CN1243313A - Composite substrate carrier - Google Patents
Composite substrate carrier Download PDFInfo
- Publication number
- CN1243313A CN1243313A CN 99107667 CN99107667A CN1243313A CN 1243313 A CN1243313 A CN 1243313A CN 99107667 CN99107667 CN 99107667 CN 99107667 A CN99107667 A CN 99107667A CN 1243313 A CN1243313 A CN 1243313A
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- substrate
- substrate carrier
- carrier
- mold pressing
- base portion
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.
Description
The present invention relates to control and be used to the memory disc that transports, store, handle, the device of silicon chip and like.Especially relate to a kind of composite substrate or dish carrier.
Before treatment substrate, during and after, use specific carrier to transport and store silicon chip or disk groups.Substrate is placed into integrated circuit, and dish is placed into the computing machine magnetic storage disk.When this uses, substrate refers to silicon chip, magnetic matrix and like thereof.
The processing procedure that basal disc is put into integrated circuit block generally includes dish and is repeatedly handled the several steps of storage and transportation.Because characteristic and peaked qualification thereof that dish is accurate, in the entire process process, it is important correctly protecting disk.A purpose of basal disc carrier provides this protection.In addition, because the processing of basal disc is normally carried out automatically, therefore dish must accurately be located with respect to treatment facility, so that the remote control of dish is removed and inserted.Second purpose of basal disc carrier is during transportation to support basal disc reliably.
Carrier is formed at and axially arranges substrate or dish in the groove, and by its periphery or near periphery place's supporting substrate or dish.Substrate or dish can make progress usually or laterally radially leave carrier.Carrier can accessory cover, bottom, or the cover of covering substrate or dish.
For the type and the distinctive part thereof of the carrier of being discussed, multiple properties of materials is useful and useful.
In the process of handling semiconductor chip or disk, the existence of particle and generation bring very serious pollution problem.Pollution is considered to cause the reason of a maximum of semi-conductor industry recovery loss.Because the size of integrated circuit (IC) system constantly reduces, the size of polluting the particle of integrated circuit also diminishes, and makes that the minimization of pollutant is crucial more.The polluter of particulate forms can produce for example friction or the scraping of carrier and substrate or dish, carrier cover or cover, storage support, other carrier or treatment facility by wearing and tearing.One of carrier desired characteristics stops the generation of particle when being wearing and tearing, friction at the plastic forming material and scraping.Publication number is the various characteristics that 5780127 United States Patent (USP) has disclosed this plastic products that are suitable for substrate carrier.This patent is incorporated herein by reference.
Carrier material also should satisfy the minimum volatilization of volatile part, constitutes a kind of pollutant that can destroy substrate and dish because volatile substances can leave carrier.
Carrier material must have enough dimensional stabilitys, and when carrier carried, dimensional stability was to prevent that substrate or adjustment debit are bad and make substrate or dish amount of movement minimum in carrier necessary.The tolerance on fit of the groove of supporting substrate and dish is very little usually, and any deformation energy of carrier directly destroys breaking up of very easily damaging or increases wearing and tearing, so, and when substrate or dish moves into, shifts out or in carrier the time, particle produces.When carrier in the carrying of some directions, for example when carrier during transportation pile up or when its with treatment facility in conjunction with the time, dimensional stability is also quite important.Also should keep its dimensional stability under the high-temperature condition that carrier material may run into when storage and cleaning.
The traditional carrier that is used for semi-conductor industry can form and keep static charging.When the plasticity part of a charging contacted with electronic installation or treatment facility, it may be to be commonly referred to the breakoff phenomenon discharge of Electrostatic Discharge.In addition, can be attracted and keep particle by the carrier of static charging, air particles especially suspends.Static on the carrier can make semiconductor processing equipment close automatically simultaneously.Therefore, expect a kind of carrier especially, to eliminate ESD and to avoid charmed particle with electrostatic dissipation characteristic.
In multiple possible substrate carrier material, trace-metal is a kind of common combined material or residue.When carrying out the selection of carrier material and assembly method, metal pollutant must be considered.Anionic pollutant in the carrier material can pollute and etching problem.
The material that carrier uses also must be consistent on chemical property with any compound that they may run into.Although transportation and storage substrate carrier are not used in chemical purposes, they must anti-cleaning problems, and with the solvent that is generally used for such as isopropyl alcohol.The production carrier is subjected to the restriction of ultra-pure acid and other compound.
In the closed container visibility of substrate be strong expectation and for the terminal user needed.The transparent plastic such as polycarbonate that is applicable to this container is desired, and this plastics cost is low, but does not have desired electrostatic dissipation characteristic and wearing quality.
Other important characteristic comprises the easy of sharp cost of expecting of carrier and material compacting.
Carrier is used usually such as polycarbonate (PC), acrylonitrile butadiene styrene resin (ABS), polypropylene (PP), tygon (PE), the notes compression molding material moulding of perfluoroalkoxy (PFA) and polyetheretherketone (PEEK).
Be filled to and annotate compression molding material so that the filling material of electrostatic dissipation comprises carbon dust or fiber, metal fibre, matel coated graphite and organic additive.
The existing substrate carrier that is used to transport and store is a single press element, it comprises that one has the front end of H type interface portion, one has the rear end of a wallboard, and has the lower curved of groove and ligand plate curvature or the sidewall of contraction section, and has a top and a bottom of opening wide.Just abandoned after H type carrier is often reused several times.During use, carrier cleans in hot water and/or other chemical substance usually, is dried up by hot-air then.Follow cleaning when carrier bears, dry up, transportation and handle carrier and during the high temperature that produces, it is very important characteristic that carrier keeps its shape.
Another existing carrier is one and is configured the box that supports H type carrier.This box is become operation (WIP) box usually.
Another existing carrier is mechanical interface (SMIF) container of a standard, and it comprises a box that covers the H type carrier that connects with treatment facility machinery face hermetically.The SMIF container has the door that open a bottom usually, and the H type carrier of substrate is housed in order to contact.The door that open the also known front portion with contact H type carrier of box.Another kind of known carrier is a kind of transport assembly, and it is a box type cover, comprises the inside shelf of the door that opens a front portion and supporting substrate rather than independent H type carrier.
Should be realized that the ideal material that is used for parts of a carrier is not the ideal material of another parts of same vehicle usually.For example, PEEK is a kind of material that is used for the substrate contact portion with wearing quality, but this material is difficult to compacting, and costs an arm and a leg with respect to other plastics.Therefore, PEEK is not a good selection with respect to other plastics for the polycarbonate that is used for structure division.
It is to suppress different piece separately that the different piece of known disk carriers is used unique example of different materials, then they is assembled in the carrier.The shortcoming that this assembling has brought different part side to contact with face, this shortcoming can cause being difficult to the particle of removing and pollute the generation that collection stays the zone.In addition, assembly process can produce particle.In addition, suppress different parts and with its be assembled in need in the carrier work and the cost.
Substrate carrier is made of the plastic material of two kinds of different fusible processing at least, and these two kinds of plastic materials appropriately are configured to obtain optimal performance, and has one and crossing the hot physical engagement that produces during the mold pressing procedure.The present invention includes the carrier of making by the plastic material of different fusible processing, and comprise the operation of producing this carrier.In an optimum embodiment, H type substrate carrier has one by polycarbonate first structure division that mold pressing forms in first die, to put into second die by the part of polycarbonate mold pressing then, PEEK by injection-molding on H type carrier, to form the substrate contact portion.Production temperature and molding temperature are controlled to provide optimum and engage between different materials.So, the composite material carrier of an one is formed.In another embodiment, the parts of utilization such as support or sidewall support the substrate by two kinds of different plastic mould pressings, and described parts are assemblied in the dish cover (coverture) such as transport assembly.
A feature and advantage of the present invention is to form the carrier with optimum Performance Characteristics with minimum material with the work cost.
The another feature of the specific optimum embodiment of the present invention and advantage are the assemblings that does not need parts, keep using the advantage of two kinds of combinations of materials simultaneously.
The another feature of the specific optimum embodiment of the present invention and advantage are that the carrier or the parts of actual one partly are made of two kinds of plasticity that are embossed in together.
Another feature and advantage of the present invention are that the combination of two kinds of different materials has been eliminated the collection that pollutant or chemical substance may cause and stayed.
Another object of the present invention and feature are the back mold pressing modulation that production process can be cancelled substrate carrier, and this operation was essential in the past, as annealing.
Fig. 1 is according to H type substrate carrier of the present invention;
Fig. 2 represents the mold pressing part excessively of carrier shown in Figure 1;
Fig. 3 is the skeleton view of existing operation (WIP) box;
Fig. 4 is the skeleton view according to WIP box of the present invention and H type carrier;
Fig. 5 is the side view according to WIP box of the present invention;
Fig. 6 is the skeleton view of existing dish conveying arrangement;
Fig. 7 is according to dish conveying arrangement of the present invention;
Fig. 8 is the view of existing transport assembly;
Fig. 9 is and the similar part exploded view according to transport assembly of the present invention shown in Figure 8;
Figure 10 is the skeleton view of composite substrate carrier;
Figure 11 is the part exploded view of carrier shown in Figure 10;
Figure 12 is the skeleton view according to enhancement mode carrier of the present invention;
Figure 13 is the process flow diagram of the inventive method.
Figure 1 shows that a H type carrier, and with label 20 expressions, this carrier is the same with existing H type carrier to have a front portion 22, one rear portion 23, sidewall 24,26, receive the groove 28 of substrate, one top of opening wide 30, and a machine bonding part 32 that is shaped as the H type, each groove is determined in conjunction with tooth 34 by a pile substrate.
Traditional H type substrate carrier also comprises machine composition surface, a bottom 38 except H type machine bonding part, and it has 40 four legs that engage at the turning usually.In addition, comprise that also one is picked up handle 42 and an automatic flange 44 that also plays the effect of machine composition surface automatically.Compound H type carrier has the second mistake mold pressing part 46 that one first base portion 44 and is configured to substrate junction surface 46 usually.In this embodiment, substrate carrier 20 is a single global facility 20.
Mold pressing part 50 excessively shown in Figure 2 does not have the base portion of one, and it comprises substrate junction surface 46 and accessory constituent 52, and this accessory constituent constitutes the flow channel of crossing moulding material that melts in mold pressing procedure.Illustrated this partial reaction cross the structure of mold pressing die.
In optimum embodiment, the plastic material mold pressing cheap, that dimensionally stable is easily molded of support portion or base portion 44 usefulness forms, as polycarbonate or have the polycarbonate of filled with carbon fibers thing.Then cross mold pressing part and form, as PEEK or have the PEEK of carbon filling material by the crystalline material mold pressing of another fusible processing.The institutional framework of these materials is different with treatment temperature.Other is to the institutional framework dissmilarity, and the material with advantage identical with above-mentioned these materials also can use.When amorphous material and crystalline material when molten state contacts, amorphous material polycarbonate and crystalline material PEEK form a hot physical engagement.Joint is considered to that increase by composition surface polymerization glass surface energy forms.Therefore, when the noncrystal melted material of heat and polymerization glass contact, polycarbonate increases the surface energy of polymerization glass, and along with the melted material of heat is cooled, polycarbonate is at surface crystallization.Crystallization process is the reason that causes two kinds of materials to engage by reasoning.Because low specific heat, heat is dissipated to polymerization glass with very slow speed, and therefore the PEEK of the fusing of heat is to increase the less speed cooling of composition surface crystallinity.When this operation was used in injection mould, because steel and polymerization glass specific heat is different, the product of formation had the crystallization degree higher than the composition surface of polymer crystals and steel of smithing quality on the composition surface of polymerization glass and crystal.
In optimum embodiment, polycarbonate, promptly polymerization glass is molded earlier, puts back to injection mould then, so that suppress PEEK on rising.In this course, molding temperature is controlled at below the glass transition temperatures of polycarbonate ideally, and this critical temperature is approximately 149 °, to prevent to destroy the base portion of polycarbonate.Substrate contact portion 50 is properly oriented and its structure makes substrate not contact with polycarbonate.
Another amorphous material with suitable joint is polyesteramide (PEI), and this joint has a chemical bond composition.
The joint that base portion is crossed the mold pressing part comprises dissimilar joint compositions.In the time of can thinking that having served as the mold pressing part contacts with non-melt base portion, hot physical engagement produces.
Accompanying drawing 3-5 discloses a kind of operation box, and with label 60 expressions.This operation box supports a H type substrate carrier 62 usually, and comprises top cover 64, base portion 66 and and base portion 66 joints and position three basic modules thereon.In this embodiment, " carrier " refers to the outer cover box or has the outer cover box of H type carrier.These assemblies can utilize operation and the intrinsic feature and advantage of the present invention to form in crossing mold process.For example, in Fig. 5, top cover can be formed by the polycarbonate mold pressing, crosses the hinge 68 that mold pressing forms by PEEK and is fixed on the top cover 64.In addition, referring to Fig. 4, polycarbonate window 70 can be earlier with the structure of hope and size compacting, insert then in the mould of header field 64, so as around the polycarbonate window the remaining header field of mold pressing.Cross mold pressing highly complete abutment is provided, and need not use bonding agent or mechanical fixed part.
Referring to Fig. 6 and 7, disk transports carrier and generally includes a base portion 76, and top cover 78 and the part 79 that can be shaped easily according to the present invention, this part 79 are to form like this: at first suppress the support portion 82 of base portion 76, then injection compression dish junction surface 84.Support portion 82 can be formed by polycarbonate or similar material, and the dish contact portion can be formed by PEEK or similar material.
Fig. 8 and 9 is a transport assembly that for example is used for 300 millimeters large-scale semiconductor chip.In this special structure, substrate support portion 90 comprises a pedestal 91 with machine junction surface 92, has the plumb post 94 of base sheet rack 96, and a top 98.The substrate splice holder can have one contact with substrate that transport assembly is equipped with cross mold pressing part 99.Machine engages the mold pressing part excessively that also can use a contact arrangement.
Figure 12 shows a structure another embodiment for the substrate carrier of the reinforced carrier of operation, and this carrier is with label 110 expressions.The reinforced carrier of this operation comprises the arm 116 that base portion supports part 112,114 and between extend.Each arm has the tooth 118 of a plurality of formation grooves 120 with supporting substrate in processing procedure.In this certain embodiments, the outside of arm 116 and tooth and being compressed on the basic framework 122 is to realize advantage of the present invention.
Figure 10 and Figure 11 disclose a kind of composite substrate carrier that is made of the assembly 122 of assembling.Assembly 122 comprises sidewall sections 124 and carrier frame 126.Sidewall sections inserts in the framework 126 and engages, thereby constitutes the reliable substrate carrier of an assembling.In addition, an automatic flange or machine junction surface 132 are positioned at carrier rear end 134.In this embodiment, minimize in order to make the particle that produces by the substrate scraping, each sidewall can have mold pressing substrate junction surface 139.Cross and be embossed in than carrying out under the stricter size Control of base portion, so that little substrate tolerance on fit configuration to be provided.
Figure 13 shows the block diagram of realizing method of the present invention.Can be carrier frame or at first such as the base portion or the support section of other carrier part of illustrated sidewall base portion 130 with a mould manufacturing.Put into the same mould that another mould or mould embolus are removed after the base portion compacting.Then mould is closed, and crosses the die that moulding material injects the specific part correspondence that will be crossed mold pressing such as another of PEEK.After this, comprise that base portion and the entire portion of crossing mold pressing portion are removed.If this base portion is an ingredient, then this ingredient is assembled on the carrier 136.
In a specific application, making first injection moulding partly is that to cross the mold pressing partial volume relatively for a short time than second be suitable to base portion.In Another Application, first kind of material is placed on the key position in the mould, and as the substrate contact portion, described material solidifies, and one second support section is embossed on first kind of material, and does not need die change.
In another specific application, second kind of material needs not to be curing, when two kinds of material melts, both can in conjunction with.This common injection compression can not provide the position on the composition surface between accurate first and second parts.But it has been eliminated the demand of additional mould and has made first solidify the step of removing parts and first is placed on second mould from mould.
Without departing from the spirit and substance in the present invention, the present invention can adopt other specific forms, therefore, wishes that present embodiment all is considered to schematically in all fields, rather than restriction; Be the reference of claim, and do not represent scope of the present invention.
Claims (17)
1. cross the mold pressing substrate carrier for one kind, have the groove that a plurality of axial array are used for supporting substrate, described substrate carrier comprises:
A. a base portion that forms by a kind of first thermoplastic, and
B. many substrate contact portions, this part comprised the substrate holder bit position that is embossed in described base portion, and described substrate contact portion is formed by a kind of second thermoplastic, and described contact portion is determined described a plurality of groove, described substrate contact portion and base portion combination.
2. the mold pressing substrate carrier of crossing as claimed in claim 1, it is characterized in that: described substrate carrier is configured to H type substrate carrier.
3. the mold pressing substrate carrier of crossing as claimed in claim 1 is characterized in that: also comprise a container part that covers described substrate.
4. the mold pressing substrate carrier of crossing as claimed in claim 1, it is characterized in that: described base portion comprises polycarbonate, described substrate contact portion comprises polyetheretherketone.
5. cross the mold pressing substrate carrier for one kind, have a plurality of axial array and be used for the groove of supporting substrate, substrate carrier comprises that a low particle of crossing mold pressing generates bonded block, these parts have one and are used to engage and the composition surface of the object that disengaging and described substrate carrier separate, described attachment comprise first base portion that forms by a kind of first moldable plastics and and the described first moldable part engage one second cross the mold pressing part, described second crosses the mold pressing part is formed by a kind of second different moldable plastics, and these plastics have the particle formation characteristic littler than described first.
6. the mold pressing substrate carrier of crossing as claimed in claim 5 is characterized in that: described attachment are to be used for the device engagement part that engages with external unit.
7. the mold pressing substrate carrier of crossing as claimed in claim 5, it is characterized in that: described substrate carrier comprises a plurality of described attachment, and each described attachment is configured to the substrate support support.
8. the mold pressing substrate carrier of crossing as claimed in claim 7 is characterized in that: the door that also comprises a described substrate carrier of sealing.
9. method of producing substrate carrier may further comprise the steps:
A. at a base portion of first kind of plastics of a mould part injection moulding;
B. the described base portion of mold pressing is put into second mould part, and
C. use second kind of plastics to cross contact portion of mold pressing at described base portion.
10. method as claimed in claim 9 is characterized in that: also comprise the step of a kind of polycarbonate resin of fusing as described first kind of plastics.
11. method as claimed in claim 10 is characterized in that: also comprise the step of the resin of one of a kind of polyethererketone of comprising of fusing or polyesteramide as described second kind of plastics.
12. method as claimed in claim 11 is characterized in that: also be included in polyethererketone or polyesteramide both one of add the step of carbon fiber.
13. method as claimed in claim 10 is characterized in that: described polycarbonate has a glass transition temperatures, and comprises the step of temperature below the glass transition temperatures of described polycarbonate that keeps second mould.
14. substrate carrier that comprises an assembly, described assembly comprises that described first and second parts connect by a hot physical engagement by first of a kind of first thermoplastic compacting and by a kind of second thermoplastic injection molded second portion in described first.
15. a method of producing the substrate carrier part comprises:
A. a kind of first thermoplastic is injected a precalculated position of a die to form a first; And
B. inject a kind of second thermoplastic of described first material that contacts to form a second portion that forms the one composite substrate with described first joint.
16. method as claimed in claim 15 is characterized in that: make described first step of curing before also being included in described second thermoplastic of injection.
17. method as claimed in claim 16 is characterized in that: remove described first before also being included in described second thermoplastic of injection, and described first is placed on the step of one second die.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8720598P | 1998-05-28 | 1998-05-28 | |
| US60/087205 | 1998-05-28 | ||
| US09/317989 | 1999-05-25 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100114352A Division CN100556772C (en) | 1998-05-28 | 1999-05-28 | Composite substrate carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1243313A true CN1243313A (en) | 2000-02-02 |
| CN1332392C CN1332392C (en) | 2007-08-15 |
Family
ID=22203725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB991076672A Expired - Lifetime CN1332392C (en) | 1998-05-28 | 1999-05-28 | Composite substrate carrier |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN1332392C (en) |
| TW (1) | TW431998B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100460292C (en) * | 2005-02-24 | 2009-02-11 | 亚洲光学股份有限公司 | Universal carrying device |
| CN113306856A (en) * | 2021-04-27 | 2021-08-27 | 江苏集萃有机光电技术研究所有限公司 | Wafer storage box |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6617433B2 (en) * | 2015-04-17 | 2019-12-11 | 日本電気硝子株式会社 | Glass substrate package |
| US10811291B2 (en) * | 2017-11-08 | 2020-10-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer container and method for holding wafer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4841906A (en) * | 1986-11-12 | 1989-06-27 | Heraeus Amersil, Inc. | Mass transferable semiconductor substrate processing and handling full shell carrier (boat) |
| EP0692817B1 (en) * | 1994-07-15 | 1997-09-24 | Fluoroware, Inc. | Wafer carrier |
| EP0843338A1 (en) * | 1996-11-15 | 1998-05-20 | Upsys | An improved boat for supporting semiconductor wafers |
-
1999
- 1999-05-28 CN CNB991076672A patent/CN1332392C/en not_active Expired - Lifetime
- 1999-05-28 TW TW88108871A patent/TW431998B/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100460292C (en) * | 2005-02-24 | 2009-02-11 | 亚洲光学股份有限公司 | Universal carrying device |
| CN113306856A (en) * | 2021-04-27 | 2021-08-27 | 江苏集萃有机光电技术研究所有限公司 | Wafer storage box |
| CN113306856B (en) * | 2021-04-27 | 2022-08-02 | 江苏集萃有机光电技术研究所有限公司 | Wafer storage box |
Also Published As
| Publication number | Publication date |
|---|---|
| TW431998B (en) | 2001-05-01 |
| CN1332392C (en) | 2007-08-15 |
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Granted publication date: 20070815 |