CN1199036C - Digital infrared heat image detection system - Google Patents
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Abstract
The present invention relates to a digital infrared detecting system for thermal images, which comprises an infrared detecting device for detecting the radiation quantity of an object to be detected and producing a digital electric signal corresponding to the radiation quantity, a circuit device for forming picture frame data corresponding to the radiation quantity of the object to be detected and a display device for receiving and displaying the picture frame data of the circuit device. The infrared detecting device can pick up the picture frame data at different temperature as standard data under the control of the circuit device at different temperature so as to automatically calibrate infrared temperature measurement to optimality, reduce cost and increase the service life of a product.
Description
[technical field]
The present invention relates to a kind of digital infrared heat image detection system, particularly relate to a kind of High Performance Digital infrared heat image detection system that is used in medical application.
[background technology]
Because no matter produce all can heat radiation for anything, therefore available infrared detector detects location, temperature or the shape etc. of this sample thing, especially in medical treatment, because human body is along with self variation of temperature is sent different thermal exposures, utilize the infrared heat image detecting device to come the condition of passive human body, can avoid utilizing invasive or initiative (release energy collect return signal by instrument) equipment (as introscope sampling, X-ray, CT Scan even ultrasonic etc.) to detect issuable harm.Generally speaking, disclose as No. 6023637 patent of United States Patent (USP), infrared detector is to produce the electric signal that is the linearization relation with thermal exposure, and utilizes a device to handle this electric signal and form the images that show different colours with the temperature difference, for doctor's reference.
Yet, heat image detection system was that machinery " point " scan-type forms image in the past, make speed that an image forms slowly (system in the past forms an image and needs 5 seconds approximately) and non real-time, with be to utilize before to be stored in to make color range with respect to thermoflux maximal value and minimum value and distribute in the past, yet in fact surrounding environment may change, make that the temperature that obtains only is that relative temperature is not correct temperature, so may cause the healthcare givers to judge by accident.Thereby, can utilize video signal interface at a high speed to cooperate the Automatic Calibration Technique of simplifying except solving one of foregoing problems means, more can have effects such as whole adjustment, precise information and thermal imagery demonstration in real time.
[summary of the invention]
A purpose of the present invention is to provide a kind of digital infrared heat image detection system that can reach the effect that improves precision.
Another object of the present invention is to provide a kind of digital infrared heat image detection system that can reach the effect of the flow process that simplifies the operation.
Another purpose of the present invention is to provide a kind of digital infrared heat image detection system, is by with the assembly mould blocking in the infra-red ray detection device, and can reach assembling and substitute the effect that makes things convenient for and can cooperate different types of infrared detector.
A further object of the present invention be to provide a kind of can be by the circuit arrangement module be changed into an add-on card, and can reach assembling and substitute digital infrared heat image detection system easily.
A more purpose of the present invention is to provide a kind of and can reaches the digital infrared heat image detection system of assembly mould blocking to reduce cost.
The invention is characterized in: a kind of digital infrared heat image detection system is characterized in that it comprises:
One circuit arrangement, be lower than the electric current of low temperature of specified temp to infra-red ray detection device in order to export the high temperature and one that is higher than specified temp corresponding to a specified temp, respectively, so that this infra-red ray detection device can be positioned at different temperatures, then and each temperature data of the data information that will import and storage in advance computing of making comparisons, with the parameter that concerns between calibration thermal radiation amount and temperature, at the digital electric signal that receives by the determinand of this infra-red ray detection device output, form the drawing frame data of a pair of temperature that should determinand according to this parameter and digital electric signal;
One infra-red ray detection device, the thermal radiation amount that can detect determinand is to export a relative digital electric signal, and before detecting determinand, this infra-red ray detection device is under the input of no extraneous light, and the electric current of described specified temp, high temperature and the low temperature that provides according to described circuit arrangement realizes detecting and distinguishing the output data data;
One display device is in order to the drawing frame data that receives above-mentioned this circuit arrangement and be shown in this display device.
[description of drawings]
The present invention is described in detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the circuit block diagram of preferred embodiment of the present invention.
Fig. 2 is the circuit block diagram of the circuit arrangement of preferred embodiment of the present invention.
Fig. 3 is the partial exploded view of the infra-red ray detection device of preferred embodiment of the present invention.
Fig. 4 is that synoptic diagram is calculated in the heat radiation of preferred embodiment of the present invention.
Fig. 5 is the action flow chart of preferred embodiment of the present invention.
Fig. 6 is the number of pixels distribution plan of different temperatures in the image data of one embodiment of the invention.
Fig. 7 is that preferred embodiment of the present invention is combined in the synoptic diagram on the workbench.
Fig. 8 shows that preferred embodiment of the present invention is combined in the synoptic diagram on another workbench.
