CN1261480C - Ultra-low temperature adhesive of epoxy resin and preparation thereof - Google Patents
Ultra-low temperature adhesive of epoxy resin and preparation thereof Download PDFInfo
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- CN1261480C CN1261480C CN 200310103286 CN200310103286A CN1261480C CN 1261480 C CN1261480 C CN 1261480C CN 200310103286 CN200310103286 CN 200310103286 CN 200310103286 A CN200310103286 A CN 200310103286A CN 1261480 C CN1261480 C CN 1261480C
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Abstract
The present invention relates to an adhesive. The present invention mainly comprises the components of epoxy resin, a mixing solidifying agent, fillers and additives, wherein the mixing solidifying agent comprises 10 to 90% (weight percentage) of polyetheramine and 10 to 90% (weight percentage) of aromatic amine. The adhesive can be solidified below 60 DEG C, adhesion strength within the temperature range of-269 DEG C to room temperature can exceed 18Mpa, the maximum one can reach 33Mpa, and the adhesion strength at the temperature of 140 DEG C can still reach 20Mpa. Furthermore, the present invention has the advantages of good hot and cold resistance and impact resistance, and can be used within the wide temperature range of-269 DEG C to 140 DEG C. In addition, the system of the adhesive comprises 100 parts of the epoxy resin, 10 to 100 parts of the mixing solidifying agent, 0 to 150 parts of the fillers and 1 to 5 parts of the additives.
Description
Technical field
The present invention relates to a kind of adhesive system, more particularly, the present invention relates to a kind of Resins, epoxy, filler, additive and polyamine curing agent of containing, be suitable under ultra-low temperature surroundings, using, and have the tackiness agent of certain resistance to elevated temperatures.
Background technology
The ultra-low temperature glue stick is meant the tackiness agent that uses and have enough bonding strengths under ultra-low temperature surroundings.And ultra-low temperature surroundings typically refers to liquid oxygen (183 ℃), liquid nitrogen (196 ℃), liquid hydrogen (253 ℃) and liquid helium environment such as (269 ℃).
Development along with national defense industry, aeronautical and space technology and low-temperature superconducting technology, performance to tackiness agent has proposed new requirement, wishes to have a kind of tackiness agent that can solidify and can use and have outstanding adhesiveproperties in lower temperature (near room temperature) down in quite wide temperature range (269 ℃～120 ℃).
When temperature is reduced to condition of ultralow temperature, can make tackiness agent produce bigger thermal stresses usually and concentrate, in addition, the segment of polymkeric substance tends to frozen.Because cold contraction, the intermolecular space that is not occupied reduces greatly, so the molecule segment motion is very difficult, makes it lose toughness.Therefore, common high-temperature resistance adhesive is along with the reduction of temperature, and can become is highly brittle, and adhesiveproperties sharply reduces, and is unsuitable for using under ultra-low temperature surroundings.
External very low temperature Study on making adhesives starts from five sixties of last century, and has proposed a series of tackiness agent that can use under very low temperature.Present commercially available ultra-low temperature glue stick mainly contains urethane and modified adhesive, organic silicon adhesive, modified nylon epoxyn and poly-fragrant heterocyclic tackiness agent, but all there is its inherent defective in they, have brought a lot of problems to practical application.
Polyurethane adhesive is best tackiness agent [the Stanley R.Sandler of adhesiveproperties under very low temperature that generally acknowledges at present; Journal of applied polymer science, 1965, vol 9, p3909-3916], its bonding strength under very low temperature is very high, can reach 34MPa-196 ℃ of following bonding strengths, and-269 ℃ next more can be up to 55MPa.In addition, the stripping strength of urethane is also higher, connects so can form flexible.But this tackiness agent is along with the rising performance of envrionment temperature can sharply reduce, and its room temperature and high-temperature behavior are relatively poor.With URALANE 5768 is example, and its room temperature bonding strength only is 5.7MPa, obviously can't satisfy service requirements.In addition, because end group is an isocyanate groups, though help the improvement of adhesiveproperties, its moisture resistance properties is reduced greatly, the cohesion of a small amount of steam will make adhesiveproperties sharply reduce [Kurt H.Miska; MaterialsEngineering, 1978, No.5, p45-47].The external polyurethane adhesive trade mark has URALANE 5768, EA9525 and PR-1665 etc. at present, the domestic DW series tackiness agent that the preparation of Shanghai synthetic resins institute is arranged.
