CN1245107A - Resin mold material - Google Patents
Resin mold material Download PDFInfo
- Publication number
- CN1245107A CN1245107A CN 98117513 CN98117513A CN1245107A CN 1245107 A CN1245107 A CN 1245107A CN 98117513 CN98117513 CN 98117513 CN 98117513 A CN98117513 A CN 98117513A CN 1245107 A CN1245107 A CN 1245107A
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- CN
- China
- Prior art keywords
- phthalate
- phosphate
- dioctyl
- epoxy resin
- dibutyl phthalate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Abstract
The present invention relates to a process for preparing the resin material of mould, which features that plasticizer is used as one of its raw materials to increase the toughness of mould, resulting in longer service life of the mould made up of said resin by high-pressure injection.
Description
The present invention relates to a kind of compound method, be applicable to and make the ceramic pressure casting mould with mold materials of filtration.
The ceramic pressure casting mould will bear up to ten thousand the alternate stress effects that maximum pressure is the mud of 1.5MPa when work, its temperature is about 40 ℃; Also to bear the erosion of oxidant when cleaning.Therefore, the micro through hole material of making the ceramic pressure casting mould must have good humidity resistance, chemerosiveness resistent, higher mechanical strength and good toughness.
At present, when with epoxy resin being the ceramic pressure casting mould of base-material making micro through hole material, used polyamide curing agent.With the epoxy resin that polyamide curing agent solidifies, its toughness is fairly good, but performances such as hear resistance, chemerosiveness resistent and mechanical strength are all lower, and rupture strength is generally below 10MPa.
The epoxy resin mould material that solidifies with amine curing agent has higher humidity resistance, chemerosiveness resistent and mechanical strength, but toughness is relatively poor, is repeatedly easily breaking under the alternate stress effect, influences the service life of mould.
The objective of the invention is and when guaranteeing that mould has higher humidity resistance, chemerosiveness resistent and mechanical strength, to improve the toughness of mould, prolong its service life.Add plasticizer when promptly using amine curing agent, mold materials toughness is improved.
Realize that concrete grammar of the present invention is:
The epoxy resin of at first selecting for use is low-molecular-weight bisphenol A type epoxy resin, as the epoxy resin of E51, E44, the E42 trade mark.Amine curing agent is selected polyhydric aliphatic amine or aromatic amine curing agent for use, as ethylenediamine, diethylenetriamine, triethylene tetramine, TEPA, polyethylene polyamine, m-xylene diamine, m-phenylene diamine (MPD), 4, and 4 ' (two amido phenyl) methane (4,4 ' MPA).Plasticizer is selected ester classes such as phthalic acid for use, as: repefral, diethyl phthalate, dibutyl phthalate, diisobutyl phthalate, phthalic acid butylbenzene ester, DMEP, diamyl phthalate, dioctyl phthalate, dibutyl phthalate (DHP), dioctyl isophthalate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, triphenyl phosphate, tricresyl phosphate, diethylene adipate, dioctyl adipate, dioctyl azelate, di-n-octyl sebacate.
Emulsifying agent is selected AEO or APES O/W type emulsifying agent, H.L.B value 13 to 15 for use.
Filler is selected inorganic or organic powder for use, and as calcium carbonate, talcum, quartz or polymethyl methacrylate, fineness is 100 order to 1000 orders.
Institute's water is a drinking water.
Any epoxy resin that resin die material of the present invention is prepared in (weight ratio): E51, E44 or the E42 trade mark in following ratio is 100; Repefral, the phthalic acid diethyl phthalate, dibutyl phthalate, diisobutyl phthalate, phthalic acid butylbenzene ester, DMEP, diamyl phthalate, dioctyl phthalate, dibutyl phthalate (DHP), dioctyl isophthalate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, triphenyl phosphate, tricresyl phosphate, diethylene adipate, dioctyl adipate, any in dioctyl azelate or the di-n-octyl sebacate: 5-25 as plasticizer; Ethylenediamine, diethylenetriamine, triethylene tetramine, TEPA, polyethylene polyamine, m-xylene diamine, m-phenylene diamine (MPD), 4, any in 4 ' (the two amido phenyl) methane (4,4 ' MPA): 5-20 as curing agent; AEO or APES O/W type emulsifying agent (H.L.B value 13 to 15) are 5-40; Water is 150-250; Fineness is that 100 orders-1000 purpose calcium carbonate, talcum, quartz or polymethyl methacrylate are 300-600.
Application example (weight ratio): epoxy resin E51 is 100; Dibutyl phthalate is 22; Diethylenetriamine 14; Breast lark (H.L.B value 13) is 35; Water is 180; Silica flour (325 order) is 560.
