CN1255273C - Three-layer structure wooden composite board material and mfg method - Google Patents

Three-layer structure wooden composite board material and mfg method Download PDF

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Publication number
CN1255273C
CN1255273C CN 02134156 CN02134156A CN1255273C CN 1255273 C CN1255273 C CN 1255273C CN 02134156 CN02134156 CN 02134156 CN 02134156 A CN02134156 A CN 02134156A CN 1255273 C CN1255273 C CN 1255273C
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China
Prior art keywords
layer
board material
surface layer
composite board
core layer
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Expired - Fee Related
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CN 02134156
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Chinese (zh)
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CN1502464A (en
Inventor
杜官本
杜依泓
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Forest College Of Southwest China
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Individual
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Priority to CN 02134156 priority Critical patent/CN1255273C/en
Publication of CN1502464A publication Critical patent/CN1502464A/en
Application granted granted Critical
Publication of CN1255273C publication Critical patent/CN1255273C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The present invention relates to a three-layer structure wood composite board material and a manufacture method thereof, which belongs to the technical field of architectural decoration. The composite board material is composed of a surface layer and a core layer, and a core layer material formed from a tabular structure unit uses wood, bamboo and crop stalks. The size of the tabular structure unit is that length is 45 to 110mm, width is 10 to 50mm, and thickness is 0.1 to 1mm. The thickness of the core layer occupies 21 to 91% of the board material, and a surface layer material is formed from fiber or a particulate structure unit. The material is made through process steps of material preparation, spreading forming, prepressing, hot pressing, etc. The adhesive used in the core layer belongs to an isocyanate class, and a spreading forming process step is that the surface layer, the core layer and an upper surface layer are orderly spread, and a lower surface layer and the upper surface layer are symmetrical. Compared with the prior art, the present invention has the advantages that a board surface has good quality, the environmental protection performance of a product is high, rupture intensity and nail-holding ability are both higher, etc. The board material can be widely used for architectural decoration and high-grade furniture manufacture and meanwhile can be used for the fields of packaging and construction shuttering.

Description

Three-layer structure wooden composite board material and manufacture method thereof
Technical field:
The present invention relates to a kind of three-layer structure wooden composite board material and manufacture method thereof, belong to the building decoration technology field.
Background technology:
Existing particieboard and medium density fibre board (MDF) etc. are the single structure unit, use formaldehyde series plastics adhesive, therefore, in use the subject matter of Cun Zaiing is: formaldehyde discharges inevitable, shortcomings such as the sheet material nail-holding ability is lower, and sheet material MOR and bearing capacity are all lower.
Summary of the invention:
The objective of the invention is to overcome the deficiency of prior art, and provide a kind of three-layer structure wooden compound plate material to close and manufacture method.
The present invention is achieved in that
This three-layer structure wooden composite board material is made up of top layer and sandwich layer.Wherein, select wood shavings for use by the core material that the flat construction unit constitutes, this flat construction unit is of a size of long 45-110mm, wide 10-50mm, thickness 0.1-1mm, and the thickness of sandwich layer accounts for the 21-91% of sheet material. The material on top layer adopts the filamentary structure unit to constitute, and fiber comprises the mixing object of string (as lumber fibre, bagasse fibre, falx straw fiber, cotton rod fibers, purple stem pool etc.), chemical fibre (as polyester fiber), glass fibre and above-mentioned fiber composite fibre.
The manufacture method of this three-layer structure wooden composite board material, operations such as moulding, precompressed, hot pressing are formed by getting the raw materials ready, mating formation.
Wherein, the used adhesive of sandwich layer is isocyanates (pure isocyanates and the mixture that contains isocyanates); The molding procedure of mating formation is pressed top layer, sandwich layer, upper epidermis and is mated formation following top layer and upper epidermis symmetry in proper order.
The present invention compared with prior art, it is good to have plate face quality, product environmental-protecting performance height, MOR and nail-holding ability are all than advantages such as height, this sheet material can be widely used in building decoration and top-grade furniture manufacturing, also can be used for simultaneously packing and building template field.
The specific embodiment:
Example one: the pinus yunnanensis of at first getting age of tree 8-10 carries out wood shavings and fiber production respectively.The wood shavings of sandwich layer obtain by the method for chipping.The long 45mm of wood shavings, wide 10mm, thickness 0.1mm.Particle drying is to moisture content 8% after dryer sizing (MDI), resin added 6%.Paraffin waterproof applied amount is 1%.The fiber production on top layer adopts the routine techniques preparation.Fiber applies urea-formaldehyde resin adhesive, and applied amount is 1%, is dried to moisture content 10% then.Mat formation by the order on lower floor, sandwich layer, upper strata then.
Hot-forming under the routine operation condition at last.The thickness of the sandwich layer of the three-layer structure wooden composite board material after the moulding accounts for 21% of sheet material.
Example two: substantially with example one.Difference is: the long 70mm of the wood shavings of sandwich layer, wide 30mm, thickness 0.5mm, the thickness of the sandwich layer of the three-layer structure wooden composite board material after the shaping accounts for 61% of sheet material.Polyester fiber is adopted on the top layer, and used adhesive is MDI.
Example three: substantially with example one.Difference is: the long 110mm of the wood shavings of sandwich layer, wide 50mm, thickness 1mm, the thickness of the sandwich layer of the three-layer structure wooden composite board material after the shaping accounts for 91% of sheet material.The mixture that includes string and glass fibre is adopted on the top layer, and its component ratio is 6: 3: 1, and used adhesive is MDI.

Claims (2)

1, a kind of three-layer structure wooden composite board material, form by top layer and sandwich layer, it is characterized in that selecting wood shavings for use by the core material that the flat construction unit constitutes, this flat construction unit is of a size of long 45-110mm, wide 10-50mm, thickness 0.1-1mm, and the thickness of sandwich layer accounts for the 21-91% of sheet material; Skin-material is selected the mixture of string, chemical fibre, glass fibre or above-mentioned fiber for use.
2, the manufacture method of the described three-layer structure wooden composite board material of claim 1 is made up of the moulding of getting the raw materials ready, mat formation, precompressed, hot pressing process, it is characterized in that the used adhesive of sandwich layer is an isocyanates; The molding procedure of mating formation is pressed top layer, sandwich layer, upper epidermis and is mated formation following top layer and upper epidermis symmetry in proper order.
CN 02134156 2002-11-20 2002-11-20 Three-layer structure wooden composite board material and mfg method Expired - Fee Related CN1255273C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 02134156 CN1255273C (en) 2002-11-20 2002-11-20 Three-layer structure wooden composite board material and mfg method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 02134156 CN1255273C (en) 2002-11-20 2002-11-20 Three-layer structure wooden composite board material and mfg method

Publications (2)

Publication Number Publication Date
CN1502464A CN1502464A (en) 2004-06-09
CN1255273C true CN1255273C (en) 2006-05-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 02134156 Expired - Fee Related CN1255273C (en) 2002-11-20 2002-11-20 Three-layer structure wooden composite board material and mfg method

Country Status (1)

Country Link
CN (1) CN1255273C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4212298A1 (en) 2022-01-15 2023-07-19 Covestro Deutschland AG A process for preparing a wood-based panel

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1319707C (en) * 2005-03-23 2007-06-06 南京林业大学 Bamboo reinforced plywood
CN100339196C (en) * 2005-03-23 2007-09-26 南京林业大学 Thin shell structure reinforced type artificial board
JP2013159095A (en) * 2012-02-08 2013-08-19 Panasonic Corp Particle board
CN104227819B (en) * 2014-08-15 2016-05-18 东营正和木业有限公司 The preparation method of reed fiber particieboard

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4212298A1 (en) 2022-01-15 2023-07-19 Covestro Deutschland AG A process for preparing a wood-based panel

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Publication number Publication date
CN1502464A (en) 2004-06-09

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: XI NAN COLLEGE OF FORESTRY

Free format text: FORMER OWNER: DU GUANBEN

Effective date: 20091211

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20091211

Address after: Bailong temple, Panlong District, Yunnan, Kunming

Patentee after: Forest College of Southwest China

Address before: School of wood science, Southwest Forestry University, Yunnan, Kunming

Patentee before: Du Guanben

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060510

Termination date: 20101120