Though organic silicon adhesive has certain high and low temperature resistance and good water tolerance, but its bonding strength is then much smaller relatively, NASA studies show that bonding strength only is 1～4MPa[David C.Goeders and John L.Perry after the organic silicon adhesive self-vulcanizings such as external SEA200, RTV 102 and DC 90-006; 36th International SAMPESymposium, April 15-18 1991, p348-361].The report that does not have at present it to use as yet as the very low temperature sqtructural adhesive.
The modified nylon epoxy adhesive is to contain the product of the polymkeric substance nylon of a large amount of amide group with Resins, epoxy generation chemical reaction in the molecule, because the formation of a large amount of hydrogen bonds, its bonding strength when 20K can reach nearly 40MPa, and still can reach about 35MPa in the room temperature bonding strength, certain resistance to elevated temperatures is also arranged, and the restriction maximum operation (service) temperature is 82 ℃.Be relatively ideal ultra-low temperature glue stick [J.Hertz of a kind of mechanical property; Advances in Cryogenic Engineering, 1962, vol 7, p336-342].But it is very harsh that the critical defect of this tackiness agent is a condition of cure, requires to be cured [Kurt H.Miska at 177 ℃ of following pressurization 0.17MPa of temperature; Materials Engineering, 1978.No.5, p45-47], this has increased technology difficulty and technology cost greatly, has limited its use.In addition, because nylon has water absorbability, thereby make the water tolerance and the wet and heat ageing resistant poor-performing of tackiness agent.The external at present main trade mark has EA951, EA951-S and FM1000 etc.
Poly-fragrant heterocyclic tackiness agent, mainly be polybenzimidazole (PBI), polyquinoxaline (PQ) and polyimide (PI) class tackiness agent, because their specific molecule chain structures (constituting by fragrant heterocycle chain fully), shown very outstanding high and low temperature resistance, can be at-253 ℃～260 ℃ life-time service.Because the existence of fragrant heterocycle structure makes it demonstrate high chain rigidity and high glass-transition temperature (T
g) over-all properties.So its intensity high and low temperature and high-temperature behavior are more or less the same.But its shortcoming is the solidification value height, need carry out condensation curing more than 300 ℃, and can emit low-molecular material when solidifying, and the more important thing is that price is very expensive, thereby practical level is not high.The external main trade mark have Narmco 2801, Imidite 850 etc. [Li Hongru, take on auspicious omen in the field; New Chemical Materials, 1996, the 10 phases, p2-13].
The epoxyn high and low temperature resistance is all better, owing to contain the polar epoxide group, its adhesiveproperties excellence is present good comprehensive properties tackiness agent.But it is bigger that shortcoming is a fragility, generally is unsuitable for using as sqtructural adhesive separately, must carry out toughness reinforcing.Because most segment is frozen under condition of ultralow temperature, therefore need select special toughner for use.
D.Evans once proposed with polyetheramine as the bisphenol A epoxide resin solidifying agent, utilize the polyether segment of solidifying agent itself to carry out toughness reinforcing, obtained to still have at low temperatures suitable flexible resin system, but room temperature and high-temperature behavior reduce greatly, can't satisfy sqtructural adhesive service requirements [D.Evans and Z.Zhang; Advances in Cryogenic Engineering (Materials), vol.46, pp235-242,2000].C.A.Baldan etc. are also to having carried out studying [C.A.Baldan, C.Y.Shigue and U.M.C.Maciel, et al with the different types of Resins, epoxy low-temperature performance of polyetheramine solidified; Advances in CryogenicEngineering, vol.46, pp.205-210,2000], but the low excessively problem not solution all the time of room temperature and high-temperature behavior makes it be difficult to carry out practical application as the very low temperature sqtructural adhesive.
Maximum epoxy curing agent of usefulness mainly contains anhydrides and polyamines class at present.And the acid anhydride type curing agent as ultra-low temperature glue stick solidifying agent that report is arranged mainly is liquid anhydride such as methyl tetrahydrophthalic anhydride (MeTHPA), methylhexahydrophthalic anhydride (MeHHPA), methyl carbic anhydride (MNA) and dodecenylsuccinic anhydride (DDSA) etc., this class solidifying agent is the solidification value height often, need be at the hot setting more than 150 ℃, technology difficulty and technology cost have been increased greatly, especially for big member sqtructural adhesive, such processing condition are difficult to realize.
The polyamines class solidifying agent that is used for ultra-low temperature glue stick solidifying agent then mainly is aromatic amine, aliphatic amide, polymeric amide and based on some modified amine of aromatic amine and aliphatic amide.Though solidification value such as aliphatic amide such as diethylenetriamine, triethylene tetramine is low, condensate performance is poor, so less use.And the polyamide curing agent cured epoxy resin of certain molecular weight can improve low-temperature performance greatly, but its shortcoming is owing to contain a large amount of amide group in the molecule, make its cured article water resistance very poor, and the resistance to elevated temperatures of polymeric amide cured article is also relatively poor relatively.And aromatic amine curing agent mainly is mphenylenediamine (m-PDA), diaminodiphenylmethane (DDM), diaminodiphenylsulfone(DDS) (DDS) and m-xylene diamine (m-XDA) etc., cured article intensity is higher, but m-PDA, DDM and DDS are solid, need first heating and melting or with using complicated process of preparation after the dissolution with solvents; Though and m-XDA is liquid, solidification value is also lower, its shortcoming be when using separately working life short, only be 15 minutes.Most in addition aromatic amines generally all require at hot setting more than 150 ℃, the curing process complexity, and cured product fragility is very big.And use more some eutectic mixtures (making by m-PDA and DDM) at present as Tonox60-40 based on aromatic amine though and modified amine on stability, improve to some extent the then less improvement of curing process, and the performance of cured article also fails to improve.
Technology contents
Goal of the invention
An object of the present invention is to provide a kind of curing agent for epoxy resin, it has overcome the shortcoming of above solidifying agent, compares with above-mentioned solidifying agent to have tangible advantage.The first, preparation technology is simple for this solidifying agent, only need with used aromatic amine or modified amine directly and polyetheramine mix and get final product; The second, use this solidifying agent that the tackiness agent processing performance is greatly improved.Its state is liquid, and viscosity is low; And improved m-xylene diamine short shortcoming working life, be 1-3 hour working life; Simple with the Resins, epoxy hybrid technique, and can thorough mixing even; The 3rd, can solidify under lower temperature, general solidification value is 60 ℃, even can at room temperature solidify, this greatly reduces technology difficulty and technology cost, for some large-sized structural parts and be unsuitable for bearing pyritous by the very important meaning of being bonded with of bond; The 4th, owing to comprise flexible polyether segment, so need not to add other toughner, cured article toughness is very good, even still can keep suitable toughness under very low temperature in this solidifying agent; The 5th, owing to contain aromatic amine in the solidifying agent, make cured article keep the certain high temperature performance again, make it under comparatively high temps (140 ℃), still can keep higher bonding strength; The 6th, the cured product wet-hot aging performance that uses this solidifying agent to obtain is good.
Another object of the present invention provides a kind of Resins, epoxy ultra-low temperature glue stick, can use in-269 ℃～140 ℃ wide temperature range, and can keep suitable bonding strength, the stripping strength height, good toughness, cold-resistant thermal shock resistance properties is good, and condition of cure requires not harsh, and solidification value is low.Preparation technology is simple in addition, and cost is low, and raw material is easy to get.
Specifically, the objective of the invention is:
1. a curing agent for epoxy resin is characterized in that: contain polyetheramine and aromatic amine in this solidifying agent.
2. as 1 described solidifying agent, it is characterized in that: the content of described polyetheramine is 10-90%, is preferably 15-85% especially, and more preferably 20-80% is preferably 25-75%, based on the gross weight of solidifying agent.
3. as 1 or 2 described solidifying agent, it is characterized in that: its contained polyether segment of described polyetheramine is aliphatic ether or aromatic oxide, contain 1～10 amido in each molecule, be preferably 1～8, more preferably 1～6, be preferably 1～4, the reactive hydrogen number is 2～20, be preferably 2～16, more preferably 2～12, be preferably 2～8.
4. as 3 described solidifying agent, it is characterized in that: described polyetheramine solidifying agent molecular weight is 100～5000, is preferably 120～4500, more preferably 150～3500, be preferably 200～3000.Select white oxygen ethylene diamine, polyethyleneoxide diamine, polyoxyethylene triamine, oxypropylene diamines, polypropyleneoxide diamine, polyoxypropylene triamine, oxygen butylene diamines, polyoxy butylene diamines, polyoxy butylene triamine, 1,2-dimethyl oxygen ethylene diamine, poly-(1,2-dimethyl oxygen ethylene diamine), poly-(1, and their mixture 2-dimethyl oxygen ethene triamine).
5. as 1 or 2 described solidifying agent, it is characterized in that: contain 1～6 amido in each molecule of described aromatic amine, be preferably 1～5, be preferably 1～4, wherein have at least an amido directly not link to each other with aromatic group, the reactive hydrogen number is 1～12, be preferably 2～10, be preferably 2～8.
6. as 5 described solidifying agent, it is characterized in that: described aromatic amine is selected from: m-xylene diamine, p dimethylamine, O-phthalic amine, a benzene Trimethylamine 99, a benzene diethylamine, to benzene diethylamine, adjacent benzene diethylamine, 4,4 '-diamines methyl diphenyl, 3,3 '-diamines methyl diphenyl, 3,3 ', 5,5 '-tetramine methyl diphenyl and based on the affixture and the condenses of above-mentioned aromatic amine, and their mixture.
7. an epoxyn is characterized in that, wherein contains 100 parts Resins, epoxy, 10～100 part 1 or 2 described solidifying agent, and 0～150 part filler, 1～5 part additive, each component concentration is by weight.
8. as 7 described tackiness agent, it is characterized in that: described Resins, epoxy is to be selected from Racemic glycidol ether type epoxy and glycidyl amine type epoxy resin, or its mixture, its oxirane value is 0.2～1.5, be preferably 0.25～1.4, more preferably 0.3～1.3, be preferably 0.4～1.2.
9. as 7 described tackiness agent, it is characterized in that being: described filler is selected from aluminium powder, zinc powder, silicon dioxide powder, aluminum oxide powder, oxide powder and zinc, glass fibre, synthon, ceramic whisker, and their mixture, consumption is the 0-150% of used weight epoxy, be preferably 0-140%, more preferably 0-130% is preferably 0-110%.
10. as 7 described tackiness agent, it is characterized in that being: described additive is a silane coupling agent, is selected from r-aminopropyl triethoxysilane, r-glycidyl ether propyl trimethoxy silicane, anilino methylene triethoxyl silane, r-(diethyl triamine) propyl-triethoxysilicane.
11. as 7 described epoxyns, its particularly preferred composition is to contain 100 parts Resins, epoxy, 17～80 parts solidifying agent, 0～110 part filler and 1～3 part coupling agent, all by weight.
Technical scheme
Adopt polyetheramine solidifying agent solidified epoxy resin cured product under ultra-low temperature surroundings, to still have suitable toughness, suit under low temperature environment, to use, but adhesiveproperties is poor under room temperature and the high temperature, should not use as sqtructural adhesive.Adopt aromatic amine curing agent solidified epoxy resin cured product intensity height, resistance to elevated temperatures is good, but that its shortcoming is a fragility is big, and the solidification value height, need solidify under 150 ℃ of high temperature.In Resins, epoxy ultra-low temperature glue stick of the present invention, the mixed curing agent that has adopted aromatic amine and polyetheramine to form, compare aromatic amine, polymeric amide and anhydride-cured system solidification value and greatly reduce, can under 60 ℃ even room temperature, solidify, greatly reduce technology difficulty and technology cost; Because comprise flexible polyether segment in this solidifying agent, so need not to add other toughner, cured article toughness is very good, even still can keep suitable toughness under very low temperature; The adding of aromatic amine has then improved the intensity of molecular chain, has improved the room temperature and the high temperature bonding performance of tackiness agent greatly; Also added coupling agent and ultra-fine filling material in addition, under the enough flexible conditions of maintenance, low-temperature performance has also been remained on the quite high level, and significantly improved room temperature and high temperature bonding performance.Adopt this mixing cured system to overcome the influence of condensation vapor that polyamide curing agent wet-hot aging performance difference and alternating hot and cold bring to adhesiveproperties; Preparation technology is simple for this solidifying agent, and its state is liquid, and viscosity is low, and working life is long, and is simple with the Resins, epoxy hybrid technique, but thorough mixing is even, and consistency is good, makes the preparation of tackiness agent and uses more convenient.
Resins, epoxy ultra-low temperature glue stick of the present invention contains Resins, epoxy, solidifying agent, filler and additive.