Earlier epoxy resin and dibutyl phthalate are stirred, adding diethylenetriamine again stirs as curing agent, it is even as emulsifier for mixing to add newborn lark (H.L.B value 13) then, add entry again and stir the formation homogeneous latex emulsion, add the filler formation slip that stirs at last, in the slip injection model.At normal temperatures, behind the epoxy resin cure, the demoulding also washes away DDGS by the duct water that sets in advance in solidfied material, promptly forms poromerics, and its profile is predetermined mold shape.The resin die that adopts mold materials of the present invention to make can use on the high-pressure slip-casting make-up machine more than 10,000 times, and the rupture strength of mold materials is more than 14MPa.
Claims (2)
1, a kind of resin die material is characterized in that any epoxy resin that this mold materials is prepared in (weight ratio): E51, E44 or the E42 trade mark in following ratio is 100; Repefral, diethyl phthalate, dibutyl phthalate, diisobutyl phthalate, phthalic acid butylbenzene ester, DMEP, diamyl phthalate, dioctyl phthalate, dibutyl phthalate (DHP), dioctyl isophthalate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, triphenyl phosphate, tricresyl phosphate, diethylene adipate, dioctyl adipate, any in dioctyl azelate or the di-n-octyl sebacate: 5-25 as plasticizer; Ethylenediamine, diethylenetriamine, triethylene tetramine, TEPA, polyethylene polyamine, m-xylene diamine, m-phenylene diamine (MPD), 4, any in 4 ' (the two amido phenyl) methane (4,4 ' MPA) is 5-20; AEO or APES O/W type emulsifying agent (H.L.B value 13 to 15) are 5-40; Water is 150-250; Fineness is that 100 orders-1000 purpose calcium carbonate, talcum, quartz or polymethacrylates are 300-600.
2, resin die material according to claim 1, it is characterized in that mold materials prepares (weight ratio) in following ratio: epoxy resin E51 is 100; Dibutyl phthalate is 22; Diethylenetriamine 14; Breast lark (H.L.B value 13) is 35; Water is 180; Silica flour (325 order) is 560.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98117513 CN1076261C (en) | 1998-08-18 | 1998-08-18 | Resin mold material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98117513 CN1076261C (en) | 1998-08-18 | 1998-08-18 | Resin mold material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1245107A true CN1245107A (en) | 2000-02-23 |
| CN1076261C CN1076261C (en) | 2001-12-19 |
Family
ID=5225565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98117513 Expired - Fee Related CN1076261C (en) | 1998-08-18 | 1998-08-18 | Resin mold material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1076261C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100365063C (en) * | 2006-03-02 | 2008-01-30 | 吕殿杰 | Filtering layer resin materials and method for preparing same |
| CN101885592A (en) * | 2010-06-10 | 2010-11-17 | 武汉大学 | Mold material and preparation method and application thereof |
| CN103448168A (en) * | 2013-09-02 | 2013-12-18 | 湖北三江航天红阳机电有限公司 | Method for de-molding particle-reinforced and fiber-reinforced double-element composite material |
| CN105314924A (en) * | 2015-07-24 | 2016-02-10 | 九牧厨卫股份有限公司 | Small high-pressure element for ceramic sanitary appliance forming and manufacturing technology thereof |
| CN107601964A (en) * | 2017-10-19 | 2018-01-19 | 周夕和 | A kind of preparation method of ceramic gypsum mold |
| CN111238908A (en) * | 2020-04-01 | 2020-06-05 | 中国大唐集团科学技术研究院有限公司华中电力试验研究院 | Preparation method of pitting sample |
-
1998
- 1998-08-18 CN CN 98117513 patent/CN1076261C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100365063C (en) * | 2006-03-02 | 2008-01-30 | 吕殿杰 | Filtering layer resin materials and method for preparing same |
| CN101885592A (en) * | 2010-06-10 | 2010-11-17 | 武汉大学 | Mold material and preparation method and application thereof |
| CN101885592B (en) * | 2010-06-10 | 2012-11-21 | 武汉大学 | Mold material and preparation method and application thereof |
| CN103448168A (en) * | 2013-09-02 | 2013-12-18 | 湖北三江航天红阳机电有限公司 | Method for de-molding particle-reinforced and fiber-reinforced double-element composite material |
| CN105314924A (en) * | 2015-07-24 | 2016-02-10 | 九牧厨卫股份有限公司 | Small high-pressure element for ceramic sanitary appliance forming and manufacturing technology thereof |
| CN105314924B (en) * | 2015-07-24 | 2017-09-15 | 九牧厨卫股份有限公司 | A kind of ceramic sanitary appliance shaping high pressure smallclothes and its manufacture craft |
| CN107601964A (en) * | 2017-10-19 | 2018-01-19 | 周夕和 | A kind of preparation method of ceramic gypsum mold |
| CN111238908A (en) * | 2020-04-01 | 2020-06-05 | 中国大唐集团科学技术研究院有限公司华中电力试验研究院 | Preparation method of pitting sample |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1076261C (en) | 2001-12-19 |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |