CN118491946A

CN118491946A - Cleaning assembly, semiconductor manufacturing equipment and cleaning method

Info

Publication number: CN118491946A
Application number: CN202410955760.1A
Authority: CN
Inventors: 陈昱成; 詹云; 陈瑶; 孙柏友
Original assignee: Wuhan Xinxin Integrated Circuit Co ltd
Current assignee: Wuhan Xinxin Integrated Circuit Co ltd
Priority date: 2024-07-17
Filing date: 2024-07-17
Publication date: 2024-08-16

Abstract

The application provides a cleaning assembly, semiconductor manufacturing equipment and a cleaning method. The cleaning component is used for cleaning semiconductor processing equipment, the semiconductor processing equipment comprises a bearing table, a first shell and a second shell, the second shell is covered on the first shell, the first shell and the second shell are arranged at intervals to form a containing cavity, and the bearing table is contained in the containing cavity; the cleaning assembly includes a rotating shaft; the rotary table is fixed on the rotary shaft, a drainage groove is formed in the rotary table, the drainage groove extends from the upper edge of the rotary table to the lower edge of the rotary table, and a liquid spraying hole which is correspondingly communicated with the drainage groove is formed in the lower edge of the rotary table; when the cleaning component is used for cleaning the semiconductor processing equipment, the cleaning component is accommodated in the accommodating cavity of the semiconductor processing equipment, the rotary table rotates along the rotary shaft, and the cleaning solution flows through the drainage groove on the rotary table and is sprayed out from the liquid spraying hole so as to clean the accommodating cavity. Through the arrangement, the gluing residues can be sufficiently cleaned, and the cleaning effect is improved.

Description

Cleaning assembly, semiconductor manufacturing equipment and cleaning method

Technical Field

The present application relates to the field of semiconductor manufacturing technology, and in particular, to a cleaning assembly, a semiconductor manufacturing apparatus, and a cleaning method.

Background

In the semiconductor manufacturing process, the process procedures of cleaning, oxidizing, gluing, baking, exposing and the like are required for the element to be processed (such as a wafer, a chip and the like). In the use process of the process machine, the thrown photoresist liquid and other process materials are easy to adhere to the inner wall of the gluing cavity, and the product yield can be influenced without cleaning for a long time.

In the related art, a semiconductor processing apparatus is generally controlled to be in an idle state at regular intervals, and the automatic cleaning of the photoresist chamber is achieved by rotating a carrying table for carrying the components to be processed to throw the cleaning solution to the inner wall of the photoresist chamber. However, the inner wall of the gluing cavity cannot be sufficiently cleaned by adopting the method, and the cleaning effect is poor.

Disclosure of Invention

The application provides a cleaning component, semiconductor processing equipment and a cleaning method, wherein the cleaning component is used for cleaning the semiconductor processing equipment, so that the problem that the inner wall of a gluing cavity of the semiconductor processing equipment cannot be sufficiently cleaned in the related art can be solved, the cleaning effect is improved, and the product yield is improved.

In order to solve the above technical problems, in one aspect, the present application provides a cleaning assembly for cleaning a semiconductor processing apparatus, where the semiconductor processing apparatus includes a carrier, a first housing, and a second housing, the second housing is covered on the first housing, and the first housing and the second housing are spaced apart to form a housing cavity, and the carrier is housed in the housing cavity; the cleaning assembly includes: a rotation shaft; the rotary table is fixed on the rotary shaft, a drainage groove is formed in the rotary table, the drainage groove extends from the upper edge of the rotary table to the lower edge of the rotary table, and a liquid spraying hole which is correspondingly communicated with the drainage groove is formed in the lower edge of the rotary table; when the cleaning component is used for cleaning the semiconductor processing equipment, the cleaning component is contained in a containing cavity of the semiconductor processing equipment, the rotary table rotates along the rotating shaft, and cleaning solution flows through the drainage grooves on the rotary table and is sprayed out from the liquid spraying hole so as to clean the containing cavity.

In some embodiments, the drainage groove is formed on the upper surface of the turntable; the upper surface of the turntable is convex, and the position of the upper edge of the turntable relative to a horizontal plane is higher than the position of the lower edge of the turntable relative to the same horizontal plane, so that the radial direction of the upper surface is inclined relative to the horizontal plane.

In some embodiments, the lower edge of the turntable is provided with a warping portion warping upward relative to a horizontal plane, and the liquid spraying hole is located at the warping portion.

In some embodiments, the warpage angle of the warpage portion is 1 ° to 40 ° with respect to a horizontal plane, and the inclination angle of the top wall of the second housing is 1 ° to 40 ° with respect to the horizontal plane.

In some embodiments, the drainage channel extending from the upper edge to the lower edge of the turntable is arcuate.

In some embodiments, the cleaning assembly further comprises: the upper cover is covered on the turntable; the upper cover is provided with a solvent pipeline in the circumferential direction, the upper end face of the upper cover is provided with a liquid inlet, the lower end face of the upper cover is provided with a liquid outlet, the liquid outlet is communicated with the corresponding drainage groove, the liquid inlet is used for being communicated with a liquid delivery pipeline to introduce cleaning solution, and the cleaning solution is respectively injected into the corresponding drainage groove through the solvent pipeline and the liquid outlet.

In some embodiments, the radial direction of the upper cover is inclined with respect to the horizontal plane; the inclination angle of the radial direction of the upper cover relative to the horizontal plane is matched with the inclination angle of the radial direction of the turntable relative to the horizontal plane.

In some embodiments, the cleaning assembly further comprises: a bottom support arranged on the upper cover, an accommodating space is formed between the bottom support and the upper cover, the turntable is accommodated in the accommodating space and is rotatable in the accommodating space under the drive of the rotating shaft.

In some embodiments, the cleaning assembly further comprises a detection assembly disposed on the first housing and/or the second housing for detecting a contamination level of the semiconductor processing apparatus.

In some embodiments, the first housing is provided with an exhaust channel, and the detection component is disposed in the exhaust channel and is configured to detect an air flow of the exhaust channel, so as to detect a contamination level of the semiconductor processing apparatus.

In order to solve the above technical problem, a second aspect of the present application further provides a semiconductor manufacturing apparatus, including: a first housing; the second shell is covered on the first shell and is arranged at intervals with the first shell to form a containing cavity; the bearing table is accommodated in the accommodating cavity; and a cleaning assembly as claimed in the first aspect.

In order to solve the above technical problem, a third aspect of the present application further provides a cleaning method applied to the semiconductor processing apparatus of the second aspect, the cleaning method includes: taking out the element to be processed from the accommodating cavity; and placing the cleaning component into the accommodating cavity, and starting the cleaning component to clean the semiconductor processing equipment.

In some embodiments, the cleaning method further comprises: and monitoring a real-time pressure value of an exhaust channel of the semiconductor processing equipment, and adjusting a preset time interval based on the real-time pressure value, wherein the preset time interval is a time interval for calling the cleaning component to clean the semiconductor processing equipment.

Some embodiments of the application provide a cleaning assembly comprising a rotating shaft and a turntable fixed on the rotating shaft, wherein the rotating shaft can drive the turntable to rotate. The rotary table is provided with a drainage groove extending from the upper edge of the rotary table to the lower edge of the rotary table, and the lower edge of the rotary table is provided with a liquid spraying hole correspondingly communicated with the drainage groove. The cleaning assembly is configured to deliver a cleaning solution for cleaning the photoresist residue to a receiving chamber of the semiconductor processing apparatus. The first shell and the second shell of the semiconductor processing equipment are arranged at intervals to form an accommodating cavity, when the cleaning component is used for cleaning the semiconductor processing equipment, the cleaning component is accommodated in the accommodating cavity, and the rotating shaft is rotated to drive the turntable to rotate along the rotating shaft, so that cleaning solution can be sprayed out from the liquid spraying hole through the drainage groove, the cleaning area is increased, the accommodating cavity is cleaned more fully and comprehensively, the cleaning effect is improved, the replacement frequency of the first shell and/or the second shell is further reduced, and the service life of the semiconductor processing equipment is prolonged, and especially the service life of the first shell and/or the second shell is prolonged.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.

FIG. 1 is a schematic view of a semiconductor processing apparatus with a cleaning assembly mounted thereon in accordance with some embodiments of the present application;

FIG. 2 is a schematic longitudinal cross-sectional view of the semiconductor processing apparatus of FIG. 1 with cleaning elements mounted thereon;

FIG. 3 is a schematic view of the cleaning assembly of FIG. 1;

FIG. 4 is an exploded view of the cleaning assembly of FIG. 1;

FIG. 5 is a schematic view of a cleaning assembly in accordance with some embodiments of the application;

FIG. 6 is a schematic diagram of a semiconductor processing apparatus employing the cleaning assembly of FIG. 5 in accordance with some embodiments of the present application;

FIG. 7 is a schematic longitudinal cross-sectional view of the semiconductor processing apparatus of FIG. 6 with cleaning elements mounted thereon; and

FIG. 8 is a flow chart of a cleaning method according to some embodiments of the application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The terms "first" and "second" in the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature.

In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

For ease of description, some embodiments of the application may use spatially relative terms such as "top," "bottom," "upper," "lower," and the like to describe one element or component's relationship to another element(s) or component(s) as illustrated in the figures of the embodiments. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or components described as "below" or "beneath" other elements or components would then be oriented "above" or "over" the other elements or components.

Furthermore, it should be understood that the use of the term "substantially" herein should be understood to indicate an amount of ±10%, unless otherwise defined with respect to a particular context, with respect to a numerical quantity or other quantifiable relationship (e.g., perpendicularity or parallelism). Thus, for example, the substantially parallel lines may be at an angle between 162-198 to each other. In further examples, a dimension of approximately between 1 mm-3 mm may be in the range from 0.9mm to 3.3mm, for example.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

In the semiconductor manufacturing process, the process procedures of cleaning, oxidizing, gluing, baking, exposing and the like are required to be carried out on the element to be processed. In the process of the photoresist coating process, the photoresist coating chamber of the semiconductor processing equipment needs to be continuously exhausted, so photoresist liquid thrown out during spin coating of the element to be processed is easy to volatilize, and residues on the inner wall of the photoresist coating chamber are formed. Therefore, the photoresist residue is removed by cleaning the photoresist chamber.

In the related art, the gluing device is usually controlled periodically in an idle state, and the automatic cleaning of the gluing chamber is achieved by rotating a carrying table for carrying the element to be processed, so as to throw the cleaning solution into the gluing chamber. However, the inner wall of the glue coating chamber cannot be sufficiently cleaned by adopting the automatic cleaning process, and the cleaning effect is poor.

In order to solve the above-mentioned problems, some embodiments of the present application provide a cleaning assembly for cleaning semiconductor processing equipment. The semiconductor processing equipment is used for cleaning, oxidizing, gluing, baking, exposing and other technological processes of elements to be processed (such as wafers, chips and the like), such as gluing equipment of a spin coater and the like.

Fig. 1 is a schematic view of a semiconductor processing apparatus 10 with a cleaning assembly 20 mounted thereon according to some embodiments of the present application, and fig. 2 is a schematic view of a longitudinal section of the semiconductor processing apparatus 10 with the cleaning assembly 20 mounted thereon in fig. 1. In some embodiments, as shown in fig. 1-2, a semiconductor processing apparatus 10 generally includes a carrier 11, a first housing 12, and a second housing 13. Wherein the second housing 13 is covered on the first housing 12. The first housing 12 and the second housing 13 are disposed at a distance from each other to form a housing chamber 100. The susceptor 11 is accommodated in the accommodating chamber 100. When the semiconductor processing apparatus 10 is used to perform a semiconductor processing (e.g., spin coating), the device to be processed is carried on the carrier 11, and a corresponding semiconductor processing (e.g., spin coating) is performed in the accommodating chamber 100. The first housing 12 may also be referred to as an "inner housing," "inner chamber," or the like. The second housing 13 may also be referred to as an "outer housing", "outer chamber", etc. The carrier 11 may be an electrostatic chuck or the like.

In some embodiments, a receiving cavity 100 is formed between the first housing 12 and the second housing 13. A first opening 120 is opened at the top of the first housing 12. A second opening 130 corresponding to the first opening 120 is opened at the top of the second housing 13. The receiving chamber 100 communicates with the first opening 120 and the second opening 130, respectively. The carrying platform 11 is used for carrying a component to be processed, one side of the carrying platform 11 is accommodated in the accommodating cavity 100, and the other side of the carrying platform 11 can extend into the first housing 12 through the first opening 120 and partially extend out of the first housing 12. When the semiconductor processing apparatus 10 is used for performing semiconductor processing, the device to be processed can be carried on the carrying table 11 through the second opening 130 and accommodated in the accommodating cavity 100.

In some embodiments, the first opening 120 is located at a central portion of the top of the first housing 12, the second opening 130 is located at a central portion of the top of the second housing 13, and the carrier 11 is correspondingly disposed at a central portion of the accommodating cavity 100, so that the device to be processed is located at a central portion of the accommodating cavity 100 when being carried on the carrier 11 during the semiconductor manufacturing process. In some embodiments, when the semiconductor processing apparatus 10 is used for the coating process, the coating residues adhere to the chamber walls of the accommodating chamber 100, i.e., the inner wall of the second housing 13 and the outer wall of the first housing 12 due to the rotation of the carrier 11.

Fig. 3 is a schematic view of the cleaning assembly 20 of fig. 1, and fig. 4 is an exploded schematic view of the cleaning assembly 20 of fig. 2. As shown in fig. 2-4, in some embodiments, the cleaning assembly 20 generally includes a rotating shaft 21 and a turntable 22. The turntable 22 is fixed to the rotation shaft 21. The turntable 22 is provided with a drainage groove 221. The drainage channel 221 extends from the upper edge of the turntable 22 to the lower edge of the turntable 22. A liquid spraying hole 222 which is correspondingly communicated with the drainage groove 221 is arranged at the lower edge of the rotary disc 22.

In the embodiment shown in fig. 3-4, the number of the drainage grooves 221 is plural, and the plurality of the drainage grooves 221 are arranged at intervals, for example, at equal intervals, along the circumferential direction of the turntable 22; correspondingly, the number of the liquid spraying holes 222 is also plural, and the liquid spraying holes 222 are communicated with the drainage grooves 221 in a one-to-one correspondence. Of course, in other embodiments, the number of the drainage channels 221 may be one, and the number of the liquid spraying holes 222 may be one. The number of the drainage grooves 221 and the liquid ejection holes 222 is not particularly limited herein.

In some embodiments, the cleaning assembly 20 is configured to deliver a cleaning solution for cleaning the gumming residues to the receiving cavity 100. The cleaning solution is, for example, photoresist corner cleaning agent (EBR, edge bead remover) or the like.

It is understood that the cleaning assembly 20 does not participate in semiconductor processing (e.g., spin coating, etc.). In some embodiments, the cleaning assembly 20 may be located outside of the receiving cavity 100. When the semiconductor processing apparatus 10 needs to be cleaned, after the semiconductor processing process of the to-be-processed device is finished, the to-be-processed device can be taken out from the semiconductor processing apparatus 10, that is, the to-be-processed device is taken out from the carrying table 11 from the second opening 130, and then the cleaning component 20 is extended into the accommodating cavity 100 from the second opening 130, and the cleaning component 20 is located at the top of the first housing 12. At this time, the cleaning assembly 20 is accommodated in the accommodating chamber 100 of the semiconductor processing apparatus 10, and the liquid spraying hole 222 is communicated with the accommodating chamber 100. The rotating shaft 21 can rotate and drives the turntable 22 to rotate along the rotating shaft 21, and the cleaning solution flows through the drainage grooves 221 on the turntable 22 and is sprayed out from the liquid spraying holes 222 so as to convey the cleaning solution into the accommodating cavity 100 and clean the accommodating cavity 100. Of course, in other embodiments, the cleaning assembly 20 may be disposed at other locations within the receiving chamber 100, so long as it does not interfere with the semiconductor manufacturing process of the device to be processed.

In some embodiments, the cleaning assembly 20 is partially received in the receiving chamber 100, and the top of the cleaning assembly 20 may be exposed from the second opening 130 to the semiconductor processing apparatus 10.

In some embodiments of the present application, since the cleaning assembly 20 includes the rotating shaft 21 and the turntable 22 fixed on the rotating shaft 21, the rotating shaft 21 can rotate the turntable 22. The turntable 22 is provided with a drainage groove 221 extending from the upper edge of the turntable 22 to the lower edge of the turntable 22, and the lower edge of the turntable 22 is provided with a liquid spraying hole 222 correspondingly communicated with the drainage groove 221. The cleaning assembly 20 is configured to deliver a cleaning solution for cleaning the photoresist residue to the receiving chamber 100 of the semiconductor processing apparatus 10. The first housing 12 and the second housing 13 of the semiconductor processing apparatus 10 are disposed at intervals to form a housing cavity 100, when the cleaning assembly 20 is used for cleaning the semiconductor processing apparatus 10, the cleaning assembly 20 is housed in the housing cavity 100, and the rotating shaft 21 rotates to drive the turntable 22 to rotate along the rotating shaft 21, so that the cleaning solution can flow through the drainage groove 221 and be sprayed out of the liquid spraying hole 222 into the housing cavity 100. At this time, the glue residue can be dissolved and liquefied by the cleaning solution, so as to reduce the probability of excessive drying and viscosity of the glue residue caused by exhaust, reduce the glue residue attached to the inner wall of the accommodating cavity 100, improve the cleaning effect, reduce the replacement frequency of the first shell 12 and/or the second shell 13, and prolong the service lives of the first shell 12 and the second shell 13. In addition, because the turntable 22 can rotate along the rotating shaft 21, the cleaning solution can be uniformly sprayed into the accommodating cavity 100 along the circumferential direction 360 degrees of the turntable 22, so that the cleaning area can be increased, the glue coating residues in the accommodating cavity 100 are greatly reduced, the accommodating cavity 100 is more fully and comprehensively cleaned, and the cleaning effect is improved. Wherein, the "upper edge" may be an edge of the turntable 22 away from the end of the carrying table 11, that is, an edge of the turntable 22 adjacent to the end of the second opening 130; the "lower edge" may be an edge of the turntable 22 near an end of the carrying table 11, i.e. an edge of the turntable 22 away from an end of the second opening 130.

When the cleaning assembly 20 is installed in the receiving chamber 100, the turntable 22 has a lower surface adjacent the first housing 12 and an upper surface disposed opposite the lower surface. Referring to fig. 4, in some embodiments, the drain channel 221 is open on the upper surface 220 of the turntable 22. The upper surface 220 of the turntable is convex, and the upper edge of the turntable 22 is located at a higher position relative to a horizontal plane than the lower edge of the turntable 22 is located at the same horizontal plane, so that the radial direction of the upper surface 220 is inclined relative to the horizontal plane. Wherein "horizontal plane" may be a plane defined by the bearing surface of the bearing table 11.

In some embodiments, the radial direction of the upper surface 220 is inclined at an angle of approximately 1 ° to 40 °, such as 1 °,5 °,10 °,15 °, 20 °, 25 °, 30 °, 35 °, 40 °, etc., relative to the horizontal plane. In some embodiments, the radial direction of the upper surface 220 is inclined at an angle of 1 ° to 20 °,5 ° to 30 °, or 10 ° to 20 ° relative to the horizontal. The angle of inclination of the upper surface 220 with respect to the horizontal may be specifically selected and adjusted as desired to accommodate different semiconductor processing apparatuses 10 and different cleaning requirements. For example, the inclination angle of the radial direction of the upper surface 220 with respect to the horizontal plane may be determined according to the shape, size, etc. of the first housing 12/second housing 13/receiving chamber 100 of the different semiconductor processing apparatuses 10. The inclination angle of the radial direction of the upper surface 220 with respect to the horizontal plane is not particularly limited herein.

When the cleaning assembly 20 is accommodated in the accommodating cavity 100, the radial direction of the upper surface 220 is inclined with respect to the horizontal plane, i.e. the distance between the upper edge of the turntable 22 and the carrying table 11 is greater than the distance between the lower edge of the turntable 22 and the carrying table 11, and the cleaning solution can be more conveniently and rapidly sprayed from the liquid spraying hole 222 along the drainage groove 221.

In some embodiments, the drain channel 221 extending from the upper edge to the lower edge of the turntable 22 may be arcuate. In other words, the drainage channel 221 may be arcuate in shape on the upper surface 220. In some embodiments, the direction of the arc of the upper surface 220 of the drainage channel 221 may be the same as the direction of rotation of the turntable 22. For example, the drain grooves 221 may be arc-shaped in a clockwise direction, and the turntable 22 may be rotated clockwise along the rotation shaft 21 when the semiconductor processing apparatus 10 needs to be cleaned; for another example, the drain grooves 221 may be arc-shaped in a counterclockwise direction, and the turntable 22 may be rotated clockwise along the rotation shaft 21 when the semiconductor processing apparatus 10 needs to be cleaned. By the arc arrangement of the drainage grooves 221, the ejection angle of the cleaning solution can be adjusted, so that the accommodating cavity 100 can be cleaned more fully. Through the cooperation between the pitch arc setting of drainage slot 221 and the direction of rotation of carousel 22, can effectively reduce the energy loss that produces when the cleaning solution flows in drainage slot 221, increase the blowout speed of cleaning solution, improve the cleaning effect.

In some embodiments, the lower edge of the turntable 22 is provided with a warp 223 that warps upward relative to the horizontal. The liquid ejecting holes 222 are respectively located at the warping portions 223. Here, "upwardly warp" means that the warp portion 223 extends from the lower edge of the disk 22 in a direction adjacent to the second opening 130 or in a direction adjacent to the top wall of the second housing 13. By providing the warping portion 223, the cleaning solution is ejected upward along the warping portion 223, so that the top wall of the second housing 13 is cleaned conveniently, and the cleaning area is increased.

In some embodiments, the second housing 13 has a top wall adjacent the upper surface 220 of the turntable 22, and the warping 223 is disposed such that the liquid spray aperture 222 faces the top wall of the second housing 13. In some embodiments, the warpage angle of the warpage portion 223 is approximately 1 ° to 40 °, such as 1 °,3 °,5 °,7 °,9 °,10 °,13 °,15 °,18 °,20 °,23 °,25 °,28 °,30 °,33 °,35 °, 38 °,40 °, and the like, relative to a horizontal plane. In some embodiments, the warpage angle of the warpage 223 with respect to the horizontal plane is 1 ° to 20 °,3 ° to 10 °, or 5 ° to 15 °. The warpage angle of the warpage portion 223 with respect to the horizontal plane may be specifically selected and adjusted as needed to accommodate different semiconductor processing apparatuses 10 and different cleaning requirements.

In some embodiments, the top wall of the second housing 13 is inclined with respect to the horizontal plane, and the angle of the warpage of the turntable 22 with respect to the horizontal plane is adapted to the angle of inclination of the top wall of the second housing 13 with respect to the horizontal plane. That is, the warpage angle of the warpage portion of the turntable 22 with respect to the horizontal plane may be specifically selected and adjusted according to the inclination angle of the top wall of the second housing 13 with respect to the horizontal plane to accommodate different semiconductor processing apparatuses 10.

In some embodiments, the top wall of the second housing 13 is inclined at an angle of approximately 1 ° to 40 °, such as 1 °, 5 °, 10 °,15 °, 20 °, 25 °, 30 °, 35 °, 38 °, 40 °, etc., with respect to the horizontal plane. In some embodiments, the top wall of the second housing 13 is inclined at an angle of 1 ° to 20 °, 5 ° to 30 °, or 10 ° to 20 ° with respect to the horizontal plane.

In some embodiments, the direction of inclination of the top wall of the second housing 13 with respect to the horizontal may intersect the direction of inclination of the upper surface 220 of the turntable 22 with respect to the horizontal to increase the cleaning area of the top wall of the second housing 13.

In the related art, both the inclination angle of the top wall of the second housing 13 and the type of photoresist used in the photoresist coating process have an effect on the adhesion position and residual thickness of the photoresist coating residue. Therefore, in some embodiments of the present application, the ejection angle, the ejection speed, etc. of the cleaning solution may be set according to the inclination angle of the top wall of the second housing 13 and the type of the photoresist used in the different semiconductor processing apparatuses 10, so as to be able to sufficiently clean the photoresist residue.

For example, in some embodiments, the warping angle of the warping portion 223 may be adjusted according to the tilting angle of the top wall of the second housing 13, that is, the spraying angle of the cleaning solution may be adjusted according to the required flushing angle of the second housing 13, so that the sprayed cleaning solution can consider the top wall of the second housing 13 to achieve a better cleaning effect. In some embodiments, when the warping angle of the warping portion 223 with respect to the horizontal plane is 1 ° to 20 °, the inclination angle of the top wall of the second housing 13 with respect to the horizontal plane may be set to be 5 ° to 30 °. In this case, the cleaning assembly 20 can clean the top wall of the second housing 13 over a larger area, and thus, the second housing 13 can be cleaned more sufficiently.

In some embodiments, the ejection angle of the wash solution and/or the ejection speed of the wash solution may be adjusted by adjusting the aperture size of the spray apertures 222. The aperture of the liquid spraying hole 222 may be approximately 0.5mm to 5mm,0.5mm, 0.8mm, 1mm, 1.2mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, 5mm, etc. In some embodiments, the aperture of the spray orifice 222 may be 1mm to 1.5mm, or 2mm to 4mm.

In some embodiments, the ejection angle and ejection speed of the cleaning solution may also be adjusted by adjusting the groove depth of the drainage groove 221, adjusting the arc of the drainage groove 221, adjusting the type of cleaning solution, adjusting the rotational speed of the rotating shaft 21, adjusting the position of the cleaning assembly 20 within the housing cavity 100 (e.g., a position along a direction parallel to the rotating shaft 21), and the like.

Referring to fig. 2-4, in some embodiments, the cleaning assembly 20 further includes an upper cover 23 that covers the turntable 22. The upper cover 23 is provided with a solvent pipe 231 in the circumferential direction. The upper end surface 235 of the upper cover 23 is provided with a liquid inlet 232. The inlet 232 is adapted to communicate with an infusion line (not shown) for introducing a cleaning solution. The lower end surface 233 of the upper cover 23 is provided with a liquid outlet 234. The liquid outlets 234 are correspondingly communicated with the corresponding drainage grooves 221. The cleaning solution is respectively injected into the corresponding drainage groove 221 through the solvent pipeline 231 and the liquid outlet 234. In some embodiments, the number of liquid outlets 234 is the same as the number of drainage channels 221, and the liquid outlets 234 are in one-to-one communication with the drainage channels 221. By providing the upper cover 23, the cleaning solution can be effectively prevented from being sputtered from the second opening 130 to the outside of the semiconductor processing apparatus 10.

In some embodiments, the solvent pipe 231 is disposed on a side of the upper cover 23 facing the turntable 22, and the liquid inlet 232, the solvent pipe 231, and the liquid outlet 234 are sequentially connected. When the cleaning assembly 20 is used to clean the semiconductor processing apparatus 10, the cleaning solution may be delivered from the fluid delivery line to the solvent line 231 and into the receiving chamber 100 through the drainage channel 221 in communication with both the solvent line 231 and the receiving chamber 100 to mix with the glue residue in the receiving chamber 100 to clean the receiving chamber 100.

In some embodiments, the solvent pipe 231 may be a channel structure integrally formed with the upper cover 23 through an injection molding process or the like, and the solvent pipe 231 may be a structure formed on the upper cover 23 through a welding process or the like, which is not particularly limited herein.

In some embodiments, cleaning assembly 20 further includes a pressing element (not shown). The pressurizing member is in communication with the solvent pipe 231 for pressurizing the solvent pipe 231 so that the cleaning solution is sprayed into the receiving chamber 100 from the spray hole 222 at a certain speed. In some embodiments, the cleaning assembly 20 may apply nitrogen, argon, etc. to the solvent conduit 231 via a pressurizing element such that the cleaning solution is delivered to the solvent conduit 231 at a flow rate of approximately 600ml/s-800 ml/s. In some embodiments, the flow rate of the cleaning solution may be 650ml/s, 700ml/s, 750ml/s, etc., and may be set according to different needs.

In some embodiments, the rotation shaft 21 is connected to a rotation driving device (not shown). The rotation driving device is used for driving the rotation shaft 21 to rotate, and then driving the turntable 22 to rotate. In some embodiments, the rotation speed of the rotating shaft 21 can be adjusted by the rotation driving device, so as to control the rotation speed of the turntable 22, and thus adjust the spraying angle and the spraying speed of the cleaning solution. In some embodiments, the rotational drive may be located external to the semiconductor processing apparatus 10. The center of the upper cover 23 is provided with a through hole 230, and the rotation shaft 21 passes through the through hole 230 to be connected with the rotation driving means.

In some embodiments, the cleaning assembly 20 may be further coupled to a translational drive device (not shown) for driving the cleaning assembly 20 to reciprocate generally in a direction parallel to the axis of rotation 21. In some embodiments, the distance of movement of the cleaning assembly 20 relative to the stage 11 may be approximately 0cm to 4cm, for example, 0.5cm, 1cm, 1.5cm, 2cm, 2.5cm, 3cm, 3.5cm, 4cm, etc. In some embodiments, the distance of movement of the cleaning element 20 relative to the stage 11 may be 0cm to 3.5cm. The translation driving device drives the cleaning assembly 20 to integrally reciprocate along the direction of the parallel rotating shaft 21, so that the cleaning range can be effectively enlarged, and the cleaning is more comprehensive.

In some embodiments, referring to fig. 2-4, the cleaning assembly 20 further includes a mating portion 25 disposed about the periphery of the rotating shaft 21. The matching part 25 is fixedly arranged on the upper cover 23 and is arranged at intervals with the rotating shaft 21 for being in transmission connection with the translation driving device. In some embodiments, the translation driving device may be located outside the semiconductor processing apparatus 10. The fitting portion 25 partially penetrates the through hole 230 to be connected with the translational driving device.

In some embodiments, the radial direction of the upper cover 23 is inclined with respect to the horizontal plane. The inclination angle of the radial direction of the upper cover 23 relative to the horizontal plane is matched with the inclination angle of the radial direction of the turntable 22 relative to the horizontal plane, so that the probability that the cleaning solution is separated from the drainage groove 221 in the rotating process of the turntable 22 can be effectively reduced, the energy loss of the cleaning solution between the upper cover 23 and the turntable 22 is reduced, and the cleaning solution can be ejected from the liquid spraying holes 222 at a higher speed and more intensively. In the present application, the inclination angle "matches" means that the inclination angles of the two elements are the same or substantially the same.

Referring to fig. 3 and 4, in some embodiments, the cleaning assembly 20 further includes a shoe 24 mounted to the upper cover 23. An accommodating space 240 is formed between the base 24 and the upper cover 23, and the turntable 22 is accommodated in the accommodating space 240 and is rotatable in the accommodating space 240 by the driving of the rotation shaft 21.

In some embodiments, the upper cover 23 and the shoe 24 are fixed relative to each other, and both the upper cover 23 and the shoe 24 are fixed during rotation of the turntable 22 driven by the rotation shaft 21. The bottom bracket 24 is fixedly installed with the upper cover 23 to accommodate the turntable 22 in the accommodating space 240, and a gap exists between the bottom bracket 24 and the upper cover 23, so that the cleaning solution sprayed from the spray hole 222 can be conveniently sprayed from the gap into the accommodating chamber 100. Wherein the radial direction of the shoe 24 may be inclined with respect to the horizontal plane, and the inclination angle of the radial direction of the shoe 24 with respect to the horizontal plane matches the inclination angle of the radial direction of the turntable 22 with respect to the horizontal plane.

Referring to fig. 4, in some embodiments, a first fixing element 236 is provided at an edge of the upper cover 23, and a second fixing element 241, which mates with the first fixing element 236, is provided at an edge of the shoe 24. The upper cover 23 is fixedly mounted to the shoe 24 by the cooperation of the first fixing member 236 and the second fixing member 241. Wherein the first fixing element 236 is one of a fixing post or a fixing hole, and the second fixing element 241 is the other of a fixing post or a fixing hole. The fixing hole may be a through hole or a blind hole, so long as the fixing hole is matched with the fixing column to fix the upper cover 23 and the bottom bracket 24 to each other.

For example, the first fixing element 236 may be a fixing post, and the second fixing element 241 may be a fixing hole; for another example, the first fixing member 236 may be a fixing hole, and the second fixing member 241 may be a fixing post. In some embodiments, the fixing hole may be a light hole, and the fixing post may pass through the fixing hole and be fixed in the fixing hole by a fixing piece such as a bolt. In some embodiments, the fixing hole may be a threaded hole, and the fixing column and the fixing hole may be fixed through threaded connection. The connection and matching relation between the fixing column and the fixing hole is not particularly limited.

The above is given as an example of a cleaning assembly 20 comprising a shoe 24. Of course, in other embodiments, the cleaning assembly 20 itself may not include a shoe, and the housing of the semiconductor processing apparatus 10 may be used as the shoe of the cleaning assembly 20. Fig. 5 is a schematic view of a cleaning assembly 20 according to some embodiments of the present application, fig. 6 is a schematic view of a semiconductor processing apparatus 10 to which the cleaning assembly 20 shown in fig. 5 is applied, and fig. 7 is a schematic view of a longitudinal section of the semiconductor processing apparatus 10 of fig. 6 on which the cleaning assembly 20 is mounted. In some embodiments, referring to fig. 5-7, the first housing 12 of the semiconductor processing apparatus 10 serves as a shoe for the cleaning assembly 20. At the lower edge of the turntable 22, a third fixing element 224 is provided, and a fourth fixing element 121 is provided in the circumferential direction of the first housing 12. The turntable 22 is mounted and fixed on the first housing 12 by the third fixing member 224 and the fourth fixing member 121, and the first housing 12 rotates with the rotation of the turntable 22. The third fixing element 224 is one of a fixing post or a fixing hole, and the fourth fixing element 121 is the other of a fixing post or a fixing hole. The fixing hole may be a through hole or a blind hole, so long as the fixing hole cooperates with the fixing post to fix the turntable 22 and the first housing 12 to each other.

Referring to the embodiment of fig. 5-7, when the cleaning assembly 20 is used to clean the semiconductor processing apparatus 10, the turntable 22 may be mounted and fixed with the first housing 12, such that the turntable 22 may rotate with the first housing 12, but the upper cover 23 remains stationary. The turntable 22 drives the first shell 12 to rotate, so that the cleaning assembly 20 can clean the outer wall of the first shell 12 more fully and comprehensively, and the cleaning effect is better.

Referring to fig. 2 and 7, in some embodiments, the cleaning assembly 20 further includes a detection assembly 14. The detecting assembly 14 is disposed on the first housing 12 and/or the second housing 13 for detecting a contamination level of the semiconductor processing apparatus 10. The detection assembly 14 is used for detecting the dirt degree of the semiconductor processing equipment 10, and the cleaning assembly 20 is called for cleaning the accommodating cavity 100 according to the detected dirt degree, so that the semiconductor processing equipment 10 can be cleaned more timely and actively.

In some embodiments, an exhaust passage 122 is disposed on a side of the first housing 12 away from the second housing 13, and the detecting component 14 is disposed in the exhaust passage 122 for detecting an air flow of the exhaust passage 122 to detect a contamination level of the semiconductor processing apparatus 10.

The detecting component 14 may be a pressure sensor or a gas flow sensor, and the detecting component 14 is configured to detect a gas flow or a gas flow pressure of the exhaust passage 122. As the glue residue in the receiving chamber 100 increases, the air flow (e.g., air flow rate or air flow pressure) exiting the air exhaust passage 122 changes. The detection of the air flow through the exhaust channel 122 by the detection component 14 can obtain the detection result of the contamination degree of the semiconductor processing apparatus 10, and the cleaning component 20 is invoked to clean the accommodating cavity 100 according to the detection result, so as to realize more timely "active" cleaning.

In some embodiments, the detection assembly 14 may also detect the thickness of the glue residue attached to the first housing 12 and/or the second housing 13 to detect the contamination level of the semiconductor processing apparatus 10. Wherein the detection component 14 may be, for example, a laser sensor.

In order to solve the above-mentioned problems, some embodiments of the present application further provide a cleaning method applied to the semiconductor processing apparatus 10. FIG. 8 is a flow chart of a cleaning method according to some embodiments of the application. The cleaning method comprises the following steps.

Step S102, the element to be processed is taken out from the accommodating cavity.

In some embodiments, when the semiconductor processing apparatus 10 is used for performing a semiconductor process, the device to be processed may be carried on the carrying platform 11 through the second opening 130 and be accommodated in the accommodating cavity 100. When the semiconductor processing apparatus 10 is required to be cleaned, the device to be processed may be taken out of the housing chamber 100 after the semiconductor processing process of the device to be processed is completed.

Step S104, the cleaning component is placed in the accommodating cavity, and the cleaning component is started to clean the semiconductor processing equipment.

In some embodiments, the cleaning assembly 20 is extended into the receiving cavity 100 from the second opening 130 such that the cleaning assembly 20 is positioned on top of the first housing 12. The cleaning assembly 20 is activated to clean the semiconductor processing apparatus 10. It will be appreciated that activating the cleaning assembly 20 to clean the semiconductor processing apparatus 10 includes: injecting a cleaning solution into the solvent pipe 231 through the infusion pipe; the rotation shaft 21 is driven to rotate by the rotation driving means and/or the cleaning assembly 20 is driven to reciprocate in a direction parallel to the rotation shaft 21 as a whole by the translation driving means. The injection of the cleaning solution and the reciprocation of the adjustment cleaning assembly 20 along the direction parallel to the rotation axis 21 may be performed simultaneously, or the injection of the cleaning solution may be performed before the reciprocation of the adjustment cleaning assembly 20 along the direction parallel to the rotation axis 21.

In some embodiments, the cleaning method further comprises: after the cleaning of the semiconductor processing equipment is completed, the cleaning assembly is taken out.

After the cleaning member 20 completes cleaning the semiconductor processing apparatus 10, the cleaning member 20 is taken out of the semiconductor processing apparatus 10. In some embodiments, the preset time period may be set. After the cleaning assembly 20 is started, the start time is recorded, and the difference between the current time and the start time is calculated as the cleaning duration. When the cleaning time reaches the preset time, the cleaning of the semiconductor processing apparatus 10 is completed. The preset time period can be specifically selected and adjusted according to the needs to adapt to different semiconductor processing equipment 10 and different cleaning requirements.

Of course, in other embodiments, after the cleaning of the semiconductor processing apparatus is completed, the cleaning element may be retained in the accommodating cavity 100 and not removed, for example, may be moved to other suitable positions, so long as the subsequent semiconductor processing process is not affected.

In some embodiments, the cleaning method further comprises: the method comprises the steps of monitoring a real-time pressure value of an exhaust channel of semiconductor processing equipment, and adjusting a preset time interval based on the real-time pressure value. The preset time interval is a time interval for calling the cleaning component to clean the semiconductor processing equipment.

The semiconductor processing apparatus 10 is preset with a preset time interval, and the cleaning assembly 20 is invoked to clean the accommodating chamber 100 according to the preset time interval. Wherein invoking the cleaning assembly 20 to clean the semiconductor processing apparatus 10 may comprise the steps described above. The preset time interval may be 12 hours, 24 hours, etc., and the present application is not particularly limited herein.

As the glue residue in the receiving chamber 100 increases, the pressure of the gas discharged from the gas discharge passage 122 increases. Thus, the gas pressure of the exhaust passage 122 may be monitored. The exhaust passage 122 of the semiconductor processing apparatus 10 may be provided therein with a detection assembly 14, and the detection assembly 14 may include a pressure sensor, and the pressure sensor may monitor the gas pressure of the exhaust passage 122 in real time to obtain a real-time pressure value. The pressure sensor can detect a pressure value every 1 second, 1.5 seconds, 2 seconds or 3 seconds to obtain a real-time pressure value, and the interval time can be specifically selected and adjusted according to the needs to adapt to different semiconductor processing devices 10 and different cleaning requirements, and the application is not limited herein.

In some embodiments, the detection component 14 may determine whether the real-time pressure value exceeds a preset pressure value, and shorten the preset time interval in response to the real-time pressure value exceeding the preset pressure value. The preset pressure value may be specifically selected and adjusted as required to adapt to different semiconductor processing apparatuses 10 and different cleaning requirements, and the present application is not limited herein. In some embodiments, the detection component 14 may calculate a rate of pressure change, i.e., a pressure increase slope, of the real-time pressure value over a preset period of time. Judging whether the pressure increasing slope exceeds a preset slope, and shortening a preset time interval in response to the pressure increasing slope exceeding the preset slope. Wherein, the preset time period and the preset slope can be specifically selected and adjusted according to the needs to adapt to different semiconductor processing devices 10 and different cleaning requirements, and the application is not limited herein.

Shortening the preset time interval may be, for example, adjusting the preset time interval of the original 12 hours or 24 hours to 8 hours, 6 hours or 4 hours, which is not particularly limited herein.

In some embodiments, the detection component 14 may determine whether the real-time pressure value exceeds the preset pressure value once per preset time interval, or calculate and determine a pressure increase slope once per preset time interval. The preset duration may be, for example, 1 second, 30 seconds, 1 minute, 30 minutes, 1 hour, etc., which is not particularly limited herein.

The cleaning method provided by some embodiments of the present application monitors the pressure value of the exhaust channel 122 in real time, so that the contamination degree of the accommodating cavity 100 can be monitored in real time, and the preset time interval is adjusted according to the contamination degree, so as to increase the frequency of cleaning the semiconductor processing equipment 10, realize more timely "active" cleaning, enable the semiconductor processing equipment 10 to better maintain in a high-efficiency and high-quality working state, reduce the replacement frequency of the first shell 12 and/or the second shell 13, and prolong the service life of the semiconductor processing equipment 10, especially the service life of the first shell 12 and/or the second shell 13.

The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application or directly or indirectly applied to other related technical fields are included in the scope of the present application.

Claims

1. The cleaning assembly is used for cleaning semiconductor processing equipment and is characterized by comprising a bearing table, a first shell and a second shell, wherein the second shell is covered on the first shell, the first shell and the second shell are arranged at intervals to form a containing cavity, and the bearing table is contained in the containing cavity; the cleaning assembly includes:

a rotation shaft; and

The rotary table is fixed on the rotary shaft, wherein a drainage groove is formed in the rotary table, the drainage groove extends from the upper edge of the rotary table to the lower edge of the rotary table, and a liquid spraying hole which is correspondingly communicated with the drainage groove is formed in the lower edge of the rotary table;

when the cleaning component is used for cleaning the semiconductor processing equipment, the cleaning component is contained in a containing cavity of the semiconductor processing equipment, the rotary table rotates along the rotating shaft, and cleaning solution flows through the drainage grooves on the rotary table and is sprayed out from the liquid spraying hole so as to clean the containing cavity.

2. The cleaning assembly of claim 1, wherein the cleaning assembly comprises a cleaning assembly,

The drainage groove is formed in the upper surface of the rotary disc;

The upper surface of the turntable is convex, and the position of the upper edge of the turntable relative to a horizontal plane is higher than the position of the lower edge of the turntable relative to the same horizontal plane, so that the radial direction of the upper surface is inclined relative to the horizontal plane.

3. The cleaning assembly of claim 2, wherein the cleaning assembly comprises a cleaning assembly,

The lower edge of the turntable is provided with a warping part which warps upwards relative to a horizontal plane, and the liquid spraying hole is positioned on the warping part.

4. A cleaning assembly according to claim 3, wherein the warp has a warp angle of 1 ° to 40 ° relative to the horizontal; and/or

The inclination angle of the radial direction of the upper surface relative to the horizontal plane is 1-40 degrees.

5. The cleaning assembly of claim 2, wherein the cleaning assembly comprises a cleaning assembly,

The drainage channel extending from the upper edge to the lower edge of the turntable is arc-shaped.

6. The cleaning assembly of claim 1, further comprising:

the upper cover is covered on the turntable;

The upper cover is provided with a solvent pipeline in the circumferential direction, the upper end face of the upper cover is provided with a liquid inlet, the lower end face of the upper cover is provided with a liquid outlet, the liquid outlet is communicated with the corresponding drainage groove, the liquid inlet is used for being communicated with a liquid delivery pipeline to introduce cleaning solution, and the cleaning solution is respectively injected into the corresponding drainage groove through the solvent pipeline and the liquid outlet.

7. The cleaning assembly of claim 6, wherein the cleaning assembly comprises a cleaning assembly,

The radial direction of the upper cover is inclined relative to the horizontal plane;

The inclination angle of the radial direction of the upper cover relative to the horizontal plane is matched with the inclination angle of the radial direction of the turntable relative to the horizontal plane.

8. The cleaning assembly of claim 6, further comprising:

a bottom support arranged on the upper cover, an accommodating space is formed between the bottom support and the upper cover, the turntable is accommodated in the accommodating space and is rotatable in the accommodating space under the drive of the rotating shaft.

9. The cleaning assembly of claim 1, further comprising a detection assembly disposed on the first housing and/or the second housing for detecting a contamination level of the semiconductor processing apparatus.

10. The cleaning assembly of claim 9, wherein the first housing is provided with an exhaust passage, and the detection assembly is disposed within the exhaust passage for detecting an air flow of the exhaust passage to detect a contamination level of the semiconductor processing apparatus.

11. A semiconductor processing apparatus, comprising:

A first housing;

The second shell is covered on the first shell and is arranged at intervals with the first shell to form a containing cavity;

The bearing table is accommodated in the accommodating cavity; and

A cleaning assembly according to any one of claims 1 to 10.

12. A cleaning method applied to the semiconductor processing apparatus of claim 11, the cleaning method comprising:

taking out the element to be processed from the accommodating cavity; and

And placing the cleaning component into the accommodating cavity, and starting the cleaning component to clean the semiconductor processing equipment.

13. The method of cleaning according to claim 12, the cleaning method is characterized by further comprising the following steps:

And monitoring a real-time pressure value of an exhaust channel of the semiconductor processing equipment, and adjusting a preset time interval based on the real-time pressure value, wherein the preset time interval is a time interval for calling the cleaning component to clean the semiconductor processing equipment.