[embodiment]
Consulting shown in Figure 1ly, is the preferred embodiment of digital infrared heat image detection system of the present invention, and present embodiment comprises an infra-red ray detection device 1, a circuit arrangement 2 and a display device 3.
This infra-red ray detection device 1 forms a digital electric signal in order to thermal exposure and the corresponding radiation flux that detects a determinand such as human body.This infra-red ray detection device 1 has an infrared ray camera lens group (IR optics) 11, one thermoelectric cooling module (TEC) 12, one non-cooled focusing surface array detecting device (FPA Dewar) 13, one amplifying circuit module 14, and simulates to digital conversion circuit collection modules (Analog CCA) 15, one input/output circuitry collection modules (I/O CCA) 16 and one system power supply supply circuit collection modules 17 (System P/S CCA).This infrared ray camera lens group 11 is in order to collect the infrared ray of incident, have and use the optical filter that passes through for suitable wavelength infrared ray, one in order to cover this camera lens 11 earlier to stop the anti-dazzling screen of infrared ray incident before detecting determinand, to allow this infrared heat image detection system capture a reference electrical signal, use to cooperate calibration, and the thermal source Control Component (blackbody soure) 111 of an electric connection input/output circuitry collection modules 15, in order to by circuit arrangement 2 through input/output circuitry collection modules 15 input currents, and thermal source Control Component 111 is different and can be positioned at different temperatures with the feed-in size of current.Present embodiment is when beginning to measure image, utilize anti-dazzling screen to stop behind the external light source in advance and control thermal source Control Component 111 temperature, in respectively to be higher than the low temperature that middle warm high temperature and one is lower than middle temperature, make circuit arrangement 2 can obtain three groups of background datas image and the correct parameter value use of calculating as a setting.In the present embodiment, the thermal source (being the infrared ray amount) that is detected when lens group 11 is non-to be in the preset range time, suppose when being lower than preset range, then can apply electric current by 111 pairs of lens group 11 of input/output circuitry collection modules 15 these thermal source Control Components of control, to increase thermal source, perhaps, when being higher than preset range, then can apply negative current, reduce thermal source, whereby, can be to the Infrared wavelength that should focusing surface array detecting device 13 be detected and select the lens group of different size, producing thermal-radiating Infrared wavelength at this corresponding human body is 8～12 μ m, thus the infrared ray camera lens group 11 that selection can supply wavelength 8～12 μ m to pass through, and this infrared ray camera lens group 11 can be suitable for different types of detecting device 13.
This focusing surface array detecting device 13 comprises most infrared detection born of the same parents.Respectively this infrared detection born of the same parents receive this counterparty respectively to the infrared radiation amount of incident and produce an analog electrical signal, to form analog electrical signal set.And this detecting device 13 can be for selecting a formation by indium antimonide (InSb), platinum silicide (PtSi), indium in the group that mercury (MCT) and heat radiation detector (Micro-Bolometer) are formed.Select in the present embodiment to utilize the heat radiation detector of thermistor to be used as detecting device 13, because the detecting device 13 of this heat radiation detector is non-cooled, so normal operation at room temperature, and do not need cooling system, so with respect in the past (infrared heat image detection system in the past uses the cooled detecting device), and the life-span and the standby for a long time that can prolong detecting device.But in the present embodiment, for guaranteeing that this detecting device 13 is raised down because of factors such as the long-time actions of electronic package in temperature, but still normal operation also can be provided with thermoelectric cooling module 12 before detecting device 13, in order to cool off this non-cooled focusing surface array detecting device 13 to proper temperature.Moreover the detecting device of present embodiment is that array detects, and is two-dimentional formula electronic type scanning, so the acquisition time of thermal imagery data is compared with some mechanical scan in the past, the time of the present invention can effectively reduce.
This amplifying circuit module 14 is to connect focusing surface array detecting device 13, simulates to digital conversion circuit collection modules 15 to this in order to amplify the analog electrical signal set that this focusing surface array detecting device 13 exported.This amplifying circuit module 14 have amplifying circuit set (Preamp CCA) 141 with amplify this analog electrical signal set to suitable voltage quasi position (for example :-1～1V), and one amplify power supply circuit set (Preamp P/S CCA) in order to amplify power supply of supplying with this amplifying circuit set 141.
This simulates to digital conversion circuit collection modules 15 is to connect this amplifying circuit module 14, in order to receive the analog electrical signal set of amplifying through this amplifying circuit module 14 and to convert digital electric signal to.
This input/output circuitry collection modules 16 is to connect this to simulate to digital conversion circuit collection modules 15, this is simulated to the digital electric signal of digital conversion circuit export circuit arrangement 2 to through this module 16.
This system power supply supply circuit collection modules 17 is to be electrically connected this respectively to simulate to digital conversion circuit collection modules 15, input/output circuitry collection modules 16 and amplify power supply circuit set 142, with power supply to these assemblies.
With reference to shown in Figure 3, infra-red ray detection device 1 in the present embodiment, respectively with amplifying circuit module 14, simulate to digital conversion circuit collection modules 15, input/output circuitry collection modules 16 and system power supply supply circuit collection modules 17 modularizations, compared in the past these circuit were done on same circuit board, causing the present invention only need substitute corresponding module when need are changed different assembly gets final product, for instance, when changing different infrared ray camera lens groups 11 and focusing surface array 13, only need substitute partial circuit module such as amplifying circuit module 14, when perhaps partial component is damaged, only need substitute the damage module that member was positioned at gets final product, yet but the monoblock circuit board must be changed in the past, so it is replaceable melanoscope head group 11 or focusing surface array detecting device 13 that the present invention only needs lower cost, for the user, more meet financial cost.
Fig. 2 shows that the present invention calculates the circuit block diagram of the circuit arrangement 2 of infrared heat width of cloth survey.It is preferable enforcement that this circuit arrangement 2 turns to a peripheral assembly interconnect interface (peripheral component interconnectinterface is hereinafter to be referred as pci interface) add-on card with module.This circuit arrangement comprises a transmission line (HOT Link Transeviers) 21, one latch circuit (16bit Latch) rank, 22, one gain/position offset memory (Gain/Offset RAM) 23, one signal processing circuit 24, a pci interface (PCI Interface) 25 and one pci bus (PCI bus) 26.
This transmission line 21 is to connect infra-red ray detection device 1 and circuit arrangement 2 respectively, with the transmission of digital electric signal through a latch circuit 22 of circuit arrangement 2 gain multiplied unit (Gainmultiplier) 241 (repeating after the appearance) to signal processing circuit 24.
This gain/rank, position offset memory 23 gains and rank, position migration parameter in order to store many groups, and wherein one group of parameter is that corresponding specific operation environment sets, as in 21 ℃ of following secret rooms of temperature.
This signal processing circuit 24 is to be electrically connected this latch circuit 22, the digital electric signal of being exported with receiving infrared-ray pick-up unit 1, and this digital electric signal is made suitably to handle and export a PCI drawing frame data from the required parameter of above-mentioned gain/rank, position offset memory 23 acquisitions.This signal processing circuit 24 more comprises a rank offset units (Offset Image) 242, one interface circuit (Interface EPLD) 243, one buffering circuit (FIFO) 244, a PCI drawing frame data storage element (PCI Frame Store) 245 except comprising a gain multiplied unit 241.These gain multiplied unit 241 coupler latch lock circuits 22 to be receiving digital electric signal, and capture a gain parameter with this digital electric signal that gains from above-mentioned gain/rank, position offset memory 23.This rank offset units 242 is to connect above-mentioned gain/rank, position offset memory 23 and gain multiplied unit 241 respectively, in order to from this gain/rank, position offset memory rank migration parameter of 23 acquisitions the digital electric signal through these gain multiplied unit 241 gains is carried out a rank skew and forms signal of video signal output.This interface circuit 243 is connect to go up rheme rank offset units 242, and normalization forms the PCI drawing frame data from the signal of video signal of this rank offset units 242, to export above-mentioned pci interface 25 to.Again, in the present embodiment, but this rank offset units 242 and this interface circuit 243 are an electricity programmed logic array (EPLD) is preferred embodiment, can capture repeatedly determinand continuously or store the higher picture of resolution and use for convenience, this signal processing circuit 24 is more utilized the buffering circuit 244 of this rank offset units 242 of connection, will be through interface circuit 243 normalized PCI drawing frame data, delivering to PCI drawing frame data storage element (PCI Frame Store) 245 with the principle of first in first out stores, and owing to be to utilize the PCI specification in the present embodiment, so the drawing frame data transmission speed can be up to 250MHz.
This pci bus 26 is in order to the PCI drawing frame data that receives above-mentioned pci interface 25 and is sent to display device 3.
Refer again to Fig. 1, in the present embodiment, this display device 3 is the computing machine of general image workbench.This display device 3 has a main frame 31 and a display screen 32 substantially, and a motherboard 311 is set in this main frame 31.Have a pci bus 310 on this motherboard 311, plant, form circuit arrangement 2 and be connected with telecommunications between the motherboard 311 for modular circuit arrangement 2.Again, the main frame 31 of present embodiment is more assembled some common computer modules, as a power supply unit (PC P/S) 33, one hard disk (Harddisk) 34, a floppy disk (Floppy disk) 35, one CD-ROM drive (CD-ROM) 36 and a modulator-demodular unit (Modem) 37, and on motherboard 311, also have the parallel port (Parallel Ports) 314 of a microprocessor (Processor) 312, a presentation card (Video Card) 313 and for external printer 38.And the circuit arrangement 2 PCI drawing frame data after handling as calculated the pci interface bus 310 of machine host 31 transfer to presentation card 313 and carry out image processing and be sent to display screen 32 and watch for users, at this, this display screen 32 is to be preferable enforcement with computer screen (PCMonitor), but also can utilize the RS-170 transmission line to be connected to TV screen (TV Monitor) 32 ' demonstration.Moreover, in this example, owing to can utilize PCI drawing frame data storage element 245 to store lot of data, so picture is to can be 320 * 240 pixels (pixel), 640 * 480 pixels or 1024 * 960 pixels, and storing Control Software in main frame 31 allows the shown color of each pixel be the temperature that this position radiation emitted amount that should determinand is converted and forms, so with the temperature difference, colour developing also changes thereupon, the picture that also can utilize a printer 38 will be presented at display screen 32 prints, at this this printer 38 is with the color printer preferred embodiment, watches to make things convenient for the user.
With reference to Fig. 4, the account form of circuit arrangement 2 of the present invention is described below:
1. radiation flux (Radiant Flux) account form:
Calculate in the scope of human body temperature according to Pu youth Ke Dinglv, the relation of light intensity that determinand sent and Infrared wavelength and temperature is shown in following formula 1:
Wherein: L
e=light intensity
λ=Infrared wavelength
T=determinand absolute temperature
C
1=constant=11,911 μ m
5Watts/ (cm
2-sr-μ m)
C
2=constant=14,388 μ m-K
And penetrate flux shown in following formula 2 through the infrared ray camera lens group 11 collected width of cloth at a certain section wavelength:
Wherein: Φ
e=radiation flux (Radiant Flux)
A
d=gain
The F=infrared frequency
τ
0=the time interval
2. the analog electrical signal set that is produced about line focus face array detecting device 13:
Because the analog electrical signal that focusing surface array detecting device 13 is produced set is linear with the radiation flux that is received, both relations can be utilized following formula 3 expressions:
V=R Φ
eVolt... formula 3
Wherein: v=detecting device output (Detector Output)
3. about entering the analog electrical signal set of simulating to digital conversion circuit collection modules 15:
Because analog electrical signal is integrated into the situation generation that the process of transmission has a rank skew, and can gain through amplifying circuit module 14 amplifying reaching suitable voltage quasi position, so enter the relation simulated between the electric signal of being exported to the electric signal of digital conversion circuit collection modules 15 and original focusing surface array detecting device 13 shown in following formula 4:
V=G (v-v
0) volts... formula 4
Wherein: the V=analogy is to the input (ADC Input) of digital converter
v
0The value (Offset) of rank ,=position skew
4. about simulating the digital electric signal of being exported to digital conversion circuit collection modules 15:
The relation of the analog electrical signal set through simulating the digital electric signal exported to digital conversion circuit collection modules 15 and input is shown in following formula 5:
N=r (V+1) Count...... formula 5
Wherein: the N=analogy is to the output (ADC Output) of digital converting set module
r＝4095/2?Counts/Volt
5. about the signal processing mode of circuit arrangement 2:
After circuit arrangement 2 receives infra-red ray detection device 1 output, utilize above-listed formula to calculating to go out suitable gain and rank, position migration parameter, to be stored in gain/rank, position offset memory 23, so can directly utilize gain multiplied unit 241 and rank, position offset units 242 to gain on circuit arrangement 2 amplifies and the skew action of rank, position, to calculate correct radiation flux, and then after normalization is handled, deliver to the Control Software in display device 3 main frames, make different radiation fluxes demonstrate different colours, be that different temperature can show different colours, so watch the picture on the display screen 32, promptly know the Temperature Distribution of determinand, and the user can be by watching this picture to judge where whether determinand such as human body have temperature anomaly.
6. the compensation way of infrared detector:
Owing to use infrared heat image detection system at medical application, often be provided with in the airtight little space and this space maintains a fixing specified temp (mostly maintaining 22 ℃ in the ward) usually, so be stored in the radiation flux that infrared ray camera lens group is captured under this temperature in this space in the native system earlier, with as with reference to data.So, the user only needs the directly radiation flux of acquisition determinand, and after the radiation flux after the acquisition can compare correction with the parameter of the data that store in advance and corresponding this specific environment, and on display screen 32, show correct picture, to avoid the needing user to key in the shortcoming that a lot of setting datas could use earlier in the past, reach the effect of simplifying user's operation.In addition, in the present embodiment, owing to utilize before the radiation flux of infra-red ray detection device 1 acquisition determinand, the anti-dazzling screen of this infrared ray camera lens group 11 is done first start and is covered camera lens, to stop infrared ray incident, make under the situation that does not have infrared ray incident, temperature in doing earlier, background data is used as in the background frame sampling of high temperature and low temperature, then remove under the situation that no longer stops infrared ray incident in determinand location and anti-dazzling screen, capturing radiation flux again makes comparisons with previous background data, (different to identical radiation flux reaction with all infrared detection born of the same parents in focusing surface array detecting device 13 as some infrared detection born of the same parents as if the different situation of task performance is arranged, promptly different in the R of formula 3 value) under, still can demonstrate correct drawing frame data.
Fig. 5 is the process flow diagram of preferred embodiment of the present invention.The present embodiment software control of can arranging in pairs or groups makes preestablishing under the specified temp and still can do real-time correction automatically, to avoid healthcare givers's operating difficulties.At first, after the infrared ray detection system begins to activate, enter step 61, order focusing surface array detecting device 13 enters " input (IN) " pattern, promptly infra-red ray detection device 1 and circuit arrangement 2 are set related data, do first start with the anti-dazzling screen of infrared ray camera lens group 11 and cover camera lens, to stop infrared ray incident, make and under the situation that does not have infrared ray incident, to do the background frame sampling earlier and to be used as background data.Thereafter, carry out step 62, set focusing surface array detecting device 13 to middle temperature (Mid-Temp), Wen Weiyi specified temp also can obtain by electric current to the thermal source Control Component 111 of this temperature correspondence of feed-in as 21 ℃ in this.Then, carry out step 63, to should in temperature and aforementioned formula, design temperature TI and simulating to the relation between the output Nf of digital conversion circuit collection modules 15.Then step 64 transmit to should in temperature equal 1 original gain parameter to gain multiplied unit 241.Moreover, carry out step 65, the raw bits rank migration parameter that calculates temperature in the correspondence is to rank, position offset units 242.Wherein, step 64 and 65 is in order to make whole position rank skew optimization, and then in step 66, self-alignment rank offset units 242 writes original gain to rank, gain/position offset memory 23 and begins to gain.Then step 67 is utilized above-mentioned setup parameter, the picture frame of warm drawing frame data and mean value (background data) in the intercepting and capturing.Skip to step 68, calculate accurately rank, position migration parameter to utilize this picture frame.Secondly, in step 69, transmit accurately rank, position migration parameter to rank, a position offset units 242.Skip to step 70, order focusing surface array detecting device 13 enters " output (OUT) " pattern, promptly removes anti-dazzling screen and begins to receive extraneous (determinand) ultrared infrared radiation.To step 71, at image load mode utilize direct memory access (Direct Memory Access thereafter; DMA) controller is carried out the image transmission, to obtain transfer rate and better transmission efficiency faster.Then in step 72, repaint the picture frame of drawing frame data according to the image data of sending into.Then, step 73 is controlled for being presented on the computer screen 32 the drawing frame data image mode.Skip to step 74 and carry out imaging in kind (Life Imagery), make the image frame data presentation on computer screen 32.Then, step 75 orders focusing surface array detecting device 13 to enter " input (IN) " pattern once more again.Then step 76 is set focusing surface array detecting device 13 to high temperature (Hi-Temp), and this high temperature is higher than the middle temperature of step 62, and this high temperature also can precisely obtain by Current Control thermal source Control Component 111.To step 77, when focusing surface array detecting device 13 be set to high temperature, intercept and capture simulate to digital conversion circuit collection modules 15 outputs digital computation result at high temperature thereafter.Secondly to step 78, set focusing surface array detecting device 13 to low temperature (Lo-Temp) by thermal source Control Component 111, this low temperature is lower than the middle temperature of step 62, then intercepts and captures and simulates to the digital computation result of digital conversion circuit collection modules 15 outputs at low temperature.Then, to step 79, according to the digital computation result of step 87 and step 88 calculate between high temperature and low temperature one suitably in temperature, and set focusing surface array detecting device 13 to middle temperature, in this warm numerical value may with the middle temperature numerical value of step 62 difference to some extent.Then, intercept and capture and simulate to the warm hereinto digital computation result of digital conversion circuit collection modules 15 outputs to step 80.Skip to step 81, corresponding result of calculation produces correct temperature.Secondly to step 82, order focusing surface array detecting device 13 switches to " output " pattern.And more utilizing hard disk 34 to store a database in the present embodiment, storing many in the database should have setting data in response to conditions such as varying environment, different temperatures.In step 83, judge whether the signal of focusing surface array detecting device 13 outputs in step 82 is the data that had in the database.If yes, then skip to step 84 by the database access setting data with acceleration imaging action, and then intercept and capture imaging to step 85.If in the time of not, jump directly to step 85 and utilize the aforementioned formula of mentioning to intercept and capture imaging.Then the imaging of intercepting and capturing is noted down with radiation and be stored to database to step 86.Secondly judge in step 87 whether the imaging of intercepting and capturing is successful.If when unsuccessful, then rebound step 83 proceeds to intercept and capture the action of imaging according to abovementioned steps.If during success, then rebound step 74 imaging in kind, then judge to step 88, if determine that imaging data is identical with the original imaging data in step 73, jump directly to step 73 control chart frame data image mode and revise and do not exist together then to step 74 imaging in kind in step 88.If judge that through step 88 this imaging data with when the different but need setup parameter of the original imaging data drawing frame data part of step 73 is identical, then skips to step 67 and intercepts and captures drawing frame data again.If judge that through step 88 this imaging data with neither when identical at the need setup parameter of the original imaging data of step 73, then skip to step 61 and resets recycle once.Thereby, in the present embodiment, be to utilize current digital control temperature value earlier, so temperature can be correct, and can not be subjected to the influence of environment and the limit is moved, moreover can utilize aforementioned formula to calculate and descend corresponding temperature for each pixel temperature (step 62), high temperature (step 76) and low temperature (step 78) in correct, so when the beginning filmed image, then can utilize these data correct calculation to go out the temperature of each pixel, thereby present embodiment reach and precisely present imaging in kind really.Moreover, the thermal imagery system of present embodiment more adds up the number of pixels in each temperature except the temperature of calculating each pixel, to show in the lump on the display device 3 as the number of pixels distribution plan on each temperature of Fig. 6, have removable on this distribution plan and be positioned at a coboundary 91 and a lower boundary 92 on the different temperatures, and each pixel in the scope between the temperature of the temperature that falls within the coboundary and lower boundary can show corresponding color range according to temperature, and the pixel that surpasses this temperature range shows with solid color, so can delete scope drawing frame data in addition, only to show the person's of being taken image, and can be with border 91,92 position changes come the changing temperature scope, adjust two borders 91 so that the healthcare givers can utilize, 92 make picture only show required Temperature Distribution.
It should be noted that, in the aforementioned embodiment, though the assembly that comprises with it for the member specification in the above description, mutual signal transmission standard is set at the suchlike setting of PCI or the like in for example all members, yet, be familiar with these operators as can be known, in fact aforementioned limitations can do suitable change according to manufacturer and prior art, changes with change and should comprise in the present invention so disclose the equivalence of member.
As shown in Figure 7, comprise more that at above-mentioned digital infrared heat image detection system one can allow on the aforementioned means setting workbench 4 thereon, can supply ccontaining main frame 31 in this workbench 4, more extend upward a high platform 41 and extend a horizontal plate 42 forward at its end face, and pulley 43 is set, and at the vertical slide rail 44 of assembling of its a side in its bottom.End face 411 at this high platform 41 is suitable for placing a display screen 32.Be suitable for Control Components such as horizontal one keyboard or mouse at horizontal plate 42.On this slide rail 44, be suitable for assembling infra-red ray detection device 1, and this infra-red ray detection device 1 can move vertically thereon.Moreover, can utilize the pulley 43 of this workbench 4, infra-red ray detection device 1 can all around be moved, and utilize slide rail 44 that infrared detecting device 1 can be moved up and down, reach the advantage that infra-red ray detection device 1 can be moved in three dimensions.
In addition, Fig. 8 be show another kind of workbench 4 ', the place that they are different with aforesaid workbench 4, be the erection mode of infra-red ray detection device 1, workbench 4 ' a side fix a upright fixed bar 44 ', and fixed bar 44 ' an end 441 ' more be connected an adjutage 45 that can move in three dimensions ' an end 451 ', and this adjutage 45 ' the other end 452 ' be more suitable for group establish infra-red ray detection device 1, reach the effect that person more flexible and more convenient to use operates that moves of infra-red ray detection device 1 whereby.
With regard to the above, digital infrared heat image detection system of the present invention has following advantage really:
1. precision height:
Temperature in the human body temperature scope and the relation between heat radiation can utilize anti-dazzling screen shading and thermal source Control Component 111 to make the standard thermal source, the background data of obtaining not affected by environment, with according to the data of acquisition be stored in advance that the reference data of specified temp calculates correct parameter in the system, can utilize aforementioned background data as standard value when then forming image, calculate correct Temperature Distribution, precisely concerned between corresponding conversion heat radiation and the temperature so can solve in the past, moreover, also avoid the incorrect image that causes because of part fault and external temperature change, and by repeatedly comparing, to reach the high advantage of precision.
2. simplify the operation:
System is positioned in the confined chamber on keeping a specified temp (as 22 ℃), and when bringing into use at every turn, utilize software control acquisition specified temp in advance, calibration and storage are used as standard in advance down for one high temperature and a low temperature, allow the healthcare givers need not key in any setting data, only needing directly, the heat radiation of acquisition determinand gets final product, reach the effect that simplifies the operation, and owing to use non-cooled focusing surface array detecting device 13, do not need cooling system to lower the temperature so can directly under specified temp, operate, make the extensible and saving great amount of cost of life-span of focusing surface array detecting device 13.
3. assembling and replacing are convenient:
In the present embodiment, respectively with amplifying circuit module 14, simulate to digital conversion circuit collection modules 15, input/output circuitry collection modules 16 and system power supply supply circuit collection modules 17 modularizations, compared in the past these circuit were done on same circuit board, the present invention is when changing different infrared ray camera lens groups 11 and focusing surface array 13, only need substitute partial circuit module such as amplifying circuit module 14, and the monoblock circuit board must be changed in the past, so it is replaceable melanoscope head group 11 or focusing surface array detecting device 13 that the present invention only needs lower cost, for the user, more meet financial cost.In addition, must customize special presentation card to carry out required image processing as gain, position rank skew etc. in the past, cost can be in any more always, handle with the circuit arrangement 2 that module changes into the PC add-on card of a PCI and be about to image processing in the present invention earlier, use so can directly be plugged in the general computing machine, and need not change presentation card, cost is greatly descended.
4. cost descends:
As previously mentioned, respectively with amplifying circuit module 14, simulate to digital conversion circuit collection modules 15, input/output circuitry collection modules 16 and system power supply supply circuit collection modules 17 modularizations, required cost when changing assembly is descended, with with circuit arrangement 2 modularizations, to avoid customized special presentation card to incur a considerable or great expense, and because circuit arrangement 2 can utilize data under the burning varying environment, reach the effect of applicable varying environment, so circuit arrangement 2 can be made in a large number to reduce cost, only need the data that burning is failed before dispatching from the factory to get final product, thereby the present invention have the advantage that reduces cost really.In addition, adopt the detection components of non-cooled, can prolong with cost compared to cooled detection components life-span in the past and also can decline to a great extent because of the present invention adopts detecting device 13.
Claims (13)
1. digital infrared heat image detection system is characterized in that it comprises:
One circuit arrangement, be lower than the electric current of low temperature of specified temp to infra-red ray detection device in order to export the high temperature and one that is higher than specified temp corresponding to a specified temp, respectively, so that this infra-red ray detection device can be positioned at different temperatures, then and each temperature data of the data information that will import and storage in advance computing of making comparisons, with the parameter that concerns between calibration thermal radiation amount and temperature, at the digital electric signal that receives by the determinand of this infra-red ray detection device output, form the drawing frame data of a pair of temperature that should determinand according to this parameter and digital electric signal;
One infra-red ray detection device, the thermal radiation amount that can detect determinand is to export a relative digital electric signal, and before detecting determinand, this infra-red ray detection device is under the input of no extraneous light, and the electric current of described specified temp, high temperature and the low temperature that provides according to described circuit arrangement realizes detecting and distinguishing the output data data;
And
One display device is in order to the drawing frame data that receives above-mentioned this circuit arrangement and be shown in this display device.
2. digital infrared heat image detection system as claimed in claim 1 is characterized in that:
This infra-red ray detection device comprises:
One infrared ray camera lens group, have a required ultrared optical filter in order to collection incident, and adjust the thermal source Control Component of the temperature of camera lens in order to the control that is subjected to this circuit arrangement, and then adjust the infrared radiation amount in order to the anti-dazzling screen, that covers infrared ray incident in good time;
One non-cooled focusing surface array detecting device, comprise most infrared detection born of the same parents, respectively this infrared detection born of the same parents give birth to an analog electrical signal in order to respectively this counterparty who receives described infrared ray camera lens group to the infrared radiation volume production of incident, to form analog electrical signal set;
One simulates to the digital conversion circuit collection modules, converts digital electric signal in order to the analog electrical signal set that above-mentioned focusing surface array detecting device is exported; And
One input/output circuitry collection modules, with so that above-mentioned simulate to the digital electric signal of digital conversion circuit through this circuit set output.
3. digital infrared heat image detection system as claimed in claim 2 is characterized in that:
Infra-red ray detection device more comprises a thermoelectric cooling module, in order to cool off this focusing surface array detecting device in suitable temperature.
4. digital infrared heat image detection system as claimed in claim 2 is characterized in that:
This infra-red ray detection device more comprises an amplifying circuit module, simulates to the digital conversion circuit module to this in order to amplify the analog electrical signal set that this focusing surface array detecting device exported.
5. digital infrared heat image detection system as claimed in claim 2 is characterized in that:
This circuit arrangement is more added up the number of the infrared detection born of the same parents of this non-cooled focusing surface array detecting device under different temperatures, and is sent to this display device to be shown in the number distribution plan of the infrared detection born of the same parents under the different temperatures.
6. digital infrared heat image detection system as claimed in claim 5 is characterized in that:
Have a high temperature border and a low temperature border that can be moved and be positioned on the different temperatures on this number distribution plan, forming a temperature range, and the image Temperature Distribution that shows on this display device is to be positioned between this temperature range.
7. digital infrared heat image detection system as claimed in claim 1 is characterized in that:
This circuit arrangement comprises:
One transmission line is to connect above-mentioned infra-red ray detection device, in order to transmit this digital electric signal;
Rank, one gain/position offset memory is in order to the parameter of storage arrays gain and the skew of rank, position;
One signal processing circuit in order to receiving the digital electric signal that above-mentioned transmission line is imported, and makes suitably to handle and export a drawing frame data from the required parameter of above-mentioned gain/rank, position offset memory acquisition to this digital electric signal;
One interface will be in order to will receive the drawing frame data of above-mentioned signal processing circuit; And
One bus is in order to the drawing frame data that receives above-mentioned interface and export above-mentioned display device to.
8. digital infrared heat image detection system as claimed in claim 7 is characterized in that:
The signal processing circuit of this circuit arrangement comprises:
One gain multiplied unit is to connect above-mentioned transmission line, and captures a gain parameter and the digital electric signal that gains and import from this transmission line from above-mentioned gain/rank, position offset memory;
A rank offset units, be to connect above-mentioned gain/rank, position offset memory and gain multiplied unit, in order to should rank, gain/position offset memory capture a rank migration parameter certainly,, the digital electric signal through this gain multiplied module gain is offset and forms signal of video signal output and being carried out a rank; And
One interface circuit is connect to go up rheme rank offset units, and normalization forms the drawing frame data that conforms to above-mentioned interface specification from the signal of video signal of this rank offset units, to export above-mentioned interface to.
9. digital infrared heat image detection system as claimed in claim 8 is characterized in that:
This circuit arrangement more comprises a drawing frame data storage element that conforms to above-mentioned interface specification, is to connect to go up rheme rank offset units and interface circuit, in order to temporary this drawing frame data.
10. digital infrared heat image detection system as claimed in claim 1 is characterized in that:
This circuit arrangement is that module turns to an add-on card.
11. digital infrared heat image detection system as claimed in claim 1 is characterized in that more comprising:
One in order to placing the workbench of this display device, and the upright assembling of a side of this workbench one slide rail, makes this infra-red ray detection device be suitable for borrowing this slide rail to move up and down.
12. digital infrared heat image detection system as claimed in claim 1 is characterized in that comprising:
One in order to place the workbench of this display device, and the upright assembling of a side of this workbench one fixed bar, and more being connected an adjutage that can move in three-dimensional away from an end of this workbench in this fixed bar, a free end of this adjutage is installed this infra-red ray detection device.
13. digital infrared heat image detection system as claimed in claim 11 is characterized in that:
The bottom installing pulley of this workbench is beneficial to moving of this workbench.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01140684 CN1199036C (en) | 2001-09-18 | 2001-09-18 | Digital infrared heat image detection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01140684 CN1199036C (en) | 2001-09-18 | 2001-09-18 | Digital infrared heat image detection system |
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| Publication Number | Publication Date |
|---|---|
| CN1409104A CN1409104A (en) | 2003-04-09 |
| CN1199036C true CN1199036C (en) | 2005-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01140684 Expired - Fee Related CN1199036C (en) | 2001-09-18 | 2001-09-18 | Digital infrared heat image detection system |
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| Country | Link |
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| CN (1) | CN1199036C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100502767C (en) * | 2007-07-11 | 2009-06-24 | 武汉昊博科技有限公司 | Medical thermal chromatographic imaging system |
| US10203252B2 (en) | 2016-12-29 | 2019-02-12 | Industrial Technology Research Institute | Microelectromechanical apparatus having a measuring range selector |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102354329B (en) * | 2011-07-25 | 2013-08-28 | 广州科易光电技术有限公司 | Infrared database intelligent diagnosis management system for charged equipment |
| CN106108854B (en) * | 2016-07-18 | 2019-09-17 | 深圳市衣信互联网科技有限公司 | The infrared optical heat radiation detection system of underwear and the method for detecting radiation field status information |
| TWI753742B (en) * | 2021-01-11 | 2022-01-21 | 搏盟科技股份有限公司 | Waiting position printing device with body temperature sensing and operation method thereof |
-
2001
- 2001-09-18 CN CN 01140684 patent/CN1199036C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100502767C (en) * | 2007-07-11 | 2009-06-24 | 武汉昊博科技有限公司 | Medical thermal chromatographic imaging system |
| US10203252B2 (en) | 2016-12-29 | 2019-02-12 | Industrial Technology Research Institute | Microelectromechanical apparatus having a measuring range selector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1409104A (en) | 2003-04-09 |
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