CN118843649A - 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置 - Google Patents

树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置 Download PDF

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Publication number
CN118843649A
CN118843649A CN202380025888.1A CN202380025888A CN118843649A CN 118843649 A CN118843649 A CN 118843649A CN 202380025888 A CN202380025888 A CN 202380025888A CN 118843649 A CN118843649 A CN 118843649A
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formula
resin composition
compound
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CN202380025888.1A
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English (en)
Chinese (zh)
Inventor
桥口和弘
长谷部惠一
平野俊介
小林宇志
中岛祐司
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Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
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Publication of CN118843649A publication Critical patent/CN118843649A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36—Amides or imides
    • C08F222/40—Imides, e.g. cyclic imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
CN202380025888.1A 2022-03-11 2023-03-03 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置 Pending CN118843649A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022038645 2022-03-11
JP2022-038645 2022-03-11
PCT/JP2023/007985 WO2023171553A1 (ja) 2022-03-11 2023-03-03 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置

Publications (1)

Publication Number Publication Date
CN118843649A true CN118843649A (zh) 2024-10-25

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ID=87935004

Family Applications (1)

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CN202380025888.1A Pending CN118843649A (zh) 2022-03-11 2023-03-03 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置

Country Status (5)

Country Link
JP (1) JPWO2023171553A1 (enrdf_load_stackoverflow)
KR (1) KR20240157733A (enrdf_load_stackoverflow)
CN (1) CN118843649A (enrdf_load_stackoverflow)
TW (1) TW202342605A (enrdf_load_stackoverflow)
WO (1) WO2023171553A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024090410A1 (enrdf_load_stackoverflow) * 2022-10-26 2024-05-02
KR20250096750A (ko) * 2022-10-26 2025-06-27 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및, 프린트 배선판

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020054601A1 (ja) 2018-09-12 2020-03-19 日本化薬株式会社 マレイミド樹脂、硬化性樹脂組成物およびその硬化物
JP7513587B2 (ja) * 2019-02-28 2024-07-09 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板
KR20220132535A (ko) * 2020-01-24 2022-09-30 미츠비시 가스 가가쿠 가부시키가이샤 수지조성물, 수지시트, 프리프레그 및 프린트배선판
JP7005821B1 (ja) 2020-03-11 2022-02-10 日本化薬株式会社 マレイミド樹脂およびその製造方法、マレイミド溶液、並びに、硬化性樹脂組成物およびその硬化物
WO2022054867A1 (ja) * 2020-09-11 2022-03-17 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
TW202233705A (zh) * 2020-11-12 2022-09-01 日商味之素股份有限公司 樹脂組成物

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Publication number Publication date
TW202342605A (zh) 2023-11-01
JPWO2023171553A1 (enrdf_load_stackoverflow) 2023-09-14
KR20240157733A (ko) 2024-11-01
WO2023171553A1 (ja) 2023-09-14

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