CN118360001A - Adhesive tape - Google Patents
Adhesive tape Download PDFInfo
- Publication number
- CN118360001A CN118360001A CN202310079968.7A CN202310079968A CN118360001A CN 118360001 A CN118360001 A CN 118360001A CN 202310079968 A CN202310079968 A CN 202310079968A CN 118360001 A CN118360001 A CN 118360001A
- Authority
- CN
- China
- Prior art keywords
- adhesive
- monomers
- weight
- adhesive tape
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 60
- 239000000853 adhesive Substances 0.000 claims abstract description 71
- 230000001070 adhesive effect Effects 0.000 claims abstract description 70
- 239000012790 adhesive layer Substances 0.000 claims abstract description 69
- 239000010410 layer Substances 0.000 claims abstract description 31
- 239000000178 monomer Substances 0.000 claims description 139
- 229920005601 base polymer Polymers 0.000 claims description 49
- 239000003431 cross linking reagent Substances 0.000 claims description 30
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 27
- 239000012948 isocyanate Substances 0.000 claims description 20
- 150000002513 isocyanates Chemical class 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 20
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 18
- 239000004593 Epoxy Substances 0.000 claims description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 10
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 claims description 3
- 150000008064 anhydrides Chemical class 0.000 claims 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 73
- -1 alkyl methacrylate Chemical compound 0.000 description 38
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- 238000000034 method Methods 0.000 description 21
- 239000000203 mixture Substances 0.000 description 20
- 238000012360 testing method Methods 0.000 description 20
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 18
- 229920000058 polyacrylate Polymers 0.000 description 18
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 11
- 238000001035 drying Methods 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000005056 polyisocyanate Substances 0.000 description 8
- 229920001228 polyisocyanate Polymers 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 239000004696 Poly ether ether ketone Substances 0.000 description 7
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 229920002530 polyetherether ketone Polymers 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000003505 polymerization initiator Substances 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 6
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 238000005470 impregnation Methods 0.000 description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000004814 polyurethane Substances 0.000 description 5
- 229920002635 polyurethane Polymers 0.000 description 5
- FKAWETHEYBZGSR-UHFFFAOYSA-N 3-methylidenepyrrolidine-2,5-dione Chemical compound C=C1CC(=O)NC1=O FKAWETHEYBZGSR-UHFFFAOYSA-N 0.000 description 4
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical class CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 239000013638 trimer Substances 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 238000004220 aggregation Methods 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000009863 impact test Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- HASUCEDGKYJBDC-UHFFFAOYSA-N 1-[3-[[bis(oxiran-2-ylmethyl)amino]methyl]cyclohexyl]-n,n-bis(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC1CC(CN(CC2OC2)CC2OC2)CCC1)CC1CO1 HASUCEDGKYJBDC-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical class CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000003926 acrylamides Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 125000004103 aminoalkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical group O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- AURYLBASVGNSON-UHFFFAOYSA-N (2,5-dioxopyrrolidin-3-ylidene)methyl prop-2-enoate Chemical compound C=CC(=O)OC=C1CC(=O)NC1=O AURYLBASVGNSON-UHFFFAOYSA-N 0.000 description 1
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical class O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
- 239000005059 1,4-Cyclohexyldiisocyanate Substances 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- SIZPGZFVROGOIR-UHFFFAOYSA-N 1,4-diisocyanatonaphthalene Chemical compound C1=CC=C2C(N=C=O)=CC=C(N=C=O)C2=C1 SIZPGZFVROGOIR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- HXQKJEIGFRLGIH-UHFFFAOYSA-N 1-ethenyl-2h-pyrazine Chemical compound C=CN1CC=NC=C1 HXQKJEIGFRLGIH-UHFFFAOYSA-N 0.000 description 1
- OZFIGURLAJSLIR-UHFFFAOYSA-N 1-ethenyl-2h-pyridine Chemical compound C=CN1CC=CC=C1 OZFIGURLAJSLIR-UHFFFAOYSA-N 0.000 description 1
- LNKDTZRRFHHCCV-UHFFFAOYSA-N 1-ethenyl-2h-pyrimidine Chemical compound C=CN1CN=CC=C1 LNKDTZRRFHHCCV-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- DCRYNQTXGUTACA-UHFFFAOYSA-N 1-ethenylpiperazine Chemical compound C=CN1CCNCC1 DCRYNQTXGUTACA-UHFFFAOYSA-N 0.000 description 1
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical compound C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 description 1
- NWHSSMRWECHZEP-UHFFFAOYSA-N 1-ethenylpyrazole Chemical compound C=CN1C=CC=N1 NWHSSMRWECHZEP-UHFFFAOYSA-N 0.000 description 1
- CTXUTPWZJZHRJC-UHFFFAOYSA-N 1-ethenylpyrrole Chemical compound C=CN1C=CC=C1 CTXUTPWZJZHRJC-UHFFFAOYSA-N 0.000 description 1
- DTZHXCBUWSTOPO-UHFFFAOYSA-N 1-isocyanato-4-[(4-isocyanato-3-methylphenyl)methyl]-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(CC=2C=C(C)C(N=C=O)=CC=2)=C1 DTZHXCBUWSTOPO-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- RESPXSHDJQUNTN-UHFFFAOYSA-N 1-piperidin-1-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCCCC1 RESPXSHDJQUNTN-UHFFFAOYSA-N 0.000 description 1
- DGPVNNMFVYYVDF-UHFFFAOYSA-N 1-prop-2-enoylpyrrolidin-2-one Chemical compound C=CC(=O)N1CCCC1=O DGPVNNMFVYYVDF-UHFFFAOYSA-N 0.000 description 1
- NQDOCLXQTQYUDH-UHFFFAOYSA-N 1-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)N1C(=O)C=CC1=O NQDOCLXQTQYUDH-UHFFFAOYSA-N 0.000 description 1
- WLPAQAXAZQUXBG-UHFFFAOYSA-N 1-pyrrolidin-1-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCCC1 WLPAQAXAZQUXBG-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- CQJLZFWJGKQGRU-UHFFFAOYSA-N 2-ethenyl-1h-pyridazine Chemical compound C=CN1NC=CC=C1 CQJLZFWJGKQGRU-UHFFFAOYSA-N 0.000 description 1
- NFHVQKQXNHFCKH-UHFFFAOYSA-N 2-ethenyl-3h-1,2-oxazole Chemical compound C=CN1CC=CO1 NFHVQKQXNHFCKH-UHFFFAOYSA-N 0.000 description 1
- QERTUMILBWNEJM-UHFFFAOYSA-N 2-ethenyl-3h-1,2-thiazole Chemical compound C=CN1CC=CS1 QERTUMILBWNEJM-UHFFFAOYSA-N 0.000 description 1
- AUZRCMMVHXRSGT-UHFFFAOYSA-N 2-methylpropane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CC(C)CS(O)(=O)=O AUZRCMMVHXRSGT-UHFFFAOYSA-N 0.000 description 1
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- YYIOIHBNJMVSBH-UHFFFAOYSA-N 2-prop-2-enoyloxynaphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=C(OC(=O)C=C)C=CC2=C1 YYIOIHBNJMVSBH-UHFFFAOYSA-N 0.000 description 1
- GAVHQOUUSHBDAA-UHFFFAOYSA-N 3-butyl-1-ethenylaziridin-2-one Chemical compound CCCCC1N(C=C)C1=O GAVHQOUUSHBDAA-UHFFFAOYSA-N 0.000 description 1
- BSQQSDPTDVETTH-UHFFFAOYSA-N 3-ethenyl-1-methylpyrrolidin-2-one Chemical compound CN1CCC(C=C)C1=O BSQQSDPTDVETTH-UHFFFAOYSA-N 0.000 description 1
- NIAXWFTYAJQENP-UHFFFAOYSA-N 3-ethenyl-2h-1,3-oxazole Chemical compound C=CN1COC=C1 NIAXWFTYAJQENP-UHFFFAOYSA-N 0.000 description 1
- RKFCJJGVLBBOQC-UHFFFAOYSA-N 3-ethenyl-2h-1,3-thiazole Chemical compound C=CN1CSC=C1 RKFCJJGVLBBOQC-UHFFFAOYSA-N 0.000 description 1
