CN118610104A - Novel integrated circuit packaging method - Google Patents
Novel integrated circuit packaging method Download PDFInfo
- Publication number
- CN118610104A CN118610104A CN202410711921.2A CN202410711921A CN118610104A CN 118610104 A CN118610104 A CN 118610104A CN 202410711921 A CN202410711921 A CN 202410711921A CN 118610104 A CN118610104 A CN 118610104A
- Authority
- CN
- China
- Prior art keywords
- copper block
- integration module
- copper
- block integration
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 114
- 229910052802 copper Inorganic materials 0.000 claims abstract description 114
- 239000010949 copper Substances 0.000 claims abstract description 114
- 229910000679 solder Inorganic materials 0.000 claims abstract description 43
- 230000010354 integration Effects 0.000 claims abstract description 41
- 238000003466 welding Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 229910001092 metal group alloy Inorganic materials 0.000 claims abstract description 6
- 150000002739 metals Chemical class 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 239000013078 crystal Substances 0.000 claims abstract description 4
- 238000005476 soldering Methods 0.000 claims abstract description 4
- 230000005672 electromagnetic field Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 15
- 238000013461 design Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a novel integrated circuit packaging method in the field of integrated circuit packaging, which comprises the following steps: s1, preparing a copper block, a blue film and a copper block integration module; s2, attaching the blue film to the bottom of a copper block integration module, placing the copper block at the top of the copper block integration module, and electrifying the copper block integration module to place the copper block in a preset round hole of the copper block integration module; s3, scanning the copper block integration module through AOI, and detecting when the porosity of the copper block is more than 99%; applying a fixed pressure to the copper block on the copper block integration module through pressure maintaining Tooling, and removing the copper block integration module to enable the copper block to be kept on the blue film; and S4, uniformly coating solder paste on the substrate/carrier, pressing the copper blocks into the solder paste on the substrate/carrier one by one in a thorn crystal mode, and welding the copper blocks on the substrate/carrier after the solder paste is melted and solidified through reflow soldering. The aspect ratio of the metal block of the invention can be made to be 0.5-3, and various pure metals or metal alloys can be used as welding materials.
Description
Technical Field
The invention belongs to the field of integrated circuit packaging, and particularly relates to a novel integrated circuit packaging method.
Background
In the field of integrated circuit packaging, solder ball bonding is a common connection technique that uses solder balls on the pads of a carrier to electrically and mechanically connect a chip product to the carrier. However, the conventional solder ball bonding process has some drawbacks: the traditional solder ball extension product solder disc process is limited by the aspect ratio of the solder balls; after the width of the welding disc or the solder ball is determined, the height of the solder ball cannot exceed the width of the solder ball; after the solder ball width is determined, the solder ball width or the solder pad area cannot be reduced according to the requirement; the characteristics of tin ball materials lead to the fact that the electric conductivity and the thermal conductivity of the product cannot be effectively improved.
In view of the above-mentioned drawbacks of the solder ball bonding process, there is a strong need to develop a bonding process which is highly variable in the ratio of width to height and which can use various alloys.
Disclosure of Invention
In order to solve the limitation of the traditional solder ball welding process in aspect ratio, electric conduction and heat conduction performance and flexibility of the design of a welding disk, the invention provides a novel integrated circuit packaging method which utilizes copper blocks and an electromagnetic field principle, improves the flexibility of the design of the welding disk, and allows various pure metals or metal alloys to be used as welding materials, thereby improving the electric conduction and heat conduction performance of the product.
In order to achieve the above purpose, the following technical scheme is adopted: the invention provides a novel integrated circuit packaging method, which comprises the following steps:
S1, preparing a copper block, a blue film and a copper block integration module;
s2, attaching the blue film to the bottom of a copper block integration module, placing the copper block at the top of the copper block integration module, and electrifying the copper block integration module to place the copper block in a preset round hole of the copper block integration module;
S3, scanning the copper block integration module through AOI, and detecting when the porosity of the copper block is more than 99%; applying a fixed pressure to the copper block on the copper block integration module through pressure maintaining Tooling, and then removing the copper block integration module to enable the copper block to be kept on the blue film;
And S4, uniformly coating solder paste on the substrate/carrier, pressing the copper blocks into the solder paste on the substrate/carrier one by one in a thorn crystal mode, and welding the copper blocks on the substrate/carrier after the solder paste is melted and solidified through reflow soldering.
Further, the copper block is one of a cylinder, a T-shaped body and a cuboid.
Further, the copper block may be replaced with various pure metals or metal alloys.
Further, the blue film is transferred in copper block welding.
Further, the copper block integration module moves the metal block into a preset round hole of the copper block integration module through an electromagnetic field principle.
The beneficial effects of the invention are as follows: compared with the traditional solder ball welding, the aspect ratio of the metal block can be 0.5-3, and the flexibility of the design and the packaging layout of the welding disc is greatly improved; the traditional solder ball welding is limited to the electric and heat conduction properties of tin materials, and the invention can select optimal electric and heat conduction materials according to different application requirements by using various pure metals or metal alloys as welding materials.
Drawings
FIG. 1 is a schematic top view of a copper block integration module;
fig. 2 is a schematic top view of the copper block integrated into the blue film in step S2;
FIG. 3 is a sectional view of the copper block integrated into the blue film in step S2;
FIG. 4 is an enlarged view of FIG. 3 at A;
FIG. 5 is a schematic sectional view of the copper block assembly in step S3 by applying a constant pressure to the copper block by the pressure maintaining Tooling;
FIG. 6 is a schematic top view of the copper block assembly removed in step S3, leaving the copper block behind in the blue film;
FIG. 7 is a schematic operation diagram of step S4;
Fig. 8 is a schematic top view of the copper block soldered on the substrate/carrier in step S4;
FIG. 9 is an internal layout of a conventional solder ball extension product;
Fig. 10 is a plan view of a conventional solder ball extension product.
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention.
Legend: 1. a copper block integration module; 2. copper blocks; 3. a blue film; 4. pressure maintaining Tooling; 5. a die-piercing device; 6. solder paste; 7. substrate/carrier a substrate/carrier; 8. solder balls; 9. and welding the disc.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art based on the embodiments of the present invention without making any inventive effort are within the scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. In addition, any methods and materials similar or equivalent to those described herein can be used in the present application. The preferred methods and materials described herein are illustrative only and should not be construed as limiting the application.
The experimental methods in the following examples are conventional methods unless otherwise specified, and the experimental materials used in the following examples are commercially available unless otherwise specified.
Examples
According to one embodiment of the present invention, as shown in fig. 1-8, a novel integrated circuit packaging method is provided, the packaging method comprising the steps of:
s1, preparing a proper copper block, a blue film and a copper block integration module;
Selecting a copper block with a proper shape, wherein the copper block is one of a cylinder, a T-shaped body and a cuboid, the shape design of the copper block needs to consider the contact area, the heat conduction performance and the electric connectivity of the copper block and an integrated circuit, in the embodiment, the cylindrical copper block is adopted, the shape of the copper block needs to be matched with an integrated module of the copper block, the diameter and the height of the copper block are accurately calculated and processed according to the packaging requirement of the integrated circuit so as to ensure good heat conduction and electric connectivity, and the copper block can be replaced by other pure metals or metal alloys according to the requirement so as to adapt to different electric and mechanical performance requirements;
The blue film is used as a temporary carrier and mainly used for supporting and protecting the copper block in the welding process, the compatibility of the blue film with the copper block and the welding material is considered in selection, and the stability of the blue film in the welding process is considered, and in the embodiment, the blue film has good high-temperature resistance and can be kept stable in the welding process;
The copper block integration module is key equipment for realizing accurate positioning of a copper block, the module utilizes the electromagnetic field principle, realizes movement and positioning of the copper block by accurately controlling the intensity and the direction of an electromagnetic field, and is designed to ensure that the copper block can be accurately placed at a preset position and also consider the simplicity and the reliability of the operation of the copper block;
S2, attaching the blue film to the bottom of the copper block integration module, providing a stable foundation for the placement of a subsequent copper block, ensuring that the contact surface of the blue film and the module is smooth and bubble-free for the installation of the blue film so as to ensure the stability of the copper block in the welding process, placing the copper block on the top of the copper block integration module, and accurately aligning the copper block with a round hole of the module so as to ensure that the copper block can be accurately adsorbed and positioned, and electrifying the copper block integration module to ensure that the copper block is placed in a preset round hole of the copper block integration module;
Through the electro-active electromagnetic field, the copper block can be adsorbed and accurately positioned in a preset round hole of the module;
s3, scanning the copper block integration module through an AOI, detecting the placement rate of the copper block, and detecting when the placement rate of the copper block is more than 99%;
the AOI system needs to have high-precision imaging and analysis capability so as to ensure accurate detection of the porosity of the copper block;
Then applying a fixed pressure to the copper block on the copper block integration module through pressure maintaining Tooling, and removing the copper block integration module to enable the copper block to be kept on the blue film;
The design of the pressure maintaining Tooling needs to consider the compatibility with the copper block integration module and the uniformity and controllability of the applied pressure;
after the copper block is stable, carefully removing the copper block integration module, wherein the copper block and the blue film are required to be protected in the removing process, so that the damage to the welding structure is avoided;
S4, selecting proper tin paste, adjusting the viscosity and fluidity of the tin paste according to welding requirements, preparing the tin paste under strict environmental conditions to ensure the quality and stability of the tin paste, uniformly coating the tin paste on a substrate/carrier plate, controlling the dosage of the tin paste in the coating process to avoid excessive or insufficient tin paste, uniformly coating the tin paste to ensure full contact between a copper block and the substrate/carrier plate, precisely pressing the copper block into the tin paste on the substrate/carrier plate one by one in a thorn crystal mode, controlling the pressure and speed in the pressing process to avoid damage to the copper block and the tin paste, putting the substrate pressed with the copper block into a reflow soldering furnace, melting and solidifying the tin paste through a set temperature curve, and ensuring the stability and reliability of the welding process.
From fig. 9-10, the internal layout of the conventional solder ball extension product and the physical planing surface of the conventional solder ball extension product show that the conventional solder ball welding process has some drawbacks: the traditional solder ball extension product solder disc process is limited by the aspect ratio of the solder balls; after the width of the welding disc or the solder ball is determined, the height of the solder ball cannot exceed the width of the solder ball; after the solder ball width is determined, the solder ball width or the solder pad area cannot be reduced according to the requirement; the characteristics of tin ball materials lead to the fact that the electric conductivity and the thermal conductivity of the product cannot be effectively improved.
Compared with the traditional solder ball welding, the aspect ratio of the metal block can be 0.5-3, the novel integrated circuit packaging method not only improves the flexibility and reliability of welding, but also limits the traditional solder ball welding to the electric conduction and heat conduction performance of tin materials.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The invention and its embodiments have been described above with no limitation, and the invention is illustrated in the figures of the accompanying drawings as one of its embodiments, without limitation in practice. In summary, those skilled in the art, having benefit of this disclosure, will appreciate that the invention can be practiced without the specific details disclosed herein.
Claims (5)
1. The novel integrated circuit packaging method is characterized in that: the packaging method comprises the following steps:
S1, preparing a copper block, a blue film and a copper block integration module;
s2, attaching the blue film to the bottom of a copper block integration module, placing the copper block at the top of the copper block integration module, and electrifying the copper block integration module to place the copper block in a preset round hole of the copper block integration module;
S3, scanning the copper block integration module through AOI, and detecting when the porosity of the copper block is more than 99%; applying a fixed pressure to the copper block on the copper block integration module through pressure maintaining Tooling, and then removing the copper block integration module to enable the copper block to be kept on the blue film;
And S4, uniformly coating solder paste on the substrate/carrier, pressing the copper blocks into the solder paste on the substrate/carrier one by one in a thorn crystal mode, and welding the copper blocks on the substrate/carrier after the solder paste is melted and solidified through reflow soldering.
2. The novel integrated circuit packaging method of claim 1, wherein: the copper block is one of a cylinder, a T-shaped body and a cuboid.
3. The novel integrated circuit packaging method of claim 2, wherein: the copper block may be replaced with various pure metals or metal alloys.
4. The novel integrated circuit packaging method of claim 3, wherein: the blue film plays a role in transferring in copper block welding.
5. The novel integrated circuit packaging method of claim 4, the method is characterized in that: the copper block integration module moves the metal block into a preset round hole of the copper block integration module through an electromagnetic field principle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410711921.2A CN118610104A (en) | 2024-06-04 | 2024-06-04 | Novel integrated circuit packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410711921.2A CN118610104A (en) | 2024-06-04 | 2024-06-04 | Novel integrated circuit packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118610104A true CN118610104A (en) | 2024-09-06 |
Family
ID=92551069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410711921.2A Pending CN118610104A (en) | 2024-06-04 | 2024-06-04 | Novel integrated circuit packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118610104A (en) |
-
2024
- 2024-06-04 CN CN202410711921.2A patent/CN118610104A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9120169B2 (en) | Method for device packaging | |
| US5427301A (en) | Ultrasonic flip chip process and apparatus | |
| EP1386356B1 (en) | Fluxless flip chip interconnection | |
| CN101252093B (en) | Method of manufacturing an electronic component and an electronic device, the electronic component and electronic device | |
| JP2007268613A (en) | Method for diffusion soldering | |
| KR970012964A (en) | A system interconnected by bond material bumps | |
| US9662730B2 (en) | Bump electrode, board which has bump electrodes, and method for manufacturing the board | |
| CN101939832A (en) | Thermal mechanical flip chip die bonding | |
| EP1472916B1 (en) | Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board | |
| JPH0810716B2 (en) | Electronic package | |
| US5877079A (en) | Method for manufacturing a semiconductor device and a method for mounting a semiconductor device for eliminating a void | |
| US10390440B1 (en) | Solderless inter-component joints | |
| CN110459667B (en) | LED flip-chip substrate | |
| CN114300369A (en) | Manufacturing method of semiconductor packaging structure | |
| US7968801B2 (en) | Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure | |
| EP1230676A1 (en) | Advanced flip-chip join package | |
| CN118610104A (en) | Novel integrated circuit packaging method | |
| JP2643613B2 (en) | Method of forming electrical connection contact and method of mounting electronic component | |
| CN113394241B (en) | Accurate and stable chip mass transfer method | |
| JPH04263434A (en) | Formation of electric connection contact and manufacture of mounting board | |
| CN115020259B (en) | Semiconductor structure and packaging method thereof | |
| JP4056856B2 (en) | Electronic component mounting method | |
| JP3336999B2 (en) | Bump sheet, bump forming apparatus and bump forming method using the same | |
| JPH05102251A (en) | Tab tape, manufacture thereof and ic chip mounting method using said tab tape | |
| JP3078781B2 (en) | Semiconductor device manufacturing method and semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |