CN118354520A - Circuit board assembly and electronic equipment - Google Patents
Circuit board assembly and electronic equipment Download PDFInfo
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- CN118354520A CN118354520A CN202310077988.0A CN202310077988A CN118354520A CN 118354520 A CN118354520 A CN 118354520A CN 202310077988 A CN202310077988 A CN 202310077988A CN 118354520 A CN118354520 A CN 118354520A
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Abstract
The embodiment of the application discloses a circuit board assembly and electronic equipment, relates to the technical field of antennas, and solves the problem that an antenna assembly in communication equipment affects heat dissipation. The circuit board assembly of the present application includes a radio frequency circuit board and an antenna assembly. Wherein, the radio frequency circuit board is provided with a heating device. The antenna assembly comprises a reflecting plate and a plurality of antenna arrays, and the reflecting plate is arranged above the radio frequency circuit board and is in contact with the heating device. The plurality of antenna array sub-arrays are distributed on one side of the reflecting plate far away from the radio frequency circuit board and are electrically connected with the radio frequency circuit board. The reflecting plate can be closely contacted with the heating device of the radio frequency circuit board, so that heat can be rapidly conducted out, and the heat dissipation performance of the whole electronic equipment is improved.
Description
Technical Field
The present application relates to the field of antenna technologies, and in particular, to a circuit board assembly and an electronic device.
Background
With the rapid increase of the capacity and the rate of 5G (5 th generation mobile communication technology, fifth generation mobile communication technology) communication equipment, the power consumption of the whole machine is increased, and the excellent heat dissipation performance becomes one of key factors influencing the competitiveness of the product. For communication equipment with built-in antennas, the capacity and the speed requirement of the 5G communication equipment can be met by increasing the number and the overall dimension of the antennas.
However, under the same volume of equipment, the number and the overall dimension of the antennas are increased, so that the space for accommodating other equipment is occupied, the area of the heat dissipation teeth is greatly reduced, and the heat dissipation capacity of the whole machine is further weakened. In addition, the existing antenna assemblies are all independent closed assemblies and are distributed on the outermost side of the communication equipment. The contact area of the antenna component and the heat source or the heat dissipation teeth is small, and external air is prevented from entering the heat dissipation teeth to exchange heat.
Disclosure of Invention
The embodiment of the application provides a circuit board assembly and electronic equipment, which solve the problem that an antenna assembly in communication equipment affects heat dissipation in the prior art.
In order to achieve the above purpose, the application adopts the following technical scheme:
In a first aspect, an embodiment of the present application provides a circuit board assembly, which may be applied to a communication device of a base station, and may also be applied to a device such as a broadcast, a television, a radar, a navigation device, a remote sensing device, and the like. The circuit board assembly includes a radio frequency circuit board and an antenna assembly. Wherein, the radio frequency circuit board is provided with a heating device. The heat generating device may include a radio frequency chip mounted on a radio frequency circuit board, and may also include other high power electronic devices mounted on the radio frequency circuit board. The antenna assembly comprises a reflecting plate and a plurality of antenna arrays. The reflecting plate is arranged above the radio frequency circuit board and is contacted with the heating device. The specific contact mode may be direct contact or indirect contact. The plurality of antenna array subarrays are distributed on one side of the reflecting plate far away from the radio frequency circuit board. And the radio frequency circuit board is electrically connected with the plurality of antenna arrays, so that feeding of the plurality of antenna arrays is realized.
Taking the direct contact of the heating device on the radio frequency circuit board and the reflecting plate as an example, the reflecting plate is usually a metal reflecting plate, such as silver, copper, aluminum and other materials, and the heat conductivity coefficient of the metal reflecting plate is higher, so that the reflecting plate can rapidly lead out the heat of the heating device, and the heat dissipation efficiency of the heating device is higher. And if there is not other shielding object in the outside of reflecting plate, then the reflecting plate can directly exchange heat with outside space, and electronic equipment's radiating efficiency is very high.
If the number of the heating devices on the radio frequency circuit board is multiple and the heights of the heating devices are different, the heat conducting glue can be filled between the heating devices with lower heights and the reflecting plate, so that the reflecting plate can be contacted with more heating devices as much as possible.
Based on the above, in some embodiments of the present application, the reflective plate is provided with a plurality of first heat dissipation holes distributed at intervals. The plurality of first radiating holes and the plurality of antenna arrays are provided with gaps. The air above the reflecting plate can directly enter between the reflecting plate and the radio frequency circuit board through the plurality of first radiating holes and fully exchanges heat with the heating device. Therefore, the heat dissipation efficiency of the reflecting plate is improved, and shielding of the air duct by the antenna assembly is reduced. In addition, the plurality of first radiating holes and the plurality of antenna arrays have gaps, so that the plurality of first radiating holes do not influence the signal reflection performance of the reflecting plate on the antenna arrays.
Also, in some embodiments of the present application, the reflection plate is provided with a plurality of auxiliary heat dissipation teeth. The auxiliary heat dissipation teeth are distributed on one side of the reflecting plate, which is close to the radio frequency circuit board. Or a plurality of auxiliary heat dissipation teeth are positioned on one side of the reflecting plate, which is close to the antenna array, and are arranged at intervals with the plurality of antenna arrays. Or a part of the plurality of auxiliary radiating teeth are distributed on one side of the reflecting plate, which is close to the radio frequency circuit board, at intervals; the other part of the plurality of auxiliary heat dissipation teeth is positioned on one side of the reflecting plate, which is close to the antenna array, and is arranged at intervals with the plurality of antenna arrays. The plurality of auxiliary heat dissipation teeth can increase the heat dissipation area of the reflecting plate, so that the heat dissipation efficiency of the reflecting plate is further improved. And in the same way, the auxiliary heat dissipation teeth positioned on one side of the reflecting plate, which is close to the antenna array, and the plurality of antenna arrays are arranged at intervals, so that the signal reflection performance of the reflecting plate to the antenna array is not influenced by the auxiliary heat dissipation teeth.
In some embodiments, the circuit board assembly further includes a first heat sink disposed between the radio frequency circuit board and the reflective plate. And the first radiator is in contact connection with the heating device and the reflecting plate. That is, the heat generating device is in indirect contact with the reflective plate through the first heat sink. The heat generated by the heating device can be transferred to the reflecting plate through the first radiator, and the heat conduction speed of the first radiator is high, so that the heat dissipation capacity of the whole machine can be improved. Specifically, the connection mode of the heat dissipation teeth on the first heat radiator and the reflecting plate can be heat conduction glue connection, welding or riveting, etc.
Further, in some embodiments of the application, the first heat sink includes a plurality of heat dissipating teeth spaced apart from each other. The position on the reflecting plate corresponding to the radiating teeth is provided with a matching hole, and the radiating teeth can penetrate out of the matching hole to support the antenna array above the reflecting plate. Therefore, the length of at least part of radiating teeth on the first radiator is prolonged, and the radiating effect is further improved. And the area of the matching hole can be larger than that of the radiating teeth, so that the assembly operation is convenient, and the matching hole can be regarded as a radiating hole with stronger radiating capacity.
In other embodiments of the present application, the first heat sink includes a plurality of heat dissipating teeth disposed at intervals. And the positions of the reflecting plates corresponding to the radiating teeth are provided with avoiding holes. The heat dissipation tooth is penetrated out of the avoidance hole, and the upper end of the heat dissipation tooth is higher than the reflecting plate. In the same way, the length of at least part of radiating teeth on the first radiator is also prolonged, and the radiating effect is further improved. Similarly, the area of the avoidance hole can be larger than that of the heat dissipation tooth, and the avoidance hole can be regarded as a heat dissipation hole with stronger heat dissipation capability.
Also, in some examples, the circuit board assembly further includes a second heat sink disposed on a side of the radio frequency circuit board remote from the first heat sink. The heat dissipation area can be further improved by additionally arranging the second radiator, so that the heat dissipation efficiency of the circuit board assembly is improved.
To accommodate some outdoor application scenarios, in some examples, the second heat sink and the first heat sink enclose a first sealed cavity. The radio frequency circuit board is accommodated in the first sealing cavity. Therefore, the waterproof performance of the radio frequency circuit board is improved. And the antenna array can adopt a waterproof structure design.
In some embodiments, the antenna array adopting the waterproof structure design includes an insulating support and a radiation sheet, where the insulating support is supported on the reflecting plate. The radiation piece is arranged on the insulating support frame, and the outer surface of the radiation piece is provided with a waterproof coating. Therefore, the antenna array has good waterproof performance. And the insulating support can be made of weather-resistant materials such as plastic materials with good weather resistance, so that the insulating support is suitable for outdoor application scenes.
In other embodiments, the antenna array with the waterproof structure includes an insulating bracket and a radiating fin. Wherein, the insulating support is supported on the reflecting plate. A third sealing cavity is formed at the upper part of the insulating bracket. The radiation piece is arranged in the third sealing cavity. The third sealing cavity ensures the waterproof performance of the radiation piece. Therefore, the outer surface of the radiation sheet may or may not have a waterproof coating. Similarly, the insulating support can also be made of weather-resistant materials such as plastic materials with good weather resistance, so that the insulating support is suitable for outdoor application scenes.
In addition, in some embodiments of the present application, the antenna assembly further includes a radome, where the radome is disposed outside the plurality of antenna elements and at least part of the reflecting plate, and is connected to the reflecting plate or the radio frequency circuit board. The radome can mechanically protect a plurality of antenna arrays and the reflecting plate. Meanwhile, if the waterproof performance is considered, the joint of the radome and the reflecting plate or the radio frequency circuit board is waterproof sealed by adopting sealant.
Based on the above, in some embodiments, a plurality of second heat dissipation holes are formed on the radome, and the plurality of second heat dissipation holes are distributed at intervals. External cold air can enter the antenna housing through the second radiating holes to radiate heat of devices inside the antenna housing, so that the radiating efficiency of the circuit board assembly with the antenna housing is improved, and shielding of the air duct by the antenna assembly is reduced.
In addition, in order to adapt to some outdoor application scenes, the antenna housing comprises a housing body and an annular sealing enclosure. The cover body is arranged outside the plurality of antenna arrays and at least part of the reflecting plate and is connected with the reflecting plate or the radio frequency circuit board. The annular sealing enclosure is arranged on the inner wall of the cover body, and forms a second sealing cavity for sealing the antenna array together with part of the cover body and part of the reflecting plate. The design of the antenna housing can ensure the waterproof performance of a plurality of antenna arrays without adopting waterproof structures. And for the antenna housing with the second radiating holes, the second radiating holes are distributed on a part of the housing body forming the outside of the second sealing cavity at intervals.
In some embodiments, the antenna array is attached to the reflecting plate, and the antenna array is made of a heat conducting material or has a first heat conducting material layer on a surface thereof. The inner wall of the radome is provided with a second heat conduction material layer. The antenna assembly further comprises an elastic heat-conducting material layer, wherein the elastic heat-conducting material layer is arranged between the antenna array and the antenna housing and is attached to the antenna array and the antenna housing. Therefore, the heating device on the radio frequency circuit board can transfer heat to the antenna housing through the reflecting plate, the antenna array and the elastic heat conducting material layer, and then exchanges heat with external cold air. The antenna array can be made of a heat conducting material with a higher heat conducting coefficient, or the surface of the antenna array is provided with a first heat conducting material layer with a higher heat conducting coefficient, the inner wall of the antenna housing is made of a second heat conducting material layer with a higher heat conducting coefficient, and the elastic heat conducting material layer is made of a material with a higher heat conducting coefficient, so that the heat radiating effect on a heating device on the radio frequency circuit board can be guaranteed to be better, and the antenna array is particularly suitable for circuit board assemblies without a first radiator and a second radiator or without a second radiating hole.
Based on this, in some examples, the inner wall of the radome has a frequency selective surface. The second layer of thermally conductive material may be a frequency selective surface. Therefore, on the basis of not affecting the radiation performance of the signals of the multiple antenna arrays, the radiating effect of the heating device on the radio frequency circuit board is guaranteed to be good.
In the embodiment of the application, a plurality of antenna arrays and a radio frequency circuit board are connected in various modes. In some embodiments, the circuit board assembly further includes a power division feeder strip line, where the power division feeder strip line may be one or multiple. The power division feed signal line is connected with the antenna array and the radio frequency circuit board. The power division feeder strip line comprises a conductive connecting ring, a flexible dielectric material and a first reference ground wire, a signal wire and a second reference ground wire which are stacked and arranged at intervals. The conductive connection ring is sleeved outside the first reference ground wire and the second reference ground wire so as to connect the first reference ground wire with the second reference ground wire. The first reference ground and the second reference ground may be metal lines. The flexible dielectric material is filled in the gap among the first reference ground wire, the signal wire and the second reference ground wire. The signal line is a power division feed network line, and the power division form of the power division feed network line can be one-drive two-drive or one-drive three-drive. The shape of the first reference ground is the same as the shape of the second reference ground. The paths of the first reference ground line and the second reference ground line are the same as the paths of the signal lines. Therefore, the first reference ground line and the second reference ground line can be used as the reference ground of the signal line, so that the power division feed strip lines in the circuit board assembly can not interfere with each other. And the flexible dielectric material ensures that the power division feeder strip line has good toughness, and can be freely bent to a proper position in a certain angle, for example, bent to the outer side of the reflecting plate and then connected with the radio frequency circuit board. Therefore, shielding of the power division feed strip line to the main air duct is reduced, and space of the power division feed network line is not required to be reserved on the radio frequency circuit board.
For the antenna array adopting the waterproof structure, in order to realize the electrical connection between the antenna array and the power division feed strip line, in some embodiments, a containing cavity is formed on one side of the insulating support, which is away from the radiating fin. And a feeder line is formed on the inner wall of the accommodating cavity. The feeder line is coupled with the radiation piece to realize feeding to the radiation piece. The first end of the power division feed strip line is arranged between the insulating support and the reflecting plate and is positioned in the accommodating cavity. The signal line is disposed bare at a first end of the strip-shaped power division feeder line and is connected to the feeder line. Therefore, the connection part of the feeder line and the signal line can be positioned in the accommodating cavity of the insulating bracket, and the waterproof effect is good. In addition, in order to further improve the waterproof effect, the connection part of the feeder line and the signal line and the connection part of the insulating bracket and the reflecting plate can be filled with sealant.
In addition, in some embodiments, the circuit board assembly further comprises a waterproof connector, the waterproof connector is used for connecting the power division feeder strip line with the radio frequency circuit board, the connection operation is convenient, and the waterproof effect is good. In addition, the joint of the insulating sealing structure and the waterproof connector can be sealed by adopting an injection molding process, can also be sealed by adopting sealant, and can be particularly sealant with good weather resistance.
In some embodiments of the present application, the circuit board assembly further includes an insulating sealing structure, wherein the insulating sealing structure seals the plurality of antenna arrays and the power division feed strip line. The insulating sealing structure can further improve the waterproof effect on the plurality of antenna arrays and the power division feed strip line. In addition, in order to ensure the heat dissipation effect, the insulating sealing structure can be made of materials with good heat conductivity.
In some examples, the insulating sealing structure includes an insulating sealing layer, and the insulating sealing layer wraps the outer sides of the plurality of antenna arrays and the power division feed strip line. The insulating sealing layer can be made of a material with good weather resistance.
For example, the antenna array and the power division feed strip line (and the waterproof connector) are soaked in weather-resistant colored glue, so that glue with uniform thickness is attached to the outer surfaces of the antenna array and the power division feed strip line (and the waterproof connector). Thus, the insulating sealing layer can be formed outside the plurality of antenna elements and the power division feed strip line. The glue solution is flexible after solidification, can be convenient for bending operation of the power division feeder strip line, can isolate external rainwater, sunlight, corrosive gas and the like, and has good outdoor application characteristics such as water resistance, corrosion resistance, UV aging resistance and the like.
For another example, a thermal shrinkage process is adopted to form a film thermal shrinkage layer, namely an insulating sealing layer, on the outer surfaces of the antenna array and the power division feeder strip line (and the waterproof connector). The film heat shrinkage layer has insulation and waterproof effects.
In other examples, the insulating sealing structure includes an insulating sealing box, and the plurality of antenna arrays and the power division feed strip line are accommodated in the insulating sealing box. For example, the insulating sealing box can be an upper box body and a lower box body which are buckled with each other, and a plurality of antenna arrays and power division feed strip lines can be conveniently placed in the insulating sealing box. After the assembly operation is completed, the buckling parts of the upper box body and the lower box body can be sealed by sealing materials, so that good waterproof performance is ensured.
In addition, in some embodiments, the insulating sealing box may be the same as the shape and size of the assembled piece after the antenna array and the power division feed strip line are assembled, so that the volume of the assembled piece is smaller. In other embodiments, the insulating sealing box may be rectangular, square, etc. and is convenient to process.
In addition, in other embodiments, the insulating sealing structure includes an insulating material layer and a sealant. Wherein, insulating material layer parcel is in the outside of dividing the power feed stripline. The sealant is filled at the joint of the power division feed strip line and the plurality of antenna arrays. The design is suitable for the antenna array adopting the waterproof structure design. The insulating material layer can ensure the waterproof performance of the power division feed strip line, and the sealant can ensure the waterproof performance of the joint of the power division feed strip line and the antenna array. In addition, the sealant can be filled at the joint of the power division feeder strip line and the waterproof connector.
It should be noted that, in some embodiments of the present application, the circuit board assembly further includes a power distribution feeding board, where the power distribution feeding board includes a substrate, a first connection conductive pillar, a plurality of second connection conductive pillars, and a first reference ground line, a signal line, and a second reference ground line that are sequentially stacked from top to bottom and are disposed at intervals. The first connection guide post connects the first reference ground wire and the second reference ground wire so as to realize the connection of the first reference ground wire and the second reference ground wire. The signal line is a power division feed network line. The shape of the first reference ground is the same as the shape of the second reference ground. The paths of the first reference ground line and the second reference ground line are the same as the paths of the signal lines. The power division feed plate is arranged below the plurality of antenna arrays. The first end of the signal line is positioned outside the first end of the first reference ground line. The plurality of second connecting conductive posts connect the plurality of antenna elements with the first ends of the signal lines.
Based on the design, in some embodiments, the circuit board assembly further includes a sealing cover, and the sealing cover is arranged outside the plurality of antenna arrays on the power division feeding board and is in sealing connection with the power division feeding board. Therefore, waterproof performance of the antenna arrays and the joints of the antenna arrays and the power division feed plate is guaranteed.
In addition, in some embodiments, the radio frequency circuit board is provided with a power division feed network circuit. The circuit board assembly further comprises a coaxial radio frequency wire and a waterproof connector, and one end of the coaxial radio frequency wire is connected with the antenna array. The waterproof connector connects the other end of the coaxial radio frequency line with the power division feed network line. The waterproof performance of the circuit board assembly is also good.
In some embodiments, the radio frequency circuit board is provided with a power division feed network circuit and a signal receiving and transmitting processing circuit. The circuit board assembly further comprises a radio frequency connector, and the radio frequency connector can connect the antenna array with a power division feed network line and a signal receiving and transmitting processing circuit of the radio frequency circuit board.
In some embodiments, the circuit board assembly further includes a power division feed network circuit board, a sealed housing, a plurality of first coaxial rf lines, a waterproof connector, and a second coaxial rf line. The power division feed network plate is arranged on the reflecting plate. The power division feed network circuit board is provided with a power division feed network circuit, and the power division feed network circuit is provided with a plurality of first ports and second ports. The power division feed network circuit board is accommodated in the sealing shell. The first coaxial radio frequency lines are used for respectively and correspondingly connecting the first ports of the power division feed network line with the antenna arrays. One end of the second coaxial radio frequency line is connected with a second port of the power division feed network line. The waterproof connector is connected with the other end of the second coaxial radio frequency wire and is connected with the radio frequency circuit board. At this time, the radio frequency circuit board is provided with a signal receiving and transmitting processing circuit, and the waterproof connector can be connected with the signal receiving and transmitting processing circuit. The circuit board assembly also has good waterproof performance.
In a second aspect, an embodiment of the present application further provides an electronic device, including a housing and the circuit board assembly described in the foregoing embodiment. The circuit board assembly is disposed within the housing. Because the circuit board assembly in the electronic device of the embodiment of the application has the same structure as the circuit board assembly described in the above embodiment, the circuit board assembly and the circuit board assembly can solve the same technical problems and obtain the same technical effects, and the description thereof is omitted.
Drawings
In order to describe the technical solution of the embodiment of the present application, the drawings required to be used in the embodiment of the present application will be described below.
FIG. 1 is an exploded view of a circuit board assembly according to an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of a first circuit board assembly according to an embodiment of the application;
FIG. 3 is a schematic cross-sectional view of a reflective plate having a first heat dissipation hole in a first circuit board assembly according to an embodiment of the application;
FIG. 4 is a schematic cross-sectional view of a first embodiment of a circuit board assembly according to the present application, wherein the lower surface of the reflector has auxiliary heat dissipation teeth;
FIG. 5 is a schematic cross-sectional view of a first embodiment of a circuit board assembly with an upper surface of a reflector plate having auxiliary heat dissipating teeth;
FIG. 6 is a schematic cross-sectional view of a first embodiment of a circuit board assembly according to the present application, wherein the upper surface and the lower surface of the reflector plate are provided with auxiliary heat dissipation teeth;
FIG. 7 is a schematic cross-sectional view of a first embodiment of a circuit board assembly according to the present application, wherein the upper surface and the lower surface of the reflective plate are provided with auxiliary heat dissipation teeth and first heat dissipation holes;
FIG. 8 is a schematic cross-sectional view of a first circuit board assembly with a first heat sink according to an embodiment of the application;
fig. 9 is a schematic cross-sectional view of an antenna module in the related art;
fig. 10 is a schematic cross-sectional view of a first circuit board assembly according to the first embodiment of the present application, in which a portion of heat dissipation teeth of a first heat sink are disposed beyond a reflective plate, and an antenna array is supported above the reflective plate at intervals;
FIG. 11 is a schematic cross-sectional view of a first circuit board assembly with a portion of heat dissipation teeth of a first heat sink disposed beyond a reflective plate according to an embodiment of the present application;
fig. 12 is a schematic cross-sectional view of a first circuit board assembly having a second heat sink according to an embodiment of the application;
FIG. 13 is a schematic cross-sectional view of a first circuit board assembly with a radome and a reflector connected to the radome according to the present application;
FIG. 14 is a schematic cross-sectional view of a first circuit board assembly with a radome and a radome coupled with a first heat sink according to an embodiment of the present application;
FIG. 15 is a schematic cross-sectional view of a radome having a second heat dissipation hole in a first circuit board assembly according to an embodiment of the present application;
fig. 16 is a schematic perspective view of a radome in a first circuit board assembly according to an embodiment of the present application;
FIG. 17 is a schematic cross-sectional view of a second sealed cavity formed between a radome and a reflector in a first circuit board assembly according to an embodiment of the present application;
FIG. 18 is a schematic cross-sectional view of a second circuit board assembly according to an embodiment of the present application;
fig. 19 is a schematic cross-sectional view of an antenna array having a first layer of thermally conductive material in a second circuit board assembly according to an embodiment of the present application;
Fig. 20 is a schematic structural diagram of a first antenna array according to an embodiment of the present application;
fig. 21 is a schematic structural diagram of a second antenna array according to an embodiment of the present application;
FIG. 22 is a schematic cross-sectional view of a first circuit board assembly having a radio frequency connector according to an embodiment of the present application;
Fig. 23 is a schematic cross-sectional view of a first circuit board assembly having a power division feed stripline and connector according to an embodiment of the application;
fig. 24 is a schematic diagram of a three-dimensional structure of an assembly of a power division feed strip line, a connector and three antenna elements according to an embodiment of the present application;
fig. 25 (a) is a schematic perspective view of a power division feeder strip line according to an embodiment of the present application;
fig. 25 (b) is a schematic diagram of a partial structure of a power division feeder strip line according to an embodiment of the present application;
fig. 26 is a schematic cross-sectional view of a connection between an antenna element and a power division feed strip line according to a first embodiment of the present application;
fig. 27 is a schematic cross-sectional view of a second antenna element connected to a power division feed strip line according to an embodiment of the present application;
fig. 28 is a schematic perspective view showing an insulation material layer disposed outside a power division feeder strip line according to an embodiment of the present application;
Fig. 29 is a schematic diagram of a three-dimensional structure of an insulating seal case according to an embodiment of the present application, which is disposed outside a power division feed strip line and three antenna arrays;
fig. 30 is a schematic cross-sectional view of an insulating material layer disposed outside a power division feed stripline according to an embodiment of the present application;
Fig. 31 (a) is a schematic diagram of a three-dimensional structure of a power division feeding network circuit board with a power division feeding network circuit according to an embodiment of the present application;
fig. 31 (b) is a schematic cross-sectional view of a power division feeding network circuit board according to an embodiment of the present application;
Fig. 32 is a schematic diagram of an assembly structure of a power division feed network circuit board, a sealing cover and three antenna arrays according to an embodiment of the present application;
Fig. 33 (a) is a schematic perspective view of a printed circuit board with a power division feeding network circuit according to an embodiment of the present application;
fig. 33 (b) is a schematic structural view of a first circuit board assembly according to an embodiment of the present application, having coaxial rf lines and a waterproof connector;
Fig. 34 is a schematic diagram of an assembly structure of six antenna arrays, two power division feed network circuit boards, two sealed housings, two first coaxial rf lines and two second coaxial rf lines according to an embodiment of the present application;
Fig. 35 is a schematic diagram of an assembly structure of six antenna elements, a power division feed network circuit board, a seal housing, and six second coaxial rf lines according to an embodiment of the present application;
Fig. 36 is a schematic diagram of an assembled structure of six antenna arrays, six sealed housings, six first coaxial rf lines and six second coaxial rf lines according to an embodiment of the present application.
Reference numerals:
1000-circuit board assembly, 10-antenna assembly, 1-reflecting plate, 11-first radiating hole, 12-auxiliary radiating tooth, 13-matching hole, 14-avoidance hole, 15-avoidance hole, 2-antenna array, 20 a-first material layer, 20 b-third sealing cavity, 21-insulating support, 211-accommodation cavity, 212-feeder, 22-radiating sheet, 221-waterproof coating, 3-antenna housing, 301-second radiating hole, 302-second sealing cavity, 303-second material layer, 31-housing, 32-annular sealing enclosure, 4-elastic heat conducting material layer, 20-radio frequency circuit board, 201-printed circuit board, 202-radio frequency chip, 200 a-heating device, 30-first radiator, 311-radiating tooth, 40-second heat sink, 50-first sealed cavity, 60-radio frequency connector, 70-power division feed strip line, 70 a-power division feed board, 701-first reference ground line, 702-signal line, 702S-power division feed network line, 702 a-first port, 702 b-second port, 703-second reference ground line, 704-conductive connection ring, 705-flexible dielectric material, 706-first connection conductive post, 707-second connection conductive post, 80-connector, 90-insulating seal structure, 91-insulating seal layer, 92-insulating seal box, 93-insulating material layer, 100-seal cover, 110-coaxial radio frequency line, 120-waterproof connector, 130-power division feed network circuit board, 140-a sealed housing, 150-a first coaxial radio frequency wire, 160-a second coaxial radio frequency wire, 200-a mounting base.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings.
Hereinafter, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
Furthermore, in the present application, the terms of orientation such as "upper," "lower," "left," "right," "horizontal," and "vertical" are defined with respect to the orientation in which the components in the drawings are schematically disposed, and it should be understood that these directional terms are relative terms, which are used for descriptive and clarity with respect thereto, and which may be correspondingly altered in response to changes in the orientation in which the components in the drawings are disposed. In the present application, unless specifically stated and limited otherwise, the term "coupled" is to be construed broadly, e.g., the term "coupled" may refer to a mechanical, physical, or a combination of structures. For example, the two parts can be fixedly connected, detachably connected or integrated; can be directly connected or indirectly connected through an intermediate medium. The circuit structure is also understood to be in physical contact and electrical conduction with components, and also understood to be in a form of connection between different components in a circuit structure through a PCB copper foil or a lead and other physical circuits capable of transmitting electric signals.
The embodiment of the application comprises an electronic device which can be applied to a base station, broadcast equipment, television equipment, radar equipment, navigation equipment, remote sensing equipment and the like, and the application is not limited to the above. The electronic device includes a housing, and a circuit board assembly disposed within the housing. As shown in fig. 1, the circuit board assembly 1000 includes an antenna assembly 10 and a radio frequency circuit board 20. The radio frequency circuit board 20 is electrically connected to the antenna assembly 10, and is used for feeding the antenna assembly 10. The specific feeding mode can be microstrip line feeding, coaxial feeding or electromagnetic coupling feeding, and the application is not limited to this. The radio frequency circuit board 20 may specifically be a printed circuit board 201. The printed circuit board 201 is provided with a radio frequency chip 202, the radio frequency chip 202 is integrated with a radio frequency circuit, and the radio frequency chip 202 is electrically connected with the antenna assembly 10 through a line on the printed circuit board 201. The rf chip 202 feeds the processed rf signal to be transmitted to the antenna assembly 10, and the antenna assembly 10 radiates the rf signal. Thus, the function of transmitting radio frequency signals by the electronic equipment is realized. The antenna assembly 10 may also receive radio frequency signals transmitted by other electronic devices and feed the radio frequency chip 202. Thus, the function of receiving the radio frequency signal by the electronic equipment is realized. Therefore, the electronic device may be a communication device.
With the development of communication technology, the capacity and rate requirements of communication equipment (especially 5G communication equipment) are higher and higher, so that the overall power consumption of the communication equipment is increased. Therefore, the communication device is required to have good heat dissipation performance.
The radio frequency circuit board 20 in the electronic device according to the embodiment of the present application is provided with a heat generating device 200a. The number of the heat generating devices 200a may be one or more, and the present application is not limited thereto. The heat generating device 200a may include the radio frequency chip 202 shown in fig. 1 and may be other high-power electronic devices on the printed circuit board 201.
In order to improve the heat dissipation efficiency of the electronic device, in some embodiments of the present application, referring to fig. 1 and 2, the antenna assembly 10 includes a reflection plate 1 and a plurality of antenna arrays 2. The reflection plate 1 is disposed above the radio frequency circuit board 20. The reflection plate 1 is grounded, so that the receiving capability of the antenna assembly 10 can be enhanced. The reflection plate 1 also serves to block and shield interference of other radio waves from the lower side with the received signal. The reflecting plate 1 is usually made of metal material, and the molding mode can be realized by adopting technologies such as die casting, aluminum extrusion molding, sheet metal and the like. The heat generating device 200a may be in contact with the reflection plate 1. The contact may be a direct contact or may be a contact through other devices. The plurality of antenna elements 2 are distributed on the side of the reflecting plate 1 away from the radio frequency circuit board 20, that is, the plurality of antenna elements 2 shown in fig. 1 are all located above the reflecting plate 1. And the radio frequency circuit board 20 is located below the reflection plate 1. The plurality of antenna elements 2 may be electrically connected to the radio frequency circuit board 20 by a feed structure such as a connector. The plurality of antenna arrays 2 may transmit the radio frequency signals to be transmitted processed by the radio frequency chip 202 in the radio frequency circuit board 20, and may also receive radio frequency signals transmitted by other electronic devices.
Taking the direct close contact of the heat generating device 200a on the radio frequency circuit board 20 and the reflecting plate 1 as an example, the reflecting plate 1 made of metal material has higher heat conductivity, so that the reflecting plate 1 can rapidly lead out the heat of the heat generating device 200a, and the heat dissipation efficiency of the heat generating device 200a is higher. If there is no other shielding object on the outer side of the reflecting plate 1, the reflecting plate 1 can directly exchange heat with the outside air, and the heat dissipation efficiency of the electronic device is high.
Note that, the heat conductive adhesive is filled between the plurality of heat generating devices 200a on the radio frequency circuit board 20 and the reflecting plate 1. The heat conductive paste can rapidly transfer heat generated from the plurality of heat generating devices 200a to the reflection plate 1.
Further, as illustrated in fig. 2, the circuit board assembly 1000 may include a mounting base 200, and the mounting base 200 is disposed under the reflection plate 1 and is hermetically connected with the reflection plate 1, thereby sealing the radio frequency circuit board 20. The specific sealing mode can be sealant.
In some embodiments, as shown in fig. 3, a plurality of first heat dissipation holes 11 are formed in the reflective plate 1, and the plurality of first heat dissipation holes 11 are all distributed at intervals. The air above the reflection plate 1 may directly enter between the reflection plate 1 and the radio frequency circuit board 20 through the plurality of first heat dissipation holes 11 and sufficiently exchange heat with the heat generating device 200 a. The heat dissipation efficiency of the electronic device having the reflection plate 1 is high. In order to avoid that the first heat dissipation holes 11 affect the reflection and shielding performance of the reflection plate 1 on signals, the plurality of antenna elements 2 and the plurality of first heat dissipation holes 11 have gaps.
In addition, other auxiliary structures can be arranged on the reflecting plate 1 to further improve the heat dissipation efficiency of the electronic equipment. For example, referring to fig. 4, the reflection plate 1 is further provided with a plurality of auxiliary heat dissipation teeth 12 spaced apart from each other. The plurality of auxiliary heat dissipation teeth 12 are additionally arranged, so that the heat dissipation area of the reflecting plate 1 can be increased, and the heat dissipation efficiency of the electronic equipment is further improved. The auxiliary heat dissipation teeth 12 may be L-shaped as shown in fig. 4, or may be elongated, which is not limited in the present application. For example, the reflecting plate 1 is manufactured by a sheet metal forming process, and the auxiliary heat dissipation teeth 12 can be added only by a welding mode. Therefore, the auxiliary radiating teeth 12 may be formed in an L shape.
The plurality of auxiliary heat radiating teeth 12 may be located at a side of the reflection plate 1 near the rf circuit board 20. That is, the plurality of auxiliary heat radiating teeth 12 shown in fig. 4 are all located on the lower surface of the reflection plate 1. A plurality of auxiliary radiating teeth 12 may also be provided on the side of the reflecting plate 1 near the antenna array 2. That is, the plurality of auxiliary heat radiating teeth 12 shown in fig. 5 are all located on the upper surface of the reflection plate 1. Or as shown in fig. 6, some of the plurality of auxiliary heat dissipation teeth 12 are located on a side of the reflection plate 1 near the radio frequency circuit board 20, and others of the plurality of auxiliary heat dissipation teeth 12 are located on a side of the reflection plate 1 near the antenna array 2.
It will be appreciated that, similarly, in order to avoid that the auxiliary heat dissipation teeth 12 affect the reflection and shielding performance of the reflection board 1 on the signal, all the auxiliary heat dissipation teeth 12 located on the side of the reflection board 1 away from the radio frequency circuit board 20 need to be located away from the antenna array 2. Therefore, as shown in fig. 4 to 6, one or more auxiliary heat dissipation teeth 12 located at one side of the reflection plate 1 near the antenna array 2 are spaced apart from the plurality of antenna arrays 2. The distance between the auxiliary radiating teeth 12 and the antenna array 2 can be selected according to the radiation performance of the antenna array 2.
For example, the reflection plate 1 shown in fig. 7 is provided with a plurality of first heat dissipation holes 11 and a plurality of auxiliary heat dissipation teeth 12, and the heat dissipation efficiency of the electronic device having the reflection plate 1 is high.
The above embodiment is described taking the case that the reflecting plate 1 is in direct contact with the heat generating device 200a on the rf circuit board 20 as an example, and in some embodiments, the circuit board assembly 1000 further includes a first heat sink 30 as shown in fig. 8, where the first heat sink 30 is disposed between the rf circuit board 20 and the reflecting plate 1. The first heat sink 30 is in contact with the heat generating device 200a and the reflection plate 1. For example, the first heat sink 30 is connected to the reflection plate 1 by means of glue (e.g., heat conductive glue), welding, riveting, screw connection, or the like. Therefore, the heat of the heat generating device 200a may be transferred to the first heat sink 30 to radiate heat, and may also be transferred to the reflection plate 1 through the first heat sink 30. That is, the heat generating device 200a is indirectly in contact with the reflection plate 1 through the first heat sink 30. The first radiator 30 is additionally arranged, so that the radiating area of the heating device 200a is further increased, and the radiating efficiency of the whole machine is improved.
In the electronic device shown in fig. 9, the antenna assembly 10 is mounted as a whole on the first heat sink 30, and since the antenna assembly 10 is connected to the radio frequency circuit board 20 below the first heat sink 30 through a rigid radio frequency connector, it is necessary to secure the mounting accuracy thereof. However, other positions of the first heat sink 30 cannot be guaranteed to be in contact with the antenna assembly 10, so that the contact area between the first heat sink 30 and the antenna assembly 10 is very small, and the heat conduction speed is poor. In addition, the antenna assembly 10 also blocks the external air from contacting the first heat sink 30, so that the heat dissipation efficiency of the electronic device is poor.
Compared with the electronic device shown in fig. 9, in the electronic device of the embodiment of the application, the assembly of the reflecting plate 1 and the first radiator 30 and the assembly of the plurality of antenna arrays 2 and the radio frequency circuit board 20 do not affect each other, so that the reflecting plate 1 can be ensured to be in close contact with the first radiator 30, and the accurate connection of the antenna arrays 2 and the radio frequency circuit board 20 can be ensured, so that the heat dissipation efficiency of the electronic device of the embodiment of the application is higher.
The first heat sink 30 includes a plurality of heat dissipating teeth 311 disposed at intervals. In order to further increase the heat dissipation area of the reflection plate 1, in some embodiments, as shown in fig. 10, the reflection plate 1 is provided with a matching hole 13 at a position corresponding to the heat dissipation tooth 311 of the first heat sink 30. The heat radiation teeth 311 of the first heat sink 30 may be disposed to penetrate the fitting hole 13. Therefore, the length of at least part of the heat dissipation teeth 311 on the first heat sink 30 is prolonged, and the heat dissipation effect of the whole machine is further improved. The area of the mating hole 13 may be larger than that of the heat dissipating tooth 311, for example, the mating hole 13 may be a long strip, which is convenient for assembly operation, and may be regarded as a heat dissipating hole having high heat dissipating capability. The fitting hole 13 is located directly below the antenna element 2. The radiating teeth 311 may support the antenna array 2 above the reflection plate 1 at intervals. Therefore, shielding of the reflecting plate 1 by the antenna array 2 can be reduced, and the contact area between the reflecting plate 1 and the outside air can be further increased.
The number of the fitting holes 13 may be one or plural. The plurality of fitting holes 13 may be respectively in one-to-one correspondence with the plurality of heat dissipation teeth 311 of the first heat sink 30. Each antenna element 2 may be supported above the reflector plate 1 by one or more heat dissipating teeth 311.
In addition, in order to further increase the heat dissipation area of the first heat sink 30, in some embodiments, as shown in fig. 11, relief holes 14 are formed in the reflection plate 1 at positions corresponding to the heat dissipation teeth 311. And, the heat dissipation teeth 311 may pass through the avoidance holes 14, and the upper ends of the heat dissipation teeth 311 are higher than the reflection plate 1. Similarly, the length of at least part of the heat dissipation teeth 311 on the first heat sink 30 is also prolonged, and the heat dissipation effect of the whole machine is further improved. Similarly, the area of the avoidance hole 14 may be larger than the area of the heat dissipation teeth 311, and the avoidance hole 14 may be regarded as a heat dissipation hole with a strong heat dissipation capability. The avoiding hole 14 is provided at an interval from the antenna element 2.
In addition, other heat dissipation structures can be added. For example, the circuit board assembly 1000 further includes a second heat sink 40 as shown in fig. 12, the second heat sink 40 being disposed on a side of the radio frequency circuit board 20 remote from the first heat sink 30. The second heat sink 40 may further increase the heat dissipation area of the electronic device.
Also, in some embodiments, the second heat sink 40 encloses a first sealed cavity 50 with the first heat sink 30. The radio frequency circuit board 20 may be housed within a first sealed cavity 50. Therefore, the radio frequency circuit board 20 has good sealing performance, so that the electronic equipment can be applied to outdoor application scenes.
In order to protect the antenna array 2 from the external environment, in some embodiments of the present application, the antenna assembly 10 further includes a radome 3 as shown in fig. 13, where the radome 3 may be disposed outside the plurality of antenna arrays 2 and the partial reflection plate 1, and the radome 3 is connected to the reflection plate 1. Or as shown in fig. 14, the radome 3 is disposed outside the plurality of antenna elements 2 and the entire reflection plate 1, and the radome 3 is connected to the first heat sink 30 (or the radio frequency circuit board 20). The radome 3 may mechanically protect the plurality of antenna elements 2 and the reflecting plate 1. Meanwhile, if the waterproof performance is considered, the connection part of the radome 3 and the reflecting plate 1 or the radio frequency circuit board 20 is waterproof sealed by adopting sealant.
However, considering that the radome 3 may affect the reflection plate 1 (and the first heat sink 30) to be in full contact with the external air, in some embodiments, as shown in fig. 15, a plurality of second heat dissipation holes 301 are formed on the radome 3, and the plurality of second heat dissipation holes 301 are spaced apart. The radome 3 having the plurality of second heat radiation holes 301 may also have a certain mechanical protection effect. External cold air can enter the antenna housing 3 through the plurality of second radiating holes 301 to radiate heat of devices inside the antenna housing 3, so that the radiating efficiency of the electronic equipment with the antenna housing 3 is improved, the blocking of the antenna assembly 10 to a radiating air channel in the electronic equipment is reduced, and the radiating capacity can be improved by more than 15%.
In addition, the second heat dissipation holes 301 may be square holes, round holes, louver holes, elongated slots, or irregular holes, which is not limited in the present application. The second heat radiation holes 301 may be formed in a partial region of the radome 3, or the second heat radiation holes 301 may be formed in the entire radome 3. In fig. 16, a plurality of second heat dissipation holes 301 formed in four sides of the radome 3 are square holes, and a plurality of second heat dissipation holes 301 formed in a top plate of the radome 3 are circular holes.
In order to accommodate some outdoor applications, in some embodiments, as shown in fig. 17, the radome 3 includes a cover 31 and an annular sealing enclosure 32. The cover 31 may be disposed outside the plurality of antenna elements 2 and the partial reflection plate 1, and the cover 31 is connected to the reflection plate 1. Or the cover 31 is arranged outside the plurality of antenna arrays 2 and the whole reflecting plate 1, and the cover 31 is connected with the first radiator 30 or the radio frequency circuit board 20. And an annular sealing fence 32 is provided on the inner wall of the cover body 31 and is connected with the reflection plate 1. The annular sealing enclosure 32 may enclose the second sealing cavity 302 with a portion of the cover 31 and a portion of the reflection plate 1. The antenna array 2 may be housed within the second sealed cavity 302. Therefore, the sealing performance of the antenna array 2 is ensured to be better. In particular, the antenna array 2 is suitable for application scenes in which the antenna array 2 does not have a waterproof structure design.
For the radome 3 having the second heat dissipation holes 301, the plurality of second heat dissipation holes 301 are all distributed on a part of the area of the cover 31 outside the second sealed cavity 302 at intervals.
The number of the annular sealing barriers 32 in the radome 3 may be one or plural, and the present application is not limited thereto. The plurality of annular sealing barriers 32 may enclose a plurality of second sealing cavities 302 with the cover 31 and the reflecting plate 1. The plurality of second sealed cavities 302 may respectively accommodate a plurality of antenna elements 2.
But with some electronic devices having only a closed radome 3 without the first and second heat sinks 30, 40 described above, the electronic device has poor heat dissipation capability. To solve this problem, in some embodiments, as shown in fig. 18, the antenna array 2 is attached to the reflection plate 1. The antenna array 2 may be made of a heat conductive material, and the inner wall of the radome 3 is provided with a second heat conductive material layer 303. The antenna assembly 10 further comprises an elastic heat-conducting material layer 4, wherein the elastic heat-conducting material layer 4 is arranged between the antenna array 2 and the antenna housing 3 and is attached to the antenna array 2 and the antenna housing 3. Therefore, the heat generating device 200a on the rf circuit board 20 can conduct heat to the radome 3 through the reflecting plate 1, the antenna array 2, the elastic heat conducting material layer 4 and the second heat conducting material layer 303, and then exchange heat with the cold air outside. The antenna array 2 can be made of a heat conducting material with a high heat conductivity coefficient, the inner wall of the antenna housing 3 is made of a second heat conducting material layer 303 with a high heat conductivity coefficient, and the elastic heat conducting material layer 4 is made of a material with a high heat conductivity coefficient, so that the heat dissipation efficiency of the electronic device is high. And, the elastic heat conduction material layer 4 has certain elasticity, can guarantee that the elastic heat conduction material layer 4 can closely laminate with the antenna array 2 and the antenna housing 3 when the antenna assembly 10 is assembled. And the elastic heat conduction material layer 4 can also generate certain high-temperature deformation, so that after long-time heat conduction, the elastic heat conduction material layer 4 can still be closely attached to the antenna array 2 and the antenna housing 3.
Note that, the antenna element 2 may be made of a non-heat conductive material, and the first heat conductive material layer 20a shown in fig. 19 may be disposed on the outer surface of the antenna element 2. Therefore, the reflective plate 1 can conduct out the heat of the heat generating device 200a through the first heat conductive material layer 20a, the elastic heat conductive material layer 4 and the second heat conductive material layer 303 on the antenna array 2. The first heat conductive material layer 20a is also made of a material having a high heat conductivity coefficient.
In addition, if the second heat-conducting material layer 303 is made of a metal material, in order to avoid that the second heat-conducting material layer 303 affects the performance of the antenna array 2 for emitting signals, the inner wall of the radome 3 has a frequency-selective surface, and the frequency-selective surface is the second heat-conducting material layer 303. Thus, the frequency selective surface may avoid affecting the signal emitted by the antenna element 2.
The foregoing mainly describes various structural designs for improving the heat dissipation efficiency of electronic devices. In order to adapt to outdoor application scenes, the antenna array 2 in the embodiment of the application adopts a waterproof structure design.
In some embodiments, as shown in fig. 20, the antenna array 2 includes an insulating support 21 and a radiating patch 22. Wherein the insulating holder 21 is supported on the reflecting plate 1. The radiation sheet 22 may be made of a metal material, and the outer surface of the radiation sheet 22 has a waterproof coating 221, and the radiation sheet 22 is disposed on the insulating support 21. For example, the radiation piece 22 may be provided on the insulating holder 21 by plating or by sheet metal assembly. Therefore, the antenna array 2 has good waterproof effect, can avoid the problem that the electric performance of the antenna assembly 10 is deteriorated due to the fact that rainwater and foreign matters are attached to the surface of the antenna array 2, and can cope with some outdoor application scenes. In addition, the insulating support 21 can be made of weather-resistant materials such as plastic materials with good weather resistance, and is further beneficial to outdoor application.
In other embodiments, as shown in fig. 21, the antenna array 2 includes an insulating support 21 and a radiating patch 22. Wherein the insulating holder 21 is supported on the reflecting plate 1. A third seal chamber 20b is formed at an upper portion of the insulating holder 21. The radiation sheet 22 is disposed in the third sealed chamber 20b, and the third sealed chamber 20b ensures the waterproof performance of the radiation sheet 22, so the outer surface of the radiation sheet 22 may or may not have the waterproof coating 221 described above. Similarly, the insulating support 21 can also be made of weather-resistant materials such as plastic materials with better weather resistance, so as to adapt to outdoor application scenes.
The antenna array 2 and the rf circuit board 20 are connected in various ways. For example, in some embodiments, the circuit board assembly 1000 further includes a radio frequency connector 60 as shown in fig. 22, the radio frequency connector 60 being disposed through the reflective plate 1 (and the first heat sink 30) and connecting the antenna array 2 with the radio frequency circuit board 20. The rf circuit board 20 is provided with a power division feeding network line 702S and a signal transceiving processing circuit, and the rf connector 60 is connected with the power division feeding network line 702S and the signal transceiving processing circuit on the rf circuit board 20. In addition, the reflector 1 (and the first radiator 30) may be provided with an avoidance port 15, so that the radio frequency connector 60 may be connected with the antenna array 2 and the radio frequency connector 60 through the avoidance port 15.
As another example, as shown in fig. 23 and 24, the circuit board assembly 1000 further includes a power division feed stripline 70 and a connector 80. One end of the power division feed strip line 70 is connected to the antenna element 2. The connector 80 is connected to the other end of the power division feed strip line 70, and the connector 80 is connected to the radio frequency circuit board 20. As shown in fig. 25 (a) and (b), the power division feed strip line 70 includes a first reference ground line 701, a signal line 702, a second reference ground line 703, a conductive connection ring 704, and a flexible dielectric material 705. The first reference ground line 701, the signal line 702, and the second reference ground line 703 are stacked in this order and arranged at intervals. The first reference ground line 701 and the second reference ground line 703 may be metal lines. The flexible dielectric material 705 fills the gaps between the first reference ground line 701, the signal line 702, and the second reference ground line 703. The conductive connection ring 704 is sleeved outside the first reference ground line 701 and the second reference ground line 703. The signal line 702 is a power division feeding network line 702S, and the signal line 702 integrates a power division network and a feeding function. Also, impedance matching may be achieved by designing the width, length, and shape of the different branches in the signal line 702. The shape of the first reference ground line 701 is the same as the shape of the second reference ground line 703. The paths of the first reference ground line 701 and the second reference ground line 703 are the same as those of the signal line 702. The electronic device of the embodiment of the present application adopts the power division feed network line 702S and the signal line 702 to be integrated together to manufacture the power division feed strip line 70. Further, since the power division feed strip line 70 has the flexible dielectric material 705, the power division feed strip line 70 may be freely bent to the outside of the reflection plate 1 (and the first heat sink 30) within a certain angle (or an opening for the power division feed strip line 70 is opened in a region near the edge of the reflection plate 1) and then connected to the radio frequency circuit board 20. The power division feed strip line 70 and the connector 80 do not shade the reflecting plate 1 (and the first radiator 30), so that shielding of the power division feed strip line 70 to the radiating air duct is reduced, and space of the power division feed network line 702S is not required to be reserved on the radio frequency circuit board 20. The power division feed network circuit 702S is not required to be distributed on the radio frequency circuit board 20, so that the area of the radio frequency circuit board 20 is reduced.
The power division feeding network 702S may have a first port 702a and a second port 702b, where the first port 702a is connected to the antenna array 2. The second port 702b is for connection with the radio frequency circuit board 20 through the connector 80. For example, the power division feeding network line 702S has two first ports 702a and one second port 702b, and the two first ports 702a are respectively connected to the two antenna arrays 2. That is, the power division feed network line 702S is in the form of one-drive two-power division. As another example, the power division feed network line 702S has only one first port 702a and one second port 702b, the second port 702b being connected to the antenna array 2. That is, the power division feed network line 702S is a one-drive feed. The number of the first ports 702a in the power division feeding network 702S may be one, or two or more, which is not limited in the present application. It should be noted that the conductive connection ring 704 may be located at the second port 702b of the power division feed strip line 70.
Based on the above structure of the power division feed strip line 70, in order to connect the power division feed strip line 70 to the antenna array 2 shown in fig. 20, as shown in fig. 26, the insulating holder 21 in the antenna array 2 is formed with a receiving cavity 211 on a side (a lower side as shown in fig. 26) facing away from the radiation piece 22. A power supply line 212 is formed on the inner wall of the accommodation chamber 211, and the power supply line 212 is coupled to the radiation sheet 22. Thus, the feeder 212 may be coupled to the antenna element 2 to provide feeding to the antenna element 2. The power division feeder strip line 70 is disposed between the insulating support 21 and the reflective plate 1 near a partial region of the first port 702a, and is located in the accommodating cavity 211. The first reference ground line 701 of the power division feed stripline 70 at the first port 702a is not covered on the signal line 702. That is, the signal line 702 is disposed bare at the first port 702 a. Also, the bare signal line 702 may be connected with the feeder 212. Therefore, the connection part of the power supply line 212 and the signal line 702 can be positioned in the accommodating cavity 211 of the insulating bracket 21, and has good waterproof effect. In order to further improve the waterproof effect, the connection between the feeder line 212 and the signal line 702 and the connection between the insulating holder 21 and the reflection plate 1 may be filled with a sealant.
Similarly, as shown in fig. 27, the connection of the power division feed strip line 70 to the antenna element 2 shown in fig. 21 may also be made in the manner described above.
In order to be suitable for outdoor application, in some embodiments, the connector 80 is a waterproof connector, which has a good waterproof effect.
Also, the circuit board assembly 1000 further includes an insulating sealing structure 90 as shown in fig. 28, the insulating sealing structure 90 sealing the power division feed strip line 70 and the plurality of antenna elements 2. Thus, the insulating sealing structure 90 can further improve the assurance that the waterproof performance of the connector 80, the power division feed strip line 70, and the plurality of antenna elements 2 is good.
