CN1197100C - Technology for making unwound chip inductor - Google Patents

Technology for making unwound chip inductor Download PDF

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Publication number
CN1197100C
CN1197100C CN 00123426 CN00123426A CN1197100C CN 1197100 C CN1197100 C CN 1197100C CN 00123426 CN00123426 CN 00123426 CN 00123426 A CN00123426 A CN 00123426A CN 1197100 C CN1197100 C CN 1197100C
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CN
China
Prior art keywords
chip inductor
coil
making
inductor
route
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 00123426
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Chinese (zh)
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CN1338762A (en
Inventor
王弘光
王蕾雅
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JIAYE SCIENCE AND TECHNOLOGY Co Ltd
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JIAYE SCIENCE AND TECHNOLOGY Co Ltd
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Application filed by JIAYE SCIENCE AND TECHNOLOGY Co Ltd filed Critical JIAYE SCIENCE AND TECHNOLOGY Co Ltd
Priority to CN 00123426 priority Critical patent/CN1197100C/en
Publication of CN1338762A publication Critical patent/CN1338762A/en
Application granted granted Critical
Publication of CN1197100C publication Critical patent/CN1197100C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The present invention relates to a method for manufacturing unwound chip inductors, which comprises the following steps: a solid or hollow long strip-shaped square cylinder or cylindrical main body is made; an electrically conducting metal film is coated on the surface of the main body; predetermined traces are removed through laser cutting; required coil paths are reserved; single chip inductors are divided by a cutting means; rectangular metal terminals are in scarf joint with both ends of chip inductor main bodies and are directly conducted with the coil paths; the coil paths are coated with glue to form a resin protective layer; electrical testing operation is carried out, and a finished product is packaged. The present invention has the advantages of precise inductor value, high qualified rate and easy installation.

Description

The manufacture method of not having the coiling chip inductor
Technical field
The present invention relates to the manufacture method of a kind of manufacture method of inductor, particularly a kind of chip inductor.
Background technology
Be illustrated in figure 1 as the packaged type of known electric sensor, in encapsulating press mold process, make body 1 ' outside be formed with a resin 4 ' and protected.The hot-fluid that its coil 2 ' can be subjected to high temperature and high pressure influences the winding spacing, and the doubt of displacement is arranged, and makes inductance value have the situation of erratic variation.And in pin 11 ' forming process, need both sides pin 11 ' is imposed the bending means, enabling smooth insert group on substrate 3 ', this kind processing procedure mode is not only loaded down with trivial details.And extend then need impose at the end points 21 ' of coil 2 ' and flatten the bending operation in pin 11 ', easily influence the phenomenon that Inside coil 2 ' end points 21 ' then has broken string because of folding s tress, and pin 11 ' also has the scruple that fractures accidentally, therefore remains to be improved on degree of fine qualities.
Be with, the inventor because the disadvantages of known electric sensor, the experience of the industry, the research of throwing oneself into are engaged in accumulation for many years.There is the manufacture method of the nothing coiling chip inductor of innovation to produce eventually.
Summary of the invention
Main purpose of the present invention promptly is to provide a kind of winding coil processing procedure that saves, and can overcome simultaneously the manufacture method of nothing coiling chip inductor of the characteristic of the imperfect winding number of turns.
Secondary objective of the present invention promptly is to provide a kind of production efficiency height, satisfies the manufacture method of the nothing coiling chip inductor of radio frequency (RF) circuit product high quality factor (Q value) demand.
Another object of the present invention promptly is to provide a kind of manufacture method of avoiding producing the nothing coiling chip inductor of inductance value erratic variation.
Above-mentioned purpose of the present invention is realized by following technical scheme.
A kind of manufacture method of not having the coiling chip inductor, its step comprises:
(1) makes solid or a rectangular square body of hollow form or a cylindrical body;
(2) this body metal film of having conductivity in surperficial coating one deck;
(3) body of this coating metal film adopts the default trace of removing of laser cutting, makes required coil route with reservation;
(4) this body of making the coil route is adopted the cutting means to cut apart the chip inductor chip inductor body of making a plurality of monomers;
(5) with the metal terminal and the direct conducting of coil route of chip inductor chip inductor body two ends interlockings cuboid;
(6) form a resin protective layer with gluing on the coil route of chip inductor chip inductor body;
(7) chip inductor of gluing being finished is implemented the testing electrical property operation, gives packing after finishing and promptly makes the product of finishing;
The invention has the advantages that:
1, the body of the rectangular body coating of solid or hollow form metal film design, the mode of cutting straight forming coil is saved the winding coil processing procedure on body, can overcome the characteristic of the imperfect winding number of turns simultaneously.
2, but the body of the rectangular body straight forming of solid or hollow form coil is established pin, its body can cut the single body of a plurality of chip inductors, and in the metal terminal of chip inductor chip inductor body both sides interlocking cuboid, its made chip inductor has the characteristics of forming product of processing simultaneously more on processing procedure, promote production efficiency, the value of value-for-money, this physical efficiency is further adopted the design of hollow again, more can promote quality factor (Q value), to satisfy the demand of radio frequency (RF) circuit product high quality factor (Q value).
3, adopt the mode of glue protection of resinizing of not pressurizeing on the coil route of inductance body, exempt traditional encapsulating pressing mold processing procedure, make inductor can not be subjected to the influence of high temperature, high pressure, and avoid producing the situation of inductance value erratic variation.
By the coil route of directly making on the chip inductor chip inductor body, do not need integer number of turns winding, can improve the accuracy of inductance value, and further with the architecture design of chip inductor chip inductor body hollow, more can improve quality factor (Q value), and the metal terminal of directly rabbeting cuboid in chip inductor chip inductor body both sides, the method for more favourable upper plate.
Manufacture method according to taking off the nothing coiling chip inductor shown in purpose, feature and the effect thereof in a tree name the present invention is described as follows in conjunction with the accompanying drawings in detail with regard to specific embodiment now:
Description of drawings
Figure 1 shows that the schematic diagram that the encapsulation of known electric sensor is finished.
Figure 2 shows that the solid or hollow type of the present invention does not have the flow chart of the embodiment of winding inductor.
Figure 3 shows that hollow type inductance body of the present invention is cut into the schematic diagram of coil route.
Figure 4 shows that the solid formula of the present invention do not have the associated component perspective exploded view of winding inductor.
Figure 5 shows that the solid or hollow type of the present invention does not have the schematic perspective view of winding inductor.
Figure 6 shows that the enforcement illustration when the solid or hollow type of the present invention does not have the winding inductor upper plate.
Embodiment
See also Fig. 3 to flow chart and the associated component schematic diagram that is the embodiment of the invention shown in Figure 6.
In step 601, be to make solid or a rectangular square body of hollow form or a cylindrical body 1 with pottery.
In step 602, be the metal film 2 that this body is had conductivity in surperficial coating one deck.
In step 603, the body 1 that is this coating metal film 2 is placed on the cutting device, adopt the default trace of removing of laser cutting, make required coil route 3 with reservation, so can save tradition needs the processing procedure mode of coiling, and on number of turns winding layout, can directly cut and finish required winding integer.
In step 604, be that this body 1 of making coil route 3 is adopted the cutting means to cut apart the chip inductor chip inductor body 1 of making a plurality of single individualities.
In step 605, providing two groups is the metallic conductor material, the metal terminal 4 of cuboid, this metal terminal 4 has a connecting groove 41 for body 1 fixing on opposite face, make chip inductor chip inductor body 1 two ends be rabbeted metal terminal 4 and the 3 direct conductings of coil route, so utilize the metallic conductor material metal terminal 4 can with the characteristic of coil route 3 direct conductings, to have quick production and cost-effective practical value, the design of chip inductor chip inductor body 1 hollow and for example shown in Figure 3, more can improve quality factor (Q value), to satisfy the demand of radio frequency (RF) circuit high quality factor (Q value).
In step 606; be on the coil route 3 of this chip inductor chip inductor body 1, to give the glue 5 of resinizing to form a protective layer; form the protective layer mode with the glue 5 of resinizing on the coil route 3 of chip inductor chip inductor body 1; coil route 3 can not be subjected to the influence of high temperature and high pressure, makes inductance value not have the situation of erratic variation.
In step 607, be that the chip inductor that gluing is finished is implemented the testing electrical property operation, give packing after finishing and promptly make the product of finishing.
There is not the coiling chip inductor by the made solid or hollow type of above-mentioned steps program, as shown in Figure 6 during upper plate, the metal terminal 4 of its chip inductor chip inductor body 1 dual-side cuboid gets directly and follows with substrate 6, quite simple and convenient, and can significantly improve the reliability of qualification rate and quality, have progressive and practical value.
To sum up institute is old, and the manufacture method of nothing of the present invention coiling chip inductor provides a kind of processing procedure simple, the method for upper plate operation and straight forming coil fast, can improve the problem of imperfect number of turns winding, improves the characteristic of quality factor (Q value) simultaneously.

Claims (1)

1, a kind of manufacture method of not having the coiling chip inductor is characterised in that its step comprises:
(1) makes solid or a rectangular square body of hollow form or a cylindrical body;
(2) this body metal film of having conductivity in surperficial coating one deck;
(3) body of this coating metal film adopts the default trace of removing of laser cutting, makes required coil route with reservation;
(4) this body of making the coil route adopts the cutting means to cut apart the chip inductor body of making a plurality of monomers;
(5) with the metal terminal and the direct conducting of coil route of chip inductor body two ends interlockings cuboid;
(6) form a resin protective layer with gluing on the coil route of chip inductor body;
(7) chip inductor of gluing being finished is implemented the testing electrical property operation, and packing is promptly made the product of finishing after finishing.
CN 00123426 2000-08-15 2000-08-15 Technology for making unwound chip inductor Expired - Fee Related CN1197100C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 00123426 CN1197100C (en) 2000-08-15 2000-08-15 Technology for making unwound chip inductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 00123426 CN1197100C (en) 2000-08-15 2000-08-15 Technology for making unwound chip inductor

Publications (2)

Publication Number Publication Date
CN1338762A CN1338762A (en) 2002-03-06
CN1197100C true CN1197100C (en) 2005-04-13

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Application Number Title Priority Date Filing Date
CN 00123426 Expired - Fee Related CN1197100C (en) 2000-08-15 2000-08-15 Technology for making unwound chip inductor

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1933061B (en) * 2006-09-06 2011-06-29 清华大学 Non-wirewound inductive reactance element based on negative dielectric constant dielectric
CN109686561A (en) * 2019-01-25 2019-04-26 宁波优佳流体控制设备有限公司 A kind of production method of reactor winding

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