CN118870723A

CN118870723A - Heat dissipation control system, heat dissipation control method, controller and cabinet

Info

Publication number: CN118870723A
Application number: CN202310487961.9A
Authority: CN
Inventors: 周镇新; 孙晓光; 高俊恩; 默蓬勃; 随贺
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2023-04-28
Filing date: 2023-04-28
Publication date: 2024-10-29
Also published as: WO2024222561A1

Abstract

The utility model discloses a heat dissipation control system, a heat dissipation control method, a controller and a cabinet, and relates to the field of computers. The heat dissipation control system comprises an embedded liquid cooling unit, a liquid cooling door, a plurality of liquid cooling plates, a plurality of fans and a controller. The embedded liquid cooling unit, the liquid cooling door and the plurality of liquid cooling plates are connected. The embedded liquid cooling unit provides circulating flow power of liquid cooling working medium among the embedded liquid cooling unit, the liquid cooling door and the plurality of liquid cooling plates. The liquid cooling plate conducts heat generated by devices in the system to the liquid cooling door based on liquid cooling working medium. The method comprises the following steps: the controller controls the rotating speed of at least one fan in the plurality of fans according to the energy consumption parameters of the devices in the system and the system position of the devices, and dissipates heat conducted from the liquid cooling plate through the liquid cooling door according to cold air flow controlled by the rotating speed of the at least one fan. And the rotating speeds of fans in the system are respectively controlled according to the heat dissipation requirement, so that the heat dissipation of the data center is improved, and the energy consumption of the data center is reduced.

Description

Heat dissipation control system, heat dissipation control method, controller and cabinet

Technical Field

The present application relates to the field of computers, and in particular, to a heat dissipation control system, a heat dissipation control method, a controller, and a cabinet.

Background

Along with the improvement of the calculation force of the data center, the energy consumption and heat dissipation of the data center are also improved. Liquid cooling heat dissipation is a reliable and feasible scheme for dissipating heat of servers of a data center and reducing energy consumption of the data center. However, the rotation speed of the fan in the whole cabinet is generally controlled in units of cabinets, so that the cooling effect of the data center for cooling is poor.

Disclosure of Invention

The application provides a heat dissipation control system, a heat dissipation control method, a controller and a cabinet, so that the rotating speed of a fan in the system is adjusted according to heat dissipation requirements, the heat dissipation of a data center is improved, and the energy consumption of the data center is reduced.

In a first aspect, a heat dissipation control system is provided, the heat dissipation control system including an embedded liquid cooling unit, a liquid cooling door, a plurality of liquid cooling plates, a plurality of fans and a controller. The embedded liquid cooling units are connected with the liquid cooling door, the plurality of liquid cooling plates are connected with the liquid cooling door in parallel, and the plurality of liquid cooling plates are connected with the embedded liquid cooling units in parallel. The embedded liquid cooling unit is used for providing circulating flow power of liquid cooling working medium among the embedded liquid cooling unit, the liquid cooling door and the plurality of liquid cooling plates. The liquid cooling plate is used for conducting heat generated by devices in the system to the liquid cooling door based on liquid cooling working medium. The controller is used for controlling the rotating speed of at least one fan in the plurality of fans according to the energy consumption parameters of the devices in the system and the position of the system where the devices are located, and the energy consumption parameters are used for indicating the energy consumption condition of the devices in the system. The liquid cooling door is used for radiating according to cold air flow controlled by the rotating speed of at least one fan.

Therefore, according to the energy consumption condition of the device indicated by the energy consumption parameter and the system position of the device, the rotating speed of at least one fan is controlled to accelerate the air flow, and the heat generated by the device is conducted to the outside of the system by the liquid cooling working medium flowing through the liquid cooling door to achieve the heat dissipation purpose. Therefore, the rotating speeds of fans in the system are respectively controlled according to the heat dissipation requirement, so that the heat dissipation of the data center is improved, and the energy consumption of the data center is reduced.

In addition, a liquid cooling system for providing refrigeration for the liquid cooling device is not required to be deployed in the data center, so that a liquid cooling server is not required to be deployed in the data center in a reconstruction mode, and the application range of the liquid cooling server is enlarged. And because the specific heat capacity of the liquid is larger than that of the air, the heat dissipation speed is far higher than that of the air, and therefore, the refrigeration efficiency of liquid cooling heat dissipation is far higher than that of air cooling heat dissipation, so that the liquid cooling cabinet is deployed in the data center, and the heat dissipation of the data center is effectively improved and the energy consumption of the data center is reduced under the condition that the high calculation power requirement of the data center is met.

In one possible implementation manner, the controller is further configured to control the frequency of the water pump in the embedded liquid cooling unit according to the energy consumption parameter of the device in the system; the liquid cooling door is also used for controlling the flow speed of the liquid cooling working medium to dissipate heat according to the frequency of the water pump in the embedded liquid cooling unit.

The embedded liquid cooling unit provided by the application is used as a power source for flowing liquid cooling working medium in a heat dissipation control system, and the liquid cooling door is used as a wind liquid heat exchange device in the heat dissipation control system. Therefore, cold air generated by the fan and the air cooling system of the data center in the heat dissipation control system is reused, the cold air blown out by the fan is utilized, heat generated by devices in the liquid cooling cabinet is transferred to the space of the data center through the liquid cooling door, and the liquid cooling cabinet is rapidly deployed without water channel transformation for the data center.

In another possible implementation manner, the heat dissipation control system further comprises a control valve, and the control valve is connected with the liquid cooling plate; the controller is also used for controlling the flow rate of the liquid cooling working medium in the liquid cooling plate through the control valve according to the energy consumption parameters of devices in the system. Therefore, the control valve corresponding to the liquid cooling plate attached to the device is controlled according to the energy consumption parameter of the device in the system, the flow velocity of the liquid cooling working medium in the liquid cooling plate is controlled through the control valve, heat generated by the device is dissipated, accurate control of system heat dissipation is achieved, heat dissipation of the data center is improved, and energy consumption of the data center is reduced.

In another possible implementation manner, the controller is specifically configured to, when controlling the rotational speed of at least one fan of the plurality of fans according to the energy consumption parameter of the device in the system and the system position where the device is located: determining at least one fan according to the position relation between the device and a plurality of fans in the system; the rotational speed of at least one fan is controlled in accordance with the energy consumption parameter of the device.

In another possible implementation manner, the controller is specifically configured to, when controlling the rotational speed of at least one fan of the plurality of fans according to the energy consumption parameter of the device in the system and the system position where the device is located: determining at least one fan according to the position relation between the device and an air duct in the system; the rotational speed of at least one fan is controlled in accordance with the energy consumption parameter of the device.

Therefore, at least one fan is selected according to the position of a device generating heat in the system, and the accurate control of heat dissipation of the system is realized by controlling the rotating speed of the at least one fan, so that the heat dissipation of the data center is improved, and the energy consumption of the data center is reduced.

In another possible implementation manner, the embedded liquid cooling unit is used for controlling the liquid cooling working medium carrying heat flowing from the liquid cooling plate to flow to the liquid cooling door; the liquid cooling door is used for cooling liquid cooling working medium flowing in from the embedded liquid cooling unit according to cold air flowing controlled by the rotating speed of the fan, and the cooled liquid cooling working medium flows to the liquid cooling plate.

In another possible implementation manner, the embedded liquid cooling unit is used for controlling the flow of the cooled liquid cooling working medium flowing in from the liquid cooling door to the liquid cooling plate; the liquid cooling door is used for cooling the liquid cooling working medium which flows in from the liquid cooling plate and carries heat according to the cold air flow controlled by the rotating speed of the fan, and the cooled liquid cooling working medium flows to the embedded liquid cooling unit.

In another possible implementation, the energy consumption parameter is used to indicate a parameter affecting the energy saving effect of the system, including: parameters of at least one of power consumption and temperature of the device. The device comprises a memory, a processor and a chip with higher heat design power consumption, wherein the chip with higher heat design power consumption has high calculation capability and generates more heat.

In another possible implementation, the heat dissipation control system further includes a plurality of temperature sensors; the temperature sensor is positioned at the air inlet of the liquid-cooled door and used for monitoring the temperature of the air inlet of the liquid-cooled door; the temperature sensor is positioned at the air outlet of the liquid-cooled door and used for monitoring the temperature of the air outlet of the liquid-cooled door; the temperature sensor positioned at the liquid inlet of the liquid cooling door is used for monitoring the temperature of the liquid inlet of the liquid cooling door; the temperature sensor located at the liquid outlet of the liquid cooling door is used for monitoring the liquid outlet temperature of the liquid cooling door.

In another possible implementation manner, the controller is configured to determine, according to a correspondence between a heat dissipation requirement and a control index, the control index corresponding to the heat dissipation requirement obtained according to the energy consumption parameter, where the control index includes a rotation speed of the fan and a frequency of the water pump in the embedded liquid cooling unit.

Therefore, by installing the temperature sensor in the system, the air inlet temperature of the liquid cooling door, the air outlet temperature of the liquid cooling door, the liquid inlet temperature of the liquid cooling door and the liquid outlet temperature of the liquid cooling door are obtained, the constraint condition is met according to the law of conservation of energy, the minimum frequency of the water pump and the minimum rotation speed of the fan in the embedded liquid cooling unit are realized, the accurate refrigeration is realized as required, and the closed-loop control is realized. Therefore, the liquid cooling server is deployed without modification to the data center, and the energy consumption of the data center is reduced.

In another possible implementation, the embedded liquid cooling unit, the liquid cooling door, the plurality of liquid cooling plates, the plurality of fans and the controller are in the same cabinet; or alternatively; the controller, the embedded liquid cooling unit, the liquid cooling door, the plurality of liquid cooling plates and the plurality of fans are not in the same cabinet.

In another possible implementation manner, the heat dissipation control system further comprises a mobile device, so that the heat dissipation control system can move, and flexibility of deploying the heat dissipation control system in the data center is improved.

In a second aspect, a heat dissipation control method is provided, where the heat dissipation control system includes an embedded liquid cooling unit, a liquid cooling door, a plurality of liquid cooling plates, a plurality of fans and a controller; the embedded liquid cooling units are connected with the liquid cooling doors, the plurality of liquid cooling plates are connected with the liquid cooling doors in parallel, and the plurality of liquid cooling plates are connected with the embedded liquid cooling units in parallel; the embedded liquid cooling unit is used for providing circulating flow power of liquid cooling working medium among the embedded liquid cooling unit, the liquid cooling door and the plurality of liquid cooling plates; the liquid cooling plate is used for conducting heat generated by devices in the system to the liquid cooling door based on liquid cooling working medium; the method comprises the following steps: the controller controls the rotating speed of at least one fan in the plurality of fans according to the energy consumption parameters of the devices in the system and the system position where the devices are located, and dissipates heat conducted from the liquid cooling plate through the liquid cooling door according to cold air flowing controlled by the rotating speed of the at least one fan, wherein the energy consumption parameters are used for indicating the energy consumption condition of the devices in the system.

In one possible implementation, the method further includes: the controller controls the frequency of the water pump in the embedded liquid cooling unit according to the energy consumption parameters of devices in the system, controls the flow rate of the liquid cooling working medium according to the frequency of the water pump in the embedded liquid cooling unit, and dissipates heat conducted from the liquid cooling plate through the liquid cooling door.

In another possible implementation manner, the heat dissipation control system further comprises a control valve, and the control valve is connected with the liquid cooling plate; the method further comprises the steps of: the controller controls the flow rate of the liquid cooling working medium in the liquid cooling plate through a control valve according to the energy consumption parameters of devices in the system.

In another possible implementation, the controller controls the rotational speed of at least one fan of the plurality of fans according to an energy consumption parameter of a device in the system and a system position where the device is located, including: determining at least one fan according to the position relation between the device and a plurality of fans in the system; the rotational speed of at least one fan is controlled in accordance with the energy consumption parameter of the device.

In another possible implementation, the controller controls the rotational speed of at least one fan of the plurality of fans according to an energy consumption parameter of a device in the system and a system position where the device is located, including: determining at least one fan according to the position relation between the device and an air duct in the system; the rotational speed of at least one fan is controlled in accordance with the energy consumption parameter of the device.

In another possible implementation, controlling the rotation speed of at least one fan according to the energy consumption parameter of the device includes: and the controller determines a control index corresponding to the heat dissipation demand obtained according to the energy consumption parameter according to the corresponding relation between the heat dissipation demand and the control index, wherein the control index comprises the rotating speed of the fan and the frequency of the water pump in the embedded liquid cooling unit.

In a third aspect, a controller is provided that includes at least one processor and memory for storing a set of computer instructions; the method comprises the steps of performing the method of controlling heat dissipation in the second aspect or any one of the possible implementations of the second aspect when the processor executes the set of computer instructions as a controller in the second aspect or any one of the possible implementations of the second aspect.

In a fourth aspect, a cabinet is provided, the cabinet including an embedded liquid cooling unit, a liquid cooling door, a plurality of liquid cooling plates, a plurality of fans and a controller; the embedded liquid cooling units are connected with the liquid cooling doors, the plurality of liquid cooling plates are connected with the liquid cooling doors in parallel, and the plurality of liquid cooling plates are connected with the embedded liquid cooling units in parallel; the controller is configured to perform the operation steps of the heat dissipation control method in the second aspect or any one of the possible implementation manners of the second aspect.

In a fifth aspect, there is provided a data center comprising an air cooling system and a plurality of cabinets as described in the fourth aspect for dissipating heat from cabinets in the data center according to the air cooling system and the liquid cooling apparatus. The cabinet is configured to perform the operation steps of the heat dissipation control method in the second aspect or any one of the possible implementation manners of the second aspect.

In a sixth aspect, a chip is provided, including: a processor and a power supply circuit; wherein the power supply circuit is used for supplying power to the processor; the processor is configured to perform the operational steps of the method as described in the first aspect or any one of the possible implementations of the first aspect.

In a seventh aspect, there is provided a computer readable storage medium comprising: computer software instructions; when executed in a controller, the computer software instructions cause the controller to perform the operational steps of the method as described in the first aspect or any one of the possible implementations of the first aspect.

In an eighth aspect, there is provided a computer program product for, when run on a computer, causing the computer to perform the operational steps of the method as described in the first aspect or any one of the possible implementations of the first aspect.

The technical effects of any one of the second aspect to the eighth aspect may be referred to as the technical effects of the first aspect or the different designs of the first aspect, and will not be described herein.

Further combinations of the present application may be made to provide further implementations based on the implementations provided in the above aspects.

Drawings

FIG. 1 is a schematic diagram of a data center according to the present application;

FIG. 2 is a schematic diagram of a data center with a liquid-cooled server according to the present application;

FIG. 3 is a schematic diagram of a liquid-cooled cabinet according to the present application;

FIG. 4 is a schematic flow diagram of a liquid-cooled working medium in a liquid-cooled cabinet according to the present application;

FIG. 5 is a schematic diagram of a temperature sensor in a liquid-cooled cabinet according to the present application;

fig. 6 is a schematic flow chart of a heat dissipation control method provided by the present application;

fig. 7 is a schematic heat dissipation diagram of a liquid cooling cabinet provided by the present application;

fig. 8 is a schematic structural diagram of a heat dissipation control device according to the present application;

fig. 9 is a schematic structural diagram of a controller according to the present application.

Detailed Description

For ease of understanding, the main terms involved in the present application will be explained first.

Data center (DATA CENTER), which refers to a specific device network that delivers, accelerates, presents, calculates, and stores data information over the internet (internet) infrastructure, is a worldwide collaboration.

The energy consumption (energy consumption) is an index for evaluating the energy consumption of the product in use.

The energy utilization efficiency (power usage effectiveness, PUE) refers to an energy-saving condition index for evaluating the energy efficiency of the data center, namely the ratio of the total energy consumption of the data center to the energy consumption of the IT equipment. For example, energy utilization efficiency is determined by dividing the total power of the data center by the power used to run the computer infrastructure in the data center. The lower the PUE (e.g., close to 1), the less energy is consumed by the non-Internet technology (Internet Technology, IT) devices and the higher the energy utilization efficiency. The total energy consumption of the data center includes the energy consumption of the systems of IT equipment, refrigeration, power distribution, etc.

Air cooling (air cooling), which means cooling an object to be cooled using air as a heat transfer medium. For example, increasing the surface area of an object to be cooled is achieved by adding heat sinks to the surface of the object, which are typically hung from the object or otherwise secured to the object to provide more efficient heat dissipation. For another example, fans may be used to enhance ventilation and cooling by increasing the rate of air flow through the object per unit time. Either the two methods are used together.

Liquid cooling (liquid cooling) refers to a technique of using a liquid as a heat transfer medium to exchange heat for a heat generating component and to transfer the heat to the outside of the heat generating component. For example, the liquid cooling plate is fixed on a heating device (such as a central processing unit (central processing unit, CPU)) of the computer, and the heat generated by the device is conducted to the outside of the computer by the liquid cooling working medium flowing through the liquid cooling plate so as to achieve the purpose of heat dissipation, so that the cooling method of the computer in a safe temperature range is ensured.

And the liquid cooling distribution unit (Cooling Distribution Unit, CDU) is positioned in the data center and used for controlling the refrigerating capacity of a group of cabinets, the temperature and the flow rate of chilled water and the like.

The embedded liquid cooling unit (Embedded Cooling Unit, ECU) is arranged in the cabinet in a pre-integration mode and is used as a component of the cabinet to control the refrigerating capacity of the cabinet, the temperature and the flow rate of chilled water and the like.

Specific heat capacity (SPECIFIC HEAT CAPACITY), also known as specific heat capacity, simply specific heat (SPECIFIC HEAT), is the heat capacity of a unit mass of an object, i.e., the heat absorbed or released by a unit mass of an object when it changes unit temperature. Specific heat capacity is a physical quantity commonly used in thermodynamics and refers to the ability of a substance to raise its temperature by heat, rather than by absorbing or dissipating it, by which is meant the amount of heat absorbed (or released) per unit mass per unit temperature of rise (or fall) of the substance.

The law of conservation of energy (Law of conservation of energy), one of the basic laws common in nature, is generally expressed as: the energy neither goes nor goes away from the void, either from one form to another, or from one object to another, while the total amount of energy remains unchanged. It can also be expressed as: the change in the total energy of a system is equal to how much energy is transferred into or out of the system. The total energy is the sum of the mechanical energy, the internal energy (or thermal energy) of the system and any form of energy other than mechanical and internal energy.

Thermal Power (THERMAL DESIGN Power, TDP) is an indicator of the heat release of a processor.

Fig. 1 is a schematic diagram of a data center according to the present application. Here, a case in which a cabinet included in a data center is cooled by a liquid cooling heat radiation system will be described. As shown in fig. 1, the data center 100 includes a liquid-cooled machine room 110 and a liquid-cooled system 120.

The liquid cooling machine room 110 includes a plurality of liquid cooling cabinets 111, and the liquid cooling cabinets 111 are solid bodies for providing high-performance calculation, and radiate heat to servers in the cabinets based on a liquid cooling heat radiation mode. For example, the liquid-cooled cabinet 111 includes a plurality of server nodes. The server node may be a separate physical device.

The liquid cooling system 120 includes a plurality of refrigeration subsystems in parallel, each for refrigerating a set of liquid cooled cabinets 111. The liquid cooling system 120 may also include a redundant refrigeration subsystem for providing backup functions as a backup system for other refrigeration subsystems in the event of a failure of the other refrigeration subsystem. Each refrigeration subsystem includes cooling devices connected in series, which can be flexibly configured according to refrigeration requirements. For example, the refrigeration subsystem includes a cooling tower 121, a primary circulation pump 122, a cold heat exchange plate 123, a secondary circulation pump 124, and a liquid-cooled distribution unit 125.

The cooling tower (the cooling tower) 121 is used to discharge heat to the atmosphere to reduce the water temperature using a liquid cooled working fluid (e.g., water) as a circulating cooling medium. The primary circulation pump (cooling water pump) 122 is used to provide power for conveying the cooling medium. For example, the device is suitable for liquid cooling working media for conveying water or physical and chemical properties in a high-pressure operation system. The heat-cold exchange plate 123 is used to conduct heat to the outside of the liquid-cooled cabinet 111 by forced convection of air, water or other cooling medium in the channels, so as to effectively reduce the PUE of the data center. The cold-heat exchanging plate 123 may be a closed cavity formed of a heat conductive metal such as copper, aluminum, etc. The secondary circulation pump 124 is a chilled water circulation system. The liquid cooling distribution unit 125 is located in a control unit of liquid cooling in the liquid cooling machine room 110 of the data center 100, and is used for adjusting the cooling capacity of the set of liquid cooling cabinets 111, the temperature and flow rate of chilled water, and the like.

The liquid cooling cabinet 111 can further comprise a liquid cooling plate, the liquid cooling plate is fixed on a server, the server is not in direct contact with liquid, heat is conducted through liquid cooling working medium in the liquid cooling plate, and then heat is conducted to the outside of the liquid cooling cabinet 111 through liquid cooling working medium circulation in the liquid cooling system, so that the safety is high. The liquid cooling plate can solve the heat dissipation of devices with large heat productivity in the server, other devices can also rely on air cooling, and the server adopting the cold plate type liquid cooling can also be called as a gas-liquid double-channel server.

The liquid cooling cabinet 111 may further include a liquid cooling door 112, and the liquid cooling system 120 may further provide a cooling subsystem for cooling the liquid cooling door 112 of the liquid cooling cabinet 111, thereby further improving cooling of the server in the liquid cooling cabinet 111.

Alternatively, the liquid cooling system 120 may not be provided with the liquid cooling distribution unit 125, and the liquid cooling cabinet 111 includes an embedded liquid cooling unit. The embedded liquid cooling unit is built in the liquid cooling cabinet 111 in a pre-integration mode, and is used as a component of the liquid cooling cabinet 111 to control the refrigerating capacity of the cabinet, the temperature and the flow rate of chilled water, and the like.

It is worth to say that the number of cabinets and the arrangement mode of the liquid cooling system included in the data center are not limited, and the liquid cooling system can be adjusted according to actual requirements. For example, the data center 100 may also include air-cooled racks.

The data center 100 may also include a controller 130. The controller 130 is used for controlling the refrigeration of the liquid cooling machine room 110 in the data center 100, so as to achieve the purpose of energy saving and reduce the PUE of the data center. In some embodiments, the controller 130 is installed with management software (e.g., a data center operation and maintenance management platform) for managing the data center, for implementing refrigeration control of the data center 100.

In order to solve the problem of how to adjust the rotation speed of a fan in a system according to heat dissipation requirements, improve heat dissipation of a data center and reduce energy consumption of the data center, the application provides a heat dissipation control method which is applied to a heat dissipation control system. The embedded liquid cooling units are connected with the liquid cooling door, the plurality of liquid cooling plates are connected with the liquid cooling door in parallel, and the plurality of liquid cooling plates are connected with the embedded liquid cooling units in parallel. The embedded liquid cooling unit is used for providing circulating flow power of liquid cooling working medium among the embedded liquid cooling unit, the liquid cooling door and the plurality of liquid cooling plates. The liquid cooling plate is used for conducting heat generated by devices in the system to the liquid cooling door based on liquid cooling working medium. The method comprises the following steps: the controller controls the rotating speed of at least one fan in the plurality of fans according to the energy consumption parameters of the devices in the system and the system position of the devices, and dissipates heat conducted from the liquid cooling plate through the liquid cooling door according to cold air flow controlled by the rotating speed of the at least one fan.

Therefore, according to the energy consumption condition of the device indicated by the energy consumption parameter and the system position of the device, the rotating speed of at least one fan is controlled to accelerate the air flow, and the heat generated by the device is conducted to the outside of the system by the liquid cooling working medium flowing through the liquid cooling door to achieve the heat dissipation purpose. Therefore, the rotating speeds of fans in the system are respectively controlled according to the heat dissipation requirement, so that the heat dissipation of the data center is improved, and the energy consumption of the data center is reduced. In addition, a liquid cooling system for providing refrigeration for the liquid cooling device is not required to be deployed in the data center, so that a liquid cooling server is not required to be deployed in the data center in a reconstruction mode, and the application range of the liquid cooling server is enlarged. And because the specific heat capacity of the liquid is larger than that of the air, the heat dissipation speed is far higher than that of the air, and therefore, the refrigeration efficiency of liquid cooling heat dissipation is far higher than that of air cooling heat dissipation, so that the liquid cooling cabinet is deployed in the data center, and the heat dissipation of the data center is effectively improved and the energy consumption of the data center is reduced under the condition that the high calculation power requirement of the data center is met.

