CN118386057A - Planetary plane grinding machine - Google Patents
Planetary plane grinding machine Download PDFInfo
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- CN118386057A CN118386057A CN202410821324.5A CN202410821324A CN118386057A CN 118386057 A CN118386057 A CN 118386057A CN 202410821324 A CN202410821324 A CN 202410821324A CN 118386057 A CN118386057 A CN 118386057A
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- grinding
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- micro powder
- abrasive
- planetary
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- 239000010432 diamond Substances 0.000 claims abstract description 204
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 204
- 239000000463 material Substances 0.000 claims abstract description 109
- 239000002245 particle Substances 0.000 claims description 102
- 239000000843 powder Substances 0.000 claims description 77
- 230000005540 biological transmission Effects 0.000 claims description 42
- 239000003082 abrasive agent Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000005498 polishing Methods 0.000 description 132
- 239000012050 conventional carrier Substances 0.000 description 31
- 239000006061 abrasive grain Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a planetary plane grinder, which relates to the technical field of grinding and grinding devices and comprises a gear ring, a lower turntable, a sun gear, an upper turntable and two circular diamond grinding pads, wherein the two diamond grinding pads are respectively arranged on two planes opposite to the lower turntable and the upper turntable; the positioning carrier is provided with a plurality of first positioning holes and a plurality of second positioning holes, the first positioning holes are close to the edge of the positioning carrier, the positioning carrier is arranged between two diamond grinding pads, and the positioning carrier rotates around the axis of the sun gear while rotating around the self shaft; the diamond grinding pad comprises a first grinding part, a second grinding part and a third grinding part which are sequentially arranged from inside to outside and are all annular, and the grinding efficiency of the second grinding part is highest. The planetary plane grinder further improves the production efficiency of the planetary plane grinder while ensuring the thickness consistency of a plurality of hard and brittle materials.
Description
Technical Field
The invention relates to the technical field of grinding and grinding devices, in particular to a planetary plane grinding machine.
Background
The thinning step of the brittle and hard materials such as silicon carbide, sapphire, silicon nitride, gallium arsenide and the like generally comprises the steps of wire cutting, rough grinding, fine grinding, polishing and the like. But glass, quartz and other brittle and hard materials used for cover plates and window sheets in consumer electronics and industrial electronics industries also need the steps of rough grinding, thinning, fine grinding, polishing and the like. In the rough grinding and finish grinding steps, a planetary planar grinder including a diamond grinding pad is generally used to grind and thin brittle and hard materials. The diamond grinding pad is a tool for precisely grinding and polishing hard and brittle materials, is provided with a large number of grinding particles, comprises diamond micro powder abrasive materials, and realizes efficient material removal and surface treatment by utilizing the high hardness and high machinability of the diamond micro powder abrasive materials.
When performing the polishing, the operator will place a carrier for positioning and holding a plurality of hard and brittle materials between two diamond polishing pads. The output end of the planetary plane grinder can drive the two diamond grinding pads and the carrier to rotate, so that the two diamond grinding pads can grind the surfaces of a plurality of hard and brittle materials on the carrier, and the grinding thinning of the plurality of hard and brittle materials is realized. In the prior art, in order to ensure the thickness consistency of a plurality of hard and brittle materials which are ground and thinned, a circle of positioning holes for positioning the hard and brittle materials are formed in the area close to the edge of the carrier, so that the area in the center of the carrier is wasted, the carrier cannot position and accommodate more hard and brittle materials, and the quantity of the hard and brittle materials which are ground and thinned at one time by the planetary plane grinder is small, and the production efficiency of the planetary plane grinder is not improved.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides the planetary plane grinder, which can improve the number of the hard and brittle materials thinned by one grinding while ensuring the thickness consistency of a plurality of hard and brittle materials, and is beneficial to improving the production efficiency.
According to an embodiment of the present invention, a planetary type plane grinder includes:
the inner side of the gear ring is provided with a first transmission tooth;
The lower rotary table is arranged in the gear ring, the lower rotary table is in transmission connection with the gear ring so that the gear ring and the lower rotary table can rotate in opposite directions, the sun gear is arranged on the lower rotary table and is coaxial with the lower rotary table, and a second transmission gear is arranged on the outer wall of the sun gear;
the upper turntable is detachably connected to the sun gear, so that the upper turntable can synchronously rotate along with the lower turntable;
two diamond grinding pads in a circular shape, wherein the two diamond grinding pads are respectively arranged on two planes opposite to the lower turntable and the upper turntable;
The positioning carrier is provided with a plurality of first positioning holes and a plurality of second positioning holes at the edge, the first positioning holes are close to the edge of the positioning carrier, the second positioning holes are close to the center of the positioning carrier, the first positioning holes and the second positioning holes are used for accommodating hard and brittle materials, the positioning carrier is arranged between two diamond grinding pads so that a plurality of hard and brittle materials on the positioning carrier are clamped by the two diamond grinding pads, and the third driving teeth are meshed with the first driving teeth and the second driving teeth so that the positioning carrier rotates around the axis of the sun wheel while rotating around the self axis;
The diamond grinding pad comprises a first grinding part, a second grinding part and a third grinding part which are sequentially arranged from inside to outside and are all annular, the first grinding part comprises a plurality of first grinding particles, the first grinding particles comprise first diamond micro powder abrasive materials, the second grinding part comprises a plurality of second grinding particles, the second grinding particles comprise second diamond micro powder abrasive materials, the third grinding part comprises a plurality of third grinding particles, the third grinding particles comprise third diamond micro powder abrasive materials, the grinding efficiency of the second diamond micro powder abrasive materials is greater than that of the first diamond micro powder abrasive materials, and the grinding efficiency of the second diamond micro powder abrasive materials is greater than that of the third diamond micro powder abrasive materials.
