CN113839169B

CN113839169B - Antenna module and mobile terminal

Info

Publication number: CN113839169B
Application number: CN202010587186.0A
Authority: CN
Inventors: 黄国书
Original assignee: Oneplus Technology Shenzhen Co Ltd
Current assignee: Oneplus Technology Shenzhen Co Ltd
Priority date: 2020-06-24
Filing date: 2020-06-24
Publication date: 2023-05-05
Anticipated expiration: 2040-06-24
Also published as: CN113839169A; WO2021259364A1

Abstract

The invention relates to an antenna module and a mobile terminal. The antenna module comprises a printed circuit board, a radiating unit and a heat conduction communication column. The printed circuit board comprises a ground layer and a first insulating layer which are arranged in a stacked mode. The radiation unit is arranged on the surface of the first insulating layer far away from the grounding layer and is provided with a feed-in point and a grounding point. The heat conduction communication column penetrates through the first insulating layer and is connected between the grounding point and the grounding layer. When the antenna module works, heat generated by the radiating unit can be transferred to the grounding layer of the printed circuit board through the heat conduction communication column, so that the grounding layer of the printed circuit board assists the radiating unit to radiate, and the radiating capacity of the antenna module is improved.

Description

Antenna module and mobile terminal

Technical Field

The present invention relates to the field of antenna technologies, and in particular, to an antenna module and a mobile terminal.

Background

With the development of electronic technology, the functions of mobile terminals such as mobile phones are becoming more and more abundant, and the requirements on antenna modules in the mobile terminals are also becoming more and more high.

In the conventional art, an antenna module generally includes a radiating unit, and the radiating unit performs transmission and reception of electromagnetic waves.

The applicant found in the course of implementing the conventional technique that: the traditional antenna module has poorer heat dissipation capability.

Disclosure of Invention

Based on this, it is necessary to provide an antenna module and a mobile terminal aiming at the problem of poor heat dissipation capability of the antenna module in the conventional technology.

An antenna module, comprising:

a printed wiring board including a ground layer and a first insulating layer which are stacked;

the radiation unit is arranged on the surface of the first insulating layer far away from the grounding layer and is provided with a feed-in point and a grounding point;

and the heat conduction communication column penetrates through the first insulating layer, one end of the heat conduction communication column is connected with the grounding point, and the other end of the heat conduction communication column is connected with the grounding layer.

In one embodiment, the antenna module includes a plurality of radiating elements, and the plurality of radiating elements form a first radiating array and a second radiating array;

the printed circuit board is provided with a bending angle so that a plane where the first radiation array is located and a plane where the second radiation array is located intersect.

In one embodiment, the first radiating array and the second radiating array respectively comprise a plurality of radiating units distributed in an array;

the plurality of radiation units distributed in an array at least comprises a first polarization direction and a second polarization direction.

In one embodiment, the printed wiring board comprises a first area, a second area and a bending area connected between the first area and the second area along the extending direction of the printed wiring board;

the first radiating array is located in the first area, and the second radiating array is located in the second area.

In one embodiment, the printed circuit board includes a flexible circuit board, and the first region, the bending region and the second region are integrally formed along an extending direction of the printed circuit board.

In one embodiment, the radiating element has more than two feed points.

A mobile terminal comprising an antenna module as in any one of the embodiments above; the printed wiring board further includes:

the second insulating layer is arranged on one side of the grounding layer away from the first insulating layer;

the conductive layer is arranged between the second insulating layer and the first insulating layer, and a third insulating layer is arranged between the conductive layer and the grounding layer;

the mobile terminal further includes:

the radio frequency transceiver is arranged on one side, far away from the first insulating layer, of the second insulating layer, and is electrically connected with the feed-in point so as to feed power to the radiation unit;

and the main board is electrically connected with the radio frequency transceiver through the conducting layer so as to control the radio frequency transceiver.

In one embodiment, the printed wiring board comprises a first area, a second area and a bending area connected between the first area and the second area along the extending direction of the printed wiring board; the first radiating array is positioned in the first area, and the second radiating array is positioned in the second area;

the mobile terminal further includes:

the support is arranged on the main board and connected with the second area to fix the second area, and the support is also connected with the grounding layer of the second area to assist the grounding layer to dissipate heat.

the mobile terminal further includes:

a metal frame;

the support is arranged on the metal frame, connected with the second area and used for fixing the second area, and also connected with the grounding layer of the second area so as to assist the grounding layer to dissipate heat.

In one embodiment, the metal bezel includes a first side, a second side, a third side, and a fourth side; the mobile terminal further comprises a bottom surface connected with the metal frame;

the first region is attached to one of the first side, the second side, the third side, the fourth side, and the bottom surface; the second region is attached to the other of the first side, the second side, the third side, the fourth side, and the bottom surface.

The antenna module comprises a printed circuit board, a radiating unit and a heat conduction communication column. The printed circuit board comprises a ground layer and a first insulating layer which are arranged in a stacked mode. The radiation unit is arranged on the surface of the first insulating layer far away from the grounding layer and is provided with a feed-in point and a grounding point. The heat conduction communication column penetrates through the first insulating layer and is connected between the grounding point and the grounding layer. When the antenna module works, heat generated by the radiating unit can be transferred to the grounding layer of the printed circuit board through the heat conduction communication column, so that the grounding layer of the printed circuit board assists the radiating unit to radiate, and the radiating capacity of the antenna module is improved.

Drawings

In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings required for the descriptions of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

FIG. 1 is a schematic cross-sectional view of an antenna module according to an embodiment of the present disclosure;

FIG. 2 is a schematic top view of a radiating element according to an embodiment of the present application;

FIG. 3 is a schematic perspective view of an antenna module according to an embodiment of the present disclosure;

FIG. 4 is a schematic side view of an antenna module according to one embodiment of the present disclosure;

FIG. 5 is a schematic top view of a radiating array according to one embodiment of the present application;

FIG. 6 is a schematic top view of a radiating array according to another embodiment of the present application;

FIG. 7 is a schematic cross-sectional view of an antenna module according to another embodiment of the present disclosure;

FIG. 8 is a schematic cross-sectional view of an antenna module according to another embodiment of the present disclosure;

fig. 9 is a schematic cross-sectional structure of a mobile terminal according to an embodiment of the present application;

fig. 10 is a schematic cross-sectional structure of a mobile terminal according to another embodiment of the present application;

FIG. 11 is a schematic view of a metal frame according to an embodiment of the present application;

fig. 12 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application;

fig. 13 is a graph comparing radiation gain of a mobile terminal according to the conventional technology and the present application.

Wherein, the meanings represented by the reference numerals are respectively as follows:

10. an antenna module;

102. a first radiating array;

104. a second radiating array;

110. a printed wiring board;

111. a first region;

113. a bending region;

115. a second region;

112. a ground layer;

114. a first insulating layer;

116. a second insulating layer;

118. a conductive layer;

119. a third insulating layer;

120. a radiation unit;

122. a feed point;

124. a grounding point;

130. a thermally conductive communication column;

20. a mobile terminal;

210. a radio frequency transceiver;

212. a heat sink;

220. a main board;

230. a conductive post;

240. a bracket;

250. a metal frame;

252. a first side;

254. a second side;

256. a third side;

258. a fourth side;

260. a bottom surface.

Detailed Description

In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.

The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The terms "coupled" and "connected," as used herein, are intended to encompass both direct and indirect coupling (coupling), unless otherwise indicated. In the description of the present application, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. indicate or refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

The application provides an antenna module and a mobile terminal using the same. Compared with the prior art, the antenna module can improve the heat radiation capability of the radiation unit and can also improve the space coverage rate of transmitting or receiving electromagnetic waves.

In one embodiment, as shown in fig. 1, the antenna module 10 of the present application includes a printed wiring board 10, a radiating element 120, and a thermally conductive communication post 130.

In particular, the printed wiring board 10, also referred to as a printed circuit board, is a provider of electrical connections for electronic devices. The printed wiring board 10 generally includes a plurality of stacked signal layers, and an insulating layer is disposed between two adjacent signal layers to insulate between the two signal layers. Here, a number refers to more than one integer. The signal layer refers to a film layer composed of wires or conductive sheets that can transmit electric signals. In the embodiment of the present application, the signal layer includes the conductive layer 118 and the ground layer 112, that is, the conductive layer 118 and the ground layer 112 are one of the signal layers. Wherein the conductive layer 118 refers to a signal layer connected between two electronic devices for electrical signal transmission between the two electronic devices. The ground layer 112 refers to a signal layer that the printed wiring board 10 uses for connection to ground.

As shown in fig. 1, in the present embodiment, the printed circuit board 10 includes at least a ground layer 112 and a first insulating layer 114. The first insulating layer 114 is stacked over the ground layer 112. The ground layer 112 here may be a metallic conductive sheet for connection to ground.