The used Resins, epoxy of the present invention is selected from one or more in tetraglycidel ether epoxy resin or the glycidyl amine type epoxy resin, and its oxirane value is 0.2～1.5, is preferably 0.25～1.4, and more preferably 0.3～1.3, be preferably 0.4～1.2.Wherein used tetraglycidel ether epoxy resin can be bisphenol A epoxide resin, bisphenol F epoxy resin and bisphenol-s epoxy resin etc., can contain 2-4 epoxide group in the used glycidyl amine type epoxy resin in each molecule, can be 4,4 '-diaminodiphenylmethane Resins, epoxy, p-aminophenol Resins, epoxy etc.In the present invention, this two based epoxy resin all can use separately, also can mix use by multiple Resins, epoxy.In addition, because the fracture toughness property of Resins, epoxy under very low temperature is by the stress relaxation of crack tip and common decision of intensity of molecular chain.The cross-linking density height of the cured article of polyfunctionality glycidyl amine type epoxy resin helps the raising of molecular chain intensity and resistance toheat, but can reduce the snappiness of resin.We have designed again by this two based epoxy resin and have mixed the mixed type Resins, epoxy that obtains thus, utilize glycidyl amine type epoxy resin to bear external load, stress concentration is then relaxed by linear pattern bisphenol type tetraglycidel ether epoxy resin and other soft segment.
Mixing polyamine curing agent provided by the invention is made up of polyetheramine and aromatic amine.
Used polyetheramine molecular weight is 100～5000, is preferably 120～4500, more preferably 150～3500, be preferably 200～3000, polyetheramine content can be 10～90% of solidifying agent gross weight, is preferably 15～85%, more preferably 20～80%, be preferably 25～75%.Contain 1～10 amido in each molecule, be preferably 1～8, more preferably 1～6, be preferably 1～4, the reactive hydrogen number is 2～20, is preferably 2～16, more preferably 2～12, is preferably 2～8.Be selected from oxygen ethylene diamine, polyethyleneoxide diamine, polyoxyethylene triamine, oxypropylene diamines, polypropyleneoxide diamine, polyoxypropylene triamine, oxygen butylene diamines, polyoxy butylene diamines, polyoxy butylene triamine, 1,2-dimethyl oxygen ethylene diamine, poly-(1,2-dimethyl oxygen ethylene diamine), poly-(1, and their mixture 2-dimethyl oxygen ethene triamine).
Contain 1～6 amido in each molecule of used aromatic amine, be preferably 1～5, be preferably 1～4, wherein have at least an amido directly not link to each other with aromatic group, the reactive hydrogen number is 1～12, is preferably 2～10, is preferably 2～8.The content of aromatic amine is the 10-90% of solidifying agent gross weight, is preferably 15～85%, more preferably 20～80%, be preferably 25～75%.Used aromatic amine is selected from: m-xylene diamine, p dimethylamine, O-phthalic amine, a benzene Trimethylamine 99, a benzene diethylamine, to benzene diethylamine, adjacent benzene diethylamine, 4,4 '-diamines methyl diphenyl, 3,3 '-diamines methyl diphenyl, 3,3 ', 5,5,-tetramine methyl diphenyl and based on the affixture and the condenses of above-mentioned aromatic amine, and their mixture.
Curing agent content in the adhesive system can be with 10～100% of used weight epoxy, is preferably 12～90%, and more preferably 15～85%, be preferably 17～80%.
Filler provided by the invention can be aluminium powder, zinc powder, silicon dioxide powder, aluminum oxide powder, oxide powder and zinc, glass fibre, synthon, ceramic whisker etc., and their arbitrary combination.In adhesive system, the consumption of filler is the 0-150% of used weight epoxy, is preferably 0-140%, and more preferably 0-130% is preferably 0-110%.
Additive provided by the invention is a silane coupling agent, and its close organic group can be alkylamino, alkyl epoxy base, alkyl sulfide alcohol radical, vinyl and metacryloxy etc., and close inorganic group is-Si-(OR)
3Wherein (OR)
3Can be alkoxyl group, acetoxyl group etc.Described silane coupling agent specifically can be: r-aminopropyl triethoxysilane, r-glycidyl ether propyl trimethoxy silicane, anilino methylene triethoxyl silane, r-(diethyl triamine) propyl-triethoxysilicane etc.Be selected from r-aminopropyl triethoxysilane, r-glycidyl ether propyl trimethoxy silicane etc. especially.In adhesive system, the consumption of additive is the 1-5% of used weight epoxy, is preferably 1-4.5%, and more preferably 1-4% is preferably 1-3%.