- DFSGINVHIGHPES-UHFFFAOYSA-N 3-ethenyl-4h-1,3-oxazin-2-one Chemical compound C=CN1CC=COC1=O DFSGINVHIGHPES-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- ZMALNMQOXQXZRO-UHFFFAOYSA-N 4-ethenylmorpholin-3-one Chemical compound C=CN1CCOCC1=O ZMALNMQOXQXZRO-UHFFFAOYSA-N 0.000 description 1
- CFZDMXAOSDDDRT-UHFFFAOYSA-N 4-ethenylmorpholine Chemical compound C=CN1CCOCC1 CFZDMXAOSDDDRT-UHFFFAOYSA-N 0.000 description 1
- HDYTUPZMASQMOH-UHFFFAOYSA-N 4-ethenylmorpholine-3,5-dione Chemical compound C=CN1C(=O)COCC1=O HDYTUPZMASQMOH-UHFFFAOYSA-N 0.000 description 1
- SBVKVAIECGDBTC-UHFFFAOYSA-N 4-hydroxy-2-methylidenebutanamide Chemical compound NC(=O)C(=C)CCO SBVKVAIECGDBTC-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 244000025254 Cannabis sativa Species 0.000 description 1
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 1
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- LAGMANKZFBMQGW-UHFFFAOYSA-N N=C=O.N=C=O.CCCC Chemical class N=C=O.N=C=O.CCCC LAGMANKZFBMQGW-UHFFFAOYSA-N 0.000 description 1
- DQXLSKZOXHDYRA-UHFFFAOYSA-N N=C=O.N=C=O.OC(=O)C1=CC=CC(C(O)=O)=C1 Chemical compound N=C=O.N=C=O.OC(=O)C1=CC=CC(C(O)=O)=C1 DQXLSKZOXHDYRA-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- KJVBXWVJBJIKCU-UHFFFAOYSA-N [hydroxy(2-hydroxyethoxy)phosphoryl] prop-2-enoate Chemical compound OCCOP(O)(=O)OC(=O)C=C KJVBXWVJBJIKCU-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000007869 azo polymerization initiator Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 235000009120 camo Nutrition 0.000 description 1
- 239000005025 cast polypropylene Substances 0.000 description 1
- 235000005607 chanvre indien Nutrition 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000005670 ethenylalkyl group Chemical group 0.000 description 1
- 125000006232 ethoxy propyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000007647 flexography Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011487 hemp Substances 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- LDHQCZJRKDOVOX-IHWYPQMZSA-N isocrotonic acid Chemical compound C\C=C/C(O)=O LDHQCZJRKDOVOX-IHWYPQMZSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- RQAKESSLMFZVMC-UHFFFAOYSA-N n-ethenylacetamide Chemical compound CC(=O)NC=C RQAKESSLMFZVMC-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000001196 nonadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- AAYRWMCIKCRHIN-UHFFFAOYSA-N propane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CCCS(O)(=O)=O AAYRWMCIKCRHIN-UHFFFAOYSA-N 0.000 description 1
- 125000006225 propoxyethyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- BWYYYTVSBPRQCN-UHFFFAOYSA-M sodium;ethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=C BWYYYTVSBPRQCN-UHFFFAOYSA-M 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to an adhesive tape comprising adhesive layers on both sides of a base layer, wherein the adhesive in the adhesive layers has a loss tangent tan delta of 0.3-0.5 at 80 ℃ x 10000 Hz. By satisfying the above conditions, the adhesive tape of the present invention has excellent impact resistance and vibration resistance while maintaining excellent adhesion.
Description
Technical Field
The present invention relates to an adhesive tape, and more particularly, to a double-sided adhesive tape having excellent impact resistance and vibration resistance while maintaining excellent adhesion.
Background
In recent years, with the trend of complicating various performances of mobile devices, various performances of various members employed in mobile devices also tend to complicate. In a mobile device, a double-sided adhesive tape is sometimes used to join housings or the like. In recent years, various properties of the double-sided adhesive tape have also been required to be complicated.
The mobile device is at risk of falling according to its form of use, and in addition, the mobile device is also required to have high vibration resistance according to its form of use. Therefore, there is a need for a mobile device having high impact resistance and high vibration resistance. However, if the impact absorbing member or the vibration-resistant member is provided outside the housing of the mobile device to improve the impact resistance and vibration resistance of the mobile device, in such a form, the size of the mobile device may be increased or its design may be impaired, and other performance may be impaired.
In view of the above, it is desirable to impart excellent impact resistance and vibration resistance to a double-sided adhesive tape provided in a mobile device.
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made to solve the above-mentioned conventional problems, and an object thereof is to provide an adhesive tape having excellent impact resistance and vibration resistance while maintaining excellent adhesion.
Solution for solving the problem
The present inventors have made intensive studies to solve the above problems, and as a result, have found that the above problems can be solved by controlling the loss tangent tan δ of an adhesive in an adhesive layer within a specific range at 80 ℃.
Namely, the present invention is as follows.
[1] An adhesive tape comprising adhesive layers on both sides of a base layer, wherein the adhesive in the adhesive layers has a loss tangent tan delta at 80 ℃ x 10000Hz of between 0.3 and 0.5.
[2] The adhesive tape according to [1], wherein the adhesive layer comprises a base polymer comprising at least three monomers, wherein at least two monomers differ in side chain length, and the monomers of the same side chain length account for 50 mass% or less of the total monomers of the base polymer,
Preferably, the base polymer contains 3 to 15 monomers, more preferably 5 to 8 monomers, in which at least two monomers have different side chain lengths and the monomers having the same side chain length account for 50 mass% or less of the total monomers of the base polymer.
[3] The adhesive tape according to [2], wherein the monomer comprises an adhesive monomer and optionally a hydroxyl group-containing monomer and/or optionally a carboxyl group-containing monomer.
[4] The adhesive tape according to [3], wherein the tacky monomer is at least one selected from alkyl (meth) acrylates having an alkyl group of 1 to 20 carbon atoms, and the tacky monomer is contained in an amount of 90 to 100 parts by weight relative to 100 parts by weight of the total monomers of the base polymer.
[5] The adhesive tape according to [3], wherein the hydroxyl group-containing monomer is at least one selected from the group consisting of a monomer having a primary hydroxyl group and a monomer having a secondary hydroxyl group, and the content of the hydroxyl group-containing monomer is 0 to 5 parts by weight relative to 100 parts by weight of the total monomers of the base polymer.
[6] The adhesive tape according to [3], wherein the carboxyl group-containing monomer is selected from at least one of ethylenically unsaturated monocarboxylic acid, ethylenically unsaturated dicarboxylic acid and acid anhydride thereof, and the content of the carboxyl group-containing monomer is 0 to 5 parts by weight based on 100 parts by weight of the total monomers of the base polymer.
[7] The adhesive tape according to [2], wherein the adhesive layer further comprises 1 to 5 parts by weight of an isocyanate crosslinking agent and/or 0.01 to 1 part by weight of an epoxy crosslinking agent, based on 100 parts by weight of the total monomers of the base polymer.
[8] The adhesive tape according to any one of [1] to [7], wherein the adhesive has a storage modulus G 'at 80 ℃ x 10000Hz of 18000 Pa.s or more and a loss modulus G' at 80 ℃ x 10000Hz of 9000 Pa.s or more; the gel rate of the adhesive is 60-98%; the weight average molecular weight of the soluble portion of the adhesive is 80000 or less.
[9] The adhesive tape according to any one of [1] to [7], wherein the thickness of the base layer is 1 to 50. Mu.m, and the thickness of each of the adhesive layers is 1 to 200. Mu.m.
[10] The adhesive tape according to any one of [1] to [7], wherein a ratio of a thickness of the base material layer to a total thickness of the adhesive layer, that is, a thickness of the base material layer/a total thickness of the adhesive layer is 1:20 to 1:2.
ADVANTAGEOUS EFFECTS OF INVENTION
The adhesive tape of the present invention exhibits excellent storage modulus G', loss modulus G ", weight average molecular weight of the soluble portion, gel fraction, high temperature shear force, high temperature holding power, 180 ° peel strength and falling ball impact test performance, thereby having excellent impact resistance and vibration resistance.
Drawings
Fig. 1 is a sectional view schematically showing the structure of an adhesive tape according to an embodiment of the present invention.
Description of the reference numerals
10: An adhesive tape; 1. 3: an adhesive layer; 2: substrate layer
Detailed Description
Hereinafter, preferred embodiments of the present invention will be described. Matters necessary for the practice of the present invention other than matters specifically mentioned in the present specification are understood by those skilled in the art based on the teachings and technical knowledge at the time of application as to the practice of the present invention described in the present specification. The present invention can be implemented based on the content disclosed in the present specification and technical common knowledge in the field.
The embodiments described in the drawings are schematically illustrated for the sake of clarity of explanation of the present invention, and do not necessarily accurately represent the dimensions and scale of the product actually provided.
< Adhesive tape >
The adhesive tape of the present invention is characterized in that the adhesive in the adhesive layer has a loss tangent tan delta at 80 ℃ x 10000Hz of between 0.3 and 0.5.
Fig. 1 is a sectional view schematically showing the structure of an adhesive tape according to an embodiment of the present invention. As shown in fig. 1, the adhesive tape 10 includes a base layer 2 and adhesive layers 1 and 3 provided on both sides of the base layer 2, and the adhesive layers 1 and 3 are preferably provided on the entire surface of the base layer 2.
Although not shown, the pressure-sensitive adhesive tape of the present invention may be provided with a release liner on the outer side of the pressure-sensitive adhesive layer for the purpose of protecting the pressure-sensitive adhesive surface during the period of time before use.
The term "pressure-sensitive adhesive tape" as used herein may include articles called pressure-sensitive adhesive sheets, pressure-sensitive adhesive labels, pressure-sensitive adhesive films, and the like. The pressure-sensitive adhesive tape disclosed herein may be a single-piece pressure-sensitive adhesive tape or may be a pressure-sensitive adhesive tape further processed into various shapes. In some preferred embodiments, the adhesive tape of the present invention may be provided in a long strip shape.
The adhesive tape of the present invention has the following features: the adhesive in the adhesive layer has a loss tangent tan delta at 80 ℃ x 10000Hz of between 0.3 and 0.5. The range of any two values of 0.3, 0.32, 0.34, 0.36, 0.38, 0.4, 0.42, 0.44, 0.46, 0.48 and 0.5 may be used, and for example, the range is preferably between 0.32 and 0.48, more preferably between 0.33 and 0.47, still more preferably between 0.35 and 0.45.
The loss tangent tan delta is an index indicating the impact resistance and vibration resistance of the adhesive tape. In the present invention, when tan δ is between 0.3 and 0.5, the adhesive tape can be made to have excellent impact resistance and vibration resistance, thereby exhibiting a higher damping effect. In contrast, if tan δ is not between 0.3 and 0.5, excellent impact resistance and vibration resistance cannot be exhibited. The loss tangent tan δ can be measured, for example, by the method described in examples described below.
[ Adhesive layer ]
In the present invention, the adhesive layer is a layer formed of an adhesive. In the present invention, "adhesive" and "adhesive composition" are used interchangeably. In one embodiment, the adhesive layer of the present invention comprises a base polymer comprising at least three monomers, wherein at least two monomers have different side chain lengths, and the monomers having the same side chain length account for 50 mass% or less of the total monomers of the base polymer. If the adhesive layer of the present invention satisfies this condition, the adhesive tape can be made to have excellent impact resistance and vibration resistance; on the other hand, if this condition is not satisfied, excellent impact resistance and vibration resistance cannot be exhibited. Preferably, the base polymer contains 3 to 15 monomers, more preferably 5 to 8 monomers, in which at least two monomers have different side chain lengths and the monomers having the same side chain length account for 50 mass% or less of the total monomers of the base polymer.
The form of the adhesive composition is not particularly limited, and may be, for example, various forms such as a water-dispersible form, a solvent form, a hot-melt form, an active energy ray-curable form (e.g., a photo-curable form), and the like.
The components of the adhesive composition of the present invention will be described in detail below.
(Base Polymer)
The adhesive composition of the present invention comprises a base polymer. Examples of the base polymer include acrylic polymers, rubber polymers, polyester polymers, urethane polymers, polyether polymers, silicone polymers, polyamide polymers, and fluorine polymers. Preferably, the adhesive composition comprises an acrylic polymer as a base polymer.
The content of the base polymer is not particularly limited, but is preferably 30 to 100 mass%, more preferably 35 to 90 mass%, and even more preferably 40 to 80 mass% with respect to the total amount (100 mass%) of the adhesive composition from the viewpoint of obtaining sufficient adhesion reliability. By adjusting the content of the base polymer in the adhesive composition to be within the above range, an adhesive composition having better structural system compatibility, stronger cohesion and excellent adhesion to an adherend can be provided.
In the present invention, the monomers in the base polymer comprise a tacky monomer, optionally a hydroxyl-containing monomer and/or optionally a carboxyl-containing monomer.
(Viscous monomer)
The adhesive monomer is at least one selected from alkyl (meth) acrylate esters having an alkyl group having 1 to 20 carbon atoms. In the present specification, the term alkyl (meth) acrylate refers to alkyl acrylate and/or alkyl methacrylate.
Specific examples of the alkyl (meth) acrylate having an alkyl group of 1 to 20 carbon atoms include, but are not particularly limited to: methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, n-pentyl (meth) acrylate, isopentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, n-decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, nonadecyl (meth) acrylate and eicosyl (meth) acrylate. Among these, n-Butyl Acrylate (BA), 2-ethylhexyl acrylate (2 EHA), ethylhexyl acrylate (EHA) and Ethyl Acrylate (EA) are preferable. The alkyl (meth) acrylate may be used alone or in combination of two or more.
The content of the tacky monomer is 90 to 100 parts by weight, more preferably 90 to 98 parts by weight, still more preferably 92 to 95 parts by weight, relative to 100 parts by weight of the total monomers of the base polymer. When the content of the tacky monomer is within the above range, the adhesive agent has good fluidity and initial adhesion, can wet the surface to be bonded well, thereby obtaining excellent adhesion, and can ensure excellent impact resistance and vibration resistance of the adhesive tape.
(Hydroxyl group-containing monomer)
In the present invention, the monomer of the base polymer contains an optional hydroxyl group-containing monomer selected from at least one of a monomer having a primary hydroxyl group and a monomer having a secondary hydroxyl group.
The hydroxyl group-containing monomer means a monomer having at least one hydroxyl group in the molecule. In the case where the monomer component for constituting the base polymer contains a hydroxyl group-containing monomer, that is, the base polymer contains a monomer unit derived from the hydroxyl group-containing monomer, since a secondary bond such as a hydrogen bond with an adherend is formed, the cohesive force of the base polymer (preferably an acrylic polymer) is improved, and the change in adhesive force with time can be more effectively suppressed, and the adhesive tape is ensured to have excellent impact resistance and vibration resistance with less residual adhesive on the adherend after peeling. The base polymer of the present embodiment may use 1 kind of hydroxyl group-containing monomer, or may use 2 or more kinds of hydroxyl group-containing monomers.
Specific examples of the hydroxyl group-containing monomer include: 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, 4-hydroxymethylcyclohexyl (meth) acrylate, and the like. Among these, 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate are preferable. The hydroxyl group-containing monomer may be used singly or in combination of any 1 or more than 2.
The content of the hydroxyl group-containing monomer is not particularly limited, but in the present invention, the content of the hydroxyl group-containing monomer is 0 to 5 parts by weight, preferably 1 to 4 parts by weight, more preferably 2 to 3 parts by weight, based on 100 parts by weight of the total monomers of the base polymer. When the content of the hydroxyl group-containing monomer is within the above range, since secondary bonds such as hydrogen bonds with an adherend are formed, the cohesive force of the base polymer (preferably an acrylic polymer) is improved, and the change in adhesive force with time can be more effectively suppressed, and the adhesive tape is ensured to have excellent impact resistance and vibration resistance with less residual adhesive on the adherend after peeling and higher aggregation.
(Carboxyl group-containing monomer)
In the present invention, the monomer of the base polymer contains an optional carboxyl group-containing monomer selected from at least one of ethylenically unsaturated monocarboxylic acid, ethylenically unsaturated dicarboxylic acid, and acid anhydride thereof.
Carboxyl group-containing monomer means a monomer having at least one carboxyl group in the molecule. By including the carboxyl group-containing monomer in the monomer of the base polymer, since secondary bonds such as hydrogen bonds with the adherend are formed, the cohesive force of the base polymer (preferably, the acrylic polymer) is improved, and the adhesive force can be more effectively suppressed from changing with time, and the adhesive tape can be ensured to have excellent impact resistance and vibration resistance by less residual adhesive to the adherend after peeling and higher aggregation.
Specific examples of the carboxyl group-containing monomer include: acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, crotonic acid, isocrotonic acid, fumaric acid, itaconic acid, maleic acid, citraconic acid, maleic anhydride, itaconic anhydride, and the like. Among these, acrylic Acid (AA) and Methacrylic Acid (MA) are preferable. The above carboxyl group-containing monomers may be used singly or in combination of any of 1 or more of 2.
The content of the carboxyl group-containing monomer is not particularly limited, but in the present invention, the content of the carboxyl group-containing monomer is 0 to 5 parts by weight, preferably 1 to 4 parts by weight, more preferably 2 to 3 parts by weight, based on 100 parts by weight of the total monomers of the base polymer. When the content of the carboxyl group-containing monomer is within the above range, since secondary bonds such as hydrogen bonds with an adherend are formed, the cohesive force of the base polymer (preferably, the acrylic polymer) is improved, and the change in adhesive force with time can be more effectively suppressed, and the residual adhesive to the adherend after peeling is less, and has higher aggregation, thereby ensuring that the adhesive tape has excellent impact resistance and vibration resistance.
The base polymer of the present invention may further contain an acrylic monomer having an alicyclic structure, specific examples of which include cyclopropyl (meth) acrylate, cyclobutyl (meth) acrylate, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, cycloheptyl (meth) acrylate, cyclooctyl (meth) acrylate, isobornyl (meth) acrylate, and dicyclopentanyl (meth) acrylate. Among these acrylic monomers having an alicyclic structure, isobornyl (meth) acrylate is particularly preferable because it can exhibit more excellent impact resistance.
The base polymer of the present invention comprises optionally the above-mentioned hydroxyl-containing monomer and/or optionally the above-mentioned carboxyl-containing monomer. In addition, the base polymer of the present invention may contain other functional monomers such as sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, epoxy group-containing monomers, isocyanate group-containing monomers, amide group-containing monomers, monomers having a ring containing a nitrogen atom, monomers having a succinimide skeleton, maleimide-based monomers, itaconimide-based monomers, aminoalkyl (meth) acrylate-based monomers, alkoxyalkyl (meth) acrylate-based monomers, vinyl ether-based monomers, olefin-based monomers, and the like.
Examples of the sulfonic acid group-containing monomer include: styrene sulfonic acid, allyl sulfonic acid, sodium vinyl sulfonate, 2- (meth) acrylamide-2-methylpropanesulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, acryloxynaphthalene sulfonic acid, and the like.
Examples of the phosphate group-containing monomer include: 2-hydroxyethyl acryloyl phosphate, and the like.
Examples of the epoxy group-containing monomer include: glycidyl (meth) acrylate, epoxy group-containing acrylates such as 2-ethyl glycidyl (meth) acrylate, allyl glycidyl ether, glycidyl (meth) acrylate, and the like.
Examples of the isocyanate group-containing monomer include: 2-isocyanatoethyl (meth) acrylate, and the like.
Examples of the amide group-containing monomer include: (meth) acrylamide; n, N-dialkyl (meth) acrylamides such as N, N-dimethyl (meth) acrylamide, N-diethyl (meth) acrylamide, N-dipropyl (meth) acrylamide, N-diisopropyl (meth) acrylamide, N-di (N-butyl) (meth) acrylamide, N-di (t-butyl) (meth) acrylamide, and the like; n-alkyl (meth) acrylamides such as N-ethyl (meth) acrylamide, N-isopropyl (meth) acrylamide, N-butyl (meth) acrylamide, and N-N-butyl (meth) acrylamide; n-vinylcarboxylic acid amides such as N-vinylacetamide; n, N-dimethylaminopropyl (meth) acrylamide, hydroxyethyl acrylamide, N-hydroxymethyl (meth) acrylamide, N-hydroxyethyl (meth) acrylamide, N-methylolpropane (meth) acrylamide, N-methoxymethyl (meth) acrylamide, N-methoxyethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, N- (meth) acryloylmorpholine, and the like.
Examples of the monomer having a ring containing a nitrogen atom include: n-vinyl-2-pyrrolidone, N-methyl vinyl pyrrolidone, N-vinyl pyridine, N-vinyl piperidone, N-vinyl pyrimidine, N-vinyl piperazine, N-vinyl pyrazine, N-vinyl pyrrole, N-vinyl imidazole, N-vinyl oxazole, N- (meth) acryl-2-pyrrolidone, N- (meth) acryl piperidine, N- (meth) acryl pyrrolidine, N-vinyl morpholine, N-vinyl-3-morpholinone, N-vinyl-2-caprolactam, N-vinyl-1, 3-oxazin-2-one, N-vinyl-3, 5-morpholinedione, N-vinyl pyrazole, N-vinyl isoxazole, N-vinyl thiazole, N-vinyl isothiazole, N-vinyl pyridazine, and the like.
Examples of the monomer having a succinimide skeleton include: n- (meth) acryloyloxymethylene succinimide, N- (meth) acryl-6-oxahexamethylenesuccinimide, N- (meth) acryl-8-oxahexamethylenesuccinimide, and the like.
Examples of the maleimide monomer include: n-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, N-phenylmaleimide, and the like.
Examples of the itaconimide monomer include: n-methyl itaconimide, N-ethyl itaconimide, N-butyl itaconimide, N-octyl itaconimide, N-2-ethylhexyl itaconimide, N-cyclohexyl itaconimide, N-Yue Gui Jiyi itaconimide, etc.
Examples of the aminoalkyl (meth) acrylate monomer include: aminoethyl (meth) acrylate, N-dimethylaminoethyl (meth) acrylate, N-diethylaminoethyl (meth) acrylate, t-butylaminoethyl (meth) acrylate, and the like.
Examples of the alkoxyalkyl (meth) acrylate monomer include: methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, propoxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, ethoxypropyl (meth) acrylate, and the like.
Examples of the vinyl ether monomer include: vinyl alkyl ethers such as methyl vinyl ether and ethyl vinyl ether.
Examples of the olefin monomer include: ethylene, butadiene, isoprene, isobutylene, and the like.
(Process for producing base Polymer)
The method for obtaining the base polymer is not particularly limited, and various known polymerization methods such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a suspension polymerization method, and a photopolymerization method can be suitably used. For example, a solution polymerization method can be preferably employed. As a monomer supply method in the case of performing solution polymerization, a batch type in which all monomer raw materials are supplied at once, a continuous supply (drop wise) type, a split supply (drop wise) type, or the like can be suitably employed. The polymerization temperature in the solution polymerization may be appropriately selected depending on the types of monomers and solvents used, the types of polymerization initiators, and the like, and may be set to about 20 to 170℃for example (typically about 40 to 140 ℃).
The initiator used in the polymerization may be appropriately selected from conventionally known polymerization initiators depending on the kind of the polymerization method. For example, one or two or more azo polymerization initiators such as 2,2' -Azobisisobutyronitrile (AIBN) may be preferably used. As other examples of the polymerization initiator, there may be mentioned: persulfates such as potassium persulfate; peroxide initiators such as benzoyl peroxide and hydrogen peroxide; substituted ethane initiators such as phenyl substituted ethane; aromatic carbonyl compounds, and the like. As still other examples of the polymerization initiator, there are cited redox-type initiators obtained by combining a peroxide with a reducing agent. Such polymerization initiators may be used singly or in combination of two or more. The amount of the polymerization initiator to be used may be a usual amount, and for example, may be selected from the range of about 0.005 to about 1 part by weight (typically about 0.01 to about 1 part by weight) based on 100 parts by weight of the entire monomer components.
In the present invention, the weight average molecular weight (Mw) of the base polymer (preferably an acrylic polymer) is not particularly limited, and may be, for example, 2,000,000 or less, preferably 400,000 or more.
(Crosslinking agent)
Preferably, in the present invention, the adhesive layer further comprises 1 to 5 parts by weight of an isocyanate crosslinking agent and/or 0.01 to 1 part by weight of an epoxy crosslinking agent with respect to 100 parts by weight of the total monomers of the base polymer.
As the isocyanate crosslinking agent, polyfunctional isocyanates (meaning compounds having an average of two or more isocyanate groups per molecule, including compounds having an isocyanurate structure) can be preferably used. The isocyanate crosslinking agent may be used singly or in combination of two or more.
Examples of the polyfunctional isocyanate include aliphatic polyisocyanates, alicyclic polyisocyanates, aromatic polyisocyanates, and the like.
Specific examples of the aliphatic polyisocyanate include: 1, 2-ethylene diisocyanate; 1, 2-butanediisocyanate, 1, 3-butanediisocyanate, 1, 4-butanediisocyanate and other butanediisocyanates; hexamethylene diisocyanate such as1, 2-hexamethylene diisocyanate, 1, 3-hexamethylene diisocyanate, 1, 4-hexamethylene diisocyanate, 1, 5-hexamethylene diisocyanate, 1, 6-hexamethylene diisocyanate and 2, 5-hexamethylene diisocyanate; 2-methyl-1, 5-pentanediisocyanate, 3-methyl-1, 5-pentanediisocyanate, lysine diisocyanate, and the like.
Specific examples of the alicyclic polyisocyanate include: isophorone diisocyanate; cyclohexyl diisocyanate such as 1, 2-cyclohexyl diisocyanate, 1, 3-cyclohexyl diisocyanate, and 1, 4-cyclohexyl diisocyanate; cyclopentyl diisocyanate such as 1, 2-cyclopentyl diisocyanate and 1, 3-cyclopentyl diisocyanate; hydrogenated xylylene diisocyanate, hydrogenated toluene diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated tetramethylxylylene diisocyanate, 4' -dicyclohexylmethane diisocyanate, and the like.
Specific examples of the aromatic polyisocyanate include: 2, 4-toluene diisocyanate, 2, 6-toluene diisocyanate, 4' -diphenylmethane diisocyanate, 2' -diphenylmethane diisocyanate, 4' -diphenyl ether diisocyanate, 2-nitrobiphenyl-4, 4' -diisocyanate, 2' -diphenylpropane-4, 4' -diisocyanate 3,3' -dimethyldiphenylmethane-4, 4' -diisocyanate, 4' -diphenylpropane diisocyanate, isophthalate diisocyanate, p-phenylene diisocyanate, naphthalene-1, 4-diisocyanate, naphthalene-1, 5-diisocyanate, 3' -dimethoxybiphenyl-4, 4' -diisocyanate, xylylene-1, 4-diisocyanate, xylylene-1, 3-diisocyanate, and the like.
As the preferable polyfunctional isocyanate, polyfunctional isocyanates having an average of 3 or more isocyanate groups per molecule can be exemplified. The polyfunctional isocyanate may be a polymer (typically a dimer or trimer) of difunctional or trifunctional or higher isocyanate, a derivative (e.g., an addition reaction product of a polyol and two or more polyfunctional isocyanates), a polymer, or the like. Examples may include: dimers or trimers of diphenylmethane diisocyanate, isocyanurate forms of hexamethylene diisocyanate (isocyanurate-structured trimer adducts), reaction products of trimethylol propane and toluene diisocyanate, reaction products of trimethylol propane and hexamethylene diisocyanate, polymethylene polyphenyl isocyanates, polyether polyisocyanates, polyester polyisocyanates, and other polyfunctional isocyanates. Examples of the commercial products of the polyfunctional isocyanate include trade names "DURANATE TPA-100" manufactured by Asahi chemical Co., ltd., trade name "CORONATE L" manufactured by Japanese polyurethane Industrial Co., ltd., trade name "CORONATE HL" manufactured by Japanese polyurethane Industrial Co., ltd., trade name "CORONATE HK" manufactured by Japanese polyurethane Industrial Co., ltd., trade name "CORONATE HX" manufactured by Japanese polyurethane Industrial Co., ltd., trade name "CORONATE2096" manufactured by Japanese polyurethane Industrial Co., ltd.
In embodiments containing an isocyanate crosslinker, the isocyanate group content (NCO content) of the isocyanate crosslinker is preferably from 7 to 15%.
The isocyanate crosslinking agent is used in an amount of, for example, preferably 1 to 5 parts by weight, more preferably 2 to 4 parts by weight, based on 100 parts by weight of the total monomers of the base polymer.
As the epoxy-based crosslinking agent, a compound having two or more epoxy groups in one molecule can be used without particular limitation. Preferably an epoxy-based crosslinking agent having 3 to 5 epoxy groups in one molecule. The epoxy crosslinking agent may be used singly or in combination of two or more.
Specific examples of the epoxy-based crosslinking agent include, but are not particularly limited to: bisphenol A, epichlorohydrin-based epoxy resins, ethylene glycidyl ether, N, N, N ', N' -tetraglycidyl m-xylylenediamine, 1, 3-bis (N, N-diglycidyl aminomethyl) cyclohexane, 1, 6-hexanediol diglycidyl ether, polyethylene glycol diglycidyl ether, polyglycidyl ether, and the like. Examples of the commercial products of the epoxy-based crosslinking agent include trade names "tetra d-C" and "tetra d-X" manufactured by mitsubishi gas chemical company, trade names "EPICLON CR-5L" manufactured by DIC corporation, trade names "DENACOL EX-512" manufactured by long-format chemical company, and trade name "TEPIC-G" manufactured by daily chemical industry company.
In the embodiment containing the epoxy-based crosslinking agent, the epoxy equivalent of the epoxy-based crosslinking agent is preferably 80 to 120g/eq.
The amount of the epoxy-based crosslinking agent used is, for example, preferably 0.01 to 1 part by weight, more preferably 0.1 to 0.5 part by weight based on 100 parts by weight of the total monomers of the base polymer.
By using the isocyanate crosslinking agent and/or the epoxy crosslinking agent, a proper crosslinking reaction can be generated, the cohesive force can be sufficiently improved, good adhesion can be ensured, and breakage of the adherend at the time of the peeling operation can be effectively prevented, thereby ensuring excellent impact resistance and vibration resistance of the adhesive tape.
In addition to the isocyanate crosslinking agent and the epoxy crosslinking agent, the adhesive layer of the present invention may contain other crosslinking agents commonly used, for example, melamine crosslinking agents, aziridine crosslinking agents, metal chelate crosslinking agents, and the like.
(Property of adhesive)
In the present invention, the storage modulus G 'of the adhesive at 80 ℃ x 10000Hz is 18000pa·s or more, preferably 20000pa·s or more, more preferably 25000pa·s or more, further preferably 30000pa·s or more, and on the other hand, the storage modulus G' is 120000pa·s or less, more preferably 100000pa·s or less, further preferably 80000pa·s or less; the loss modulus G' at 80 ℃ x 10000Hz is 9000 Pa.s or more, preferably 10000 Pa.s or more, more preferably 11000 Pa.s or more, further preferably 12000 Pa.s or more, and on the other hand, 90000 Pa.s or less, more preferably 70000 Pa.s or less, further preferably 50000 Pa.s or less.
The gel fraction of the binder is 60 to 98%, preferably 70 to 95%, more preferably 72 to 92%.
The weight average molecular weight of the soluble portion of the binder is preferably 80000 or less, more preferably 60000 or less, still more preferably 50000 or less, and further preferably 40000 or less, and on the other hand, the weight average molecular weight of the soluble portion is preferably 2000 or more, more preferably 5000 or more, further preferably 10000 or more.
In the present invention, by providing the adhesive with the storage modulus G', the loss modulus G ", the gel fraction and the weight average molecular weight of the soluble portion within the above ranges, the adhesive can be provided with excellent adhesion to an adherend, thereby ensuring excellent impact resistance and vibration resistance of the adhesive tape.
(Formation of adhesive layer)
The adhesive layer of the present invention can be formed by a conventionally known method. For example, a method (direct method) of forming an adhesive layer by directly applying (typically coating) the adhesive composition onto a substrate layer and drying it can be employed. In addition, a method (transfer method) of forming an adhesive layer on a surface (release surface) having releasability by applying the adhesive composition to the surface and drying the surface, and transferring the adhesive layer to a base material layer may also be employed. The transfer method is preferable from the viewpoint of productivity. The release surface may be a surface of a release liner, a back surface of a base material layer subjected to a release treatment, or the like. The pressure-sensitive adhesive layer of the present invention is typically formed continuously, but is not limited to such a form, and may be formed in a regular or irregular pattern such as a dot shape or a stripe shape.
The adhesive composition may be applied by using a conventionally known coater such as a gravure roll coater, a die coater, or a bar coater. Alternatively, the adhesive composition may be applied by impregnation, curtain coating, or the like.
Drying of the adhesive composition is preferably performed under heating from the viewpoints of promoting the crosslinking reaction, improving the production efficiency, and the like. The drying temperature can be set, for example, at about 40 to 150℃and is usually preferably set at about 60 to 130 ℃. After drying the adhesive composition, aging may be further performed for the purpose of adjusting migration of components in the adhesive layer, progress of crosslinking reaction, relaxation of strain that may exist in the substrate film or the adhesive layer, and the like.
In the present invention, the thickness of each adhesive layer is 1 to 200. Mu.m, more preferably 10 to 100. Mu.m. By setting the thickness of the adhesive layer to the above range, good adhesion can be achieved.
[ Substrate layer ]
The material of the base layer of the present invention is not particularly limited, and may be appropriately selected according to the purpose of use, the manner of use, and the like of the adhesive tape. Non-limiting examples of the usable base material layer include polyolefin films containing polyolefin such as polyethylene, polypropylene, polybutylene, and ethylene-propylene copolymer as a main component, polyester films containing polyester such as polyethylene terephthalate and polybutylene terephthalate as a main component, polyvinyl chloride films containing polyvinyl chloride as a main component, films containing cast polypropylene as a main component, and plastic films such as thermoplastic polyurethane films; foam sheets formed of a foam such as polyurethane foam, polyethylene foam, polychloroprene foam, or the like; various fibrous substances (natural fibers such as hemp and cotton, synthetic fibers such as polyester and vinylon, semisynthetic fibers such as acetate, etc.), woven fabrics and nonwoven fabrics obtained by blending or the like; paper such as japanese paper, high-quality paper, kraft paper, crepe paper, etc.; metal foil such as aluminum foil and copper foil. Of these, the substrate layer preferably contains at least one selected from the group consisting of thermoplastic polyurethane, polyethylene, polypropylene, polybutylene, ethylene-vinyl acetate copolymer, and polyvinyl chloride. The substrate may be a composite substrate. Examples of such a composite substrate include a substrate having a structure in which a metal foil and the plastic film are laminated, a plastic substrate reinforced with inorganic fibers such as glass cloth, and the like.
The surface of the base material layer of the present invention may be subjected to any surface treatment in order to improve adhesion to an adjacent layer, retention, and the like. Examples of the surface treatment include chemical or physical treatments such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, and ionizing radiation treatment, and coating treatment.
The thickness of the base material layer of the present invention is preferably 1 to 50. Mu.m, more preferably 10 to 40. Mu.m, still more preferably 20 to 30. Mu.m.
In the present invention, the ratio of the thickness of the substrate layer to the total thickness of the adhesive layer, i.e., the thickness of the substrate layer/the total thickness of the adhesive layer, is 1:20 to 1:2, preferably 1:16 to 1:5, more preferably 1:12 to 1:8. By satisfying this ratio, good adhesion can be achieved, thereby ensuring excellent impact resistance and vibration resistance of the adhesive tape. The thickness of each adhesive layer may be the same or different.
[ Method for producing adhesive tape ]
The adhesive tape of the present invention can be manufactured by any suitable method. For example, the following methods are mentioned: a method of applying the adhesive composition to the substrate layer, a method of transferring a coating layer formed by applying the adhesive composition to any appropriate substrate to the substrate layer, and the like.
As a coating method of the above adhesive composition, any suitable coating method may be employed. For example, each layer may be formed by drying after coating. Examples of the coating method include coating methods using a multiple coater, a die coater, a gravure coater, an applicator, a bar coater, air knife coating, reverse roll coating, lip coating, dip coating, offset printing, flexography, screen printing, and the like. Examples of the drying method include natural drying and heat drying. The heating temperature in the case of the heat drying can be set to any appropriate temperature according to the characteristics of the substance to be dried.
Examples
Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples. The evaluation method in the examples is as follows. In the examples, "parts" and "%" are weight basis unless otherwise specified. The specific conditions are not noted in the examples and are carried out according to conventional conditions or conditions recommended by the manufacturer. The materials used, or the instruments, unless otherwise specified, are conventional products available commercially.
(Preparation of acrylic Polymer A1)
Into a reaction vessel equipped with a stirrer, a thermometer, a nitrogen inlet pipe and a reflux condenser, 25 parts of n-Butyl Acrylate (BA) (manufactured by Zhejiang satellite), 22 parts of Ethyl Acrylate (EA), 47.9 parts of 2-ethylhexyl acrylate (2-EHA), 1.1 parts of 2-hydroxyethyl acrylate (2-HEA), 4 parts of Acrylic Acid (AA) and 200 to 300 parts of ethyl acetate as a polymerization solvent were charged, and after stirring under a nitrogen atmosphere at 65℃for 1 to 1.5 hours, 0.1 part of 2,2' -Azobisisobutyronitrile (AIBN) was charged as a thermal polymerization initiator, and the reaction was carried out at 65℃for 6 to 8 hours, and the internal bath temperature was raised to 70 to 90℃and aged for 2 hours. A solution of the acrylic polymer A1 was obtained. The performance parameters of the acrylic polymer A1 are shown in table 1.
(Preparation of acrylic polymers A2 to A7 and B1 to B6)
Acrylic polymers A2 to A7, B1 to B6 were produced in the same manner as acrylic polymer A1 except that the kinds and amounts of the monomer components were changed as shown in table 1. The performance parameters of the acrylic polymers A2 to A7 are shown in table 1, and the performance parameters of the acrylic polymers B1 to B6 are shown in table 2.
Wherein MAA is methacrylic acid, 2-HPA is hydroxypropyl acrylate, and PA is propyl acrylate.
< Production of adhesive tape >
Example 1
To a solution of the acrylic polymer A1, 2 parts of an isocyanate crosslinking agent (trade name: CORONATE L, manufactured by Tosoh Corporation as a 75% ethyl acetate solution of trimethylolpropane/toluene diisocyanate trimer adduct) and 0.03 part of an epoxy crosslinking agent (trade name: TETRAD-C, 1, 3-bis (N, N-diglycidyl aminomethyl) cyclohexane, manufactured by Mitsubishi gas chemical) were added, and the mixture was uniformly mixed and diluted with an appropriate ethyl acetate, to obtain an adhesive composition D1.
Next, the above adhesive composition D1 was coated on both sides of a polyolefin film (PO film) having a thickness of 10 μm, and then dried in a 80 ℃ suspension oven for 1 minute to form two adhesive layers having a total thickness of 140 μm, each having a thickness of 70 μm.
Examples 2 to 7
An adhesive tape was obtained in the same manner as in example 1, except that the kind of the acrylic polymer, the amount of the crosslinking agent, and the ratio of the total thickness of the substrate and the adhesive layer were changed as shown in table 1. The evaluation results are shown in table 1. In example 2, the total thickness of the two adhesive layers was 20 μm, and the thickness of each adhesive layer was 10 μm; in example 3, the total thickness of the two adhesive layers was 80 μm, and the thickness of each adhesive layer was 40 μm; in example 4, the total thickness of the two adhesive layers was 50 μm, and the thickness of each adhesive layer was 25 μm; in example 5, the total thickness of the two adhesive layers was 100 μm, and the thickness of each adhesive layer was 50 μm; in example 6, the total thickness of the two adhesive layers was 120 μm, and the thickness of each adhesive layer was 60 μm; in example 7, the total thickness of the two adhesive layers was 180 μm, and the thickness of each adhesive layer was 90 μm.
The evaluation results are shown in tables 1 and 2.
Table 1 (Unit: portion)
Table 2 (Unit: portion)
Comparative examples 1 to 6
An adhesive tape was obtained in the same manner as in example 1, except that the kind of the acrylic polymer, the amount of the crosslinking agent, and the ratio of the total thickness of the substrate and the adhesive layer were changed as shown in table 1. The evaluation results are shown in table 3. In comparative examples 1,2 and 4, the total thickness of the two adhesive layers was 60 μm, and the thickness of each adhesive layer was 30 μm; in comparative example 3, the total thickness of the two adhesive layers was 140 μm, and the thickness of each adhesive layer was 70 μm; in comparative example 5, the total thickness of the two adhesive layers was 15 μm, and the thickness of each adhesive layer was 7.5 μm; in comparative example 6, the total thickness of the two adhesive layers was 220 μm, and the thickness of each adhesive layer was 110 μm.
The evaluation results are shown in tables 3 and 4.
Table 3 (Unit: portion)
Table 4 (Unit: portion)
As can be seen from tables 1 and 2, all examples of the present application can satisfy the loss tangent tan delta at 80 c×10000Hz of the adhesive therein between 0.3 and 0.5, thereby giving the adhesive tape excellent in impact resistance and vibration resistance. Specifically, the adhesive tape of the example exhibited excellent storage modulus G', loss modulus G ", weight average molecular weight of the soluble portion, gel fraction, high temperature shear force, high temperature holding power, 180 ° peel strength, and falling ball impact test performance, relative to the comparative example.
In contrast, as can be seen from tables 3 and 4, all of the comparative examples of the present application failed to achieve good impact resistance and vibration resistance because the adhesive therein did not satisfy the loss tangent tan delta at 80 ℃ x 10000Hz of between 0.3 and 0.5, resulting in inferior properties of the adhesive tape to those of the examples.
[ Evaluation test ]
< Measurement of loss tangent tan delta >
Double-sided adhesive tapes of thickness 1mm (when the thickness is not positive 1mm, the thickness is as close to 1mm as possible) superimposed on each other were punched into a disk shape of diameter 7.9mm to provide evaluation samples. The evaluation sample was sandwiched between parallel plates, and the storage modulus G' and the loss modulus G "were measured at 80 ℃ by a shear mode when a shear strain having a frequency of 10000Hz was applied to the sample using a viscoelasticity tester (TA Instruments Japan inc. Manufactured under the model name" ARES "). The loss tangent tan delta of the sample was calculated according to the equation "tan delta=g'/G".
< Storage modulus G' of adhesive
The temperature of the adhesive is scanned by using a torsional rheometer ARES G2 of TA company in an oscillation mode, the frequency is 10000Hz, the temperature is-70-100 ℃, and the storage modulus at 80 ℃ is G'.
< Loss modulus of adhesive G ">
The temperature of the adhesive was scanned using a torsional rheometer ARES G2 from TA company using an oscillation mode at 10000Hz, the temperature range was-70℃to 100℃and the loss modulus at 80℃was G ".
< Gel fraction >
About 0.1g of the adhesive layer to be measured was collected, and wrapped with a porous polytetrafluoroethylene sheet (manufactured by Nito electric Co., ltd.) having a thickness of 85 μm and an average pore diameter of 0.2 μm and a porosity of 75%, and then bound with kite string, and the weight at that time was measured and used as the wrapped weight. In this regard, the weight before impregnation is the total weight of the adhesive layer (the adhesive layer collected above), the polytetrafluoroethylene sheet and the kite string. The total weight of the polytetrafluoroethylene sheet and kite string was also measured and used as the wrap weight.
Then, the above-mentioned product (referred to as "sample") in which the adhesive layer was wrapped with a polytetrafluoroethylene sheet and bound with kite string was put in a 50 ml capacity container filled with toluene, and allowed to stand at 23℃for 7 days. Thereafter, the sample (toluene treated) was taken out of the vessel and transferred to an aluminum cup, dried in a desiccator at 130℃for 2 hours to remove toluene, and then the weight thereof was measured as the weight after impregnation. The gel fraction was thereafter calculated from the following formula.
Gel fraction (wt%) = { (a-B)/(C-B) } ×100
In the above formula, A is the weight after impregnation, B is the wrapper weight, and C is the weight before impregnation.
< Weight average molecular weight of soluble fraction of adhesive >
The weight average molecular weight of the soluble portion of the binder was determined by a method using the weight average molecular weight of the soluble portion (sol portion) obtained by toluene extraction.
About 0.1g of the adhesive layer to be tested was collected from the adhesive sheet, wrapped with a porous polytetrafluoroethylene sheet (manufactured by Nito electric Co., ltd.) having a thickness of 85 μm and an average pore diameter of 0.2 μm and a porosity of 75%, and then bound with kite strings.
Then, the adhesive layer wrapped with the polytetrafluoroethylene sheet and bound with kite string as described above was put into a 50 mL-capacity container filled with toluene, and allowed to stand at 23℃for 7 days. Thereafter, the toluene solution (containing the extracted sol fraction) in the vessel was taken out and dried under reduced pressure, and the solvent (toluene) was evaporated to obtain the sol fraction.
