CN118329280A - Sensor and method for manufacturing sensor - Google Patents

Abstract

The sensor and the manufacturing method of the sensor comprise a shell part, a pressure detection element and a pressure sensing part, wherein the shell part is provided with a pressure guiding hole, the pressure guiding hole is communicated with the outside of the sensor, the pressure sensing part is at least partially exposed to the pressure guiding hole, and the pressure detection element is connected with the pressure sensing part; the pressure guiding hole comprises a first pressure guiding channel and a second pressure guiding channel, the first pressure guiding channel is communicated with the second pressure guiding channel, the sensor is provided with a height direction, a first direction is defined, the first direction is inclined relative to the height direction, along the first direction, the first pressure guiding channel part is positioned at one side of the second pressure guiding channel, along the first direction, the second pressure guiding channel part is positioned at one side of the first pressure guiding channel. The application can facilitate the processing of the pressure guiding hole. The application also discloses a manufacturing method of the sensor.

Description

Sensor and method for manufacturing sensor

Technical Field

The application relates to the technical field of sensors, in particular to a sensor and a manufacturing method of the sensor.

Background

The sensor is a member for detecting various parameters, such as the temperature and pressure of the refrigerant in the pipe.

In the related art, the sensor includes casing portion, pressure detecting element and pressure sensing portion, and pressure detecting element and pressure sensing portion all are located casing portion, and casing portion has draws the pressure hole, draws the external intercommunication of pressure hole and sensor, and pressure sensing portion exposes to drawing the pressure hole, and pressure detecting element is connected with pressure sensing portion.

Disclosure of Invention

The inventors found that the pilot hole is difficult to process because the pilot hole is long.

The application aims to provide a sensor, which comprises a shell part, a pressure detection element and a pressure sensing part, wherein the shell part is provided with a pressure guiding hole, the pressure guiding hole is communicated with the outside of the sensor, the pressure sensing part is at least partially exposed to the pressure guiding hole, and the pressure detection element is connected with the pressure sensing part; the pressure guiding hole comprises a first pressure guiding channel and a second pressure guiding channel, the first pressure guiding channel is communicated with the second pressure guiding channel, the sensor is provided with a height direction, a first direction is defined, the first direction is inclined relative to the height direction, along the first direction, the first pressure guiding channel part is positioned at one side of the second pressure guiding channel, along the first direction, the second pressure guiding channel part is positioned at one side of the first pressure guiding channel.

In the application, along the first direction, the first pressure guiding channel part is positioned at one side of the second pressure guiding channel, along the first direction, the second pressure guiding channel part is positioned at one side of the first pressure guiding channel, the first pressure guiding channel and the second pressure guiding channel are arranged in a staggered manner, the lengths of the first pressure guiding channel and the second pressure guiding channel are shortened, and the processing is convenient.

Another object of the present application is to provide a method for manufacturing a sensor, comprising the steps of: providing a housing portion having a first face and a second face;

forming a first pressure guiding channel from the first surface and forming a second pressure guiding channel from the second surface;

the first surface and the second surface are respectively positioned on different sides of the shell part, and the first pressure guiding channel is communicated with the second pressure guiding channel.

In the application, the first pressure guiding channel is formed by processing the first surface, the second pressure guiding channel is formed by processing the second surface, and the processing length of the first pressure guiding channel and the second pressure guiding channel is shortened by processing the first pressure guiding channel and the second pressure guiding channel twice, so that the processing is convenient.

Drawings

Fig. 1 is a schematic perspective view of a sensor of the present application.

Fig. 2 is a schematic perspective sectional view of fig. 1.

Fig. 3 is a schematic view of the sub-housing and the positioning portion of fig. 1.

Fig. 4 is a schematic view of an embodiment of the positioning portion in fig. 3.

Fig. 5 is a schematic view of another embodiment of the sub-housing and the positioning portion.

