Surface fluctuation type diffraction optical element and preparation method thereof
The present invention relates to a kind of surface fluctuation type diffraction optical element, particularly relate to surface fluctuation type diffraction optical element of gradually changed refractive index and preparation method thereof.
General diffractive optical elements or optical grating element are with kind, can be divided into following two kinds: one is volume type diffraction element, with regard to its exposing material, can be divided into following three kinds: first kind is photopolymer (Photopolymer), has high-level efficiency, without advantages such as chemical agent development, photographic fixing, but cost an arm and a leg and be difficult for problem such as batch process; Second kind is silver halide, has advantages such as sensitization is fast, shooting is simple, but the shortcomings such as diffraction element moisture-sensitive of poor efficiency and generation are arranged; The third is (bichromate gelatin) DCG (Dichromate Gelatin), though the tool high-level efficiency also has the shortcoming of diffraction element moisture-sensitive.In other words, aforementioned three kinds of materials all have the shortcoming that is difficult for batch process.Another is surface undulation type (surface relief) diffraction element, mainly be to utilize semiconductor technology light shield commonly used to carry out microetch processing (lithography), the interference fringe that etching is calculated by computer on quartz or glass substrate, or in the mode of laser interference, directly shoot required photoresistance diffraction element, its production method is that making exposes with the substrate that scribbles the photoresistance emulsion basically, etching or electroforming become the nickel template in addition again, to produce in batches.This kind mode have element environment tolerance height, be easy to produce in batches and low cost and other advantages, but its shortcoming is, because the diffraction element of this type is a surface fluctuation type, when the high-level efficiency demand, can't produce interference fringe with enough degree of depth, be that lines breadth depth ratio (aspect ratio) is not high enough, efficient lower shortcoming.In order to raise the efficiency, the surface fluctuation type diffraction element of variety of way has been proposed in the known technology, for example utilize multiple stage type microetch technology to produce the diffraction element or the grating of blazed grating (blazed) type, see also Fig. 1, on-quartz or crystal silicon substrate 10, utilize the high light shield of a plurality of precision through repeatedly light shield plate-making (photolithography) and etching (etching), form the optical grating construction 20 of blazed grating shape.Or as shown in Figure 2, on a quartz or crystal silicon substrate 30, utilize a gray tone mask 50 to carry out light shield plate-making and etching, with the optical grating construction 40 that produces similar blazed grating with the GTG Exposure mode, in the hope of strengthening the first rank diffraction, reduce or remove unnecessary diffraction rank.Aforementioned GTG Exposure mode also can utilize the mode of electron-beam direct writing to substitute.Below all reach the purpose that increases efficient, so very high degree of precision light shield that must be above together or different gray tone mask and fine registration technology are finished with the control raster shape.
For overcoming above-mentioned existing in prior technology problem, structure that provides by a kind of high efficiency surface fluctuation type diffraction element and preparation method thereof promptly is provided the object of the invention, be to utilize etching technique commonly used in a kind of gradual (or multi-level) optical index coefficient distribution coating technique and the semiconductor fabrication, the substrate of gradual to being coated with (or multi-level) optical index coefficient distribution plated film carries out etching.Produce high efficiency surface fluctuation type diffraction element with coating technique and etching technique commonly used, and need not to use the electron beam light shield of multiple costliness or the light shield of the different gray scales of tool, and repeat the high precision exposure imaging and aim at steps such as skill, just can solve known surface fluctuation type diffraction grating and can't reach high efficiency problem.
Utilize the diffraction element as optical element, mainly be owing to can utilize the phase place etching mode to make the diffraction component structure form the pattern of concaveconvex structure, make light beam through concaveconvex structure then, and produce the each point out of phase at the diffraction element surface, that is each point optical path difference difference, form the phase place addition at last at the observation station place, and produce the effect of the spoke addition of shaking.With surface fluctuation type (surface relief) diffractive optical elements or optical grating element, because it utilizes incident beam to produce the ratio of diffraction deflection phenomenon, be diffraction efficient (diffractionefficiency), be to depend on streak line breadth depth ratio (aspect ratio), in case so element function decision, its width of fringe is just decision also, therefore in order to obtain high diffraction efficient, striped how to produce enough degree of depth just becomes the important topic of making surface fluctuation type diffraction optical element, because the striped of enough degree of depth represents that promptly it can provide enough optical path differences.In addition, the mode that changes optical path difference also can utilize change optical index coefficient to carry out, but this kind mode generally all utilizes the plated film mode to finish.
Utilize light shield plate-making and microetch technology commonly used in the semiconductor technology, etch the element concaveconvex structure on quartz or crystal silicon substrate, the concaveconvex structure of its making is essentially square, and with the direct exposure person of laser, mostly be sinusoidal, make as for other shape is then difficult.
The present invention makes surface fluctuation type diffraction element in conjunction with aforementioned concaveconvex structure and two kinds of technology of graded index, can go to change the breadth depth ratio of concaveconvex structure in order to change light path as known technology, and the difficulty that causes making is with complicated.Therefore, the present invention's method has light shield and easily aims at, easily produces in batches and low cost and other advantages.
The present invention at first utilizes a kind of gradual (or multi-level) optical index coefficient distribution coating technique, on a substrate, plate the gradual optical index coefficient of one deck distribution plated film, its gradual optical index coefficient distributes and can be cumulative or decrescence distribution, its distribution mode can utilize the coupled wave theory of diffraction light beam to cooperate the refractive index of various unlike material to be analyzed, based on can provide palpus diffraction efficient.Again with the aforementioned substrate that is coated with gradual (or multi-level) optical index coefficient distribution membrane of photoresistance coating, utilize the direct interference mode of light shield or laser to take then, so as to obtaining required diffraction fringe, the last etching technique of using always in the semiconductor fabrication of utilizing again etches diffraction fringe on substrate.As mentioned above, this substrate that is coated with the distribution of gradual (or multi-level) optical index coefficient is carried out etching, need not to use the electron beam light shield of multiple costliness or the light shield of tool grey scale change, reach steps such as repeating high precision exposure imaging aligning skill and just can make the surface fluctuation type diffraction element of providing high-level efficiency.
For structure, feature and the advantage that further describes the present invention, one side accompanying drawings the present invention's preferred embodiment, wherein:
Fig. 1 represents to produce with multiple stage type microetch technology a kind of diffraction element or grating of blazed grating type, in the hope of strengthening the first rank diffraction, reduces or removes other unwanted diffraction rank;
Fig. 2 represents to utilize the GTG exposure to produce the diffraction element or the grating of blazed grating type, in the hope of strengthening the first rank diffraction, reduces or removes other unwanted diffraction rank;
Fig. 3 a to Fig. 3 d is illustrated on the substrate that is coated with being coated with of photoresist layer gradual (or multi-level) optical index coefficient distribution membrane, shoots required diffraction fringe with the direct interference mode of laser; And
Fig. 4 a to Fig. 4 d is illustrated on the substrate that is coated with being coated with of photoresist layer gradual (or multi-level) optical index coefficient distribution membrane, shoots required diffraction fringe with light shield.
The method of high efficiency surface fluctuation type diffraction element is made in this invention, mainly is to utilize known coating technique and etch process.But utilizing the diffraction sheet as optically focused, imaging or when scanning element, must carry out optical design earlier, promptly analyzed to understand the diffraction component structure through ray trace (Ray Tracing) mode by computer, the diffraction component structure with pattern (diffraction fringe) can make the phase place of incident light wave change.This pattern can utilize a phase function to represent the characterisitic parameter of its outgoing light wave after its modulation in distribution on the base material and calculating.Method for making of the present invention mainly comprises following dual mode: embodiment one
See also Fig. 3 a to Fig. 3 d, the present invention's first embodiment comprises the following steps: that (1) is shown in Fig. 3 a, utilize a kind of gradual (or multi-level) optical index coefficient distribution coating technique, on substrate 90, change its gas flux and reach the composition variation with enhancing chemical vapor deposition (PECVD) of electricity slurry or chemical vapor deposition (CVD), and obtain the progressive optical index coefficient of one deck distribution membrane 100, for example SiOx or Si
1-xNx or other can utilize PECVD, CVD, sputter physics such as (sputtering), the chemical formula thin-film technique changes the composition combination with the change technological parameter, and the material to optical transparency that refractive index is changed, make light beam through the out-of-date optical path difference that produces, be coated with the aforesaid base plate 90 of aforementioned progressive formula (or multi-level) optical index coefficient distribution membrane 100 again with photoresistance 110 coatings, gradual (or multi-level) optical index coefficient distributions specifications can be by parameters such as diffraction fringe live width and required efficient, going out required optical index coefficient through accurate coupled waves (rigorous coupled wave) Theoretical Calculation again distributes, be decremented to minimum by mxm. with equal difference as specific refractivity, its rete output beam characteristic can be analyzed by the mode of fourier transform, and, directly take out required diffraction fringe at aforementioned photoresistance 110 arsis in the mode that laser is directly interfered; (2) see also Fig. 3 b, via development, photographic fixing and required diffraction fringe is formed on the aforementioned photoresistance 110; (3) shown in Fig. 3 c, for forming diffraction fringe on aforementioned progressive formula (or multi-level) optical index coefficient distribution membrane 100, utilize semiconductor technology etching technique commonly used, aforementioned progressive formula (or multi-level) optical index coefficient distribution membrane 100 is carried out etching and forms; (4) see also Fig. 3 d, at last aforementioned photoresistance 110 is removed, can obtain the present invention's surface fluctuation type diffraction element.Embodiment two
See also Fig. 4 a to Fig. 4 d, the present invention's second embodiment comprises the following steps: that (1) is shown in Fig. 4 a, utilize a kind of gradual (or multi-level) optical index coefficient distribution coating technique, on substrate 90, plate the progressive optical index coefficient of one deck distribution membrane 100, for example SiOx or Si
1-xNx, make light beam through the out-of-date optical path difference that produces, be coated with the aforesaid base plate 90 of aforementioned progressive formula (or multi-level) optical index coefficient distribution membrane 100 again with photoresistance 110 coatings, gradual (or multi-level) optical index coefficient distributions specifications can be by parameters such as diffraction fringe live width and required efficient, again through accurate coupled waves (rigorous coupled wave) Theoretical Calculation go out institute must the distribution of optical index coefficient, be decremented to minimum by mxm. with equal difference as specific refractivity, and, utilize light shield 120 to take out required diffraction fringe at aforementioned photoresistance 110 arsis in light shield plate-making mode; (2) see also Fig. 4 b, via development, photographic fixing and required diffraction fringe is formed on the aforementioned photoresistance 110; (3) shown in Fig. 4 c, for forming diffraction fringe on aforementioned progressive formula (or multi-level) optical index coefficient distribution membrane 100, utilize semiconductor technology etching technique commonly used, aforementioned progressive formula (or multi-level) optical index coefficient distribution membrane 100 is carried out etching and forms; (4) see also Fig. 4 d, at last aforementioned photoresistance 110 is removed, can obtain the present invention's surface fluctuation type diffraction element.
In described two embodiment, the index distribution of SiOx is about 1.46 (SiO
2) to 2.0 (SiO), and Si
1-xThe index distribution of Nx then is about 1.8 to 2.2.
The present invention compares with known technology, and known technology mainly is light shield plate-making and the erosion that utilizes semiconductor technology commonly used Carving technology etches the element concaveconvex structure at quartz or crystal silicon substrate, and the concaveconvex structure of its made is essentially Square, and with laser directly exposure person mostly be sinusoidal. As for the Exposure mode that adopts, as exposing with multiple stage type Technology, at least three to four road light shields just can accomplish several microns live width indent male structure approximate blazed grating is arranged Effect, its required light shield cost, making and alignment precision is all high. And with gray tone mask, at several microns The light exposure that produces in the live width in various degree is very difficult, and the light shield cost is also high. And the present invention is in conjunction with plated film and etching Two kinds of technology can change concaveconvex structure and go to change optical path difference, have therefore that light shield is easily aimed at, easily batch production And low cost and other advantages. In addition, the present invention utilizes a kind of gradual (or multi-level) optical index coefficient to distribute to plate Membrane technology forms different optical index coefficient distribution layers, can make the diffraction element surface produce the different phase place of each point (each point optical path difference difference), form at the observation station place at last out of phase is added and subtracted mutually and amplitude is added and subtracted mutually high efficiency around Penetrate effect. Through calculating SiO2, lambda1-wavelength is 0.632nm, probably maintains about 0.6 in breadth depth ratio The time, the diffraction efficient of the first rank diffraction is at least also more than 40%. With known technology, reach this equivalence Really, then the breadth depth ratio of its diffraction fringe need reach more than 1.5, and can cause the making hard problem.