The above sol fraction was dissolved in Tetrahydrofuran (THF), and the weight average molecular weight of the sol fraction was measured using a GPC apparatus (manufactured by TOSOHCORPORATION, HLC-8230 GPC). The measurement conditions were as follows, and the molecular weight was determined by conversion with standard polystyrene.
Sample concentration: 0.2wt% (tetrahydrofuran (THF)) solution
Sample injection amount: 10 μl of
Eluent: THF (tetrahydrofuran)
Flow rate: 0.6ml/min
Measuring temperature: 40 DEG C
Column: sample column TSKguardcolumnSuperHZ-H (1) + TSKgelSuperHZM-H (2); reference column TSKgelSuperH-RC (1 root)
A detector: differential Refractometer (RI).
< Weight average molecular weight of adhesive >
The weight average molecular weight (Mw) refers to a value in terms of standard polystyrene obtained by Gel Permeation Chromatography (GPC). As a GPC apparatus, model name "HLC-8320GPC" (column: TSKGELGMH-H (S), manufactured by Tosoh corporation) was used.
< High temperature shear force >
The release liner covering the adhesive surface of each test piece was peeled off under a standard atmosphere of 23 ℃ and 50% rh, and bonded to the SUS304BA plate, and then the release liner on the other adhesive surface was peeled off, and the exposed adhesive surface was pressed against the SUS304BA plate by 1 round trip using a 2kg roller. The test piece thus pressed against the SUS304BA plate was left under the above standard environment for 30 minutes, then heated at 80℃for 5 minutes, and peeled off at a tensile rate of 300mm/min using a tensile tester (product name Tensilon manufactured by Shimadzu corporation) at 80℃to measure the force (80℃high temperature shear force) (N/10X 10 mm) required for the peeling.
< High temperature holding force >
The release liner covering the adhesive surface of each test piece was peeled off under a standard atmosphere of 23℃and 50% RH, and bonded to PET having a thickness of 50. Mu.m, and then the release liner on the other adhesive surface was peeled off, and the exposed adhesive surface was pressed against a phenolic resin plate by 1 round trip using a 2kg roller. The test piece thus pressed against the phenolic resin plate was left under the above standard environment for 30 minutes, then left under 80℃for 5 minutes, and under 80℃for 5 minutes, a 200g weight was hung, and after 1 hour, the tape slip distance (80℃high temperature holding force) (mm) (tape adhering area 10X20 mm) was recorded.
<180 ° Peel Strength >
The release liner covering the adhesive surface of each test piece was peeled off under a standard atmosphere of 23℃and 50% RH, and bonded to PET having a thickness of 50. Mu.m, and then the release liner on the other adhesive surface was peeled off, and the exposed adhesive surface was pressed against the PEEK sheet of the adherend by 1 round trip using a 2kg roller. After the test piece thus pressed against the PEEK plate was left under the above standard conditions for 30 minutes, the test piece was peeled off at a peeling angle of 180℃at a tensile rate of 300mm/min using a tensile testing machine (product name Tensilon manufactured by Shimadzu corporation) in accordance with JIS Z0237, and the force required for the peeling (180℃peeling strength to the PEEK plate) (N/25 mm) was measured.
< Ball drop impact test >
The release liner covering the adhesive surface of each test piece was peeled off under a standard atmosphere of 50% RH at 23℃and bonded to PET having a thickness of 50. Mu.m, each test piece was cut into a square of 100X100mm, the release liner on the other adhesive surface was peeled off, the exposed adhesive surface was pressed against a PEEK frame by 1 round trip using a 2kg roller, and the bonding surface on each side of the square test piece was pressed against the PEEK frame to a depth of 10mm. After the test piece thus pressed against the PEEK frame in the above-mentioned standard environment was left for 30 minutes, a SUS304 stainless steel ball having a weight of 10g was freely dropped at a position 50cm from the height of the test piece to the center of the test piece, and the number of ball drop impacts (the number of ball drop impacts at normal temperature) when the bonding surface of the test piece was released was recorded. Placing a test piece which is pressed and connected with a PEEK frame according to the operation in the standard environment for 30min, then placing the test piece in the environment of minus 30 ℃ for 5min, and striking the center of the test piece by free falling SUS304 stainless steel balls with the weight of 10g at the position of 50cm from the test piece in the environment of minus 30 ℃, and recording the times of ball striking (-30 ℃) when the bonding surface of the test piece is separated.
Claims (10)
1. An adhesive tape comprising adhesive layers on both sides of a base layer, wherein the adhesive in the adhesive layer has a loss tangent tan delta at 80 ℃ x 10000Hz of 0.3-0.5.
2. The adhesive tape according to claim 1, wherein the adhesive layer comprises a base polymer comprising at least three monomers, wherein at least two monomers differ in side chain length, and the monomers of the same side chain length account for 50 mass% or less of the total monomers of the base polymer,
Preferably, the base polymer contains 3 to 15 monomers, more preferably 5 to 8 monomers, in which at least two monomers have different side chain lengths and the monomers having the same side chain length account for 50 mass% or less of the total monomers of the base polymer.
3. Adhesive tape according to claim 2, wherein the monomers comprise a tacky monomer and optionally a hydroxyl-containing monomer and/or optionally a carboxyl-containing monomer.
4. The adhesive tape according to claim 3, wherein the adhesive monomer is at least one selected from alkyl (meth) acrylates having an alkyl group of 1 to 20 carbon atoms, and the adhesive monomer is contained in an amount of 90 to 100 parts by weight based on 100 parts by weight of the total monomers of the base polymer.
5. The adhesive tape according to claim 3, wherein the hydroxyl group-containing monomer is at least one selected from the group consisting of a monomer having a primary hydroxyl group and a monomer having a secondary hydroxyl group, and the content of the hydroxyl group-containing monomer is 0 to 5 parts by weight relative to 100 parts by weight of the total monomers of the base polymer.
6. The adhesive tape according to claim 3, wherein the carboxyl group-containing monomer is selected from at least one of ethylenically unsaturated monocarboxylic acid, ethylenically unsaturated dicarboxylic acid and anhydride thereof, and the content of the carboxyl group-containing monomer is 0 to 5 parts by weight relative to 100 parts by weight of the total monomers of the base polymer.
7. Adhesive tape according to claim 2, wherein the adhesive layer further comprises 1 to 5 parts by weight of an isocyanate crosslinking agent and/or 0.01 to 1 part by weight of an epoxy crosslinking agent per 100 parts by weight of the total monomers of the base polymer.
8. The adhesive tape according to any one of claims 1 to 7, wherein the adhesive has a storage modulus G' at 80 ℃ x 10000Hz of 18000 Pa-s or more and a loss modulus G "at 80 ℃ x 10000Hz of 9000 Pa-s or more; the gel rate of the adhesive is 60-98%; the weight average molecular weight of the soluble portion of the adhesive is 80000 or less.
9. Adhesive tape according to any one of claims 1 to 7, wherein the thickness of the substrate layer is 1 to 50 μm and the respective thickness of the adhesive layer is 1 to 200 μm.
10. Adhesive tape according to any one of claims 1 to 7, wherein the ratio of the thickness of the substrate layer to the total thickness of the adhesive layer, i.e. the thickness of the substrate layer/the total thickness of the adhesive layer, is 1:20 to 1:2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310079968.7A CN118360001A (en) | 2023-01-17 | 2023-01-17 | Adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310079968.7A CN118360001A (en) | 2023-01-17 | 2023-01-17 | Adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118360001A true CN118360001A (en) | 2024-07-19 |
Family
ID=91884425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310079968.7A Pending CN118360001A (en) | 2023-01-17 | 2023-01-17 | Adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118360001A (en) |
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2023
- 2023-01-17 CN CN202310079968.7A patent/CN118360001A/en active Pending
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