CN1242137A - Multilayered printed wiring board - Google Patents
Multilayered printed wiring board Download PDFInfo
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- CN1242137A CN1242137A CN 96180569 CN96180569A CN1242137A CN 1242137 A CN1242137 A CN 1242137A CN 96180569 CN96180569 CN 96180569 CN 96180569 A CN96180569 A CN 96180569A CN 1242137 A CN1242137 A CN 1242137A
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- conductor
- bus plane
- wiring board
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- multilayer printed
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Abstract
The objective of the present invention is to provide a multilayered printed wiring board capable of effectively effectively preventing a conductor layer from swelling and adhesive performances between a resin insulating layer and the conductor from falling, which are cause by residual solvents. The present invention provides a multilayered printed wiring board comprising a resin insulating layer and a conductor layer which lap over a base plate, wherein the conductor layer is composed of at least a signal layer and a power supply layer exhibiting a grid-like conductor pattern.
Description
Technical field
The present invention relates to multilayer printed-wiring board, particularly relate to the multilayer printed-wiring board of conductor fig with the bus plane that is provided with in order to power to signals layer.
Background technology
In by interlayer insulating film and the overlapping multilayer printed-wiring board that forms of conductor layer, above-mentioned conductor layer is along with the difference of purposes, and is divided into bus plane, signals layer, screen, makes it functionalization.This conductor fig of wherein above-mentioned bus plane adopts the big full graphics of surface area usually.
On the other hand, the multilayer printed-wiring board that adopts additive process to make is to make like this: alternately be combined in resin insulating barrier and conductor layer on the substrate, by being located at the via hole on the resin insulating barrier, conductivity ground connects each conductor layer, makes multilayer printed-wiring board.Therefore, in the manufacture process of such multilayer printed-wiring board, there is such problem, promptly is arranged on the interlayer insulating film of downside of each conductor layer residual solvent easily.
Such residual solvent for example under the situation of the resin bed that forms gas permeability such as resist on the interlayer insulating film, by the heat treatment of the dried of carrying out in electroplating work procedure etc., is removed evaporate residual solvent, is no problem.
, forming on the interlayer insulating film under the situation of the so airproof metal level of conductor layer, it is extremely difficult by evaporation above-mentioned residual solvent being removed.Especially utilize additive process, when the conductor fig on resin bed in the above-mentioned conductor layer of formation is the bus plane of full graphics, above-mentioned residual solvent is trapped between bus plane and the resin insulating barrier as steam, has the problem that so-called " conductor layer expansion " takes place easily.
And " the conductor layer expansion " that causes like this can destroy the tight contact between resin insulating barrier and the conductor layer, and then causes layer insulation decline.
Therefore, the object of the present invention is to provide a kind of multilayer printed-wiring board that can solve the problems referred to above that residual solvent causes, particularly design a kind of conductor that can prevent and expand, improve effectively the conductor fig of bus plane of the tight contact of resin insulating barrier and conductor.
Disclosure of an invention
Present inventors have carried out wholwe-hearted research towards realizing above-mentioned purpose, and it is the invention of main idea that its result has finished with following content.Promptly
The present invention a kind ofly overlaps the multilayer printed-wiring board that constitutes on the substrate with resin insulating barrier and conductor layer, and it is characterized in that: in the above-mentioned conductor layer that is made of signals layer and bus plane at least, the conductor fig of this bus plane is clathrate.
And in above-mentioned multilayer printed-wiring board, preferably making the width of clathrate conductor of the conductor fig of bus plane is 100 microns～5 millimeters, and the distance between the conductor is 100 microns～10 millimeters.
In addition, in above-mentioned multilayer printed-wiring board, preferably make the curved shape of each corner of the cross section of the conductor fig of bus plane or clathrate conductor.
In addition, the resin insulating barrier that constitutes multilayer printed-wiring board of the present invention preferably constitutes in the heat-resistant resin (or photoresist) of heat-resistant resin Dispersion of Particles in being insoluble in acid or oxidant in acid or the oxidant by dissolving in.Its reason is: the heat-resistant resin particle is removed under the effect of acid or oxidant, makes the surface of such resin insulating barrier become coarse.In addition, if form cancellate bus plane, then platedresist is isolated state by conductor surrounded, peels off easily under this state.In this, if form platedresist on above-mentioned matsurface, even then this platedresist is isolated state, this platedresist also is difficult to peel off, and can guarantee reliability.
The simple declaration of accompanying drawing
Fig. 1 is the process chart that is illustrated in the such bus plane of formation on the multilayer printed-wiring board of the present invention.
Fig. 2 is the process chart that is illustrated in the such bus plane of formation on the existing multilayer printed-wiring board.
The preferred plan of the usefulness that carries out an invention
Multilayer printed-wiring board of the present invention is characterised in that: the conductor fig that forms as the bus plane in the conductor layer is the cancellate point that is of not sticking. Therefore, the solvent that remains in the resin bed below the bus plane can be naturally degassed from the resin part of the non-conductor forming section (between the clathrate conductor fig) that is positioned at bus plane, so can not continue to remain under the bus plane. Its result, the bus plane that as above consists of does not expand, and can improve the close contact of the resin insulating barrier of bus plane and downside.
In addition, the bus plane that existing conductor (full graphics) by sticking consists of forms at its conductor in the situation of resin insulating barrier, in order to ensure the close contact of conductor and resin insulating barrier, has at least necessity that this conductive surface is carried out roughening and processes. This point as described herein, be the bus plane that clathrate is provided with conductor fig, because there is resin bed in the non-conductor forming section (between the clathrate conductor fig) at bus plane, do not process so do not carry out roughening in this part, be adhering state between the resin insulating barrier on upper strata and the resin. This is the tightening degree that is better than (between the different materials) between resin and the metal owing to the tightening degree of (between the commaterial) between resin and the resin. And above-mentioned bus plane is a kind of like this structure, i.e. resin part and clathrate conductor part concave-convex surface attitude repeatedly, and be concavo-convex chimerism with the resin insulating barrier on upper strata and bond together. Its adhesive strength is much firm. Its result, the close contact between the bus plane on the multilayer printed-wiring board of the present invention and the resin insulating barrier on upper strata significantly improves.
In such multilayer printed-wiring board of the present invention, the conductor fig of bus plane preferably consists of like this: the width of its clathrate conductor is 100 microns～5 millimeters, and the distance between the conductor is 100 microns～10 millimeters. Its reason is if all less than 100 microns, then because the restriction on making is difficult to form such figure. On the other hand, if conductor width is greater than 5 millimeters, then the residual solvent in the resin bed below the conductor be difficult to degassed, if the distance between the conductor is greater than 10 millimeters, the area that then plays the conductor of power supply effect significantly reduces, the result so that the electrical characteristic of bus plane degenerate.
The conductor fig of bus plane, the best curved shape of each corner of the cross section of clathrate conductor in other words. That is, preferably make the curved shape of each corner of each interconnection part. That is, round and smooth processing is partly carried out in each interconnection, made it be simple and direct circle or ellipse. Its reason is: by carrying out so round and smooth processing, the resin bed of the non-conductor forming section (between the clathrate conductor fig) that can stop stress to concentrate on to be present in bus plane, be platedresist (permanent resist) upper (particularly when thermal cycle, occuring easily), can prevent resist generation crackle.
Below, specifically describe the conductor fig of the bus plane that constitutes multilayer printed-wiring board of the present invention with embodiment.
(embodiment 1)
In the present embodiment, the following bus plane that constitutes multilayer printed-wiring board that formed.
At first, on substrate 1, form the interlayer insulating film 2 that constitutes by heat stable resin (PES), make the surface roughening of this interlayer insulating film 2, make its matsurface that is the JIS-B0601Rz=6 micron (with reference to Fig. 1 (1)) with liquor potassic permanganate.In addition, the thickness through this interlayer insulating film 2 behind the roughening is 35 microns.
Secondly, on above-mentioned layer insulation laminar surface, print the figure (with reference to Fig. 1 (2)) of the desirable permanent resist (epoxy resin series) 3 corresponding with the conductor fig of bus plane, by carrying out electroless plating copper, formed bus plane 4 (with reference to Fig. 1 (3)) with clathrate conductor fig.The trellis of this bus plane 4 along conductor width/resist width=250 of X-axis, Y direction micron/250 microns.
(embodiment 2)
In the present embodiment, the following bus plane that constitutes multilayer printed-wiring board that formed.
At first, on substrate 1, form the interlayer insulating film 2 that constitutes by heat stable resin (PES-epoxy resin series), make the surface roughening of this interlayer insulating film 2, make its matsurface that is JIS-B0601 Rz=6 micron (with reference to Fig. 1 (1)) with liquor potassic permanganate.In addition, the thickness through this interlayer insulating film 2 behind the roughening is 35 microns.
Secondly, on above-mentioned layer insulation laminar surface, print the figure (with reference to Fig. 1 (2)) of the desirable permanent resist (epoxy resin series) 3 corresponding with the conductor fig of bus plane, by carrying out electroless plating copper, formed bus plane 4 (with reference to Fig. 1 (3)) with clathrate conductor fig.The trellis of this bus plane 4 along conductor width/resist width=5 of X-direction millimeter/10 millimeters, along conductor width/resist width=250 of Y direction micron/250 microns.
(embodiment 3)
In the present embodiment, the following bus plane that constitutes multilayer printed-wiring board that formed.
At first, on substrate 1, form the interlayer insulating film 2 that constitutes by heat stable resin (PES-epoxy resin series), make the surface roughening of this interlayer insulating film 2, make its matsurface that is JIS-B0601 Rz=6 micron (with reference to Fig. 1 (1)) with liquor potassic permanganate.In addition, the thickness through this interlayer insulating film 2 behind the roughening is 35 microns.
Secondly, on above-mentioned layer insulation laminar surface, print the figure (with reference to Fig. 1 (2)) of the desirable permanent resist (epoxy resin series) 3 corresponding with the conductor fig of bus plane, by carrying out electroless plating copper, formed bus plane 4 (with reference to Fig. 1 (3)) with clathrate conductor fig.The trellis of this bus plane 4 along conductor width/resist width=250 of X-axis, Y direction micron/250 microns.At this moment, slick and sly processing has been carried out at 4 turnings of each grid face of being surrounded by conductor fig respectively.
(comparative example 1)
In this comparative example, the following bus plane that constitutes multilayer printed-wiring board that formed.
At first, on substrate 1, form the interlayer insulating film 2 that constitutes by heat stable resin (PES-epoxy resin series), make the surface roughening of this interlayer insulating film 2, make its matsurface that is JIS-B0601 Rz=6 micron (with reference to Fig. 2 (1)) with liquor potassic permanganate.In addition, the thickness through this interlayer insulating film 2 behind the roughening is 35 microns.
Secondly, on above-mentioned layer insulation laminar surface, print the figure (with reference to Fig. 2 (2)) of the desirable permanent resist (epoxy resin series) 3 corresponding with the conductor fig of bus plane, by carrying out electroless plating copper, formed the bus plane 4 (with reference to Fig. 2 (3)) of full graphics.This full graphics is the conductor fig of the bus plane 4 in the existing multilayer printed-wiring board, its size be 20 millimeters square.
(comparative example 2)
In this comparative example, the following bus plane that constitutes multilayer printed-wiring board that formed.
At first, on substrate 1, form the interlayer insulating film 2 that constitutes by heat stable resin (PES-epoxy resin series), make the surface roughening of this interlayer insulating film 2, make its matsurface that is JIS-B0601 Rz=6 micron (with reference to Fig. 2 (1)) with liquor potassic permanganate.In addition, the thickness through this interlayer insulating film 2 behind the roughening is 35 microns.
Secondly, on above-mentioned layer insulation laminar surface, print the figure (with reference to Fig. 2 (2)) of the desirable permanent resist (epoxy resin series) 3 corresponding with the conductor fig of bus plane, by carrying out electroless plating copper, formed bus plane 4 (with reference to Fig. 2 (3)) with cancellate conductor fig.The trellis of this bus plane 4 along conductor width/resist width=50 of X-axis, Y direction micron/50 microns.
(comparative example 3)
In this comparative example, the following bus plane that constitutes multilayer printed-wiring board that formed.
At first, on substrate 1, form the interlayer insulating film 2 that constitutes by heat stable resin (PES-epoxy resin series), make the surface roughening of this interlayer insulating film 2, make its matsurface that is JIS-B0601 Rz=6 micron (with reference to Fig. 2 (1)) with liquor potassic permanganate.In addition, the thickness through this interlayer insulating film 2 behind the roughening is 35 microns.
Secondly, on above-mentioned layer insulation laminar surface, print the figure (with reference to Fig. 2 (2)) of the desirable resist (epoxy resin series) 3 corresponding with the conductor fig of bus plane, by carrying out electroless plating copper, formed bus plane 4 (with reference to Fig. 2 (3)) with cancellate conductor fig.The trellis of this bus plane 4 along conductor width/resist width=10 of X-axis, Y direction millimeter/300 microns.
Various bus planes to such formation have carried out reliability tests such as outward appearance observation, TCT test (cold-resistant thermal shock test), adhesive strength test.It is the results are shown in table 1.
[table 1]
| Conductor density/distance between conductors (mm/mm) | ???? *Have or not expansion after 1 electroplating processes | ?????? *2 TCT test | ??? *The test of 3 adhesive strengths | ||
| X-direction | | ||||
| Embodiment | |||||
| 1 | ??0.25/0.25 | ???0.25/0.25 | Do not have | After 900 circulations | ???○ |
| | ????5/10 | ???0.25/0.25 | Do not have | After 700 circulations | ???○ |
| | ??0.25/0.25 | ???0.25/0.25 | Do not have | More than 1000 circulations | ???○ |
| Comparative example 1 | No grid | No grid | Have | More than 1000 circulations | ???× |
| Comparative example 2 | ??0.05/0.05 | ???0.05/0.05 | Do not have | After 800 circulations | ???× |
| Comparative example 3 | ??15/0.30 | ???15/0.30 | Have | After 800 circulations | ???× |
*1: have or not expansion after the electroplating processes: check by visual.
*2:TCT test: the time that when-65 ℃ → 125 ℃ cold cycling, on resist, cracks.
*3: the adhesive strength test: dipping is after one hour in the water of boiling with substrate, and whether dipping is 30 seconds in 180 ℃ scolding tin solution, estimate at this moment to expand between conductor layer-insulating barrier.Zero expression does not have expansion, and * expression has expansion.
From the result shown in this table as can be known, bus plane with clathrate conductor fig of the present invention is owing to can be easily remove the residual solvent in the resin bed below the conductor, so when dry (for example in the electroplating processes operation) " expansion " can not take place when carrying out high-temperature process in the operation afterwards.And, if make the curved shape of each corner of the cross section in the clathrate conductor fig of bus plane, then in the TCT test, do not crack on the resist, confirm to improve cold-resistant thermal shock resistance properties.
Different therewith, the bus plane of the full graphics shown in the comparative example 1 since the residual solvent in the resin bed below the conductor can not remove fully, so when carrying out high-temperature process in the operation afterwards, observed " expansion ".
In addition, the bus plane that conductor width shown in the comparative example 2 and resist width all have narrow trellis, because the resist figure is fine,, reduced the adhesive property of the interlayer insulating film below conductor so form the development vestiges that resist takes place part easily at conductor fig.And the bus plane shown in the comparative example 2 must be provided with width than (conductor width) big contact zone, grid interval, so design is complicated from the upper strata to the coupling part of lower floor.
In addition, the conductor width of the trellis of the bus plane shown in the comparative example 3 is bigger than preferable range of the present invention, because the residual solvent in the resin bed below the conductor can not be removed fully, so when carrying out high-temperature process in the operation afterwards, observed " expansion ".
The possibility of industrial utilization
As mentioned above, if employing the present invention, then owing to make the conductor fig that forms as the bus plane in the conductor layer be the clathrate of not sticking, so can prevent the expansion of conductor layer, a kind of multilayer printed-wiring board of bus plane of the adhesive property that can effectively improve resin insulating barrier and conductor can be provided.
If adopt in addition the present invention, then owing to make the curved shape of each corner of the cross section in the clathrate conductor fig of above-mentioned bus plane, so can prevent because the concentrated crackle that causes of the platedresist between the clathrate conductor fig (permanent resist) upper stress.
Claims (3)
1. one kind overlaps the multilayer printed-wiring board that constitutes on the substrate with resin insulating barrier and conductor layer, and it is characterized in that: in the above-mentioned conductor layer that is made of signals layer and bus plane at least, the conductor fig of this bus plane is clathrate.
2. multilayer printed-wiring board according to claim 1 is characterized in that: in the conductor fig of bus plane, the width of clathrate conductor is 100 microns～5 millimeters, and the distance between the conductor is 100 microns～10 millimeters.
3. multilayer printed-wiring board according to claim 1 is characterized in that: in the conductor fig of bus plane, and the curved shape of each corner of the cross section of clathrate conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB961805692A CN1168360C (en) | 1996-12-13 | 1996-12-13 | Multilayered printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB961805692A CN1168360C (en) | 1996-12-13 | 1996-12-13 | Multilayered printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1242137A true CN1242137A (en) | 2000-01-19 |
| CN1168360C CN1168360C (en) | 2004-09-22 |
Family
ID=5128000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB961805692A Expired - Lifetime CN1168360C (en) | 1996-12-13 | 1996-12-13 | Multilayered printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1168360C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323140A (en) * | 2018-01-24 | 2018-07-24 | 中山国安火炬科技发展有限公司 | A kind of electromagnetic shielding film and its preparation method and application |
| US11019758B2 (en) | 2017-09-15 | 2021-05-25 | Henan Guoan Electronic Material Co., Ltd. | Electromagnetic shielding film and preparation method therefor |
-
1996
- 1996-12-13 CN CNB961805692A patent/CN1168360C/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11019758B2 (en) | 2017-09-15 | 2021-05-25 | Henan Guoan Electronic Material Co., Ltd. | Electromagnetic shielding film and preparation method therefor |
| CN108323140A (en) * | 2018-01-24 | 2018-07-24 | 中山国安火炬科技发展有限公司 | A kind of electromagnetic shielding film and its preparation method and application |
| WO2019144564A1 (en) * | 2018-01-24 | 2019-08-01 | 河南国安电子材料有限公司 | Electromagnetic wave shielding film, manufacturing method therefore, and use thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1168360C (en) | 2004-09-22 |
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