CN118555740A - Driving plate, manufacturing method of driving plate and electronic equipment - Google Patents
Driving plate, manufacturing method of driving plate and electronic equipment Download PDFInfo
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- CN118555740A CN118555740A CN202410650479.7A CN202410650479A CN118555740A CN 118555740 A CN118555740 A CN 118555740A CN 202410650479 A CN202410650479 A CN 202410650479A CN 118555740 A CN118555740 A CN 118555740A
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- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 239000011810 insulating material Substances 0.000 claims description 25
- 230000017525 heat dissipation Effects 0.000 claims description 23
- 239000004020 conductor Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 3
- 239000011152 fibreglass Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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Abstract
The application discloses a driving plate, a preparation method of the driving plate and electronic equipment, and relates to the technical field of electronics. Wherein, the drive plate includes: the first wiring layer is provided with a heat conducting piece, a heat concentration bonding pad and a temperature sensing bonding pad are arranged on the heat conducting piece, the heat concentration bonding pad is used for being connected with a heat concentration pin of the heating device, and the temperature sensing bonding pad is used for being connected with a temperature sensing pin of the temperature sensing device; and a first cover layer disposed on the surface of the first wiring layer and exposing the temperature sensing pad and the heat concentration pad. The drive plate of the application is applied to products such as AR, MR and VR products, and the like, so that the temperature of devices on a miniature drive plate of the XR products can be monitored.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a driving plate, a preparation method of the driving plate and electronic equipment.
Background
The XR (such as AR, MR, VR, etc.) products are provided with miniature drive plates. In the working process of the XR product, a device on the miniature drive plate can generate a large amount of heat, so that the temperature of the XR product is too high, and the risks of breakdown, bursting, burning and the like of electronic components in the XR product are caused.
Therefore, how to realize temperature monitoring of devices on a miniature drive board of an XR product becomes a technical problem to be solved.
Disclosure of Invention
An object of the present application is to provide a new drive plate solution.
According to a first aspect of the present application, there is provided a drive plate comprising:
the heat conduction device comprises a first wiring layer, a second wiring layer and a heat conduction layer, wherein the first wiring layer is provided with a heat conduction member, a heat concentration bonding pad and a temperature sensing bonding pad are arranged on the heat conduction member, the heat concentration bonding pad is used for being connected with a heat concentration pin of a heating device, and the temperature sensing bonding pad is used for being connected with a temperature sensing pin of the temperature sensing device;
and the first covering layer is arranged on the surface of the first wiring layer and exposes the temperature sensing pad and the heat concentration pad.
Optionally, the heating device includes a heat dissipation member, a heat dissipation pad is further disposed on the heat conduction member, the first cover layer further exposes the heat dissipation pad, and the heat dissipation pad is used for connecting the heat dissipation member.
Optionally, the heat concentration pin and the temperature sensing pin have the same electrical property, and the heat conducting member comprises a heat conducting material.
Optionally, the heat concentration pin and the temperature sensing pin have different electrical properties, and the heat conducting piece at least comprises a heat conducting insulating material, and the heat conducting insulating material insulates the heat concentration pad and the temperature sensing pad.
Optionally, the heat dissipation element and the temperature sensing pin have the same electrical property, and the heat conduction element comprises a heat conduction material;
Or the heat dissipation piece and the temperature sensing pin have different electrical properties, and the heat conduction piece at least comprises a heat conduction insulating material, and the heat conduction insulating material insulates the heat dissipation bonding pad and the temperature sensing bonding pad.
Optionally, the electrical property of the temperature sensing pin is a power supply property, the heat conducting piece is further provided with a power supply pad, the first covering layer further exposes the power supply pad, and the power supply pad is used for connecting with the power supply pin of the heating device.
Optionally, the heat-conducting insulating material is heat-conducting ceramic or heat-conducting insulating fiber glass fiber cloth.
Optionally, the thermally conductive material is copper.
According to a second aspect of the present application, there is provided a method of manufacturing a drive board including a first wiring layer and a first cover layer, the method comprising:
a heat conducting piece is arranged on the first wiring layer, a heat concentration bonding pad and a temperature sensing bonding pad are arranged on the heat conducting piece, the heat concentration bonding pad is used for being connected with a heat concentration pin of a heating device, and the temperature sensing bonding pad is used for being connected with a temperature sensing pin of the temperature sensing device;
the first cover layer is disposed on a surface of the first wiring layer such that the first cover layer exposes the temperature sensing pad and the heat concentration pad.
According to a third aspect of the present application, there is provided an electronic device comprising the drive board as in any one of the first aspects;
or the electronic device comprises a drive board prepared according to the method of the second aspect.
The present application provides a driving plate comprising: the first wiring layer is provided with a heat conducting piece, a heat concentration bonding pad and a temperature sensing bonding pad are arranged on the heat conducting piece, the heat concentration bonding pad is used for being connected with a heat concentration pin of the heating device, and the temperature sensing bonding pad is used for being connected with a temperature sensing pin of the temperature sensing device; and a first cover layer disposed on the surface of the first wiring layer and exposing the temperature sensing pad and the heat concentration pad. Based on the driving plate provided by the application, the temperature of the heating device can be monitored by the temperature sensing device. Thus, when the drive plate provided by the application is applied to XR products such as AR, MR and VR products, the temperature of devices on a miniature drive plate of the XR products can be monitored.
Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments of the application, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.
Fig. 1 is a schematic top view of a first wiring layer of a driving board according to the present application;
FIG. 2 is a schematic cross-sectional view of a driving plate according to the present application;
fig. 3 is a schematic top view of a first wiring layer of a driving board according to the second embodiment of the present application;
FIG. 4 is a schematic diagram of a cross-sectional structure of a driving plate according to the present application;
Fig. 5 is a schematic top view of a first wiring layer of a driving board according to the third embodiment of the present application;
FIG. 6 is a schematic diagram of a cross-sectional structure of a driving plate according to the present application;
FIG. 7 is a schematic flow chart of a method for manufacturing a drive plate according to the present application;
Reference numerals:
11-a first wiring layer; 12-a first cover layer; 13-an insulating layer; 14-a second wiring layer; 15-a second cover layer;
111-a heat conducting member; 112-heat concentration pads; 113-a temperature sensing pad; 114-power pads; 1111-a thermally conductive insulating material;
2-a heat generating device; 21-heat concentration pins; 22-power pins; 3-a temperature sensing device; 31-temperature sensing pin.
Detailed Description
Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise.
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The features of the application "first", "second" and the like in the description and in the claims may be used for the explicit or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
The present application provides a driving board, as shown in fig. 1 and 2, comprising:
the first wiring layer 11, the first wiring layer 11 is provided with a heat conduction member 111, the heat conduction member 111 is provided with a heat concentration pad 112 and a temperature sensing pad 113, the heat concentration pad 112 is used for connecting with a heat concentration pin 21 of the heating device 2, and the temperature sensing pad 113 is used for connecting with a temperature sensing pin 31 of the temperature sensing device 3;
The first cover layer 12, the first cover layer 12 is disposed on the surface of the first wiring layer 11, and exposes the temperature sensing pads 113 and the heat concentration pads 112.
In this embodiment, the driving board may be an FPCB or a PCB. The specific form of the driving plate is not limited in the present application.
In the present embodiment, the heat conductive member 111 is provided on the first wiring layer 11. And, the manner of disposing the heat conductive member 111 on the first wiring layer 11 may be specifically a laying manner, an open hole filling manner, or the like.
The heat conductive member 111 is provided with a heat concentration pad 112. The heat concentration pad 112 is exposed by the first cover layer 12 for connecting the heat concentration pins 21 of the heat generating device 2. The heat concentration pins 21 of the heat generating device 2 are specifically pins that concentrate heat when the heat generating device 2 generates heat.
The heat conductive member 111 is further provided with a temperature sensing pad 113. The temperature sensing pad 113 is exposed by the first cover layer 12 for connecting the temperature sensing pin 31 of the temperature sensing device 3. The temperature sensing pin 31 is specifically a pin for sensing heat in the temperature sensing device 3.
The number of the heat concentration pads 112 of the driving board is not limited in the present application. For example, two heat generating devices 2 are welded on the driving board provided by the application, and 2 heat concentration pads 112,1 and 1 heat concentration pin 21 for connecting 1 heat generating device 2 are arranged on the heat conducting piece 111. For another example, 1 heat generating device 2 is soldered on the driving board provided by the present application, and 2 heat concentrating pads 112 are provided on the heat conducting member 111, and the 2 heat concentrating pads 112 are used for respectively connecting 2 heat concentrating pins 21 of the 1 heat generating device 2. For another example, 2 heat generating devices 2 are soldered on the driving board provided by the present application, 3 heat collecting pads 112 are disposed on the heat conducting member 111, and 2 heat collecting pads 112 of the 3 heat collecting pads 112 are used for respectively connecting 2 heat collecting pins 21 of 1 heat generating device 2, and the remaining 1 heat collecting pad 112 is used for connecting 1 heat collecting pin 21 of another heat generating device 2, as shown in fig. 1 and 2 for example.
When both the heat generating device 2 and the temperature sensing device 3 are soldered on the driving board provided by the present application, the heat concentrating pins 21 of the heat generating device 2 are connected with the heat concentrating pads 112. Based on this, when the heat generating device 2 generates heat, the heat thereof is transferred to the heat collecting pad 112 through the heat collecting pin 21. Further, the heat concentration pad 112 is disposed on the heat conducting member 111, and the heat of the heat generating device 2 is further transferred to the body of the heat conducting member 112. Further, since the temperature sensing pads 113 are also provided on the heat conductive member 111, the heat of the heat generating device 2 is transferred to the temperature sensing pads 113 again through the body of the heat conductive member 111. The heat of the heat generating device 2 is transferred to the temperature sensing pin 31 of the temperature sensing device 3 again via the temperature sensing pad 113, on the basis that the temperature sensing pad 113 is connected to the temperature sensing pin 31 of the temperature sensing device 3. In this way, the temperature sensing device 3 determines the temperature of the heat generating device 2 based on the heat on the temperature sensing pin 31. Based on the above, the driving board provided by the application can realize the monitoring of the temperature of the heating device 2 by the temperature sensing device 3. Thus, when the drive plate provided by the application is applied to XR products such as AR, MR and VR products, the temperature of devices on a miniature drive plate of the XR products can be monitored.
It will be appreciated that, as shown in fig. 2, the driving board provided by the present application may further include at least one second wiring layer 14, and an insulating layer 13 is disposed between the first wiring layer 11 and the second wiring layer 14 and between the second wiring layers 14. And as shown in fig. 2, the driving board provided by the present application may further include a second cover layer 15 located at the outermost layer of the driving board and far from the first wiring layer 11.
The present application provides a driving plate comprising: the first wiring layer is provided with a heat conducting piece, a heat concentration bonding pad and a temperature sensing bonding pad are arranged on the heat conducting piece, the heat concentration bonding pad is used for being connected with a heat concentration pin of the heating device, and the temperature sensing bonding pad is used for being connected with a temperature sensing pin of the temperature sensing device; and a first cover layer disposed on the surface of the first wiring layer and exposing the temperature sensing pad and the heat concentration pad. Based on the driving plate provided by the application, the temperature of the heating device can be monitored by the temperature sensing device. Thus, when the drive plate provided by the application is applied to XR products such as AR, MR and VR products, the temperature of devices on a miniature drive plate of the XR products can be monitored.
In one embodiment of the present application, the heat generating device 2 includes a heat dissipating member, the heat conducting member 111 is further provided with a heat dissipating pad, and the first cover layer 12 also exposes the heat dissipating pad, which is used for connecting the heat dissipating member.
In the present embodiment, the heat generating device 2 further includes a heat sink. Taking the heating device 2 as a high-power-consumption device as an example, the bottom of the high-power-consumption device is provided with a heat sink as a heat sink. The heat sink also concentrates heat from the high power device. In order to monitor the temperature of the heat generating device 2 more accurately, the heat conducting member 111 in the driving board provided by the application is further provided with a heat dissipation pad, and the heat dissipation pad is exposed through the first covering layer 12 for connection of the heat dissipating member of the heat generating device 2. Based on this, the heat of the heat generating device 2 is transferred to the temperature sensing device via the heat radiating member, the heat radiating pad, the body of the heat conducting member 111, the temperature sensing pad 113, and the temperature sensing pin 31 of the heat generating device 2, and is transferred to the temperature sensing device via the heat concentrating pin 21, the heat concentrating pad 112, the body of the heat conducting member 111, the temperature sensing pad 113, and the temperature sensing pin 113 of the heat generating device 2. Based on this, the temperature sensing device 3 accurately monitors the temperature of the heat generating device 2.
Based on the driving plate provided by the application, the temperature of the heating device provided with the heat dissipation part can be accurately monitored.
In one embodiment of the present application, the electrical properties of the temperature sensing pin 31 of the temperature sensing device 3 are the same as or different from the electrical properties of the heat concentrating pin 21 of the heat generating device 2.
In the case that the electrical properties of the temperature sensing pin 31 of the temperature sensing device 3 are the same as those of the heat concentration pin 21 of the heat generating device 2, the heat concentration pin 21 of the heat generating device 2 and the temperature sensing pin 31 of the temperature sensing device 3 are connected via the driving board provided by the present application, so that mutual damage between the heat generating device 2 and the temperature sensing device 3 is not caused. For example, the electrical property of the temperature-sensing pin 31 of the temperature-sensing device 3 and the electrical property of the heat-concentrating pin 21 of the heat-generating device 2 are both GND properties. In this case, the heat conduction member 111 may have only a heat conduction effect, and other characteristics of the heat conduction member 111, such as an electric conduction characteristic, need not be limited. Based on this, in one embodiment of the present application, the heat concentrating pins 21 and the temperature sensing pins 31 have the same electrical properties, and the heat conductive member 111 includes a heat conductive material.
When the electrical properties of the temperature sensing pin 31 of the temperature sensing device 3 are different from those of the heat concentration pin 21 of the heat generating device 2, for example, when the heat conducting member 111 further has electrical conductivity, the heat concentration pin 21 of the heat generating device 2 and the temperature sensing pin 31 of the temperature sensing device 3 are connected through the driving board provided by the application, so that mutual damage between the heat generating device 2 and the temperature sensing device 3 can be caused. For example, as shown in fig. 3 and 4, the electrical property of the temperature-sensing pin 31 of the temperature-sensing device 3 is VDD property, and the electrical property of the heat-concentrating pin 21 of the heat-generating device 2 is GND property. To avoid this problem, in one embodiment of the present application, the heat concentrating pins 21 and the temperature sensing pins 31 have different electrical properties, and as shown in fig. 3 and 4, the heat conductive member 111 includes at least a heat conductive insulating material 1111, and the heat conductive insulating material 111 insulates the heat concentrating pad 112 from the temperature sensing pad 113. In this way, the heat conductive insulating material 1111 in the heat conductive member 111 can also realize insulation of the heat concentration pad 112 from the temperature sensing pad 113 in the case of realizing heat conduction. At this time, there is no electrical connection between the heat generating device 2 and the temperature sensing device 3, i.e., there is no problem of mutual damage.
On the basis of the above-described embodiment, as shown in fig. 5 and 6, in one embodiment of the present application, the electrical property of the temperature-sensing pin 31 is a power property, the heat conductive member 111 is further provided with a power pad 114, and the first cover layer 12 further exposes the power pad 114, and the power pad 114 is used for connecting with the power pin 22 of the heat generating device 2.
In the present embodiment, the power supply pin 22 of the heat generating device 2 has the same electrical properties as the temperature sensing pin 31. Thus, the two are connected by the heat conductive member 111, and there is no problem of mutual damage.
And, there is a part of heat in the power supply pin 22 of the heat generating device 2. The power supply pin 22 of the heat generating device 2 as a non-heat concentrating pin transfers part of the heat to the temperature sensing pin 31 of the temperature sensing device 3 through the power supply pad 114, the body of the heat conducting member 111, and the temperature sensing pad 113. In this way, the heat transfer path of the heat generating device 2 is increased, and the monitoring of the temperature of the heat generating device 2 by the temperature sensing device 3 is further improved.
In the present embodiment, in the case where the heat conductive member 111 includes at least the heat conductive insulating material 1111, the heat conductive member 111 may be realized in particular by the manner shown in fig. 3 to 6, that is, the heat conductive member 111 is formed by combining the heat conductive material (the electric conductivity is not limited) and the heat conductive insulating material 1111.
In the same way, in the case where the heat radiating member is provided on the heat generating device 2, the electrical property of the temperature sensing pin 31 of the temperature sensing device 3 is the same as or different from that of the heat radiating member of the heat generating device 2, corresponding to the above-described embodiment.
In the case that the electrical properties of the temperature sensing pins 31 of the temperature sensing device 3 are the same as those of the heat dissipating member of the heat generating device 2, mutual damage between the heat generating device 2 and the temperature sensing device 3 is not caused when the heat dissipating member of the heat generating device 2 is connected with the temperature sensing pins 31 of the temperature sensing device 3 through the driving board provided by the application. In this case, the heat conduction member 111 may have only a heat conduction effect, and other characteristics of the heat conduction member 111, such as an electric conduction characteristic, need not be limited. Based on this, in one embodiment of the present application, the heat sink and the temperature sensing pin 31 have the same electrical properties, and the heat conductive member 111 includes a heat conductive material.
When the electrical properties of the temperature sensing pin 31 of the temperature sensing device 3 are different from those of the heat dissipating member of the heat generating device 2, if the heat conducting member 111 has electrical conductivity, the heat dissipating member of the heat generating device 2 and the temperature sensing pin 31 of the temperature sensing device 3 are connected through the driving board provided by the present application, so that mutual damage between the heat generating device 2 and the temperature sensing device 3 is caused. To avoid this problem, in one embodiment of the present application, the heat dissipation member and the temperature sensing pin 31 have different electrical properties, and the heat conduction member 111 at least includes a heat conduction insulating material 1111, and the heat conduction insulating material 111 insulates the heat dissipation pad and the temperature sensing pad 113. In this way, the heat conductive insulating material 1111 in the heat conductive member 111 can also realize insulation of the heat dissipation pad from the temperature sensing pad 113 in the case of realizing heat conduction. At this time, the problem of no mutual damage between the heat generating device 2 and the temperature sensing device 3 occurs.
For the above embodiments, in one example, the thermally conductive material is specifically copper. Based on this, the heat conduction member 111 has good heat conductivity.
And, in one example, the thermally conductive insulating material 1111 is a thermally conductive ceramic or a thermally conductive insulating fiberglass cloth. In this way, the heat conductive insulator has insulation properties when it has heat conductivity.
The application provides a preparation method of a driving board, wherein the driving board comprises a first wiring layer and a first covering layer, as shown in fig. 7, the method comprises the following steps of S71 and S72:
step S71, a heat conducting piece is arranged on the first wiring layer, a heat concentration bonding pad and a temperature sensing bonding pad are arranged on the heat conducting piece, the heat concentration bonding pad is used for being connected with a heat concentration pin of a heating device, and the temperature sensing bonding pad is used for being connected with a temperature sensing pin of the temperature sensing device;
and step S72, disposing the first covering layer on the surface of the first wiring layer, and enabling the first covering layer to expose the temperature sensing bonding pad and the heat concentration bonding pad.
In one embodiment of the application, the heat generating device includes a heat sink, the method further comprising: and a heat dissipation pad is further arranged on the heat conduction piece, the first covering layer also exposes the heat dissipation pad, and the heat dissipation pad is used for connecting the heat dissipation piece.
In one embodiment of the present application, the heat concentrating pins and the temperature sensing pins have the same electrical properties, and the heat conductive member comprises a heat conductive material.
In one embodiment of the present application, the heat concentration pin and the temperature sensing pin have different electrical properties, and the heat conducting member includes at least a heat conducting insulating material, and the heat conducting insulating material insulates the heat concentration pad and the temperature sensing pad.
In one embodiment of the present application, the heat dissipation element and the temperature sensing pin have the same electrical property, and the heat conduction element comprises a heat conduction material;
Or the heat dissipation piece and the temperature sensing pin have different electrical properties, and the heat conduction piece at least comprises a heat conduction insulating material, and the heat conduction insulating material insulates the heat dissipation bonding pad and the temperature sensing bonding pad.
In one embodiment of the present application, the electrical property of the temperature sensing pin is a power source property, and the method further comprises: and a power supply pad is arranged on the heat conducting piece, the first covering layer also exposes the power supply pad, and the power supply pad is used for connecting with a power supply pin of the heating device.
In one embodiment of the present application, the heat conductive insulating material is a heat conductive ceramic or a heat conductive insulating fiber glass cloth.
In one embodiment of the application, the thermally conductive material is copper.
The application also provides electronic equipment, which comprises the drive board provided by any one of the drive board embodiments.
Or the electronic device comprises a drive board prepared according to any one of the methods provided in the method embodiments described above.
The foregoing description of embodiments of the application has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the technical improvement of the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the application is defined by the appended claims.
Claims (10)
1. A drive plate, comprising:
The heat conduction device comprises a first wiring layer (11), wherein the first wiring layer (11) is provided with a heat conduction member (111), a heat concentration pad (112) and a temperature sensing pad (113) are arranged on the heat conduction member (111), the heat concentration pad (112) is used for being connected with a heat concentration pin (21) of a heating device (2), and the temperature sensing pad (113) is used for being connected with a temperature sensing pin (31) of a temperature sensing device (3);
And a first cover layer (12), wherein the first cover layer (12) is arranged on the surface of the first wiring layer (11), and exposes the temperature sensing pad (113) and the heat concentration pad (112).
2. The drive board according to claim 1, wherein the heat generating device (2) comprises a heat dissipating member, the heat conducting member (111) is further provided with a heat dissipating pad, the first cover layer (12) further exposes the heat dissipating pad, and the heat dissipating pad is used for connecting the heat dissipating member.
3. The drive board according to claim 1, wherein the heat concentration pins (21) and the temperature sensing pins (31) have the same electrical properties, and the heat conducting member (111) comprises a heat conducting material.
4. The drive board according to claim 1, wherein the heat concentration pin (21) and the temperature sensing pin (31) have different electrical properties, the heat conducting member (111) comprises at least a heat conducting insulating material (1111), and the heat conducting insulating material (1111) insulates the heat concentration pad (112) from the temperature sensing pad (113).
5. The drive plate according to claim 2, wherein the heat sink and the temperature-sensitive pin (31) have the same electrical properties, the heat-conducting member (111) comprising a heat-conducting material;
Or the heat dissipation member and the temperature sensing pin (31) have different electrical properties, the heat conduction member (111) at least comprises a heat conduction insulating material (1111), and the heat conduction insulating material (1111) insulates the heat dissipation pad and the temperature sensing pad (113).
6. The drive board according to claim 4, wherein the electrical property of the temperature-sensitive pin (31) is a power property, the heat conductive member (111) is further provided with a power pad (114), and the first cover layer (12) further exposes the power pad (114), the power pad (114) being for connecting with a power pin (22) of the heat generating device (2).
7. The drive plate according to claim 4 or 5, characterized in that the thermally conductive insulating material (1111) is a thermally conductive ceramic or a thermally conductive insulating fibrous glass cloth.
8. The drive plate of claim 3 or 5, wherein the thermally conductive material is copper.
9. A method of manufacturing a drive board, the drive board comprising a first wiring layer and a first cover layer, the method comprising:
a heat conducting piece is arranged on the first wiring layer, a heat concentration bonding pad and a temperature sensing bonding pad are arranged on the heat conducting piece, the heat concentration bonding pad is used for being connected with a heat concentration pin of a heating device, and the temperature sensing bonding pad is used for being connected with a temperature sensing pin of the temperature sensing device;
the first cover layer is disposed on a surface of the first wiring layer such that the first cover layer exposes the temperature sensing pad and the heat concentration pad.
10. An electronic device, characterized in that the electronic device comprises a drive board according to any one of claims 1-8;
Or the electronic device comprises a drive board prepared according to the method of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410650479.7A CN118555740A (en) | 2024-05-23 | 2024-05-23 | Driving plate, manufacturing method of driving plate and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410650479.7A CN118555740A (en) | 2024-05-23 | 2024-05-23 | Driving plate, manufacturing method of driving plate and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118555740A true CN118555740A (en) | 2024-08-27 |
Family
ID=92452404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410650479.7A Pending CN118555740A (en) | 2024-05-23 | 2024-05-23 | Driving plate, manufacturing method of driving plate and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118555740A (en) |
-
2024
- 2024-05-23 CN CN202410650479.7A patent/CN118555740A/en active Pending
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