CN1220086C

CN1220086C - Optical module

Info

Publication number: CN1220086C
Application number: CN 02805258
Authority: CN
Inventors: 史蒂文·K·凯斯; 格雷戈里·S·莫里; 蒂莫西·A·什昆尼斯; 帕特里克·J·加菲尔德; 约翰·T·麦克尔里思; 克雷格·D·奈顿; 卡里·A·楞次; 马克·L·威尔逊
Original assignee: Cyberoptics Corp
Current assignee: Cyberoptics Corp
Priority date: 2001-02-20
Filing date: 2002-02-20
Publication date: 2005-09-21
Anticipated expiration: 2022-02-20
Also published as: WO2002067032A2; GB2387923A; CN1502054A; WO2002067032A3; GB2390174A; AU2002306580A1; CN1493013A; WO2002067033A3; GB2387923B; AU2002306579A1; GB2390174B; CN1259585C; GB0319381D0; WO2002067034A2; WO2002067033A2; WO2002067034A3; WO2002075415A2; WO2002075415A3; GB0319380D0

Abstract

An optical module (12) for use in an optical device (10) is provided. The module (12) includes an optical component (14) and relative reference mount (18). The optical component (14) is fixed spacially relative to a registration feature (50). The registration feature (50) is configured to couple to a fixed reference mount (20).

Description

Optical module

Technical field

The present invention relates to a kind of optical element that is used to make optical device.More properly, the present invention relates to a kind of optical module that carries optics, light-electricity or opto-mechanical element.

Background technology

In order to provide such as the high speed data transfer in optical-fibre communications equipment, optical device is used in multiple industry and the technology day by day.Before multiple, only use in the application of electronic equipment, change optical device into or merge and use optical device.Optical device typically comprises a plurality of elements, and described element must accurately be installed and harmonize, so that equipment moves effectively and plays a role.The example element comprises optical fiber, waveguide, laser, modulator, detector, grating, optical amplifier, lens, reflective mirror, prism, view window etc.

In history, optical device (equipment that for example is used for optical-fibre communications, data storage and retrieval, optical check etc.) seldom has general character on packing and installation method.Because such difference is arranged on these device designs, this has limited the application of the automation equipment that is used for producing automatically these equipment.For such equipment is carried out jumbo automated production, the element of each independent production line of having to design especially.

On the contrary, all develop into such as the industry of printed circuit board (PCB) manufacturing and semiconductor manufacturing and have universal design rule and packing method.This makes the same section of automation equipment be applied in a plurality of designs.With the P.e.c. is example, and the multiple application from the computing machine motherboard to mobile phone can be designed by the basic standard spare of an identical relatively cover.These modules comprise printed circuit board (PCB), integrated circuit (IC) chip, discrete capacitor etc.In addition, identical automation equipment (for example select and locate (pickand place) machine) is suitable for the assembling of each these design, because they use common element and design rule.

Further complicated factor appears in the robotization assembling of optical device.Because the accurate mechanically calibrated requirement of optical element, such assembling is complicated.This has increased the problem that occurs owing to design variation.The numerous characteristics that these problems result from optical element can not be controlled to accurate tolerance economically.The example of these performances comprise fibre core with respect to the concentricity of covering, lens with respect to the position of the optical axis of exterior mechanical size, the back burnt position of lens, the spectral characteristic of film interference wave filter etc.Make each element be positioned at accurate Design Theory position even the machinery of each optical element is installed,, can not reach the performance provision of optical device owing to top listed tolerance.

In order to understand the accurate alignment requirements of high-performance optics equipment, consider the simplified example of two single form fiber optics of calibration.In this example, mechanically calibrated below requiring: each other angle of optical fiber, fiber facet angle, laterally adjust (perpendicular to optical propagation direction) and advance (being parallel to optical propagation direction) to guarantee that an optical fiber is to the enough optically-coupled of another optical fiber.

The typical single form optical fiber that is used for the radio communication of 1.3 μ m to 1.6 mum wavelength wave bands has the extramural cladding size of about 9 microns effective core diameter and 125 microns.Fibre core is 1 micron to the typical tolerances of the concentricity of covering outer dia.If the extramural cladding absolute calibration of two optical fiber does not have angular error or advance, fibre core still has 2 microns lateral error.This error will produce about 14% or the theoretical coupling loss of 0.65dB.This is lost in many application is unacceptable.The technology of using " actively calibration (active alignment) " is (for example at U.S. Patent number 5,745, illustrated technology in 624, described patent autograph is authorized on April 28th, 1998 for " device of calibration and blocking method and fiber optics module manufacturing automatically ") can improve coupling efficiency.

