CN1191937C - Back-jetting ink jet printing head structure - Google Patents
Back-jetting ink jet printing head structure Download PDFInfo
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- CN1191937C CN1191937C CN 01103881 CN01103881A CN1191937C CN 1191937 C CN1191937 C CN 1191937C CN 01103881 CN01103881 CN 01103881 CN 01103881 A CN01103881 A CN 01103881A CN 1191937 C CN1191937 C CN 1191937C
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- ink
- heat
- printing head
- jet printing
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Abstract
The present invention relates to a back-jetting type ink jet printing head structure, which at least comprises a base material, an isolation layer and a bottom plate layer, wherein the base material has a front surface and an opposite surface; a plurality of thermal resistance elements are collocated on the opposite surface of the base material, a corresponding jet hole is arranged in the base material beside each thermal resistance element, and the jet holes penetrate through the base material; the isolation layer is collocated on the opposite surface of the base material and is provided with an ink flow passage, and the ink flow passage is composed of patterned openings of the isolation layer; the patterned openings are distributed on the thermal resistance elements, the corresponding jet holes, and areas between the thermal resistance elements and the corresponding jet holes. The bottom plate layer is collocated on the isolation layer and is provided with an ink supply window communicated with the ink flow passage. The jet holes are positioned in the base material on one side of each of the thermal resistance elements, and the ink supply window is positioned in the bottom plate layer positioned on the other side of each thermal resistance element.
Description
Technical field
The present invention relates to a kind of ink jet printing head structure, and be particularly related to a kind of back-jetting ink jet printing head structure.
Background technology
Known ink jet printing head structure, as ink jet printing head structures such as No. the 4490728th, 4809428,4596994,4723129,4774530,4863560, United States Patent (USP)s, its primary element includes (1) capillary that contains ink; (2) spray nozzle sheets (orificeplate) that are used for the ink droplet ejection; (3) heat-resistant element that electric energy transferred to heat energy.In addition, the operation principle of ink-jet printing head can be divided into following several stages in regular turn: (1) thermal source produces; (2) heat conduction; (3) formation of thermal with grow up; (4) ink droplet ejection.When the pulse voltage that an abundance is provided (pulse widths of several μ sec), ink-jet printing head makes the surface temperature of heat-resistant element be increased to hundreds of degree Celsius rapidly, and forms thermal on its surface.The formation of thermal promptly provides a pressure source, this pressure source provides ink to spray needed thrust, when the temperature of ink reaches the critical-temperature of ink vaporization, the ink generation thermal of promptly vaporizing, when producing thermal, pressure in the ink cavity increased in moment, and the pressure of thermal is along with the temperature of thermal descends and following cutting edge of a knife or a sword subsequently, and operating frequency can reach several kHz.According to the relative position of ink droplet and ink jetting structure, known Thermal Bubble Ink-jet Printer seal head can be divided into lateral spray type (as shown in Figure 1) and upper-spraying type (as shown in Figure 2) two classes.
Please refer to Fig. 1, is known a kind of lateral spray type ink jet printing head structure.Configuration one hot barrier layer 22, a thermoresistance layer 24, a conductor layer 26 and an insulating barrier 28 on substrate 10, and the conductor layer 26 that passes through patterning forms heat-resistant element 20 on substrate 10, and configuration isolation layer 30 is on substrate 10, dispose a spray nozzle sheet 40 on it again, wherein, isolation layer 30 has the structure of the ink runner 32 (ink channel) of patterning.Ink is via ink runner 32, and enters from the right side of heat-resistant element 20, produces bubble 50 by heat-resistant element 10 rapid heating inks, and it expands rapidly and produces pressure and push ink droplet 52, and from the left side of heat-resistant element 20 with ink droplet 52 ejections.
Please refer to Fig. 2, is known a kind of upper-spraying type ink jet printing head structure.The main difference of it and lateral spray type ink jet printing head structure is, the position of spray orifice 40 directly over heat-resistant element 20 has spray orifice 42, ink is via ink runner 32, enter from the right side of heat-resistant element 20, produce bubble 50 by heat-resistant element 20 rapid heating inks, its generation pressure that expands is rapidly pushed ink droplet 52, and sees through the spray orifice 42 of spray nozzle sheet 40 with ink droplet 52 ejections directly over heat-resistant element 20.
The manufacture method of above-mentioned known ink-jet printing head is growth one deck thermal insulation layer such as silicon layer (SiO on silicon (Si) wafer mostly
2), again thermal resistance material and conductor material sputter-deposited (sputtering) are got on.The formation of heat-resistant element then is the ic manufacturing technology that utilizes standard, as light shield, exposure, development and etch process etc., and then adds the ink runner that other protective layer and dry film constitutes.The ink runner that ink enters ink jet crystal plate must pass through special processing, as laser drill (Laser Drilling), sandblast (Sand Blasting) or ultrasonic wave grinds processing modes such as (Ultrasonic Milling).Yet above-mentioned two kinds of technology all must be done spray nozzle sheet aligning and bonding work at last in addition and form ink-jetting member.Another known technology then is that the ink runner is produced on another piece silicium wafer (silicium wafers different with the film resistor position), again two silicium wafers is aimed at joint (bonding) and gets up.
The ink jet printing head structure of above-mentioned known technology, all need be divided into several different parts, again it is combined, for example the spray nozzle sheet of the wafer at heat-resistant element place, ejection ink droplet, constitute the material of ink runner etc., all need accurate aligning and bonding, thereby increase the manufacturing cost of ink-jet printing head.
Ink-jet printing head is the key parts of ink-jet printer, this ink-jet printing head made from semiconductor process technique, not only can use domestic mature semiconductor technology, manufacturing cost is also cheap than other manufacturing side, but scrutinize ink-jet printer common on the market, following shortcoming still can take place in its ink-jet printing head on technology:
(1) spray nozzle sheet and ink jet crystal plate must or be aimed at bondingly through special processing, not only improve manufacturing cost, reduce speed of production simultaneously, and can't realize producing in batches (All BatchProcess).
(2) the ink ink runner that enters ink jet crystal plate must pass through special processing, as laser drill, sandblast or processing mode such as ultrasonic wave grinding, therefore pollutes ink jet crystal plate easily and influences qualification rate, and can't realize equally producing in batches.
(3) known ink-jet printing head all need be divided into several different parts, again it is combined, for example the spray nozzle sheet of the wafer at heat-resistant element place, ejection ink droplet, constitute the material of ink runner etc., all need accurate aligning with bonding, thereby the manufacturing cost of increase ink-jet printing head.
Summary of the invention
In order to solve the shortcoming of above-mentioned ink jet printing head structure, exploitation simultaneously has low material cost and the ink-jet printing head of producing feasibility in enormous quantities, the present invention proposes a kind of ink jet printing head structure of back reflection type, it comprises at least: a base material, it has a positive and reverse side, the reverse side of base material disposes a plurality of heat-resistant element, and the spray orifice that has a correspondence in the base material on each heat-resistant element side, and these spray orifices run through base material; One isolation layer is disposed on the reverse side of base material, and has the ink runner, wherein, the ink runner is made of the patterning opening of isolation layer, and its position distribution is on the position of heat-resistant element, on the position of corresponding spray orifice, and on the zone between heat-resistant element and the corresponding spray orifice; One backplane level, it is disposed on the isolation layer, and has the ink supply window, and it communicates with the ink runner, and wherein spray orifice is arranged in the base material of heat-resistant element one side, and the ink supply window is arranged in the backplane level of heat-resistant element opposite side.
The present invention also proposes a kind of ink jet printing head structure of back reflection type, at least comprise: a base material, it has a positive and reverse side, disposes a plurality of heat-resistant element on the reverse side of base material, and the spray orifice that has a correspondence in the base material on each heat-resistant element side, these spray orifices run through base material; One backplane level, this backplane level have one and are just reaching a reverse side, and backplane level is disposed on the base material, and the reverse side of the front of backplane level and base material is fitted.Also have an ink runner and an ink supply window in the backplane level, its ink inside runner is distributed in the front of backplane level, the position distribution of ink runner is on the position of heat-resistant element, on the position of the spray orifice of corresponding heat-resistant element, and on the zone between heat-resistant element and the corresponding spray orifice.The ink supply window is distributed in the reverse side of backplane level, and the ink supply window communicates with the ink runner.In addition, spray orifice is arranged in the base material of heat-resistant element one side, and the ink supply window is arranged in the backplane level of heat-resistant element opposite side.
Description of drawings
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, below especially exemplified by a preferred embodiment, and conjunction with figs., elaborate:
Fig. 1 is known a kind of lateral spray type ink jet printing head structure;
Fig. 2 is known a kind of upper-spraying type ink jet printing head structure;
Fig. 3 is the generalized section of back-jetting ink jet printing head structure of the present invention;
Fig. 4 is the front view of a kind of back-jetting ink jet printing head chip architecture of the present invention;
Fig. 5 is the reverse view of a kind of back-jetting ink jet printing head chip architecture of the present invention;
Fig. 6 is the exploded view of Fig. 5;
Fig. 7 is the partial enlarged drawing of Fig. 6.
Description of reference numerals:
10: substrate;
20: heat-resistant element;
22: hot barrier layer;
24: thermoresistance layer;
26: conductor layer;
28: insulating barrier;
30: isolation layer;
32: the ink runner;
40: spray nozzle sheet;
42: spray orifice;
50: bubble;
52: ink droplet;
100: base material;
102: the front;
104: reverse side;
106: spray orifice;
110: heat-resistant element;
112: hot barrier layer;
114: zone of heating;
116: conductive layer;
118: insulating barrier;
120: isolation layer;
122: the ink runner;
130: backplane level;
132: the ink supply window;
134: parados;
140: bubble;
160: metal gasket.
The specific embodiment
Please refer to Fig. 3, is the generalized section of back-jetting ink jet printing head structure of the present invention.One base material 100 is provided, its material for example is silicon, glass, metal and macromolecular material, base material 100 has positive 102 and one reverse side 104, on the reverse side 104 of base material 100, disposes a hot barrier layer 112, a zone of heating 114, a conductive layer 116 and an insulating barrier 118.And the mode of its configuration for example with technologies such as the semiconductor fabrication of physical deposition method or standard such as light shield exposure, development, etchings, is disposed at base material 100 with thermal resistance material and conductor material and forms.Wherein, hot barrier layer 112 is disposed on the reverse side 104 of base material 100, and zone of heating 114 is disposed on the hot barrier layer 112, and conductive layer 116 is disposed on the zone of heating 114, and insulating barrier 118 is disposed on the conductive layer 116.In addition, by the opening that forms in the conductive layer 116 of patterning, and the zone of heating 114 and insulating barrier 118 of corresponding this open area, in order to constitute heat-resistant element 110.And by heat-resistant element 110, having corresponding spray orifice 106, it runs through the front 102 and the reverse side 104 of base material 100, in order to allow ink droplet 142 processes.
Please equally with reference to figure 3, also provide on the reverse side 104 that an isolation layer 120 is disposed at base material 100, and the material of isolation layer 120 for example is silicon, glass, metal and macromolecular material, the mode of its configuration for example pressing one dry film (dry film) on the reverse side 104 of base material 100, with as isolation layer 120, and an adhesion coating (not drawing) is provided between isolation layer 120 and base material 100, in order to bonding isolation layer 120 and base material 100.Or select for use the high macromolecular material of adherence to be used as the material of isolation layer 120, it helps isolation layer 120 and base material 100 bonding.In addition, isolation layer 120 has ink runner 122 structures, its patterning opening by isolation layer 120 is formed, and the position distribution of ink runner 122 is on the position of heat-resistant element 110, on the position of corresponding spray orifice 106, and on the zone between heat-resistant element 110 and the corresponding spray orifice 106.
Please also refer to Fig. 3, one backplane level 130 also is provided, it is disposed on the isolation layer 120, the material of backplane level 130 for example is silicon, glass, metal and macromolecular material, the mode of its configuration, for example between backplane level 130 and isolation layer 120, provide an adhesion coating (not drawing), in order to bonding backplane level 130 and isolation layer 120.Or select for use the high macromolecular material of adherence with material as backplane level 130, and help backplane level 130 and isolation layer 120 bonding.Or utilize lithography technology, and backplane level 130 directly is made on the isolation layer 120, save the step of contraposition and applying.In addition, backplane level 130 also has the structure of ink supply window 132, and wherein the ink runner 122 of isolation layer 120 communicates with the ink supply window 132 of backplane level 130, in order to allow ink enter ink runner 122 via ink supply window 132.Wherein, backplane level 130 forms a parados 134 in the position of corresponding spray orifice 106, in order to a reflecting wall of ink droplet 142 ejections to be provided.It should be noted that, ink supply window 132 is positioned at a side of heat-resistant element 110, and spray orifice 106 is positioned at the opposite side of heat-resistant element 110, make ink enter after the ink runner 122, earlier through after the heat-resistant element 110 formation bubbles 140, bubble 140 expands rapidly and pushes ink formation ink droplet 142, and via spray orifice 106 ejections.
Please equally with reference to figure 3, wherein, backplane level 130 can be a thin plate of making separately, and its material for example is silicon, glass, metal or macromolecular material etc.Applying that it should be noted that this thin plate does not need accurate location, only need provide bubble to generate the parados 134 of ink droplet ejection and the ink supply window 132 of formation back reflection type.In addition, can omit isolation layer 120, make backplane level 130 have the structure of ink runner 122 and ink supply window 132 simultaneously, and directly be disposed on the reverse side 104 of base material 100,, replace the function of isolation layer 120 with inlet and the path that ink is provided.
Please equally with reference to figure 3, wherein, the base material 100 at heat-resistant element 110 places, constitute heat-resistant element 110 required thermal resistance material and the spray orifice 106 of conductor material, ejection ink droplet, the isolation layer 120 of formation ink runner 122, and the backplane level 130 of formation ink supply window 132 etc., all but monocrystalline is integrated, and do not need to make in addition spray nozzle sheet and it made accurate aligning bonding, but therefore speed production speed and reduces material cost.
Please equally with reference to figure 3, back-jetting ink jet printing head structure of the present invention, its operation principle is as follows: ink flows and passes the ink supply window 132 of backplane level 130 according to the direction of ink flow line 150, flows into the ink runner 122 of isolation layer 120.A similar capillary makes ink rest among the ink runner 122 because of capillarity because the cross section bore of ink runner 122 is quite little.When producing bubble 140 when heat-resistant element 110 rapid heating inks, bubble 140 will expand generation pressure rapidly and push ink formation ink droplet 142, and according to the direction of ink flow line 150, ink droplet 142 is pushed to a side of the close spray orifice 106 of ink runner 122, and the effect by parados 134, ink droplet 142 will be through the surface of spray orifice 106 ejection arrival paper.
Please also refer to Fig. 4, Fig. 5, is respectively the front view and the reverse view of a kind of back-jetting ink jet printing head wafer appearance of the present invention.The both sides in the front 102 of base material 110 form two rows a plurality of spray orifices 106 arranged in a straight line, and the spray orifice 106 of its corresponding diagram 3 is in order to provide the outlet of ink droplet ejection.And corresponding above-mentioned two row's spray orifices 106 in backplane level 130 both sides and form the ink supply window 132 of two rectangles, the ink supply window 132 of its corresponding diagram 3 is in order to provide ink entry.And a plurality of metal gasket 160 alignment arrangements are in the both sides of the reverse side 104 of base material 100, and the conductive layer 116 with patterning is electrically connected with other heat-resistant element 110 of base material 100, as shown in Figure 3, in order to provide current to heat-resistant element 110, make the rapid heating ink in surface of heat-resistant element 110, and form bubble 140.
Please refer to Fig. 6, is the exploded view of Fig. 5.And, be the partial enlarged drawing of Fig. 6 simultaneously with reference to figure 7.The reverse side of base material 100 disposes a plurality of heat-resistant element 110 on 104, forms bubble in order to heating ink, has spray orifice 106 in that heat-resistant element 110 is other, and it passes base material 100, in order to allow ink droplet pass through.Wherein, not necessarily close fully between heat-resistant element 110 and the spray orifice 106, can have slightly therebetween at interval.Configuration isolation layer 120 on the reverse side 104 of base material 100, it has the structure of ink runner 122, in order to allow ink pass through.Wherein, metal gasket 160 is that the conductive layer 116 in order to patterning is electrically connected with heat-resistant element 110, in order to electric current is imported heat-resistant element 110, provides heat-resistant element 110 to produce the electric energy of high heat of moment.
In sum, back-jetting ink jet printing head structure of the present invention has the following advantages at least:
(1) base material at heat-resistant element place, required thermal resistance material and conductor material, the spray orifice of ejection ink droplet, the isolation layer of formation ink runner and the backplane level of formation ink supply window etc. of formation heat-resistant element, all but monocrystalline is integrated, and do not need to make in addition spray nozzle sheet and it is made accurate aligning and bonding, but speed production speed, and reduce material cost.
(2) all can produce (All Batch Process) in batches.
(3) the ink ink runner that enters ink jet crystal plate is formed by lithography technology, therefore must be through special processing such as laser drill, sandblast or mode such as ultrasonic wave grinding, not only can avoid polluting wafer or reduction die strength and influence its qualification rate, and can reduce wafer material, to reduce production costs.
(4) back-jetting ink jet printing head structure of the present invention is a monocrystalline integrated morphology, spray orifice and ink runner can further dwindle, be not subjected to the resolution restriction of electroforming spray nozzle sheet (Nozzle Plate by Electroforming), can improve the spray orifice density of unit are, the wafer layout ability is better than the ink jet printing head structure of upper-spraying type.
(5) back-jetting ink jet printing head structure of the present invention is a monocrystalline integrated morphology, more easily expands to the ink-jet printing head of page width formula (Page-Wide), can reduce assembly cost.
Though the present invention with a preferred embodiment openly as above, so it is not in order to limit the present invention.Any personnel that have the knack of this technology, without departing from the spirit and scope of the present invention, when doing small renewal and improvement.But protection scope of the present invention should be as the criterion with claims restricted portion.
Claims (15)
1. back-jetting ink jet printing head structure is characterized in that: comprise at least:
One base material, this base material have-first and a correspondence second, dispose a plurality of heat-resistant element on second of this of this base material, and the spray orifice that has a correspondence in other this base material of each these heat-resistant element, and these spray orifices run through this base material;
One isolation layer, this isolation layer is disposed on this second of this base material, and has an ink runner, this ink runner is made of the patterning opening of this isolation layer, the position distribution of this ink runner is on the position of these heat-resistant element, on the position of these spray orifices of corresponding these heat-resistant element, and on the zone between these heat-resistant element and corresponding these spray orifices;
One backplane level, this backplane level is disposed on this isolation layer, and has an ink supply window, and this ink supply window communicates with this ink runner, wherein these spray orifices are arranged in this base material of these heat-resistant element one sides, and this ink supply window is arranged in this backplane level of these heat-resistant element opposite sides.
2. ink jet printing head structure according to claim 1 is characterized in that: this base material is selected from the group that is made up of silicon, glass, metal and macromolecular material.
3. ink jet printing head structure according to claim 1, it is characterized in that: this heat-resistant element comprises a hot barrier layer, a zone of heating, a conductive layer and an insulating barrier, wherein this hot barrier layer is disposed on this second of this base material, this zone of heating is disposed on this hot barrier layer, and this conductive layer is disposed on this zone of heating, and this insulating barrier is disposed on this conductive layer.
4. ink jet printing head structure according to claim 1 is characterized in that: this isolation layer is selected from the group that is made up of silicon, glass, metal and macromolecular material.
5. ink jet printing head structure according to claim 1 is characterized in that: the material of this isolation layer comprises having adhesive macromolecular material.
6. ink jet printing head structure according to claim 1 is characterized in that: the material of this backplane level is selected from the group that is made up of silicon, glass, metal and macromolecular material.
7. ink jet printing head structure according to claim 1 is characterized in that: the material of this backplane level comprises having adhesive macromolecule material Tu.
8. ink jet printing head structure according to claim 1 is characterized in that: comprise an adhesion coating between this base material and this isolation layer, in order to bonding this base material and this isolation layer.
9. ink jet printing head structure according to claim 1 is characterized in that: comprise an adhesion coating between this isolation layer and this backplane level, in order to bonding this isolation layer and this backplane level.
10. back-jetting ink jet printing head structure is characterized in that: comprise at least:
One base material, this base material have one first and a correspondence second, dispose a plurality of heat-resistant element on second of this of this base material, and the spray orifice that has a correspondence in other this base material of each these heat-resistant element, and these spray orifices run through this base material;
One backplane level, this backplane level has one first corresponding with one second, this backplane level is disposed on this base material, and this second applying of first of this of this backplane level and this base material, also have an ink runner and an ink supply window in this backplane level, wherein this ink runner is distributed in this first of this backplane level, the position distribution of this ink runner is on the position of these heat-resistant element, on the position of these spray orifices of corresponding these heat-resistant element, and on the zone between these spray orifices of these heat-resistant element correspondences, this ink supply window is distributed on this second of this backplane level again, and this ink supply window communicates with this ink runner, in addition, these spray orifices are arranged in this base material of these heat-resistant element one sides, and this ink supply window is arranged in this backplane level of these heat-resistant element opposite sides.
11. ink jet printing head structure according to claim 10 is characterized in that: this base material is selected from the group that is made up of silicon, glass, metal and macromolecular material.
12. ink jet printing head structure according to claim 10, it is characterized in that: this heat-resistant element comprises a hot barrier layer, a zone of heating, a conductive layer and an insulating barrier, wherein this hot barrier layer is disposed on this second of this base material, this zone of heating is disposed on this hot barrier layer, and this conductive layer is disposed on this zone of heating, and this insulating barrier is disposed on this conductive layer.
13. ink jet printing head structure according to claim 10 is characterized in that: the material of this backplane level is selected from the group that is made up of silicon, glass, metal and macromolecular material.
14. ink jet printing head structure according to claim 10 is characterized in that: the material of this backplane level comprises having adhesive macromolecular material.
15. ink jet printing head structure according to claim 10 is characterized in that: comprise an adhesion coating between this base material and this backplane level, in order to bonding this base material and this backplane level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01103881 CN1191937C (en) | 2001-03-19 | 2001-03-19 | Back-jetting ink jet printing head structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01103881 CN1191937C (en) | 2001-03-19 | 2001-03-19 | Back-jetting ink jet printing head structure |
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| Publication Number | Publication Date |
|---|---|
| CN1310092A CN1310092A (en) | 2001-08-29 |
| CN1191937C true CN1191937C (en) | 2005-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 01103881 Expired - Fee Related CN1191937C (en) | 2001-03-19 | 2001-03-19 | Back-jetting ink jet printing head structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110202930A (en) * | 2019-05-28 | 2019-09-06 | 黄春燕 | A kind of small ink dot hot-bubble ink-jetting detection device used based on printer |
| CN113211985B (en) * | 2020-01-21 | 2022-10-14 | 国际联合科技股份有限公司 | Thermal bubble ink jet head device |
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