CN1202602A - Thin film type heater and method of manufacturing the same - Google Patents

Thin film type heater and method of manufacturing the same Download PDF

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Publication number
CN1202602A
CN1202602A CN98108722A CN98108722A CN1202602A CN 1202602 A CN1202602 A CN 1202602A CN 98108722 A CN98108722 A CN 98108722A CN 98108722 A CN98108722 A CN 98108722A CN 1202602 A CN1202602 A CN 1202602A
Authority
CN
China
Prior art keywords
heating
thin film
film type
electrode layer
zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN98108722A
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Chinese (zh)
Inventor
徐五权
金兴范
南升浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CN1202602A publication Critical patent/CN1202602A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002Heaters using a particular layout for the resistive material or resistive elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013Heaters using resistive films or coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017Manufacturing methods or apparatus for heaters

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
  • Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

The present invention provides an hinly film-coated exothermic heater in which an initial heating time is short, instantaneous heating efficiency is maximized and the method of manufacture. The heater comprises a substrate, a plurality of single thickness unit heating layers coated on the substrate in a predetermined pattern, an electrode layer for interconnecting the unit heating layers to form a current path and a protective layer for protecting the heating layer and the electrode layer.

Description

Thin film type heater and manufacture method thereof
The present invention relates to a kind of thin film type heater and manufacture method thereof as boiler-type humidifier or water heater thermal source.
Usually, the boiler-type humidifier produces steam and these steam is blown into a ventilator by heating the water in the water tank.In said process, heat that should control heater and control the quantity of steam that is produced.The heater that is suitable for this boiler-type humidifier is mainly selected a kind of nickel filament or nickel chromium triangle rod heater with a predetermined resistance for use.The heat of heater changes by changing contact resistance, and perhaps the electric current of crossing heater by control flows changes.
Existing heater, the required zero-time of normal humidification is very long, and the contact point between the electrode since produce too much heat may short circuit.
In order to address the above problem, an object of the present invention is to provide a kind of can be microminiaturized, utilize a kind of material to increase the thin film type heater and the manufacture method thereof of the instantaneous efficiency of heating surface with good resistive performance.
Therefore, in order to achieve the above object, a thin film type heater formed according to the present invention comprises: a substrate; A plurality ofly be coated in this suprabasil unit zone of heating with a kind of predetermined pattern; One is formed at this substrate and is used to connect the said units zone of heating to form the electrode layer of a current path; With one be formed at the protective layer that above-mentioned substrate is used to protect above-mentioned zone of heating and electrode layer.
In addition, zone of heating is to comprise TaAl, Ni-Cr alloy, SnO by a kind of being selected from 2, HfB 2Form with material in the group of Ta, electrode layer is to comprise Al, Au, Ag, RuO by a kind of being selected from 2Form with material in the group of Pt, and protective layer is to comprise Si by a kind of being selected from 3N 4, SiO 2Form with material in the group of SiC.
According to a further aspect in the invention, a kind of method of making thin film type heater may further comprise the steps: (a) comprise TaAl, Ni-Cr alloy, SnO with a kind of being selected from 2, HfB 2In a substrate, apply a film with the material in the group of Ta with a predetermined pattern, to form a unit zone of heating; (b) by above-mentioned each unit zone of heating and the interconnection of a suprabasil electrode layer are formed an electric pathway; (c) in above-mentioned substrate, form a protective layer, to protect above-mentioned zone of heating and electrode layer.
Above-mentioned purpose of the present invention and advantage detailed description of the preferred embodiment in conjunction with the drawings become more clear.Wherein:
Fig. 1 is a cross-sectional of a thin film type heater formed according to the present invention;
Fig. 2 is a plane sketch of the thin film type heater among Fig. 1; And
Fig. 3 A to 3C shows the plane graph that forms the method for a thin film type heater according to the present invention.
With reference to figure 1 and Fig. 2, a thin film type heater formed according to the present invention comprises: a plurality ofly press the unit zone of heating 20 that a predetermined pattern forms in a substrate 10; One is coated on and is used in the substrate 10 electrode layer 30 of said units zone of heating 20 interconnection to form a current path; With one be coated on the protective layer 40 that is used to protect zone of heating 20 and electrode layer 30 in said units zone of heating 20, electrode layer 30 and the substrate 10.Label 31 representative is used for providing a binding post of electric current to zone of heating 20, and it for example is connected to a main circuit substrate of a boiler-type humidifier or water heater by wire bonds.
Preferably, substrate 10 is a substrate of glass, and for example PVD or CVD form with a metal mask by a kind of dry-coated method for zone of heating 20, electrode layer 30 and protective layer 40.
Preferably, zone of heating 20 comprises TaAl, Ni-Cr alloy, SnO by a kind of being selected from 2, HfB 2Form with the material in the group of Ta, and electrode layer 30 comprises Al, Au, RuO by a kind of being selected from 2Form with the material in the material group of Pt with high conductivity.
The protective layer 40 that is formed by dielectric material is to comprise Si by a kind of being selected from 3N 4, SiO 2Apply with material in the group of SiC etc. upper surface line along zone of heating 20 and electrode layer 30.
According to above-mentioned thin film type heater of the present invention, when electric current applies by binding post 31, it will flow through unit zone of heating 20 by electrode layer 30, thus in this unit zone of heating owing to its resistance produces heat.The material that is used for zone of heating 20 has very high resistance, so that it is heated to a required temperature in the time of a weak point.
Describe a kind of method that forms thin film type heater in detail with reference to Fig. 3 A to 3C below.
As shown in Figure 3A, the substrate of glass 10 with cleaning of metal mask (not shown) covering of a unit zone of heating figure is 5 * 10 7In the vacuum chamber of torr substrate 10 is heated to 200~500 ℃, injects argon gas (Ar) then and comprise TaAl, Ni-Cr alloy, SnO by PVD or a kind of being selected from of CVD deposition 2, HfB 2With the material in the material group of Ta, to form a unit zone of heating 20.At this moment, can control the surface area and the thickness of this zone of heating 20 according to needed resistance value.
Then, a metal mask (not shown) that is used to form an electrode is covered in the above-mentioned substrate 10 that forms zone of heating 20, deposits a kind of being selected from PVD or CVD in a vacuum chamber in above-mentioned substrate 10 again and comprises Al, Au, Ag, RuO 2With the material of the high conductive material group of Pt, to form an electrode layer 30, shown in Fig. 3 B.At this moment, can control the surface area and the thickness of the electrode layer 30 that is deposited suitably according to required resistance value.
Shown in Fig. 3 C, form a protective layer 40 that is used for protected location zone of heating 20 and electrode layer 30.That is: in the substrate 10 that has formed zone of heating 20 and electrode layer 30, cover a metal mask (not shown) that is used to form a protective layer, in a vacuum chamber, in above-mentioned substrate 10, deposit a kind of being selected from PVD or CVD then and comprise Si 3N 4, SiO 2With the material in the material group of SiC.At this moment, preferably, along the above-mentioned protective layer 40 of a said units zone of heating 20 and a predetermined thickness of electrode layer 30 upper surface lines deposition.
Membrane according to the invention type heater adopts a kind ofly to have the material of good resistive performance so that initial heating time is shortened.In addition, can make little heater so that this heater adequate relief is formed in thin film deposition, for example, the total inner surface of water tank, thus the instantaneous efficiency of heating surface increased.

Claims (7)

1. a thin film type heater comprises:
A substrate;
A plurality ofly be coated on this suprabasil unit zone of heating with a predetermined pattern;
One is used for described each unit zone of heating interconnection to form the electrode layer of a current path; With
One is coated on the protective layer that described substrate is used to protect described zone of heating and electrode layer.
2. thin film type heater according to claim 1, wherein, described zone of heating is to comprise TaAl, Ni-Cr alloy, SnO by a kind of being selected from 2, HfB 2Form with material in the material group of Ta.
3. thin film type heater according to claim 1 wherein, also comprises a binding post that is used to described heater to apply electric current.
4. thin film type heater according to claim 1, wherein, described electrode layer is to comprise Al, Au, Ag, RuO by a kind of being selected from 2Form with material in the material group of Pt.
5. thin film type heater according to claim 1, wherein, described protective layer is to comprise Si by a kind of being selected from 3N 4, SiO 2Form with material in the material group of SiC.
6. thin film type heater according to claim 1, wherein, described protective layer forms and has a preset thickness along the upper surface line of described zone of heating and described electrode layer.
7. method that is used to make thin film type heater may further comprise the steps:
(a) comprise TaAl, Ni-Cr alloy, SnO with a kind of being selected from 2, HfB 2In a substrate, apply a film with the material in the material group of Ta, to form a unit zone of heating with a predetermined pattern;
(b) by with described unit zone of heating and described suprabasil electrode layer interconnection, form an electric pathway
(c) in above-mentioned substrate, form a protective layer, to protect described zone of heating and electrode layer.
CN98108722A 1997-06-12 1998-06-01 Thin film type heater and method of manufacturing the same Pending CN1202602A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019970024281A KR100213110B1 (en) 1997-06-12 1997-06-12 Thin film heater and its manufaturing method
KR24281/97 1997-06-12

Publications (1)

Publication Number Publication Date
CN1202602A true CN1202602A (en) 1998-12-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN98108722A Pending CN1202602A (en) 1997-06-12 1998-06-01 Thin film type heater and method of manufacturing the same

Country Status (4)

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JP (1) JPH1131577A (en)
KR (1) KR100213110B1 (en)
CN (1) CN1202602A (en)
GB (1) GB2327028A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101690385A (en) * 2007-06-05 2010-03-31 雷斯梅德有限公司 Electrical heater with particular application to humification and fluid warming
CN101294854B (en) * 2007-04-23 2010-12-01 博奥生物有限公司 Chip type heater element
CN102665306B (en) * 2003-09-17 2015-01-07 又荣医疗科技有限公司 Heater and method for producing the same using PCB process

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KR100352892B1 (en) * 2000-05-22 2002-09-16 주식회사 팍스텍 Method for manufacturing thin film heating material and heating device thereof
TW592830B (en) 2002-03-29 2004-06-21 Casio Computer Co Ltd Chemical reaction apparatus and power supply system
JP3891131B2 (en) 2002-03-29 2007-03-14 カシオ計算機株式会社 Chemical reaction apparatus and power supply system
JP2005149751A (en) * 2003-11-11 2005-06-09 Olympus Corp Heater element
KR100915708B1 (en) * 2007-08-31 2009-09-04 한국기계연구원 Heating substrate equipped with conductive-thin-film and electrode and manufacturing method of the same
CA2744032C (en) * 2008-11-20 2018-07-31 Oerlikon Trading Ag, Trubbach Cleaning method for coating systems
JP5603601B2 (en) * 2010-01-15 2014-10-08 株式会社ブリヂストン Heater unit
AU2012269735B2 (en) 2011-06-16 2016-04-21 ResMed Pty Ltd Humidifier and layered heating element
JP5842782B2 (en) * 2012-10-17 2016-01-13 株式会社デンソー Radiation heater device
US9063041B2 (en) 2012-11-30 2015-06-23 General Electric Company Device and method for drying biological sample on substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4296309A (en) * 1977-05-19 1981-10-20 Canon Kabushiki Kaisha Thermal head
GB2091527A (en) * 1981-01-14 1982-07-28 Boussois Sa Heatable Panels
GB2154403A (en) * 1984-01-31 1985-09-04 Glaverbel Heatable glazing panels
WO1986006241A1 (en) * 1985-04-15 1986-10-23 Email Limited Heating element
JP2617110B2 (en) * 1988-02-29 1997-06-04 富士ゼロックス株式会社 Manufacturing method of resistor

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102665306B (en) * 2003-09-17 2015-01-07 又荣医疗科技有限公司 Heater and method for producing the same using PCB process
CN101294854B (en) * 2007-04-23 2010-12-01 博奥生物有限公司 Chip type heater element
CN101690385A (en) * 2007-06-05 2010-03-31 雷斯梅德有限公司 Electrical heater with particular application to humification and fluid warming
US8873941B2 (en) 2007-06-05 2014-10-28 Resmed Limited Electrical heater with particular application to humidification and fluid warming
CN101690385B (en) * 2007-06-05 2015-05-27 瑞思迈有限公司 Electrical heater with particular application to humification and fluid warming
CN104812111A (en) * 2007-06-05 2015-07-29 瑞思迈有限公司 Electrical heater with particular application to humidification and fluid warming
CN104812111B (en) * 2007-06-05 2017-05-10 瑞思迈有限公司 Electrical heater with particular application to humidification and fluid warming
US9993609B2 (en) 2007-06-05 2018-06-12 Resmed Limited Electrical heater with particular application to humidification and fluid warming
US11786691B2 (en) 2007-06-05 2023-10-17 ResMed Pty Ltd Electrical heater with particular application to humidification and fluid warming

Also Published As

Publication number Publication date
KR100213110B1 (en) 1999-08-02
KR19990001077A (en) 1999-01-15
GB2327028A (en) 1999-01-06
JPH1131577A (en) 1999-02-02
GB9811901D0 (en) 1998-07-29

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