Has at least the following beneficial effects:
When the grinding thinning processing is required to be carried out on a plurality of hard and brittle materials, an operator can detach the upper turntable from the sun wheel firstly, and then the plurality of hard and brittle materials to be ground are respectively placed in a plurality of first positioning holes and a plurality of second positioning holes on the positioning carrier. After the hard and brittle materials are placed, an operator can install the upper rotary table on the sun wheel again, the upper rotary table can apply certain ground pressure, and under the action of the upper rotary table, the diamond grinding pad on the lower rotary table and the diamond grinding pad on the lower rotary table can clamp and position the hard and brittle materials on the carrier. And finally, the lower turntable rotates, so that the diamond grinding pad on the lower turntable rotates together with the sun gear, and the upper turntable is connected with the sun gear, so that the upper turntable and the diamond grinding pad on the upper turntable can rotate together with the lower turntable. Because the lower turntable is in transmission connection with the gear ring, the gear ring can rotate along the opposite direction of the lower turntable. Because the third transmission gear on the edge of the positioning carrier is meshed with the first transmission gear on the inner side of the gear ring, and because the third transmission gear on the edge of the positioning carrier is meshed with the second transmission gear on the outer wall of the sun gear, the positioning carrier rotates around the axis of the sun gear while rotating around the self shaft under the drive of the gear ring and the sun gear. At this time, the hard and brittle materials on the positioning carrier and the two diamond grinding pads move relatively, so that the two diamond grinding pads can grind and thin the hard and brittle materials on the positioning carrier.
For convenience of description, the hard and brittle materials in the first positioning holes are defined as hard and brittle materials near the edge of the positioning carrier, and the hard and brittle materials in the second positioning holes are defined as hard and brittle materials near the center of the positioning carrier. The first abrasive particles are close to the inner ring of the diamond grinding pad, the second abrasive particles are positioned at the center of the diamond grinding pad, and the third abrasive particles are close to the outer ring of the diamond grinding pad.
Because the grinding efficiency of the second diamond micro powder abrasive is greater than that of the first diamond micro powder abrasive, and the grinding efficiency of the second diamond micro powder abrasive is greater than that of the third diamond micro powder abrasive, the grinding efficiency of the second grinding particles is greater than that of the first grinding particles, and the grinding efficiency of the second grinding particles is greater than that of the first grinding particles. The plurality of first grinding particles and the plurality of third grinding particles are added for grinding the hard and brittle materials close to the edge of the carrier, and the hard and brittle materials close to the center of the carrier are ground by the plurality of second grinding particles, so that the grinding amount of the hard and brittle materials close to the edge of the carrier is reduced compared with that of the hard and brittle materials close to the center of the carrier, the grinding amount difference between the hard and brittle materials close to the edge of the carrier and the hard and brittle materials close to the center of the carrier is reduced, and the thickness consistency of a plurality of hard and brittle materials ground and thinned by the two diamond grinding pads is ensured.
On the other hand, the middle part of the positioning carrier in the embodiment of the invention is provided with a plurality of second positioning holes, so that the positioning carrier can position and accommodate more hard and brittle materials, the number of the hard and brittle materials thinned by one-time grinding of the planetary plane grinding machine is increased, and the production efficiency of the planetary plane grinding machine is improved. In short, the planetary plane grinder provided by the embodiment of the invention further improves the production efficiency of the planetary plane grinder while ensuring the consistency of the thicknesses of a plurality of hard and brittle materials.
According to the planetary plane grinder, the ring width of the second grinding part is larger than that of the first grinding part, and the ring width of the second grinding part is larger than that of the third grinding part.
According to the planetary plane grinder provided by the embodiment of the invention, the ring width of the first grinding part is larger than that of the third grinding part.
According to the planetary plane grinder provided by the embodiment of the invention, the ratio of the outer circle radius of the diamond grinding pad to the inner circle radius of the diamond grinding pad is 1-3.
According to the planetary plane grinder, the first grinding particles comprise first diamond micro powder abrasive materials with first density, the second grinding particles comprise second diamond micro powder abrasive materials with second density, the third grinding particles comprise third diamond micro powder abrasive materials with third density, and the second density is larger than the first density and the third density.
According to an embodiment of the invention, the third density is smaller than the first density.
According to the planetary type plane grinding machine, the particle size of the second diamond micro powder abrasive is larger than that of the first diamond micro powder abrasive, and the particle size of the second diamond micro powder abrasive is larger than that of the third diamond micro powder abrasive.
According to the planetary plane grinder provided by the embodiment of the invention, the particle size of the first diamond micro powder abrasive is larger than that of the third diamond micro powder abrasive.
According to the planetary plane grinding machine provided by the embodiment of the invention, the upper rotary table is provided with the avoidance hole and the transmission rod, one end of the transmission rod is arranged above the avoidance hole, the outer wall of the sun wheel is provided with the transmission groove, and the sun wheel can be arranged in the avoidance hole in a penetrating way, so that one end of the transmission rod extends into the transmission groove.
