CN1238537A - Surface mounting type coil unit - Google Patents
Surface mounting type coil unit Download PDFInfo
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- CN1238537A CN1238537A CN99107803A CN99107803A CN1238537A CN 1238537 A CN1238537 A CN 1238537A CN 99107803 A CN99107803 A CN 99107803A CN 99107803 A CN99107803 A CN 99107803A CN 1238537 A CN1238537 A CN 1238537A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The surface mounted type coil member of the invention includes a frame portion for coil winding and a core made of ferrite material which forms integral with the frame portion and is configured to extend from two ends in longitudinal direction of the frame portion, and several external electrodes directly mounted at projecting edge of the core, and a coil made of insulation coating wire whose two ends are respectively conductive connected to external electrode and which is winded at the frame portion on the core.
Description
The present invention relates to be applicable to that lift-launch is in the structure such as surface mounting type coil unit on the circuit substrate of the mixed integrated circuit assembly of DC-DC converter etc., ultrathin typeization, the particularly structure of the conduction joint portion between direct assembly type outer electrode of core body and end winding.
In recent years along with lightness, slimming and miniaturization such as the electronic apparatus of portable data assistance etc., adopting so-called mixed integrated circuit assembly (originally being also referred to as modular circuit) more and more, be about to constitute the integrated circuit electronic unit of capacitor that the winding-type assembly circuit of DC-DC converter etc. uses, transmitter, converter etc., be surface mounted in to high-density on the circuit substrate.
In described this mixed integrated circuit assembly, each electronic unit needs miniaturization, low typeization certainly, particularly more needs to make its low typeization for the bigger coil component of aspect ratio (such as converter, filter, choking-winding etc.).
Analyze from this point, the structure of existing surface mounting type coil unit can be shown in the stereogram among Fig. 8, promptly being a kind of including has the coil that is the square shape and twines to twine to extend with the place, two ends of the longitudinal direction of frame section 14 with frame section 14 (shown in the dotted line among Fig. 8) with by this coil and be provided with, twine the flange part 13 that forms as one with frame section 14 with this coil, 13 core body 15, described flange part 13 on described core body 15,13 end face and place, bottom surface are formed with the direct assembly type outer electrode 21 of several core bodys of electrode zone, 21 ..., and by being wrapped in coil on the described core body twines with frame section 14 places, two end respectively be arranged on described flange part 13, the outer electrode 21 at 13 places, 21 ... on flange part end face 13a, the mounted on surface code converter 30 of the coil 19 that the insulation cover type lead that electrode zone 28 conductions of 13b are connecting (such as being polyurethane covering copper cash and polyester covering copper cash etc.) constitutes.
The outer electrode 21 with the direct assembly type of described core body ... mounted on surface code converter 30 in the core body 15 that uses, can by have the high impedance rate, make such as the material of nickel zinc class ferrite or MnZn class ferrite etc., so that outer electrode 21 directly can be assembled thereon.
Described outer electrode 21 can form by the printing mode, such as the conductive paste slurry of silvery cream slurry etc., or additional soldering tin material coating or tin system coating etc. are arranged thereon.Normally be connected on these outer electrodes 21, and after implementing the conduction connection, the surface of conduction joint portion 41 will be in exposed state by the end conduction of solder bond mode with coil 19.
In order to make the further miniaturization of aforesaid surface mounting type coil unit, low typeization, also need as in the presentation surface installation coil parts 30, it is shown in Figure 9 to be positioned at the part enlarged drawing that the binding site of 10 of outer electrode 21 and circuit substrates uses, make electrode land 11 and the installation in the direct assembly type outer electrode 21 of core body on the circuit substrate 10 before installing with electrode surface (bottom surface side of outer electrode) 21 ' with to be positioned at the distance of 41 of the conduction joint portions the end of coil 19 located extremely approaching, and this also will make it and the coil winding that is wrapped on the core body of attitude in extension of shape is quite approaching with the distance between the coil curled portion S of the coil 19 at frame section place.
Therefore, for described surface mounting type coil unit 30 being installed under the situation on the circuit substrate 10 by modes such as soft heat welded and installed, when the solder(ing) paste slurry at 11 places, electrode land on being coated in circuit substrate 10 in advance produces fusing, the soldering tin material of this fusing will be soaked to being positioned at coil winding with 19 places of the coil on the frame section with electrode surface 21 ' by the installation in the outer electrode 21 by conduction joint portion 41 always, thereby have the problem that nappe (shown in the region D among Fig. 9) on the insulation cover type lead at coil curled portion S place is easy to generate fire damage.This also might further cause coil 19 to be short-circuited or coil between the problem that descends of dielectric voltage withstand, thereby damaged trustworthiness as mixed integrated circuit assembly goods.
And; the cry of environment in recent years protection grows to even greater heights; also begin to adopt lead-free soldering tin material in electronic industry circle; from now on when the circuit substrate of mixed integrated circuit assembly etc. is implemented the soft heat welded and installed; must progressively replace leaded soldering tin material with so-called Pb-free solder material (such as account for 96 weight % by tin, all the other 4 weight % constitute for the mixture of silver, bismuth or copper, its fusion temperature is approximately 220 ℃ material).
Yet, the fusion temperature of described Pb-free solder material is than the fusion temperature height of leaded soldering tin material, so on circuit substrate, carry out in the operation process of soft heat welded and installed in enforcement, the heat that the soft heat soldering tin material produces tends to make the eutectic welding tin material at the place, conduction joint portion between direct assembly type outer electrode of the core body that is arranged in surface mounting type coil unit and end winding to melt once more, is caused new problems such as loose contact easily by the disengagement of outer electrode place thereby end winding may occur.
The present invention is exactly the invention that addresses the above problem usefulness, first purpose of the present invention is exactly will be when implementing the soft heat welded and installed for the circuit substrate of the surface mounting type coil unit of the outer electrode with the flange part place that directly is assemblied on the ferrite material core body, can in case positive melting tin material soak to coil, thereby improve the trustworthiness of relevant coil short and dielectric voltage withstand aspect; Second purpose of the present invention is exactly will prevent from owing to the soft heat heat of soldering tin material the soldering tin material at place, conduction joint portion to be melted once more, and then end winding is thrown off and the problem of generation bad connection by the outer electrode place; The 3rd purpose of the present invention is exactly further to improve the trustworthiness of the mixed integrated circuit assembly that is equipped with surface mounting type coil unit by this constituted mode.
In order to realize above-mentioned purpose, the invention provides:
(1) a kind of surface mounting type coil unit, it comprise have coil twine with frame section and by this coil twine with the place, two ends of the longitudinal direction of frame section extend be provided with, and the ferrite material core body of the flange part that forms as one with frame section of this coil winding, directly be assemblied in several outer electrodes at the flange part place on the described ferrite material core body, and twine the coil that constitutes with the insulation cover type lead frame section place, that two end is being connected with described outer electrode conduction respectively by the coil that is wrapped on the described ferrite material core body.
Outer surface place on the conduction joint portion between described outer electrode and end winding also is formed with the thin layer that has lower soldering tin material wetting quality than the installation on the described outer electrode with electrode surface.
(2) a kind of surface mounting type coil unit, it comprise have coil twine with frame section and by this coil twine with the place, two ends of the longitudinal direction of frame section extend be provided with, and the ferrite material core body of the flange part that forms as one with frame section of this coil winding, directly be assemblied in several outer electrodes at the flange part place on the described ferrite material core body, and twine the coil that constitutes with the insulation cover type lead frame section place, that two end is being connected with described outer electrode conduction respectively by the coil that is wrapped on the described ferrite material core body.
Externally the surface of electrode also is formed with conductivity plating film, and also is formed with thin oxide layer in the surface of the conductivity plating film that is positioned at conduction between described end winding and described outer electrode, close joint portion.
(3) a kind of surface mounting type coil unit, it comprise have coil twine with frame section and by this coil twine with the place, two ends of the longitudinal direction of frame section extend be provided with, and the ferrite material core body of the flange part that forms as one with frame section of this coil winding, directly be assemblied in several outer electrodes at the flange part place on the described ferrite material core body, and twine the coil that constitutes with the insulation cover type lead frame section place, that two end is being connected with described outer electrode conduction respectively by the coil that is wrapped on the described ferrite material core body.
Described outer electrode is configured in the peripheral side place on the flange part of described ferrite material core body, its surface has soldering tin material plating thin layer or tin system plating thin layer, but also is formed with the conduction joint portion covering thin layer that use, that include electroconductive stuffing that is covered with on the insulation covering lead that combines with described outer electrode conduction.
(4) a kind of surface mounting type coil unit, it comprise have coil twine with frame section and by this coil twine with the place, two ends of the longitudinal direction of frame section extend be provided with, and the ferrite material core body of the flange part that forms as one with frame section of this coil winding, directly be assemblied in several outer electrodes at the flange part place on the described ferrite material core body, and twine the coil that constitutes with the insulation cover type lead frame section place, that two end is being connected with described outer electrode conduction respectively by the coil that is wrapped on the described ferrite material core body.
Described outer electrode is configured in the peripheral side place on the flange part of described ferrite material core body, and its surface also has copper plating thin layer or nickel system plating thin layer.
(5) a kind of surface mounting type coil unit of as above-mentioned (4) record, its also externally the surface of copper plating thin layer on the electrode or nickel system plating thin layer add and be formed with antirust covering thin layer.
(6) a kind of surface mounting type coil unit of as above-mentioned (4) record, also externally the surface of copper plating thin layer on the electrode or nickel system plating thin layer is additional is formed with the golden plating thin layer of making for it.
(7) a kind of mixed integrated circuit assembly is carrying the surface mounting type coil unit as circuit element on circuit substrate.
Embodiment to surface mounting type coil unit of the present invention describes below with reference to accompanying drawing.
Fig. 1 (a) is the part enlarged side view of the structure at claim 1 near zone place, conduction joint portion structure, that be arranged in the mounted on surface code converter in representing according to the present invention;
The phantom that state when Fig. 1 (b) is installed in it on circuit substrate for expression is used;
Fig. 2 (a) is the part enlarged side view of the structure at claim 2 near zone place, conduction joint portion structure, that be arranged in the mounted on surface code converter in representing according to the present invention;
The phantom that state when Fig. 2 (b) is installed in it on circuit substrate for expression is used;
Fig. 3 (a) is the amplification view of the cross-section structure at claim 3 near zone place, conduction joint portion structure, that be arranged in the mounted on surface code converter in representing according to the present invention;
Fig. 3 (b) is the amplification view of the cross-section structure at claim 4 near zone place, conduction joint portion structure, that be arranged in the mounted on surface code converter in representing according to the present invention;
Fig. 4 (c) is the amplification view of the cross-section structure at claim 5 near zone place, conduction joint portion structure, that be arranged in the mounted on surface code converter in representing according to the present invention;
Fig. 4 (d) is the amplification view of the cross-section structure at claim 6 near zone place, conduction joint portion structure, that be arranged in the mounted on surface code converter in representing according to the present invention;
Fig. 5 (a) for explanation according to the present invention in outer electrode in the mounted on surface code converter of claim 3 structure combine the process flow chart that operation is used with conduction between end winding;
The process flow chart that Fig. 5 (b) uses for the same operation in the mounted on surface code converter of claim 4 structure in illustrating according to the present invention;
Fig. 6 (c) for explanation according to the present invention in outer electrode in the mounted on surface code converter of claim 5 structure combine the process flow chart that operation is used with conduction between end winding;
The process flow chart that Fig. 6 (d) uses for the same operation in the mounted on surface code converter of claim 6 structure in illustrating according to the present invention.
Fig. 7 has the stereoscopic figure that the embodiment of mounted on surface code converter of direct assembly type outer electrode constructed according to the invention uses for expression.
The stereogram that Fig. 8 uses for expression mounted on surface code converter existing, that have direct assembly type outer electrode.
Fig. 9 is outer electrode and link position between the circuit substrate part enlarged diagram used of expression in the existing surface mounting type coil unit.
Surface mounting type coil unit of the present invention can be parts such as converter, choking-winding, filter, because these parts are except outer electrode number and coil number are different, have identical structure, be illustrated as typical embodiment so only get the mounted on surface code converter at this.
The mounted on surface code converter of claim 1 structure is a kind of mounted on surface code converter 50 as shown in Figure 7 in according to the present invention, it comprises that having coil twines to twine to extend with the place, two ends of the longitudinal direction of frame section 31 with frame section 31 (shown in the dotted line among the figure) with by this coil and be provided with, twine the flange part 32 that forms as one with frame section with this coil, 33 ferrite material core body 35, directly be assemblied in several outer electrodes 8 at the flange part place on the described ferrite material core body 35, and by being wrapped in coil on the described ferrite material core body 35 twines with frame section 31 places, the coil 39 that the insulation cover type lead that two end is being connected with described outer electrode 8 conductions respectively constitutes, shown in Fig. 1 (a), be positioned at the outer surface place on the conduction joint portion 51 between the end of described outer electrode 8 and coil 39, also be formed with than the substrate on the described outer electrode 38 and install with surperficial 8 " have a thin layer 43 (shown in the hatched example areas among the figure) of lower soldering tin material wetting quality.
By adopting the outer surface place on conduction joint portion 51 to dispose aforesaid, the mode of the thin layer 43 that the soldering tin material wetting quality is low, just can be shown in Fig. 1 (b), in the process that by modes such as soft heat welded and installed it is installed in such as the circuit substrate 10 of mixed integrated circuit assembly etc., when forming melting tin material 12 when the fusing of the slurry of the solder(ing) paste on the electrode land 11 that is positioned at circuit substrate 10 places, substrate on the described outer electrode 8 is installed with surface 8 " (bottom surface side) will be melted soldering tin material 12 and fully soak; thus be in the state of combination of can conducting electricity well; and be covered with by the low thin layer 43 of soldering tin material wetting quality; soak, thereby can prevent that molten solder material 12 from soaking to coil curled portion S by conducting electricity joint portion 51 always so be difficult to be melted soldering tin material 12 in the end and the conduction joint portion 51 between the outer electrode 8 of coil 39.
If be exactly specifically, the low thin layer 43 of described soldering tin material wetting quality is melted soldering tin material 12 and soaks soldering tin material wetting quality usefulness, low-down owing to need have to stop, so preferably adopt by the synthetic resin thin layer that constitutes such as epoxy resin, fluoride resin etc., by the harden coating that constitutes such as borosilicate acids glass cream slurry etc., or the thin resin layer etc. that includes the conductive filling of silver etc. is implemented to make.
The mounted on surface code converter of claim 2 structure in according to the present invention, shown in Fig. 2 (a), promptly externally the surface of electrode 18 also is formed with conductivity plating film 47, and 18 of the end that is positioned at described coil 39 and described outer electrodes, near the surface of the conductivity plating film 47 at the position of conduction joint portion 51, also be formed with thin oxide layer 48.
Be positioned on the described outer electrode 18, by by to implement the surface of the silvery electrode thin layer 46 that coating, sintering processing form such as silvery cream slurry etc., also be formed with to constitute by nickel, zinc or copper etc., thickness be several microns to tens of microns, as the plating thin layer of described conductivity plating film 47 uses.
And, combine by the thermo-compressed mode in the conduction of 18 of end winding and outer electrodes and to implement, implement this in conjunction with the time heat (500～600 ℃) can make outer surface on the described conductivity plating film 47, that be positioned at conduction 51 vicinity, joint portion produce oxidation, and then form thin oxide layer 48.
The characteristic that has the wetting quality that makes soldering tin material bad (promptly reducing) owing to the surface of the plating film-type thin oxide layer that constitutes by nickel, zinc or copper etc., so the effect of thin layer in the surf zone of this thin oxide layer 48 and the claim 1, that the soldering tin material wetting quality is low is similar, promptly at the shielding wall that when circuit substrate 10 is implemented to install by modes such as soft heat welded and installed, can be used as melting tin material 12.
Therefore when circuit substrate 10 is implemented the soft heat welded and installed, the substrate that melting tin material 12 will easily be immersed on the outer electrode 18 is installed with surface 18 " side; thus can realize good combination; and this melting tin material 12 can not soak to 51 places, conduction joint portion that are positioned at 18 of coil 39 and outer electrodes, is immersed into coil curled portion S so can prevent it again by conducting electricity joint portion 51.
As mentioned above, if adopt this structure of the direct assembly type outer electrode of core body in the surface mounting type coil unit of the present invention, owing to be formed with the lower surf zone of soldering tin material wetting quality in conduction joint portion and vicinity thereof, so when implementing welded and installed in the electrode land on circuit substrate, the melting tin material can not soak to the coil curled portion, thereby can prevent that coil from producing fire damage, and then can improve the trustworthiness of the dielectric voltage withstand between relevant coil short and coil.And be understood that, when with of the present invention, when carrying on the mixed integrated circuit assembly, can improve the installation trustworthiness of these parts significantly as the surface mounting type coil unit of mounted on surface code converter etc.
And, the mounted on surface code converter 60 of claim 3 structure is also shown in Fig. 3 (a) among the present invention, promptly can also be as required the surface of the silvery electrode thin layer 52 on the electrode 8A externally, be formed with soldering tin material plating thin layer by not shown nickel system plating bottom and (such as be tin/plumbous cocrystallizing type soldering tin material plating thin layer, its fusion temperature is about 180 ℃) or tin system plating thin layer (fusion temperature is 230 ℃) 53, but also be formed with the surface usefulness that covers the conduction joint portion 51 that is positioned at the end winding place, the covering thin layer 55 that includes electroconductive stuffing.
Conduction joint portion 51 between end winding in the aforesaid mounted on surface code converter 60 and outer electrode part 8A ' can be with reference to the process flow chart shown in the figure 5 (a), constitute by following manner, i.e. (1) flange part 33 places printing on the ferrite material core body is coated with and applies silvery cream slurry (10～100 microns), (2) utilize sintering circuit to form silvery electrode thin layer 52, (3) form soldering tin material plating thin layer or tin system plating thin layer 53 by nickel system plating bottom (not shown) when needed, (4) the end winding conduction that will reel by thermo-compressed (500～600 ℃) mode is combined in outer electrode part 8A ' and locates, and (5) form the surface that is covered with this conduction joint portion 51 by the printing application pattern subsequently again, the covering thin layer 55 that includes electroconductive stuffing.
By the section of the conduction joint portion shown in Fig. 3 (a) as can be known; integral body is covered with the protective layer that conduction covering thin layer 55 joint portion 51, that include electroconductive stuffing becomes one deck housing shape; thereby conduction joint portion 51 is not directly exposed to the open air under the soft heat state; so even its inner soldering tin material plating thin layer or tin system plating thin layer 53 take place softening; also can hinder end winding and produce disengaging, move, thereby can make it remain on the conduction bonding state.
If for instance, include electroconductive stuffing covering thin layer 55 can for include such as gold, silver etc., as the thin resin layer of the conductive metal powder of conductivity packing material (filler), also can be for such as Ag: the cold coating that contains silver of resin=90: 10 (weight %) etc.Its thickness t preferably is taken as 20 microns～30 microns.And the fusion temperature of described, as to include electroconductive stuffing covering thin layer 55 is certainly than the temperature height of unleaded type soldering tin material when implementing the soft heat installation.
Unleaded type soldering tin material is being implemented the end winding at 51 places, described conduction joint portion can be remained the another kind of structure constituted mode that bonding state is used when soft heat is installed, can be for shown in Fig. 3 (b), the mounted on surface code converter 70 of claim 4 structure in according to the present invention, lower soldering tin material plating thin layer of fusion temperature or tin system plating thin layer 53 promptly no longer are set, but utilize fusion temperature than higher copper plating thin layer or nickel system plating thin layer 63 as the plating thin layer on the outer electrode 8B, and then pass through thermo-compressed (500～600 ℃) mode this end winding is implemented combination, so just can no longer contain soldering tin material and the tin material that is easy to melt at conduction 51 places, joint portion.
Therefore implementing the soft heat welded and installed to circuit substrate (when implementing high temperature soft heat welded and installed, peak temperature can reach about 260 ℃) time, even directly expose to the open air under the soft heat state conduction joint portion 51, it is softening that copper plating thin layer or nickel system plating thin layer 63 are produced, so still can remain on the conduction bonding state.
Conduction joint portion 51 between end winding in the aforesaid mounted on surface code converter 70 and outer electrode part 8B ' can be with reference to the process flow chart shown in Fig. 5 (b), constitute by following manner, i.e. (1) flange part place printing on the ferrite material core body is coated with and applies silvery cream slurry (10～100 microns), (2) utilize sintering circuit to form silvery electrode thin layer 52, (3) formation is as the copper plating thin layer or the nickel system plating thin layer 63 of plating thin layer, and (4) implement combination by thermo-compressed (500～600 ℃) mode to the end winding of reeling.
Yet the outer electrode that has on the other hand, described copper plating thin layer or nickel system plating thin layer 63 has its surface through the oxidized problem of certain hour meeting.Promptly pass through after the certain hour, can form the surface oxidation film at the copper plating thin layer at the bottom side place that is positioned at the outer electrode 8B of solder bond on circuit substrate or the surface of nickel system plating thin layer 63, thereby make the soldering tin material and the soldering tin material wetting quality between outer electrode 8B (bottom side) of the preparation enforcement welding usefulness on the circuit substrate bad, and then can produce in conjunction with bad this new problem.
For adopt shown in Fig. 4 (c), the mounted on surface code converter 80 of claim 5 among the present invention, promptly for adopting the copper plating thin layer among the electrode 8C externally or the also additional situation that is formed with antirust covering thin layer 73 in surface of nickel system plating thin layer 63, just contacting between the surface of air and copper plating thin layer or nickel system plating thin layer 63 can be blocked, describedly the problem of oxidation (rustization) can be produced through certain hour thereby can solve.
If for instance, this antirust covering thin layer 73 can be by it being immersed in such as the mode of implementing antirust processing in the solution such as alkyl benzimidazole/copper ion the cover film of formation.
Solve aforesaid, can produce another kind of solution that problem of oxidation uses shown in Fig. 6 (d) through certain hour, it is the mounted on surface code converter 90 of claim 6 structure among the present invention, be that externally the copper plating thin layer among the electrode 8D or the surface of nickel system plating thin layer 63 do not form antirust covering thin layer 73, but form gold system plating thin layer 83, this also can obtain identical rust-proof effect, and, also can obtain good soldering tin material wetting quality when the soft heat welded and installed is implemented in the surface of the bottom surface side of copper plating thin layer or nickel system plating thin layer 63.
As mentioned above, the structure of the direct assembly type outer electrode of the core body in the surface mounting type coil unit of the present invention, can be for novel, in the additional structure form of the composition that the covering thin layer 55 that is comprising electroconductive stuffing is arranged in conduction 51 places, joint portion, also can adopt the structure form of the composition of implementing formation as the copper plating thin layer of outer electrode constituent components part or nickel system plating thin layer 63, can also adopt antirust covering thin layer 73 of further affix or gold system plating thin layer 83 to implement the structure form of the composition that constitutes, so they can prevent that all coil 39 is by the disengagement of conduction 51 places, joint portion, simultaneously can guarantee the wetting quality of soldering tin material more, use plumbous system cream slurry soldering tin material to implement the trustworthiness of soft heat welded and installed thereby can improve.Particularly, also can improve the trustworthiness (corresponding) of its installation with claim 7 for being equipped with as the mixed integrated circuit assembly of power circuit with surface mounting type coil unit circuit element, constructed according to the invention of converter etc.
And as shown in Figure 7, the place can also be provided with mark above any one of pair of flanges portion 32,33 in described various mounted on surface code converters 60,70,80,90, promptly can be formed with in the part place printing suitable with electrode gap by recessed formation or applying coating mode ● phenotypic marker 3.Adopt this constituted mode, just can under the condition that does not reduce core body intensity, make flange part have directivity, thereby have the advantage that to implement judgement by outward appearance to the polarity of this surface mounting type coil unit.
The surface mounting type coil unit that consists of according to the present invention is owing to having the aforesaid structure form of the composition, so have effect as described below:
(1) can prevent when on circuit substrate, implementing welded and installed fusing scolding tin material Material soaks to coil curled portion place by the conduction joint portion, thereby can not make coil because molten Change soldering tin material and produce fire damage.
(2) can improve coil short and coil on the relevant surface mounting type coil unit Between the trustworthiness of dielectric voltage withstand.
(3) can utilize the soft heat heat that produces in the soft heat welded and installed operation, with coil On end turn and the conduction joint portion between outer electrode slowly be combined in circuit substrate On, thereby can prevent the disengagement of end turn, in conjunction with the appearance of the phenomenon such as bad, carry The installation trustworthiness of high soft heat welded and installed operation.
(4) can improve and cause external electrode surface can produce oxidation through certain hour The wetting quality of the soldering tin material during the soft heat welded and installed.
(5) particularly work as using such as components such as mixed integrated circuit assemblies The time higher installation trustworthiness arranged.
Claims (7)
1. surface mounting type coil unit, it comprises that having coil twines to twine to extend with the place, two ends of the longitudinal direction of frame section with frame section with by this coil and be provided with, twine the ferrite material core body of the flange part that forms as one with frame section with this coil, directly be assemblied in several outer electrodes at the flange part place on the described ferrite material core body, and by being wrapped in coil on the described ferrite material core body twines with the frame section place, the coil that the insulation cover type lead that two end is being connected with described outer electrode conduction respectively constitutes
It is characterized in that the outer surface place on the conduction joint portion between described outer electrode and end winding, also be formed with the thin layer that has lower soldering tin material wetting quality than the installation on the described outer electrode with electrode surface.
2. surface mounting type coil unit, it comprises that having coil twines to twine to extend with the place, two ends of the longitudinal direction of frame section with frame section with by this coil and be provided with, twine the ferrite material core body of the flange part that forms as one with frame section with this coil, directly be assemblied in several outer electrodes at the flange part place on the described ferrite material core body, and by being wrapped in coil on the described ferrite material core body twines with the frame section place, the coil that the insulation cover type lead that two end is being connected with described outer electrode conduction respectively constitutes
It is characterized in that externally the surface of electrode also is formed with conductivity plating film, and also be formed with thin oxide layer in the surface of the conductivity plating film that is positioned at conduction between described end winding and described outer electrode, close joint portion.
3. surface mounting type coil unit, it comprises that having coil twines to twine to extend with the place, two ends of the longitudinal direction of frame section with frame section with by this coil and be provided with, twine the ferrite material core body of the flange part that forms as one with frame section with this coil, directly be assemblied in several outer electrodes at the flange part place on the described ferrite material core body, and by being wrapped in coil on the described ferrite material core body twines with the frame section place, the coil that the insulation cover type lead that two end is being connected with described outer electrode conduction respectively constitutes
It is characterized in that described outer electrode is configured in the peripheral side place on the flange part of described ferrite material core body, its surface has soldering tin material plating thin layer or tin system plating thin layer, but also is formed with the covering thin layer conduction joint portion, that include electroconductive stuffing that is covered with on the insulation covering lead that combines with described outer electrode conduction.
4. surface mounting type coil unit, it comprises that having coil twines to twine to extend with the place, two ends of the longitudinal direction of frame section with frame section with by this coil and be provided with, twine the ferrite material core body of the flange part that forms as one with frame section with this coil, directly be assemblied in several outside electroplaxs at the flange part place on the described ferrite material core body, and by being wrapped in coil on the described ferrite material core body twines with the frame section place, the coil that the insulation cover type lead that two end is being connected with described outer electrode conduction respectively constitutes
It is characterized in that described outer electrode is configured in the peripheral side place on the flange part of described ferrite material core body, and its surface also have copper plating thin layer or nickel system plating thin layer.
5. surface mounting type coil unit as claimed in claim 4 is characterized in that the surface of copper plating thin layer on the electrode externally or nickel system plating thin layer is also additional and is formed with antirust covering thin layer.
6. surface mounting type coil unit as claimed in claim 4 is characterized in that the copper plating thin layer on the electrode externally or the also additional gold system plating thin layer that is formed with in surface of nickel system plating thin layer.
7. a mixed integrated circuit assembly is characterized in that carrying the surface mounting type coil unit as circuit element on circuit substrate.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14902098A JPH11340053A (en) | 1998-05-29 | 1998-05-29 | Surface mounted coil part |
| JP149020/1998 | 1998-05-29 | ||
| JP149020/98 | 1998-05-29 | ||
| JP151037/1998 | 1998-06-01 | ||
| JP151037/98 | 1998-06-01 | ||
| JP15103798A JP3347292B2 (en) | 1998-06-01 | 1998-06-01 | Surface mount type coil parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1238537A true CN1238537A (en) | 1999-12-15 |
| CN1189897C CN1189897C (en) | 2005-02-16 |
Family
ID=26479037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB991078039A Expired - Fee Related CN1189897C (en) | 1998-05-29 | 1999-05-28 | Surface mounting type coil unit |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100339147B1 (en) |
| CN (1) | CN1189897C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1875442B (en) * | 2003-11-05 | 2010-07-14 | Tdk株式会社 | Coil device |
| US20210319954A1 (en) * | 2018-05-18 | 2021-10-14 | Taiyo Yuden Co., Ltd. | Multilayer ceramic capacitor and method of manufacturing the same |
-
1999
- 1999-05-26 KR KR1019990019030A patent/KR100339147B1/en not_active IP Right Cessation
- 1999-05-28 CN CNB991078039A patent/CN1189897C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1875442B (en) * | 2003-11-05 | 2010-07-14 | Tdk株式会社 | Coil device |
| CN1875441B (en) * | 2003-11-05 | 2010-07-21 | Tdk株式会社 | Coil device |
| US20210319954A1 (en) * | 2018-05-18 | 2021-10-14 | Taiyo Yuden Co., Ltd. | Multilayer ceramic capacitor and method of manufacturing the same |
| US11705281B2 (en) * | 2018-05-18 | 2023-07-18 | Taiyo Yuden Co., Ltd. | Multilayer ceramic capacitor and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100339147B1 (en) | 2002-05-31 |
| KR19990088565A (en) | 1999-12-27 |
| CN1189897C (en) | 2005-02-16 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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Granted publication date: 20050216 |