CN1262341A - Computer controlled ion nitrizing process and equipment with plasma source - Google Patents
Computer controlled ion nitrizing process and equipment with plasma source Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 54
- 230000008569 process Effects 0.000 title claims abstract description 49
- 238000005121 nitriding Methods 0.000 claims abstract description 71
- 238000010438 heat treatment Methods 0.000 claims abstract description 28
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 32
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 229910052757 nitrogen Inorganic materials 0.000 claims description 16
- 239000010453 quartz Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 230000005284 excitation Effects 0.000 claims description 3
- 230000005405 multipole Effects 0.000 claims description 3
- 244000309464 bull Species 0.000 claims description 2
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 4
- 230000001105 regulatory effect Effects 0.000 claims 4
- 230000004069 differentiation Effects 0.000 claims 2
- 230000010354 integration Effects 0.000 claims 2
- 230000015556 catabolic process Effects 0.000 claims 1
- 230000002000 scavenging effect Effects 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 12
- 238000004321 preservation Methods 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 3
- 238000000137 annealing Methods 0.000 abstract description 2
- 238000002347 injection Methods 0.000 abstract description 2
- 239000007924 injection Substances 0.000 abstract description 2
- 230000004048 modification Effects 0.000 abstract description 2
- 238000012986 modification Methods 0.000 abstract description 2
- 238000005265 energy consumption Methods 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 description 26
- 238000012544 monitoring process Methods 0.000 description 13
- 238000010849 ion bombardment Methods 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- -1 nitrogen ion Chemical class 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910001566 austenite Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005315 distribution function Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 150000002829 nitrogen Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000001988 small-angle X-ray diffraction Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
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Abstract
材料表面改性领域中,用计算机控制的等离子体源离子渗氮工艺及设备,包括升温、保温、降温及离子注渗工艺过程和供电系统、供气系统、抽真空系统与主真空室所构成的设备,特征是采用自加热式加热工件,通过计算机自动控制正负脉冲对的重复频率、各自的占空比与幅值来实现对工件温度的控制,使之按设定的渗氮温度曲线变化,优点:简化设备,降低能耗40%,过程完全自动化,工艺稳定,不打火,不起弧,不引起工件退火,安全可靠,重复性好。
In the field of material surface modification, the plasma source ion nitriding process and equipment controlled by computer, including heating, heat preservation, cooling and ion injection permeation process and power supply system, gas supply system, vacuum system and main vacuum chamber The equipment is characterized by the use of self-heating to heat the workpiece, and the computer automatically controls the repetition frequency of positive and negative pulse pairs, their respective duty ratios and amplitudes to control the temperature of the workpiece, so that it can be controlled according to the set nitriding temperature curve. Changes, advantages: simplified equipment, reduced energy consumption by 40%, fully automated process, stable process, no sparking, no arcing, no annealing of the workpiece, safe and reliable, and good repeatability.
Description
本发明涉及到离子渗氮工艺,属于材料表面改性技术领域。The invention relates to an ion nitriding process and belongs to the technical field of material surface modification.
渗氮工艺是材料表面强化的重要手段,目前,最先进的渗氮工艺是采用等离子体源离子渗氮工艺,这种工艺通常包括下面三个内容:①将欲渗氮的工件置于真空室内,抽真空后充以低气压的氮气,之后借助某种放电机制,使产生氮等离子体;②启动安置在工件旁的加热器使之对工件加热,调节加热器功率以控制工件温度;③对工件上加上直流或脉冲负偏压,以吸引氮等离子体中的正离子对工件表面进行注渗。现有技术在实现这一工艺过程中,存在着两个主要问题:①采用旁热式加热器加热工件,这不仅对形状复杂的工件来说,加热很难均匀,而且,加热器的设置增加了系统的复杂性,并对等离子体空间形成一定的干扰与污染;②等离子体源离子渗氮工艺是一个多参数的控制过程,这些参数有:等离子体密度、等离子体电子能量分布函数、工作气体压强、工件偏压参数、氮离子流密度、渗氮温度、渗氮时间与注渗氮总剂量等,对于这些参数的调节,现有技术是通过手工方法来完成的。这种人工调节方法,随机性很大,随时而变,因人而异,因此,很难保障工艺的重复性,并且需要操作人员全神贯注,随时进行监控,增加了劳动强度。The nitriding process is an important means of material surface strengthening. At present, the most advanced nitriding process is the plasma source ion nitriding process. This process usually includes the following three contents: ① Place the workpiece to be nitrided in a vacuum chamber After vacuuming, it is filled with low-pressure nitrogen, and then a nitrogen plasma is generated by a certain discharge mechanism; ②Start the heater placed next to the workpiece to heat the workpiece, and adjust the power of the heater to control the temperature of the workpiece; ③For A DC or pulse negative bias is applied to the workpiece to attract positive ions in the nitrogen plasma to infiltrate the surface of the workpiece. In the prior art, there are two main problems in the process of realizing this process: ① using a side-heating heater to heat the workpiece, which not only makes it difficult to heat evenly for workpieces with complex shapes, but also increases the number of heaters. It reduces the complexity of the system, and forms certain interference and pollution to the plasma space; ②Plasma source ion nitriding process is a multi-parameter control process, these parameters include: plasma density, plasma electron energy distribution function, working Gas pressure, workpiece bias parameters, nitrogen ion flux density, nitriding temperature, nitriding time and total nitriding dose, etc. The adjustment of these parameters is done manually in the prior art. This manual adjustment method is very random, changes at any time, and varies from person to person. Therefore, it is difficult to guarantee the repeatability of the process, and it requires the operator to concentrate on monitoring at any time, which increases the labor intensity.
本发明的目的和任务是要克服现有技术在渗氮过程中,①需要旁热式加热器和由此带来的系统复杂性及对等离子体空间形成的干扰、污染;②对等离子体源离子渗氮工艺的多参数过程需要人工监控,不能实现自动控制的不足,并提出一种无需安置加热器而采用自热式加热工件的方法,同时采用计算机自动监控工艺过程,使等离子体源离子渗氮成为一种完全自动化的工艺过程,特提出本发明的技术解决方法。Purpose and task of the present invention are to overcome prior art in nitriding process, 1. need the side heating type heater and the system complexity that brings thereby and to the disturbance, pollution that plasma space forms; 2. to plasma source The multi-parameter process of the ion nitriding process needs manual monitoring, and the lack of automatic control cannot be realized. A method of self-heating the workpiece without installing a heater is proposed. At the same time, a computer is used to automatically monitor the process, so that the plasma source ion Nitriding has become a fully automated process, and the technical solution of the present invention is specially proposed.
在渗氮过程中,工件需要加上一系列负偏压脉冲,负脉冲吸引正的氮离子对工件表面进行注渗,同时由于负偏压脉冲的作用,使离子获得动能,轰击工件表面,动能转化为热能,使工件温度升高,如果离子轰击时产生的热量与热辐射等原因损失的热量相等,则工件可维持在某一温度不变,显然,单位时间内离子轰击所带给工件的热能与脉冲频率,脉冲幅值及占空比有关。In the nitriding process, the workpiece needs to be added with a series of negative bias pulses. The negative pulses attract positive nitrogen ions to infiltrate the surface of the workpiece. It is converted into heat energy to increase the temperature of the workpiece. If the heat generated during ion bombardment is equal to the heat lost due to thermal radiation, the workpiece can be maintained at a certain temperature. Obviously, the ion bombardment brought to the workpiece per unit time Thermal energy is related to pulse frequency, pulse amplitude and duty cycle.
为了进一步说清这种关系,以实现完全自动控制的目的,首先说明自加热原理。“浸泡”在等离子体中待氮化处理的工件加上脉冲负偏压时,其表面便形成一鞘层,根据分子运动学理论可知,单位时间内打在单位面积鞘层表面的离子数为:
其中ni为离子密度,
vi为离子热运动平均速度,在负偏压的情况下,这些正离子都可穿过鞘层而达到工件表面,所以,进入工件表面的离子电流密度ji为
其中e为单位电荷,kTi为离子温度,mi为离子质量。Where e is the unit charge, kT i is the ion temperature, and m i is the ion mass.
由于建立鞘层的时间一般小于1μs,比负脉冲宽度小很多,故可忽略鞘层形成过程中离子电流密度的变化,认为在负脉冲期间、离子电流密度均为ji。Since the time to establish a sheath is generally less than 1 μs, which is much shorter than the width of the negative pulse, the change of the ion current density during the formation of the sheath can be ignored, and it is considered that the ion current density during the negative pulse is j i .
设负脉冲频率为f,脉宽为τ2,则平均离子电流密度ji为: Assuming that the negative pulse frequency is f and the pulse width is τ 2 , then the average ion current density j i is:
设脉冲负偏压幅值为V2,则离子轰击工件表面产生的功率密度pi为:
设工件暴露在等离子体中的表面积为S,则离子轰击产生的功率Pi为:
显然,对一个确定的工件,即S一定,在特定的等离子体参数条件下,即ni、kTi、mi一定,调节负脉冲的重复频率f,脉宽τ2与幅值V2,即可控制注入工件的总功率。Obviously, for a certain workpiece, that is, S is constant, and under certain plasma parameter conditions, that is, ni , kT i , mi are constant, and the repetition frequency f, pulse width τ 2 and amplitude V 2 of the negative pulse are adjusted, The total power injected into the workpiece can be controlled.
当工件加正脉冲时,将引起电子轰击工件,脉冲电子电流密度je可按下式计算:
其中,ne为电子密度,
ve为电子热运动平均速度,类似于负脉冲的情况,可以推导得出平均电子电流密度
je、电子加热功率密度pe与电子加热总功率Pe的公式:
式中τ1为正脉冲宽度,V1为正脉冲幅值,kTe为电子温度where τ 1 is the positive pulse width, V 1 is the positive pulse amplitude, and kT e is the electron temperature
由于 ve>> viSince v e >> vi
故 je>>ji Therefore j e >>j i
即正脉冲具有比负脉冲大得多的加热功率,一般约大两个量级,这对大工件的升温阶段特别有意义。That is, the positive pulse has a much larger heating power than the negative pulse, generally about two orders of magnitude larger, which is particularly meaningful for the heating up stage of large workpieces.
由此可知,氮化在实际操作的升温阶段、保温阶段和降温阶段中,通过调节离子轰击功率与电子轰击功率使其分别满足:It can be seen that, in the heating stage, heat preservation stage and cooling stage of the actual operation, the ion bombardment power and the electron bombardment power are adjusted to satisfy:
①升温阶段: ① Heating stage:
②保温阶段:②Insulation stage:
离子轰击功率=热辐射等造成的功率损失Ion bombardment power = power loss caused by heat radiation, etc.
③降温阶段: ③Cooling stage:
不难看出,如果离子轰击功率<热辐射等造成的功率损失,那么,系统就处在降温阶段。It is not difficult to see that if the ion bombardment power<the power loss caused by thermal radiation, etc., then the system is in the cooling stage.
显然, Obviously,
即为停止离子轰击的自然冷却速率。is the natural cooling rate to stop ion bombardment.
因此,整个氮化过程,可以通过调节正负脉冲的重复频率、脉宽与幅值来控制工件的温度。这就是用计算机控制氮化工艺的基本原理。Therefore, throughout the nitriding process, the temperature of the workpiece can be controlled by adjusting the repetition frequency, pulse width and amplitude of the positive and negative pulses. This is the basic principle of computer-controlled nitriding process.
对于尺寸较小的工件,氮化的三个阶段,均可通过对负偏压脉冲参数的调节来实现控温;但是,对于大工件,由于其热容量较大,在升温阶段,只靠离子轰击,有时达不到所需的升温速率,故还采用电子轰击来提高工件升温速率。这就是要通过采用正负偏压脉冲对来实现的。For smaller workpieces, the three stages of nitriding can achieve temperature control by adjusting the negative bias pulse parameters; however, for large workpieces, due to their large heat capacity, in the heating stage, only ion bombardment , Sometimes the required heating rate cannot be reached, so electron bombardment is also used to increase the heating rate of the workpiece. This is achieved by employing positive and negative bias pulse pairs.
本发明的基本构思是去掉旁热式加热器,采用离子/电子轰击工件的自热式加热工件,采用正负偏压脉冲对,通过调节其重复频率及各自的占空比与幅值以控制温度沿设定的渗氮温度曲线变化,用计算机循回检测工件温度,并在计算机内将检测值与设定值进行比较,使检测值趋于设定值或在设定值附近摆动,控温软件采用多参数比例积分微分PID控制技术,工件单位表面积所获得的总的注渗氮剂量,是通过计算机以一定的频率读取工件总电流、负偏压脉冲宽度以及在每个宽度下的负脉冲计数并按给定方程式计算。为安全起见,系统中还设置了弧流甄别系统和反馈控制电路。The basic idea of the present invention is to remove the side-heating heater, adopt the self-heating heating workpiece of ion/electron bombardment workpiece, adopt positive and negative bias voltage pulse pairs, and control their repetition frequency and their respective duty ratios and amplitudes. The temperature changes along the set nitriding temperature curve, the computer is used to detect the temperature of the workpiece, and the detected value is compared with the set value in the computer, so that the detected value tends to the set value or swings around the set value, and the control Wen software adopts multi-parameter proportional-integral-differential PID control technology. The total nitriding dose obtained per unit surface area of the workpiece is obtained by reading the total current of the workpiece, the negative bias pulse width and the pulse width of each width through the computer at a certain frequency. Negative pulses are counted and calculated according to the given equation. For the sake of safety, arc current discrimination system and feedback control circuit are also set up in the system.
本发明所提出的用计算机控制的等离子体源离子渗氮工艺及设备,其工艺包括设定的升温,保温与降温过程和离子注渗过程,其特征在于:采用自热式加热工件,即利用离子/电子轰击工件的能量加热工件;工件升温,保温和降温过程的温度控制,是通过调节工件负偏压的频率、幅值与占空比来调节工件的温度,对于大工件为达到所要求的升温速率,还采用电子轰击,这时,应通过采用正负偏压脉冲对来实现,正负脉冲对有相同的重复频率,其出现的时间完全错开并有一定的时间间隔,而其幅值与占空比可以分别独立调节,调节时,正负脉冲对重复频率T应满足以下关系:
第一步工件准备The first step workpiece preparation
将欲渗氮的工件进行清理,一般是浸泡在清洗液中用超声波清洗,然后凉干;Clean the workpiece to be nitrided, usually by immersing it in the cleaning solution, cleaning it with ultrasonic waves, and then drying it;
第二步装炉、抽真空、充氮气The second step is to load the furnace, vacuumize and fill with nitrogen
将凉干的工件,放置在主真空室内的工件平台上,关闭真空室,抽真空至1×10-2Pa~1×10-4Pa,一般为2×10-3Pa,然后,通过质量流量计向真空室内注入氮气,使真真室内的气压达到1Pa~1×10-2Pa,一般为8×10-2Pa;Place the dry workpiece on the workpiece platform in the main vacuum chamber, close the vacuum chamber, and evacuate to 1×10 -2 Pa ~ 1×10 -4 Pa, generally 2×10 -3 Pa, and then pass the mass The flowmeter injects nitrogen gas into the vacuum chamber to make the air pressure in the vacuum chamber reach 1Pa~1×10 -2 Pa, generally 8×10 -2 Pa;
第三步激励产生等离子体The third step stimulates the generation of plasma
接通电源,利用直流辉光放电,或射频辉光放电,或微波ECR放电在工件周围激励产生等离子体;Turn on the power, use DC glow discharge, or radio frequency glow discharge, or microwave ECR discharge to excite and generate plasma around the workpiece;
第四步启动自动渗氮控制程序The fourth step starts the automatic nitriding control program
开启正负脉冲电源与计算机控制系统电源,启动自动渗氮控制程序,选择或设定渗氮温度曲线,于是,计算机便按多参数比例积分微分PID控制原理,调整正负脉冲的参数,使实际渗氮温度沿渗氮温度曲线变化,直至过程序结束,如遇异常,系统自动报警,并提示排除故障;Turn on the positive and negative pulse power supply and the computer control system power supply, start the automatic nitriding control program, select or set the nitriding temperature curve, then, the computer adjusts the positive and negative pulse parameters according to the multi-parameter proportional integral differential PID control principle, so that the actual The nitriding temperature changes along the nitriding temperature curve until the end of the process. In case of abnormality, the system will automatically alarm and prompt to eliminate the fault;
第五步停机、取样、质量和性能检测The fifth step is shutdown, sampling, quality and performance inspection
过程结束后,自动停机,此时即可取样,并检测,一般进行常规的金相和性能方面的检测。After the process is over, it will stop automatically, and samples can be taken and tested at this time, usually for routine metallographic and performance testing.
本发明工艺方法其进一步的特征在于,其正负脉冲对是在计算机控制下,由监控电路产生,脉冲对的重复频率为f,其范围为1kHz~20kHz,正脉冲宽度为τ1,其范围为 -Δt2,一般为50μs~1ms,幅值V1,其范围为500V~3000V,在保温阶段与降温阶段τ1=0,即无正脉冲。负脉冲镀为τ2,其范围为 ,一般为50μs~1ms,幅度为V2,其范围为-500V~3000V,而Δt1=Δt2=1μs为宜。The process of the present invention is further characterized in that the positive and negative pulse pairs are generated by a monitoring circuit under the control of a computer, the repetition frequency of the pulse pair is f, and its range is 1 kHz to 20 kHz, and the positive pulse width is τ 1 , and its range for -Δt 2 is generally 50μs~1ms, the amplitude V 1 is in the range of 500V~3000V, and τ 1 =0 in the heat preservation stage and the temperature drop stage, that is, there is no positive pulse. Negative pulse plating is τ 2 , and its range is , generally 50μs~1ms, the amplitude is V 2 , the range is -500V~3000V, and Δt 1 =Δt 2 =1μs is appropriate.
一般说来,频率的选用与待氮化工件的形状有关,对带有棱棱角角的工件,为避免起弧要选用较高的频率;能量的沉积主要取决于脉冲幅值与占空比,因此在升温阶段,V1、V2、τ1、τ2均取较大值或最大值,在保温阶段与降温阶段,τ1=0,即无正脉冲,V2、τ2取较小值或最小值。Generally speaking, the selection of frequency is related to the shape of the workpiece to be nitrided. For workpieces with edges and corners, a higher frequency should be selected to avoid arcing; the energy deposition mainly depends on the pulse amplitude and duty cycle. Therefore, in the heating stage, V 1 , V 2 , τ 1 , and τ 2 take larger or maximum values; in the heat preservation stage and cooling stage, τ 1 = 0, that is, there is no positive pulse, and V 2 and τ 2 take smaller values value or minimum value.
为了实现本发明所提出用计算机控制的等离子体源离子渗氮工艺及设备的技术方案,其所采用的设备包括主真空室[21]、工件平台[22]、抽真空系统[26]、供气系统[27]、供电系统[28]与微波源系统[29],其特征在于:主真空室[21]是由园柱形壳体所构成,在其壳体的外侧设置有许多小永久磁铁块[20],这些磁铁块的极性按一定规律交替变化排列,构成多极会切场结构,对等离子体起磁约束作用,为了提高真空室内等离子体密度,并改善其均匀性,在主真空室[21]壳体两侧,设有两个电子回旋共振ECR反应室[18],它们与主真空室联通,在ECR反应室的周围,设有ECR磁场线圈[19],在主真空室下部设有真空泵接口[24],主真空室侧面设有密封门[23],可取放工件等,自动渗氮监控电路[25]通过计算机接口电路[13]与微机[14]相接,微波[15]通过起密封作用的石英窗[17]而引入ECR反应室[18]。In order to realize the technical scheme of the plasma source ion nitriding process and equipment controlled by computer proposed by the present invention, the equipment adopted includes main vacuum chamber [21], workpiece platform [22], vacuum pumping system [26], supply Gas system [27], power supply system [28] and microwave source system [29] are characterized in that: the main vacuum chamber [21] is made of a cylindrical shell, and many small permanent Magnets[20], the polarities of these magnets are arranged alternately according to certain rules, forming a multi-pole tangential field structure, which acts as a magnetic confinement for the plasma. In order to increase the plasma density in the vacuum chamber and improve its uniformity, the On both sides of the shell of the main vacuum chamber [21], there are two electron cyclotron resonance ECR reaction chambers [18], which communicate with the main vacuum chamber. Around the ECR reaction chamber, there are ECR magnetic field coils [19]. A vacuum pump interface [24] is provided at the bottom of the vacuum chamber, and a sealed door [23] is provided on the side of the main vacuum chamber, where workpieces can be taken and placed. The automatic nitriding monitoring circuit [25] is connected with the microcomputer [14] through the computer interface circuit [13] , the microwave [15] is introduced into the ECR reaction chamber [18] through the quartz window [17] which acts as a seal.
本发明设备的进一步特征在于:通过调节电磁线圈[19]电流,使在ECR反应室出口附近可产生与微波频率相对应的共振磁场强度,若微波频率为2.45GHz,则产生电子回旋共振所需的磁强强度为875高斯,永久磁块的表面磁场强度为1500~2500高斯,一般为2000高斯左右,透过无磁不锈钢室壁后,在室壁内侧表面衰减为100~700高斯,一般为400高斯左右。The further feature of the device of the present invention is: by adjusting the current of the electromagnetic coil [19], the resonant magnetic field intensity corresponding to the microwave frequency can be generated near the outlet of the ECR reaction chamber. The magnetic strength of the permanent magnet is 875 gauss, and the surface magnetic field strength of the permanent magnet is 1500-2500 gauss, generally about 2000 gauss. Around 400 Gauss.
对应不同的微波频率需要不同的共振磁场强度,若微波频率固定,则共振磁场强度也固定。同样,永久磁铁块的表面磁场强度也是固定的,因此,透过确定的无磁不锈钢室壁后,在室壁内侧也将衰减为一确定的磁场强度。当频率为2.45GHz的微波[15],通过石英窗[17]引入ECR反应室[18]后,即可在875高斯处通过电子回旋共振激励产生出来高密度的氮等离子体,由于扩散作用氮等离子体便可充满整个主真空室,此时,将监控电路[25]产生的正/负脉冲偏压加于工件[1]上,即可开始氮化处理,在氮化过程中,计算机软件自动调整正负脉冲对的频率f及各自的幅值V1、V2与脉宽τ1、τ2,使工件的温度在一定的误差范围内沿设定的氮化温度曲线变化,从而,完全自动地完成渗氮过程。Corresponding to different microwave frequencies, different resonant magnetic field strengths are required. If the microwave frequency is fixed, the resonant magnetic field strength is also fixed. Similarly, the surface magnetic field strength of the permanent magnet block is also fixed, therefore, after passing through a certain non-magnetic stainless steel chamber wall, it will also decay to a certain magnetic field strength inside the chamber wall. When the microwave [15] with a frequency of 2.45 GHz is introduced into the ECR reaction chamber [18] through the quartz window [17], high-density nitrogen plasma can be generated by electron cyclotron resonance excitation at 875 Gauss. The body can fill the entire main vacuum chamber. At this time, the positive/negative pulse bias voltage generated by the monitoring circuit [25] is applied to the workpiece [1], and the nitriding treatment can be started. During the nitriding process, the computer software automatically Adjust the frequency f of the positive and negative pulse pairs, their respective amplitudes V 1 , V 2 and pulse width τ 1 , τ 2 , so that the temperature of the workpiece changes along the set nitriding temperature curve within a certain error range, thus, completely The nitriding process is completed automatically.
本发明所提出用计算机控制的等离子体源离子渗氮工艺及设备的技术方案主要优点是:①由于设备去掉了加热器,采用了自加热模式,因此,不仅简化了设备,而且,改善了工件周围的等离子体状态,使加热均匀,效果更好;②在计算机控制的渗氮工艺中,计算机程序按照设定的温度曲线进行多参数比例积分微分PID控制,反馈响应快,控制精度高,是一种自动化的可重复工艺,特别适于工业上的推广应用;③由于计算机可详细记录工件的实际温度,工件总电流,正负脉冲对的频率、幅值与占空比的变化历史,因此,计算机可给出工件的总的注渗剂量及工件总电流的变化曲线,这为评价渗氮效果提供可靠的数据;④计算机控制的渗氮工艺,不打火、不起弧、不引起工件退火,是一种安全的工艺操作方法;⑤由于去掉了加热器,可节省电能消耗约40%。The main advantages of the technical scheme of the computer-controlled plasma source ion nitriding process and equipment proposed by the present invention are: 1. Since the equipment removes the heater and adopts a self-heating mode, not only the equipment is simplified, but also the workpiece is improved. The surrounding plasma state makes the heating uniform and the effect is better; ②In the computer-controlled nitriding process, the computer program performs multi-parameter proportional integral differential PID control according to the set temperature curve, with fast feedback response and high control precision, which is An automated and repeatable process, especially suitable for industrial application; ③ Since the computer can record in detail the actual temperature of the workpiece, the total current of the workpiece, the change history of the frequency, amplitude and duty cycle of positive and negative pulse pairs, so , the computer can give the total infiltration dose of the workpiece and the change curve of the total current of the workpiece, which provides reliable data for evaluating the nitriding effect; ④Computer-controlled nitriding process, no sparking, no arcing, and no Annealing is a safe process operation method; ⑤Because the heater is removed, the power consumption can be saved by about 40%.
下面是对附图的说明The following is a description of the accompanying drawings
图1是本发明加于工件的正负脉冲对结构示意图Fig. 1 is the schematic diagram of the structure of the positive and negative pulse pairs added to the workpiece in the present invention
在计算机控制下由监控电路所产生的正负脉冲对,具有相同的重复频率,正负脉冲在时间上是完全错开的,相互之间并有一定的时间间隔,正脉冲的宽度为τ1,幅度为V1,在保温与降温阶段取τ1=0,即无正脉冲。负脉冲的宽度为τ2,幅度为V2,τ为τ1、τ2的调节余量,即τ1、τ2可占用时间,调节时,正负脉冲对的重复频率T应满足:
图2是本发明用于自动渗氮监控电路[25]的结构示意图。虚线框以内部分即为监控电路[25]Fig. 2 is a structural schematic diagram of the present invention for automatic nitriding monitoring circuit [25]. The part inside the dashed box is the monitoring circuit[25]
该电路的作用一方面是随时监测工件的温度及其他运行参数,另一方面是接收计算机的控制信号,通过正负脉冲对的频率、脉宽与脉冲幅值的调节,实现对工件温度等的控制。On the one hand, the function of this circuit is to monitor the temperature of the workpiece and other operating parameters at any time, and on the other hand, it receives the control signal of the computer, and realizes the control of the temperature of the workpiece through the adjustment of the frequency, pulse width and pulse amplitude of the positive and negative pulse pairs. control.
紧贴在欲氮化的工件[1]上的热电偶,将温度信号送至隔离放大器[2],隔离放大器的作用是将工件上的偏置电压隔离开,使之不能传至计算机接口[13]电路,而只能将温度信号传到计算机接口[13],计算机对负脉冲的控制是通过计算机接口[13]送出三路数模转换D/A信号以分别控制负脉冲的频率f、脉宽τ2与脉冲幅值a2,[4]为电压频率转换VFC电路,[5]为延时电路,使负脉冲在正脉冲结束后经过时间Δt1的延迟之后才产生,以保障系统稳定的工作,[6]为电压脉宽转换电路、[7]为驱动电路,它将频率与脉宽均经过调整了的脉冲信号进行功率放大,以便驱动脉冲调制器IGBT[8],[9]为数控直流电源,它的输出幅值受计算机的D/A信号a2所控制,数控直流电源[9]的直流输出经IGBT[8]调制后,输出大功率的脉冲信号至脉冲变压器[3]的一组输入线圈,并在输出线圈内感应产生出负脉冲加在工件[1]上。正脉冲的产生与负脉冲完全类似,其极性的不同是通过脉冲变压器[3]初次级线圈的不同耦合相位而实现的。电流传感器[12],可测得工件离子电流I2和电子电流I1经计算机接口[13]送入计算机,电流传感器[12]的输出同时也送到比较器[11],工件电流若大于某一临界值,比较器[11]便有信号输出至反馈控制电路[10],实现对数控直流电源[9]的保护性控制。电压脉宽转换电路[6],输出的脉冲除送驱动电路[7]之外,也送到计算机接口[13]进行脉冲计数,即n1、n2,如此实现监控作用。The thermocouple attached to the workpiece [1] to be nitrided sends the temperature signal to the isolation amplifier [2]. The function of the isolation amplifier is to isolate the bias voltage on the workpiece so that it cannot be transmitted to the computer interface [ 13] circuit, but the temperature signal can only be transmitted to the computer interface [13]. The computer controls the negative pulse by sending three digital-to-analog conversion D/A signals through the computer interface [13] to control the frequency f, Pulse width τ 2 and pulse amplitude a 2 , [4] is a voltage-frequency conversion VFC circuit, and [5] is a delay circuit, so that the negative pulse is generated after a delay of time Δt 1 after the end of the positive pulse, so as to ensure the system Stable work, [6] is the voltage pulse width conversion circuit, [7] is the drive circuit, it amplifies the power of the pulse signal whose frequency and pulse width have been adjusted, so as to drive the pulse modulator IGBT[8], [9 ] is a digitally controlled DC power supply, whose output amplitude is controlled by the D/A signal a2 of the computer. After the DC output of the digitally controlled DC power supply [9] is modulated by the IGBT [8], it outputs a high-power pulse signal to the pulse transformer [ 3] a set of input coils, and a negative pulse is induced in the output coil and applied to the workpiece [1]. The generation of the positive pulse is completely similar to the negative pulse, and the difference in polarity is achieved by the different coupling phases of the primary and secondary coils of the pulse transformer [3]. The current sensor [12] can measure the workpiece ion current I2 and the electronic current I1 and send it into the computer through the computer interface [13]. The output of the current sensor [12] is also sent to the comparator [11] at the same time. If the workpiece current is greater than At a certain critical value, the comparator [11] will have a signal output to the feedback control circuit [10] to realize the protective control of the digitally controlled DC power supply [9]. Voltage pulse width conversion circuit [6], the output pulses are not only sent to the drive circuit [7], but also sent to the computer interface [13] for pulse counting, namely n 1 and n 2 , so as to realize the monitoring function.
图3是本发明所设计的用计算机控制的等离子体源离子渗氮设备结构示意图Fig. 3 is the structural representation of the plasma source ion nitriding equipment designed by the present invention with computer control
用不锈钢制作的园柱状主真空室[21]的外侧放置有很多小块永久磁铁[20],其极性按一定规律交替变化地排列,构成多极会切场结构,对室内等离子体起到约束作用,连接在抽气口[24]的机械泵与分子泵系统同主真空室连通,在ECR反应室[18]的端部设有氮气入口[16],在充气气路中配置有气体质量流量计,用以调节进气速率,在主真空室[21]的两侧,设有两个带石英窗[17]的电子回旋共振ECR反应室[18],与主真空室[21]连通,电子回旋共振ECR反应器[18]的外侧设置有ECR磁场线圈[19],通过调节线圈电流,可在ECR反应室[18]出口处产生875高斯磁场。频率为2.45GHz的微波[15],通过起密封作用的石英窗[17],引入ECR反应室后,即可在875高斯处,通过电子回旋共振激发出来高密度的氮等离子体,由于扩散作用等离子体便可充满整个主真空室,此时,将监控电路[25]产生的正/负脉冲偏压加于工件[1]上。便可开始氮化处理,工件[1]是放在工件平台[22]上,工件平台[22]通过监控电路[25]及计算机接口电路[13]与计算机[14]相接,计算机软件自动调整正负脉冲对的频率,及各自的幅值和脉宽,使工件的温度在一定误差范围内沿设定的氮化温度曲线变化,从而完全自动地完成渗氮过程。符号[23]是主真空室密封门。虚线框以内是主真空室系统[30]。图中符号[15]所标明的箭头方向是微波进入方向;符号[16]所标明的箭头方向是氮气入口方向;符号[24]所标明的箭头方向是抽气方向。There are many small pieces of permanent magnets [20] placed on the outside of the cylindrical main vacuum chamber [21] made of stainless steel, and their polarities are arranged alternately according to certain rules, forming a multi-pole tangential field structure, which plays a role in the indoor plasma. Constraint effect, the mechanical pump and molecular pump system connected to the pumping port [24] communicate with the main vacuum chamber, a nitrogen inlet [16] is provided at the end of the ECR reaction chamber [18], and a gas mass The flow meter is used to adjust the intake rate. On both sides of the main vacuum chamber [21], there are two electron cyclotron resonance ECR reaction chambers [18] with quartz windows [17], communicating with the main vacuum chamber [21]. , the ECR magnetic field coil [19] is set outside the electron cyclotron resonance ECR reactor [18]. By adjusting the coil current, an 875 Gauss magnetic field can be generated at the exit of the ECR reaction chamber [18]. Microwaves with a frequency of 2.45 GHz [15] are introduced into the ECR reaction chamber through the quartz window [17] which acts as a seal, and high-density nitrogen plasma can be excited by electron cyclotron resonance at 875 Gauss. Due to the diffusion effect, the plasma Body just can be filled with whole main vacuum chamber, at this moment, the positive/negative pulse bias voltage that monitoring circuit [25] produces is added on the workpiece [1]. Just can start nitriding treatment, workpiece [1] is to be placed on workpiece platform [22], and workpiece platform [22] is connected with computer [14] by monitoring circuit [25] and computer interface circuit [13], computer software automatically Adjust the frequency of positive and negative pulse pairs, as well as their respective amplitude and pulse width, so that the temperature of the workpiece changes along the set nitriding temperature curve within a certain error range, so that the nitriding process can be completed automatically. Symbol [23] is the airtight door of the main vacuum chamber. Inside the dotted box is the main vacuum chamber system [30]. The direction of the arrow indicated by the symbol [15] in the figure is the direction of microwave entrance; the direction of the arrow indicated by the symbol [16] is the direction of nitrogen gas inlet; the direction of the arrow indicated by the symbol [24] is the direction of gas extraction.
图4是本发明所设计的用计算机控制的等离子体源离子渗氮设备系统示意图,主真空室系统[30]配有供电系统[28],供气系统[27],抽真空系统[26]和微波源系统[29],计算机机[14]通过计算机接口电路[13]与监控电路[25]相连,从而对渗氮过程进行自动监控。Fig. 4 is the schematic diagram of the plasma source ion nitriding equipment system designed by the present invention, the main vacuum chamber system [30] is equipped with power supply system [28], gas supply system [27], vacuum pumping system [26] And the microwave source system [29], the computer [14] is connected with the monitoring circuit [25] through the computer interface circuit [13], so as to automatically monitor the nitriding process.
图5是本发明工艺的计算机自动控制程序流程图,图中箭头是流程的进展方向。自动氮化程序启动之后,首先设定升温速率a,保持温度TH,氮化所需剂量D0,降温速率b与结束温度T;因此氮化温度曲线Tc(t)可表示为这里T0表示室温。无疑,也可设定其他形成的氮化曲线。接着氮化开始,激励产生氮等离子体,时间清零;在升温阶段,循环检测工件实际温度Tm(t),并将它与Tc(t)比较,根据二者的差值,进行多参数PID调节,即调节正负脉冲对的频率及各自的宽度与幅度,使差值减小,直到Tm(t)≥TH,即达到Tc(t)在保温阶段的取值,此时转入保温阶段;在保温阶段,依旧循环检测工件的实际温度Tm(t),并将它与Tc(t)比较,根据二者的差值进行多参数PID调节,使差值减小;对负脉冲期间的工件总电流进行跟踪记录,对每一种工件总电流下的负脉冲宽度,以及每一种负脉冲宽度下的脉冲计数进行记录,同时也对τ值进行跟踪记录,计算机根据这些数值利用前述公式计算工件所接收的氮化剂量D(t),直至D(t)≥D0,即达到预期的氮化剂量,此时转入降温阶段,时间重新置零;在降温阶段,依旧循环检测工件的实际温度Tm(t),并将它与Tc(t)比较,根据二者的差值进行多参数PID调节,使差值减小,直至Tm(t)≤T,氮化结束。Fig. 5 is a computer automatic control program flow chart of the process of the present invention, and the arrow in the figure is the progress direction of the flow process. After the automatic nitriding program starts, first set the heating rate a, maintain the temperature T H , the dose required for nitriding D 0 , the cooling rate b and the end temperature T; therefore, the nitriding temperature curve T c (t) can be expressed as Here T 0 means room temperature. Of course, other formed nitriding curves can also be set. Then nitriding starts, the nitrogen plasma is stimulated, and the time is reset; in the heating stage, the actual temperature T m (t) of the workpiece is cyclically detected, and it is compared with T c (t). According to the difference between the two, multiple Parameter PID adjustment, that is, to adjust the frequency of positive and negative pulse pairs and their respective width and amplitude, so as to reduce the difference until T m (t) ≥ T H , that is, to reach the value of T c (t) in the heat preservation stage. In the heat preservation stage, the actual temperature T m (t) of the workpiece is still cyclically detected, and compared with T c (t), and the multi-parameter PID adjustment is performed according to the difference between the two to reduce the difference. Small; track and record the total workpiece current during the negative pulse period, record the negative pulse width under each kind of total workpiece current, and the pulse count under each negative pulse width, and also track and record the τ value, Based on these values, the computer calculates the nitriding dose D(t) received by the workpiece using the aforementioned formula until D(t)≥D 0 , that is, the expected nitriding dose is reached. At this time, it enters the cooling stage, and the time is reset to zero; In the cooling stage, the actual temperature T m (t) of the workpiece is still cyclically detected, and compared with T c (t), and multi-parameter PID adjustment is performed according to the difference between the two to reduce the difference until T m (t )≤T, nitriding ends.
下面结合具体实施例进一步说明本发明的细节。The details of the present invention will be further described below in conjunction with specific embodiments.
一根用于活塞环清洗机上的Cr18Ni9Ti不锈钢转轴,尺寸为35×280毫米,要求表面耐磨,并具有抗腐蚀性,采用本发明技术进行氮化处理,步骤如下:A Cr18Ni9Ti stainless steel rotating shaft used on a piston ring cleaning machine, with a size of 35 × 280 millimeters, requires surface wear resistance and corrosion resistance, and adopts the technology of the present invention to carry out nitriding treatment. The steps are as follows:
第一步工件清洗The first step workpiece cleaning
工件放入超声波清洗机内,加入清洗液,开启超声波,清洗15分钟,取出后,用丙酮棉擦洗,再用无水酒精棉擦净,最后在空气中凉干。Put the workpiece into the ultrasonic cleaning machine, add cleaning solution, turn on the ultrasonic wave, and clean it for 15 minutes. After taking it out, scrub it with acetone cotton, then wipe it with anhydrous alcohol cotton, and finally dry it in the air.
第二步装入工件、抽真空The second step is to load the workpiece and vacuumize
将工件装入本发明用计算机控制的等离子体源离子渗氮设备的主真空室内工件平台上,关闭真空室门,相继开启机械泵与分子泵,使真空室本底真空达2×10-3Pa。Put the workpiece into the workpiece platform in the main vacuum chamber of the computer-controlled plasma source ion nitriding equipment of the present invention, close the vacuum chamber door, and turn on the mechanical pump and the molecular pump in succession to make the background vacuum of the vacuum chamber reach 2×10 -3 Pa.
第三步 微波ECR激励氮等离子体Step 3: Microwave ECR excites nitrogen plasma
通过质量流量计向真空室内充入氮气,使其气压达到8×10-2Pa;此时开启磁场线圈的电源,调节线圈电流,使ECR反应室出口处产生875高斯的磁场;接着开启频率为2.45GHz的微波源,调节其功率输出至630瓦,此时,从ECR反应室与主真空室发出的浅紫色辉光可知氮等离子体已充满主真空室。用Langmuir探针测得等离子体密度为2.3×1010/厘米3,电子温度为6.2eV。Fill the vacuum chamber with nitrogen gas through the mass flowmeter to make the pressure reach 8×10 -2 Pa; at this time, turn on the power supply of the magnetic field coil and adjust the coil current to generate a magnetic field of 875 gauss at the outlet of the ECR reaction chamber; then turn on the frequency of 2.45GHz microwave source, adjust its power output to 630 watts. At this time, the light purple glow from the ECR reaction chamber and the main vacuum chamber shows that the nitrogen plasma has filled the main vacuum chamber. The plasma density was measured with a Langmuir probe to be 2.3×10 10 /cm 3 , and the electron temperature was 6.2 eV.
第四步启动自动渗氮程序The fourth step starts the automatic nitriding program
开启监控电路电源与正负直流电源,启动自动渗氮程序后,屏幕即显示参数设定界面。在此设定升温速率a=1℃/秒,降温速率b=0.2℃/秒,保温阶段温度TH=400℃,氮化剂量D0=4×1021/cm2,结束温度T=60℃,用鼠标点击“确认”后,程序即进入升温阶段,约经6分钟转入保温阶段,保温阶段持续4小时后自动转入降温阶段,降温阶段持续约半小时,氮化结束,自动停机。Turn on the power supply of the monitoring circuit and the positive and negative DC power supply, and after starting the automatic nitriding program, the screen will display the parameter setting interface. Here, set the heating rate a=1°C/s, the cooling rate b=0.2°C/s, the temperature in the holding stage T H =400°C, the amount of nitriding D 0 =4×10 21 /cm 2 , and the end temperature T=60 ℃, after clicking “Confirm” with the mouse, the program will enter the heating stage, and it will transfer to the heat preservation stage after about 6 minutes. After the heat preservation stage lasts for 4 hours, it will automatically transfer to the cooling stage. .
第五步质量检查Step Five Quality Check
金相检查表面生成了厚约6μm的氮化层。A nitride layer with a thickness of about 6 μm was formed on the surface of the metallographic examination.
显微硬度检查,表面硬度在25g载荷下为724HV。Microhardness check, surface hardness was 724HV under 25g load.
小角X射线衍射分析观察到了来自氮化层过饱和氮奥氏体相的5个γN峰。Small angle X-ray diffraction analysis observed five γ N peaks from the supersaturated nitrogen austenite phase of the nitrided layer.
电化学腐蚀试验表明,经约4个小时的氮化处理,表面抗腐蚀性能未变。The electrochemical corrosion test shows that after about 4 hours of nitriding treatment, the surface corrosion resistance has not changed.
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CN102668379A (en) * | 2009-10-13 | 2012-09-12 | 相干公司 | Digital pulse-width-modulation control of a radio frequency power supply for pulsed laser |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN102668379A (en) * | 2009-10-13 | 2012-09-12 | 相干公司 | Digital pulse-width-modulation control of a radio frequency power supply for pulsed laser |
CN102668379B (en) * | 2009-10-13 | 2015-07-22 | 相干公司 | Digital pulse-width-modulation control of a radio frequency power supply for pulsed laser |
CN104583446A (en) * | 2012-07-05 | 2015-04-29 | 伯明翰大学 | Long-acting antibacterial metal surface and preparation method thereof |
CN102877020A (en) * | 2012-10-09 | 2013-01-16 | 江苏丰东热技术股份有限公司 | Large double temperature control active screen ion nitriding device |
CN106319435A (en) * | 2015-07-07 | 2017-01-11 | 财团法人金属工业研究发展中心 | Control method of carburizing heat treatment |
CN107239052A (en) * | 2017-05-23 | 2017-10-10 | 中国电子科技集团公司第四十研究所 | A kind of triggering level automatic calibrating method realized based on FPGA |
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CN114892123A (en) * | 2022-05-23 | 2022-08-12 | 太原理工大学 | An ion nitriding method to eliminate the risk of arcing in small holes |
CN114892123B (en) * | 2022-05-23 | 2024-04-16 | 太原理工大学 | An ion nitriding method to eliminate the risk of arcing in small holes |
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