CN1258189A - Method for attaching electric conductor to substrate - Google Patents
Method for attaching electric conductor to substrate Download PDFInfo
- Publication number
- CN1258189A CN1258189A CN 98126051 CN98126051A CN1258189A CN 1258189 A CN1258189 A CN 1258189A CN 98126051 CN98126051 CN 98126051 CN 98126051 A CN98126051 A CN 98126051A CN 1258189 A CN1258189 A CN 1258189A
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- CN
- China
- Prior art keywords
- substrate
- electric conductor
- attaches
- regularly arranged
- die
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A method for attaching electric conductor to substrate includes such steps as putting a screen mould on the substrate with multiple connecting points arranged regularly, pouring electric conducting liquid into the mould, scraping the screen mould to uniformly penetrate the liquid into substrate and form cylindrical conducting system, heating to make the cylindrical points become ball ones, and cooling.
Description
The present invention relates to a kind of integrated circuit packaging method, be specially a kind of electric conductor and attach to method on the substrate, refer to that especially attached spherical contact is in spherical lattice array (BGA, BallGridArray) method of ic substrate.
The formation system of the contact (pin) on early stage this spherical lattice array substrate puts completed tin ball on a plurality of regularly arranged contact of this spherical lattice array substrate one by one by machine, makes it form a complete spherical shape array base palte.
The above practice is very time-consuming, must go ahead of the rest and finish spherical shape electric conductor one by one, this electric conductor is attached on this substrate again; And this practice also very consumes manpower, and required cost is also higher, and is hereat very uneconomical.
The object of the invention is to overcome the deficiencies in the prior art, and a kind of perfect method is provided, and the formation of tin ball can be put one by one, in the mode of a patrix, make the formation of tin ball more quick, and cost is more cheap, and commercial value is higher.
The objective of the invention is to be achieved through the following technical solutions:
A kind of electric conductor that makes attaches to method on the substrate, the a plurality of regularly arranged contacts of this substrate cording, system is printed on a conducting liquid on these a plurality of regularly arranged contacts, after making this conducting liquid cooling, tightly invest on these a plurality of regularly arranged contacts with definite shape, it comprises the following step:
This die is placed on these a plurality of regularly arranged contacts; This conducting liquid to this die, is utilized scraper plate to sweep on this die again and scrapes, conducting liquid is infiltrated into respect on these a plurality of regularly arranged contacts from this die equilibrium; And heat this substrate, make the cooling of this conducting liquid after, tightly invest on these a plurality of regularly arranged contacts with this shape.
The preferably, this substrate means the substrate of a plurality of regularly arranged contacts.And the substrate of a plurality of regularly arranged contacts is integrated circuit (IC) substrate of spherical lattice array (BGA).Wherein a plurality of regularly arranged contacts mean spherical lattice array.
The preferably, this conducting liquid comprises tin, also comprises lead, and the ratio of tin lead is 63/37.
The preferably, this die then means the die with respect to the substrate of spherical lattice array.This die with respect to the substrate of spherical lattice array comprises a plurality of regularly arranged spherical shape holes.
The preferably, wherein this scraper plate system is used to scrape the conducting liquid on this die, makes on this conducting liquid is able to from the hole balanced flow on this die to corresponding this substrate.
The preferably, so-called infiltration means is inverted this conducting liquid on this die, make this conducting liquid via a plurality of regularly arranged spherical shape hole on this die flow to respect to this substrate on.
The preferably, heating means that this substrate must make this shape must be in tightly investing on these a plurality of regularly arranged contacts via the heating reflow.
The preferably, this shape bitt shape shape; Wherein this column shape is the electric conductor that begins to take shape and attach on this substrate.This column shape electric conductor that begins to take shape and attach on the substrate must make its column deformation become spherical shape via heating.
The present invention adopts technique scheme, and the formation of tin ball can be put one by one, in the mode of a patrix, need not divide by several steps, once finishes, thereby makes the formation of tin ball more quick, and required cost is low, and is also more time saving and energy saving.
The embodiment that provides below in conjunction with accompanying drawing and accompanying drawing is described in further detail the present invention:
Fig. 1 makes schematic diagram for the electric conductor of preferred embodiment of the present invention.
Fig. 2 is the electric conductor shape figure of preferred embodiment of the present invention.
See also Fig. 1, the present invention is a kind of method that makes conducting liquid attach to a substrate 1, system is positioned over a die 2 on the contact 51 with respect to this spherical lattice array substrate 1, again a conducting liquid 3 is inverted on this die 2, and utilize scraper plate 4 on this die, to sweep and scrape, make the conducting liquid must be to the relative spherical lattice array substrate 1 in the spherical shape hole of a plurality of rules from this die 25 balanced flow.Form column shape electric conductor 6, and depend on the substrate 1 that is connected to this spherical lattice array.
See also Fig. 2, begin to take shape and attach to the column shape electric conductor 6 on this substrate, must it be become via the heating reflow be a spherical shape electric conductor 7.
Aforesaid substrate means the substrate of a plurality of regularly arranged contacts, and these a plurality of regularly arranged contacts are spherical shape, the preferably, and the substrate of a plurality of regularly arranged contacts is the ic substrate of spherical shape array (BGA).
By above-mentioned diagram and explanation, we can draw to draw a conclusion:
One, its required cost of the method that the present invention implemented is low;
Two, the method that the present invention implemented is also more time saving and energy saving;
Three, the present invention executes real method and had once both finished, and need not divide to be made by several steps side and finish.
Claims (16)
1. one kind makes electric conductor attach to method on the substrate, it is characterized in that:
The a plurality of regularly arranged contacts of this substrate tool are that a conducting liquid is printed on these a plurality of regularly arranged contacts, make the cooling of this conducting liquid after, tightly invest on these a plurality of regularly arranged contacts with definite shape, it comprises the following step:
One die is placed on these a plurality of regularly arranged contacts of this substrate;
With this conducting liquid to this die;
Utilize scraper plate on this die, to sweep and scrape, conducting liquid is infiltrated into respect on these a plurality of regularly arranged contacts from this die; And
Heat this substrate, make the cooling of this conducting liquid after, tightly invest on these a plurality of regularly arranged contacts with this shape.
2. the electric conductor that makes as claimed in claim 1 attaches to method on the substrate, and it is characterized in that: this substrate is the substrate of a plurality of regularly arranged contacts, the substrate of a spherical lattice array or the ic substrate of a spherical lattice array.
3. the electric conductor that makes as claimed in claim 1 attaches to method on the substrate, and it is characterized in that: these a plurality of regularly arranged contacts mean the contact of spherical lattice array.
4. the electric conductor that makes as claimed in claim 1 attaches to method on the substrate, and it is characterized in that: this conducting liquid comprises a tin.
5. the electric conductor that makes as claimed in claim 4 attaches to method on the substrate, and it is characterized in that: this conductive liquid also comprises a lead.
6. the electric conductor that makes as claimed in claim 5 attaches to method on the substrate, and it is characterized in that: this tin lead ratio is 63 to 37.
7. the electric conductor that makes as claimed in claim 1 attaches to method on the substrate, it is characterized in that: a plurality of holes of cording on this die.
8. the electric conductor that makes as claimed in claim 7 attaches to method on the substrate, it is characterized in that: this a plurality of holes system is with respect to a plurality of regularly arranged contacts on this substrate.
9. the electric conductor that makes as claimed in claim 7 attaches to method on the substrate, and it is characterized in that: these a plurality of holes are regularly arranged person, and are the designer in response to a plurality of regularly arranged contacts on this substrate.
10. the electric conductor that makes as claimed in claim 1 attaches to method on the substrate, it is characterized in that: this scraper plate system is used to sweep the conducting liquid of scraping on this die, and this conducting liquid is able to from this die balanced flow to the position with respect to this substrate.
11. the electric conductor that makes as claimed in claim 10 attaches to method on the substrate, it is characterized in that: these a plurality of holes of die cording, so that this conducting liquid is able to balanced flow to the position with respect to this substrate.
12. the electric conductor that makes as claimed in claim 1 attaches to method on the substrate, it is characterized in that: infiltration is meant is inverted this conducting liquid on this die, makes this conducting liquid flow to position relative on this substrate via this die.
13. the electric conductor that makes as claimed in claim 12 attaches to method on the substrate, it is characterized in that: a plurality of regularly arranged holes of this die cording, so that this flow of conductive liquid is as for position relative on this substrate.
14. the electric conductor that makes as claimed in claim 1 attaches to method on the substrate, it is characterized in that: this heated substrates is meant this substrate heating reflow, makes this shape must be in tightly investing on these a plurality of regularly arranged contacts, and this shape bitt shape shape.
15. the electric conductor that makes as claimed in claim 1 attaches to method on the substrate, it is characterized in that: this shape means column shape.
16. the electric conductor that makes as claimed in claim 15 attaches to method on the substrate, it is characterized in that: this column shape is the electric conductor that begins to take shape and attach on the substrate, must its column shape electric conductor be become via heating to be spherical shape electric conductor and this begins to take shape and attach to column shape electric conductor on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98126051 CN1258189A (en) | 1998-12-22 | 1998-12-22 | Method for attaching electric conductor to substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98126051 CN1258189A (en) | 1998-12-22 | 1998-12-22 | Method for attaching electric conductor to substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1258189A true CN1258189A (en) | 2000-06-28 |
Family
ID=5229455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98126051 Pending CN1258189A (en) | 1998-12-22 | 1998-12-22 | Method for attaching electric conductor to substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1258189A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6784598B2 (en) | 2001-04-25 | 2004-08-31 | Murata Manufacturing Co., Ltd. | Electronic component and method for forming substrate electrode of the same |
| CN104733887A (en) * | 2013-12-20 | 2015-06-24 | 爱信精机株式会社 | Electric connection structure of electronic component |
-
1998
- 1998-12-22 CN CN 98126051 patent/CN1258189A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6784598B2 (en) | 2001-04-25 | 2004-08-31 | Murata Manufacturing Co., Ltd. | Electronic component and method for forming substrate electrode of the same |
| CN104733887A (en) * | 2013-12-20 | 2015-06-24 | 爱信精机株式会社 | Electric connection structure of electronic component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |