CN1248778A - Axial wire-guiding type electronics parts and device for installation of circuit base board - Google Patents
Axial wire-guiding type electronics parts and device for installation of circuit base board Download PDFInfo
- Publication number
- CN1248778A CN1248778A CN99118410A CN99118410A CN1248778A CN 1248778 A CN1248778 A CN 1248778A CN 99118410 A CN99118410 A CN 99118410A CN 99118410 A CN99118410 A CN 99118410A CN 1248778 A CN1248778 A CN 1248778A
- Authority
- CN
- China
- Prior art keywords
- metal cap
- terminal
- guiding type
- resin
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009434 installation Methods 0.000 title description 2
- 239000002184 metal Substances 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 238000005476 soldering Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 29
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 25
- 239000003990 capacitor Substances 0.000 claims description 17
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 7
- 238000007747 plating Methods 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 2
- 206010068051 Chimerism Diseases 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The present invention provides an axial electronic part wherein terminals 11 of a chip electronic part element are covered by the tubular metal cap and spread by resin 3. When heating the substrate for soft soldering, the resin is expanded and the soft soldering material that forms the plating layer 12 on the terminals 11 flows along the body 10 and in the gap of the resin 3. In the solution of the present invention, an extra metal layer 23 is provided on the inner circumferential surface at the tubular part 22 of the metal cap 2. When the resin 3 is expanded, because the soft soldering material of the extra metal layer 23 flows on the external side of the tubular part 22, the expansion of the resin 3 does not influence the plating layer on the terminals.
Description
The invention relates to axial wire-guiding type electronics parts and the circuit board device that this axial wire-guiding type electronics parts is installed to wafer-like ceramic electronic component component chimeric metal cap.
As shown in Figure 5, before, the terminal 11 chimeric metal caps 2 that extend lead 21 at wafer capacitor 1 two ends that are formed at wafer-like ceramic electronic component assembly, it is known using the back axialmode electronic component that is overlayed on the coated film 4 that belongs to exterior material of resin 3 coatings.Be formed with by plating slicken solder or zinc-plated formed electrodeposited coating 12 at this terminal 11, because of the section shape of wafer capacitor 1 is a rectangle, so electrodeposited coating 12 is to sentence electric means 4 to be connected with the inner peripheral surface of metal cap 2.The axial wire-guiding type electronics parts of making like this is installed in substrate, is fixed with soft soldering for substrate.
When above-mentioned illustrated axial wire-guiding type electronics parts being installed on substrate when carrying out soft soldering, when particularly using the soft soldering device of anti-stream (reflow) formula, axial wire-guiding type electronics parts also can be heated to more than the fusing point.Again, in recent years, because the unleaded progress of slicken solder makes the fusing point of slicken solder and the fusing point of tin that the tendency that is tending towards approaching be arranged.And, because above-mentioned heating makes and is coated on that terminal 11 surfaces constitute the slicken solder of electrodeposited coating 12 or tin is softening sometimes.On the other hand, the coefficient of thermal expansion of resin 3 is for big than the coefficient of thermal expansion of metal cap.So the resin 3 that is positioned at terminal 11 and the cylindrical portions may of metal cap 2 is heated and when expanding, so because the slicken solder of electrodeposited coating 12 or tin are softening is forced out towards periphery.The improper situation that just changes of slicken solder that is extruded or tin like this along the electrical characteristic of the axialmode electronic component that when the another terminal side is extended, can cause electric capacity etc. between capacitor department 10 and the resin 3.So the circuit board device that this axial wire-guiding type electronics parts has been installed can change in its characteristic of soft soldering operation process or performance.
So, in view of the above problems, even the objective of the invention is in order to provide more than a kind of fusing point that is heated to slicken solder, being coated on the slicken solder of two-terminal or tin can to axial wire-guiding type electronics parts that direction adjacent to each other flows and installing in the soft soldering operation process of this axial wire-guiding type electronics parts not can occurrence features or the circuit board device of performance change yet yet.
In order to address the above problem, the present invention is provided with: the wafer-like ceramic electronic component assembly that has the terminal of implementing slicken solder electricity tin or tin plating at two ends; Be entrenched in the tubular metal cap that the end is arranged of this terminal respectively; Coefficient of thermal expansion is greater than the resin of the coefficient of thermal expansion of the metal cap in the gap that is filled in terminal and metal cap inner peripheral surface, the axial wire-guiding type electronics parts that the outer dress material of the wafer-like that is covered at least ceramic electronic component assembly is constituted, it is characterized in that: at the tube portion inner peripheral surface of above-mentioned metal cap, be provided with the residual metallic layer, be used for by when the fusing point that is heated to slicken solder is above, preventing to be plated on the slicken solder of above-mentioned terminal or flowing of tin because the expansion of resin flows in metal cap outer peripheral face side.
Because of being provided with above-mentioned residual metallic layer, even resin expands because of the metal of the residual metallic layer that constitutes slicken solder or tin owing to flow in metal cap outer peripheral face side, just can weaken and to be plated on the slicken solder of terminal surfaces or the strength that tin extrudes, thereby can prevent that the slicken solder or the tin that are plated on terminal surfaces from taking place to flow.
The simple declaration of accompanying drawing
Fig. 1 is the figure of the chimerism of expression wafer capacitor and metal cap.
Fig. 2 is the profile of the preceding state of heating of the telescoping part of expression wafer capacitor and metal cap.
Fig. 3 is the figure of the installment state of expression capacitor of the present invention.
Fig. 4 is the profile of state after the heating of telescoping part of expression wafer capacitor and metal cap.
Fig. 5 is the profile of original state of the telescoping part of expression wafer capacitor and metal cap.
Consult accompanying drawing example of the present invention is described, wherein, just use the symbol identical with Fig. 5 with above-mentioned same section shown in Figure 5.Referring to Fig. 1, metal cap 2 is to have formed the round-ended cylinder shape, and has extended lead 2l from the bottom branch.The terminal 11 that is formed on wafer capacitor 1 two ends of wafer-like ceramic electronic component assembly is embedded in the cylindrical portions may 22 of metal cap 2.Can implement soft soldering easily for substrate when making on this terminal 11 surfaces still state with wafer capacitor 1 be installed on substrate, be coated with and electroplate soft soldering or the formed electrodeposited coating 12 of tin.As shown in Figure 2, cylindrical portions may 22 inner peripheral surfaces at metal cap 2 are provided with residual metallic layer 23.This residual metallic layer 23 forms by be covered equably at cylindrical portions may 22 inner peripheral surfaces slicken solder or tin.Though form the slicken solder of this residual metallic layer 23 or metal (slicken solder or the tin) identical materials that tin could use and form electrodeposited coating 12,, the fusing point that uses its fusing point to form the metal of electrodeposited coating 12 is that low person is preferable.Again, the thickness of residual metallic layer 23 is preferably rough identical or thicker than it with the thickness of electrodeposited coating 12.
Consult Fig. 3, bending is inserted in the installing hole H that provides at substrate B by the lead 21 of the capacitor C of the above-mentioned axial wire-guiding type electronics parts that constitutes made, after again tip in position being cut off in order to prevent to come off in addition bending.Above installation process is to be undertaken by automatic mounting machine.Thereafter for lead 21 soft solderings are transported to flow soft soldering device or backflow soft soldering device in pattern P.Carry out the heating of capacitor C in this soft soldering process.Consult Fig. 4, C is from external heat because of this capacitor, so heat residual metallic layers 23 in cylindrical portions may 22 backs of heating of metal cap 2, makes the slicken solder of residual metallic layer 23 or tin softening.Then, heating expands for big resin 3 than the thermal coefficient of expansion of metal cap 2.At this moment, the temperature of electrodeposited coating 12 is a lower temperature than the temperature of residual metallic layer 23, and the slicken solder of electrodeposited coating 12 or tin become more hard state for slicken solder or the tin than residual metallic layer 23.Therefore, because the expansion of resin 3, the slicken solder of residual metallic layer 23 or tin are extruded and change in the peripheral part of cylindrical portion 22 by the resin that is expanded 3.If with the expansion of resin 3 since the slicken solder of residual metallic layer 23 or the part of tin change over to when cylindrical portion 22 outer peripheral faces are absorbed, so the surface electrical coating 12 of cylindrical portions may 22 inner peripheral surfaces or terminal 11 is not unlikely to be subjected to stress because resin 3 can not expand again.Therefore, electrodeposited coating 12 is subjected to heating the slicken solder that causes electrodeposited coating 12 or tin is softening even its after heat is communicated to, but because resin 3 can not expand again, takes place mobile so also do not have the slicken solder or the tin that form electrodeposited coating 12 between capacitor 10 and resin 3.So resin 3 just shrinks during capacitor C cooling when finishing the soft soldering process, so flow and can form gap 5 between the residual metallic layer 23 of attenuation and the resin 3 at part slicken solder or tin.
Yet, though used the wafer capacitor at above-mentioned example as wafer-like ceramic electronic component element, also applicable temperature-sensitive resistance device, variable resistor, other wafer-like ceramic part elements such as pearl inductor.
Just can be clear by above explanation, be provided with the residual metallic layer according to axial wire-guiding type electronics parts of the present invention because of tube portion inner peripheral surface at the metal cap, so in be contained in the wafer-like ceramic electronic component element of axial wire-guiding type electronics parts slicken solder that two-terminal applied or tin can not flow, thereby, two-terminal can be not close, so the electrical characteristic of electric capacity etc. can not change.Again, characteristic or the performance that the circuit board device of this axial wire-guiding type electronics parts is installed can not change because of the soft soldering process.
Claims (5)
1. an axial wire-guiding type electronics parts comprises: have the wafer-like ceramic electronic component assembly that applies the terminal of electroplating slicken solder or electrotinning at two ends; Be embedded in the metal cap that bottom tube-like is arranged of each this terminal; Be filled in the gap of terminal and metal cap inner peripheral surface, than the big resin of its thermal expansion of metal cap; The exterior material of the wafer-like that is covered at least ceramic electronic component element, it is characterized in that: at the inner peripheral surface of the cylindrical portions may of above-mentioned metal cap, be provided with the residual metallic layer, in order to by preventing to be plated on the slicken solder of above-mentioned terminal or flowing of tin because the expansion of resin flows in metal cap outer peripheral face side when above being heated to the slicken solder fusing point.
2. axial wire-guiding type electronics parts as claimed in claim 1 is characterized in that, above-mentioned terminal is rectangular shape, and the barrel of metal cap is the drum that is external in terminal.
3. axial wire-guiding type electronics parts as claimed in claim 1 or 2 is characterized in that, above-mentioned resin is filled in the gap of terminal and metal cap inner peripheral surface, and the surface of lining wafer-like ceramic electronic component element.
4. as claim 1,2 or 3 described axial wire-guiding type electronics parts, it is characterized in that above-mentioned wafer-like ceramic electronic component assembly is the wafer capacitor, temperature-sensitive resistance device, variohm, any in the pearl inductor.
5. an axial lead lead-type electronic component is installed circuit board device, it is characterized in that, install and soft soldering just like claim 1,2, each described axial wire-guiding type electronics parts of 3 or 4.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24400498A JP3836263B2 (en) | 1998-08-28 | 1998-08-28 | Axial lead type electronic component and circuit board device mounted with axial lead type electronic component |
| JP244004/1998 | 1998-08-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1248778A true CN1248778A (en) | 2000-03-29 |
| CN1158681C CN1158681C (en) | 2004-07-21 |
Family
ID=17112291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB991184106A Expired - Fee Related CN1158681C (en) | 1998-08-28 | 1999-08-28 | Axial wire-guiding type electronics parts and device for installation of circuit base board |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3836263B2 (en) |
| KR (1) | KR100657112B1 (en) |
| CN (1) | CN1158681C (en) |
| HK (1) | HK1026507A1 (en) |
| TW (1) | TW442804B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100449654C (en) * | 2000-03-30 | 2009-01-07 | 阿维科斯公司 | Electronic device and process of making electronic device |
| CN100456276C (en) * | 2005-03-18 | 2009-01-28 | 富士通株式会社 | Cross bar apparatus, and method and program for controlling the same |
| CN101755314B (en) * | 2007-07-19 | 2012-10-10 | 松下电器产业株式会社 | Electronic component, lead wire and their production methods |
| CN111922474A (en) * | 2020-07-08 | 2020-11-13 | 安徽工程大学 | Metal and ceramic welding device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100822987B1 (en) * | 2001-09-11 | 2008-04-16 | 주식회사 포스코 | Sludge cake supply apparatus on belt conveyer for coke transferring |
| WO2009011096A1 (en) * | 2007-07-19 | 2009-01-22 | Panasonic Corporation | Electronic component, lead wire and their production methods |
| JP2010199171A (en) | 2009-02-24 | 2010-09-09 | Shinko Electric Ind Co Ltd | Chip component mounted wiring board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH027410A (en) * | 1987-12-30 | 1990-01-11 | Tdk Corp | Chip-shaped electronic component and its manufacture |
| JPH03157909A (en) * | 1989-11-16 | 1991-07-05 | Taiyo Yuden Co Ltd | Cylindrical ceramic capacitor |
-
1998
- 1998-08-28 JP JP24400498A patent/JP3836263B2/en not_active Expired - Fee Related
-
1999
- 1999-08-10 TW TW088113670A patent/TW442804B/en not_active IP Right Cessation
- 1999-08-25 KR KR1019990035346A patent/KR100657112B1/en not_active IP Right Cessation
- 1999-08-28 CN CNB991184106A patent/CN1158681C/en not_active Expired - Fee Related
-
2000
- 2000-09-11 HK HK00105719A patent/HK1026507A1/en not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100449654C (en) * | 2000-03-30 | 2009-01-07 | 阿维科斯公司 | Electronic device and process of making electronic device |
| CN100456276C (en) * | 2005-03-18 | 2009-01-28 | 富士通株式会社 | Cross bar apparatus, and method and program for controlling the same |
| CN101755314B (en) * | 2007-07-19 | 2012-10-10 | 松下电器产业株式会社 | Electronic component, lead wire and their production methods |
| CN111922474A (en) * | 2020-07-08 | 2020-11-13 | 安徽工程大学 | Metal and ceramic welding device |
| CN111922474B (en) * | 2020-07-08 | 2022-01-11 | 安徽工程大学 | Metal and ceramic welding device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100657112B1 (en) | 2006-12-15 |
| JP3836263B2 (en) | 2006-10-25 |
| CN1158681C (en) | 2004-07-21 |
| HK1026507A1 (en) | 2000-12-15 |
| KR20000017518A (en) | 2000-03-25 |
| TW442804B (en) | 2001-06-23 |
| JP2000077257A (en) | 2000-03-14 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1026507 Country of ref document: HK |
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040721 Termination date: 20100828 |