Fig. 6 is a schematic view of the positioning portion of fig. 5.

Fig. 7 is a schematic view of the housing of fig. 2.

Fig. 8 is an enlarged schematic view at circle a in fig. 2.

Fig. 9 is a schematic view of the socket portion of fig. 2.

Fig. 10 is a schematic perspective sectional view of the pressure guiding portion and the main body portion in fig. 2.

FIG. 11 is a schematic perspective sectional view of the screw part, the temperature measuring part and the sub-housing of FIG. 2.

Fig. 12 is an exploded view of the pressure guiding portion and the main body portion of fig. 2.

Fig. 13 is a schematic view of the hole portion and the body portion on the projection surface.

Fig. 14 is a schematic cross-sectional view of fig. 10.

Fig. 15 is a perspective view of the reinforcement portion, the protrusion portion, the temperature detecting element, and the pins in fig. 2.

Detailed Description

Exemplary embodiments of the present application will be described in detail below with reference to the accompanying drawings. The features of the examples and embodiments described below may be combined with each other without conflict.

As shown in fig. 1 to 15, a sensor according to the present application includes a housing 11 and a circuit board 5, wherein the housing 11 has an inner cavity 114, and the circuit board 5 is located in the inner cavity 114; the sensor comprises a positioning part 2, the positioning part 2 comprises a clamping part 21 and a connecting part 22, the clamping part 21 is connected with the connecting part 22, the shell 11 is provided with a first wall part 24 and a second wall part 25, the first wall part 24 and the second wall part 25 are exposed to an inner cavity 114, the sensor is provided with a height direction Z, the clamping part 21 and the first wall part 24 are positioned on the same side of the circuit board 5 along the height direction Z, the clamping part 21 is abutted with the first wall part 24, and the connecting part 22 is in limit connection or fixed connection with the circuit board 5; the sensor comprises a spring piece part 23, the spring piece part 23 is connected with the positioning part 2, and the spring piece part 23 is abutted against the second wall part 25. Specifically, both the first wall portion 24 and the second wall portion 25 are exposed to the first chamber 1141.

Referring to fig. 1,2 and 3, the clamping portion 21 is contacted with the first wall portion 24, the elastic piece portion 23 is contacted with the second wall portion 25, the elastic piece portion 23 deforms to generate elastic force, so that the clamping portion 21 is abutted with the first wall portion 24, the circuit board 5 is in limit connection or fixed connection with the connecting portion 22, the occurrence of movement of the circuit board 5 in the mounting process is reduced, the mounting accuracy is improved, and the circuit board 5 is conveniently connected with the housing 11 through the arrangement of the clamping portion 21 and the elastic piece portion 23. Specifically, the circuit board 5 is attached to or soldered to the connection portion 22.

Referring to fig. 2 and 3, specifically, a first direction X is defined, which is disposed obliquely to the height direction Z, and the first wall portion 24 extends along the first direction X; further, the first direction X is perpendicular to the height direction Z, and the first wall portion 24 extends along the first direction X; the second wall portion 25 extends in the height direction Z.

In some embodiments, referring to fig. 2 and 3, a first extending direction X1 is defined, the spring piece portion 23 extends along the first extending direction X1, the first extending direction X1 is inclined with respect to the height direction Z, the second wall portion 25 extends along the height direction Z, the first wall portion 24 is located between the second wall portion 25 and the clamping portion 21 along the height direction Z, the first wall portion 24 is located between the circuit board 5 and the clamping portion 21, and the spring piece portion 23 abuts against the second wall portion 25.

During the installation process, the elastic piece portion 23 elastically deforms to abut against the second wall portion 25, the clamping portion 21 and the first wall portion 24 provide elastic force along the height direction Z, so that the clamping portion 21 abuts against the first wall portion 24, and the clamping portion 21, the connecting portion 22 and the elastic piece portion 23 are connected with the housing 11.

In some embodiments, referring to fig. 3 and 4, a first extending direction X1 is defined, the spring piece portion 23 extends along the first extending direction X1, the first extending direction X1 is inclined with respect to the height direction Z, the second wall portion 25 extends along the height direction Z, the clamping portion 21 is located between the first wall portion 24 and the second wall portion 25 along the height direction Z, the clamping portion 21 is located between the circuit board 5 and the first wall portion 24 along the height direction Z, and the spring piece portion 23 abuts against the second wall portion 25.

Specifically, referring to fig. 2 and 3, the engaging portion 21 and the second wall portion 25 are located between the circuit board 5 and the first wall portion 24, and the spring portion 23 is connected to the circuit board 5.

In some embodiments, referring to fig. 3 and 4, the lumen 114 has an annular groove 1143, the annular groove 1143 has a first wall portion 24, the snap-fit portion 21 is partially located in the annular groove 1143, and a second wall portion 25 is located outside the annular groove 1143. Specifically, the first wall portion 24 is connected to the second wall portion 25, the engaging portion 21 has a second extending direction X2, the engaging portion 21 extends along the second extending direction X2, and the second extending direction X2 is perpendicular to the height direction Z. Specifically, the first chamber 1141 has a circumferential groove 1143.

Further, referring to fig. 2 and 3, a first direction X is defined, which is perpendicular to the height direction Z, along which the second wall portion 25 is located on one side of the first wall portion 24. The engaging portion 21, the connecting portion 22 and the spring piece portion 23 are integrally formed.

In some embodiments, referring to fig. 2 and 3, the circuit board 5 has a ground portion electrically connected to the circuit board 5, the ground portion electrically connected to the positioning portion 2, and the positioning portion 2 electrically connected to the housing 11. Specifically, the connection portion 22 is electrically connected to the circuit board 5, the clamping portion 21 is electrically connected to the housing 11, the spring piece portion 23 is electrically connected to the housing 11, and the electrical connection between the positioning portion 2 and the housing 11 is more stable. In the installation process, the positioning part 2 not only can reduce the up-and-down shaking of the circuit board 5 to influence the assembly process, but also can say that the circuit board 5 is electrically connected with the shell 11 to realize the grounding function. Specifically, the positioning portion 2 is located in the first cavity 1141.

In some embodiments, referring to fig. 3 and 4, the lumen 114 has a circumferential groove 1143, the circumferential groove 1143 having a first wall portion 24, the snap-fit portion 21 being partially located in the circumferential groove 1143; along the height direction Z, the connecting part 22 is positioned between the clamping part 21 and the circuit board 5, and the connecting part 22 is positioned outside the ring groove 1143; defining a first direction X, wherein the first direction X is perpendicular to the height direction Z, and along the first direction X, the connection portion 22 is at least partially located between the elastic piece portion 23 and the clamping portion 21, and along the first direction X, the elastic piece portion 23 is located at one side of the clamping portion 21. Specifically, along the first direction X, the connection portion 22 is located at one side of the second wall portion 25, the elastic piece portion 23 has a first extending direction X1, the elastic piece portion 23 extends along the first extending direction X1, the first extending direction X1 is obliquely set with respect to the height direction Z, the elastic piece portion 23 has a first end 231 and a second end 232, the first end 231 is closer to the second wall portion 25 with respect to the second end 232, the first end 231 abuts against the second wall portion 25, and the second end 232 is connected with the connection portion 22.

In some embodiments, referring to fig. 3 and 4, the sensor includes a guide portion 26, the guide portion 26 is connected to the clamping portion 21, the clamping portion 21 is closer to the first wall portion 24 than the guide portion 26, the guide portion 26 has an inclined surface 261, the inclined direction of the inclined surface 261 is inclined with the height direction Z, and the inclined surface 261 can contact with the wall of the inner cavity 114; the guide 26 has a notch 262. Specifically, the inclined surface 261 has a third extending direction X3, and the inclined surface 261 extends in the third extending direction X3, and the third extending direction X3 is opposite to the inclined direction of the first extending direction X1.

In some embodiments, referring to fig. 5 and 6, the sensor includes a guide portion 26, the guide portion 26 is connected to the engagement portion 21, the engagement portion 21 is closer to the first wall portion 24 than the guide portion 26, the guide portion 26 has an engagement wall 263 and a guide wall 264, the engagement wall 263 is located on one side of the guide wall 264 in a height direction Z, the engagement wall 263 is connected to the guide wall 264, the guide wall 264 is closer to the first wall portion 24 than the engagement wall 263 in the height direction Z, the inner cavity 114 has an opening wall 1144, the engagement wall 263 is engaged with the opening wall 1144, and the guide wall 264 is capable of contacting and elastically deforming with a wall of the inner cavity 114. Specifically, the aperture wall 1144 extends in the height direction Z, and the aperture wall 1144 is an arc-shaped wall. Specifically, the aperture wall 1144 is exposed to the first chamber 1141.

During installation, the engaging wall 263 is in engaging contact with the hole wall 1144, the positioning portion 2 is pressed down, the guide wall 264 is in contact with the hole wall 1144, the clamping portion 21 is elastically deformed, and when the clamping portion 21 is located in the ring groove 1143, the clamping portion 21 is restored to the original state, so that the clamping portion 21 is in contact with the first wall portion 24 of the ring groove 1143, and the positioning portion 2 is conveniently connected with the housing 11 in a clamping manner.

In some embodiments, referring to fig. 2 and 7, the sensor includes a socket portion 3, the housing 11 has a mounting port 12, the mounting port 12 communicates with the interior cavity 114, the sensor includes a resilient portion 13, the resilient portion 13 is connected to the housing 11, the socket portion 3 is at least partially located at the mounting port 12, and the socket portion 3 is at least partially located between the resilient portion 13 and a portion of the housing 11 in a height direction Z. The housing 11 is connected to the socket portion 3 by means of a snap-fit connection. Specifically, the elastic portion 13 is annular, and the elastic portion 13 is integral with the housing 11. When the socket part 3 is mounted, the part is contacted with the elastic part 13, the elastic part 13 deforms, the socket part 3 is pressed down, and the elastic part 13 is rebounded to clamp the socket part 3 to the shell 11. In the process of mounting the socket part 3 on the housing 11, the positioning part 2 is clamped with the housing 11, so that the positioning part 2 is connected with the circuit board 5, and the mounting of the socket part 3 and the housing 11 caused by shaking of the circuit board 5 can be reduced.

In some embodiments, referring to fig. 2 and 8, the sensor includes a socket portion 31 and a contact portion 32, the socket portion 31 is located at the socket portion 3, the socket portion 3 is partially exposed to the inner cavity 114, the contact portion 32 is located at least partially between the socket portion 31 and the circuit board 5, the contact portion 32 is electrically connected to the circuit board 5, and the contact portion 32 is electrically connected to the socket portion 3. The circuit board 5 is electrically connected to the plug-in portion 31 via the contact portion 32.

In some embodiments, referring to fig. 7 and 9, the sensor has a latch 33, the latch 33 is connected to the housing 11, the latch 33 is exposed to the inner cavity 114, the first direction X is defined, the first direction X is perpendicular to the height direction Z, the latch 33 extends along the first direction X, the socket portion 3 has a latch groove 34, and the latch 33 is at least partially located in the latch groove 34. Specifically, the fixture block 33 and the housing 11 are integrated, the socket part 3 is an injection molding piece, and the housing 11 is made of metal.

In some embodiments, referring to fig. 11 and 14, the sensor includes a sub-housing 111 and a threaded portion 112, the threaded portion 112 being connected to the sub-housing 111, the sub-housing 111 having a first cavity 1141; the threaded portion 112 has a second cavity 1142, the second cavity 1142 communicating with the first cavity 1141, the sensor having a temperature measurement groove 18, the temperature measurement groove 18 communicating with the second cavity 1142; the sensor has a through hole 14, the through hole 14 communicates with the second chamber 1142, and the through hole 14 communicates with the outside of the sensor. The through hole 14 is located on one side of the temperature measuring groove 18 along the first direction X. Specifically, the inner lumen 114 includes a first lumen 1141 and a second lumen 1142.

In some embodiments, referring to fig. 11 and 14, the sensor includes a temperature measuring portion 8, the sensor has a height direction Z, a screw portion 112 is located between the sub-case 111 and the temperature measuring portion 8 along the height direction Z, the temperature measuring portion 8 is connected to the screw portion 112, and the temperature measuring portion 8 has a temperature measuring groove 18 portion. Along the first direction X, the temperature measuring section 8 is located at one side of the through hole 14. Specifically, the sub-housing 111, the screw portion 112, and the temperature measuring portion 8 are integrated.

In some embodiments, referring to fig. 10 and 11, the sensor has a height direction Z defining a first direction X perpendicular to the height direction Z, the threaded portion 112 has a wall portion 16, the wall portion 16 is located at the periphery of the second cavity 1142, the wall portion 16 extends along the first direction X, and the through hole 14 and the temperature measuring groove 18 are recessed from the wall portion 16 into the threaded portion 112. Specifically, the second chamber 1142, the temperature measuring groove 18, and the through hole 14 all extend in the height direction Z. Further, in the height direction Z, the second chamber 1142 is located at one side of the first chamber 1141.

In some embodiments, referring to fig. 10 and 11, the sensor includes a circuit board 5, the circuit board 5 is located in the first cavity 1141, the sub-housing 111 has a plane 19, the sensor has a height direction Z defining a first direction X, the first direction X is perpendicular to the height direction Z, the plane 19 extends along the first direction X, the plane 19 is located at a periphery of the first cavity 1141, along the height direction Z, the plane 19 is located between the temperature measuring groove 18 and the circuit board 5, and the circuit board 5 is in contact with the plane 19. Specifically, in the height direction Z, the plane 19 is located between the first wall portion 24 and the circuit board 5. Further, in the height direction Z, the plane 19 is located between the opening wall 1144 and the circuit board 5, and the opening wall 1144 is connected to the plane 19, and the opening wall 1144 is connected to the first wall portion 24. Specifically, the planar surface 19 is exposed to the first cavity 1141.

In some embodiments, referring to fig. 2 and 10, the sensor includes a housing part 1, a pressure detecting element 41, and a pressure sensing part 42, the housing part 1 has a pressure guiding hole 43, the pressure guiding hole 43 communicates with the outside of the sensor, the pressure sensing part 42 is at least partially exposed to the pressure guiding hole 43, and the pressure detecting element 41 is connected to the pressure sensing part 42; the pressure guiding hole 43 includes a first pressure guiding channel 431 and a second pressure guiding channel 432, the first pressure guiding channel 431 is communicated with the second pressure guiding channel 432, the sensor has a height direction Z, a first direction X is defined, the first direction X is inclined relative to the height direction Z, the first pressure guiding channel 431 is partially located at one side of the second pressure guiding channel 432 along the first direction X, and the second pressure guiding channel 432 is partially located at one side of the first pressure guiding channel 431 along the first direction X.

In some embodiments, referring to fig. 10 and 11, the sensor includes a pressure detecting element 41, a pressure sensing portion 42, and a pressure guiding portion 4, the pressure guiding portion 4 having a pressure guiding hole 43, the pressure guiding hole 43 communicating with the outside of the sensor, the pressure sensing portion 42 being at least partially exposed to the pressure guiding hole 43, the pressure detecting element 41 being connected to the pressure sensing portion 42; the pressure guiding portion 4 is provided separately from the housing 11, and a portion of the pressure guiding portion 4 is located in the through hole 14, and a portion of the pressure guiding portion 4 is located in the second chamber 1142.

In some embodiments, referring to fig. 10 and 11, the housing portion 1 includes a pressure guiding portion 4 and a casing 11, the casing 11 has an inner cavity 114, the pressure guiding portion 4, the pressure detecting element 41 and the pressure sensing portion 42 are all located in the inner cavity 114, the pressure guiding portion 4 has a first pressure guiding channel 431 and a second pressure guiding channel 432, the casing 11 has a through hole 14, and the pressure guiding portion 4 is located at least partially in the through hole 14. Specifically, the through hole 14, the first pressure guiding channel 431 and the second pressure guiding channel 432 all extend along the height direction Z, the through hole 14 communicates with the inner cavity 114, the through hole 14 penetrates the housing 11 along the height direction Z, and the through hole 14 is located at one side of the circuit board 5 along the height direction Z. Specifically, the housing 11 includes a screw portion 112 and a sub-housing 111.

In some embodiments, referring to fig. 10, the flow area of the first pressure introduction passage 431 is smaller than the flow area of the second pressure introduction passage 432, and the first direction X is perpendicular to the height direction Z.

In some embodiments, the pressure guide 4 is integral with the housing 11.

In some embodiments, the housing part1 has a first face 44 and a second face 45, the second face 45 is exposed to the inner cavity 114, the first face 44 is exposed to the outside of the sensor, a second pressure guiding channel 432 is formed by recessing the first face 44 along the interior of the housing part1, and a second pressure guiding channel 432 is formed by recessing the second face 45 along the interior of the housing part 1; specifically, the first face 44 and the second face 45 are distributed in the height direction Z; further, the first pressure guiding channel 431 extends along the height direction Z, and the second pressure guiding channel 432 extends along the height direction Z.

In some embodiments, referring to fig. 10 and 12, the pressure guiding portion 4 includes a first connecting portion 46, an intermediate portion 47, and a second connecting portion 48, the intermediate portion 47 is located between the first connecting portion 46 and the second connecting portion 48 in the height direction Z, the first connecting portion 46 is connected to the intermediate portion 47, the second connecting portion 48 is connected to the intermediate portion 47, the first connecting portion 46 is located at least partially in the through hole 14, the first connecting portion 46 has a first pressure guiding channel 431, and the second connecting portion 48 has a second pressure guiding channel 432. Specifically, in the height direction Z, the second connection portion 48 is closer to the circuit board 5 than the first connection portion 46, the first connection portion 46 has the first face 44, the second connection portion 48 has the second face 45, the first face 44 extends in the first direction X, and the second face 45 extends in the first direction X. Further, the first connection portion 46 is connected to the housing 11. Specifically, the first connection portion 46 is laser welded to the housing 11.

In some embodiments, referring to fig. 10 and 12, the pressure guiding portion 4 includes a first connecting portion 46, an intermediate portion 47, and a second connecting portion 48, the intermediate portion 47 is located between the first connecting portion 46 and the second connecting portion 48 in the height direction Z, the first connecting portion 46 is connected to the intermediate portion 47, the second connecting portion 48 is connected to the intermediate portion 47, the first connecting portion 46 is located at least partially in the through hole 14, and the second connecting portion 48 and the intermediate portion 47 are located in the second cavity 1142.

In some embodiments, referring to fig. 10 and 12, the sensor has a height direction Z defining a first direction X perpendicular to the height direction Z, the threaded portion 112 has a wall portion 16, the wall portion 16 is located at the periphery of the second cavity 1142, the wall portion 16 extends along the first direction X, and the middle portion 47 is located at one side of the wall portion 16 along the height direction Z. Specifically, the sensor includes a boss 62, the boss 62 being located between the intermediate portion 47 and the wall portion 16, and the boss 62 being connected to the intermediate portion 47, the boss 62 being integral with the intermediate portion 47.

In some embodiments, referring to fig. 10 and 12, the first connection portion 46 is partially located at one side of the second connection portion 48 in the first direction X, and the second connection portion 48 is partially located at one side of the first connection portion 46 in the first direction X. The first connecting portions 46 and the second connecting portions 48 are staggered; specifically, the first connecting portion 46, the second connecting portion 48, and the intermediate portion 47 are all cylindrical, the first connecting portion 46 is disposed coaxially with the first pressure guiding channel 431, and the second connecting portion 48 is disposed coaxially with the second pressure guiding channel 432.

In some embodiments, referring to fig. 10 and 12, in the height direction Z, the first pressure guiding channel 431 penetrates the first connecting portion 46 and extends into the middle portion 47, and in the height direction Z, the second pressure guiding channel 432 penetrates the second connecting portion 48 and extends into the middle portion 47. Specifically, the first pressure introduction passage 431 and the second pressure introduction passage 432 are located at the intermediate portion 47 at a position where they communicate.

In some embodiments, referring to fig. 10 and 12, the sensor includes a main body 6 and a circuit board 5, the main body 6 and the circuit board 5 are both located in the inner cavity 114, the main body 6 is connected to the second connection portion 48, the main body 6 has a pressure sensing portion 42, the main body 6 is located on one side of the circuit board 5 in the height direction Z, and the pressure detecting element 41 is electrically connected to the circuit board 5. Specifically, in the height direction Z, the main body portion 6 is closer to the circuit board 5 than the second connection portion 48.

In some embodiments, referring to fig. 10 and 13, the circuit board 5 has a hole portion 51 defining a projection plane S, the projection plane S being disposed perpendicular to the height direction Z, and an orthographic projection of the hole portion 51 on the projection plane S is located within an orthographic projection of the main body portion 6 on the projection plane S. By arranging the main body 6 and the circuit board 5 in the height direction Z, the circuit board 5 can reduce the area of the hole 51, thereby increasing the area of the circuit board 5 where the electrical components are arranged, and if the main body 6 is at least partially located in the hole 51, the area of the hole 51 will be increased, and the effective arrangement area of the circuit board 5 will be reduced.

In some embodiments, the body portion 6 has a pressure tap 61, the pressure tap 61 communicates with a second pressure-inducing channel 432, the pressure-inducing portion 4 includes a boss 49, the boss 49 is connected to the second connection portion 48, the boss 49 is at least partially located in the pressure tap 61, the second pressure-inducing channel 432 extends through the boss 49, and the pressure-sensing portion 42 is exposed to the pressure tap 61. The boss 49 is mounted in the pressure measuring groove 61 and positioned, and the second connecting portion 48 and the main body portion 6 are laser welded. Specifically, the first connecting portion 46, the intermediate portion 47, the second connecting portion 48, and the boss portion 49 are one piece. The hole 51 and the first pressure guiding channel 431 are arranged in a staggered manner, and the first pressure guiding channel 431 and the second pressure guiding channel 432 are arranged in a staggered manner, so that the pressure sensing part 42 can be arranged under the hole 51 without enlarging the aperture of the first pressure guiding channel 431 and the second pressure guiding channel 432.

In some embodiments, referring to fig. 10 and 14, the sensor includes a housing 11, a pressure detecting element 41, a pressure sensing portion 42, and a pressure guiding portion 4, the pressure guiding portion 4 having a pressure guiding hole 43, the pressure guiding hole 43 communicating with the outside of the sensor, the pressure sensing portion 42 being at least partially exposed to the pressure guiding hole 43, the pressure detecting element 41 being connected to the pressure sensing portion 42; the pressure guiding part 4 is arranged separately from the shell 11, the shell 11 is provided with an inner cavity 114, the shell 11 is provided with an inner side wall 15, the inner side wall 15 is at least partially exposed to the inner cavity 114, and a gap is reserved between the inner side wall 15 and the pressure guiding part 4. Specifically, the pressure guiding hole 43 includes a first pressure guiding channel 431 and a second pressure guiding channel 432.