Summary of the invention

At an instance aspect, provide the optical module that is used for optical device.Described module comprises optical element, optical component mount and relative datum base, and described optical component mount is configured to be fixedly connected to described optical element, and described relative datum base is configured to link to each other with fixed reference mount.Adhesives is with respect to the relative datum base optical element that is permanently connected.Like this with respect to the position and the orientation of the registration device fixing optical element of relative datum base.On the one hand, with welding element is fixed on certain locus with respect to the relative datum base.

Description of drawings

Fig. 1 is the skeleton view of optical device according to an embodiment of the invention;

Fig. 2 A is the decomposition diagram of optical module shown in Figure 1;

Fig. 2 B is the flat sheet of the bottom view of component mount;

Fig. 3 is the front plan view of the optical module of Fig. 1;

Fig. 4 is the flat sheet of the bottom view of the optical module of Fig. 1;

Fig. 5 is the top plan view of the fixed reference mount shown in Fig. 1;

Fig. 6 is the cross-sectional view of the optical module cut open of Fig. 4 6-6 along the line;

Fig. 7 A is the cross-sectional view of registration device, and described registration device is used to adopt fixed reference mount registration relative datum base shown in Figure 1;

Fig. 7 B is the dissection cross-sectional view of registration device;

Fig. 8 A is the skeleton view of the used adhesives of explanation the present invention;

Fig. 8 B is the side cross-sectional view of the adhesives of key diagram 8A;

Fig. 8 C is the zoomed-in view of adhesives;

Fig. 8 D is the enlarged drawing of the adhesives of explanation heating back distortion of materials;

Fig. 9 is the skeleton view of an explanation optical module of the present invention, and it comprises gradient index (GRIN) lens;

Figure 10 is the front plan views of the optical module among Fig. 9;

Figure 11 and 12 is outboard profiles that explanation is electrically connected with optical module;

Figure 13 explanation is used for the heat dissipation technology of optical module;

Figure 14,15 and 16 is that another fibre-optical fixator is implemented illustration.

Embodiment

The many aspects that the present invention includes can reduce or eliminate the many problems relevant with aforementioned techniques.The invention provides a kind of optical element, its pre-calibration in standardized optical module.Optical module can be calibrated with sub-micrometer precision with respect to the registration device.Registration device on the optical module can be calibrated with the coupling device on the base.This similar in appearance in printed circuit board (PCB) or on electronic component is installed.Optical device can be easily by go up at optics " circuit board " pre-calibration is installed optical module make.The pre-calibration of optical element can compensate the deviation between element, thereby eliminates the influence of component variation in fact.Pre-calibration optical module also be applicable to the automatic manufacturing of equipment well.Module can be made in silicon by enough well-known silicon treatment technologies.Yet, can use any suitable material.Preferable material is the material that present electricity or optical element use.And the present invention can be used on the active equipment, for example laser instrument, modulator, detector etc.Can on multilayer, make electric conductor to be coupled with active optical element.The circuit that comprises analog-and digital-circuit also can directly be made in module or on fixed reference mount.

On the one hand, the invention provides a kind of optical module, in described optical module, optical element is mounted on the optical component mount.Optical component mount is fixed to relative datum base (the substrate installing plate that for example has desirable position and orientation).On the one hand, come installation elements with welding.The relative datum base is connected to fixed reference mount (for example substrate), so that optical element remains on ideal position and orientation with respect to fixed reference mount.In this common structure, before the relative position of fixing optical element by the relative datum base adjust optical component mount with the optical element pre-calibration to desirable space reference and orientation.This can be used to provide common element pre-calibration to compensate the deviation that produces simultaneously between optical element.Many instantiations are enumerated in following explanation, yet, aspect a lot, the invention is not restricted to here this special structure, element or technology.

Fig. 1 is the skeleton view of optical device 10.For purpose of the present invention is described, optical device 10 is as simple optical fiber and fibre-optic coupling mechanism.Yet the present invention can be used for optical element more complicated or other optical devices and other type.

In Fig. 1, optical device 10 is made by two optical module 12A and 12B, and described optical module 12A and 12B comprise

optical element

14A and 14B separately,

optical element

14A and 14B described in this instantiation as optical fiber.This optical fiber is mounted to

optical component mount

16A and 16B separately, and location and directed described

optical component mount

16A and 16B are with the optical element 14A that reaches relative

substrate installing plate

18A and 18B respectively and ideal position and the orientation of 14B.A plurality of instantiations of this coupling of sets forth in detail more below, however others of the present invention are not limited to this example.In the example explanation of setting forth particularly in Fig. 1,

substrate installing plate

18A and 18B comprise the backing plate that is roughly the plane.

Substrate installing plate

18A, 18B are one of examples of relative datum base.The relative datum base can have Any shape or structure.

Substrate installing plate

18A and 18B are mounted on the reference base 20 so that

optical element

14A and 14B are in the calibration of essence.Base 20 is one of examples of fixed reference mount, and can use any suitable fixed reference mount with suitable shape and structure.

Optical element module of the present invention can be by pre-assembled and pre-calibration to suitable benchmark, thereby makes final optical device by the optical module that assembles on reference base simply.In the example of Fig. 1, as flat base, described flat base can be considered to optics " circuit board " by diagram for reference base 20, described optics " circuit board " receive optical module with form optics, light-electricity or light-plant equipment.

Fig. 2 A is the decomposition diagram of optical module 12.In the instantiation shown in Fig. 2 A, optical component mount or fixator 16 comprise component mount or fixator 24 (first plate) and following component mount or fixator 26 (second plate).And other structure also within the scope of the invention.Fig. 2 A explanation is connected to an example field engineering on the substrate installing plate 18 to optical component mount 16.In this example, adhesives 30 is transported to the top surface of substrate installing plate 18.Material 30 preferably has two states at least.In a kind of state, material 30 does not disturb or contacts base 16.So, optical component mount 16 can be positioned at relative substrate installing plate 18 and has the most nearly degree of freedom of 6 degree.At another kind of state, material connects

base

16 and 18, and then fixes the relative position between them.In a preferred embodiment, material 30 comprises heat or chemistry response (or active) material, for example scolder or other connection materials.Scolder can comprise the scolder of any kind in electric welding, pad, soldered ball, weldering pricker, the welding block etc.The scolder that comprises those types that are used for the flip chip electronic unit.Yet, other material (for example Gan Zao bonding agent) chemically reactive, or activate by other method and maybe can use other attachment technique.Preferably, attachment technique has some relative motions before making and adhering to optical component mount 16 and substrate installing plate 18 regularly between them.In the embodiment that uses the hot activation material, can provide heating element (seeing Fig. 8 B for details) with heating material 30.For example, in Fig. 2 A, provide heating element, its application by contact liner 34 electric energy is activated.This can obtain by electrically contacting liner 34 and applying electric current.Yet, also can use other heating technique.Certainly, other technology that changes the state of adhesives also can be used, and for example solidifies the application of element (radiation or chemicals).Can use any suitable bonding agent that comprises brazing, welding, bonding or other technology.Can use comprise be exposed to air, heating, chemicals, (comprising light or UV) etc. activates cementing agent to add heat radiation.

Fig. 2 B is the flat sheet of the bottom view of optical component mount 16 and bottom base 26, and bonding liner 40 is described, arranges that described bonding liner 40 is to mate with the material 30 shown in Fig. 2 A.Liner 40 can comprise, for example, is placed on the metal on the bottom base 26.In another embodiment, also provide and comprise integrated heating element and electrically contact the bonding liner 40 of liner to excite heating element.Can obtain by caking liner 40 and adhesives 30 in bonding temporal minimizing.

Fig. 3 makes the front plan view of the miniature optical element 12 of the adjacent optical component mount 16 of explanation and substrate installing plate 18.In layout illustrated in fig. 3, material 30 does not contact with optical component mount 16 when initial.As described below, material 30 can be activated to fill or to be fixed on the gap 32 between base 16 and the base 18.Yet, can use the material 30 of other type, in described material 30, between

base

16 and 18, there are actual contact or material 30 before bonding, to fill gap 32.In a preferred embodiment, before being bonded to base 16 on the base 18 regularly, two elements can both be up to the degree of freedom of six degree by manipulation, as the X among Fig. 3 and Y-axis along shown in unshowned another Z, and all, around three axles, rotate perpendicular to the plane of figure.For some optical elements, can not require the calibration that all six-freedom degrees are all suitable and still less degree of freedom can be provided.On the one hand, material 30 comprises scolder.Fig. 3 also illustrates example registration device 50.In the example of Fig. 3 was implemented, each registration device 50 all was a projection, and described projection is configured to be complementary with reference base 20, and is as described below.

Fig. 3 also illustrates element registration device 60 in bottom base 26 and the element registration device 62 in upper element base 24.Usually, can use any registration technology, and the invention is not restricted to instantiation described here.In this example was implemented,

element registration device

60 and 62 comprised the V-connected in star, and described V-connected in star is configured to receive optical element (for example optical element 14).Optical element 14 for example can be connected with optical component mount by bonding agent or scolder.Optical element 14 preferably is fixed in component mount 16 and keeps calibration with the registration device 50 with respect to relative datum base 18.

Fig. 4 is the flat sheet of the bottom view of optical module 12, the part of the bottom optical component mount 26 of its explanation substrate installing plate 18 and optical component mount 16.Liner 54 on substrate installing plate 18 can be bonding with adhesives 72.The interface surface 64 of the flat sheet of the bottom view explanation optical component mount 16 of Fig. 4.Interface surface 64 is input, output or I/O faces of the optical element 14 among Fig. 3.In certain embodiments, the interface surface of adjacent optical module is in adjacent contact.In certain embodiments, refractive index optical match material is filled in connection and the minimizing reflection of any gap so that improvement to be provided between the adjacent interfaces.For example, the optical match material can be in solid, gel or liquid form.In one embodiment, interface surface 64 is planes, and described plane is with respect to perpendicular to the planar shaped of fiber optics 14 directions of propagation at an angle.For example, this angle may be 8 degree.The surface 64 at the one-tenth angle of optical element 14 is preferred, because it has reduced catoptrical quantity, described reflected light is coupled and is back in the fiber optics.If two modules are near state or are in adjacent contact, then the adjacent optical elements base will have suitable angle.In an embodiment, angle or concrete interface finishing are desirable, and then interface surface 64 can be used suitable technology (for example overlapping technology, chemical process, processing etc.) and be shaped or manufacturing.Or use additional technology to reach desirable structure.For example, in optical element 14 is fixed on optical component mount 14 after, the surface 64 can be overlapping to reach desirable angle or Surface Finishing.Also can use this technology concordant with interface surface 64 with the surface that guarantees optical element.Yet, in certain embodiments, ideally, have from interface surface 64 or recessed or outstanding optical element 14.

Fig. 5 is the top plan view of reference base 20, and described reference base 20 is configured to receive optical module 12A and 12B as shown in Figure 1.Be provided with registration device 70A and 70B on separately optical module 12A and 12B, to receive registration device 50.In example is implemented, accurately determine the recess of part 70, to mate with the projection of the registration device 50 shown in Fig. 3 or 4.This example is implemented as being described in more detail among Fig. 7 A.Dotted outline is represented the layout of substrate installing plate 18A and 18B.This structure provides sports type (kinematic-type) registration or collimation technique.Example sports type technology is explanation in the United States Patent (USP) 5,748,827 " two-stage motion base " at autograph.Can use any suitable benchmark or collimation technique, yet preferably, the benchmark technology should be accurate and improve high repeatability.In this example embodiment, hot activation material 72 (for example scolder) is provided, described hot activation material 72 can be heated to regularly optical module is bonded to reference base.In such embodiments, contact liner 74 is electrically connected to well heater, and described well heater is used to heating material 72.Material 72 preferably with liner 54 alignments shown in Figure 4.For example, liner 54 can be a kind of material that material 72 will adhere to consumingly.For example, liner 54 can comprise a kind of metal, and scolder will adhere to described metal.Be used to promote that the liner of adhesion can have multilayer.For example, with the bonding one deck of adhesives and another layer bonding with base, as

base

16,18 or base 20, on the other hand, the bonding liner 54 on substrate installing plate 18 also can comprise integrated heating element and can provide the electric contact liner so that these heating elements activate.Can obtain the minimizing of bonding time by caking liner and adhesives 72.

The optical module 12 of Fig. 6 installation that to be explanation cut along Fig. 4 center line 6-6 also comprises the cross-sectional view of base 20.This figure illustrates assembling structure, and in described structure, optical module 12 is connected to reference base 20, and component holder body 16 is connected to substrate installing plate 18.

Fig. 7 A is one and amplifies cross-sectional view that Fig. 7 B is the amplification internal anatomy of explanation V-shape groove registration device 70 and outstanding registration device 50.Relevant spacing between plate 18 and the base 20 can be by adjusting V-groove 70 or projection 50 the angle or the width of wall control.If make monocrystalline silicon,, and can adjust width with the control spacing by material crystals structure immobilization material typically with proper orientation.The in fact online contact point of connection between plate 18 and the base 20 76 places take place.

Fig. 8 A is the skeleton view that illustrates in greater detail adhesives 30, and Fig. 8 B is the cross-sectional view of the adhesives of explanation between lower element base 26 and installing plate 18.Adhesives 30 is sent on the heating element 80, and described heating element 80 is electrically connected with conductor 82.Heating element 80 can comprise such as the resistive element of refractory metal or such as the alloy of tantalum, chromium or nichrome, and be configured to molten material 30 when enough electric currents are supplied to by conductor 82.

