CN1250720A - Formation of single nozzle plate, and method for connecting same onto printing head - Google Patents

Abstract

The present invention discloses a method for manufacturing nozzle plate of ink jet printing head by using composite strip containing nozzle layer and adhesive layer. It is characterized by that before the flowing component is ablated in said composite strip by using laser, a layer of polymer sacrifical layer is applied on said adhesvie layer. Said invention also provides a method for improving adhesive effect between adhesive layer and acrificial layer. Once the composite strip containing sacrificial layer is prepared, the composite strip is ablated by using laser so as to form flowing component in said composite strip, and form the above-mentioned nozzle plate. After the above-mentioned flowing component is formed, the sacrificial layer is removed, and said nozzle plate is cut by means of laser so as to separate individual ink jet printing head nozzle plate from said composite strip.

Description

Form the single-nozzle plate and nozzle plate is connected to method on the printhead

The application is the application that continues of the U.S. Patent application No.08/519906 of application on August 28 nineteen ninety-five, " a kind of method that forms the nozzle plate of inkjet printhead structure " by name.

The present invention relates to ink jet-print head, specifically, relate to and a kind ofly form the single-nozzle plate and nozzle plate is connected to method on the printhead.

The printhead of ink-jet printer is accurately to make, so that each parts can match with the black chamber of integral body, reaches required print quality.But when the printing ink in the black chamber exhausts, this printhead that comprises black chamber will be removed.Although therefore require required accuracy, each parts of complete machine are more cheap relatively, always print cost and also can compete with other print form on market so considered the single page of machine life.

Usually, printing ink, the material that is used for making black chamber and printhead are not the most expensive parts of complete machine manufacturing cost.Bothersome step is to make printing head assembly self.Every page at the ink-jet printer that reduces the use entire print head is printed as the production cost that printhead is the most effectively tried every possible means to reduce in this aspect.

A kind of method that reduces the production cost of printhead is to use supermatic production technology.This has saved the cost of each operation of technical staff's manually-operated of employing high-tech.Another important way that reduces cost is the total output that improves in the automated production.Improve the percentage of the printhead of output, by production cost being shared the price that reduces single printhead on the more sale single-piece.Can improve output owing to reduce to produce the required operation of parts, produce the required operation of printhead, or to replace the operation of complexity, low yield with operation simple, high yield be very favourable so reduce.

Hot ink-jet print head generally comprises 3, is less than 5 critical pieces usually, (1) substrate that comprises the resistive element of the component that is used for heating printing ink, mobile parts/the nozzle layer or the nozzle plate of (2) integral body, in order to the activity of guiding heating printing ink, (3) one make printing ink flow to flow channel layer on the resistive element.These separate parts that must cooperatively interact in printing step are included in two critical pieces, are installed in together before these two portions are attached to use.

The nozzle plate of ink jet-print head is to be made by the polymeric material membrane of making reel.Along with film launches from reel, will carry out semi-continuous processing to nozzle plate.A pith of this processing is that single nozzle plate is removed from film, so that this plate is fixed on the surface of a semiconductor chip, to be installed in the ink jet-print head.Importantly will finish this and remove operation, and the architecture quality of final printhead should be enough to finish the image that high-quality is printed with a kind of mode of saving cost.

Past, use excite state atomic laser ablation mobile parts and nozzle bore in polymeric material, forming nozzle plate, and with mechanical processing method cutting nozzles plate from polymeric material.Mechanical stamping is relatively cheap, but can not form additional parts on nozzle plate, needs with the bonding force between this parts raising nozzle plate and the semiconductor substrate, and nozzle plate wherein is fixed on this semiconductor substrate.Mechanical stamping also can generate a large amount of chips, and this chip will disturb the operate as normal of nozzle plate.The known mechanical punching press is serious wear on the corner, therefore can not guarantee strict tolerance in required time length, and it is high to cause maintenance to require, poor product quality.

Usually use adhesive to be connected to from the nozzle plate that film downcuts on the printhead, form an overall structure.If before parts are made, just adhesive is coated on nozzle plate or the printhead, then can leaves the chip that in various manufacturing processes, generates in the adhesive phase.Common this chip difficulty is removed, and needs to add some treatment process at least and is removed, and this can improve the cost of printhead.And, if chip do not remove fully, then between substrate and the nozzle layer in conjunction with poor effect, the printhead cisco unity malfunction of formation or do not reach service life of expection.

If adhesive is coated on nozzle plate or the printhead again after in nozzle plate and printhead, forming described mobile parts, will take some operations more and be painted on the part that will be used as mating surface on the device, and will influence so that remove above-mentioned adhesive on the part of cisco unity malfunction at the adhesive that is subjected to of device to guarantee adhesive.Not only to increase the operation that these will improve the printhead cost, and the adhesive mistake is coated in the output reduction that will cause on the device in the printhead manufacture process.

For example, if adhesive is stayed the part of device, in the flow channel such as printing ink, then will destroy the normal function of flow channel, printhead has also been scrapped.If adhesive does not have the mating surface between the abundant cladding system, then device can separate, and causes printing ink to leak from the complete machine that assembles.These situations all can reduce output, as mentioned above, improve the cost of the printhead of output.

Therefore, an object of the present invention is to provide a kind of method of supermatic manufacturing ink jet-print head.

Another object of the present invention provides a kind of manufacture method of ink jet-print head, and this method does not need extra processing step calibration and removes adhesive.

Another object of the present invention provides a kind of method of making ink jet-print head,, this method is used the adhesive jockey, and can not produce and leave chip in this adhesive processing step afterwards.

Another object of the present invention provides a kind of method of removing nozzle plate from thin polymer film.

Another object of the present invention provides and a kind of the polymer nozzle plate is connected to method on the printhead.

Above-mentioned and other purpose is that the method by a kind of manufacturing nozzle plate of inkjet printhead of the present invention realizes.In the present invention, prepare one and comprise polymeric layer, preferably also comprise compound of adhesive phase, and this adhesive phase also scribbles a polymer sacrifice layer.Laser ablation should be through compound of coating, to form the mobile parts that comprises one or more nozzles, spray chamber and/or ink-feed channel in this compound.

In this laser ablation step, the slag of this compound generation of laser ablation and other chip stick on the sacrifice layer, rather than on the adhesive phase.The sacrifice layer that is used for protecting this adhesive phase in this laser ablation step is water-soluble material preferably; preferably polyvinyl alcohol constitutes; removing this material can pass through directly to this sacrifice layer injection water, till all basically sacrifice layers are all removed from this adhesive phase.Because this sacrifice layer is water miscible, the available simply technology of scrubbing is removed this layer, and after this layer is removed, the chip that adheres to thereon also will be removed.Like this, need not to adopt cleaning can make nozzle arrangements not have chip, this chip can cause structure or operational issue.And, before the laser ablation delivery nozzle, adhesive directly can be coated on the nozzle arrangements, thus simplified manufacturing technique.

Also provide a kind of and cut apart with laser instrument, to small part cut apart nozzle plate all the layer, then remove sacrifice layer so that from polymeric material membrane, cut out the method for nozzle plate of inkjet printhead.Form single nozzle plate, and after nozzle plate separated from polymeric material, be fixed on the semiconductor substrate of an ink jet-print head.

In conjunction with the accompanying drawings, describe in detail after the preferred embodiment, other purpose of the present invention and advantage will be clearer, and similar in the accompanying drawings label is represented similar element.

Fig. 1 is the vertical view of a not to scale (NTS), and expression is by compound the nozzle plate that has mobile parts that constitutes of polymeric material.

Fig. 2 is a schematic diagram, is illustrated in the manufacture method that forms mobile parts in the nozzle plate.

Fig. 3 is the sectional view of a not to scale (NTS), and expression forms compound of polymeric material of nozzle plate.

Fig. 4 is the sectional view of a not to scale (NTS), and expression comprises compound of polymeric material of a sacrifice layer.

Fig. 5 is the sectional side elevation of employed multistage baking oven in the method for the present invention.

Fig. 6 is the sectional view of a not to scale (NTS), after being illustrated in laser ablation and going out mobile parts, and compound the middle nozzle of polymeric material and the formation of spray chamber.

Fig. 7 is a vertical view, is illustrated in partly to cut apart a plurality of nozzle plates in the polymeric material membrane.

Fig. 8 is the sectional view of a not to scale (NTS), is illustrated in after the laser cutting nozzle plate formation of compound middle nozzle of polymeric material.

It is the sectional view of a not to scale (NTS) that Fig. 9 is one, is illustrated in to remove after the sacrifice layer compound of the polymeric material of making.

Now referring to accompanying drawing, Fig. 1 is the plane of seeing from semiconductor substrate one side of the parts 70 of nozzle plate 150, has showed the principal character of nozzle plate 150.Nozzle plate 150 is to comprise polyimides, polyester, polymethyl methacrylate by being selected from, polymer such as Merlon and homopolymers, copolymerization all and the polymeric material 10 of admixture one class of terpolymer and above-mentioned two or more materials make, preferably select polyimide polymer for use, nozzle plate 150 has enough thickness can hold spray chamber, to the ink-feed channel of spray chamber ink supply and the spray orifice that links to each other with spray chamber.The thickness range of polymeric material can be 10 to 300 microns, better at 15 to 250 microns, is preferably in 35 to 75 microns, and comprises all numerical value in the scope.

Make the material of nozzle plate 150 and can make continuous slice or polymeric material film, constitute a plurality of nozzle plates successively through continuous or semi-continuous technology.In order in production process, to be convenient to control the polymeric material 10 that transmits elongated strip with forward, sprocket hole or narrow slit 12 can be set on slice or film.

By the back operation of describing in detail is constituted nozzle plate at polymeric material 10 and the mobile parts that forms in the adhesive phase 24 arbitrarily, this mobile parts comprises that an acceptance infeeds the ink-feed channel 14 of black circulation road 16 from the printing ink of print cartridge (not shown) and with it.This China ink circulation road 16 is accepted to deliver on the resistive element (not shown) of air-chamber 18 belows from the printing ink of ink-feed channel 14 and with it, and this air-chamber 18 also is formed in polymeric material 10 and any adhesive phase 24.

When one or more resistive elements are switched on, a component gasification of printing ink generates bubble, and bubble applies mechanical energy to the part of printing ink, thereby printing ink is sprayed through nozzle plate 150 respective nozzle 20.The printing ink that leaves nozzle 20 impacts print media, constitutes character and images such as letter-numeral with predetermined form.

As shown in Figure 2, compound 26 of polymeric material 10 is contained on the reel 22, infeeds in the operation of making nozzle plate.Some manufacturers are as Ube (Ube) and the Delaware Wilmington E.I.Dupont de Nemours ﹠amp of Delaware Wilmington; Co. can supply the material that is suitable for making nozzle plate, trade mark is respectively UPILEX and KAPTON.Preferred composite 10 is polyimides bands that have adhesive phase 24 as shown in Figure 3.

But adhesive phase 24 preferably appoint can a kind of B rank jointing material, comprise some thermoplastic material.But the heat reactive resin as the B rank comprises phenolic resins, resorcin resin, urea resin, epoxy resin, ethylene urea resin, furane resins, polyurethane, silicones.The suitable thermoplastic or the hot melt material that can be used as adhesive comprise ethylene/acetic acid ethene polymers, ethylene/ethyl acrylate copolymer, polypropylene, poly-stupid ethene, polyamide, polyester, polyurethane, preferably polyimides.The thickness of adhesive phase 24 is about 1 to 100 micron, and preferred thickness is about 1 to 50 micron, preferably thick about 5 to 20 microns.In optimum implementation, adhesive phase 24 can be: as the phenol/butyral adhesive that uses among laminate product RFLEX R1100 or the RFLEX R1000, can buy from the Rogens of Chandler of Arizona.The cross-sectional structure of compound 26 of position polymeric material 10 of letter " A " sign and adhesive phase 24 as shown in Figure 3 in Fig. 2.

In order to prevent that adhesive layer is damaged in subsequent handling, as shown in Figure 4, with one deck sacrifice layer 28 temporary protection adhesive phases 24.This sacrifice layer 28 can be anyly to be applied as the polymeric material that thin layer, useable solvents are removed, and this solvent can not dissolved adhesive layer 24 or polymeric material 10.Preferred solvent is a water, and one of suitable water-soluble sacrificial layer 28 is a polyvinyl alcohol.The polyvinyl alcohol material that can be used as sacrifice layer comprises AIRVOL165, can buy from the Air Products Inc. of Pennsylvania Allentown, and EMS1146, can be from New Jersey, the Emulsitone Inc. of Whippany has bought, and also can buy various polyvinyl alcohol resins from Aldrich.Sacrifice layer 28 optimum thicknesses are at least about 1 micron, and the most handy routine techniques is coated on the adhesive phase 24.

Sacrifice layer 28 the method on the adhesive phase 24 of being coated to comprised compound 26 is immersed in the container that sacrificial layer material is housed; Sacrifice layer 28 is sprayed on compound 26; By sacrifice layer 28 being imprinted on the adhesive phase 24 such as intaglio printing or aniline printing technology; By reverse gravure sacrifice layer 28 is coated on the adhesive phase 24; Sacrifice layer 28 is spin-coated on the adhesive phase 24; Sacrifice layer is coated on the adhesive phase 24 by reverse coating or myer rod mode; Sacrifice layer 28 will be coated on the adhesive phase 24 by scraper or roller.

A kind of rolling method that sacrifice layer 28 is coated on compound 26 can use coating roll shown in Figure 2 34.At position B place, compound 26 cross sectional dimensions as shown in Figure 4.Adhesive phase 24 is arranged between polymeric material 10 and the sacrifice layer 28.

The present invention also provides a kind of sacrifice layer has been bonded to method on the adhesive phase 24.This method comprises that a formation has compound 26 operation of polymeric material 10 and adhesive phase 24.Locate at the A of this process point (Fig. 2), compound 26 is similar to shown in Figure 3.By sacrifice layer 28 is coated on the adhesive phase 24, sacrifice layer 28 can be coated on the adhesive phase 24.

The coating technology of many routines can not guarantee with sacrifice layer 28 equably, be coated on the adhesive phase 24 with having no the space.Because the existence of sacrifice layer plays an important role to removing chip 42, so the bond strength of sacrifice layer 28 and adhesive phase 24 should be enough to guarantee the initial stage at laser ablation composite polymeric material 70, layering significantly can not take place between adhesive phase 24 and the sacrifice layer 28.When the bond strength of sacrifice layer 28 is hanged down, lamination may appear.Have found that, after being coated to sacrifice layer 28 on compound, compound 26 is placed in the convection oven, cured about 30 minutes to about 60 minutes after carrying out under about 100 ℃ temperature, can improve the bonding strength of sacrifice layer 28 and adhesive phase 24 significantly at about 60 ℃.Another kind of alternative method is that the roller through heating is placed on compound 26 next door, cures coated compound 26.

As shown in Figure 5, curing compound 26 coated preferred version is to adopt a multistage baking oven 100.When curing in baking oven 100, compound 26 from reel 22, by conveyer 110 feed, by multistage baking oven 100.Each section of multistage baking oven 100, every section temperature and temperature range roughly are as shown in the table:

Segment number	Temperature ℃	Temperature range ℃
			????1	????30	????25-35
????2	????60	????45-65
			????3	????77	????75-85
????4	????95	????90-100
			????5	????105	????100-110

In preferred embodiments, 60 feet of these multistage baking oven 100 length, linear speed 15 feet per minute clocks, therefore, be 4 minutes total heat time heating time.Generally compound 26 is coated with and after it is rolled into composite reel 22 after curing.When using when curing coated compound 26 through the roller of heating rather than multistage baking oven 100, compound 26 is preferably in about 60 ℃ and cures under about 100 ℃ temperature.

The most handy laser is ablated into predetermined pattern with compound 26, thereby constitutes the mobile parts of the parts 70 of nozzle plate 150, all ink-feed channel 14, black circulation road 16, air-chamber 18 and nozzle bores 20 as shown in Figure 1.In polymeric material 10, form the laser beam 36 of mobile parts, can send such as F2, ArF, KrCl, KrF or XeCl excite state atom or frequency YAG laser instrument extraordinarily by laser instrument 38.Be the parts 70 that form nozzle plate shown in Figure 1 150, the used power of laser ablation mobile parts can be from about 100 milli Jiao/square centimeters to about 5000 milli Jiao/square centimeters, better scope is from about 150-1500 milli Jiao/square centimeter, preferably from about 700 milli Jiao/square centimeters to about 900 Jiao/square centimeters in the least, and comprise all numerical value in the scope.In laser ablation process, the employing wavelength to about 400nm, is preferably the laser beam of about 248nm rice from about 150nm, and the burst length that applies preferably continues about 20 nanoseconds from about 1 nanosecond to about 200 nanoseconds.

Laser beam 36 passes the laser pulse that mask 40 applies predetermined quantity, to form the particular flow parts of nozzle plate 150, wherein mask 40 is used at composite 26 mobile parts accurately being located, in composite 26, need therefrom to remove those parts of larger cross-section degree of depth material, as nozzle bore 20, may need the lot of energy pulse; And in composite 26, only need remove those parts of a part of material from composite 26 cross-sectional depth, and for example black circulation road 16 may only need less energy pulse, and this point will be described hereinafter.

The border of the mobile parts of nozzle plate 70 determined by mask 40, and this mask is by perforate, clear area and the translucent areas of laser beam by mask 40, and do not allow laser beam 36 touch in compound 26 zone corresponding to the solid or opaque section of mask 40.Allow laser beam 36 touch those parts of compound 26 in the mask 40, the shape of those parts that this pattern forms in composite 26 corresponding to hope by predetermined pattern setting.

Compound of laser ablation 26 o'clock, can generate slag and other chip 42.At least a portion chip 42 may be redeposited on compound 26.In the present invention, because compound 26 the superiors comprise sacrifice layer 28, chip 42 is fallen on the sacrifice layer 28 rather than on the adhesive phase 24.

If compound 26 does not have sacrifice layer 28, then chip 42 can drop on and/or be bonded on the adhesive phase 24.The chip that drops on and be bonded on the adhesive phase 24 is difficult to remove, and often needs complicated clearing process and/or generates waste product.The present invention not only can make chip 42 be easy to remove, and because waste product reduces the output that can also improve nozzle plate.

After compound 26 of laser ablation finished, the parts 70 of nozzle plate 150 at the shape of cross section at C place as shown in Figure 6, this sectional view is cut open from air-chamber 18 and nozzle bore 20 and is obtained.As shown in Figure 6, polymeric material 10 also comprises the adhesive phase 24 that is subjected to sacrifice layer 28 protections.Can see that chip 42 sticks on the exposed surface of sacrifice layer 28.The relative size of China ink circulation road 16, air-chamber 18 and nozzle 20 is shown among Fig. 6.

The present invention also provides a kind of method that increases the bonding strength between nozzle plate 150 and the silicon substrate (not shown).Shown in Fig. 7 and 8, this method comprises with laser instrument 76 (referring to Fig. 2) narrow slit 94 of ablating out, thereby four of nozzle plate 150

Form leg-of-mutton narrow slit 94 at least near two angles in the angle 90.This narrow slit 94 extends through each layer of compound 26.

In case shear 56 nozzle plate 150 that each is independent downcuts (Fig. 2) from compound 26, just adhesive is placed on the narrow slit place, in optimum embodiment, adhesive 96 is a kind of ultraviolet curing adhesives.When independent nozzle plate 150 downcuts from compound 26, and adhesive is full of after the narrow slit 94, and independent nozzle plate 150 is fixed on the silicon substrate wafer (not shown).Silicon substrate is exposed under the ultraviolet light source, thereby adhesive 96 is solidified.In case when being covered with nozzle plate 150 on the silicon substrate wafer, from silicon wafer, being partitioned into single substrate, and being fixed on the printhead.

Fig. 2 also illustrates the method that forms and isolate the nozzle plate 150 of ink jet-print head a kind of from laser ablation compound 26.Specifically, this method comprises the following steps: as shown in Figure 4, prepares a composite construction that comprises 10, one adhesive phases 24 of a kind of polymeric material and a polymer sacrifice layer 28 or compound 26.This method also comprises the steps,, cuts each layer of nozzle plate 150 with laser instrument 76 parts that is, and this laser instrument 76 is positioned at the back of excite state atomic laser 38 described in the technological process of Fig. 2.This method also comprises with one uses the shear of shear plate 56 to isolate nozzle plate 150 from compound 26.

The laser instrument 76 that is used for part incision nozzle plate can be selected from following laser instrument: infrared emission type laser instrument, ultraviolet emission type laser instrument, for example excite state atomic laser, initially the YAG laser instrument of the TEA CO2 of wavelength or frequency multiplication and use Q-switch.If select to use the YAG laser instrument of Q-switch in the present invention, these laser instrument 76 best emission wavelengths are the laser of about 1.0Um.Should use the YAG laser instrument of Q-switch preferably lasting from about 8 nanoseconds to about 100 nanoseconds simultaneously by the burst length of laser beam 78 radiation polymerization thing sacrifice layers 28.Shearing down from polymeric material reel 22, the method for nozzle plate of inkjet printhead 70 further comprises following step, promptly, limit the laser beam 78 of laser instrument 76 with plate with holes 80, be about 0.005 inch perforate thereby on polymer sacrifice layer 28, cut width.

In optimizing embodiment, laser instrument 76 is TEA CO2 laser instruments.In ablation process, wish that hear rate around the polymer sacrifice layer 28 that cuts is limited in about 0Um from otch to about 37Um.Self-evident, when using the YAG laser instrument of Q-switch, also limit the laser beam of TEACO2 laser instrument with plate with holes 80, on all layers of nozzle plate 70, cut width and be about 0.005 inch perforate.Preferably use TEA CO2 laser instrument when laser is cut apart polymer sacrifice layer 28, speed is about 5 mm/second or higher.

Referring to Fig. 7, compound 26 relies on sprocket hole 88 to move along plate shown in Figure 2, and this sprocket hole 88 is positioned near compound 26 the relative side 89 on nozzle plate 150 relative sides.Cutting apart nozzle plate 150 is to ablate by laser instrument 76 to penetrate sacrifice layer 28, adhesive phase 24 and polymeric material 10, forms rectangular slit 92 around nozzle plate 150.

The position that centers on this slit 92 of nozzle plate 150 peripheries is limited by projection print plate 80, and this mask 80 allows the perforate of laser beams 78 by mask 80, does not allow laser beam 78 arrive compound 26 by the other parts of mask 80.The part that allows laser beam 36 touch compound 26 in the mask 80 forms certain pattern.

The current scanning instrument that preferably uses the General Scanning Inc. in Chicago, Illinois to sell forms slit 92 and cuts angle 90 in the every nozzle plate 150.As shown in Figure 7, compound 26 every slit best penetration sacrifice layer 28, adhesive phase 24 and polymeric material 10.Slit 92 in compound 26 is helpful for downcutting each independent nozzle plate 150 with shear plate 56.

When sacrifice layer 28 was water-soluble substances, after finishing the laser ablation operation, preferably the water with water source 46 (referring to Fig. 2) directly sprayed to compound 26 from shower nozzle 44, to remove sacrifice layer 28 and the chip 42 (Fig. 2) on it.Also compound 26 can be immersed in the pond, long enough, with dissolving sacrifice layer 28.Removing sacrifice layer 28 used water temperatures can be from about 20 ℃ to about 90 ℃.Higher water temperature can shorten the required time of dissolve polyvinyl alcohol sacrifice layer 28.Preferably suitably select dissolving sacrifice layer 28 used temperature and type of solvent, so that improve dissolution velocity as the material of sacrifice layer 28.

Chip 42 and sacrifice layer 28 are stayed in the water miscible waste stream 48, and this waste stream 48 is separated from compound 26.Because chip 42 is bonded on the sacrifice layer 28, removes sacrifice layer 28, also just almost all removed the chip 42 that in the laser ablation operation, generates.Because use water-soluble sacrificial layer 28, both leicht fallen D/A was not time-consuming yet to remove sacrifice layer 28 and chip 42.The existence of sacrifice layer 28 can prevent chip 42 contacts effectively and stick on the adhesive phase 24 in laser ablation process.Because this method adopts a sacrifice layer to protect adhesive phase, adhesive phase 24 can stick on the polymeric material 10 before carrying out laser ablation, rather than sticked on the substrate, thereby can simplify the manufacture process of printhead.

Remove after the sacrifice layer 28, scribble compound 26 of adhesive as shown in Figure 9 at the shape of cross section at D point place.As can be seen from Figure 9, this structure comprises polymeric material 10 and adhesive phase 24.Originally the sacrifice layer 28 that was coated with adhesive phase 24 now is removed.

Separate the parts 50 that comprise single-nozzle plate 150 with shear plate 56, then it is sticked on the silicon substrate.With adhesive phase 24 polymeric material 10 is bonded on the silicon substrate.

Before being bonded on the silicon substrate, be preferably in coating one deck adhesion promotor as thin as a wafer on the silicon substrate to polymeric material 10.The quantity of adhesion promotor should be enough to nozzle plate 150 on adhesive on the whole surface of substrate, react, but the quantity of adhesion promotor should not disturbed the electric component on the substrate and the function of like.Preferably the adhesive phase on the polymeric material 10 24 is placed on the silicon substrate, and nozzle plate 150 is pressed onto on the silicon substrate, nozzle plate 150 is bonded on the silicon substrate with the pressing plate after the heating.

In another kind of feasible program, can or remove sacrifice layer before uncoated sacrifice layer 28 after, adhesion promotor is coated on the exposed surface of adhesive phase 24.Can adopt well-known technology,, adhesion promotor is coated onto on silicon substrate or the adhesive phase as spin coating, spraying, roller coat or brushing.A kind of adhesion promotor that share especially is the reactive silane prescription, for example the Dow Corning Z6032 SILANE that can buy from the Dow Corning of Michigan State Midland.

Before nozzle plate being adhered to substrate and filling up the uneven part of chip surface, be preferably in coating skim photo-curing epoxy resin on the substrate, to strengthen the adhesion strength between nozzle plate and the substrate.Photo-curing epoxy resin is spin-coated on the substrate, and is light-cured into certain pattern, and this pattern defines black circulation road 16, ink-feed channel 14 and spray chamber 18.After this go uncured epoxy resin is molten with a kind of appropriate solvent.

A kind of preferred light-cured epoxy prescription contains from about 50% gamma-butyrolacton to about 75% (percentage by weight), from about 10% to about 20% polymethyl methacrylate/polymethyl acid copolymer, from about 10% to about 20% bifunctional epoxy resin such as EPON 1001F, (can buy) from Houston shell chemical company of Texas, from about 0.5% to about 3% polyfunctional epoxy resin such as DEN431 (can buy from the Dow chemical company of the Midland of Michigan State), from about 2% to about 6% light trigger such as CYRACURE UVI-6974 (can buy from the union carbide corporation of Danbury) and from about 0.1% to about 1% γ dwindle glycerine oxygen propyl group front three silicol.

Though the preferred embodiments of the invention above have been described, under the condition that does not break away from essence of the present invention, this professional those of ordinary skill can be made multiple improvement to various piece of the present invention, resets and substitutes.

Claims (39)

1, a kind of method of making the nozzle plate of ink-jet printer, this method comprises:

(a) compound of comprising polymeric material of preparation, this composite strip has or does not have an adhesive phase;

(b) coating one layer of polymeric sacrifice layer on this compound;

(c) with first laser ablation delivery nozzle hole, mobile parts or nozzle bore and mobile parts on this compound;

(d) remove this sacrifice layer from this compound.

2, a kind of the method for claim 1 is characterized in that, this method also comprises with second laser instrument cuts apart this coated compound, forming single nozzle plate, and isolates this single nozzle plate from this compound.

3, a kind of method as claimed in claim 2 is characterized in that, this second laser instrument is an infrared laser or a UV laser instrument.

4, a kind of method as claimed in claim 2 is characterized in that, this second laser instrument is a YAG laser instrument that uses Q-switch.

5, a kind of method as claimed in claim 4 is characterized in that, this uses the laser beam of the YAG laser instrument emission wavelength of Q-switch as 1.0Um.

6, a kind of method as claimed in claim 5 is characterized in that, limits second laser beam with a plate with holes, is about 0.005 inch fillet so that this composite is divided into width.

7, a kind of method as claimed in claim 5 is characterized in that, forms fillet with an inspection scan flow device on this compound.

8, a kind of method as claimed in claim 4 is characterized in that, the YAG laser instrument of this use Q-switch carries out radiation to this compound with about 8 nanoseconds to about 100 nanoseconds pulse duration.

9, a kind of method as claimed in claim 5 is characterized in that, limits this second laser beam with a projection print plate, to form the fillet pattern in compound.

10, a kind of method as claimed in claim 2 is characterized in that, this second laser instrument is a TEA CO2 laser instrument.

11, a kind of method as claimed in claim 10 is characterized in that, this TEA CO2 laser instrument has reduced and highly is about the generation of 0Um near the slag single compound of about 10Um.

12, a kind of method as claimed in claim 10 is characterized in that, about 0Um was to the interior thermal losses of about 37Um distance near this TEA CO2 laser instrument had reduced this single compound.

13, a kind of method as claimed in claim 10 is characterized in that, limits by the second laser instrument emitted laser bundle with a plate with holes, so that cut this compound, making its width is about 0.005 inch.

14, a kind of method as claimed in claim 10 is characterized in that, forms fillet with an inspection scan flow device on this compound.

15, a kind of method as claimed in claim 10 is characterized in that, limits this second laser beam with a projection print plate, to form the fillet pattern in compound.

16, a kind of method as claimed in claim 10 is characterized in that, forms single compound with second laser instrument with about 5mm/sec or faster speed.

17, the method on a kind of silicon substrate that a polymer nozzle plate is connected to a heating, this method comprises the following steps:

(a) a kind of composite that comprises a polymeric layer and an adhesive phase of preparation contains first adhesive in this adhesive phase;

(b) this composite of ablating has the nozzle plate at 4 angles with formation;

(c) on this nozzle plate, form at least one hole;

(d) from this composite, isolate single nozzle plate;

(e) make the adhesive phase of silicon substrate contact nozzle plate;

(f) fill above-mentioned hole with second adhesive;

(g) above-mentioned two kinds of adhesives are solidified.

18, a kind of method as claimed in claim 17 is characterized in that, forms above-mentioned hole at least in the adhesive phase of nozzle plate.

19, a kind of method as claimed in claim 17 is characterized in that, this second adhesive is a kind of adhesive that can be solidified by UV.

20, a kind of method as claimed in claim 19 is characterized in that, this method also comprises this nozzle plate is exposed under the UV light source, thus the adhesive step of curing that this can be solidified by UV.

21, a kind of method of improving the polymer sacrifice layer and the bonding effect between the adhesive phase of composite, this composite is used to form the nozzle plate of ink jet-print head, and this method comprises the steps:

(a) compound of comprising a nozzle layer and an adhesive phase of preparation;

(b) coating one layer of polymeric sacrifice layer on this adhesive phase;

(c) this adhesive phase and this sacrifice layer are heated to uniform temperature, this temperature is enough to improve the bonding effect between sacrifice layer and the adhesive phase.

22, a kind of method as claimed in claim 21 is characterized in that, this method is inserted this adhesive phase in this polymer sacrifice layer, is coated on this adhesive phase thereby will carve sacrifice layer.

23, a kind of method as claimed in claim 21 is characterized in that, this method is sprayed on this polymer sacrifice layer on this adhesive phase, thereby this sacrifice layer is coated on this adhesive phase.

24, a kind of method as claimed in claim 21 is characterized in that, this method is imprinted on this polymer sacrifice layer on this adhesive phase, thereby this sacrifice layer is coated on this adhesive phase.

25, a kind of method as claimed in claim 21 is characterized in that, this method oppositely is imprinted on this polymer sacrifice layer on this adhesive phase, thereby this sacrifice layer is coated on this adhesive phase.

26, a kind of method as claimed in claim 21 is characterized in that, this method is spin-coated on this sacrifice layer on this adhesive phase, thereby this sacrifice layer is coated on this adhesive phase.

27, a kind of method as claimed in claim 21 is characterized in that, this method is coated on this adhesive phase with the reverse roller coat of this sacrifice layer or in myer rod mode, thereby this sacrifice layer is coated on this adhesive phase.

28, a kind of method as claimed in claim 21 is characterized in that, this method is coated on this polymer sacrifice layer on this adhesive phase with scraper or roller, thereby this sacrifice layer is coated on this adhesive phase.

29, a kind of method as claimed in claim 21 is characterized in that, this method heats this and comprises described sacrifice layer and adhesive phase compound by being placed near this compound through the hot-rolling of heating.

30, a kind of method as claimed in claim 29 is characterized in that, the roller of this process heating cures this polymer sacrifice layer at about 60 ℃ to about 100 ℃ scope.

31, a kind of method as claimed in claim 29 is characterized in that, cure this compound 30 to 60 minutes.

32, a kind of method as claimed in claim 21 is characterized in that, this compound that comprises adhesive phase and sacrifice layer is heated in the multistage baking oven.

33, a kind of method as claimed in claim 32 is characterized in that, the temperature that this multistage baking oven is first section about 25 ℃ to about 35 ℃ scope.

34, a kind of method as claimed in claim 33 is characterized in that, the temperature that this multistage baking oven is second section about 45 ℃ to about 65 ℃ scope.

35, a kind of method as claimed in claim 34 is characterized in that, the temperature that this multistage baking oven is the 3rd section about 75 ℃ to about 85 ℃ scope.

36, a kind of method as claimed in claim 35 is characterized in that, the temperature that this multistage baking oven is the 4th section about 90 ℃ to about 100 ℃ scope.

37, a kind of method as claimed in claim 36 is characterized in that, the temperature that this multistage baking oven is the 5th section about 100 ℃ to about 110 ℃ scope.

38, a kind of method as claimed in claim 20 is characterized in that, this method is by in the baking oven that will this compound be placed on a convection current, thereby heats this polymer sacrifice layer.

39, a kind of method as claimed in claim 38 is characterized in that, this method makes this compound heating about 30 to about 60 minutes.

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