of computer system inside and fan are coupled together lead 31 offer fan 30.Groove 56 on the cover cap wall can be used for holding lead 31.Above-mentioned lead 31 also can be connected on the pin connector 60, so that be connected with the power supply of computer system.It can be to pass through folding heat conduction thin plate downwards that fan makes the direction of air movement, and the suction air that also can make progress is by folding heat conduction thin plate.Because the top at the convex ridge of folded sheet 10 is provided with opening 16, has improved the efficient of air perpendicular flow greatly.According to the preferred embodiments of the present invention, the folded sheet that has opening 16 and sunk area 18 can provide 66 square inches frigorimeter area in the CPU that only occupies 4 area in square inches, and wherein the height of convex ridge has only 1/2nd inches.

If needed, can add a liner 34 at the top of folded fin, so that the pressure of clip is evenly distributed on all convex ridges 12.Liner 34 is inserted between the top connector in folded sheet and the cover cap.The height that the convex ridge 12 of liner 34 and folding heat conduction thin plate combines has surpassed the headroom between base plate 38 and the above-mentioned connector.Therefore, one in base plate snaps in cover cap after, downward pressure will continue to be applied on the convex ridge of folded sheet by liner.Except there is opening at the top so that the air perpendicular flow, cover cap also is provided with opening in the side near groove and convex ridge end.The opening of side can allow the air water level land flow into and flow out folding heat conduction thin plate.

Embodiments of the present invention also can go up or be equipped with on the housing of CPU with cover cap 22 being stuck in CPU, and corrugated sheet directly is pressed on the CPU.At this moment, the size of above-mentioned suspender need be designed to just in time be suitable for corrugated sheet is pressed on the CPU.Perhaps, can between CPU and the heat conduction thin plate that folds, compress the base plate 38 of heat conduction.

In order to increase the elasticity of cover cap 22, according to another embodiment of the present invention, shown in Figure 10 and 11, above-mentioned connector can be made spring 128, so that it is pressed in the top of folded sheet convex ridge 12 downwards.Spring 128 will be pushed down convex ridge or liner.Spring 128 has a long limit 132, and the top of all convex ridges 12 on the folded sheet 10 is crossed on this long limit basically.The form of using is a spring that sheet metal is made.In one embodiment, two springs in the sleeve pipe 134 below the cover cap top of inserting plastic mouldings are arranged.Two die-cut anchoring extensions 136 that form from the steel plate of making this spring are arranged on each spring.These two the die-cut elements that come out are used for spring is fixed on the sleeve pipe 134 of housing.Above-mentioned spring is the plate of a bending.The thickness of plate and flexibility are like this designs, and it can be applied to suitable pressure the top of folded sheet convex ridge, so as the bottom surface of groove 14 with and its base plate or substrate of contacting between, obtain needed contact in the bottom of folded sheet.

Please see Figure 12 now, represented another cooling equipment component 101 of the embodiment of the invention among the figure.This embodiment is not a convex ridge of clamping folded fin, but clamps its groove.Cooling equipment component 101 is to make with fin that spirals or folding fin 10.This folded fin 10 is that the doubling of heat conduction is become a series of convex ridges that replace 12 and groove 14.It is a large amount of that folded fin 10 can provide, and air can be taken away the surface area of heat from it.A kind of preferred folded fin is to be that the aluminium sheet of 0.245mm is made with thickness.The height that forms the fin of convex ridge 12 and groove 14 is decided by operating position.The height of fin is high more, and surface area is just big more, and for certain air mass flow, the heat that can distribute is just many more.As mentioned above, hole that can die-cut various sizes on the convex ridge of folded fin is so that provide additional passage for air flows through heat abstractor.

Above-mentioned folded fin 10 is placed on the conductive sole plate 138.According to a preferred embodiment, in order to improve heat conductivility, can on base plate 138, apply the grease of one deck heat conduction, so that the thermo-contact of the groove 14 of improvement and folded fin 10.According to a preferred embodiment, above-mentioned base plate 138 is aluminium sheets of a smooth rigidity.The very approaching length that will place superincumbent folded fin of the length of base plate 138.The width of base plate all surpasses folded fin in both sides, be used for folded fin 10 is fixed on spring clip 121 on the base plate 138 so that hold.On an edge of base plate 138, a pair of breach 123 is arranged.Along another opposed edges, a pair of much longer breach 125 is being arranged on the edge of base plate.Footing or tongue piece 131 are arranged on the above-mentioned spring clip 121, be used for below bottom edge, meshing with above-mentioned breach.

Above-mentioned spring shelf 121 has the flexible link rod 140 of a row, is used for groove 14 is pressed in base plate 138.In the present embodiment, each root link rod all has a coupling part, is used for making it to contact with the groove 14 of folded fin 10.In the present embodiment, above-mentioned coupling part is flat middle part 142.The preferred embodiment is that each groove of folded fin is provided with an elasticity link rod.For the less demanding situation of heat radiation, the quantity of elasticity link rod can be lacked.Respectively there is the shank 144 of an inclination at relative two ends at the flat middle part 142 of each elasticity link rod.The shank that tilts extends upward from flat middle part, is connected on the cross bar 146.Two parallel cross bars are arranged, and each is in the relative side of spring clip 121.Each root cross bar 146 all is connected with all elasticity link rod.When its tongue piece of spring clip 121 usefulness 131 was connected on the base plate 138, it just was applied to pressure on the groove 14 of folded fin by flat middle part 142, made it and following base plate 138 have good thermo-contact.

See also Figure 13, represented spring clip 121 among this figure in more detail.Tongue piece 131 is folded down from spring clip 121.Specifically, tongue piece 131 is folded down from cross bar 146.In the spring clip 121 of present embodiment, tongue piece has four.Having on tongue piece can be as the edge lower part that is engaged on a plate, by projection or the formed any clamp system of element.The present invention also can be with the another kind of clamp system that substitutes, and it can be different from the mode of hooking the below, edge with another kind, for example is hooked in other clips on the base plate and accepts mode on member and the corresponding opening, is engaged on the base plate.A vertical rod 148 is connected tongue piece 131 on the cross bar 146.Vertical rod 148 is narrow, so it can move in base plate that will cool off or the corresponding narrow slit of substrate or in the breach.Tongue piece among Figure 13 of present embodiment has step.First step 152 is wideer slightly than vertical rod 148, stretches out from the relative both sides of vertical rod.First step 152 is wideer than narrow slit, therefore abuts against base plate near on the limit of narrow slit.A second step 154 extends downwards from each first step, can engagement below bottom edge in than the scope of the narrow slit of broad or gap regions.The narrow slit of broad or the size of breach are to determine like this, that is, it can allow first step 152 be embedded in the inside, but can not allow second step 154 embed wherein.Tongue piece 131 also has a sweep 156 in the end away from cross bar 146.This sweep 156 curves inwardly, and makes four sweeps 156 can be used for being stuck on the substrate that will cool off.Though expression is sweep in the present embodiment, also can assign to replace these sweeps with any protuberance that can catch substrate.The spring clip 121 of this preferred embodiment can be made the part of an integral body easily with a resilient corrosion resistant plate.

See also Figure 14, represented a preferred base plate 138 among the figure.On this piece base plate 138 opening that holds clip is arranged, the position of this opening can be accepted such as the such clamp system of the tongue piece on the spring shelf 121.The above-mentioned opening that holds clip is the gap regions of describing in the above in the present embodiment.Each breach comprises a wide seam and a narrow slit.Vertical rod 148 or first step 152 can be embedded in the wide seam, but second step 154 can not be embedded.The width of narrow slit only enough embeds vertical rod 148.On a limit of base plate 138, a wide seam part 162 is respectively arranged on the short gap 123, be narrow slit part 164 more inward.On another edge of base plate, long nick 125 respectively has a wide seam 166 and a narrow slit 168.Narrow slit 168 is long more a lot of than the narrow slit 164 of base plate opposite side.In assembling during cooling equipment component, long narrow slit 168 can hold and will insert wherein and can slide therein, in the vertical rod 148 of spring clip 121 1 sides.Like this, the tongue piece 131 at the relative opposite side of spring clip 121 just can drop to below the base plate in the outside of bottom edge.Tongue piece 131 is moved to the position of aiming at narrow slit 123, and promotes cross bar 146, move to base plate to force tongue piece 131, up to wide second step 154 below wide seam 162 with the edge engagement of base plate.At the another side of base plate 138, make their vertical rod 148 pass narrow slit 168 tongue piece 131 to extrapolation, fall into wide seam 166 up to above-mentioned first step 152, and second step 154 be engaged on base plate 138 below.Like this, whole four tongue pieces just all are engaged on below the base plate, and folded fin is pressed against on the base plate.All the second step 154 of tongue pieces all be engaged on a limit of base plate below, its first step 152 then is pressed near on the bottom edge of narrow slit.Like this, relative tongue piece all is subjected to the released position that strength will be left spring clip 121.So just formed the cooling equipment component that can transport.This heat abstractor is set up and is ready to, and can be placed to facing to a flat substrate that will cool off.

The Pentium II microprocessor chip that cooling equipment component among Figure 12-16 is particularly suitable for making with Intel company moves together.A heat transfer plate is arranged on the Pentium II, and heat abstractor can be installed in above it.Many oval-shaped narrow slits are arranged on this piece heat transfer plate.After being engaged on four tongue pieces 131 in the wide seam, they have just reserved the position, so heat abstractor 101 just can be placed on the heat transfer plate of Pentium II, and these tongue pieces all fall into the narrow slit of this piece heat transfer plate.After heat abstractor is in place on heat transfer plate,, just can be installed in heat abstractor on the heat transfer plate as long as push away two cross bars 146 simply downwards.Under the state before the assembling, whole four tongue pieces 131 all are in the wide seam.In short gap 123, tongue piece is sandwiched in the wide seam 162.In long nick 125, tongue piece is sandwiched in the wide seam 166.Therefore, for all tongue pieces 131, stoped tongue piece to be pressed more closely mutually at wide seam on the base plate and the step between the narrow slit.So in two cross bars 146 being pressed downwardly onto the simple process that base plate gets on, tongue piece 131 just is pulled to floor below, enters in the narrow slit of heat transfer plate.When first step 152 was pushed over the below of base plate 138, two vertical rods 148 can relatively move freely in narrow slit.These tongue pieces all keep separating owing to sweep 156 is pressed on the limit wall of heat transfer plate narrow slit.Till matching in the below, edge that tongue piece all is pushed downwards the narrow slit on sweep 156 and the heat transfer plate.Then, the elastic force of spring forces the relative tongue piece resilience of these tongue pieces towards them.Therefore, the sweep 156 of tongue piece blocks on heat transfer plate, and cooling equipment component is fixed on the heat transfer plate firmly.Like this, cross bar simply moves down and just makes tongue piece 131 move down, the result, tongue piece 131 just can hook Pentium II heat transfer plate below.In addition, along be bent part 156 to the tongue piece that presses down reach heat transfer plate below, the tension force on the spring clip 121 just will apply the very big pressure that is pressed on the base plate 138 to the groove of folded fin.According to present embodiment, the size of spring clip 121 and base plate 138 is to determine like this, that is, when tongue piece was fixed on the heat transfer plate of Pentium II, the pressure between base plate 138 and the heat transfer plate approximately was 30lb.Thermo-contact between base plate 138 and the heat transfer plate can apply one deck thermally conductive grease by means of the lower surface at base plate 138 and further strengthen.In the present embodiment, the silica-based grease of the right and wrong of use, the non-silica-based HTC-15 of AOS specifically.Cooling equipment component as described herein can be clamped folded fin on a base plate well, and can cooling equipment component be fixed on the substrate that will cool off with the same action of cross bar 146 to the base plate promotion of cooling equipment component.Above-mentioned spring clip 121 had both been finished folded fin had been clipped in task on the base plate, had also play a part cooling equipment component is clipped on the substrate that will cool off.

Though the efficient that above-mentioned cooling equipment component 101 dispels the heat for the size of its such size is very high,, the huge heat that microprocessor produced that resembles the Pentium II still needs air flows by folded fin, to obtain enough coolings.Said flow can be provided by a fan that is arranged in the computer rack, perhaps, also can be provided by a fan that is used for microprocessor.Represented an additional microprocessor fan that has assembly of lid in the embodiments of the invention among Figure 15 and 16.This cooling fan assembly 200 has a housing 210.A pectinid device, normally a desk fan 220 is installed on the top of above-mentioned housing 210.Fan 220 is contained in the opening 214 of housing.Fan 220 is kept watch and is blown in the chamber that is formed by housing 210.Fan 220 is kept watch and is vertically guided base plate 138 into.The border of above-mentioned chamber is a right side wall 216, left side wall 217 and front side wall 218.This cooling package 200 is installed on the plastics heat abstractor support plate 230 on the motherboard, to form complete air chamber.

According to one embodiment of the present of invention, baffle plate 240 extends to chamber interior from front side wall, stops the air-flow that blows from fan 220.Above-mentioned baffle plate extends to right side wall from left side wall.In the preferred embodiment, above-mentioned baffle plate 240 approximately extends to half place of chamber.Therefore, the air-flow of a part of fan 220 has directly been blocked by baffle plate 240.So baffled housing just guides fan to blow over the air that comes and walks around baffle plate, flows into by in the formed passage of folded fin.Owing to adopted baffle plate 240 that air is directed in the above-mentioned passage again, thereby improved cooling effectiveness.This baffle plate 240 is particularly useful for the solid folded fin of describing among other embodiment in the above that lacks opening 16.Above-mentioned baffle plate 240 also the air-flow in the flow channel every in the baffle plate back, prevent that air-flow that it is blown over by fan from upsetting or disturb.Like this, just improved the motion of air by passage.Above-mentioned cooling fan assembly 200 equally also can be used for the heat abstractor that other have many parallel channels.The same with prior art, this passage can form with the heat dissipation metal device that is squeezed into.

Air flows near baffle plate 240 back the front side wall 218 after flowing through the passage of heat abstractor.Be provided with one and extend out from front side wall, and the cover plate 250 of protrusion outside baffle plate 240, the feasible air deflection direction that flows out from heat abstractor also is of great use.The purpose of cover plate 250 is to stop air to be back to heat sink interior by fan 220.If needed, cover plate can like this, just can be regulated the angle of its deflection with being pivotally mounted on the housing 210.Footing 260 is housed on the housing 210, and it can be stuck on the maintaining body of a processor.Above-mentioned housing 210 can be made of plastic, and the fan in the present embodiment is the fan of the Hypro bearing of 3300rpm.

Should be appreciated that,, can carry out various changes and modifications preferred embodiment described above for those skilled in the art.For example, the substantially parallel wall made of heat conduction thin plate can be made with common known production method.Equally, can use various clamp systems commonly used to keep for the convex ridge of folding heat conduction thin plate or the downward pressure of groove.Folding heat conduction thin plate can have some groups of independently groove and convex ridges mutually, rather than all is impartial at interval groove and convex ridge on the monoblock thin plate.Can punch on the base plate, rather than solid plate.The shape of flexible link rod and tongue piece can change on the spring shelf, but still clamping and the linkage function said above possessing.The position of tongue piece and breach also can change, with the various edge on the substrate that is fit to cool off or the position of narrow slit.But these variations all do not break away from design of the present invention and scope, therefore, are all covered by the claims among the application.

Claims (68)

1. heat abstractor, it comprises:

A heat conduction thin plate that is folded at least one group of convex ridge that replaces and groove, above-mentioned heat conduction thin plate have a bottom that is formed by at least one above-mentioned groove;

A heat-conducting plate; And

Bottom that is used to force above-mentioned heat conduction thin plate leans against the clamp system on the above-mentioned heat-conducting plate.

2. heat abstractor as claimed in claim 1 is characterized in that, above-mentioned heat conduction thin plate has the opening by the many convex ridges on the above-mentioned thin plate top.

3. heat abstractor as claimed in claim 2 is characterized in that, it comprises that also is positioned at an above-mentioned heat conduction thin plate over top, is used to make air between the convex ridge and from the upwards mobile device that makes air flows of the opening of above-mentioned thin plate.

4. heat abstractor as claimed in claim 2 is characterized in that, it comprises that also is positioned at an above-mentioned heat conduction thin plate over top, is used to make air to flow downward between the convex ridge, and flows through the device that makes air flows of the opening of above-mentioned thin plate.

5. heat abstractor as claimed in claim 4 is characterized in that, above-mentioned clamp system comprises a cover cap with the opening that holds a device that makes air flows.

6. heat abstractor as claimed in claim 5 is characterized in that, it also comprises a liner between the many convex ridges that are placed on above-mentioned cover cap and above-mentioned heat conduction thin plate.

7. heat abstractor as claimed in claim 1 is characterized in that, above-mentioned clamp system comprises a top connector that is used for being pressed on the above-mentioned convex ridge downwards.

8. heat abstractor as claimed in claim 7 is characterized in that, above-mentioned clamp system also comprises a suspender, and an end of this suspender is connected on the above-mentioned connector, and the other end is used to hook above-mentioned heat-conducting plate.

9. heat abstractor as claimed in claim 1 is characterized in that, above-mentioned clamp system comprises many flexible link rods, and each root link rod all contacts with a groove in the above-mentioned groove, is pressed in downwards on these grooves.

10. heat abstractor as claimed in claim 9 is characterized in that, above-mentioned clamp system also comprises a tongue piece on the edge that is locked in above-mentioned heat conduction thin plate.

11. an active heat removal device, it comprises:

A heat conduction thin plate that is folded at least one group of convex ridge that replaces and groove, above-mentioned heat conduction thin plate have the bottom and the top that is formed by at least one convex ridge that are formed by many grooves;

Be used to support above-mentioned heat conduction thin plate, and the heat-transfer device that contacts with its bottom; And

Be used for above-mentioned heat conduction thin plate is clamped in device on the above-mentioned heat-conducting plate.

12. heat abstractor as claimed in claim 11 is characterized in that, it comprises that also is installed in an above-mentioned heat conduction thin plate top, is used to make air to flow through the air flow arrangement of at least one group of convex ridge that replaces and groove.

13. heat abstractor as claimed in claim 11, it is characterized in that, the above-mentioned device that is used to clamp comprises that a cover cap that covers above-mentioned heat conduction thin plate top and one protrude from above-mentioned cover cap, is used to be locked in the suspender below edge of above-mentioned heat-conducting plate.

14. heat abstractor as claimed in claim 11, it is characterized in that, the above-mentioned device that is used to clamp comprises many members, each member contacts with a groove in the above-mentioned groove, be used for being pressed in above-mentioned groove downwards, and comprise at least one tongue piece that is connected with above-mentioned member, be used to hook below edge of above-mentioned heat-conducting plate.

15. a heat abstractor, it comprises:

A heat conduction thin plate that is folded at least one group of convex ridge that replaces and groove, above-mentioned heat conduction thin plate have a bottom that is formed by at least one above-mentioned groove;

A heat-conducting plate; And

A clamp system, it comprises and is used to force above-mentioned folding heat conduction thin plate to lean against coupling part on the above-mentioned heat-conducting plate, a following tongue piece that is used to be locked in an edge of above-mentioned heat-conducting plate, and be used for heat-conducting plate is clamped in a device on the substrate that will cool off.

16. heat abstractor as claimed in claim 15 is characterized in that, above-mentioned coupling part is pressed on many convex ridges at above-mentioned heat conduction thin plate top, and above-mentioned tongue piece is on a suspender that is connected above-mentioned coupling part.

17. heat abstractor as claimed in claim 16 is characterized in that, the above-mentioned device that is used to clamp comprises many spring clipes, and each clamp all has a ring that is used to hook.

18. heat abstractor as claimed in claim 15 is characterized in that, above-mentioned coupling part comprises many members, and each member all contacts with a groove in the above-mentioned groove, so that be pressed in downwards on this groove.

19. heat abstractor as claimed in claim 18 is characterized in that, above-mentioned coupling part and tongue piece are two parts of a spring.

20. heat abstractor as claimed in claim 19 is characterized in that, the above-mentioned device that is used to clamp comprises the sweep of a tongue piece on the spring, and it and the substrate that will cool off engagement are so that compress into above-mentioned heat-conducting plate on substrate and clamp.

21. a method of assembling heat abstractor, it comprises:

Folding heat conduction thin plate alternately is formed on the convex ridge at its top and at the groove of its bottom;

A clamp system is placed on the above-mentioned heat conduction thin plate that folds;

The above-mentioned heat conduction thin plate that folds is clamped on the heat-conducting plate, forces the bottom of the above-mentioned heat conduction thin plate that folds to be pressed on the above-mentioned heat-conducting plate, form the cooling equipment component of a clamping; And

The cooling equipment component of above-mentioned clamping is installed on the substrate that will cool off, and makes heat-conducting plate and substrate contacts.

22. method as claimed in claim 21 is characterized in that, above-mentioned placement step comprises a top connecting elements is placed on above-mentioned many convex ridges.

23. method as claimed in claim 22 is characterized in that, above-mentioned clamping step comprise a suspender that is bound up on the connecting elements of top be locked in an edge of heat-conducting plate below.

24. method as claimed in claim 21 is characterized in that, above-mentioned clamp system has many link rods, and above-mentioned placement step comprises these many link rods are placed on the above-mentioned groove.

25. method as claimed in claim 24, it is characterized in that, the part that above-mentioned these many link rods are springs, and above-mentioned clamping step comprises above-mentioned spring is exerted pressure, so as a tongue piece that is folded down from spring hook above-mentioned heat-conducting plate below.

26. a method of assembling heat abstractor, it comprises:

Folding heat conduction thin plate alternately is formed on the convex ridge at its top and at the groove of its bottom;

A flexible clamping component is placed on the above-mentioned heat conduction thin plate that folds;

Force a tongue piece that is folded down from above-mentioned elasticity clamping component be engaged on a heat-conducting plate an edge below, make the bottom of the above-mentioned heat conduction thin plate that folds compress above-mentioned heat-conducting plate, and form the cooling equipment component of a clamping; And

The cooling equipment component of above-mentioned clamping is installed on the substrate that will cool off, and makes heat-conducting plate and substrate contacts.

27. method as claimed in claim 26 is characterized in that, above-mentioned flexible clamping component has a top connector, and above-mentioned placement step comprises above-mentioned top connector is placed on above-mentioned many convex ridges.

28. method as claimed in claim 26 is characterized in that, above-mentioned elasticity clamping component has many link rods, and above-mentioned placement step comprises these many link rods are placed on the above-mentioned groove.

29. an active heat removal device, it comprises:

A heat conduction thin plate that is folded at least one group of convex ridge that replaces and groove, above-mentioned heat conduction thin plate have the bottom and the top that is formed by at least one convex ridge that are formed by many grooves;

A device that makes air flows that is installed in above-mentioned heat conduction thin plate top;

A heat-conducting plate that is mounted to the bottom heat transfer contact of above-mentioned heat conduction thin plate; And

A clip that is used to push down the top of above-mentioned heat conduction thin plate and pushes down above-mentioned heat-conducting plate is to improve the heat transfer contact between above-mentioned many grooves and the above-mentioned heat-conducting plate.

30. active heat removal device as claimed in claim 29 is characterized in that, above-mentioned clip comprises a cover cap, and this cover cap extends to the top that covers above-mentioned heat conduction thin plate, and an opening with the above-mentioned device ventilation that makes air flows is arranged.

31. active heat removal device as claimed in claim 30 is characterized in that, above-mentioned clip also comprises a suspender that protrudes from above-mentioned cover cap and one flange below above-mentioned suspender is used to be locked in edge of above-mentioned heat-conducting plate.

32. active heat removal device as claimed in claim 31 is characterized in that, above-mentioned cover cap comprises a top connector in above-mentioned cover cap, is used for pushing down on above-mentioned many convex ridges the top of above-mentioned heat conduction thin plate.

33. active heat removal device as claimed in claim 32 is characterized in that, it also comprises a liner between above-mentioned top connector and above-mentioned heat conduction thin plate top, so that above-mentioned clip can be exerted pressure to whole above-mentioned convex ridges.

34. active heat removal device as claimed in claim 32 is characterized in that, above-mentioned top connector comprises a thin plate, and this piece thin plate is designed to a spring, and its limit is across above-mentioned whole convex ridges.

35. active heat removal device as claimed in claim 29 is characterized in that, it also is included in the opening that forms on these many convex ridges.

36. active heat removal device as claimed in claim 35, it is characterized in that, above-mentioned heat conduction thin plate has formed a sunk area below the above-mentioned device that makes air flows, and the opening on these convex ridges be positioned at by folding thin plate formed, between the short wall of the wall that forms convex ridge.

37. active heat removal device as claimed in claim 29 is characterized in that, it comprises that also one is used for heat-conducting plate is pressed in clamping component on the substrate that will cool off.

38. an active heat removal device, it comprises:

A corrugated heat conduction thin plate, it has one by the formed top of the ripple in this thin plate;

Heat-conducting plate below above-mentioned corrugated sheet;

The cover cap of an integral body, it comprises that a top connector that is placed on above-mentioned corrugated heat conduction thin plate top and one are locked in the locking component below the above-mentioned heat-conducting plate, so that above-mentioned corrugated sheet is clamped on the above-mentioned heat-conducting plate; And

One is installed in the above-mentioned cover cap, is placed on above-mentioned a series of heat conduction corrugated, is used to make air to flow through these corrugated devices that makes air flows.

39. active heat removal device as claimed in claim 38 is characterized in that, it also comprises many being installed on the above-mentioned cover cap, be used for above-mentioned heat abstractor is clamped in a substrate that will cool off, and the clip of between above-mentioned heat-conducting plate and substrate, exerting pressure.

40. active heat removal device as claimed in claim 38 is characterized in that, above-mentioned locking component comprises a suspender and the flange on above-mentioned suspender on the edge that is used to be locked in above-mentioned heat-conducting plate.

41. active heat removal device as claimed in claim 38 is characterized in that, above-mentioned corrugated heat conduction thin plate comprises some openings that pass above-mentioned thin plate top.

42. active heat removal device as claimed in claim 41 is characterized in that, above-mentioned corrugated heat conduction thin plate comprises a zone below the above-mentioned device that makes air flows, and the ripple in this zone has the sidewall lower than thin plate top.

43. an active heat removal device, it comprises:

A heat conduction thin plate that is folded at least one group of convex ridge that replaces and groove, above-mentioned heat conduction thin plate have the bottom and the top that is formed by at least one convex ridge that are formed by many grooves;

A device that makes air flows that is installed in above-mentioned heat conduction thin plate top;

A heat-conducting plate that is mounted to the bottom heat transfer contact of above-mentioned heat conduction thin plate;

One is used for many grooves are pressed in clamping element on the above-mentioned heat-conducting plate; And

Many being installed on the above-mentioned cover cap is used for above-mentioned heat abstractor is clamped in a substrate that will cool off, and above-mentioned heat-conducting plate pressed to the clip of above-mentioned thin plate.

44. heat abstractor as claimed in claim 43 is characterized in that, above-mentioned heat conduction thin plate has many openings that pass the many convex ridges in above-mentioned thin plate top.

45. heat abstractor as claimed in claim 44 is characterized in that, the above-mentioned device of air flows that makes makes air flow between convex ridge and by Open Side Down in the above-mentioned thin plate.

46. heat abstractor as claimed in claim 43 is characterized in that, above-mentioned clamping element comprises a cover cap that has the opening that can hold the above-mentioned device that makes air flows.

47. heat abstractor as claimed in claim 46, it is characterized in that, above-mentioned cover cap comprises a top connector that is used for being pressed on the above-mentioned convex ridge downwards, with many suspenders, each suspender all is connected an end of above-mentioned top connector, and has the other end that is used to hook above-mentioned heat-conducting plate.

48. a method of making the folded fin heat abstractor, it comprises:

Provide one to have the heat conduction thin plate in the hole of partition distance regularly;

Folding this piece heat conduction thin plate alternately is formed on the convex ridge at its top and at the groove of its bottom, wherein, above-mentioned these holes have formed the opening at the top of passing many convex ridges; And

The above-mentioned heat conduction thin plate that folds is clamped on the heat-transfer surface.

49. method as claimed in claim 48 is characterized in that, the position in the hole on the above-mentioned heat conduction thin plate and does not extend on other any adjacent grooves between adjacent groove.

50. method as claimed in claim 48 is characterized in that, above-mentioned hole on the heat conduction thin plate is to design so dimensionally, that is, when folded sheet, these holes are on the convex ridge, form sunk area.

51. method as claimed in claim 50 is characterized in that, it also is included in the calibration step before the above-mentioned folding step, so that opening is formed on unlikely bottom at any groove, these holes.

52. method as claimed in claim 50 is characterized in that, it also comprises inserts the step in the cover cap to the heat conduction thin plate that folds and a heat-conducting plate is clamped in the above-mentioned cover cap, and near the bottom of above-mentioned folding heat conduction thin plate.

53. a method of assembling heat abstractor, it comprises:

Provide one to be folded into the heat conduction thin plate that has one group of convex ridge that replaces and groove at least;

Above-mentioned folded sheet is placed on the top of a heat-conducting plate;

Spring with many parallel link rods is placed on the above-mentioned folded sheet, makes each piece thin plate all embed in the groove; And

Above-mentioned spring is exerted pressure, make a tongue piece that is folded down from above-mentioned spring hook heat-conducting plate below, to form a cooling equipment component, wherein, above-mentioned folded sheet is by means of with above-mentioned link rod groove being pressed on the above-mentioned heat-conducting plate and be clamped on the heat-conducting plate.

54. method as claimed in claim 53 is characterized in that, it also comprises above-mentioned heat abstractor set up and is placed on the substrate that will cool off, and above-mentioned spring is exerted pressure, so that allow tongue piece hook substrate, above-mentioned heat-conducting plate is clamped on the substrate.

55. a method of assembling heat abstractor, it comprises:

A folded fin that many convex ridges that replace and groove arranged is placed on the heat-conducting plate top that has an opening that holds clamping element;

Spring with many elasticity link rods and clamp system are placed on the top of above-mentioned folded fin, make these many flexible link rods embed in the groove of above-mentioned folded fin; And

Exerting pressure in top to above-mentioned spring, clamp system is pushed make above-mentioned clamp system be connected with heat-conducting plate in the opening holding of clamping element, and above-mentioned folded fin is pressed on the above-mentioned heat-conducting plate.