Near the cross-sectional view explanation heating element 80 shown in Fig. 8 B structure.Fig. 8 B is the pattern of thin layer, and does not have scale and device only is described, for example contact 34, and it is away from heating element 80 and near the edge of installing plate 18.Element 80 is electrically connected with contact 34 by electric conductor 82.Electric insulation layer 87 can optionally be placed on the amount of current that flows through element 80 between element 80 and the material 30 with increase.Extra play or layer 85 can be deposited on the insulator 87 to promote adhesion or other desirable characteristics or quality are provided.This is known as " collision (under-bump) metallurgy down " or UBM technology in the metal deposition.Heat (and/or) insulation course 89 also can be applied to reducing the heat energy conversion of parts towards periphery.Preferably, heating element 80 is designed to move under the state of thermal insulation.When electric current flow through heating element 80 and heating element and begins to warm, heat energy flow to adhesives 30.Similarly, be configured to reduce the hot-fluid that enters the surrounding area structure optimization.This minimizing intensifies the adhesives energy needed, reduces heating and installation time, and reduces the thermal stress that puts on material around.Element 80 can have any shape aptly, comprises straight line, two-wire, serpentine etc.Scolder provides adhesives, and described adhesives can bonding rapidly (being less than in 100 seconds) also allow by adding hot solder again " reprocessing " binding material.

Can select multiple material in order to obtain desirable suitable physical property.SiO ₂Heat that provides and electrical isolation and processing easily.Certainly, also can use other material that comprises other oxide or organic film.Electric insulation layer 87 preferably relatively approaches and provides high heat conductance.Silicon nitride is an example materials.Conductor 82 can be the material of any conduction, yet preferred material comprises those materials of deposition easily, for example thick refractory metal, gold or aluminium.The material that is used for liner 54 can be any suitable material that adheres on the adhesives 30.Example comprises gold, nickel, platinum etc.The thickness of multiple layer also should be selected to the heat that reduces again on the heating element and carry.Liner 40 illustrates has layer 40A and 40B.Layer 40A can be the material that is suitable for being bonded to thermal insulation layer 89.For example, if layer 89 is SiO ₂It then is the Ti layer.40B is configured to adhesives 30 bonding, and can be, for example, and gold, nickel, platinum or other material.Liner 40 can have the membrane structure of multilayer titanium, nickel and gold.Titanium is used as the adhesion layer that invests silicon.Secondly, nickel is deposited over the top of titanium so that scolder and nickel have strong metal-metal bonding.At last, gold is deposited over the top of nickel to prevent the nickel corrosion.Also can depend on solder alloy and many other considers to use other acceptance to cushion metallurgy or UBM (collision (under bump) metallurgy down) structure.Liner also can form intermetallic compound with collision (under bump) metallurgy under using before the retaining element with the thin layer precoating tin of scolder.

On the other hand, can use the component holder body laser bonding with retaining element.Scolder is by laser fusion and adhere to the surface of the inclination that is provided with on element.The laser bonding operation of retaining element both sides is preferably carried out simultaneously by two or more lasing light emitters.Laser energy can be transmitted by optical fiber.

Shown in Fig. 8 C, in one embodiment, material 30 comprises a kind of scolder that is shaped on the zone 86 of high surface area zone 84 and taper.When material 30 was melted, surface tension caused that fluent material flows to high surface area zone 84 and causes high surface area zone 84 end direction and upwards expansion shown in Fig. 8 D from conical region 86.This structure is favourable, because its allows the adjusting ideally towards any interference that is not subjected to adhesives 30 of component mount 16 (by the six-freedom degree that Fig. 3 discussed).When applying heat and material and be filled between two elements, adhesives only contacts two surfaces.Similarly, for substrate installing plate 18 is installed on the reference base 20, before the driving of adhesives 72 uses or heating element, plate 18 can safety calibration within part 70.This flow of solder material technology has description in the United States Patent (USP) 5,892,179 of " solder bump and the structure of integrated reallocation path conductor " by name that 1999.4.6 announces.Also can use a plurality of conical regions 86 as the desirable zone that increases amount of solder, described amount of solder flows towards high surface area zone 84.

On the other hand, component mount can be fixed in the substrate installing plate by laser bonding.Component mount and datum plate can be provided with the outer inclination surface, and described outer inclination surface has the bonding metallurgy of suitable scolder.Scolder is with the laser instrument fusing and adhere to the inclined surface that is located on component mount and the substrate installing plate.The laser instrument welding operation of retaining element both sides is preferably carried out simultaneously by two or more lasing light emitters.Can transmit the laser energy by optical fiber.Also can use laser bonding to fix the substrate installing plate to the datum plate of having fixed.

As mentioned above, can use other adhesive technology that comprises bonding agent and UV treatment technology, and the invention is not restricted to scolder.Yet on the one hand, adhesive technology can use the surface tension that produces easily in adhesives.Note scolder or bonding agent can conductivity to provide and the electrically contacting of optical device between multilayer or adjacent circuit.Can use thermal conducting material to help to make the dissipation of heat.On the other hand, use two adhesivess, described two adhesivess can be identical or different and can use simultaneously or use in order.For example, use after the described scolder, second adhesives can be filled the gap so that additional stability to be provided.Yet the contraction of adhesives or other change of shape should be mentioned to keep calibration.In certain embodiments, roughness or make the surface have a fixed structure with any suitable technology to can be used in the adhesion that improves adhesives.

Element 14 can be optics light-electricity or the light-mechanical organ that comprises any kind of active or active component.In above-mentioned example, optical element 14 is shown as optical fiber.In order to illustrate that can be selected an example light module 12, shown optical element 90 at Fig. 9 and 10, described optical element 90 comprises a grin lens.Fig. 9 is the skeleton view that explanation is fixed on the lens 90 in the component mount 16, and described component mount 16 is connected to substrate installing plate 18.Figure 10 is a front plan view.Lens 90 usefulness registration groove 60 registrations.Provide additional support adhesives 92 so that lens 90 are fixed to component mount 16.This can be bonding agent, scolder or other adhesives.

Multiple element can enough any suitable technology or made.In one embodiment, the recess of multiple registration device or groove are made by anisotropy erosion location monocrystalline silicon.Can make projection with similarly suitable mode.Any one motion in six-freedom degree should preferably be eliminated or reduce in fact to this structure.This requirement reaches the sub-micron spacing repeatability between element.For example, [100] direction of monocrystalline silicon allows to be 90 degrees to each other this device formation in orientation.Can use any suitable erosion or formation technology.A kind of common anisotropy corrodes to be used KOH and shelters to determine desirable device.Consider multiple conductive layer, heating element layer and insulation course, can use any suitable injection, plating, evaporation or other manufacturing technology.

The many aspects of the invention described above provide the optical module of pre-calibration, and described optical module can reduce or eliminate the influence of component variation.In above-mentioned example, this is to adjust component mount by (fixator) relative registration device on the substrate installing plate to reach.Spatial orientation between adhesives retaining element and the registration device.Accurate registration device is located on the substrate installing plate 18 so that it can be inserted into optics " circuit board " comprises a plurality of optical element modules with manufacturing equipment.Optical module is suitable for the automatic assembling of optical device, because they also can easily be installed on the reference base with the pre-calibration of standardized standardized component mode.Optical module can manually be put into optics " circuit board " or can the automation process process.This special optical module preferably standardization so that this robotization is more convenient.And this structure allows to carry out the assembling of equipment with the form of " being inverted (top donward) ", and in the form of described " inversion ", optical module is moved downward to optics " circuit board ", and described optics " circuit board " makes process automation more convenient.In addition, because different modules is used similar made, therefore because the variation of thermal expansion will influence all modules in a similar manner, to such an extent as to kept the calibration between the adjacent block on the optics " circuit board ".

Can use easily the electrical conductance of solder attach agent provide with module on being electrically connected of electric device.Can add hot solder with any order or combination (comprising simultaneously).Can determine position and order distortion that comprises thermal deformation in element of scolder heating with minimizing or compensation.Also can use scolder easily, allow element to reappose, move again, replace and/or repair because can add hot solder again.

Figure 11 is the simplified block diagram of another aspect of the present invention.In Figure 11, circuit 120 is electrically connected to optical component mount 16.Circuit 120 can be the circuit (for example integrated circuit) of any kind.In such embodiments, optical element 14 sensor or be electrically connected to the active component of circuit 120 typically.

Electricity liner

122 and 124 is installed on the base 20.Electricity liner 126 is installed on the base 16, is electrically connected 128 then and is located between liner 124 and the liner 126.Figure 12 is the cross-sectional view of another embodiment, in described embodiment, is electrically connected 130 and installs by the through hole that extends through substrate installing plate 18.In this embodiment, adhesives 30 provides electrical connection between electrical connection 130 and optical component mount 16.To such an extent as to liner 124 extends its contact adhesives 72 like this, and then provide and be electrically connected to circuit 120.Selectable circuit 136 also illustrates in Figure 12.Circuit 136 is installed on the base 16 and the conductor path technology of enough this propositions of energy is electrically connected to other circuit.Multiple electrical connection in conductor can be used techniques of deposition, for example thin film technique.When using adhesives that electrical connection is provided, adhesives should be an electrical conductance.

Figure 13 is the side view of another aspect of the present invention, and heat dissipation technology is described, described heat radiation can produce by active optics equipment.Thermal conductance underfilling 140 is located between base 16 and the substrate installing plate 18 and between substrate installing plate 18 and base 20.Underfilling 140 is thermal conducting materials, and the heat that equipment 14 is produced is transferred into base 20, in the relatively large area heat radiation of base 20 place's heat energy by base 20.By reducing heat history, reduce the life-span of thermogenetic distortion and increase equipment 14.Heat radiator can be mounted to base 20 and dispel the heat with further help.In one embodiment, heat radiator 142 comprises thermoelectric (al) cooler, and this thermoelectric (al) cooler is configured to a heat energy and sends away away from base 20.In one embodiment, thermoelectric (al) cooler and base become one.In another example embodiment, heat radiator 142 comprises a series of passage, and this channels configuration becomes to transport liquid coolant.In addition, heat radiator 142 can selectively directly or by non-stress hot path (for example copper, gold, aluminium or silver bar band) be connected to optical component mount 16.Heat scatters (thermal diffusion) film or layer can directly adhere to hot active equipment or multiple a plurality of element.

Figure 14 illustrates the decomposition diagram of component holder body 216.Optical fiber connector 215 is removed the protection cushion, only makes fibre cladding and fibre core keep getting off.Similarly, optical fiber connector 219 is removed the protection cushion, only makes fibre cladding and fibre core keep getting off.In an embodiment of the optical fiber of optical fiber Coupling device 210, the light quantity of riving and reflect into from the tip of optical fiber connector 215 into optical fiber 214 to reduce with an angle in the tip of optical fiber connector 215.Based on this application, also split in the tip of optical fiber connector 215 and 219, polish or prepare with multiple alternate manner, for example on the tip, make lens.

Figure 15 explanation does not have the skeleton view of the bottom fixator 226 at optical fiber 214 and top 218.V-shape groove 234 is made into pattern to accept the end of optical fiber, and described optical fiber has the protection cushion of being stripped from.V-shape groove 236 is less times greater than V-shape groove 234 and make pattern to accept the fiber section with the protection cushion.V-

shape groove

234 and 236 is preferably made by anisotropic erosion on [100] of silicon crystal orientation.Bonding agent baffle plate 238,240,242 and 244 as shown in figure 15 and be shown as V-shape groove.Bonding agent baffle plate 238,240,242 and 244 is collected in top fixator 224 is bonded to the too much bonding agent that exists after the bottom fixator 226.Otherwise any too much bonding agent can be extruded from the side and the edge of component holder body 216.

Figure 16 illustrates the skeleton view with the bottom fixator at optical fiber of placing in the V-shape groove 236 214 and top 218.Optical fiber connector 215 and 219 is placed in the V-shape groove 234.The protection cushion 217 also in this figure as seen.V-shape groove 236 provides the strain relief at optical fiber and top 218, so optical fiber do not rupture at optical fiber connector 215 and 219 places, has been removed at described optical fiber connector 215 and 219 places protection cushion 217.Top fixator 224 has the V-shape groove structure similar to bottom fixator 226, thereby can form component holder body 216 when they mate, and optical fiber 214 and top 218 are caught tightly, or " clamping (sandwiched) ".One of optical fiber can use in calibration process.The mirror image of symmetry is provided between the element with being configured in of three grooves 234.

Common one side the invention provides a kind of optical module, in described optical module, because the optical change of component variation is eliminated or reduces widely.The consistance of a plurality of optical modules is provided like this, and described a plurality of optical modules are desirable especially to the robotization assembling.On the one hand, the present invention can be regarded as providing the three phases of calibration between optical element and optical component mount.The phase one of calibration is located between component mount (fixator) and the optical element V-shape groove registration device or other technology shown in for example using.The subordinate phase of calibration is located between the registration device of optical component mount and relative datum base.This also eliminates or has reduced because the calibration variation of component variation.Last calibration occurs between optical module and the reference base.Another aspect, optical element have an optical characteristics, and described optical characteristics changes on the space of relative at least one size.Optical element is calibrated with respect to the position of the registration device of relative datum base by the retaining element base with the benchmark architecture on the relative datum base, and then the collimation optical characteristic.On the one hand, the phase one of elimination of calibrations, optical element registration device direct and the relative datum base is calibrated, and does not use base/fixator.

Though with reference to preferred embodiment the present invention has been described, will have recognized that to those of ordinary skills not breaking away from the spirit and scope of the present invention can do variation in form with on the content.For example, the quantity of scolder, well heater and receptacle can depend on concrete requirement and change.The order of remelting scolder can change to increase stability.Optical element can be active or passive optical, light-electricity or the light-mechanical organ of any kind and the instantiation that is not limited to propose here.Optical element can be calibrated, and its position is to using any suitable or desirable mode to fix.Here concrete element of Ti Chuing and example are provided to illustrate that different aspect of the present invention does not limit the scope of the invention.Other element, shape, part, structure etc. are all within the scope of the present invention.Any suitable material can be used in different elements.A concrete aspect, relative datum base and other element are made from monocrystal material (for example silicon).On the other hand, these elements can be made from any electric material that comprises semiconductor or pottery.Other material comprises machinable material (for example steel, aluminium, metal alloy etc.) of the requirement that depends on special instrument.Can use the assembling optical module to make optical device by " selecting and location (pickand place) " machine or any suitable or desirable method.In such embodiments, chamfering on the component mount edge or oblique angle can promote the mechanical grip of base.Similarly, different elements of the present invention can use any desirable technology manufacturing.In present technique, scolder is known, and any suitable scolder can be selected to obtain Ideal Characteristics.Welding can be carried out under a kind of atmosphere that prevents or remove the scolder oxidation.Optical element can not have the component mount of separating and is connected directly to the relative datum base.As used herein, " light " is unnecessary to be visible light.And optical element can be any active or passive optical, light-electricity or light-mechanical organ.Optical module can use any suitable technology pre-calibration.In a selectable example, be mounted to optics " circuit board " afterwards at optical module or relative datum base, calibrate.

Claims

1. optical module that is used on the optical device comprises:

Optical element;

Optical component mount, described optical component mount is configured to be fixedly connected to described optical element;

The relative datum base, it has the registration device that is configured to be connected to reference base; With

Adhesives, it is configured to the registration device fixing optical element with respect to the relative datum base.

2. optical module according to claim 1, wherein adhesives comprises scolder.

3. optical module according to claim 1, wherein adhesives is an electrical conductance.

4. optical module according to claim 1, wherein optical component mount comprises first and second plates, fixing optical element therebetween.

5. optical module according to claim 1, wherein optical element has optical characteristics, described optical characteristics is at least one change in size relatively, and wherein optical characteristics is with respect to a reference calibration, and described benchmark is determined with respect to the registration device of relative datum base.

6. optical module according to claim 1, wherein adhesives comprises bonding agent.

7. optical module according to claim 1, wherein adhesives between optical element and relative datum base, provide fixing space bit to.

8. optical module according to claim 7, wherein adhesives has first state and second state, in described first state, can adjust described space bit to, in described second state fixed space position to.

9. optical module according to claim 8 wherein ought operationally only be connected to one of optical element and relative datum base by described adhesives under first state.

10. optical module according to claim 9, wherein adhesives is activated to fill the gap.

11. optical module according to claim 10 is wherein supplied heat or is got rid of the variation that heat causes the adhesives state.

12. optical module according to claim 10 wherein applies or does not apply the variation that radiation causes the state of adhesives.

13. optical module according to claim 1, wherein the relative datum base comes down to the plane.

14. optical module according to claim 1, wherein reference base comprises the base on plane.

15. optical module according to claim 1, wherein adhesives has first state, and at described first state, optical element can move with maximum six-freedom degree with respect to the relative datum base.

16. optical module according to claim 1 is included in the bonding liner between optical component mount and the relative datum base, is configured to adhere to adhesives.

17. optical module according to claim 1, wherein optical element comprises the registration device, and described registration device is configured for the registration optical element.

18. optical module according to claim 1, wherein optical element is bonded to optical component mount.

19. optical module according to claim 1, wherein adhesives is thermally coupled to adhesives by hot activation and at least one heating element.

20. optical module according to claim 1 comprises the heating element that is installed in relative datum base and the optical component mount at least on one of them.

21. optical module according to claim 20 comprises the electric conductor that is installed in relative datum base and the optical component mount at least on one of them, described optical component mount is electrically connected to heating element.

22. optical module according to claim 21 comprises the contact liner that is electrically connected to electric conductor.

23. optical module according to claim 1 is included in the bonding liner on the relative datum base, is configured to adhere to adhesives, described adhesives is connected to reference base.

24. optical module according to claim 1, wherein the relative datum base comprises silicon.

25. optical module according to claim 1, wherein optical component mount comprises silicon.

26. optical module according to claim 1, wherein optical component mount comprises that interface surface and optical element are concordant with described interface surface.

27. optical module according to claim 1, wherein the relative datum base comprises semiconductor.

28. optical module according to claim 1, wherein the relative datum base comprises pottery.

29. optical module according to claim 1, wherein the registration device is configured to provide substantial motion registration to fixed reference mount.

30. optical module according to claim 1 comprises the electrical connection that is connected to described optical element.

31. optical module according to claim 30, wherein said electrical connection is undertaken by through hole.

32. optical module according to claim 1, wherein optical element is that active equipment and optical module comprise from the device of active equipment heat radiation.

33. optical module according to claim 1 comprises the optical fiber afterbody from optical element, is used for the pre-calibration from optical element to the registration device.