The application is not limited to the type of server included in the data center, and the type of server includes a rack server, a blade server and a tower server. The heat dissipation control method provided by the application can be used for refrigerating any one of a cabinet server, a rack server, a blade server and a tower server.

Next, embodiments of the heat dissipation control method provided by the present application will be described in detail with reference to the accompanying drawings.

Fig. 2 is a schematic structural diagram of a data center with a liquid cooling server according to the present application. Here, the cooling and air cooling method is described in connection with cooling a cabinet included in a data center, and the cooling method may also be referred to as a cooling method of liquid-cooling ASSISTED AIR cooling (LAAC). As shown in fig. 2, the data center 200 includes a plurality of liquid-cooled racks 210 and an air-cooling system 220. The air cooling system 220 cools the air, and the cold air enters the liquid cooling cabinet 210 through a cold channel to dissipate heat of a server in the liquid cooling cabinet 210; the hot air then passes out of the liquid-cooled cabinet 210 through the "hot aisle" for heat dissipation purposes. The air cooling system of the data center can comprise equipment such as an air conditioner, an air exchange processor and the like. The air conditioner is connected with the external machine through a fluorine pipeline. For example, the internal machine comprises a compressor, an expansion valve, an evaporator and the like, and realizes the functions of refrigeration, airflow conveying and the like. The external machine is used for radiating heat, so that the indoor temperature of the data center is reduced. The air exchange processor is used for air flow transportation. Conventional air supply modes include an upper air supply mode, an air pipe air supply mode and underfloor air supply. The specific deployment mode of the air cooling system of the data center refers to the traditional technology and is not limited.

The heat dissipation control system will be described below by taking a liquid cooling cabinet as an example. In the present application, the liquid-cooled cabinet 210 includes a plurality of servers 211, a liquid-cooled device 212, and fans 213. According to the energy consumption of the devices indicated by the energy consumption parameters of the devices in the liquid cooling cabinet 210, the rotation speed of the fan 213 in the liquid cooling cabinet 210 is controlled to accelerate the flow of cold air, and the heat generated by the devices is conducted to the outside of the liquid cooling cabinet 210 by the liquid cooling working medium flowing through the liquid cooling device 212 to achieve the purpose of heat dissipation.

In some embodiments, the liquid cooling device includes an embedded liquid cooling unit, a liquid cooling door, and a plurality of liquid cooling plates. The embedded liquid cooling unit is connected with the liquid cooling door, the plurality of liquid cooling plates are connected with the liquid cooling door in parallel, and the plurality of liquid cooling plates are connected with the embedded liquid cooling unit in parallel. The liquid cooling plates can be attached to the devices or the servers, and each device or each server can be attached to at least one liquid cooling plate.

Illustratively, as shown in fig. 3 (a), a side view of a liquid-cooled cabinet is provided in the present application. Liquid cooling apparatus 212 includes an embedded liquid cooling unit 212a, a liquid cooling gate 212b, and a plurality of liquid cooling plates 212c. The embedded liquid cooling unit 212a, the liquid cooling gate 212b and the plurality of liquid cooling plates 212c are connected in series by a hose 216. The hose comprises a gold heat shrinkage tube or a rubber tube, etc. The material of the hoses used for connecting the embedded liquid cooling unit 212a, the liquid cooling gate 212b and the plurality of liquid cooling plates 212c is not limited in the present application. For example, the embedded liquid cooling unit 212a and the liquid cooling gate 212b are connected, and the embedded liquid cooling unit 212a and the liquid cooling gate 212b are connected to a plurality of liquid cooling plates 212c through a liquid separator 214 included in the liquid cooling cabinet 210.

Wherein the liquid-cooled cabinet 210 includes a knockout 214. For example, two dispensers 214 may be included in the liquid cooling cabinet 210, where one dispenser 214 is connected to the embedded liquid cooling unit 212a and is configured to flow the liquid cooling medium in the plurality of liquid cooling plates 212c to the embedded liquid cooling unit 212a or flow the liquid cooling medium in the embedded liquid cooling unit 212a to the plurality of liquid cooling plates 212c.

Another knockout 214 is connected to liquid cooling gate 212b for flowing liquid cooling medium from plurality of liquid cooling plates 212c to liquid cooling gate 212b or flowing liquid cooling medium from liquid cooling gate 212b to plurality of liquid cooling plates 212c.

Optionally, the liquid-cooled cabinet 210 may also include a control valve. A control valve may be provided on the knockout 214 for controlling the flow rate of liquid cooled working fluid into the liquid cooled plate 212c and the flow rate of liquid cooled working fluid out of the liquid cooled plate 212 c. Therefore, the heat dissipation of the data center is further improved and the energy consumption of the data center is reduced by controlling the flow rate of the liquid cooling working medium in each liquid cooling plate.

As shown in fig. 3 (b), a front view of a liquid cooling cabinet provided by the application is shown. The liquid cooling door 212b is located at the back of the liquid cooling cabinet 210, that is, the liquid cooling door 212b is located at the air outlet of the liquid cooling cabinet 210. The fan 213 is located on the front side of the liquid cooling cabinet 210, i.e., the fan 213 is located at the air inlet position of the liquid cooling cabinet 210.

The embedded liquid cooling unit 212a is configured to provide circulating fluid power of the liquid cooling medium between the embedded liquid cooling unit 212a, the liquid cooling gate 212b and the plurality of liquid cooling plates 212 c.

The liquid cooling door 212b is used for radiating heat generated by the server 211 or devices in the server 211 conducted to the liquid cooling plate 212c according to the cold air flow controlled by the rotation speed of the fan 213.

For example, the temperature of cold air in the data center is 23 to 24 degrees, the temperature of cold air between the server 211 and the liquid cooling door 212b is 25 to 26 degrees, the temperature of liquid cooling working medium in the liquid cooling door 212b is 45 to 55 degrees, and the cold air controlled according to the rotation speed of the fan 213 flows to dissipate heat of the liquid cooling working medium in the liquid cooling door 212b, so that the temperature of the liquid cooling working medium in the liquid cooling door 212b reaches 35 degrees, and heat generated by devices is conducted to the outside of the machine liquid cooling cabinet 210 by the liquid cooling working medium flowing through the liquid cooling device 212 to achieve the purpose of heat dissipation.

Optionally, the liquid-cooled enclosure 210 may also include a movement device 215 (e.g., wheels) such that the liquid-cooled enclosure 210 may be moved to promote flexibility in deploying the liquid-cooled enclosure 210 in a data center.

The direction in which the liquid-cooled working fluid circulates between the embedded liquid-cooling unit 212a, the liquid-cooling gate 212b, and the plurality of liquid-cooling plates 212c is not limited in the present application.

In one embodiment, as shown in fig. 4 (a), the embedded liquid cooling unit 212a controls the liquid cooling medium to flow to the liquid cooling gate 212b. Liquid cooling gate 212b flows the liquid cooling medium flowing from embedded liquid cooling unit 212a to liquid cooling plate 212c. Liquid cooling plate 212c flows the liquid-cooled working fluid flowing in from liquid cooling gate 212b to embedded liquid cooling unit 212a. Since the liquid cooling plate 212c is located in the server 211, heat generated by the server 211 is conducted to the liquid cooling plate 212c, and the temperature of the liquid cooling medium in the liquid cooling plate 212c is increased, so that the liquid cooling medium carrying heat in the liquid cooling plate 212c flows into the embedded liquid cooling unit 212a. The embedded liquid cooling unit 212a controls the flow of the liquid cooling medium carrying heat flowing from the liquid cooling plate 212c to the liquid cooling gate 212b. The liquid cooling gate 212b radiates heat from the liquid cooling medium with heat flowing in from the embedded liquid cooling unit 212a according to the flow of cold air in the data center controlled by the rotation speed of the fan 213, and flows the cooled liquid cooling medium to the liquid cooling plate 212c.

In the second mode, as shown in fig. 4 (b), the embedded liquid cooling unit 212a controls the liquid cooling medium to flow to the liquid cooling plate 212c first. Liquid cooling plate 212c flows the liquid-cooled working fluid flowing from embedded liquid cooling unit 212a to liquid cooling gate 212b. Liquid cooling gate 212b flows the liquid-cooled working fluid flowing from liquid cooling plate 212c to embedded liquid cooling unit 212a. Since the liquid cooling plate 212c is located in the server 211, heat generated by the server 211 is conducted to the liquid cooling plate 212c, and the temperature of the liquid cooling medium in the liquid cooling plate 212c is increased, so that the liquid cooling medium carrying heat in the liquid cooling plate 212c flows into the liquid cooling door 212b. The liquid cooling gate 212b radiates heat from the liquid cooling medium with heat flowing in from the liquid cooling plate 212c according to the flow of cold air in the data center controlled by the rotation speed of the fan 213, and flows the cooled liquid cooling medium to the embedded liquid cooling unit 212a. The embedded liquid cooling unit 212a controls the flow of the cooled liquid cooling medium flowing in from the liquid cooling gate 212b to the liquid cooling plate 212c.

The liquid-cooled cabinet 210 may also include a temperature sensor. The air inlet of the liquid cooling door, the air outlet of the liquid cooling door, the liquid inlet of the liquid cooling door and the liquid outlet of the liquid cooling door in the liquid cooling cabinet are respectively provided with temperature sensors so as to collect the air inlet temperature of the liquid cooling door, the air outlet temperature of the liquid cooling door, the liquid inlet temperature of the liquid cooling door and the liquid outlet temperature of the liquid cooling door. For example, as shown in fig. 5, a temperature sensor 217 is respectively disposed at an air inlet of the liquid cooling door 212b, an air outlet of the liquid cooling door 212b, a liquid inlet of the liquid cooling door 212b, and a liquid outlet of the liquid cooling door 212b in the liquid cooling cabinet 210. The positional relationship between the liquid inlet of the liquid cooling gate and the liquid outlet of the liquid cooling gate is not limited, and is changed according to the direction in which the liquid cooling medium circulates among the embedded liquid cooling unit 212a, the liquid cooling gate 212b, and the plurality of liquid cooling plates 212c, specifically referring to the explanation of fig. 4. In addition, the air outlet temperature of the server can also be used as the air inlet temperature of the liquid cooling door. The application is not limited to the number and the arrangement mode of the temperature sensors in the liquid cooling cabinet, and can be arranged according to actual detection requirements.

It can be understood that the embedded liquid cooling unit in the liquid cooling cabinet provided by the application is used as a power source for flowing liquid cooling working medium in the liquid cooling cabinet, and the liquid cooling door is used as a wind liquid heat exchange device in the liquid cooling cabinet. Therefore, cold air generated by the fan and the air cooling system of the data center in the multiplexed liquid cooling cabinet is utilized, the cold air blown by the fan is utilized, heat generated by devices in the liquid cooling cabinet is transferred to the space of the data center through the liquid cooling door, and the liquid cooling cabinet is rapidly deployed without water channel transformation for the data center.

Optionally, the embedded liquid cooling unit 212a includes a primary side pipe and a secondary side pipe. As shown in fig. 4, the embedded liquid cooling unit 212a is connected to the liquid cooling door 212b and the liquid cooling plates 212c through a secondary side pipeline, so that heat generated by devices is conducted to the outside of the machine liquid cooling cabinet 210 by means of liquid cooling working media flowing through the liquid cooling door 212b and the plurality of liquid cooling plates 212c, and the purpose of heat dissipation is achieved. The embedded liquid cooling unit 212a is connected with the liquid cooling system through a primary side pipeline to dissipate heat for the liquid cooling working medium in the embedded liquid cooling unit 212a, so that the liquid cooling cabinet 210 is further cooled, the heat dissipation of the data center is improved, and the energy consumption of the data center is reduced.

In addition, the present application is not limited to the execution body for executing the heat dissipation control method, and may be executed by a controller in a cabinet or a controller in a data center. That is, the embedded liquid cooling unit, the liquid cooling door, the plurality of liquid cooling plates, the plurality of fans and the controller are arranged in the same cabinet; or alternatively; the controller, the embedded liquid cooling unit, the liquid cooling door, the plurality of liquid cooling plates and the plurality of fans are not in the same cabinet. For example, the liquid cooling cabinet 210 further includes a management board, and the management board is configured to obtain an energy consumption parameter of a device in the liquid cooling cabinet 210, control a rotation speed of at least one fan 213 according to the energy consumption parameter, and dissipate heat generated by the device in the liquid cooling cabinet 210 through the liquid cooling device 212. The energy consumption parameter is used to indicate the energy consumption of the devices in the liquid cooled cabinet 210. For a detailed explanation of the heat dissipation control method, reference is made to the following description of method embodiments. Fig. 6 is a schematic flow chart of a heat dissipation control method provided by the application. As shown in fig. 6, the method includes the following steps.

Step 610, obtaining energy consumption parameters of devices in the cabinet.

The energy consumption parameter is used to indicate the energy consumption of the devices in the system. The energy consumption parameters include parameters that affect the energy saving effect of the cabinet. Such as parameters indicative of at least one of power consumption and temperature of devices in the cabinet. Energy consumption parameters include, but are not limited to: the power consumption and temperature of the server, the power consumption and temperature of devices in the server, the temperature of an air inlet of the server, the temperature of an air outlet of the server, the temperature of an air inlet of the liquid cooling door, the temperature of an air outlet of the liquid cooling door, the temperature of a liquid inlet of the liquid cooling door, the temperature of a liquid outlet of the liquid cooling door, the frequency of a water pump in an embedded liquid cooling unit, the rotating speed of a fan and the like.

In some embodiments, a management board in the cabinet is connected to the embedded liquid cooling unit via a bus, the management board being configured to provide maintenance functions for a plurality of servers in the cabinet. In the application, the frequency of a water pump in the embedded liquid cooling unit, the temperature of an air inlet of the liquid cooling door, the temperature of an air outlet of the liquid cooling door, the temperature of a liquid inlet of the liquid cooling door and the temperature of a liquid outlet of the liquid cooling door are collected by a management board.

A controller in the server (e.g., baseboard management controller (Baseboard Management Controller, BMC) or other chip with control function) collects power consumption and temperature of devices in the server and rotational speed of the fan. The device comprises a chip, a memory, a hard disk, a peripheral device and the like with higher heat design power consumption. The controller in the server feeds back the power consumption and temperature of the device and the rotation speed of the fan to the management board in the cabinet. Chips with high heat design power consumption include computing units with high-density computing power, such as a central processing unit (central processing unit, CPU), a graphics processor (graphics processing unit, GPU), a data processing unit (data processing unit, DPU), a neural processing unit (neural processing unit, NPU), and the like.

And 620, controlling the rotating speed of the fan according to the energy consumption parameters of the devices, and radiating heat generated by the devices in the cabinet through the liquid cooling device.

The faster the air flows, the faster the system exchanges heat, as the fan rotates at a faster speed. Conversely, the slower the speed of the fan, the slower the air flow and the slower the system heat exchange. And determining heat dissipation requirements according to the energy consumption parameters of the devices (step 621), determining the rotating speed of at least one fan according to the heat dissipation requirements, controlling cold air to flow according to the rotating speed of the at least one fan, and dissipating heat generated by the devices in the cabinet through the liquid cooling device.

The heat dissipation control method provided by the application can control the rotation speed of the fan in the whole cabinet to dissipate heat and also can control the rotation speed of the fan of at least one server in the cabinet or the rotation speed of the fan corresponding to the wind channel in the cabinet to dissipate heat.

In some embodiments, the device of the server in the cabinet generates higher heat, and after the controller collects the energy consumption parameter of the device, the controller determines at least one fan according to the system position where the device is located, and controls the rotation speed of the at least one fan according to the heat dissipation requirement determined by the energy consumption parameter of the device.

The controller can determine at least one fan according to the position relation between the device and a plurality of fans in the system, and control the rotating speed of the at least one fan. For example, the controller controls the rotational speed of a fan in the server where the device is located. For another example, the controller controls the rotational speed of the fan in the server where the device is located, and the rotational speed of the fan in the server adjacent to the server where the device is located.

The controller can also determine at least one fan according to the position relation between the device and the air duct in the system, and control the rotating speed of the at least one fan. For example, the controller controls the air duct adjacent to the device to determine at least one fan and controls the rotational speed of the at least one fan.

In other embodiments, the servers in the cabinet generate higher heat, the controller collects energy consumption parameters of the servers, and the rotational speed of the fan in at least one of the servers is controlled according to heat dissipation requirements determined by the energy consumption parameters of the servers.

In other embodiments, the faster the liquid cooling medium flows, the faster the system exchanges heat, due to the faster the frequency of operation of the water pump in the embedded liquid cooling unit. On the contrary, the slower the frequency of the water pump in the embedded liquid cooling unit, the slower the liquid cooling working medium flows, and the slower the heat exchange of the system. The controller controls the frequency of the water pump in the embedded liquid cooling unit according to the energy consumption parameters of devices in the system, and controls the flow speed of the liquid cooling working medium to dissipate heat according to the frequency of the water pump in the embedded liquid cooling unit.

Optionally, the controller can also control a control valve corresponding to the liquid cooling plate attached to the device according to the energy consumption parameter of the device in the system, and the control valve is used for controlling the flow rate of the liquid cooling working medium in the liquid cooling plate to dissipate heat generated by the device, so that the accurate control of system heat dissipation is realized, the heat dissipation of the data center is improved, and the energy consumption of the data center is reduced.

In some embodiments, according to the energy conservation theorem and the optimizing algorithm, it is determined that the heat dissipation requirement is satisfied under the constraint condition (step 622), the frequency of the water pump in the embedded liquid cooling unit and the rotation speed of the fan are controlled according to the frequency of the water pump in the embedded liquid cooling unit, the flow rate of the liquid cooling working medium is controlled according to the rotation speed of the fan, and the cold air is flowed according to the rotation speed of the fan, so that heat generated by the device is dissipated through the liquid cooling door (step 623).

The solution target of the optimizing algorithm is to meet the heat dissipation requirement under the constraint condition, and the frequency of a water pump in the embedded liquid cooling unit is minimum and the rotating speed of a fan is minimum. The output parameters of the optimizing algorithm comprise the frequency of a water pump in the embedded liquid cooling unit and the rotating speed of a fan. The constraint is used to indicate that the temperature of the device is less than or equal to the temperature threshold.

For example, as shown in fig. 7, it is assumed that the embedded liquid cooling unit controls the liquid cooling medium to flow to the liquid cooling gate first. The liquid cooling gate flows the liquid cooling working medium flowing in from the embedded liquid cooling unit to the liquid cooling plate. The liquid cooling plate flows the liquid cooling working medium flowing in from the liquid cooling door to the embedded liquid cooling unit. T1 represents the temperature of cold air in a data center, T2 represents the temperature of an air inlet of a liquid cooling door, T3 represents the temperature of an air outlet of the liquid cooling door, T4 represents the temperature of a liquid outlet of the liquid cooling door, and T5 represents the temperature of a liquid inlet of the liquid cooling door.

Assume that the heat dissipation requirement is the heat dissipation capacity of the liquid cooling plate, the heat dissipation capacity of the liquid cooling door, and the heat dissipation capacity from the air inlet of the liquid cooling door to the air outlet of the liquid cooling door. The cabinet comprises n servers, and the heat dissipation capacity of the liquid cooling plate is determined according to the power consumption of the CPU of the n servers in the cabinet. The heat dissipation capacity of the liquid cooling plate is shown in formula (1).

Wherein Q1 represents the heat dissipation capacity of the liquid cooling plate. CPU _k represents the power consumption (or heat) of the CPU.

The heat dissipation capacity of the liquid cooling door is shown in formula (2).

Q2=cm1 (T5-T4) m1 formula (2)

Wherein Q2 represents the heat dissipation capacity of the liquid-cooled door. Cm1 represents the specific heat capacity of the liquid cooling working medium, and the specific heat capacity of the liquid cooling working medium is constant. Different liquid cooling working mediums have different specific heat capacities. T5 represents the temperature of the liquid inlet of the liquid cooling door, T4 represents the temperature of the liquid outlet of the liquid cooling door, and m1 represents the flow (such as water flow speed) of the liquid cooling working medium. In some embodiments, the flow rate of the liquid cooling medium is determined according to the frequency of the water pump in the embedded liquid cooling unit.

The heat quantity from the air inlet of the liquid cooling door to the air outlet of the liquid cooling door is shown in formula (3).

Q3=cm2 (T3-T2) m2 formula (3)

Wherein Q3 represents heat dissipating from the air inlet of the liquid cooling door to the air outlet of the liquid cooling door. Cm2 represents the specific heat capacity of air, T2 represents the temperature of an air inlet of the liquid-cooled door, T3 represents the temperature of an air outlet of the liquid-cooled door, and m2 represents the air flow.

In some embodiments, the air flow is determined according to the rotation speed of the fan, m2= (n×m×100+200) ×0.47×1.29 kg/M3) N represents the number of fans, and M represents the rotation speed of the fans. The density of the air was 1.29kg/m3.

Constraint conditions: t4 is less than or equal to 40 ℃, Q1=Q2=Q3, T3 is less than or equal to T5, and the temperature of the CPU is less than or equal to 105 ℃.

The management board in the cabinet feeds back the frequency of the water pump in the embedded liquid cooling unit to the embedded liquid cooling unit, and feeds back the rotating speed of the fan to the controller in the server, and the rotating speed of the fan is controlled by the controller in the server.

Optionally, the controller determines a control index corresponding to the heat dissipation requirement obtained according to the energy consumption parameter according to a corresponding relation between the heat dissipation requirement and the control index, wherein the control index comprises a rotation speed of the fan and a frequency of a water pump in the embedded liquid cooling unit. For example, the controller may pre-configure a correspondence between the heat dissipation requirement and the control index, and determine the rotational speed of the fan and the frequency of the water pump in the embedded liquid cooling unit according to the energy consumption parameter collected in real time. For another example, a training data set is constructed, wherein the training data set comprises a plurality of groups of data, and each group of data comprises the air inlet temperature of the liquid cooling door, the air outlet temperature of the liquid cooling door, the liquid inlet temperature of the liquid cooling door, the liquid outlet temperature of the liquid cooling door, the heat dissipation requirement, the frequency of the water pump and the rotating speed of the fan. And training the neural network model according to the training data set, so that the neural network model has the function of obtaining the frequency of the water pump and the rotating speed of the fan in the embedded liquid cooling unit by reasoning according to the energy consumption parameter (or the heat dissipation requirement).

Therefore, by installing the temperature sensor in the cabinet, the air inlet temperature of the liquid cooling door, the air outlet temperature of the liquid cooling door, the liquid inlet temperature of the liquid cooling door and the liquid outlet temperature of the liquid cooling door are obtained, constraint conditions are met according to the law of conservation of energy, accurate refrigeration is realized in an embedded liquid cooling unit according to the minimum frequency of a water pump and the minimum rotation speed of a fan, and closed-loop control is realized. Therefore, the liquid cooling server is deployed without modification to the data center, and the energy consumption of the data center is reduced.

It will be appreciated that, in order to implement the functions of the above embodiments, the controller includes corresponding hardware structures and/or software modules that perform the respective functions. Those of skill in the art will readily appreciate that the various illustrative elements and method steps described in connection with the embodiments disclosed herein may be implemented as hardware or combinations of hardware and computer software. Whether a function is implemented as hardware or computer software driven hardware depends upon the particular application scenario and design constraints imposed on the solution.

The heat dissipation control method provided according to the present application is described in detail above with reference to fig. 1 to 7, and the heat dissipation control device provided according to the present application will be described below with reference to fig. 8.

Fig. 8 is a schematic structural diagram of a possible heat dissipation control device according to the present application. These heat dissipation control devices may be used to implement the functions of the controller in the above-described method embodiments, so that the beneficial effects of the above-described method embodiments may also be implemented. In this embodiment, the heat dissipation control device may be a controller as shown in fig. 6, or may be a module (such as a chip) applied to a server.

As shown in fig. 8, the heat dissipation control device 800 includes a communication module 810, a cooling control module 820, and a storage module 830. The heat dissipation control device 800 is used to implement the functions of the controller in the method embodiment shown in fig. 6.

The communication module 810 is configured to obtain an energy consumption parameter of a device in the cabinet, where the energy consumption parameter is used to indicate an energy consumption condition of the device. For example, the communication module 810 is configured to perform step 610 in fig. 6.

The refrigeration control module 820 is configured to control a rotation speed of at least one fan of the plurality of fans according to an energy consumption parameter of a device in the system and a system position where the device is located, and dissipate heat conducted from the liquid cooling plate through the liquid cooling door according to a cold air flow controlled by the rotation speed of the at least one fan, where the energy consumption parameter is used to indicate an energy consumption condition of the device in the system. For example, the refrigeration control module 820 is used to perform step 620 of FIG. 6.

The refrigeration control module 820 is configured to determine a rotation speed of the fan and a frequency of the water pump in the embedded liquid cooling unit according to constraint conditions and a heat dissipation requirement, where the constraint conditions are used to indicate that a temperature of the device is less than or equal to a temperature threshold; and cooling the heat generated by the servers through the liquid cooling door according to the flow speed of the liquid cooling working medium controlled by the frequency of the water pump in the embedded liquid cooling unit and the cold air flow controlled by the rotating speed of the fan.

The storage module 830 is configured to store energy consumption parameters, a rotational speed of the fan, and a frequency of the water pump in the embedded liquid cooling unit, so that the refrigeration control module 820 can control a flow rate of the liquid cooling working medium according to the frequency of the water pump in the embedded liquid cooling unit, and can control cold air flow according to the rotational speed of the fan, and dissipate heat generated by the device through the liquid cooling door.

It should be appreciated that the heat dissipation control apparatus 800 of the present embodiment may be implemented by an application-specific integrated circuit (ASIC), a programmable logic device (programmable logic device, PLD), which may be a complex program logic device (complex programmable logical device, CPLD), a field-programmable gate array (FPGA) GATE ARRAY, a general-purpose array logic (GENERIC ARRAY logic, GAL), or any combination thereof. When the heat dissipation control method shown in fig. 6 is implemented by software, each module thereof may be a software module, and the heat dissipation control device 800 and each module thereof may be a software module.

The heat dissipation control apparatus 800 according to the embodiment of the present application may correspond to performing the method described in the embodiment of the present application, and the above and other operations and/or functions of each unit in the heat dissipation control apparatus 800 are respectively for implementing the corresponding flow of each method in fig. 6, and are not described herein for brevity.

Fig. 9 is a schematic structural diagram of a controller 900 according to the present application. As shown, controller 900 includes a processor 910, a bus 920, a memory 930, a communication interface 940, and a memory unit 950 (also referred to as a main memory unit). Processor 910, memory 930, memory unit 950, and communication interface 940 are coupled by bus 920.

It should be appreciated that in this embodiment, the processor 910 may be a CPU, and the processor 910 may also be other general purpose processors, digital Signal Processors (DSPs), ASICs, FPGAs or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. A general purpose processor may be a microprocessor or any conventional processor or the like.

The processor may also be a graphics processor (graphics processing unit, GPU), a neural network processor (neural network processing unit, NPU), a microprocessor, ASIC, or one or more integrated circuits for controlling the execution of the programs of the present application.

The communication interface 940 is used to enable communication of the controller 900 with external devices or apparatuses. In this embodiment, when the controller 900 is used to implement the functions of the controller shown in fig. 6, the communication interface 940 is used to obtain the energy consumption parameters of the devices in the cabinet, so that the processor 910 controls the rotation speed of at least one fan according to the energy consumption parameters, and the heat generated by the devices in the cabinet is dissipated by the liquid cooling device.

Bus 920 may include a path to transfer information between components such as processor 910, memory unit 950, and storage 930. The bus 920 may include a power bus, a control bus, a status signal bus, and the like in addition to a data bus. But for clarity of illustration, the various buses are labeled as bus 920 in the drawing. Bus 920 may be a peripheral component interconnect express (PERIPHERAL COMPONENT INTERCONNECT EXPRESS, PCIe) bus, or an extended industry standard architecture (extended industry standard architecture, EISA) bus, a unified bus (unified bus, ubus or UB), a computer express link (compute express link, CXL), a cache coherent interconnect protocol (cache coherent interconnect for accelerators, CCIX), or the like. The bus 920 may be classified into an address bus, a data bus, a control bus, and the like.

As one example, the controller 900 may include a plurality of processors. The processor may be a multi-core (multi-CPU) processor. A processor herein may refer to one or more devices, circuits, and/or computing units for processing data (e.g., computer program instructions).

It should be noted that, in fig. 9, only the controller 900 includes 1 processor 910 and 1 memory 930 as an example, where the processor 910 and the memory 930 are respectively used to indicate a type of device or apparatus, and in a specific embodiment, the number of each type of device or apparatus may be determined according to service requirements.

The memory unit 950 may be a volatile memory Chi Huofei pool of volatile memory, or may include both volatile and nonvolatile memory. The nonvolatile memory may be a read-only memory (ROM), a Programmable ROM (PROM), an erasable programmable ROM (erasable PROM), an electrically erasable programmable EPROM (EEPROM), or a flash memory. The volatile memory may be random access memory (random access memory, RAM) which acts as external cache memory. By way of example, and not limitation, many forms of RAM are available, such as static random access memory (STATIC RAM, SRAM), dynamic Random Access Memory (DRAM), synchronous Dynamic Random Access Memory (SDRAM), double data rate synchronous dynamic random access memory (double DATA DATE SDRAM, DDR SDRAM), enhanced synchronous dynamic random access memory (ENHANCED SDRAM, ESDRAM), synchronous link dynamic random access memory (SYNCHLINK DRAM, SLDRAM), and direct memory bus random access memory (direct rambus RAM, DR RAM). The memory unit 950 is used for storing information such as frequency of the water pump in the embedded liquid cooling unit, rotation speed of the fan, constraint conditions, heat dissipation requirement, energy consumption parameters, etc.

The memory 930 may correspond to a storage medium, for example, a magnetic disk, such as a mechanical hard disk or a solid state hard disk, for storing information such as the optimization algorithm in the foregoing method embodiments.

The controller 900 may be a general purpose device or a special purpose device. For example, the controller 900 may be an edge device (e.g., a box carrying a chip with processing capabilities), or the like. Alternatively, the controller 900 may be a server or other device having computing capabilities.

It should be understood that the controller 900 according to the present embodiment may correspond to the heat dissipation control device 800 in the present embodiment, and may correspond to the respective main bodies performing any one of the methods according to fig. 6, and the foregoing and other operations and/or functions of each module in the heat dissipation control device 800 are respectively for implementing the respective flows of each method in fig. 6, and are not repeated herein for brevity.

The embodiment of the application provides a computer device, which comprises a controller, wherein the controller is used for executing the operation steps of the heat dissipation control method in the embodiment of the method.

The embodiment of the application provides a chip, which comprises: a processor and a power supply circuit; wherein the power supply circuit is used for supplying power to the processor; the processor is configured to execute the operation steps of the heat dissipation control method described in the foregoing method embodiment.

The method steps in this embodiment may be implemented by hardware, or may be implemented by executing software instructions by a processor. The software instructions may be comprised of corresponding software modules that may be stored in random access memory (random access memory, RAM), flash memory, read-only memory (ROM), programmable ROM (PROM), erasable programmable ROM (erasable PROM, EPROM), electrically Erasable Programmable ROM (EEPROM), registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC. In addition, the ASIC may reside in a computing device. The processor and the storage medium may reside as discrete components in a computing device.

In the above embodiments, it may be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer programs or instructions. When the computer program or instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present application are performed in whole or in part. The computer may be a general purpose computer, a special purpose computer, a computer network, a network device, a user device, or other programmable apparatus. The computer program or instructions may be stored in a computer readable storage medium or transmitted from one computer readable storage medium to another computer readable storage medium, for example, the computer program or instructions may be transmitted from one website site, computer, server, or data center to another website site, computer, server, or data center by wired or wireless means. The computer readable storage medium may be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. that integrates one or more available media. The usable medium may be a magnetic medium, e.g., floppy disk, hard disk, tape; but also optical media such as digital video discs (digital video disc, DVD); but also semiconductor media such as Solid State Drives (SSDs) STATE DRIVE. While the application has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the application. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims

1. The heat dissipation control system is characterized by comprising an embedded liquid cooling unit, a liquid cooling door, a plurality of liquid cooling plates, a plurality of fans and a controller; the embedded liquid cooling unit is connected with the liquid cooling door, the plurality of liquid cooling plates are connected with the liquid cooling door in parallel, and the plurality of liquid cooling plates are connected with the embedded liquid cooling unit in parallel;

The embedded liquid cooling unit is used for providing circulating flow power of liquid cooling working medium among the embedded liquid cooling unit, the liquid cooling door and the plurality of liquid cooling plates;

The liquid cooling plate is used for conducting heat generated by devices in the system to the liquid cooling door based on the liquid cooling working medium;

the controller is used for controlling the rotating speed of at least one fan of the fans according to the energy consumption parameters of devices in the system and the system position where the devices are located, and the energy consumption parameters are used for indicating the energy consumption condition of the devices in the system;

The liquid cooling door is used for radiating according to cold air flowing controlled by the rotating speed of the at least one fan.

2. The system of claim 1, wherein the system further comprises a controller configured to control the controller,

The controller is also used for controlling the frequency of the water pump in the embedded liquid cooling unit according to the energy consumption parameters of devices in the system;

the liquid cooling door is also used for controlling the flow speed of the liquid cooling working medium to dissipate heat according to the frequency of the water pump in the embedded liquid cooling unit.

3. The system of claim 1 or 2, wherein the heat dissipation control system further comprises a control valve, the control valve being connected to the liquid cooling plate;

the controller is also used for controlling the flow rate of the liquid cooling working medium in the liquid cooling plate through the control valve according to the energy consumption parameters of devices in the system.

4. A system according to any one of claims 1-3, wherein the controller is configured to control the rotational speed of at least one of the plurality of fans based on the energy consumption parameters of the devices in the system and the system position at which the devices are located, in particular:

determining the at least one fan according to the positional relationship of the device and a plurality of fans in the system;

And controlling the rotating speed of the at least one fan according to the energy consumption parameter of the device.

5. A system according to any one of claims 1-3, wherein the controller is configured to control the rotational speed of at least one of the plurality of fans based on the energy consumption parameters of the devices in the system and the system position at which the devices are located, in particular:

determining the at least one fan according to the position relation between the device and an air duct in the system;

6. The system of any one of claims 1-5, wherein,

The embedded liquid cooling unit is also used for controlling the liquid cooling working medium with heat flowing in from the liquid cooling plate to flow to the liquid cooling door;

The liquid cooling door is also used for radiating the liquid cooling working medium flowing in from the embedded liquid cooling unit according to the cold air flowing controlled by the rotating speed of the fan, and flowing the cooled liquid cooling working medium to the liquid cooling plate.

7. The system of any one of claims 1-5, wherein,

The embedded liquid cooling unit is also used for controlling the flow of the cooled liquid cooling working medium flowing in from the liquid cooling door to the liquid cooling plate;

The liquid cooling door is also used for radiating the liquid cooling working medium which flows in from the liquid cooling plate and carries heat according to the cold air flowing controlled by the rotating speed of the fan, and the cooled liquid cooling working medium flows to the embedded liquid cooling unit.

8. The system according to any of claims 1-7, wherein the energy consumption parameter is used for indicating a parameter affecting the energy saving effect of the system, comprising: parameters of at least one of power consumption and temperature of the device.

9. The system of any one of claims 1-6, wherein the heat dissipation control system further comprises a plurality of temperature sensors;

The temperature sensor is positioned at the air inlet of the liquid cooling door and used for monitoring the temperature of the air inlet of the liquid cooling door;

The temperature sensor is positioned at the air outlet of the liquid cooling door and used for monitoring the temperature of the air outlet of the liquid cooling door;

the temperature sensor positioned at the liquid inlet of the liquid cooling door is used for monitoring the temperature of the liquid inlet of the liquid cooling door;

the temperature sensor positioned at the liquid outlet of the liquid cooling door is used for monitoring the liquid outlet temperature of the liquid cooling door.

10. The system of any one of claims 1-9, wherein,

The controller is further configured to determine a control index corresponding to the heat dissipation requirement obtained according to the energy consumption parameter according to a corresponding relation between the heat dissipation requirement and the control index, where the control index includes a rotation speed of the fan and a frequency of the water pump in the embedded liquid cooling unit.

11. The system of any one of claims 1-10, wherein the embedded liquid cooling unit, the liquid cooling door, the plurality of liquid cooling panels, the plurality of fans, and the controller are within a same cabinet; or alternatively;

The controller, the embedded liquid cooling unit, the liquid cooling door, the plurality of liquid cooling plates and the plurality of fans are not in the same cabinet.

12. The heat dissipation control method is characterized in that the heat dissipation control system comprises an embedded liquid cooling unit, a liquid cooling door, a plurality of liquid cooling plates, a plurality of fans and a controller; the embedded liquid cooling unit is connected with the liquid cooling door, the plurality of liquid cooling plates are connected with the liquid cooling door in parallel, and the plurality of liquid cooling plates are connected with the embedded liquid cooling unit in parallel; the embedded liquid cooling unit is used for providing circulating flow power of liquid cooling working medium among the embedded liquid cooling unit, the liquid cooling door and the plurality of liquid cooling plates; the liquid cooling plate is used for conducting heat generated by devices in the system to the liquid cooling door based on the liquid cooling working medium;

The method comprises the following steps:

The controller controls the rotating speed of at least one fan of the fans according to the energy consumption parameters of devices in the system and the system position where the devices are located, and the cold air flow controlled according to the rotating speed of the at least one fan dissipates heat conducted from the liquid cooling plate through the liquid cooling door, wherein the energy consumption parameters are used for indicating the energy consumption condition of the devices in the system.

13. The method according to claim 12, wherein the method further comprises:

the controller controls the frequency of the water pump in the embedded liquid cooling unit according to the energy consumption parameters of devices in the system, controls the flow rate of the liquid cooling working medium according to the frequency of the water pump in the embedded liquid cooling unit, and dissipates heat conducted from the liquid cooling plate through the liquid cooling door.

14. The method of claim 12 or 13, wherein the heat dissipation control system further comprises a control valve connected to the liquid cooling plate; the method further comprises the steps of:

And the controller controls the flow velocity of the liquid cooling working medium in the liquid cooling plate through the control valve according to the energy consumption parameters of devices in the system.

15. The method of any of claims 12-14, wherein the controller controlling the rotational speed of at least one of the plurality of fans based on an energy consumption parameter of a device in the system and a system location at which the device is located, comprises:

16. The method of any of claims 12-14, wherein the controller controlling the rotational speed of at least one of the plurality of fans based on an energy consumption parameter of a device in the system and a system location at which the device is located, comprises:

17. The method according to claim 15 or 16, wherein controlling the rotational speed of the at least one fan according to the energy consumption parameter of the device comprises:

and the controller determines a control index corresponding to the heat dissipation demand obtained according to the energy consumption parameter according to the corresponding relation between the heat dissipation demand and the control index, wherein the control index comprises the rotating speed of the fan and the frequency of the water pump in the embedded liquid cooling unit.

18. A controller comprising a memory and a processor, the memory for storing a set of computer instructions; the method of any of the preceding claims 12-17, when executed by the processor.

19. The equipment cabinet is characterized by comprising an embedded liquid cooling unit, a liquid cooling door, a plurality of liquid cooling plates, a plurality of fans and a controller; the embedded liquid cooling unit is connected with the liquid cooling door, the plurality of liquid cooling plates are connected with the liquid cooling door in parallel, and the plurality of liquid cooling plates are connected with the embedded liquid cooling unit in parallel; the controller being adapted to perform the operational steps of the method of any of the preceding claims 12-17.