The insulating sealing structure 90 may be embodied in various embodiments. The insulating sealing structure 90 includes an insulating sealing layer 91, and the insulating sealing layer 91 wraps the plurality of antenna elements 2 and the power division feed strip line 70. The insulating sealing layer 91 may be a heat-shrinkable film layer manufactured by a heat shrinkage process, and has simple sealing operation and low cost. Or the antenna array 2 and the power division feed strip line (and the waterproof connector) 70 are soaked in weather-proof colored glue, so that glue with uniform thickness is attached to the outer surfaces of the antenna array 2 and the power division feed strip line (and the waterproof connector) 70. Thus, the insulating sealing layer 91 can be formed outside the plurality of antenna elements 2 and the power division feed strip line 70. The glue solution is flexible after solidification, can be convenient for bending operation of the power division feeder strip line 70, can isolate external rainwater, sunlight, corrosive gas and the like, and has good outdoor application characteristics such as water resistance, corrosion resistance, UV aging resistance and the like.
By way of example, the insulating seal structure 90 includes an insulating seal case 92 as shown in fig. 28, and a plurality of antenna elements 2, power division feed strip lines 70 may be accommodated in the insulating seal case 92. The inner cavity of the insulating sealing box 92 may be larger than the space occupied by the plurality of antenna elements 2 and the power division feed strip line 70, for example, the insulating sealing box 92 is a square box. The inner cavity of the insulating sealing case 92 may also be adapted to the space occupied by the plurality of antenna elements 2 and the power division feed strip line 70. The insulating seal case 92 is adapted to have the same shape and the same size as those of the structure formed by the plurality of antenna elements 2 and the power division feed strip line 70. The insulating seal case 92 may be a plastic suction case. The insulating sealing case 92 is made of a colored weather-resistant low-loss material, such as polypropylene (PP), polycarbonate (polycarbonate, PC), and the like.
Since the antenna element 2 shown in fig. 20 and 21 described above already has good waterproof performance, in some examples, as shown in fig. 29 and 30, the insulating sealing structure 90 includes an insulating material layer 93 and a sealant. The insulating material layer 93 wraps only the outside of the power division feed strip line 70. The sealant is filled in the connection gaps between the power division feed strip line 70 and the plurality of antenna elements 2. Thus, the waterproof performance of the power division feed strip line 70 and the plurality of antenna elements 2 can be ensured. The insulating material layer 93 may also be a plastic film layer and has weather resistance. The plastic film layer may also be formed by dip coating in a weatherable glue or by a film heat shrink process.
The junction between the insulating sealing structure 90 and the waterproof connector also needs to be waterproof. In some embodiments, the interface of the insulating sealing structure 90 and the waterproof connector is sealed with an injection molded material. That is, the junction of the insulating sealing structure 90 and the waterproof connector is wrapped by an injection molding process.
It should be noted that the insulating sealing layer 91, the insulating sealing box 92, the insulating material layer 93, the sealant and the injection molding material all satisfy good weather resistance, and may be made of a colored material, so as to reduce the problem of photo-aging of the antenna array 2 and the power division feeder strip line 70.
The antenna element 2 may be a monopole antenna or a dual polarized antenna, and the present application is not limited thereto. For example, the antenna element 2 is a dual polarized antenna. Therefore, the power division feeder strip line 70 in the circuit board assembly 1000 may be one or more, which is not limited in the present application. By way of example, the circuit board assembly 1000 may include a plurality of power division feed striplines 70. The number of the insulating sealing structures 90 may be plural, and each insulating sealing structure 90 may seal one power division feed strip line 70 and plural antenna elements 2 connected to the power division feed strip line 70. The plurality of insulating sealing structures 90 may seal the plurality of power division feed strip lines 70 and the plurality of antenna elements 2 correspondingly connected to the power division feed strip lines 70, respectively. For the circuit board assembly 1000 having the plurality of power division feed striplines 70, the first reference ground line 701 and the second reference ground line 703 may serve as the reference grounds for the signal lines 702, so that the plurality of power division feed striplines 70 in the circuit board assembly 1000 may not interfere with each other.
Similar to the structure of the power distribution feed strip line 70 described above, in some embodiments, the circuit board assembly 1000 further includes a power distribution feed board 70a as shown in fig. 31 (a) and (b), the power distribution feed board 70a including a first reference ground line 701, a signal line 702, a second reference ground line 703, a first connecting conductive post 706, and a second connecting conductive post 707. The first reference ground line 701, the signal line 702, and the second reference ground line 703 are sequentially stacked from top to bottom and are arranged at intervals. The first connection conductive post 706 connects the first reference ground line 701 with the second reference ground line 703. The signal line 702 is a power division feed network line 702S. The shape of the first reference ground line 701 is the same as the shape of the second reference ground line 703. The paths of the first reference ground line 701 and the second reference ground line 703 are the same as those of the signal line 702. A plurality of antenna elements 2 are arranged above the power dividing feed plate 70 a. The signal line 702 is located outside the first reference ground line 701 at the first port 702 a. A plurality of second connecting conductive posts 707 connect the plurality of antenna elements 2 with the first ends (at the first port 702 a) of the signal lines 702. That is, the power division feed plate 70a shown in fig. 31 (a) can be regarded as the power division feed strip line 70 made in a flat plate shape. Also, referring to fig. 32, the signal wire 702 in the power division feeding plate 70a is connected to the waterproof connector at the second port 702 b. The power division feeder strip line 70 may be a flexible board or a non-flexible board, and the present application is not limited thereto.
In view of the waterproof problem, in some examples, the above-described circuit board assembly 1000 further includes a sealing cover 100 as shown in fig. 32, and the sealing cover 100 covers the plurality of antenna elements 2 provided on the power distribution feeding board 70 a. The sealing cover 100 is hermetically connected to the power dividing feed plate 70 a. Thus, the sealing cover 100 can seal the plurality of antenna elements 2 and the connection portions of the plurality of antenna elements 2 and the power division feed strip line 70. Thereby, the waterproof performance of the plurality of antenna elements 2 is further improved, and the sealing property of the connection of the antenna elements 2 and the power division feed strip line 70 is ensured.
In addition, in some embodiments, the rf circuit board 20 is provided with a power division feeding network 702S as shown in fig. 33 (a). The circuit board assembly 1000 further includes a coaxial rf line 110 and a waterproof connector 120 as shown in fig. 33 (b), one end of the coaxial rf line 110 is connected to the antenna array 2, and the other end of the coaxial rf line 110 is connected to the waterproof connector 120. The waterproof connector 120 may be connected to the power division feed network line 702S on the radio frequency circuit board 20. The electronic equipment can be applied to outdoor application scenes as well, and has good waterproof performance. The rf circuit board 20 is further provided with a signal receiving/transmitting circuit, and the waterproof connector 120 may be connected to the signal receiving/transmitting circuit of the rf circuit board 20.
In other embodiments, as shown in fig. 34, the circuit board assembly 1000 further includes a power division feeding network circuit board 130, a sealing housing 140, a plurality of first coaxial rf lines 150, a plurality of second coaxial rf lines 160, and a waterproof connector 120. Wherein the power division feeding network circuit board 130 is disposed on the reflection plate 1. Also, the power division feeding network circuit board 130 may be accommodated in the hermetic case 140. Thus, the tightness of the power division feeding network circuit board 130 is ensured. The power division feeding network circuit board 130 has a power division feeding network line 702S, and the power division feeding network line 702S has a plurality of first ports 702a and second ports 702b. The first coaxial rf lines 150 respectively connect the first ports 702a of the power division feeding network 702S with the antenna arrays 2. One end of the second coaxial rf line 160 is connected to the second port 702b of the power division feed network line 702S. The waterproof connector 120 is connected to the other end of the second coaxial rf line 160 and to the rf circuit board 20. The radio frequency circuit board 20 is provided with a signal transmission/reception processing circuit, and the waterproof connector 120 may be connected to the signal transmission/reception processing circuit. The electronic equipment also has good waterproof effect.
The power division feed network circuit board 130 in the circuit board assembly 1000 may be one or more, which is not limited in the present application. The number of power division feeding network circuit boards 130 may be the same as the number of second coaxial rf lines 160, waterproof connectors 120.
By way of example, the circuit board assembly 1000 shown in fig. 34 includes 6 antenna elements 2 and 2 power division feed network circuit boards 130. The power division feed network line 702S on each power division feed network circuit board 130 is connected with 3 antenna elements 2, so that a one-drive-three power division mode can be realized.
The circuit board assembly 1000 shown in fig. 35 includes 6 antenna elements 2 and 1 power division feed network circuit board 130. The power division feed network line 702S on the power division feed network circuit board 130 is connected with the 6 antenna elements 2, so that a six-drive power division mode can be realized.
The circuit board assembly 1000 shown in fig. 36 includes 6 antenna elements 2 and 6 power division feed network circuit boards 130. The power division feed network lines 702S on the 6 power division feed network circuit boards 130 are respectively connected with the 6 antenna elements 2 in a one-to-one correspondence manner, so that a one-to-one feed mode can be realized.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (28)
1. A circuit board assembly, comprising:
The radio frequency circuit board is provided with a heating device;
an antenna assembly, the antenna assembly comprising:
The reflecting plate is arranged above the radio frequency circuit board and is in contact with the heating device;
the antenna array comprises a reflecting plate, a plurality of antenna arrays and a plurality of antenna switches, wherein the antenna arrays are distributed on one side, far away from the radio frequency circuit board, of the reflecting plate and are electrically connected with the radio frequency circuit board.
2. The circuit board assembly of claim 1, wherein the reflecting plate is provided with a plurality of first heat dissipation holes distributed at intervals, and a plurality of the first heat dissipation holes and the plurality of antenna arrays are provided with gaps.
3. The circuit board assembly according to claim 1 or 2, wherein the reflecting plate is provided with a plurality of auxiliary radiating teeth, and the plurality of auxiliary radiating teeth are distributed on one side of the reflecting plate, which is close to the radio frequency circuit board;
and/or, the plurality of auxiliary heat dissipation teeth are positioned on one side of the reflecting plate, which is close to the antenna array, and are arranged at intervals with the plurality of antenna arrays.
4. The circuit board assembly of any of claims 1-3, wherein the circuit board assembly further comprises:
The first radiator is arranged between the radio frequency circuit board and the reflecting plate and is in contact connection with the heating device and the reflecting plate.
5. The circuit board assembly of claim 4, wherein the first heat sink includes a plurality of spaced heat dissipating teeth, and the reflector plate has a mating hole formed therein at a position corresponding to the heat dissipating teeth, and the heat dissipating teeth extend out of the mating hole and are configured to support the antenna array above the reflector plate.
6. The circuit board assembly according to claim 4 or 5, wherein the first heat sink comprises a plurality of heat dissipation teeth arranged at intervals, the reflector plate is provided with a avoidance hole at a position corresponding to the heat dissipation teeth, the heat dissipation teeth penetrate out of the avoidance hole, and the upper ends of the heat dissipation teeth are higher than the reflector plate.
7. The circuit board assembly of any one of claims 4-6, further comprising:
the second radiator is arranged on one side, far away from the first radiator, of the radio frequency circuit board.
8. The circuit board assembly of claim 7, wherein the second heat sink and the first heat sink define a first sealed cavity, the radio frequency circuit board being housed within the first sealed cavity.
9. The circuit board assembly of any one of claims 1-8, wherein the antenna assembly further comprises:
the antenna housing is arranged outside the plurality of antenna arrays and at least part of the reflecting plate and is connected with the reflecting plate or the radio frequency circuit board.
10. The circuit board assembly of claim 9, wherein a plurality of second heat dissipation holes are formed in the radome, and the plurality of second heat dissipation holes are distributed at intervals.
11. The circuit board assembly of claim 10, wherein the radome comprises:
The cover body is arranged outside the plurality of antenna arrays and at least part of the reflecting plate, and is connected with the reflecting plate or the radio frequency circuit board;
The annular sealing enclosure is arranged on the inner wall of the cover body and forms a second sealing cavity with part of the cover body and part of the reflecting plate for sealing the antenna array.
12. The circuit board assembly according to any one of claims 9-11, wherein the antenna array is attached to the reflecting plate, the antenna array is made of a heat conducting material or a surface of the antenna array is provided with a first heat conducting material layer; the inner wall of the radome is provided with a second heat conduction material layer; the antenna assembly further comprises:
The elastic heat conduction material layer is arranged between the antenna array and the antenna housing and is attached to the antenna array and the antenna housing.
13. The circuit board assembly of claim 12, wherein an inner wall of the radome has a frequency selective surface, and the second layer of thermally conductive material is the frequency selective surface.
14. The circuit board assembly of any one of claims 1-13, wherein the circuit board assembly further comprises:
The power division feed strip line is connected with the antenna array and the radio frequency circuit board; the power division feed strip line comprises a conductive connecting ring, a flexible medium material, a first reference ground wire, a signal wire and a second reference ground wire, wherein the first reference ground wire, the signal wire and the second reference ground wire are stacked and arranged at intervals, the conductive connecting ring is sleeved on the outer sides of the first reference ground wire and the second reference ground wire, the flexible medium material is filled in a gap among the first reference ground wire, the signal wire and the second reference ground wire, the signal wire is a power division feed network line, the shape of the first reference ground wire is identical to that of the second reference ground wire, and the paths of the first reference ground wire, the second reference ground wire and the signal wire are identical.
15. The circuit board assembly of claim 14, wherein the antenna array comprises:
an insulating bracket supported on the reflection plate;
the outer surface of the radiation piece is provided with a waterproof coating, and the radiation piece is arranged on the insulating support frame.
16. The circuit board assembly of claim 14, wherein the antenna array comprises:
An insulating bracket supported on the reflection plate; a third sealing cavity is formed at the upper part of the insulating bracket;
And the radiation piece is arranged in the third sealing cavity.
17. The circuit board assembly according to claim 15 or 16, wherein a receiving chamber is formed on the insulating bracket at a side facing away from the radiation sheet, and a power supply line is formed on an inner wall of the receiving chamber, the power supply line being coupled with the radiation sheet; the first end of the power division feed strip line is positioned between the insulating bracket and the reflecting plate and is positioned in the accommodating cavity; the signal line is disposed exposed at a first end of the strip-shaped power division feeder line and is connected to the feeder line.
18. The circuit board assembly according to any one of claims 14-16, wherein the circuit board assembly further comprises:
And the insulating sealing structure seals the plurality of antenna arrays and the power division feed strip line.
19. The circuit board assembly of claim 18, wherein the insulating sealing structure comprises an insulating sealing layer that wraps around the plurality of antenna elements, the power division feed stripline;
Or, the insulation sealing structure comprises an insulation sealing box, and the plurality of antenna arrays and the power division feed strip line are accommodated in the insulation sealing box.
20. The circuit board assembly of claim 18, wherein the insulating seal case is identical in shape and size to the structure of the plurality of antenna elements and the strip power distribution feed line.
21. The circuit board assembly of any one of claims 18-20, further comprising a waterproof connector connecting the power division feed stripline to the radio frequency circuit board.
22. The circuit board assembly of claim 18, wherein the insulating sealing structure comprises:
The insulating material layer is wrapped on the outer side of the power division feeder strip line;
And the sealant is filled at the joint of the power division feed strip line and the plurality of antenna arrays.
23. The circuit board assembly of any one of claims 1-13, wherein the circuit board assembly further comprises:
The power division feed plate comprises a first connecting conductive column, a plurality of second connecting conductive columns, a first reference ground wire, a signal wire and a second reference ground wire, wherein the first reference ground wire, the signal wire and the second reference ground wire are sequentially stacked from top to bottom and are arranged at intervals, the first connecting conductive column connects the first reference ground wire with the second reference ground wire, the signal wire is a power division feed network circuit, the shape of the first reference ground wire is the same as that of the second reference ground wire, the paths of the first reference ground wire and the second reference ground wire are the same as those of the signal wire, and the first end of the signal wire is positioned outside the first end of the first reference ground wire; the power division feed plate is arranged below the plurality of antenna arrays, and the plurality of second connecting conductive columns connect the plurality of antenna arrays with one end of the signal line.
24. The circuit board assembly of claim 23, wherein the circuit board assembly further comprises:
and the sealing cover is arranged outside the plurality of antenna arrays on the power division feeding plate and is in sealing connection with the power division feeding plate.
25. The circuit board assembly according to any one of claims 1-13, wherein the radio frequency circuit board is provided with a power division feed network line, the circuit board assembly further comprising:
The coaxial radio frequency wire, one end of the said coaxial radio frequency wire is connected with said antenna array;
and the waterproof connector is used for connecting the other end of the coaxial radio frequency wire with the power division feed network circuit.
26. The circuit board assembly according to any one of claims 1-13, wherein the radio frequency circuit board is provided with a power division feed network circuit, and the circuit board assembly further comprises:
And the radio frequency connector is used for connecting the antenna array with the power division feed network line.
27. The circuit board assembly of any one of claims 1-13, wherein the circuit board assembly further comprises:
the power division feed network circuit board is arranged on the reflecting plate; the power division feed network circuit board is provided with a power division feed network circuit, and the power division feed network circuit is provided with a plurality of first ports and second ports;
the power division feed network circuit board is accommodated in the sealing shell;
the first coaxial radio frequency lines are used for correspondingly connecting the first ports of the power division feed network line with the antenna arrays respectively;
The second coaxial radio frequency line is connected with the second port of the power division feed network line at one end of the second coaxial radio frequency line;
The waterproof connector is connected with the other end of the second coaxial radio frequency wire and is connected with the radio frequency circuit board.
28. An electronic device, comprising:
A housing;
the circuit board assembly of any of claims 1-27, disposed within the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310077988.0A CN118354520A (en) | 2023-01-13 | 2023-01-13 | Circuit board assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310077988.0A CN118354520A (en) | 2023-01-13 | 2023-01-13 | Circuit board assembly and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118354520A true CN118354520A (en) | 2024-07-16 |
Family
ID=91810816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310077988.0A Pending CN118354520A (en) | 2023-01-13 | 2023-01-13 | Circuit board assembly and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118354520A (en) |
-
2023
- 2023-01-13 CN CN202310077988.0A patent/CN118354520A/en active Pending
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