56. method as claimed in claim 55 is characterized in that, the opening that holds of above-mentioned clamping element is a breach on an edge of above-mentioned heat-conducting plate.

57. method as claimed in claim 55 is characterized in that, above-mentioned clamp system is many tongue pieces with the level, and each piece tongue piece is connected with above-mentioned spring with a vertical rod.

58. a folded fin heat abstractor, it comprises:

The folded fin that many convex ridges that replace and groove are arranged;

A conductive sole plate; And

One has many elasticity link rods and a spring that is connected the bindiny mechanism of usefulness with above-mentioned base plate, and above-mentioned each root elasticity link rod is pressed in the groove of above-mentioned folded fin.

59. folded fin heat abstractor as claimed in claim 58 is characterized in that, above-mentioned bindiny mechanism comprises a tongue piece that is locked in below edge of above-mentioned heat-conducting plate.

60. folded fin heat abstractor as claimed in claim 59, it is characterized in that, above-mentioned tongue piece is connected on the spring with a vertical rod and a step, and above-mentioned base plate has at least one breach along an edge, the width of the wide seam part of this breach is enough to hold above-mentioned step, and the width of its narrow slit part is enough to hold above-mentioned vertical rod, but can not hold above-mentioned step.

61. folded fin heat abstractor as claimed in claim 58, it is characterized in that, each root elasticity link rod comprises a flat middle part that contacts with the groove of above-mentioned folded fin, and at the shank of the inclination at two ends, above-mentioned middle part, the shank of each inclination all extends up to a cross bar that is connected with all elasticity link rod from the middle part.

62. folded fin heat abstractor as claimed in claim 58, it is characterized in that, it comprises that also is installed in an above-mentioned folded fin top, air is blown into the device that makes air flows in the groove downwards, chamber round above-mentioned folded fin, and one between the above-mentioned device and folded fin that makes air flows, and cover above-mentioned many fins and groove top baffle plate, so that from the above-mentioned fin that makes the air that flows out the device of air flows be blown into and do not blocked in the folded fin by above-mentioned baffle plate, and along rear that the convex ridge and the groove of above-mentioned folded fin flows to above-mentioned baffle plate.

63. an active heat removal device, it comprises:

The cooling equipment component of a heat conduction, he have one be used for the smooth surface that contact with the device that produces heat and series of parallel be used for steering current along the mobile passage of said modules;

A housing that around the parallel passage of above-mentioned cooling equipment component, forms a chamber;

In the opening that is installed in above-mentioned housing, and be the movement-oriented device that make air flows of air in above-mentioned heat abstractor is set up;

One at the above-mentioned device of air flows and the baffle plate between the cooling equipment component of making, this piece shutter lives in to state the top of series of passages, therefore, make in the cooling equipment component that the air that flows out the device of air flows is imported into not and blocked by above-mentioned baffle plate from above-mentioned, and flow to the rear of above-mentioned baffle plate along the passage of above-mentioned cooling equipment component.

64., it is characterized in that the above-mentioned device that makes air flows makes air flow to the direction perpendicular to the flat surfaces of above-mentioned cooling equipment component as the described heat abstractor of claim 63.

65. as the described active heat removal device of claim 63, it is characterized in that, it comprises that also one covers above above-mentioned series of passages, makes the air that spills out from this series of passages in the device of air flows flow back to the cover plate of above-mentioned cooling equipment component inside with obstruction.

66. the cooling fan assembly of an electronic equipment, it comprises:

A housing, it has the top of a band opening, a left side wall, right side wall and one are used to form a chamber from the front side wall that above-mentioned top and left and right sidewall extend out;

One is installed on the above-mentioned housing, is used to make the device that make air flows of air by above-mentioned opening; And

Front side wall from above-mentioned housing extends out, and crosses the baffle plate of right side wall from left side wall, and above-mentioned baffle plate is towards the part in the circulation of air path of the above-mentioned device that makes air flows, so that block the part of above-mentioned chamber.

67. as the described cooling fan assembly of claim 66, it is characterized in that, it comprises that also a front side wall from above-mentioned housing extends out, and protrude the cover plate beyond above-mentioned baffle plate, so that the air that above-mentioned baffle plate back has been flow through departs from the above-mentioned device that makes air flows.

68., it is characterized in that above-mentioned cover plate is with being pivotally mounted on the above-mentioned housing as the described cooling fan assembly of claim 67.

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