CN1233036C - Assebly of seiconductor radiator - Google Patents
Assebly of seiconductor radiator Download PDFInfo
- Publication number
- CN1233036C CN1233036C CN 03153902 CN03153902A CN1233036C CN 1233036 C CN1233036 C CN 1233036C CN 03153902 CN03153902 CN 03153902 CN 03153902 A CN03153902 A CN 03153902A CN 1233036 C CN1233036 C CN 1233036C
- Authority
- CN
- China
- Prior art keywords
- power semiconductor
- cooling package
- anchor region
- semiconductor modular
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002137871 DE10237871B4 (en) | 2002-08-19 | 2002-08-19 | Module system |
DE10237871.1 | 2002-08-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1495890A CN1495890A (en) | 2004-05-12 |
CN1233036C true CN1233036C (en) | 2005-12-21 |
Family
ID=31501804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 03153902 Expired - Fee Related CN1233036C (en) | 2002-08-19 | 2003-08-19 | Assebly of seiconductor radiator |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN1233036C (en) |
DE (1) | DE10237871B4 (en) |
TW (1) | TWI295096B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006018716A1 (en) * | 2006-04-20 | 2007-10-25 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Arrangement for contacting power semiconductors on a cooling surface |
DE102007003821A1 (en) * | 2006-12-20 | 2008-06-26 | Rohde & Schwarz Gmbh & Co. Kg | Transistor clamping device for transistor, has holding down plate that is provided between maintaining block, transistor, and spring that is fixed on transistor such that constant pressure is executed |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8618283U1 (en) * | 1986-07-09 | 1986-11-06 | Austerlitz Electronic GmbH, 8500 Nürnberg | Retaining spring for attaching semiconductors to any heat sink |
US5466970A (en) * | 1992-08-24 | 1995-11-14 | Thermalloy, Inc. | Hooked spring clip |
US5386338A (en) * | 1993-12-20 | 1995-01-31 | Thermalloy, Inc. | Heat sink attachment assembly |
US5869897A (en) * | 1997-10-22 | 1999-02-09 | Ericcson, Inc. | Mounting arrangement for securing an intergrated circuit package to heat sink |
US6181006B1 (en) * | 1998-05-28 | 2001-01-30 | Ericsson Inc. | Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink |
DE19942915A1 (en) * | 1999-09-08 | 2001-03-15 | Still Gmbh | Power semiconductor module |
US6208517B1 (en) * | 1999-09-10 | 2001-03-27 | Legerity, Inc. | Heat sink |
DE10052191C1 (en) * | 2000-10-20 | 2001-11-15 | Siemens Ag | Cooling assembly for electronic components includes spring clamps holding them against cooling plate and away from PCB connections |
-
2002
- 2002-08-19 DE DE2002137871 patent/DE10237871B4/en not_active Expired - Lifetime
-
2003
- 2003-07-29 TW TW92120726A patent/TWI295096B/en not_active IP Right Cessation
- 2003-08-19 CN CN 03153902 patent/CN1233036C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE10237871B4 (en) | 2011-05-12 |
TW200403823A (en) | 2004-03-01 |
CN1495890A (en) | 2004-05-12 |
DE10237871A1 (en) | 2004-03-11 |
TWI295096B (en) | 2008-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6582100B1 (en) | LED mounting system | |
CN1284232C (en) | Vibration and shock resistant heat sink assembly | |
RU2495507C2 (en) | Heat-conducting installation element for attachment of printed-circuit board to radiator | |
CN109428497B (en) | Assembling structure and assembling method of power module | |
CN101036425A (en) | Component arrangement with an optimized assembly capability | |
JP6252872B2 (en) | Electrical connection box and connection terminal parts | |
US20100133681A1 (en) | Power semiconductor device | |
CN104838493A (en) | Power module | |
CN101577262A (en) | Power semiconductor module system | |
JPH0637216A (en) | Method and apparatus for attachment of heat sink to semiconductor device | |
CN104066291A (en) | Housing And Power Module Having The Same | |
US7736153B2 (en) | Electrical connector assembly having improved clip mechanism | |
CN1751218A (en) | Heat collector with mounting plate | |
US20080112132A1 (en) | Electric Power Module | |
JP4743536B2 (en) | Semiconductor mounting structure | |
CN1449239A (en) | Cooling arrangement and electrical apparatus with cooling arrangement | |
CN1765018A (en) | Heat radiator | |
CN1233036C (en) | Assebly of seiconductor radiator | |
CN1283307A (en) | Mounting arrangement for securing integrated circuit package to heat sink | |
JP2006245362A (en) | Semiconductor apparatus and electrode terminal used for the same | |
CN217363615U (en) | Radiator for intelligent terminal | |
CN217363613U (en) | Radiator for electronic product | |
CN100461554C (en) | Discrete electronic component and related assembling method | |
CN1604314A (en) | Power module and its connecting method | |
JP4396628B2 (en) | Busbar connection type electronic circuit device and assembly method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: INFINEON TECHNOLOGIES AG Free format text: FORMER OWNER: EUPEC GMBH + CO. KG Effective date: 20130325 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: EUPEC GMBH + CO. KG Free format text: FORMER NAME: YOUPE EUROPEAN SEMICONDUCTOR INDUSTRY GMBH + CO. KG |
|
CP01 | Change in the name or title of a patent holder |
Address after: Germany wall Shi Taiyin Patentee after: OPEC European Power Semiconductor Co.,Ltd. Address before: Germany wall Shi Taiyin Patentee before: EUPEC GmbH & Co.KG |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130325 Address after: German Berg, Laura Ibiza Patentee after: Infineon Technologies AG Address before: Germany wall Shi Taiyin Patentee before: OPEC European Power Semiconductor Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20051221 |
|
CF01 | Termination of patent right due to non-payment of annual fee |