CN1184462C - Film resistor temperature sensor and its making process - Google Patents
Film resistor temperature sensor and its making process Download PDFInfo
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- CN1184462C CN1184462C CNB021099898A CN02109989A CN1184462C CN 1184462 C CN1184462 C CN 1184462C CN B021099898 A CNB021099898 A CN B021099898A CN 02109989 A CN02109989 A CN 02109989A CN 1184462 C CN1184462 C CN 1184462C
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Abstract
The present invention relates to a film resistor temperature sensor and a manufacturing method thereof, which overcomes the shortcomings of high cost and complicated manufacturing procedures existing in the prior art. The temperature sensor is provided with an insulating backing; the insulating backing is provided with a film resistor, a protective layer and an electrode used for connecting the film resistor, wherein the film resistor comprises components of platinum or aurum containing a small amount of metal oxide, and has a thickness of 0.02 to 2 um. The manufacturing method comprises the following steps: heating organic platinum compound and organic aurum compound to obtain a mixture; simultaneously adding organic compound, resin and solvents into the mixture to prepare mixed platinum slurry or mixed aurum slurry; then taking steps of printing the mixed slurry on a cleaned baseplate, sintering, etc. to form the finished product, or taking steps of evenly coating the mixed slurry on the baseplate with the methods of screen painting, etc., sintering, etc. to form the finished product. The present invention can be widely used for temperature measurement, temperature control, etc. in the technical field of aerospace industry, chemical industry and automobile industry.
Description
Affiliated technical field
The present invention relates to a kind of temperature sensor and manufacture method thereof, is a kind of film resistor temperature sensor and manufacture method thereof specifically.
Background technology
Platinum resistance has advantages such as linearity height, thermal response time are little, good stability, extensively in fields such as space flight, chemical industry, automobiles.Fig. 1 is the structural representation of diaphragm type resistance temperature sensor, and Fig. 2 is a film chip electric resistance sensor structural drawing, and Fig. 3 is the structural representation of thick-film type resistance temperature sensor, and Fig. 4 is a thick film sheet type electric resistance sensor structural drawing.1 dielectric substrate of forming by materials such as potteries among the figure, the 2nd, temperature sensitive resister, the 3rd, the glass encapsulating layer, the 4th, the lead-in wire electrode, the 5th, the platinum filament lead-in wire, the 6th, lead-in wire is reinforced glaze.
Form and manufacture craft different according to the temperature sensitive resister material, resistance can be divided into thick-film resistor and sheet resistance two classes.Thick-film resistor adopts serigraphy, sintering, laser correction technology to make at present, uses platinum powder type thick film ink, and equipment investment is few, the production efficiency height, and cost is low, but thicknesses of layers is generally about 10um, and side's resistance is little, is difficult to make small-sized high resistance measurement body; Thick-film resistor contains a large amount of glass ingredients, and temperature coefficient is adjusted difficulty, and can not etching, and extra fine wire is wide can only accomplish 150um; And because thicknesses of layers is big, line thickness is big, and thermal capacity is big, and thermal response time is long; Need 1200 ℃ of sintering, energy consumption is big, the equipment requirements height.Sheet resistance adopts two kinds of fabrication techniques at present: (1) adopts sputter equal vacuum technology, and photoetching corrosion, laser correction technology are made, and equipment investment is big, and production efficiency is low, and the platinum utilization factor is low, the cost height; But metal thickness generally has only 0.8-2um, and line thickness can be accomplished 10um, and thermal capacitance is little, and thermal response characteristics is good, therefore is used for quick temperature measurement more.(2) organic platinum slurry of the pure liquid state of use, organic platinum slurry of pure liquid state is by organic platinum of handling without heat modification, a large amount of film-forming resin and solvent compositions, adopts thick film technology making such as serigraphy.But because the influence of film surface effect, sheet resistance thickness will reach the bigger temperature coefficient that just can obtain about 0.8um near bulk material.But the easy explosion when sintering of pure liquid organic metal slurry is printed sintering thickness at every turn and can only be reached 0.2-0.3um, arrive the resistance of desired thickness, need repeat print sintering 3-4 time, production efficiency is low, easily produces rete defectives such as pin hole, dust, and yield rate is low; The film-forming resin material selectivity of dissolving the solvent of organic metal paste and coupling is little, and slurry viscosity is bigger, easily produces defectives such as bubble, pin hole during printing, and printing characteristic is adjusted difficulty.
Though gold has bigger temperature-coefficient of electrical resistance, because resistivity is less, and the technology cost of the golden film of original making is higher, thereby fails to be applied to temperature sensor as the temperature detecting resistance material always.
Summary of the invention
Technical matters to be solved by this invention is on the basis of existing above-mentioned thick, thin film technique, overcome both shortcomings, comprehensive both advantages, thus a kind of manufacture method of novel low cost, high performance thin film temperature sensor and high efficiency production sheet resistance is provided.
The technical solution adopted for the present invention to solve the technical problems is: a kind of film resistor temperature sensor; it is provided with dielectric substrate; on dielectric substrate, be provided with sheet resistance; the electrode that connects resistance; protective seam; the composition that it is characterized in that sheet resistance is platinum or gold and rhodium oxide; and bismuth; plumbous; silicon; chromium; copper; one or more of the oxide of boron; its thickness is 0.02um-2um; platinum or gold and rhodium are controlled at 1: 0.0001～0.02, platinum or gold and bismuth by weight; plumbous; silicon; chromium; copper; one or more of boron are controlled between 1: 0.003～0.05 by weight proportion.
Described sheet resistance is a crooked snake type or mesh-structured.
A kind of method of making above-mentioned film resistor temperature sensor is characterized in that this method may further comprise the steps:
A:, obtain separating the potpourri that solidfied material, ultra-fine platinum powder or bronze, low-molecular-weight organic matter, ultra-fine carbon dust are formed by the differential of organic platinum or organic gold compound with organo-platinic compounds or organic gold compound 150-190 ℃ heating 15-30 minute; This potpourri is added organic rhodium compound, and add in bismuth organic compound, organo-lead compound, organo-silicon compound, organo-chromium compound, organocopper compound, the organoboron compound one or two or more kinds, platinum or gold and rhodium are controlled at 1: 0.0001～0.02 by weight proportion, one or more of platinum or gold and bismuth, lead, silicon, chromium, copper, boron are controlled between 1: 0.003～0.05 by weight proportion, add resin and solvent simultaneously, form mixed type platinum slurry or gold paste material.
B: above-mentioned mixed type slurry is printed in through on the substrate that cleans, and through oversintering, process electrode making again, protective seam is made, and repaiies the resistance that resistance forms required figure then, measurement, formation product.
A kind of method of making above-mentioned film resistor temperature sensor is characterized in that this method may further comprise the steps:
A: with organo-platinic compounds or organic gold compound 150-190 ℃ heating 15-30 minute, obtain separating solidfied material by the differential of organic platinum or organic gold compound, ultra-fine platinum powder or bronze, low-molecular-weight organic matter, the potpourri that ultra-fine carbon dust is formed, this potpourri is added organic rhodium compound, and interpolation bismuth organic compound, organo-lead compound, organo-silicon compound, organo-chromium compound, organocopper compound, in the organoboron compound one or two or more kinds, platinum or gold and rhodium are controlled at 1: 0.0001～0.02 by weight proportion, gold or platinum and bismuth, plumbous, silicon, chromium, copper, one or more of boron are controlled between 1: 0.003～0.05 by weight proportion, add resin and solvent simultaneously, form mixed type platinum slurry or gold paste material.
B: the method that adopt serigraphy, directly retouch, spraying, roller coat, spin coating, pen is coated with, brushes one of them evenly applies described mixed type slurry on substrate; carry out sintering, photoetching, corrosion then; make through electrode making, protective seam again; repair the resistance back and form the resistance that requires; measure, form product.
The method of above-mentioned film resistor temperature sensor, its described organo-platinic compounds are one or more of dutch oil platinum, sulfuration terpenes platinum, sulfuration terpinol platinum, mercaptan platinum, sulfuration colophonic acid platinum, sulfuration 2-hexyl hexane acid platinum, sulfuration octyl group acid platinum, sulfuration cycloalkanes platinum, hydrocarbon acid platinum.
The method of above-mentioned film resistor temperature sensor, its described organic gold compound are one or more of dutch oil gold, sulfuration terpenes gold, sulfuration terpinol gold, mercaptan gold, sulfuration colophonic acid gold, sulfuration 2-hexyl hexane acid gold, sulfuration octyl group acid gold, sulfuration cycloalkanes gold, hydrocarbon acid gold.
The method of above-mentioned film resistor temperature sensor adopts thick-film technique to form described electrode and protective seam.
The present invention studies at using mixed type platinum or gold paste material to make temperature sensor film temperature-sensitive portion.Be applicable to metal material resistance (R) as follows with variation of temperature:
R＝R
0×T×EXP(E/kT)
R
0: initial stage resistance value T: temperature k: Bohr is grown graceful constant E: activation evergy
Organic platinum or organic gold are metal-organic a kind of, be pt atom or gold atom by the carbon atom be combined in sulphur atom, oxygen atom, nitrogen-atoms etc. and the organism, adopt sulfuration face cream method, mercaptide method, resinate method or their combination and make.
Organic platinum or organic gold are decomposed into metal platinum or gold by sintering, on substrate, form metal film, it is the good material of making lead and resistance, but organic platinum of handling without heat modification or organic gold easy explosion when drying and sintering, need in slurry, to add a large amount of film-forming resins and could form continuous film, cause the interior tenor of slurry low, each printing sintering thickness can only reach 0.2-0.3um, arrive the resistance of desired thickness, need repeat print sintering 3-4 time, production efficiency is low, easily produces rete defectives such as pin hole, dust, and yield rate is low; The film-forming resin selectivity of dissolving organometallic solvent and coupling is little, and slurry viscosity is bigger, easily produces defectives such as bubble, pin hole during printing, and printing characteristic is adjusted difficulty.
For addressing the above problem, a kind of sheet resistance cheaply and high efficiency production technology have been invented.For achieving the above object, we will make organic platinum or organic gold compound heated 15-30 minute at 150-190 ℃, the organic metal differential is separated, the differential that becomes organic platinum or organic gold compound is separated the mixture that solidfied material, ultra-fine platinum powder or bronze, low-molecular-weight organic matter, ultra-fine carbon dust etc. are formed, this mixture is dissolved in organic solvent, adds organic rhodium, organo-bismuth, organic lead, Organic Chromium, organic copper, organosilicon, film-forming resin, solvent etc. then and make the mixed type slurry.Because slurry contains inorganic platinum powder or bronze and inorganic carbon dust, the adjustment of slurry viscosity is very easy to, and especially is fit to make the serigraphy slurry; Owing to contain inorganic platinum powder or bronze, inorganic carbon dust, when drying and forming-film, the thermal stress that produces in the effective absorption dehydration film forming procedure of carbon dust, platinum powder or bronze prevents the phenomenon of explosion when pure organic platinum or organic gold material thickness are excessive; Organic platinum or organic golden differential as mixed type slurry major component are separated solidfied material, decompose mild in the sintering process, the phenomenon of explosion when having prevented the excessive sintering of organic platinum of pure liquid state or organic gold material thickness, single printing sintering thickness can reach 0.8um, overcome the problem that organic platinum of pure liquid state or organic gold material need repeatedly print sintering, greatly improved productivity and yield rate.Sintering temperature is low, and rete is evenly fine and close, and film quality can match in excellence or beauty with sputtered film; Platinum, golden consumption are few, and thermal response characteristics is good; Do not need the annealing in process in the film making, technology is simple; Do not need the adhesion layer in the film making, etching technics is simple; Adopt conventional serigraphy, sinter membrane technology into, the production efficiency height, can make the fine rule of forniciform width 10um or make reticulate texture in conjunction with lithography corrosion technology, can reach the purpose of high resistantization, and make and adopt gold to make low-cost temperature sensitive resister to become possibility.
Organic platinum is decomposed into metal platinum in the sintering process, organic gold is decomposed into gold, but the adhesion of platinum or gold is very poor, and can produce the particle aggregation phenomenon when high temperature sintering.Add organic rhodium and other base metal organic compounds in the slurry, can effectively address the above problem.Organic rhodium decomposing oxidation in sintering process becomes rhodium oxide, and the particle aggregation phenomenon the when rhodium oxide of denier just can be avoided platinum or golden high temperature sintering improves sintering temperature and do not influence the temperature coefficient of platinum or golden resistance, is the best platinum or the flux material of gold.Different with other glass bonds, the base metal organic compound can be realized evenly mixing up of molecular level with other compositions of slurry, use amount seldom just can reach the effect of effectively adhering to, temperature coefficient influence to platinum or gold is little, base metal organic compound decomposing oxidation becomes base metal oxide in sintering process, these base metal oxides and substrate reaction form firm binding layer, have improved the reliability of platinum or golden resistance widely.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the structural representation of diaphragm type resistance temperature sensor;
Fig. 2 is a film chip electric resistance sensor structural representation;
Fig. 3 is the structural representation of thick-film type resistance temperature sensor;
Fig. 4 is a thick film sheet type electric resistance sensor structural representation;
Fig. 5 is a crooked snake type platinum resistance temperature-sensitive portion structural representation;
Fig. 6 is a mesh platinum resistance temperature-sensitive portion structural representation.
Fig. 7 is a manufacture method schematic flow sheet of the present invention.
Fig. 8 is the schematic flow sheet of prior art.
Embodiment:
Embodiment 1
Mixed type platinum slurry is different with the thick-film platinum resistance slurry that adopts platinum powder, glass dust mixing to form, because utilized the macromolecule combination technology of platinum, thereby film forming is fine.The technical thickness 0.02um-2um that requires, the present invention adopt the mixed type slurry to make temperature-sensitive portion.43% the dutch oil platinum that Handan ceramic research is produced was 190 ℃ of heating 15 minutes, dutch oil rhodium with decomposition product and 4.3%, 5.1% colophonic acid bismuth is in platinum: rhodium: the ratio of bismuth=1: 0.0001: 0.003, add the uncommon acid resin of poly-methyl-prop and the 5% weight Cellosolve and the 10% weight terpinol equal solvent of Weihai prestige chemical industry company limited production of 20% weight, obtain required mixed type platinum slurry after mixing, this platinum slurry is coated on the glazing aluminum oxide substrate 1 equably, 810 ℃ of sintering obtain the platinum plating substrate after 30 minutes, repeat print, sintering obtains temperature-sensitive platinum resistance portion 2, printing sintering lead-in wire electrode 3, apply, sintered glass encapsulated layer 4, the laser correction obtains required resistance value, welding platinum filament lead-in wire 5, apply ruggedization under lower temperature glaze 6, reinforce the platinum filament lead-in wire.
In one embodiment of the present of invention, obtaining thickness is 0.8um, and resistance is 100 Ω, and TCR reaches 3830ppm/ ℃, the high-performance platinum resistance of time constant＜0.5s.
43% the dutch oil platinum that Handan ceramic research is produced, 35% sulfuration terpinol platinum mixes in 2: 1 ratio, 190 ℃ of heating 15 minutes, dutch oil rhodium with decomposition product and 4.3%, 3.8% copper abietinate is in platinum: rhodium: the ratio of copper=1: 0.0001: 0.001, add the uncommon acid resin of poly-methyl-prop and the Cellosolve of 5% weight and the terpinol equal solvent of 10% weight of Weihai prestige chemical industry company limited production of 20% weight, obtain required mixed type platinum slurry after mixing, this platinum slurry is coated on the glazing aluminum oxide substrate 1 equably, 810 ℃ of sintering obtain the platinum plating substrate after 30 minutes, repeat print, the platinum plating substrate that sintering obtains thickening; Form needed figure by photoetching, plasma etching, obtain temperature-sensitive platinum resistance portion 2, printing sintering lead-in wire electrode 3, coating, sintered glass encapsulated layer 4, the laser correction obtains required resistance value, welding platinum filament lead-in wire 5, apply ruggedization under lower temperature glaze 6, reinforce the platinum filament lead-in wire.
In one embodiment of the present of invention, obtaining thickness is 0.8um, and resistance is 1000 Ω, and TCR reaches 3760ppm/ ℃, the high-performance platinum resistance of time constant＜0.5s.
190 ℃ of heating of 43% dutch oil platinum that Handan ceramic research is produced 15 minutes, dutch oil rhodium with decomposition product and 4.3%, 5.1% colophonic acid bismuth is in platinum: rhodium: the ratio of bismuth=1: 0.0003: 0.01, add the uncommon acid resin of poly-methyl-prop and the Cellosolve of 5% weight and the terpinol equal solvent of 10% weight of Weihai prestige chemical industry company limited production of 20% weight, obtain required mixed type platinum slurry after mixing, this platinum slurry is coated on the glazing aluminum oxide substrate 1 equably, 850 ℃ of sintering obtain the platinum plating substrate after 30 minutes, repeat print, the platinum plating substrate that sintering obtains thickening; Form needed figure by photoetching, plasma etching, obtain temperature-sensitive platinum resistance portion 2, printing sintering lead-in wire electrode 3, coating, sintered glass encapsulated layer 4, the laser correction obtains required resistance value, and cutting sealed end tip electrode obtains small-sized chip sheet resistance.
In one embodiment of the present of invention, obtaining thickness is 0.8um, and resistance is 500 Ω, and TCR reaches 35300ppm/ ℃, the high-performance platinum resistance of time constant＜0.5s.
38% the dutch oil gold that Handan ceramic research is produced was 160 ℃ of heating 25 minutes, with decomposition product, 4.3% dutch oil rhodium, 5.1% colophonic acid bismuth down payment: rhodium: the ratio of bismuth=1: 0.0001: 0.003, add the uncommon acid resin of poly-methyl-prop and the Cellosolve of 5% weight and the terpinol equal solvent of 8% weight of Weihai prestige chemical industry company limited production of 16% weight, obtain required hybrid metal slurry after mixing, this gold paste material is coated on the glazing aluminum oxide substrate 1 equably, 810 ℃ of sintering obtain gold-plated substrate after 30 minutes, repeat print, sintering obtains temperature-sensitive gold resistance section 2, printing sintering lead-in wire electrode 3, apply, sintered glass encapsulated layer 4, the laser correction obtains required resistance value, electrode in the printing sintering after the scribing, the coated end tip electrode obtains the chip temperature sensor.
In one embodiment of the present of invention, obtaining thickness is 0.8um, and resistance is 100 Ω, and TCR reaches 3450ppm/ ℃, the high-performance gold resistance of time constant＜0.5s.
38% the dutch oil gold that Handan ceramic research is produced was 160 ℃ of heating 25 minutes, the dutch oil rhodium that decomposition product and 35% sulfuration terpinol gold is mixed back interpolation 4.3% in 3: 1 ratio, 5.1% colophonic acid bismuth down payment: rhodium: the ratio of bismuth=1: 0.0001: 0.001, add the uncommon acid resin of poly-methyl-prop and the 3% weight Cellosolve and the 8% weight terpinol equal solvent of Weihai prestige chemical industry company limited production of 20% weight, obtain required hybrid metal slurry after mixing, this gold paste material is coated on the glazing aluminum oxide substrate 1 equably, 810 ℃ of sintering obtain the platinum plating substrate after 30 minutes, repeat print, the gold-plated substrate that sintering obtains thickening; Form needed figure by photoetching, plasma etching, obtain temperature-sensitive gold resistance section 2, printing sintering lead-in wire electrode 3, coating, sintered glass encapsulated layer 4, the laser correction obtains required resistance value, welding platinum filament lead-in wire 5, apply ruggedization under lower temperature glaze 6, reinforce the platinum filament lead-in wire.
In one embodiment of the present of invention, obtaining thickness is 0.8um, and resistance is 100 Ω, and TCR reaches 3380ppm/ ℃, the high-performance gold resistance of time constant＜0.35s.
Embodiment 6
160 ℃ of heating of 38% dutch oil gold that Handan ceramic research is produced 20 minutes, dutch oil rhodium with decomposition product and 4.3%, 5.1% colophonic acid bismuth down payment: rhodium: the ratio of bismuth=1: 0.0003: 0.01, add the uncommon acid resin of poly-methyl-prop and the Cellosolve of 3% weight and the terpinol equal solvent of 6% weight of Weihai prestige chemical industry company limited production of 16%% weight, obtain required hybrid metal slurry after mixing, this gold paste material is coated on the glazing aluminum oxide substrate 1 equably, 850 ℃ of sintering obtain gold-plated substrate after 30 minutes, repeat print, the gold-plated substrate that sintering obtains thickening; Form needed figure by photoetching, plasma etching, obtain temperature-sensitive gold resistance section 2, printing sintering lead-in wire electrode 3, coating, sintered glass encapsulated layer 4, the laser correction obtains required resistance value, electrode in the printing sintering after the scribing, and the coated end tip electrode obtains the chip temperature sensor.
In one embodiment of the present of invention, obtaining thickness is 0.8um, and resistance is 100 Ω, and TCR reaches 3100ppm/ ℃, the high-performance gold resistance of time constant＜0.35s.
Embodiment 7
The following describes the structure of temperature sensitive resister portion, as shown in Figure 5, for improving resistance value, improve the homogeneity of heat distribution, reduce from heat affecting, resistance has made crooked snake type structure.
Embodiment 8
The following describes the other structure example of temperature-sensitive platinum resistance portion, as shown in Figure 6, for improving resistance value, improve the heat distribution homogeneity, reduce self-heating effect, resistance has made the mesh shape or has been lattice structure, homogeneity of electrical resistance height after this structure etching.
Embodiment 9
Fig. 7 is a method for making process flow diagram of the present invention.As shown in Figure 7, the used method of the present invention is first cleaning base plate, after repairing resistance, platinum filament welding, platinum filament reinforcing, measurement through the printing of platinum slurry, sintering, gluing, exposure, phenomenon, etching, electrode printing, electrode sintering, glass printing, glass sintering, laser again, form product.
Fig. 8 is the method for making process flow diagram of prior art.As shown in Figure 8, the used method of prior art is first cleaning base plate, after repairing resistance, platinum filament welding, platinum filament reinforcing, measurement through sputter platinum film, gluing, exposure, phenomenon, etching, electrode printing, electrode sintering, glass printing, glass sintering, laser again, form product.
As mentioned above,, and made crooked snake shape or mesh because the resistance of film resistor temperature sensor of the present invention adopts mixed type platinum slurry or gold paste material to make, so have following effect:
1, rete is thin, and thermal response characteristics is good, is adapted to quick temperature measurement.
2, the reaction of the base metal oxide that contains of rete and substrate forms the firm layer of paying, and adhesion is big, the reliability height.
3, platinum film or golden film form at sintering more than 810 ℃, can at high temperature work.
4, make in conjunction with photoetching technique of conventional thick film technology or thick film, production efficiency height, material consumption are few, and cost is low.
5, mixed type platinum slurry or gold paste material are made simple; Can realize between each composition that molecular level mixes up, temperature coefficient controllability, good reproducibility.
6, sintering temperature is low, and sintering rete even compact need not carry out annealing in process, and technology is simple.
7, mixed type platinum or gold paste material can apply on various complicated shapes, can make the sensor of different shape.
8, platinum film or golden film direct sintering do not need transition metal layer on substrate, and etching technics is simple.
The invention relates to the used film resistor temperature sensor of fast temperature observing and controlling, can be widely used in thermometric, temperature control of space flight, chemical industry, automotive field etc.
Claims (7)
1, a kind of film resistor temperature sensor; it is provided with dielectric substrate; on dielectric substrate, be provided with electrode, the protective seam of sheet resistance, connection resistance; the composition that it is characterized in that sheet resistance is platinum or gold and rhodium oxide; and one or more of the oxide of bismuth, lead, silicon, chromium, copper, boron; its thickness is 0.02um-2um; platinum or gold are controlled at 1: 0.0001～0.02 by weight with rhodium, and one or more of platinum or golden and bismuth, lead, silicon, chromium, copper, boron are controlled between 1: 0.003～0.05 by weight proportion.
2, film resistor temperature sensor according to claim 1 is characterized in that described sheet resistance is crooked snake type or mesh-structured.
3, a kind of method of making film resistor temperature sensor as claimed in claim 1 is characterized in that this method may further comprise the steps:
A:, obtain separating the potpourri that solidfied material, ultra-fine platinum powder or bronze, low-molecular-weight organic matter, ultra-fine carbon dust are formed by the differential of organic platinum or organic gold compound with organo-platinic compounds or organic gold compound 150-190 ℃ heating 15-30 minute; This potpourri is added organic rhodium compound, and add in bismuth organic compound, organo-lead compound, organo-silicon compound, organo-chromium compound, organocopper compound, the organoboron compound one or two or more kinds, platinum or gold and rhodium are controlled at 1: 0.0001～0.02 by weight proportion, one or more of platinum or gold and bismuth, lead, silicon, chromium, copper, boron are controlled between 1: 0.003～0.05 by weight proportion, add resin and solvent simultaneously, form mixed type platinum slurry or gold paste material.
B: above-mentioned mixed type slurry is printed in through on the substrate that cleans, and through oversintering, process electrode making again, protective seam is made, and repaiies the resistance that resistance forms required figure then, measurement, formation product.
4, a kind of method of making film resistor temperature sensor as claimed in claim 1 is characterized in that this method may further comprise the steps:
A: with organo-platinic compounds or organic gold compound 150-190 ℃ heating 15-30 minute, obtain separating solidfied material by the differential of organic platinum or organic gold compound, ultra-fine platinum powder or bronze, low-molecular-weight organic matter, the potpourri that ultra-fine carbon dust is formed, this potpourri is added organic rhodium compound, and interpolation bismuth organic compound, organo-lead compound, organo-silicon compound, organo-chromium compound, organocopper compound, in the organoboron compound one or two or more kinds, platinum or gold and rhodium are controlled at 1: 0.0001～0.02 by weight proportion, gold or platinum and bismuth, plumbous, silicon, chromium, copper, one or more of boron are controlled between 1: 0.003～0.05 by weight proportion, add resin and solvent simultaneously, form mixed type platinum slurry or gold paste material.
B: the method that adopt serigraphy, directly retouch, spraying, roller coat, spin coating, pen is coated with, brushes one of them evenly applies described mixed type slurry on substrate; carry out sintering, photoetching, corrosion then; make through electrode making, protective seam again; repair the resistance back and form the resistance that requires; measure, form product.
5,, it is characterized in that described organo-platinic compounds is one or more of dutch oil platinum, sulfuration terpenes platinum, sulfuration terpinol platinum, mercaptan platinum, sulfuration colophonic acid platinum, sulfuration 2-hexyl hexane acid platinum, sulfuration octyl group acid platinum, sulfuration cycloalkanes platinum, hydrocarbon acid platinum according to the method for claim 3 or 4 described manufacturings film resistor temperature sensor as claimed in claim 1.
6,, it is characterized in that described organic gold compound is one or more of dutch oil gold, sulfuration terpenes gold, sulfuration terpinol gold, mercaptan gold, sulfuration colophonic acid gold, sulfuration 2-hexyl hexane acid gold, sulfuration octyl group acid gold, sulfuration cycloalkanes gold, hydrocarbon acid gold according to the method for claim 3 or 4 described manufacturings film resistor temperature sensor as claimed in claim 1.
7, the method for manufacturing according to claim 6 film resistor temperature sensor as claimed in claim 1 is characterized in that adopting thick-film technique to form described electrode and protective seam.
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| CN110346060B (en) * | 2019-07-19 | 2021-05-14 | 重庆斯太宝科技有限公司 | Manufacturing method of high-stability temperature sensor sensitive chip |
| CN110388992B (en) * | 2019-07-19 | 2021-03-16 | 重庆斯太宝科技有限公司 | High-stability temperature sensor sensitive element |
| RU197211U1 (en) * | 2019-12-19 | 2020-04-13 | Общество с ограниченной ответственностью "АвтоТрейд" | temperature sensor |
| CN112652418B (en) * | 2020-12-04 | 2022-06-21 | 湖南利德电子浆料股份有限公司 | Organic gold conductor slurry and preparation method thereof |
| CN115597736A (en) * | 2022-09-07 | 2023-01-13 | 南京高华科技股份有限公司（Cn） | Quick-response film platinum resistor temperature sensor and preparation method thereof |
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