Embodiment
One, used raw material has:
Title trade mark manufacturer
1. polypropyleneoxide diamine JEFFAMINE D-230 Texaco company (molecular weight 230)
JEFFAMINE D-400 Texaco company (molecular weight 400)
JEFFAMNE D-2000 Texaco company (molecular weight 2000)
2. polyoxypropylene triamine JEFFAMINE T-403 Texaco company (molecular weight 403)
3. ask benzene dimethylamine (m-XDA) Changsha chemical research institute
4. amine 105 solidifying agent that the contract amine 105 Changsha chemical research institutes (amine value 500-600) of contracting
5. bisphenol A epoxide resin Epon828 SHELL company
6. bisphenol F epoxy resin 830 Wuxi Di Aisheng epoxy company limiteds
7.4,4 '-diaminodiphenylmethane Resins, epoxy AG-80 Shanghai synthetic resins institute
8.r-coupling agent factory is won in Shen, glycidyl ether propyl trimethoxy silicane KH-560 Beijing
9.r-chemical plant, aminopropyl triethoxysilane KH-550 Gaizhou City
10. aluminium powder FLQT2/FLQT3/FLQT4 Angang Industrial Fine Aluminium Powder Co., Ltd.
11. the bright grand super finely ground slag in silicon dioxide powder MG-12 Huzhou company limited
Two, the general operation step of embodiment
Take by weighing Resins, epoxy, fully stirring mixes it, adds filler, stirs, and makes component one.
Accurately take by weighing a certain amount of polyetheramine solidifying agent, aromatic amine curing agent and additive, fully mix, make mixed curing agent component two.
Before the use, component one and component two are mixed in proportion, fully stir and it was mixed in 5 minutes, can use after the standing and defoaming.
Condition of cure: 40 ℃ added in 8 hours 60 ℃ 16 hours.
Embodiment
With the LY12-CZ duralumin is by sticking material, prepares sample by GB GB 7124-86, the test lap shear strength; Prepare sample by GB GB/T 7122-1996, test tackiness agent stripping strength.
Because the ultra-low temperature glue stick often will bear quenching or shock heating when reality is used, can more real reaction practical situations for making tackiness agent, tested its anti--196 ℃～80 ℃ thermal shock performance.Tackiness agent is pressed GB 7124-86 preparation overlap joint sample, completion of cure.Sample is placed 80 ℃ of thermostat containers, kept 20 minutes, take out rapidly, immediately it is immersed in the liquid nitrogen fully, kept 20 minutes, take out, put into thermostat container fast, be once circulation.After carrying out 150 circulations, the test bonding strength.
Each embodiment adhesive raw materials component and the mechanical property parameters that records are respectively shown in table one and table two:
Table one, each embodiment feed composition
Continuous table one, each embodiment adhesive raw materials component
Table two, each embodiment mechanical property
Comparative examples
The adhesiveproperties data of the low temperature adhesive of other the domestic and international better performances that below is us by document inquiry gained, the domestic trade mark has DW-3, NHJ-44, HY-912,672 ultra-low temperature glues, H01 low temperature glue [plum east; The adhesive applications technical manual; Shanghai scientific and technical literature press; 1994, p636-638], the external trade mark has two kind tackiness agent EA9394s, the FM-300[David C.Goeders and John L.Perry of U.S. X-33 plan liquid hydrogen storage tank with recommendation, Adhesive bondingPEEK/IM-6 composite cryogenic applications, 36th International SAMPE Symposium, April 15-18 1991, p348-36] etc., performance data is listed in table three.
DW-3 glue is after 100 ℃ of curing, and maximum operation (service) temperature only is 60 ℃, and HY-912 bonding strength in the time of 50 ℃ is following
Table three, comparative examples mechanical property
Annotate: go up in the table a. test after-196 ℃～room temperature circulation 120 times
B.-269 ℃ of tests after-269 ℃～room temperature circulation 150 times
Reduce to 4.61Mpa; 672 and the H01 tackiness agent need be 150 ℃ of temperature-curable, and NHJ-44 glue more need be under 170 ℃ high temperature cure under pressure, and contain polymeric amide in the tackiness agent, reduced its wet-hot aging performance; H-006 glue is because the resin (trimesic acid three-glycidyl ester) that adopts is a solid, and preparation technology is quite complicated, and this resin price costliness, and it is relatively poor that the existence of ester bond makes water tolerance, acid resistance and the alkali resistance of tackiness agent in addition; And external EA-9394 and FM-300 over-all properties are better, but bonding strength is relatively low.In addition, the at present most no peel strength data of existing domestic report ultra-low temperature glue does not all have cold-resistant thermal shock resistance properties data except that EA9394, FM300 and H-006.
Tackiness agent of the present invention is compared with existing tackiness agent, and-269 ℃ and-196 ℃ of following bonding strengths reach as high as 32.8Mpa all above existing tackiness agent in the time of-269 ℃.The room temperature bonding strength is then all high than other tackiness agent except that NHJ-44, and 140 ℃ of bonding strengths reach as high as 20.4Mpa, than existing tackiness agent height (H-01 and H-006 are because 200 ℃ of tests down, so can't compare).And cold-resistant thermal shock strength, other tackiness agent does not all have cold-resistant thermal shock resistance properties data except that EA9394, FM300 and H-006, compares with these three kinds of tackiness agent, and tackiness agent of the present invention also has remarkable advantages; For stripping strength, to compare with the EA9394 tackiness agent (875N/m) that the data report is arranged, tackiness agent observed value of the present invention is higher, still can reach 1200N/m (embodiment 2,5) under the situation that keeps higher high temperature strength.
Though the present invention is described in detail with reference to technology contents and embodiment, but should describe only for purposes of illustration, to those skilled in the art, it all is conspicuous under the situation that does not deviate from scope of the present invention the present invention being carried out various variations and changes, and can not be defined as the described content of specification sheets to the present invention.
Claims (8)
1, a kind of curing agent for epoxy resin is characterized in that: contain polyetheramine and aromatic amine in this solidifying agent, contain 1-6 amido in each molecule of described aromatic amine, wherein have at least an amido directly not link to each other with aromatic group, the reactive hydrogen number is 1-12.
2, solidifying agent as claimed in claim 1 is characterized in that: the content of described polyetheramine is 10～90%, and the content of aromatic amine is 10～90%, based on the gross weight of solidifying agent.
3, solidifying agent as claimed in claim 1 or 2 is characterized in that: its contained polyether segment of described polyetheramine is aliphatic ether or aromatic oxide, contains 1～10 amido in each molecule, and the reactive hydrogen number is 2～20.
4, as each described solidifying agent in the claim 1～2, it is characterized in that: described polyetheramine solidifying agent molecular weight is 100～5000, be selected from oxygen ethylene diamine, polyethyleneoxide diamine, polyoxyethylene triamine, oxypropylene diamines, polypropyleneoxide diamine, polyoxypropylene triamine, oxygen butylene diamines, polyoxy butylene diamines, polyoxy butylene triamine, 1,2-dimethyl oxygen ethylene diamine, poly-(1,2-dimethyl oxygen ethylene diamine), poly-(1, and their mixture 2-dimethyl oxygen ethene triamine).
5, solidifying agent as claimed in claim 1, it is characterized in that: described aromatic amine is selected from: m-xylene diamine, p dimethylamine, O-phthalic amine, a benzene Trimethylamine 99, a benzene diethylamine, to benzene diethylamine, adjacent benzene diethylamine, 4,4 '-diamines methyl diphenyl, 3,3 '-diamines methyl diphenyl, 3,3 ', 5,5 '-tetramine methyl diphenyl, with affixture and condenses based on above-mentioned aromatic amine, and their mixture.
6, a kind of epoxyn is characterized in that, wherein contains 100 parts Resins, epoxy, each solidifying agent in 10～100 parts of claims 1～5, and 0～150 part filler, 1～5 part silane coupling agent, each component concentration is by weight.
7, tackiness agent as claimed in claim 6 is characterized in that: described Resins, epoxy is to be selected from Racemic glycidol ether type epoxy and glycidyl amine type epoxy resin, or its mixture.
8, tackiness agent as claimed in claim 6 is characterized in that: described filler is selected from aluminium powder, zinc powder, silicon dioxide powder aluminum oxide powder, oxide powder and zinc, glass fibre, synthon, ceramic whisker, and their mixture.
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| Publication number | Priority date | Publication date | Assignee | Title |
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