The radiation unit 120 is used to transmit and receive electromagnetic waves. The radiating element 120 is typically configured to electrically connect to the radio frequency transceiver such that radio frequency signals may be transferred between the radio frequency transceiver and the radiating element 120. When the rf transceiver transmits the rf signal to the radiating unit 120, the radiating unit 120 can convert the rf signal into an electromagnetic wave, thereby realizing the emission of the electromagnetic wave. Similarly, when the radiation unit 120 receives electromagnetic waves, the electromagnetic waves can be converted into radio frequency signals and transmitted to the radio frequency transceiver. In the present embodiment, the radiation unit 120 is disposed on a surface of the first insulating layer 114 away from the ground layer 112. In other words, the radiation unit 120 is stacked above the first insulating layer 114, so that the first insulating layer 114 is sandwiched between the radiation unit 120 and the ground layer 112 to realize insulation between the radiation unit 120 and the ground layer 112. As shown in fig. 2, in the present embodiment, the radiating unit 120 has a feed point 122 and a ground point 124. The feeding point 122 herein refers to a position of the radiating unit 120 for feeding the rf signal, that is, the feeding point 122 is electrically connected to the rf transceiver. The ground point 124 refers to a position where the radiating element 120 is used for connection to ground, and in this embodiment, the ground point 124 of the radiating element 120 may be connected to the ground layer 112 of the printed wiring board 10.

As shown in fig. 1, the heat conductive via 130 penetrates through the first insulating layer 114, and one end of the heat conductive via 130 is connected to the ground point 124 of the radiating unit 120, and the other end of the heat conductive via 130 is connected to the ground layer 112 of the printed circuit board 10. In this embodiment, the heat conductive communication post 130 may be made of a material with better heat conductivity, such as copper, silver, or/and gold. When the heat conductive communication post 130 is connected between the ground point 124 and the ground layer 112, heat energy transmission between the radiating unit 120 and the ground layer 112 can be achieved.

In the antenna module 10, the heat conductive via 130 penetrates the first insulating layer 114 and is connected between the ground point 124 and the ground layer 112. When the antenna module 10 works, heat generated by the radiating unit 120 can be transferred to the ground layer 112 of the printed circuit board 10 through the heat conduction communication column 130, so that the ground layer 112 of the printed circuit board 10 assists the radiating unit 120 to radiate heat, thereby improving the heat radiation capability of the antenna module 10. At the same time, the ground layer 112 may also shield the interference source from the back of the radiating element 120, thereby enhancing the performance of the radiating element 120. The back side of the radiating element 120 refers to the side of the radiating element 120 facing away from the radiating direction.

In one embodiment, as shown in fig. 3, the antenna module 10 of the present application may include a plurality of radiating elements 120, where the plurality of radiating elements 120 form the first radiating array 102 and the second radiating array 104. The printed wiring board 10 has a bend angle such that the plane of the first radiating array 102 and the plane of the second radiating array 104 intersect.

Specifically, a plurality refers to more than one integer. In this embodiment, the antenna module 10 may include an even number of radiating elements 120. The plurality of radiating elements 120 are arranged to form the first radiating array 102 and the second radiating array 104. In other words, the first radiating array 102 includes a plurality of radiating elements 120 distributed in an array. The second radiating array 104 also includes a plurality of radiating elements 120 distributed in an array. As shown in fig. 3, an embodiment of the antenna module 10 is shown comprising 6 radiating elements 120. Wherein 3 radiating elements 120 constitute the first radiating array 102 and the other 3 radiating elements 120 constitute the second radiating array 104.

The printed wiring board 10 has a bend angle such that the plane of the first radiating array 102 and the plane of the second radiating array 104 intersect. In other words, the printed wiring board 10 has a bending angle so as to have an "L" type or "L" like structure. The term "L-like" as used herein means "L" having a bending angle not equal to 90 °. The first radiating array 102 and the second radiating array 104 are respectively located at different positions of the printed wiring board 10 having a bending angle. The printed wiring board 10 having a bending angle has two intersecting planes. Wherein, the plurality of radiating elements 120 in the first radiating array 102 are located on one plane of the printed circuit board 10, and the plurality of radiating elements 120 in the second radiating array 104 are located on another plane of the printed circuit board 10. The angle between the plane of the first radiating array 102 and the plane of the second radiating array 104 is a bending angle.

In this embodiment, the bending angle may be greater than 0 degrees and less than 180 degrees, so as to improve the coverage of the electromagnetic wave emitted by the antenna module 10. In other words, the bending angle may be 1 degree, 179 degrees, or 90 degrees.

In a specific embodiment, when the bending angle is 90 degrees, the coverage area of the electromagnetic wave emitted by the antenna module 10 is the largest.

Specifically, when the bending angle is 90 degrees, the printed circuit board 10 of the antenna module 10 has an L-shaped structure, and the plane of the first radiating array 102 is perpendicular to the plane of the second radiating array 104. The first radiating array 102 and the second radiating array 104 may implement orthogonal polarizations. When the first radiating array 102 and the second radiating array 104 each have more than two radiating elements 120, the first radiating array 102 and the second radiating array 104 with orthogonal polarizations can provide multiple sets of signals with orthogonal polarizations, so as to improve the communication quality and transmission capacity of the antenna module 10. Fig. 3 shows a schematic perspective view of the antenna module 10 when the bending angle is 90 degrees. Fig. 4 shows a schematic side view of the antenna module 10 when the bending angle is 90 degrees. In the embodiment shown in fig. 4, only one radiating element is shown for each of the first radiating array 102 and the second radiating array 104.

Further, as shown in fig. 3 and 4, the printed wiring board 10 includes a first region 111, a second region 115, and a bending region 113 along the extending direction of the printed wiring board 10. Wherein the bending region 113 is connected between the first region 111 and the second region 115, so that the printed circuit board 10 has a bending angle.

In this embodiment, the first region 111 and the second region 115 are both planar regions. The first radiating array 102 may be located in the first region 111 and the second radiating array 104 may be located in the second region 115, i.e. the plane of the first radiating array 102 and the plane of the second radiating array 104 may intersect.

In a specific embodiment, the first region 111, the second region 115, and the bending region 113 are formed by stitching along the extending direction of the printed wiring board 10.

Along the extending direction of the printed wiring board 10, the first region 111, the second region 115, and the bending region 113 are spliced to form: as is known from the above description, the printed wiring board 10 includes at least the ground layer 112 and the first insulating layer 114, which are stacked. Here, the ground layer located in the first region 111, the ground layer located in the second region 115, and the ground layer located in the bending region 113 are spliced to form a film. The first insulating layer in the first region 111, the first insulating layer in the second region 115, and the first insulating layer in the bending region 113 are also spliced to form a film.

The first insulating layer located in the first region 111 may be a hard film layer having no flexibility. The first insulating layer located in the second region 115 may be a hard film layer having no flexibility. The first insulating layer located at the bending region 113 may be a flexible film layer having flexibility. One end of the flexible first insulating layer is spliced with the first insulating layer of the first region 111 and the other end of the flexible first insulating layer is spliced with the first insulating layer of the second region 115, thereby connecting the first region 111 and the second region 115 together.

Wherein the first region 111 and the second region 115 may be hard circuit boards having no flexibility. The bending region 113 may be a flexible film layer, and both ends of the flexible film layer are respectively spliced with the first region 111 and the second region 115, so as to connect the first region 111 and the second region 115 together.

In another embodiment, the first region 111, the second region 115, and the bending region 113 are integrally formed along the extending direction of the printed wiring board 10.

Along the extending direction of the printed wiring board 10, the first region 111, the second region 115, and the bending region 113 are integrally formed as follows: as is known from the above description, the printed wiring board 10 includes at least the ground layer 112 and the first insulating layer 114, which are stacked. Here, the ground layer 112 located in the first region 111, the ground layer 112 located in the second region 115, and the ground layer 112 located in the bending region 113 are integrally formed into one film layer. The first insulating layer 114 located in the first region 111, the first insulating layer 114 located in the second region 115, and the first insulating layer 114 located in the bending region 113 are also integrally formed into a film layer.

The printed wiring board 10 may be at least one of a flexible circuit board or a high-frequency flexible board.

In one embodiment, as shown in fig. 3, the first radiating array 102 and the second radiating array 104 each include a plurality of radiating elements 120 distributed in an array. That is, the first radiating array 102 may include a plurality of radiating elements 120, and the plurality of radiating elements 120 in the first array are distributed in an array. The second radiating array 104 may also include a plurality of radiating elements 120, and the plurality of radiating elements 120 in the second array are also distributed in an array. In the present embodiment, in the first radiating array 102, the plurality of radiating elements 120 includes at least a first polarization direction and a second polarization direction. I.e. several radiating elements 120 in the first radiating array 102 comprise at least two different polarization directions. In the second radiating array 104, the plurality of radiating elements 120 also includes at least a first polarization direction and a second polarization direction. I.e. the number of radiating elements 120 in the second radiating array 104 also comprises at least two different polarization directions.

The first radiating array 102 may differ from the second radiating array 104 only in different areas of the printed wiring board 10. Based on this, the antenna module 10 in the present embodiment will be described by taking the first radiating array 102 as an example. Fig. 5 shows an embodiment in which the radiating array comprises 4 radiating elements 120 distributed in an array.

The following description is directed to different implementations of "several radiating elements 120 in the first radiating array 102 include at least two different polarization directions":

in one embodiment, as shown in fig. 5, the feed points 122 of the different radiation units 120 are located differently, so that the polarization modes of the different radiation units 120 are different.

Specifically, one radiating element 120 typically has two feed points 122. When the radiation unit 120 is in operation, the two feeding points 122 simultaneously feed in the rf signals to realize the dipole. In the present embodiment, the positions of the feed points 122 of the different radiation units 120 are different, so that the polarization modes of the different radiation units 120 are different. In the embodiment shown in fig. 5, the feed points 122 of the four radiating elements 120 in the radiating array are all different, i.e. the polarization modes of the four radiating elements 120 are also different.

In another embodiment, when the feeding points 122 are located at the same position, the polarization of the different radiation units 120 can be different by adjusting the phase of the rf signal.

Specifically, as is known from the above description, when the radiation unit 120 is in operation, the rf transceiver is required to transmit the rf signal to the radiation unit 120, and the radiation unit 120 performs conversion from the rf signal to electromagnetic wave. The radio frequency signal is a sine wave signal. Thus, the polarization modes of the different radiation units 120 can be made different by adjusting the phases of the sinusoidal radio frequency signals that are input to the different radiation units 120.

In one embodiment, to facilitate polarization adjustment of the radiation units 120 in the antenna module 10 of the present application, each radiation unit 120 has more than two feed points 122.

Specifically, each radiating element 120 may have two feed points 122, as shown in fig. 5. At this time, the positions of the feed points 122 of the different radiation units 120 are different, so that the polarization modes of the different radiation units 120 are different. In the present embodiment, the radiating unit 120 may further have three feeding points 122 or four feeding points 122. Fig. 6 shows a schematic diagram of a radiating element 120 with four feed points 122. In this embodiment, each radiating element 120 has more than two feed points 122. When the antenna module 10 is in operation, the polarization of one radiating element 120 can be adjusted by adjusting the feed points 122 at different positions of the radiating element 120 to communicate with the rf transceiver. By adjusting the polarization of the radiation unit 120, the beam direction of the electromagnetic wave emitted by the radiation unit 120 can be adjusted, so as to be beneficial to resisting the problem of multiple reflection caused by the emission of the electromagnetic wave.

It should be understood that in the embodiments shown in fig. 5 and 6, the feed point 122 is located in the directions of "right up", "right down", "right left" and "right" of the grounding point 124. In other embodiments, the feed point 122 may also be located in the upper left, lower left, upper right, lower right, etc. orientations of the ground point 124. The change of the orientation of the feeding point 122 does not affect the implementation of the embodiment of the present application, and therefore, only the embodiment of changing the orientation of the feeding point 122 should be understood as being within the protection scope of the present application. Also, in the above description, only embodiments are exemplified in which the radiating element 120 has two, three or four feed points 122. In other embodiments, the radiating element 120 may have more, such as six or eight feed points 122, which are also understood to be within the scope of the present application.

In one embodiment, as shown in fig. 7 and 8, the antenna module 10 of the present application, the printed wiring board 10 further includes a second insulating layer 116, a conductive layer 118, and a third insulating layer 119.

Specifically, as is known from the above description, the printed wiring board 10 generally includes a plurality of stacked signal layers, and an insulating layer is provided between adjacent two signal layers to insulate between the two signal layers. In the above embodiment, only the embodiment in which the printed wiring board 10 has one signal layer, i.e., the ground layer 112, is described. In the present embodiment, the hierarchical structure of the printed wiring board 10 is further described.

As shown in fig. 7 or 8, the second insulating layer 116 is disposed on a side of the ground layer 112 away from the first insulating layer 114. In other words, the ground layer 112 is sandwiched between the first insulating layer 114 and the second insulating layer 116.

A conductive layer 118 is also provided between the first insulating layer 114 and the second insulating layer 116. A third insulating layer 119 is disposed between the conductive layer 118 and the ground layer 112 to insulate the conductive layer 118 from the ground layer 112. At this time, there are two types of cross-sectional structures of the printed wiring board 10 along the lamination direction of the printed wiring board 10. The structure of the printed wiring board 10 will be described in various cases with reference to the drawings.

In one embodiment, as shown in fig. 7, the printed wiring board 10 includes a stacked second insulating layer 116, a conductive layer 118, a third insulating layer 119, a ground layer 112, and a first insulating layer 114. At this time, the second insulating layer 116 is located on a side of the ground layer 112 away from the first insulating layer 114. The conductive layer 118 is disposed between the first insulating layer 114 and the second insulating layer 116, and is located on a side of the ground layer 112 adjacent to the second insulating layer 116. A third insulating layer 119 is disposed between the conductive layer 118 and the ground layer 112.

At this time, as shown in fig. 7, the heat conductive via 130 penetrates through the first insulating layer 114 and is connected between the feed point 122 of the radiating unit 120 and the ground layer 112.

In another embodiment, as shown in fig. 8, the printed wiring board 10 includes a second insulating layer 116, a ground layer 112, a third insulating layer 119, a conductive layer 118, and a first insulating layer 114, which are stacked. At this time, the second insulating layer 116 is located on a side of the ground layer 112 away from the first insulating layer 114. The conductive layer 118 is disposed between the first insulating layer 114 and the second insulating layer 116, and is located on a side of the ground layer 112 near the first insulating layer 114. A third insulating layer 119 is disposed between the conductive layer 118 and the ground layer 112.

At this time, as shown in fig. 8, the heat conductive via 130 penetrates the first insulating layer 114, the conductive layer 118 and the third insulating layer 119, and is connected between the feeding point 122 of the radiating unit 120 and the ground layer 112. Note that in this embodiment, to avoid a short circuit between the conductive via 130 and the conductive layer 118, the conductive layer 118 may be provided with a through hole penetrating the conductive layer 118. The heat conductive communication post 130 penetrates through the through hole. A gap is formed between the through hole of the conductive layer 118 and the conductive via 130 to avoid conduction between the conductive layer 118 and the conductive via 130.

In one embodiment, the present application further provides a mobile terminal 20, including the antenna module 10 in any one of the embodiments described above.

Specifically, the antenna module 10 includes a printed wiring board 10, a radiating element 120, and a thermally conductive via 130. The printed wiring board 10 includes a ground layer 112 and a first insulating layer 114 that are stacked. The radiating unit 120 is disposed on a surface of the first insulating layer 114 away from the ground layer 112, and the radiating unit 120 has a feeding point 122 and a ground point 124. The heat conductive communication post 130 penetrates through the first insulating layer 114, and one end of the heat conductive communication post 130 is connected to the ground point 124, and the other end of the heat conductive communication post 130 is connected to the ground layer 112.

The mobile terminal 20 includes an antenna module 10 according to any of the embodiments described above. When the antenna module 10 works, heat generated by the radiating unit 120 can be transferred to the ground layer 112 of the printed circuit board 10 through the heat conduction communication column 130, so that the ground layer 112 of the printed circuit board 10 assists the radiating unit 120 to radiate heat, thereby improving the heat radiation capability of the antenna module 10.

In one embodiment, as shown in fig. 9, the printed wiring board 10 of the antenna module 10 further includes a second insulating layer 116, a conductive layer 118, and a third insulating layer 119. At this time, the mobile terminal 20 of the present application may further include a radio frequency transceiver 210 and a main board 220.

Specifically, the rf transceiver 210 is configured to transmit an rf signal to the radiating element 120, so that the radiating element 120 emits electromagnetic waves. The rf transceiver 210 may also be used to acquire rf signals transmitted by the radiating element 120. In the present embodiment, the rf transceiver 210 is disposed on a side of the second insulating layer 116 away from the first insulating layer 114. The radio frequency transceiver 210 is connected to a feed point (not shown) of the radiating element 120, thereby feeding the radiating element 120.

The motherboard 220 is used to control the operation of the radio frequency transceiver 210. Here, the main board 220 may be connected to the radio frequency transceiver 210 through the conductive layer 118 of the printed wiring board 10, thereby transmitting a control signal to the radio frequency transceiver 210. The connection between the motherboard 220 and the conductive layer 118, and the connection between the rf transceiver 210 and the conductive layer 118 can be as shown in fig. 9.

In the embodiment shown in fig. 9, the motherboard 220 is connected to the conductive layer 118 via conductive posts 230. The printed wiring board 10 includes a second insulating layer 116, a ground layer 112, a third insulating layer 119, a conductive layer 118, and a first insulating layer 114, which are stacked. The conductive post 230 penetrates the second insulating layer 116, the ground layer 112, and the third insulating layer 119. Similarly, in order to avoid a short circuit between the conductive post 230 and the ground layer 112, the ground layer 112 is formed with a through hole for the conductive post 230 to pass through, and a gap is provided between the ground layer 112 and the conductive post 230. The conductive layer 118 is also connected to the rf transceiver 210 by a conductive post 230. And will not be described in detail.

In one embodiment, the conductive posts 230 may be implemented by conductive terminals connected to the connector or at least one of the connectors.

Further, as shown in fig. 9, the printed circuit board 10 is fixedly connected to the radio frequency transceiver 210, and the radio frequency transceiver 210 is fixed on the main board 220. Here, the rf transceiver 210 may be directly fixed to the motherboard 220, or may be fixed to the motherboard 220 through the heat sink 212.

Specifically, to fix the motherboard 220, the rf transceiver 210, and the antenna module 10: the printed circuit board 10 of the antenna module 10 is fixed on one surface of the radio frequency transceiver 210, and the other surface of the radio frequency transceiver 210, which is far away from the printed circuit board 10, is fixed on the main board 220. Meanwhile, in order to improve the heat dissipation capability of the mobile terminal 20, a heat sink 212 may be further fixed between the motherboard 220 and the other surface of the rf transceiver 210 remote from the printed circuit board 10. The heat sink 212 may be made of a material with better heat dissipation performance to assist in dissipating heat from the rf transceiver 210.

In one embodiment, as shown in fig. 10, the printed wiring board 10 includes a first region 111, a second region 115, and a bending region 113 connected between the first region 111 and the second region 115 along the extending direction of the printed wiring board 10. The first radiating array 102 is located in a first region 111 and the second radiating array 104 is located in a second region 115.

In the present embodiment, the first region 111 of the printed circuit board 10 is fixed to the motherboard 220 through the rf transceiver 210 and the heat sink 212. The mobile terminal 20 also includes a cradle 240. The bracket 240 is used to secure the second region 115.

In one particular embodiment, the bracket 240 is mounted to the motherboard 220 and is coupled to the second region 115 to secure the second region 115 to the motherboard 220. At this time, the bracket 240 is also connected to the ground layer 112 of the second region 115 of the printed wiring board 10, thereby assisting the ground layer 112 in dissipating heat. When the mobile terminal 20 is operated, heat generated from the radiating unit may be transferred to the ground layer of the printed wiring board 10 and thus to the bracket 240. At this time, both the bracket 240 and the ground layer may assist the radiating unit 120 in radiating heat, thereby improving the heat radiation capability of the mobile terminal 20.

In another specific embodiment, the mobile terminal 20 may further include a metal bezel 250. The metal bezel 250 may be as shown in fig. 11. At this time, the bracket 240 is mounted on the metal frame 250 and connected to the second region 115, thereby fixing the second region 115 to the metal frame 250. At this time, the bracket 240 is also connected to the ground layer 112 of the second region 115 of the printed wiring board 10, thereby assisting the ground layer 112 in dissipating heat. When the mobile terminal 20 is operated, the heat generated by the radiating unit 120 may be transferred to the ground layer 112 of the printed wiring board 10, and further transferred to the bracket 240 and the metal bezel 250. At this time, the bracket 240, the metal bezel 250, and the ground layer 112 may assist the radiating unit 120 to radiate heat, thereby improving the heat radiation capability of the mobile terminal 20.

In one embodiment, as shown in fig. 12, the metal bezel 250 of the mobile terminal 20 of the present application includes a first side 252, a second side 254, a third side 256, and a fourth side 258. The mobile terminal 20 also includes a bottom surface 260 coupled to the metal bezel 250.

Specifically, along the extending direction of the printed wiring board 10, the printed wiring board 10 includes a first region 111, a second region 115, and a bending region 113 connected between the first region 111 and the second region 115. The first radiating array 102 is located in a first region 111 and the second radiating array 104 is located in a second region 115. The bending region 113 makes an angle between the plane of the first region 111 and the plane of the second region 115. The included angle is the bending angle of the bending region 113.

In the present embodiment, the first region 111 of the printed wiring board 10 is attached to one of the first side 252, the second side 254, the third side 256, the fourth side 258 and the bottom surface 260. The second region 115 is attached to the other of the first side 252, the second side 254, the third side 256, the fourth side 258, and the bottom surface 260. As shown in the embodiment of fig. 12, in an antenna module 10, a first area 111 of a printed circuit board 10 is attached to a bottom surface 260, a second area 115 of the printed circuit board 10 is attached to a second side 254, and a bending area 113 of the printed circuit board 10 is located at an interface between the bottom surface 260 and the second side 254. In another antenna module 10, the first area 111 of the printed circuit board 10 is attached to the fourth side 258, the second area 115 of the printed circuit board 10 is attached to the first side 252, and the bending area 113 of the printed circuit board 10 is attached to the junction between the fourth side 258 and the first side 252.

The radiation gain of the conventional mobile terminal is compared with that of the mobile terminal 20 in this embodiment. In the conventional art, the mobile terminal has three sets of antenna modules, and in this embodiment, the mobile terminal 20 has only two sets of antenna modules 10, the radiation gain pairs are as shown in fig. 13. The curve (1) is the radiation gain in the conventional technology, and the curve (2) is the radiation gain in the present embodiment. As can be seen from the figure, the mobile terminal 20 of the present application has a radiation gain greater than that of the conventional technology in the case of a small number of antenna modules 10.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims

1. An antenna module, comprising:

a printed wiring board (110) comprising a ground layer (112) and a first insulating layer (114) which are stacked;

the radiation units (120) are arranged on the surface, far away from the ground layer (112), of the first insulating layer (114), the radiation units (120) are provided with feed points (122) and grounding points (124), and the feed points (122) of at least two radiation units (120) are different in position so that the polarization modes of at least two radiation units (120) are different;

the heat conduction communication column (130) penetrates through the first insulating layer (114), one end of the heat conduction communication column (130) is connected with the grounding point (124), the other end of the heat conduction communication column (130) is connected with the grounding layer (112), so that the grounding layer (112) assists the radiating unit (120) to radiate heat, and the grounding layer (112) is further used for shielding an interference source from the back of the radiating unit (120).

2. The antenna module according to claim 1, characterized in that the antenna module (10) comprises a number of the radiating elements (120), the number of radiating elements (120) constituting a first radiating array (102) and a second radiating array (104);

the printed wiring board (110) has a bending angle such that a plane in which the first radiating array (102) is located intersects a plane in which the second radiating array (104) is located.

3. The antenna module according to claim 2, characterized in that the first radiating array (102) and the second radiating array (104) each comprise a number of the radiating elements (120) distributed in an array;

the plurality of radiating elements (120) distributed in an array comprises at least a first polarization direction and a second polarization direction.

4. The antenna module according to claim 2, characterized in that the printed wiring board (110) comprises a first area (111), a second area (115) and a bending area (113) connected between the first area (111) and the second area (115) along the extension direction of the printed wiring board (110);

the first radiating array (102) is located in the first region (111) and the second radiating array (104) is located in the second region (115).

5. The antenna module according to claim 4, wherein the printed wiring board (110) comprises a flexible circuit board, and the first region (111), the bending region (113) and the second region (115) are integrally formed along an extending direction of the printed wiring board (110).

6. The antenna module according to claim 1, wherein the radiating element (120) has more than two feed points (122).

7. A mobile terminal, characterized by comprising an antenna module (10) according to any of claims 1 to 6; the printed wiring board (110) further includes:

a second insulating layer (116) provided on a side of the ground layer (112) away from the first insulating layer (114);

a conductive layer (118) disposed between the second insulating layer (116) and the first insulating layer (114), and a third insulating layer (119) disposed between the conductive layer (118) and the ground layer (112);

the mobile terminal (20) further comprises:

a radio frequency transceiver (210) disposed on a side of the second insulating layer (116) away from the first insulating layer (114), the radio frequency transceiver (210) being electrically connected to the feed point (122) to feed the radiating element (120);

-a motherboard (220) electrically connected to the radio frequency transceiver (210) through the conductive layer (118) for controlling the radio frequency transceiver (210).

8. The mobile terminal according to claim 7, characterized in that the printed wiring board (110) includes a first region (111), a second region (115), and a bending region (113) connected between the first region (111) and the second region (115) along an extending direction of the printed wiring board (110); -the first radiating array (102) is located in the first region (111) and the second radiating array (104) is located in the second region (115);

the mobile terminal (20) further comprises:

and the bracket (240) is arranged on the main board (220) and connected with the second area (115) to fix the second area (115), and the bracket (240) is also connected with the grounding layer (112) of the second area (115) to assist the grounding layer (112) to dissipate heat.

9. The mobile terminal according to claim 7, characterized in that the printed wiring board (110) includes a first region (111), a second region (115), and a bending region (113) connected between the first region (111) and the second region (115) along an extending direction of the printed wiring board (110); -the first radiating array (102) is located in the first region (111) and the second radiating array (104) is located in the second region (115);

the mobile terminal (20) further comprises:

a metal bezel (250);

and the bracket (240) is arranged on the metal frame (250) and connected with the second area (115) to fix the second area (115), and the bracket (240) is also connected with the grounding layer (112) of the second area (115) to assist the grounding layer (112) to dissipate heat.

10. The mobile terminal of claim 9, wherein the metal bezel (250) includes a first side (252), a second side (254), a third side (256), and a fourth side (258); the mobile terminal (20) further comprises a bottom surface (260) connected with the metal frame (250);

the first region (111) is attached to one of the first side (252), the second side (254), the third side (256), the fourth side (258), and the bottom surface (260); the second region (115) is attached to the other of the first side (252), the second side (254), the third side (256), the fourth side (258), and the bottom surface (260).