CN118491946A - Cleaning assembly, semiconductor manufacturing equipment and cleaning method - Google Patents

Abstract

The present application provides a cleaning component, a semiconductor process equipment and a cleaning method. The cleaning component is used to clean the semiconductor process equipment. The semiconductor process equipment includes a carrier, a first shell and a second shell. The second shell cover is arranged on the first shell, and the first shell and the second shell are arranged to form a receiving chamber. The carrier is received in the receiving chamber; the cleaning component includes a rotating shaft; and a turntable, which is fixed on the rotating shaft. A drainage groove is provided on the turntable. The drainage groove extends from the upper edge of the turntable to the lower edge. A spray hole corresponding to the drainage groove is provided at the lower edge of the turntable. When the cleaning component is used to clean the semiconductor process equipment, the cleaning component is received in the receiving chamber of the semiconductor process equipment, and the turntable rotates along the rotating shaft. The cleaning solution flows through the drainage groove on the turntable and is sprayed out from the spray hole to clean the receiving chamber. Through the above arrangement, the glue residue can be fully cleaned and the cleaning effect is improved.

Description

Cleaning component, semiconductor process equipment and cleaning method

Technical Field

The present application relates to the field of semiconductor manufacturing technology, and in particular to a cleaning component, semiconductor process equipment and a cleaning method.

Background Art

In the semiconductor manufacturing process, the components to be processed (such as wafers, chips, etc.) need to be cleaned, oxidized, coated, baked, exposed, and other processes. During the use of the process machine, the thrown-out photoresist liquid and other process materials are easy to adhere to the inner wall of the coating chamber. If they are not cleaned for a long time, the product yield will be affected.

In the related art, semiconductor process equipment is usually controlled to be in an idle state at regular intervals, and the automatic cleaning of the glue coating chamber is achieved by rotating the carrier for carrying the components to be processed to throw the cleaning solution to the inner wall of the glue coating chamber. However, this method cannot fully clean the inner wall of the glue coating chamber, and the cleaning effect is poor.

Summary of the invention

The present application provides a cleaning component, semiconductor process equipment and a cleaning method. The cleaning component is used to clean the semiconductor process equipment, which can alleviate the problem in the related art that the inner wall of the gluing chamber of the semiconductor process equipment cannot be fully cleaned, improve the cleaning effect, and thus improve the product yield.

To solve the above-mentioned technical problems, the present application provides, on the one hand, a cleaning component for cleaning semiconductor process equipment, wherein the semiconductor process equipment comprises a carrier, a first shell and a second shell, wherein the second shell cover is arranged on the first shell, and the first shell and the second shell are spaced apart to form a receiving chamber, wherein the carrier is received in the receiving chamber; the cleaning component comprises: a rotating shaft; and a turntable fixed on the rotating shaft, wherein a drainage groove is provided on the turntable, wherein the drainage groove extends from the upper edge of the turntable to the lower edge, and a spray hole corresponding to and connected to the drainage groove is provided at the lower edge of the turntable; when the cleaning component is used to clean the semiconductor process equipment, the cleaning component is received in the receiving chamber of the semiconductor process equipment, the turntable rotates along the rotating shaft, and the cleaning solution flows through the drainage groove on the turntable and is sprayed out from the spray hole to clean the receiving chamber.

In some embodiments, the drainage groove is opened on the upper surface of the turntable; the upper surface of the turntable is convex, and the position of the upper edge of the turntable relative to a horizontal plane is higher than the position of the lower edge of the turntable relative to the same horizontal plane, so that the radial direction of the upper surface is inclined relative to the horizontal plane.

In some embodiments, a lower edge of the turntable is provided with a warped portion that is warped upward relative to a horizontal plane, and the liquid spray hole is located at the warped portion.

In some embodiments, a warping angle of the warped portion relative to a horizontal plane is 1° to 40°, and an inclination angle of a top wall of the second shell relative to a horizontal plane is 1° to 40°.

In some embodiments, the drainage groove extending from the upper edge to the lower edge of the turntable is arc-shaped.

In some embodiments, the cleaning component further includes: an upper cover, which is disposed on the turntable; wherein a solvent pipeline is arranged in the circumferential direction of the upper cover, a liquid inlet is arranged on the upper end surface of the upper cover, and a liquid outlet is arranged on the lower end surface of the upper cover, the liquid outlet is connected to the corresponding drainage groove, the liquid inlet is used to connect to the infusion pipeline to introduce the cleaning solution, and the cleaning solution is respectively injected into the corresponding drainage groove through the solvent pipeline and the liquid outlet.

In some embodiments, the radial direction of the upper cover is inclined relative to a horizontal plane; the inclination angle of the radial direction of the upper cover relative to the horizontal plane matches the inclination angle of the radial direction of the turntable relative to the horizontal plane.

In some embodiments, the cleaning assembly further includes: a base support mounted on the upper cover, a receiving space being formed between the base support and the upper cover, the turntable being received in the receiving space and rotatable in the receiving space driven by the rotating shaft.

In some embodiments, the cleaning component further includes a detection component, which is disposed on the first shell and/or the second shell and is used to detect the degree of dirtiness of the semiconductor process equipment.

In some embodiments, the first shell is provided with an exhaust channel, and the detection component is disposed in the exhaust channel for detecting the airflow in the exhaust channel to detect the degree of dirtiness of the semiconductor process equipment.

In order to solve the above-mentioned technical problems, the second aspect of the present application also provides a semiconductor process equipment, including: a first shell; a second shell, which is covered on the first shell and is spaced apart from the first shell to form a receiving cavity; a supporting platform, which is received in the receiving cavity; and a cleaning component as described in the first aspect.

In order to solve the above-mentioned technical problems, the third aspect of the present application also provides a cleaning method, which is applied to the semiconductor process equipment described in the second aspect. The cleaning method includes: taking out the component to be processed from the receiving chamber; and placing the cleaning component into the receiving chamber, and starting the cleaning component to clean the semiconductor process equipment.

In some embodiments, the cleaning method further includes: monitoring the real-time pressure value of the exhaust channel of the semiconductor process equipment, and adjusting a preset time interval based on the real-time pressure value, wherein the preset time interval is the time interval for calling the cleaning component to clean the semiconductor process equipment.

The cleaning assembly provided in some embodiments of the present application includes a rotating shaft and a turntable fixed on the rotating shaft, and the rotating shaft can drive the turntable to rotate. A drainage groove extending from the upper edge of the turntable to the lower edge of the turntable is provided on the turntable, and a spray hole corresponding to the drainage groove is provided at the lower edge of the turntable. The cleaning assembly is configured to deliver a cleaning solution for cleaning glue residues to a receiving chamber of a semiconductor process device. The first shell and the second shell of the semiconductor process device are arranged at intervals to form a receiving chamber. When the cleaning assembly is used to clean the semiconductor process device, the cleaning assembly is received in the receiving chamber, and the rotating shaft is rotated to drive the turntable to rotate along the rotating shaft, so that the cleaning solution can flow through the drainage groove and spray out from the spray hole to increase the cleaning area, and the receiving chamber is cleaned more fully and comprehensively, thereby improving the cleaning effect, thereby reducing the replacement frequency of the first shell and/or the second shell, and extending the service life of the semiconductor process device, especially the service life of the first shell and/or the second shell.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings herein are incorporated into the specification and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and are used together with the specification to illustrate the technical solution of the present application.

FIG. 1 is a schematic diagram of a semiconductor process equipment equipped with a cleaning component in some embodiments of the present application;

FIG2 is a longitudinal cross-sectional schematic diagram of the semiconductor process equipment in FIG1 with a cleaning assembly installed;

FIG3 is a schematic diagram of the cleaning assembly in FIG1 ;

FIG4 is an exploded schematic diagram of the cleaning assembly in FIG1 ;

FIG5 is a schematic diagram of a cleaning assembly in some embodiments of the present application;

FIG6 is a schematic diagram of a semiconductor process equipment using the cleaning assembly shown in FIG5 in some embodiments of the present application;

FIG. 7 is a schematic longitudinal cross-sectional view of the semiconductor process equipment in FIG. 6 with a cleaning assembly installed therein; and

FIG. 8 is a flow chart of a cleaning method in some embodiments of the present application.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

The terms "first" and "second" in this application are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features.

In the description of the present application, “plurality” means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

For ease of description, some embodiments of the present application may use spatially relative terms such as "top", "bottom", "upper", "lower", etc. to describe the relationship between one element or component and another (or other) elements or components as shown in the various figures of the embodiments. It should be understood that in addition to the orientations described in the figures, the spatially relative terms are also intended to include different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements or components described as being "below" or "beneath" other elements or components will subsequently be positioned as being "above" or "on" the other elements or components.

In addition, it should be understood that unless otherwise limited with respect to a particular context, with respect to a numerical quantity or other quantifiable relationship (e.g., perpendicularity or parallelism), the use of the term "substantially" herein should be understood to indicate an amount of ±10%. Thus, for example, substantially parallel lines may be at an angle of between 162° and 198° to each other. In a further example, a dimension of approximately between 1 mm and 3 mm may, for example, be in the range of from 0.9 mm to 3.3 mm.

Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

In the semiconductor manufacturing process, the components to be processed need to be cleaned, oxidized, coated, baked, exposed, and other processes. In the coating process, since the coating chamber of the semiconductor process equipment needs to be continuously exhausted, the photoresist liquid thrown out when the components to be processed are spin-coated is easy to volatilize and remain on the inner wall of the coating chamber to form coating residues. Therefore, the coating chamber needs to be cleaned to remove the residual photoresist liquid.

In the related art, the glue coating equipment is usually controlled to be in an idle state at regular intervals, and the automatic cleaning of the glue coating chamber is achieved by rotating the carrier for carrying the component to be processed to throw the cleaning solution into the interior of the glue coating chamber. However, the inner wall of the glue coating chamber cannot be fully cleaned by the automatic cleaning process, and the cleaning effect is poor.

To solve the above technical problems, some embodiments of the present application provide a cleaning component for cleaning semiconductor process equipment. Semiconductor process equipment is used to perform processes such as cleaning, oxidation, coating, baking, and exposure on components to be processed (such as wafers, chips, etc.), such as coating equipment such as a coating developer.

FIG. 1 is a schematic diagram of a semiconductor process equipment 10 with a cleaning component 20 installed in some embodiments of the present application, and FIG. 2 is a longitudinal cross-sectional schematic diagram of the semiconductor process equipment 10 with a cleaning component 20 installed in FIG. 1 . In some embodiments, as shown in FIG. 1-FIG. 2, the semiconductor process equipment 10 generally includes a carrier 11, a first shell 12, and a second shell 13. Among them, the second shell 13 is covered on the first shell 12. The first shell 12 and the second shell 13 are arranged to form a receiving chamber 100. The carrier 11 is received in the receiving chamber 100. When the semiconductor process equipment 10 is used to perform a semiconductor process (such as glue coating), the component to be processed is carried on the carrier 11, and the corresponding semiconductor process (such as spin coating) is performed in the receiving chamber 100. Among them, the first shell 12 can also be called an "inner shell", "inner chamber", etc. The second shell 13 can also be called an "outer shell", "outer chamber", etc. The carrier 11 can be an electrostatic chuck, etc.

In some embodiments, a receiving chamber 100 is formed between the first shell 12 and the second shell 13. A first opening 120 is provided at the top of the first shell 12. A second opening 130 corresponding to the first opening 120 is provided at the top of the second shell 13. The receiving chamber 100 is communicated with the first opening 120 and the second opening 130, respectively. The carrier 11 is used to carry one side of the component to be processed and is received in the receiving chamber 100, and the other side of the carrier 11 can extend into the first shell 12 through the first opening 120 and partially extend out of the first shell 12. When the semiconductor process equipment 10 is used to perform a semiconductor process, the component to be processed can be carried on the carrier 11 through the second opening 130 and received in the receiving chamber 100.

In some embodiments, the first opening 120 is approximately located at the center of the top of the first shell 12, the second opening 130 is approximately located at the center of the top of the second shell 13, and the carrier 11 is correspondingly disposed at the center of the receiving chamber 100, so that during the semiconductor process, the component to be processed is approximately located at the center of the receiving chamber 100 when it is carried on the carrier 11. In some embodiments, when the semiconductor process equipment 10 is used for the glue coating process, glue residues will be attached to the cavity wall of the receiving chamber 100, that is, the inner wall of the second shell 13 and the outer wall of the first shell 12 due to the rotation of the carrier 11.

FIG. 3 is a schematic diagram of the cleaning assembly 20 in FIG. 1 , and FIG. 4 is an exploded schematic diagram of the cleaning assembly 20 in FIG. 2 . As shown in FIGS. 2-4 , in some embodiments, the cleaning assembly 20 generally includes a rotating shaft 21 and a rotating disk 22. The rotating disk 22 is fixed on the rotating shaft 21. A drainage groove 221 is provided on the rotating disk 22. The drainage groove 221 extends from the upper edge of the rotating disk 22 to the lower edge of the rotating disk 22. A liquid spray hole 222 corresponding to and communicating with the drainage groove 221 is provided at the lower edge of the rotating disk 22.

In the embodiment shown in FIG. 3-FIG. 4, there are multiple drainage grooves 221, and the multiple drainage grooves 221 are arranged at intervals along the circumference of the turntable 22, for example, at equal intervals; correspondingly, there are also multiple spray holes 222, and the spray holes 222 and the drainage grooves 221 are connected one by one. Of course, in other embodiments, the number of drainage grooves 221 can also be one, and the number of spray holes 222 is also one. The present application does not specifically limit the number of drainage grooves 221 and spray holes 222.

In some embodiments, the cleaning component 20 is configured to deliver a cleaning solution for cleaning glue residues to the receiving chamber 100. The cleaning solution is, for example, an edge bead remover (EBR).

It is understandable that the cleaning component 20 does not participate in the semiconductor process (such as spin coating, etc.). In some embodiments, the cleaning component 20 can be located outside the receiving chamber 100. When the semiconductor process equipment 10 needs to be cleaned, the component to be processed can be taken out of the semiconductor process equipment 10 after the semiconductor process of the component to be processed is completed, that is, the component to be processed is taken out from the carrier 11 from the second opening 130, and then the cleaning component 20 is extended into the receiving chamber 100 from the second opening 130, and the cleaning component 20 is located on the top of the first shell 12. At this time, the cleaning component 20 is received in the receiving chamber 100 of the semiconductor process equipment 10, and the spray hole 222 is connected to the receiving chamber 100. The rotating shaft 21 can rotate and drive the rotating disk 22 to rotate along the rotating shaft 21. The cleaning solution flows through the drainage groove 221 on the rotating disk 22 and is sprayed out from the spray hole 222 to transport the cleaning solution into the receiving chamber 100, thereby cleaning the receiving chamber 100. Of course, in other embodiments, the cleaning assembly 20 may also be disposed at other locations within the receiving chamber 100 as long as it does not interfere with the semiconductor manufacturing process of the component to be processed.

In some embodiments, the cleaning component 20 is partially received in the receiving chamber 100 , and the top of the cleaning component 20 may be exposed to the semiconductor process equipment 10 through the second opening 130 .

In some embodiments of the present application, since the cleaning assembly 20 includes a rotating shaft 21 and a turntable 22 fixed on the rotating shaft 21, the rotating shaft 21 can drive the turntable 22 to rotate. The turntable 22 is provided with a drainage groove 221 extending from the upper edge of the turntable 22 to the lower edge of the turntable 22, and the lower edge of the turntable 22 is provided with a spray hole 222 corresponding to the drainage groove 221. The cleaning assembly 20 is configured to deliver a cleaning solution for cleaning glue residues to the receiving chamber 100 of the semiconductor process equipment 10. The first shell 12 and the second shell 13 of the semiconductor process equipment 10 are arranged at intervals to form the receiving chamber 100. When the cleaning assembly 20 is used to clean the semiconductor process equipment 10, the cleaning assembly 20 is received in the receiving chamber 100, and the rotation of the rotating shaft 21 drives the turntable 22 to rotate along the rotating shaft 21, so that the cleaning solution can flow through the drainage groove 221 and spray from the spray hole 222, and spray into the receiving chamber 100. At this time, the glue residue can be dissolved and liquefied by the cleaning solution, reducing the probability of the glue residue being too dry and sticky due to the exhaust gas extraction, reducing the glue residue attached to the inner wall of the receiving chamber 100, improving the cleaning effect, reducing the replacement frequency of the first shell 12 and/or the second shell 13, and extending the service life of the first shell 12 and the second shell 13. In addition, since the turntable 22 can rotate along the rotating shaft 21, the cleaning solution can be evenly sprayed into the receiving chamber 100 along the circumference of the turntable 22 at 360°, thereby increasing the cleaning area, greatly reducing the glue residue in the receiving chamber 100, and cleaning the receiving chamber 100 more fully and comprehensively, thereby improving the cleaning effect. Among them, the "upper edge" can be the edge of the turntable 22 away from the end of the support platform 11, that is, the edge of the turntable 22 adjacent to the second opening 130; the "lower edge" can be the edge of the turntable 22 close to the end of the support platform 11, that is, the edge of the turntable 22 away from the second opening 130.

When the cleaning assembly 20 is installed in the receiving chamber 100, the turntable 22 has a lower surface adjacent to the first shell 12 and an upper surface arranged opposite to the lower surface. Referring to FIG. 4 , in some embodiments, the drainage groove 221 is provided on the upper surface 220 of the turntable 22. The upper surface 220 of the turntable is a convex surface, and the position of the upper edge of the turntable 22 relative to a horizontal plane is higher than the position of the lower edge of the turntable 22 relative to the same horizontal plane, so that the radial direction of the upper surface 220 is inclined relative to the horizontal plane. The "horizontal plane" may be a plane defined by the bearing surface of the bearing platform 11.

In some embodiments, the radial direction of the upper surface 220 has an inclination angle relative to the horizontal plane of approximately 1° to 40°, such as 1°, 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, etc. In some embodiments, the radial direction of the upper surface 220 has an inclination angle relative to the horizontal plane of 1° to 20°, 5° to 30°, or 10° to 20°. Among them, the inclination angle of the radial direction of the upper surface 220 relative to the horizontal plane can be specifically selected and adjusted as needed to adapt to different semiconductor process equipment 10 and different cleaning requirements. For example, the inclination angle of the radial direction of the upper surface 220 relative to the horizontal plane can be determined according to the shape, size, etc. of the first shell 12/second shell 13/accommodation cavity 100 of different semiconductor process equipment 10. The present application does not specifically limit the inclination angle of the radial direction of the upper surface 220 relative to the horizontal plane.

When the cleaning component 20 is accommodated in the accommodating cavity 100, since the radial direction of the upper surface 220 is inclined relative to the horizontal plane, that is, the distance between the upper edge of the turntable 22 and the supporting platform 11 is greater than the distance between the lower edge of the turntable 22 and the supporting platform 11, the cleaning solution can be more conveniently and quickly sprayed out from the spray hole 222 along the drainage groove 221 and smoothly.

In some embodiments, the drainage groove 221 extending from the upper edge to the lower edge of the turntable 22 may be arc-shaped. In other words, the shape of the drainage groove 221 on the upper surface 220 may be arc-shaped. In some embodiments, the setting direction of the arc of the drainage groove 221 on the upper surface 220 may be the same as the rotation direction of the turntable 22. For example, the drainage groove 221 may be an arc-shaped arranged in a clockwise direction, and when the semiconductor process equipment 10 needs to be cleaned, the turntable 22 may rotate clockwise along the rotation axis 21; for another example, the drainage groove 221 may be an arc-shaped arranged in a counterclockwise direction, and when the semiconductor process equipment 10 needs to be cleaned, the turntable 22 may rotate clockwise along the rotation axis 21. By setting the arc of the drainage groove 221, the spraying angle of the cleaning solution can be adjusted, so as to facilitate more thorough cleaning of the receiving chamber 100. By coordinating the arc setting of the drainage groove 221 with the rotation direction of the turntable 22, the energy loss generated when the cleaning solution flows in the drainage groove 221 can be effectively reduced, the spraying speed of the cleaning solution can be increased, and the cleaning effect can be improved.

In some embodiments, a warp portion 223 is provided at the lower edge of the rotating disk 22, which is warped upward relative to the horizontal plane. The liquid spray holes 222 are respectively located at the warp portions 223. Here, "warping upward" means that the warp portion 223 extends from the lower edge of the rotating disk 22 in a direction adjacent to the second opening 130 or in a direction adjacent to the top wall of the second shell 13. By providing the warp portion 223, the cleaning solution is sprayed upward along the warp portion 223, which facilitates cleaning of the top wall of the second shell 13 and increases the cleaning area.

In some embodiments, the second housing 13 has a top wall adjacent to the upper surface 220 of the turntable 22, and the warping portion 223 is arranged so that the spray hole 222 faces the top wall of the second housing 13. In some embodiments, the warping angle of the warping portion 223 relative to the horizontal plane is approximately 1° to 40°, such as 1°, 3°, 5°, 7°, 9°, 10°, 13°, 15°, 18°, 20°, 23°, 25°, 28°, 30°, 33°, 35°, 38°, 40°, etc. In some embodiments, the warping angle of the warping portion 223 relative to the horizontal plane is 1° to 20°, 3° to 10°, or 5° to 15°. Among them, the warping angle of the warping portion 223 relative to the horizontal plane can be specifically selected and adjusted as needed to adapt to different semiconductor process equipment 10 and different cleaning requirements.

In some embodiments, the top wall of the second housing 13 is inclined relative to the horizontal plane, and the warping angle of the warped portion of the turntable 22 relative to the horizontal plane is adapted to the inclination angle of the top wall of the second housing 13 relative to the horizontal plane. That is, the warping angle of the warped portion of the turntable 22 relative to the horizontal plane can be specifically selected and adjusted according to the inclination angle of the top wall of the second housing 13 relative to the horizontal plane to adapt to different semiconductor process equipment 10.

In some embodiments, the inclination angle of the top wall of the second shell 13 relative to the horizontal plane is approximately 1°~40°, such as 1°, 5°, 10°, 15°, 20°, 25°, 30°, 35°, 38°, 40°, etc. In some embodiments, the inclination angle of the top wall of the second shell 13 relative to the horizontal plane is 1°~20°, 5°~30° or 10°~20°.

In some embodiments, the inclination direction of the top wall of the second shell 13 relative to the horizontal plane may intersect with the inclination direction of the upper surface 220 of the turntable 22 relative to the horizontal plane to increase the cleaning area of the top wall of the second shell 13 .

In the related art, the inclination angle of the top wall of the second housing 13 and the type of photoresist used in the glue coating process will affect the attachment position and residual thickness of the glue coating residue. Therefore, in some embodiments of the present application, the spraying angle and spraying speed of the cleaning solution can be set according to the inclination angle of the top wall of the second housing 13 and the type of photoresist used in different semiconductor process equipment 10, so as to fully clean the glue coating residue.

For example, in some embodiments, the warping angle of the warping portion 223 can be adjusted according to the inclination angle of the top wall of the second shell 13, that is, the spraying angle of the cleaning solution is adjusted according to the flushing angle required by the second shell 13, so that the sprayed cleaning solution can take into account the top wall of the second shell 13 to achieve a better cleaning effect. In some embodiments, when the warping angle of the warping portion 223 relative to the horizontal plane is 1°~20°, the inclination angle of the top wall of the second shell 13 relative to the horizontal plane can be set to 5°~30°. In this case, the cleaning component 20 can clean a larger area of the top wall of the second shell 13, so that the second shell 13 can be cleaned more fully.

In some embodiments, the spray angle and/or the spray speed of the cleaning solution can be adjusted by adjusting the aperture size of the spray hole 222. The aperture of the spray hole 222 can be approximately 0.5 mm to 5 mm, 0.5 mm, 0.8 mm, 1 mm, 1.2 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, etc. In some embodiments, the aperture of the spray hole 222 can be 1 mm to 1.5 mm, or 2 mm to 4 mm.

In some embodiments, the spraying angle and spraying speed of the cleaning solution can also be adjusted by adjusting the groove depth of the drainage groove 221, adjusting the arc curvature of the drainage groove 221, adjusting the type of cleaning solution, adjusting the rotation speed of the rotating shaft 21, adjusting the position of the cleaning component 20 in the receiving chamber 100 (for example, the position in a direction parallel to the rotating shaft 21), etc.

Referring to FIGS. 2-4 , in some embodiments, the cleaning assembly 20 further includes an upper cover 23 that is covered on the turntable 22. A solvent pipeline 231 is provided in the circumferential direction of the upper cover 23. A liquid inlet 232 is provided on the upper end surface 235 of the upper cover 23. The liquid inlet 232 is used to connect to a liquid infusion pipeline (not shown) to introduce a cleaning solution. A liquid outlet 234 is provided on the lower end surface 233 of the upper cover 23. The liquid outlet 234 is connected to the corresponding drainage groove 221. The cleaning solution is injected into the corresponding drainage groove 221 through the solvent pipeline 231 and the liquid outlet 234. In some embodiments, the number of the liquid outlets 234 is the same as the number of the drainage grooves 221, and the liquid outlets 234 are connected to the drainage grooves 221 one by one. By providing the upper cover 23, the cleaning solution can be effectively prevented from being sputtered from the second opening 130 to the outside of the semiconductor process equipment 10.

In some embodiments, the solvent pipeline 231 is disposed on a side of the upper cover 23 facing the turntable 22, and the liquid inlet 232, the solvent pipeline 231, and the liquid outlet 234 are sequentially connected. When the cleaning assembly 20 is used to clean the semiconductor process equipment 10, the cleaning solution can be transported from the liquid delivery pipeline to the solvent pipeline 231, and then transported to the receiving chamber 100 through the drainage groove 221 connected to the solvent pipeline 231 and the receiving chamber 100, so as to be mixed with the glue residue in the receiving chamber 100, thereby cleaning the receiving chamber 100.

In some embodiments, the solvent conduit 231 may be a channel structure integrally formed with the upper cover 23 by processes such as injection molding, or the solvent conduit 231 may be a structure formed on the upper cover 23 by processes such as welding, which is not specifically limited in the present application.

In some embodiments, the cleaning component 20 further includes a pressurizing element (not shown). The pressurizing element is connected to the solvent pipeline 231 and is used to pressurize the solvent pipeline 231 so that the cleaning solution is sprayed from the spray hole 222 into the receiving chamber 100 at a certain speed. In some embodiments, the cleaning component 20 can apply nitrogen, argon, etc. to the solvent pipeline 231 through the pressurizing element so that the cleaning solution is transported to the solvent pipeline 231 at a flow rate of approximately 600ml/s-800ml/s. In some embodiments, the flow rate of the cleaning solution can be 650ml/s, 700ml/s, 750ml/s, etc., which can be set according to different needs.

In some embodiments, the rotating shaft 21 is connected to a rotating drive device (not shown). The rotating drive device is used to drive the rotating shaft 21 to rotate, thereby driving the turntable 22 to rotate. In some embodiments, the rotating speed of the rotating shaft 21 can be adjusted by the rotating drive device, thereby controlling the rotating speed of the turntable 22, thereby adjusting the spraying angle and spraying speed of the cleaning solution. In some embodiments, the rotating drive device can be located outside the semiconductor process equipment 10. A through hole 230 is provided at the center of the upper cover 23, and the rotating shaft 21 passes through the through hole 230 to be connected to the rotating drive device.

In some embodiments, the cleaning component 20 may be further connected to a translation drive device (not shown) to drive the cleaning component 20 to reciprocate as a whole in a direction parallel to the rotation axis 21. In some embodiments, the movement distance of the cleaning component 20 relative to the carrier 11 may be approximately 0 cm to 4 cm, for example, 0.5 cm, 1 cm, 1.5 cm, 2 cm, 2.5 cm, 3 cm, 3.5 cm, 4 cm, etc. In some embodiments, the movement distance of the cleaning component 20 relative to the carrier 11 may be 0 cm to 3.5 cm. By driving the cleaning component 20 to reciprocate as a whole in a direction parallel to the rotation axis 21 through the translation drive device, the cleaning range can be effectively increased, making the cleaning more comprehensive.

In some embodiments, referring to FIGS. 2-4 , the cleaning assembly 20 further includes a mating portion 25 disposed around the outer periphery of the rotating shaft 21. The mating portion 25 is fixedly disposed on the upper cover 23 and spaced apart from the rotating shaft 21, and is used for transmission connection with the translation drive device. In some embodiments, the translation drive device may be located outside the semiconductor process equipment 10. The mating portion 25 partially passes through the through hole 230 to be connected with the translation drive device.

In some embodiments, the radial direction of the upper cover 23 is inclined relative to the horizontal plane. The inclination angle of the radial direction of the upper cover 23 relative to the horizontal plane matches the inclination angle of the radial direction of the turntable 22 relative to the horizontal plane, thereby effectively reducing the probability of the cleaning solution escaping from the drainage groove 221 during the rotation of the turntable 22, reducing the energy loss of the cleaning solution between the upper cover 23 and the turntable 22, and thus enabling the cleaning solution to be sprayed out from the spray hole 222 at a higher speed and in a more concentrated manner. In this application, the inclination angle "matches" means that the inclination angles of the two elements are the same, or approximately the same.

3 and 4 , in some embodiments, the cleaning assembly 20 further includes a base 24 mounted on the upper cover 23. An accommodating space 240 is formed between the base 24 and the upper cover 23, and the turntable 22 is accommodated in the accommodating space 240 and rotatable in the accommodating space 240 under the drive of the rotating shaft 21.

In some embodiments, the upper cover 23 and the bottom bracket 24 are fixed relative to each other, and in the process of the rotating shaft 21 driving the turntable 22 to rotate, the upper cover 23 and the bottom bracket 24 are both fixed. The bottom bracket 24 is fixedly installed with the upper cover 23 so that the turntable 22 is accommodated in the accommodating space 240, and there is a gap between the bottom bracket 24 and the upper cover 23, so that the cleaning solution sprayed from the spray hole 222 can be conveniently sprayed from the gap into the accommodating cavity 100. Among them, the radial direction of the bottom bracket 24 can be inclined relative to the horizontal plane, and the inclination angle of the radial direction of the bottom bracket 24 relative to the horizontal plane matches the inclination angle of the radial direction of the turntable 22 relative to the horizontal plane.

Referring to FIG. 4 , in some embodiments, a first fixing element 236 is provided at the edge of the upper cover 23, and a second fixing element 241 matching the first fixing element 236 is provided at the edge of the bottom bracket 24. The upper cover 23 and the bottom bracket 24 are fixedly installed by the cooperation of the first fixing element 236 and the second fixing element 241. The first fixing element 236 is one of a fixing column or a fixing hole, and the second fixing element 241 is the other of the fixing column or the fixing hole. The fixing hole can be a through hole or a blind hole, as long as it cooperates with the fixing column to fix the upper cover 23 and the bottom bracket 24 to each other.

For example, the first fixing element 236 may be a fixing column, and the second fixing element 241 may be a fixing hole; for another example, the first fixing element 236 may be a fixing hole, and the second fixing element 241 may be a fixing column. In some embodiments, the fixing hole may be a light hole, and the fixing column may pass through the fixing hole and be fixed in the fixing hole by a fixing member such as a bolt. In some embodiments, the fixing hole may be a threaded hole, and the fixing column and the fixing hole may be fixed by a threaded connection. The present application does not specifically limit the connection and matching relationship between the fixing column and the fixing hole.

The above is an embodiment in which the cleaning component 20 includes a base 24. Of course, in other embodiments, the cleaning component 20 itself may not include a base, and the housing of the semiconductor process equipment 10 may be used as the base of the cleaning component 20. FIG. 5 is a schematic diagram of the cleaning component 20 in some embodiments of the present application, FIG. 6 is a schematic diagram of the semiconductor process equipment 10 using the cleaning component 20 shown in FIG. 5, and FIG. 7 is a longitudinal cross-sectional schematic diagram of the semiconductor process equipment 10 installed with the cleaning component 20 in FIG. 6. In some embodiments, referring to FIG. 5-FIG. 7, the first housing 12 of the semiconductor process equipment 10 serves as the base of the cleaning component 20. A third fixing element 224 is provided at the lower edge of the turntable 22, and a fourth fixing element 121 is provided in the circumferential direction of the first housing 12. The turntable 22 is fixedly mounted on the first housing 12 by the third fixing element 224 and the fourth fixing element 121, and the first housing 12 rotates with the rotation of the turntable 22. The third fixing element 224 is one of a fixing column or a fixing hole, and the fourth fixing element 121 is the other of the fixing column or the fixing hole. The fixing hole can be a through hole or a blind hole, as long as it cooperates with the fixing column to fix the turntable 22 and the first housing 12 to each other.

Referring to the embodiment shown in FIGS. 5 to 7 , when the cleaning assembly 20 is used to clean the semiconductor process equipment 10, the turntable 22 can be fixedly mounted together with the first housing 12, and the turntable 22 can drive the first housing 12 to rotate together, but the upper cover 23 remains fixed. The turntable 22 drives the first housing 12 to rotate, so that the cleaning assembly 20 cleans the outer wall of the first housing 12 more fully and comprehensively, and the cleaning effect is better.

2 and 7 , in some embodiments, the cleaning component 20 further includes a detection component 14. The detection component 14 is disposed on the first housing 12 and/or the second housing 13, and is used to detect the degree of dirtiness of the semiconductor process equipment 10. The degree of dirtiness of the semiconductor process equipment 10 is detected by the detection component 14, and the cleaning component 20 is called to clean the receiving chamber 100 according to the detected degree of dirtiness, so as to achieve more timely "active" cleaning of the semiconductor process equipment 10.

In some embodiments, an exhaust passage 122 is disposed on a side of the first shell 12 away from the second shell 13 , and a detection component 14 is disposed in the exhaust passage 122 for detecting the airflow in the exhaust passage 122 to detect the degree of dirtiness of the semiconductor process equipment 10 .

The detection component 14 may be a pressure sensor or a gas flow sensor, and the detection component 14 is used to detect the gas flow or gas flow pressure of the exhaust channel 122. As the amount of glue residue in the receiving chamber 100 increases, the gas flow (such as gas flow or gas flow pressure) discharged from the exhaust channel 122 will change. By detecting the gas flow through the exhaust channel 122 through the detection component 14, the detection result of the dirtiness of the semiconductor process equipment 10 can be obtained, and the cleaning component 20 is called to clean the receiving chamber 100 according to the detection result, so as to achieve more timely "active" cleaning.

In some embodiments, the detection component 14 can also detect the thickness of the glue residue attached to the first shell 12 and/or the second shell 13 to detect the degree of dirtiness of the semiconductor process equipment 10. The detection component 14 can be, for example, a laser sensor.

To solve the above technical problems, some embodiments of the present application further provide a cleaning method, which is applied to the above semiconductor process equipment 10. Fig. 8 is a flow chart of the cleaning method in some embodiments of the present application. The cleaning method includes the following steps.

Step S102, taking out the component to be processed from the receiving cavity.

In some embodiments, when the semiconductor process equipment 10 is used to perform semiconductor processes, the component to be processed can be carried on the carrier 11 through the second opening 130 and accommodated in the receiving chamber 100. When the semiconductor process equipment 10 needs to be cleaned, the component to be processed can be taken out of the receiving chamber 100 after the semiconductor process of the component to be processed is completed.

Step S104, placing the cleaning component into the receiving chamber, and starting the cleaning component to clean the semiconductor process equipment.

In some embodiments, the cleaning component 20 is extended into the receiving cavity 100 from the second opening 130, and the cleaning component 20 is located at the top of the first shell 12. The cleaning component 20 is started to clean the semiconductor process equipment 10. It can be understood that starting the cleaning component 20 to clean the semiconductor process equipment 10 includes: injecting a cleaning solution into the solvent pipeline 231 through an infusion pipeline; driving the rotating shaft 21 to rotate through a rotary drive device and/or driving the cleaning component 20 to reciprocate as a whole in a direction parallel to the rotating shaft 21 through a translation drive device. Injecting the cleaning solution and adjusting the cleaning component 20 to reciprocate in a direction parallel to the rotating shaft 21 can be performed simultaneously, or the cleaning solution can be injected first and then the cleaning component 20 can be adjusted to reciprocate in a direction parallel to the rotating shaft 21.

In some embodiments, the cleaning method further includes: after the cleaning of the semiconductor process equipment is completed, removing the cleaning component.

After the cleaning component 20 completes the cleaning of the semiconductor process equipment 10, the cleaning component 20 is removed from the semiconductor process equipment 10. In some embodiments, a preset duration can be set. After starting the cleaning component 20, the start time is recorded, and the difference between the current time and the start time is calculated as the cleaning duration. When the cleaning duration reaches the preset duration, it indicates that the semiconductor process equipment 10 is cleaned. Among them, the preset duration can be specifically selected and adjusted as needed to adapt to different semiconductor process equipment 10 and different cleaning requirements.

Of course, in other embodiments, after the semiconductor process equipment is cleaned, the cleaning assembly may be retained in the receiving chamber 100 and may be moved to other suitable locations, for example, as long as the subsequent semiconductor process technology is not affected.

In some embodiments, the cleaning method further comprises: monitoring the real-time pressure value of the exhaust channel of the semiconductor process equipment, and adjusting the preset time interval based on the real-time pressure value, wherein the preset time interval is the time interval for calling the cleaning component to clean the semiconductor process equipment.

The semiconductor process equipment 10 is pre-set with a preset time interval, and the cleaning component 20 is called to clean the receiving chamber 100 according to the preset time interval. The process of calling the cleaning component 20 to clean the semiconductor process equipment 10 may include the above steps. The preset time interval may be 12 hours, 24 hours, etc., and the present application does not make specific limitations here.

As the amount of glue residue in the receiving cavity 100 increases, the pressure of the gas exhausted from the exhaust channel 122 increases. Therefore, the gas pressure of the exhaust channel 122 can be monitored. Among them, a detection component 14 can be provided in the exhaust channel 122 of the semiconductor process equipment 10, and the detection component 14 can include a pressure sensor, and the gas pressure of the exhaust channel 122 is monitored in real time by the pressure sensor to obtain a real-time pressure value. The pressure sensor can detect the pressure value once every 1 second, 1.5 seconds, 2 seconds or 3 seconds to obtain a real-time pressure value. The interval time can be specifically selected and adjusted as needed to adapt to different semiconductor process equipment 10 and different cleaning requirements, and this application is not limited here.

In some embodiments, the detection component 14 can determine whether the real-time pressure value exceeds the preset pressure value, and in response to the real-time pressure value exceeding the preset pressure value, shorten the preset time interval. Among them, the preset pressure value can be specifically selected and adjusted as needed to adapt to different semiconductor process equipment 10 and different cleaning requirements, and the present application does not make specific limitations here. In some embodiments, the detection component 14 can calculate the pressure change rate of the real-time pressure value within a preset time period, that is, the pressure growth slope. Determine whether the pressure growth slope exceeds the preset slope, and in response to the pressure growth slope exceeding the preset slope, shorten the preset time interval. Among them, the preset time period and the preset slope can be specifically selected and adjusted as needed to adapt to different semiconductor process equipment 10 and different cleaning requirements, and the present application does not make specific limitations here.

Shortening the preset time interval may be, for example, adjusting the original 12-hour or 24-hour preset time interval to 8 hours, 6 hours, or 4 hours, which is not specifically limited in the present application.

In some embodiments, the detection component 14 can determine whether the real-time pressure value exceeds the preset pressure value once every preset time interval, or calculate the pressure growth slope once every preset time interval and make a judgment. The preset time interval can be, for example, 1 second, 30 seconds, 1 minute, 30 minutes, 1 hour, etc., and this application does not make specific limitations here.

The cleaning method provided in some embodiments of the present application can monitor the degree of dirtiness of the accommodating chamber 100 in real time by monitoring the pressure value of the exhaust channel 122 in real time, thereby adjusting the preset time interval according to the degree of dirtiness to increase the frequency of cleaning the semiconductor process equipment 10, and achieve more timely "active" cleaning, so that the semiconductor process equipment 10 can be better maintained in an efficient and high-quality working state, reduce the replacement frequency of the first shell 12 and/or the second shell 13, and extend the service life of the semiconductor process equipment 10, especially the service life of the first shell 12 and/or the second shell 13.

The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims (13)

1. A cleaning assembly for cleaning semiconductor process equipment, characterized in that the semiconductor process equipment comprises a carrier, a first shell and a second shell, the second shell cover is arranged on the first shell, and the first shell and the second shell are spaced apart to form a receiving cavity, the carrier is received in the receiving cavity; the cleaning assembly comprises: Axis of rotation; and A turntable is fixed on the rotating shaft, wherein a drainage groove is provided on the turntable, the drainage groove extends from the upper edge of the turntable to the lower edge, and a liquid spray hole corresponding to and communicating with the drainage groove is provided at the lower edge of the turntable; When the cleaning component is used to clean the semiconductor process equipment, the cleaning component is received in the receiving chamber of the semiconductor process equipment, the turntable rotates along the rotating axis, the cleaning solution flows through the drainage groove on the turntable and is sprayed out from the spray hole to clean the receiving chamber. 2. The cleaning assembly according to claim 1, characterized in that: The drainage groove is provided on the upper surface of the rotating disk; The upper surface of the turntable is convex, and the position of the upper edge of the turntable relative to a horizontal plane is higher than the position of the lower edge of the turntable relative to the same horizontal plane, so that the radial direction of the upper surface is inclined relative to the horizontal plane. 3. The cleaning assembly according to claim 2, characterized in that: The lower edge of the rotating disk is provided with a warping portion warping upward relative to a horizontal plane, and the liquid spraying hole is located at the warping portion. 4. The cleaning assembly according to claim 3, characterized in that the warping angle of the warped portion relative to the horizontal plane is 1° to 40°; and/or The inclination angle of the radial direction of the upper surface relative to the horizontal plane is 1° to 40°. 5. The cleaning assembly according to claim 2, characterized in that: The drainage groove extending from the upper edge to the lower edge of the rotating disk is arc-shaped. 6. The cleaning assembly according to claim 1, further comprising: An upper cover, which is arranged on the rotating disk; Among them, a solvent pipeline is arranged in the circumferential direction of the upper cover, a liquid inlet is arranged on the upper end surface of the upper cover, and a liquid outlet is arranged on the lower end surface of the upper cover, the liquid outlet is connected to the corresponding drainage groove, the liquid inlet is used to connect to the infusion pipeline to introduce the cleaning solution, and the cleaning solution is respectively injected into the corresponding drainage groove through the solvent pipeline and the liquid outlet. 7. The cleaning assembly according to claim 6, characterized in that: The radial direction of the upper cover is inclined relative to the horizontal plane; The inclination angle of the radial direction of the upper cover relative to the horizontal plane matches the inclination angle of the radial direction of the rotating disk relative to the horizontal plane. 8. The cleaning assembly according to claim 6, further comprising: The bottom bracket is installed on the upper cover, and a receiving space is formed between the bottom bracket and the upper cover. The turntable is received in the receiving space and can rotate in the receiving space under the driving of the rotating shaft. 9. The cleaning component according to claim 1 is characterized in that it also includes a detection component, which is arranged on the first shell and/or the second shell and is used to detect the degree of dirtiness of the semiconductor process equipment. 10. The cleaning component according to claim 9 is characterized in that the first shell is provided with an exhaust channel, and the detection component is arranged in the exhaust channel to detect the airflow in the exhaust channel to detect the degree of dirtiness of the semiconductor process equipment. 11. A semiconductor process equipment, comprising: a first shell; A second shell, which is covered on the first shell and spaced apart from the first shell to form a receiving cavity; A carrying platform, accommodated in the accommodation cavity; and A cleaning assembly as claimed in any one of claims 1 to 10. 12. A cleaning method, characterized in that it is applied to the semiconductor process equipment according to claim 11, the cleaning method comprising: Taking out the component to be processed from the receiving cavity; and The cleaning component is placed in the receiving chamber, and the cleaning component is started to clean the semiconductor process equipment. 13. The cleaning method according to claim 12, characterized in that the cleaning method further comprises: The real-time pressure value of the exhaust channel of the semiconductor process equipment is monitored, and a preset time interval is adjusted based on the real-time pressure value, wherein the preset time interval is a time interval for calling the cleaning component to clean the semiconductor process equipment.