According to the planetary plane grinder of the embodiment of the invention, the plurality of first positioning holes are distributed in a central circumferential array of the positioning carrier, and the plurality of second positioning holes are distributed in a central circumferential array of the positioning carrier.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of a conventional diamond polishing pad (for example, a hexagonal design);
FIG. 2 is a schematic view of a partial enlarged structure at A in FIG. 1;
FIG. 3 is a schematic top view of a gear ring, sun gear and conventional carrier in a conventional planetary face grinder;
FIG. 4 is a schematic diagram of a conventional carrier;
FIG. 5 is a schematic diagram of a moving path of points A and B on a conventional carrier during polishing and thinning;
FIG. 6 is a schematic view of a gear ring, sun gear and positioning carrier in a planetary face grinder according to an embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view of a planetary flat grinder according to an embodiment of the present invention;
FIG. 8 is a schematic top view of a sun gear and upper turntable of a planetary flat grinder according to an embodiment of the present invention;
FIG. 9 is a schematic view of a positioning carrier and diamond polishing pad in a planetary flat grinder according to an embodiment of the present invention;
FIG. 10 is a schematic view of a diamond polishing pad in a planetary flat grinder according to an embodiment of the present invention;
FIG. 11 is a schematic view of a partially enlarged structure at B in FIG. 10;
FIG. 12 is a schematic view of an exploded view of a diamond polishing pad in a planetary flat grinder according to an embodiment of the present invention;
FIG. 13 is a schematic cross-sectional view of a diamond polishing pad according to a first embodiment of the present invention;
FIG. 14 is a schematic cross-sectional view of a diamond polishing pad according to a second embodiment of the present invention;
reference numerals:
a lower turntable 100; a sun gear 110; a second gear 111; a transmission groove 112;
an upper turntable 200; a relief hole 210; a transmission rod 220;
Ring gear 300; a first gear 310;
positioning carrier 400; a first positioning hole 410; a second positioning hole 420; third gear 430;
A diamond polishing pad 500; a first polishing section 510; first abrasive particles 511; a first diamond micropowder abrasive 512; a second polishing section 520; second abrasive particles 521; a second diamond micropowder abrasive 522; a third polishing section 530; third abrasive particles 531; a third diamond micro powder abrasive 532; a substrate 540.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
It should be further explained that, referring to fig. 1 to 4, the conventional planetary type plane grinder includes a ring gear 300, a lower turntable 100, a sun gear 110, an upper turntable 200, a conventional carrier, and two conventional diamond grinding pads. The sun gear 110 is disposed on the lower turntable 100, and a ring of external teeth is provided at an edge of the sun gear 110. The conventional diamond polishing pad (hatched portion in fig. 3) is ring-shaped, and is attached to the lower turntable 100 and the upper turntable 200, respectively, by being sleeved on the sun gear 110. The conventional carrier is a positioning carrier 400 for positioning and accommodating a plurality of hard and brittle materials, a circle of positioning holes are formed in the area, close to the edge, of the conventional carrier, and the plurality of hard and brittle materials to be ground are respectively placed in the plurality of positioning holes. A ring of external teeth is provided on the outer edge of the conventional carrier, which is placed on the conventional diamond grinding pad on the lower turntable 100, and the external teeth on the edge of the conventional carrier are engaged with the internal teeth of the ring gear 300, and the external teeth on the edge of the conventional carrier are engaged with the external teeth on the edge of the sun gear 110. Then the upper turntable 200 is pressed down so that the conventional diamond polishing pad on the lower turntable 100 is pressed against the lower surfaces of the plurality of hard and brittle materials on the conventional carrier, so that the conventional diamond polishing pad on the upper turntable 200 is pressed against the upper surfaces of the plurality of hard and brittle materials on the conventional carrier, that is, the conventional diamond polishing pad on the upper turntable 200 is used for grinding the upper surfaces of the plurality of hard and brittle materials, and the conventional diamond polishing pad on the lower turntable 100 is used for grinding the lower surfaces of the plurality of hard and brittle materials. The outer arrow in the drawing is the rotation direction of ring gear 300, and the inner arrow in fig. 3 is the rotation direction of sun gear 110, lower turntable 100, upper turntable 200, and conventional diamond polishing pad.
After the conventional planetary type plane grinder is started, the lower turntable 100, the upper turntable 200 and the sun gear 110 are rotated together, and the ring gear 300 is rotated in the reverse direction of the sun gear 110. The lower turntable 100 and the lower turntable 100 can respectively drive the corresponding traditional diamond grinding pad to rotate around the axis of the sun gear 110, and because the traditional carrier is meshed with the gear ring 300 and the sun gear 110, the traditional carrier rotates around the self axis while rotating along the sun gear 110 under the drive of the gear ring 300 and the sun gear 110, so that the traditional diamond grinding pad can generate relative motion with a plurality of hard and brittle materials on the traditional carrier, and further the traditional diamond grinding pad can grind the plurality of hard and brittle materials to finish grinding and thinning of the plurality of hard and brittle materials.
Referring to fig. 3 to 5, for convenience of explanation, a point a in fig. 4 is a center point of the conventional carrier, a point B in fig. 4 is any point on the conventional carrier near an edge of the conventional carrier, and a hatched portion in fig. 5 is a conventional diamond polishing pad. Since the conventional carrier rotates around the sun gear 110 axis and also rotates around the own axis, the locus of the point a is shown as a broken line in fig. 5, and the locus of the point B is shown as a solid line in fig. 5. It can be seen that the path of point B near the edge of the conventional carrier is longer and more complex, while the path of point a near the center of the conventional carrier is shorter and simpler, which results in the path of points nearer the edge of the conventional carrier being longer and more complex, while the path of points nearer the center of the conventional carrier is shorter and simpler. Further, the point B near the edge of the conventional carrier moves back and forth between the outer ring and the inner ring of the conventional diamond polishing pad, while the point a near the center of the conventional carrier is concentrated in the center of the conventional diamond polishing pad, in other words, the abrasive particles near the outer ring and the inner ring of the conventional diamond polishing pad are used to polish more of the hard and brittle material near the edge of the conventional carrier, while another part of the hard and brittle material near the center of the conventional carrier is polished more by the abrasive particles near the center of the conventional diamond polishing pad. The grinding efficiency of the diamond micro powder abrasive contained by the grinding particles on the traditional diamond grinding pad is consistent, namely the grinding efficiency of the grinding particles on the traditional diamond grinding pad on a plurality of hard and brittle materials is consistent.
When it is to be explained herein, the grinding efficiency of the diamond micro powder abrasive means the amount of material that the diamond micro powder abrasive can grind and remove per unit time. The larger the grinding efficiency of the diamond micro powder abrasive is, the more materials on the hard and brittle materials can be ground and removed by the diamond micro powder abrasive in unit time, namely the larger the grinding amount of the hard and brittle materials is; the smaller the grinding efficiency of the diamond micro powder abrasive, the less the diamond micro powder abrasive can grind and remove the material on the hard and brittle material in unit time, namely the less the grinding amount of the hard and brittle material. The amount of grinding herein refers to how much of the hard brittle material is removed.
It will be appreciated that, assuming that the center of the conventional carrier is also provided with a plurality of locating holes for locating and receiving a plurality of hard and brittle materials, this enables both the edge and the center of the conventional carrier to be located and received with a plurality of hard and brittle materials, which may cause a portion of the hard and brittle materials to be located near the edge of the conventional carrier and another portion of the hard and brittle materials to be located near the center of the conventional carrier. When the conventional carrier rotates along the sun gear 110 and rotates around its own axis, the relative movement distance between the hard and brittle materials partially near the edge of the conventional carrier and the conventional diamond polishing pad is longer, the relative movement distance between the hard and brittle materials partially near the center of the conventional carrier and the conventional diamond polishing pad is shorter, the linear velocity of the outer ring of the conventional diamond polishing pad is higher, the polishing amount of the hard and brittle materials partially having a longer moving path is further greater than that of the hard and brittle materials partially having a shorter moving path, the polishing amount difference between the hard and brittle materials partially is increased, the thickness difference between the hard and brittle materials partially polished is larger, and the consistency of the hard and brittle materials cannot be ensured. Therefore, in the prior art, in order to ensure the consistency of the thickness of the polished and thinned hard and brittle materials, only one circle of positioning holes are formed in the edge area of the conventional carrier.
Referring to fig. 6, 10 to 12, a diamond polishing pad 500 is hatched in fig. 6, and a planetary type plane grinder according to an embodiment of the present invention includes:
ring gear 300, the inside of ring gear 300 is provided with first drive teeth 310;
The lower turntable 100 is arranged in the gear ring 300, the lower turntable 100 is in transmission connection with the gear ring 300 so that the gear ring 300 and the lower turntable 100 can rotate in opposite directions, the sun gear 110 is arranged on the lower turntable 100 and is coaxial with the lower turntable 100, and a second transmission gear 111 is arranged on the outer wall of the sun gear 110;
An upper turntable 200, the upper turntable 200 being detachably connected to the sun gear 110 so that the upper turntable 200 can rotate synchronously with the lower turntable 100;
Two diamond grinding pads 500 in a circular ring shape, wherein the two diamond grinding pads 500 are respectively arranged on two opposite planes of the lower turntable 100 and the upper turntable 200;
The positioning carrier 400 is provided with a third transmission gear 430 at the edge of the positioning carrier 400, a plurality of first positioning holes 410 and a plurality of second positioning holes 420 are formed in the positioning carrier 400, the first positioning holes 410 are close to the edge of the positioning carrier 400, the second positioning holes 420 are close to the center of the positioning carrier 400, the first positioning holes 410 and the second positioning holes 420 are used for containing hard and brittle materials, the positioning carrier 400 is arranged between two diamond grinding pads 500, so that a plurality of hard and brittle materials on the positioning carrier 400 are clamped by the two diamond grinding pads 500, and the third transmission gear 430 is meshed with the first transmission gear 310 and the second transmission gear 111, so that the positioning carrier 400 rotates around the axis of the sun gear 110 while rotating around the self axis;
The diamond polishing pad 500 comprises a first polishing portion 510, a second polishing portion 520 and a third polishing portion 530 which are sequentially arranged from inside to outside and are all annular, wherein the first polishing portion 510 comprises a plurality of first polishing particles 511, the first polishing particles 511 comprise first diamond micro powder abrasive 512, the second polishing portion 520 comprises a plurality of second polishing particles 521, the second polishing particles 521 comprise second diamond micro powder abrasive 522, the third polishing portion 530 comprises a plurality of third polishing particles 531, the third polishing particles 531 comprise third diamond micro powder abrasive 532, the polishing efficiency of the second diamond micro powder abrasive 522 is greater than that of the first diamond micro powder abrasive 512, and the polishing efficiency of the second diamond micro powder abrasive 522 is greater than that of the third diamond micro powder abrasive 532.
It can be appreciated that when the grinding and thinning process is required for the plurality of hard and brittle materials, an operator can detach the upper turntable 200 from the sun gear 110 first, and then place the plurality of hard and brittle materials to be ground into the plurality of first positioning holes 410 and the plurality of second positioning holes 420 on the positioning carrier 400 respectively. After the placement of the plurality of hard and brittle materials is completed, an operator can reinstall the upper turntable 200 on the sun gear 110, and under the action of the upper turntable 200, the diamond polishing pad 500 on the lower turntable 100 and the diamond polishing pad 500 on the lower turntable 100 can clamp and position the plurality of hard and brittle materials on the carrier 400. Finally, the lower turntable 100 rotates, so that the diamond polishing pad 500 on the lower turntable 100 rotates together with the sun gear 110, and the upper turntable 200 and the diamond polishing pad 500 on the upper turntable 200 can rotate together with the lower turntable 100 because the upper turntable 200 is connected with the sun gear 110. Since the lower turntable 100 is in driving connection with the ring gear 300, the ring gear 300 rotates in the opposite direction of the lower turntable 100. Because the third gear 430 on the edge of the positioning carrier 400 is engaged with the first gear 310 on the inner side of the ring gear 300, and because the third gear 430 on the edge of the positioning carrier 400 is engaged with the second gear 111 on the outer wall of the sun gear 110, the positioning carrier 400 rotates around the axis of the sun gear 110 while rotating around its own axis under the drive of the ring gear 300 and the sun gear 110. At this time, the hard and brittle materials on the positioning carrier 400 will move relative to the two diamond polishing pads 500, so that the two diamond polishing pads can polish and thin the hard and brittle materials on the positioning carrier 400.
For convenience of description, the hard and brittle materials in the first positioning holes 410 are defined as hard and brittle materials near the edges of the positioning carrier 400, and the hard and brittle materials in the second positioning holes 420 are defined as hard and brittle materials near the center of the positioning carrier 400. The diamond polishing pad 500 includes a first polishing portion 510, a second polishing portion 520, and a third polishing portion 530, which are all in a ring shape, sequentially disposed from inside to outside, that is, a plurality of first polishing particles 511 are near an inner ring of the diamond polishing pad 500, a plurality of second polishing particles 521 are at a center of the diamond polishing pad 500, and a plurality of third polishing particles 531 are near an outer ring of the diamond polishing pad 500.
Since the grinding efficiency of the second diamond micro powder abrasive 522 is greater than that of the first diamond micro powder abrasive 512, and the grinding efficiency of the second diamond micro powder abrasive 522 is greater than that of the third diamond micro powder abrasive 532, that is, the grinding efficiency of the second abrasive grains 521 is greater than that of the first abrasive grains 511. Additionally, as described above, the first polishing particles 511 and the third polishing particles 531 are more used for polishing the portion of the hard and brittle material near the edge of the carrier, and the other portion of the hard and brittle material near the center of the carrier is more polished by the second polishing particles 521, so that the polishing amount of the hard and brittle material near the edge of the carrier is reduced compared with that near the center of the carrier, the polishing amount difference between the hard and brittle material near the edge of the carrier and the hard and brittle material near the center of the carrier is reduced, and the consistency of the thickness of the polished multiple pieces of the hard and brittle materials by the two diamond polishing pads 500 is ensured.
On the other hand, the middle part of the positioning carrier 400 in the embodiment of the invention is provided with a plurality of second positioning holes 420, so that the positioning carrier 400 can position and accommodate more hard and brittle materials, the number of the hard and brittle materials thinned by one-time grinding of the planetary plane grinding machine is increased, and the production efficiency of the planetary plane grinding machine is improved. In short, the planetary plane grinder provided by the embodiment of the invention further improves the production efficiency of the planetary plane grinder while ensuring the consistency of the thicknesses of a plurality of hard and brittle materials.
In the embodiment of the present invention, the number of the positioning carriers 400 is plural, that is, a plurality of positioning carriers 400 can be simultaneously placed on the diamond polishing pad 500 on the lower turntable 100, so that two diamond polishing pads 500 can simultaneously polish a plurality of hard and brittle materials on a plurality of positioning carriers 400. The two diamond polishing pads 500 are all in a ring shape, and the sun gear 110 is arranged in the through holes on the two diamond polishing pads 500 in a penetrating way in the polishing process. The diamond polishing pad 500 further includes a substrate 540, wherein the substrate 540 is in a ring shape, and the first polishing portion 510, the second polishing portion 520, and the third polishing portion 530 are sequentially bonded to the substrate 540 from inside to outside. The back surface of the substrate 540 away from the first polishing part 510 is further provided with an adhesive layer, and the substrate 540 is adhered to the upper turntable 200 and the lower turntable 100 through the adhesive layer.
Referring to fig. 7 and 8, the upper turntable 200 is provided with a avoidance hole 210 and a transmission rod 220, one end of the transmission rod 220 is arranged above the avoidance hole 210, the outer wall of the sun gear 110 is provided with a transmission groove 112, and the sun gear 110 can be arranged in the avoidance hole 210 in a penetrating manner, so that one end of the power transmission rod extends into the transmission groove 112. It will be appreciated that when an operator needs to install the upper turntable 200 on the sun gear 110, the operator only needs to align the avoidance hole 210 on the upper turntable 200 with the sun gear 110, then pass the sun gear 110 through the avoidance hole 210, and extend one end of the transmission rod 220 into the transmission groove 112 on the sun gear 110. Under the self-gravity of the upper turntable 200, the two diamond grinding pads 500 can clamp and squeeze a plurality of hard and brittle materials on the carrier 400. When the lower turntable 100 drives the sun gear 110 to rotate, the inner wall of the transmission groove 112 on the sun gear 110 can drive the transmission rod 220 to rotate, so that the transmission rod 220 drives the upper turntable 200 to rotate. When the upper turntable 200 needs to be disassembled, an operator only needs to lift the upper turntable 200 upwards, so that the upper turntable 200 is far away from the lower turntable 100, and the sun gear 110 is pulled out from the avoidance hole 210.
In an embodiment of the invention, the planetary plane mill further comprises a rotation driving device, a transmission gear device, a grinding fluid supply device and a lifting device. The rotary driving device is used for driving the lower turntable 100 to rotate, and the transmission gear set is used for enabling the lower turntable 100 to be in transmission connection with the gear ring 300, so that the lower turntable 100 and the gear ring 300 rotate in opposite directions. The polishing liquid supply device is used to spray the polishing liquid between the two diamond polishing pads 500. The lifting means is used to remove the upper turntable 200 from the lower turntable 100. The several devices described above are common devices in planetary face grinders and will not be further explained here.
Referring to fig. 6 and 9, the plurality of first positioning holes 410 are each distributed in a central circumferential array of the positioning carrier 400, and the plurality of second positioning holes 420 are distributed in a central circumferential array of the positioning carrier 400. It will be appreciated that the plurality of first positioning holes 410 and the plurality of second positioning holes 420 are all circumferentially arrayed, such that the two diamond polishing pads 500 can more uniformly polish a plurality of hard and brittle materials.
Referring to fig. 9 to 12, the second grinding part 520 has a larger ring width than the first grinding part 510, and the second grinding part 520 has a larger ring width than the third grinding part 530. Specifically, the ring width of the first polishing portion 510 is greater than the ring width of the third polishing portion 530.
It is understood that the second grinding portion 520 has the largest ring width, the first grinding portion 510 has the largest ring width, and the third grinding portion 530 has the smallest ring width. Since the second polishing portion 520 is located in the middle of the diamond polishing pad 500, the rotational linear velocity of the plurality of second polishing particles 521 in the second polishing portion 520 is relatively uniform, that is, the polishing efficiency of the plurality of second polishing particles 521 is relatively uniform, and the ring width of the second polishing portion 520 is the largest, which enables the plurality of hard and brittle materials on the positioning carrier 400 to be polished by the plurality of second polishing particles 521 in the second polishing portion 520 more frequently. Since the third polishing portion 530 is close to the outer ring of the diamond polishing pad 500, the rotational linear velocity of the plurality of third polishing particles 531 in the third polishing portion 530 is the maximum, that is, the polishing efficiency of the plurality of third polishing particles 531 is the highest, and the ring width of the third polishing portion 530 is the minimum, so that the plurality of hard and brittle materials on the positioning carrier 400 are not frequently polished by the plurality of third polishing particles 531 of the third polishing portion 530.
Since the first polishing portion 510 is close to the inner ring of the diamond polishing pad 500, the rotational linear velocity of the plurality of first polishing particles 511 in the first polishing portion 510 is the smallest, that is, the polishing efficiency of the plurality of first polishing particles 511 is the lowest, and the ring width of the first polishing portion 510 is smaller than that of the second polishing portion 520, so that the plurality of hard and brittle materials on the positioning carrier 400 are not frequently polished by the plurality of first polishing particles 511 in the first polishing portion 510. In the process of grinding and thinning, the plurality of hard and brittle materials can be ground by the plurality of second grinding particles 521 in the second grinding part 520 more frequently, so that the plurality of hard and brittle materials are prevented from being in the area with larger or smaller grinding speed for a long time, and the thickness consistency of the grinding and thinning process is improved.
Preferably, the ring width of the first polishing part 510 is 30% of the ring width of the diamond polishing pad 500, the ring width of the second polishing part 520 is 55% of the ring width of the diamond polishing pad 500, and the ring width of the third polishing part 530 is 15% of the ring width of the diamond polishing pad 500. As an embodiment of the present invention, referring to fig. 9, the plurality of second positioning holes 420 are all disposed in the area of the second polishing portion 520, that is, the plurality of hard and brittle materials in the plurality of second positioning holes 420 are clamped by the second polishing portions 520 on the two diamond polishing pads 500, that is, the hard and brittle materials in the plurality of second positioning holes 420 can only be polished by the plurality of second polishing particles 521 on the second polishing portions 520, so as to further reduce the polishing amount difference between the hard and brittle materials near the edge of the carrier and the hard and brittle materials near the center of the carrier.
In the embodiment of the present invention, the ratio of the outer radius of the diamond polishing pad 500 to the inner radius of the diamond polishing pad 500 is 1-3. It can be understood that the ratio of the outer ring radius to the inner ring radius of the diamond polishing pad 500 is 1-3, and in this ratio interval, the excessive difference between the rotational linear speeds of the outer ring and the inner ring of the diamond polishing pad 500 can be avoided, which is beneficial to improving the thickness consistency of the polishing and thinning process. Preferably, the ratio of the outer radius to the inner radius of the diamond polishing pad 500 is 2.5.
Example 1
As an example of the first aspect of the invention, referring to fig. 13, the first abrasive particles 511 comprise a first diamond micro powder abrasive 512 having a first density, the second abrasive particles 521 comprise a second diamond micro powder abrasive 522 having a second density, and the third abrasive particles 531 comprise a third diamond micro powder abrasive 532 having a third density, the second density being greater than the first density and the third density.
It should be noted that, in the embodiment of the first aspect of the present invention, the diamond micro powder abrasive is a powder abrasive composed of a large number of diamond abrasive particles. The density refers to the amount of diamond powder abrasive contained in the abrasive grains per unit volume or unit mass, and the larger the density is, the more diamond powder abrasive in the abrasive grains is represented, that is, the more diamond abrasive grains in the abrasive grains are represented. Referring to fig. 13, in the first aspect of the embodiment of the present invention, the volumes and shapes of the first abrasive grains 511, the second abrasive grains 521, and the third abrasive grains 531 are the same, and the first diamond micro abrasive 512, the second diamond micro abrasive 522, and the third diamond micro abrasive 532 are the same abrasive. Specifically, the first density refers to the amount of the first diamond micro abrasive 512 contained in the first abrasive grains 511, the second density refers to the amount of the second diamond micro abrasive 522 contained in the second abrasive grains 521, and the third density refers to the amount of the third diamond micro abrasive 532 contained in the third abrasive grains 531.
The second diamond micro powder abrasive 522 in the second abrasive grains 521 has the maximum density, so that more second diamond micro powder abrasive 522 participates in cutting and grinding in the grinding process of the second abrasive grains 521, that is, the grinding efficiency of the second diamond micro powder abrasive 522 is increased, thereby improving the grinding efficiency of the second abrasive grains 521. Therefore, the grinding efficiency of the second grinding particles 521 is higher than the grinding efficiency of the first grinding particles 511 and the third grinding particles 531.
As an example of the first aspect of the present invention, the first abrasive particles 511 comprise a first diamond micro powder abrasive 512 having a first density, the second abrasive particles 521 comprise a second diamond micro powder abrasive 522 having a second density, and the third abrasive particles 531 comprise a third diamond micro powder abrasive 532 having a third density, the second density being greater than the first density and the third density. The third density is less than the first density.
It will be appreciated that the second density is less than the first density and the third density, and that the third density is less than the first density, which minimizes the third density. By minimizing the third density of the third diamond micro abrasive 532 in the third abrasive particles 531 in the third grinding section 530, the grinding efficiency of the third abrasive particles 531 with the largest rotation line speed can be further reduced, which is advantageous for shortening the difference in grinding amount between the hard and brittle material near the edge of the carrier and the hard and brittle material near the center of the carrier, and for improving the thickness consistency of the grinding and thinning process. Preferably, the first density is 98% of the second density and the third density is 95% of the second density.
Example two
As an embodiment of the second aspect of the invention, referring to fig. 14, the particle size of the second diamond micro powder abrasive 522 is larger than the particle size of the first diamond micro powder abrasive 512, and the particle size of the second diamond micro powder abrasive 522 is larger than the particle size of the third diamond micro powder abrasive 532. The first diamond micro abrasive 512 has a particle size greater than that of the third diamond micro abrasive 532. It should be noted that, in the embodiment of the first aspect of the present invention, the diamond micro powder abrasive is a powder abrasive composed of a large number of diamond abrasive particles, and the particle size of the diamond micro powder abrasive refers to the median of the particle sizes of the large number of diamond abrasive particles. In the second aspect of the embodiment of the present invention, the volumes and shapes of the first abrasive particles 511, the second abrasive particles 521, and the third abrasive particles 531 are all the same.
It will be appreciated that this allows the second diamond grit abrasive 522 to have a larger cutting edge due to the maximum particle size of the second diamond grit abrasive 522, thereby allowing the second diamond grit abrasive 522 to remove more material in a single cut. Therefore, the grinding efficiency of the second diamond micro abrasive 522 is higher than the grinding efficiency of the first diamond micro abrasive 512 and the third diamond micro abrasive 532.
It will be appreciated that by minimizing the particle size of the third diamond micro abrasive 532 in the third abrasive particles 531 in the third grinding section 530, the grinding efficiency of the third abrasive particles 531 with the largest rotation line speed can be further reduced, which is advantageous for shortening the difference between the grinding amounts of the hard and brittle material near the edge of the carrier and the hard and brittle material near the center of the carrier, and for improving the thickness uniformity of the grinding and thinning process. In a first preferred embodiment, the first diamond micro abrasive 512 has a particle size of 3.8 microns, the second diamond micro abrasive 522 has a particle size of 4 microns, and the third diamond micro abrasive 532 has a particle size of 3.5 microns. In a second preferred embodiment, the first diamond micro abrasive 512 has a particle size of 8.4 microns, the second diamond micro abrasive 522 has a particle size of 9 microns, and the third diamond micro abrasive 532 has a particle size of 8 microns. In a third preferred embodiment, the first diamond grit abrasive 512 has a particle size of 19 microns, the second diamond grit abrasive 522 has a particle size of 20 microns, and the third diamond grit abrasive 532 has a particle size of 18 microns.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
Of course, the present application is not limited to the above-described embodiments, and those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of the present application, and these equivalent modifications or substitutions are included in the scope of the present application as defined in the appended claims.
Claims (10)
1. A planetary face grinder, comprising:
the inner side of the gear ring is provided with a first transmission tooth;
The lower rotary table is arranged in the gear ring, the lower rotary table is in transmission connection with the gear ring so that the gear ring and the lower rotary table can rotate in opposite directions, the sun gear is arranged on the lower rotary table and is coaxial with the lower rotary table, and a second transmission gear is arranged on the outer wall of the sun gear;
the upper turntable is detachably connected to the sun gear, so that the upper turntable can synchronously rotate along with the lower turntable;
two diamond grinding pads in a circular shape, wherein the two diamond grinding pads are respectively arranged on two planes opposite to the lower turntable and the upper turntable;
The positioning carrier is provided with a plurality of first positioning holes and a plurality of second positioning holes at the edge, the first positioning holes are close to the edge of the positioning carrier, the second positioning holes are close to the center of the positioning carrier, the first positioning holes and the second positioning holes are used for accommodating hard and brittle materials, the positioning carrier is arranged between two diamond grinding pads so that a plurality of hard and brittle materials on the positioning carrier are clamped by the two diamond grinding pads, and the third driving teeth are meshed with the first driving teeth and the second driving teeth so that the positioning carrier rotates around the axis of the sun wheel while rotating around the self axis;
The diamond grinding pad comprises a first grinding part, a second grinding part and a third grinding part which are sequentially arranged from inside to outside and are all annular, the first grinding part comprises a plurality of first grinding particles, the first grinding particles comprise first diamond micro powder abrasive materials, the second grinding part comprises a plurality of second grinding particles, the second grinding particles comprise second diamond micro powder abrasive materials, the third grinding part comprises a plurality of third grinding particles, the third grinding particles comprise third diamond micro powder abrasive materials, the grinding efficiency of the second diamond micro powder abrasive materials is greater than that of the first diamond micro powder abrasive materials, and the grinding efficiency of the second diamond micro powder abrasive materials is greater than that of the third diamond micro powder abrasive materials.
2. The planetary face grinder as claimed in claim 1, wherein: the ring width of the second grinding part is larger than that of the first grinding part, and the ring width of the second grinding part is larger than that of the third grinding part.
3. The planetary face grinder as claimed in claim 2, wherein: the annular width of the first grinding part is larger than that of the third grinding part.
4. The planetary face grinder as claimed in claim 1, wherein: the ratio of the outer ring radius of the diamond grinding pad to the inner ring radius of the diamond grinding pad is 1-3.
5. The planetary face grinder as claimed in claim 1, wherein: the first abrasive particles comprise a first diamond micro powder abrasive of a first density, the second abrasive particles comprise a second diamond micro powder abrasive of a second density, the third abrasive particles comprise a third diamond micro powder abrasive of a third density, and the second density is greater than the first density and the third density.
6. The planetary face grinder of claim 5, wherein: the third density is less than the first density.
7. The planetary face grinder as claimed in claim 1, wherein: the particle size of the second diamond micro powder abrasive is larger than that of the first diamond micro powder abrasive, and the particle size of the second diamond micro powder abrasive is larger than that of the third diamond micro powder abrasive.
8. The planetary face grinder as claimed in claim 7, wherein: the particle size of the first diamond micro powder abrasive is larger than that of the third diamond micro powder abrasive.
9. The planetary face grinder as claimed in claim 1, wherein: the upper turntable is provided with an avoidance hole and a transmission rod, one end of the transmission rod is arranged above the avoidance hole, a transmission groove is formed in the outer wall of the sun gear, and the sun gear can penetrate through the avoidance hole so that one end of the transmission rod extends into the transmission groove.
10. The planetary face grinder as claimed in claim 1, wherein: the first positioning holes are distributed in a central circumferential array of the positioning carrier, and the second positioning holes are distributed in a central circumferential array of the positioning carrier.
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| CN202410821324.5A CN118386057B (en) | 2024-06-24 | 2024-06-24 | Planetary plane grinding machine |
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| CN202410821324.5A CN118386057B (en) | 2024-06-24 | 2024-06-24 | Planetary plane grinding machine |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100099991A (en) * | 2009-03-04 | 2010-09-15 | 주식회사 실트론 | Carrier for double side polishing apparatus and double side polishing method using the same |
| CN102658528A (en) * | 2012-02-24 | 2012-09-12 | 浙江工业大学 | Graded structured composite elastic grinding and polishing disc |
| CN209349982U (en) * | 2018-12-19 | 2019-09-06 | 上海骥铭机械设备有限公司 | A kind of lapping using star lapping machine wheel |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100099991A (en) * | 2009-03-04 | 2010-09-15 | 주식회사 실트론 | Carrier for double side polishing apparatus and double side polishing method using the same |
| CN102658528A (en) * | 2012-02-24 | 2012-09-12 | 浙江工业大学 | Graded structured composite elastic grinding and polishing disc |
| CN209349982U (en) * | 2018-12-19 | 2019-09-06 | 上海骥铭机械设备有限公司 | A kind of lapping using star lapping machine wheel |
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