CN1209721A - Spherical array type packing plate tin-ball electroplating method - Google Patents
Spherical array type packing plate tin-ball electroplating method Download PDFInfo
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- CN1209721A CN1209721A CN 97117535 CN97117535A CN1209721A CN 1209721 A CN1209721 A CN 1209721A CN 97117535 CN97117535 CN 97117535 CN 97117535 A CN97117535 A CN 97117535A CN 1209721 A CN1209721 A CN 1209721A
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- ball
- tin
- bga
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Abstract
The present invention relates to a method for electroplating ball-gridarry board with tin-ball, which is characterized including the following steps: 1). drilling BGA (Ball Gridarry) substrate; 2). electroplating through hole (PTH) (first copper-plating); 3). secondary copper-plating; 4). firstly, gold-plating the circuit face of BGA substrate, and covering ball-implanting surface with D/F (dry film); 5). covering the circuit face of BGA substrate with D/F (dry film) again and electroplating the ball-implanting surface with nickel layer to form base of tin-lead ball; 6). plating the ball-implanting surface with tin-lead again; 7). heating to make tin-lead refuse to form ball.
Description
The present invention relates to a kind of packing method of integrated circuit input output pin, relate in particular to a kind of method of spherical array type packing plate tin-ball electroplating.
IC wafer or wafer set are to extend to the four directions by flower stand (LEAD FRAME) to input or output after packing traditionally, but because the peripheral length of flower stand own is limited, output or the shared space of input pin are bigger, the number that makes the flower stand periphery that pin can be set is subjected to the restriction of certain degree, and therefore the mode that inputs or outputs with this flower stand is very restricted.In order to correct this shortcoming, the manner of packing of redesign IC element output input pin, this design is to be the manner of packing of outer pin with solder ball (Solder Ball), the pin of IC wafer is connected to a conductor substrate bottom face, then with the solder ball of array trellis as the pin that inputs or outputs.
The method that BGA at present commonly used plants ball has approximately: 1) mode of printing: solder(ing) paste is printed on the BGA substrate, that its fusion is formed is spherical in heating again, but the moulding reliability of this kind mode is not high, easily causes other improper reaction and solder ball size shortcoming such as wayward in the heating process; 2) place on the BGA substrate with the plate that is provided with the location hole that gathers,, solder ball is positioned in the location hole as vibrations again in the machining mode; But the method is difficult for processing, and fragile solder ball.
The object of the present invention is to provide a kind of method of spherical array type packing plate tin-ball electroplating, it is tin-ball electroplating on the BGA substrate directly, and does not need in addition processing to plant ball, and can directly process on the printed circuit board assembly line and get final product.
Purpose of the present invention realizes like this: a kind of method of spherical array type packing plate tin-ball electroplating, be characterized in, and comprise the following steps:
1) to the boring of BGA (Ball Grid Array) substrate,
2) (PTH) (electro-coppering) electroplated in perforation,
3) second time electroplating copper,
4) BGA base material circuit surface earlier gold-plated, plant sphere and cover with D/F (dry film),
5) BGA base material circuit surface covers with D/F again, and plant the sphere plating and go up the pedestal of nickel dam with formation tin shot,
6) the BGA base material is planted sphere and is plated tin again,
7) heating makes the plumbous remelting of tin, with globulate.
In the method for above-mentioned spherical array type packing plate tin-ball electroplating, wherein, in step 7), mode of heating can be deep fat or ultrared mode of heating.
The present invention compared with the prior art advantage and good effect is very obvious.By above technical scheme as can be known, it need not processing in addition and plants ball, and is suitable for directly processing on the printed circuit board assembly line.
Concrete structure of the present invention is provided by following embodiment and accompanying drawing thereof.
Fig. 1 is the flow chart according to the method for the spherical array type packing plate tin-ball electroplating of the present invention's proposition.
Describe in detail to want the step and the working condition thereof of concrete grammar proposed by the invention below in conjunction with accompanying drawing, therefrom can also further find out other purpose, feature and advantage of the present invention.
Please refer to the flow chart of Fig. 1, method of the present invention comprises the following steps:
1) to the boring of BGA (Ball Grid Array) substrate,
2) (PTH) (electro-coppering) electroplated in perforation,
3) second time electroplating copper,
4) BGA base material circuit surface earlier gold-plated, plant sphere and cover with D/F (dry film),
5) BGA base material circuit surface covers with D/F again, and plant the sphere plating and go up the pedestal of nickel dam with formation tin shot,
6) the BGA base material is planted sphere and is plated tin lead again,
7) heating makes the plumbous remelting of tin, with globulate.
Wherein, the mode of heating of step 7) can be deep fat or ultrared mode of heating.
Claims (2)
1. the method for a spherical array type packing plate tin-ball electroplating, it is characterized in that: it comprises the following steps:
1) to the boring of BGA (Ball Grid Array) substrate,
2) (PTH) (electro-coppering) electroplated in perforation,
3) second time electroplating copper,
4) BGA base material circuit surface earlier gold-plated, plant sphere and cover with D/F (dry film),
5) BGA base material circuit surface covers with D/F again, and plant the sphere plating and go up the pedestal of nickel dam with formation tin shot,
6) the BGA base material is planted sphere and is plated tin again,
7) heating makes the plumbous remelting of tin, with globulate.
2. method according to claim 1 is characterized in that: the mode of heating of described step 7) can be deep fat or ultrared mode of heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97117535 CN1209721A (en) | 1997-08-27 | 1997-08-27 | Spherical array type packing plate tin-ball electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97117535 CN1209721A (en) | 1997-08-27 | 1997-08-27 | Spherical array type packing plate tin-ball electroplating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1209721A true CN1209721A (en) | 1999-03-03 |
Family
ID=5174483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 97117535 Pending CN1209721A (en) | 1997-08-27 | 1997-08-27 | Spherical array type packing plate tin-ball electroplating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1209721A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101372756B (en) * | 2008-09-28 | 2010-06-09 | 武汉船用机械有限责任公司 | Chrome plating method for spherical crown surface of major diameter spherical crown workpiece |
| CN101784165A (en) * | 2010-03-19 | 2010-07-21 | 中兴通讯股份有限公司 | Treatment method of corrosion-resistant weldable coating layer of printed circuit board |
| CN103094235A (en) * | 2012-12-14 | 2013-05-08 | 华天科技（西安）有限公司 | AAQFN package part using electroplating process and manufacture process thereof |
| CN107541702A (en) * | 2017-09-08 | 2018-01-05 | 张家港创博金属科技有限公司 | A kind of is efficiently the method and apparatus of caryosphere coating |
| CN110129866A (en) * | 2019-06-10 | 2019-08-16 | 重庆理工大学 | A kind of BGA plate electroplanting device and electro-plating method |
-
1997
- 1997-08-27 CN CN 97117535 patent/CN1209721A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101372756B (en) * | 2008-09-28 | 2010-06-09 | 武汉船用机械有限责任公司 | Chrome plating method for spherical crown surface of major diameter spherical crown workpiece |
| CN101784165A (en) * | 2010-03-19 | 2010-07-21 | 中兴通讯股份有限公司 | Treatment method of corrosion-resistant weldable coating layer of printed circuit board |
| CN101784165B (en) * | 2010-03-19 | 2014-11-05 | 中兴通讯股份有限公司 | Treatment method of corrosion-resistant weldable coating layer of printed circuit board |
| CN103094235A (en) * | 2012-12-14 | 2013-05-08 | 华天科技（西安）有限公司 | AAQFN package part using electroplating process and manufacture process thereof |
| CN107541702A (en) * | 2017-09-08 | 2018-01-05 | 张家港创博金属科技有限公司 | A kind of is efficiently the method and apparatus of caryosphere coating |
| CN110129866A (en) * | 2019-06-10 | 2019-08-16 | 重庆理工大学 | A kind of BGA plate electroplanting device and electro-plating method |
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