In some embodiments, referring to fig. 11 and 14, the housing 11 has a through hole 14, the cavity 114 communicates with the through hole 14, the pressure guiding portion 4 is partially located in the through hole 14, the inner sidewall 15 includes a first sidewall 151 and a second sidewall 152, the first sidewall 151 is exposed to the cavity 114, the second sidewall 152 is exposed to the through hole 14, the sensor has a height direction Z, the first sidewall 151 and the second sidewall 152 each extend along the height direction Z, a gap is provided between the pressure guiding portion 4 and the first sidewall 151, and a gap is provided between the pressure guiding portion 4 and the second sidewall 152. Specifically, in the height direction Z, the first side wall 151 is closer to the circuit board 5 than the second side wall 152, and in the first direction X, the first side wall 151 is located on one side of the second side wall 152. Further, the first sidewall 151 is arc-shaped, and the second sidewall 152 is arc-shaped. Specifically, the first sidewall 151 is exposed to the second chamber 1142.

In some embodiments, referring to fig. 11, 12 and 14, the pressure guiding portion 4 includes a first connecting portion 46, an intermediate portion 47 and a second connecting portion 48, the intermediate portion 47 is located between the first connecting portion 46 and the second connecting portion 48 in the height direction Z, the first connecting portion 46 is connected to the intermediate portion 47, the second connecting portion 48 and the intermediate portion 47 are located in the inner cavity 114, a gap is provided between each of the second connecting portion 48 and the intermediate portion 47 and the first side wall 151, the first connecting portion 46 is located at least partially in the through hole 14, and a gap is provided between the first connecting portion 46 and the second side wall 152. Specifically, the first connection portion 46 extends in the height direction Z, the intermediate portion 47 extends in the height direction Z, and the second connection portion 48 extends in the height direction Z. Gaps are formed between the second connecting portion 48 and the middle portion 47 and the first side wall 151, and gaps are formed between the first connecting portion 46 and the second side wall 152, so that the influence of external force on the pressure guiding hole 43 can be reduced, and the pressure detection accuracy is improved.

In some embodiments, referring to fig. 11, 12 and 14, the pressure guiding portion 4 includes a boss 62, the housing 11 has a wall portion 16, the wall portion 16 is exposed to the inner cavity 114, defining a first direction X, the first direction X is disposed perpendicular to a height direction Z, the wall portion 16 extends along the first direction X, the boss 62 is connected to the intermediate portion 47, the boss 62 is at least partially located between the intermediate portion 47 and the wall portion 16, and a gap is provided between the intermediate portion 47 and the wall portion 16 along the height direction Z. Specifically, the boss 62 is provided protruding from the surface of the intermediate portion 47 in a direction approaching the wall portion 16, and the boss 62 is integral with the intermediate portion 47. Specifically, the wall 16 is exposed to the second chamber 1142.

In some embodiments, referring to fig. 11, the wall portion 16 is connected to the first side wall 151 and the wall portion 16 is connected to the second side wall 152.

In some embodiments, referring to fig. 11 and 14, the pressure guiding portion 4 has a first face 44, the first face 44 is exposed to the outside of the sensor, the housing 11 has a welding face 17, the welding face 17 is exposed to the outside of the sensor, and the welding face 17 is welded to the first face 44. Specifically, the first surface 44 extends in the first direction X, the welding surface 17 and the first surface 44 are located on the same plane 19, the laser welding surface 17 and the first surface 44 are welded, and the contact between the housing 11 and the pressure guiding portion 4 is further reduced.

In some embodiments, referring to fig. 11 and 14, the sensor includes a main body 6, the main body 6 is located in the inner cavity 114, the main body 6 is connected to the second connection portion 48, the main body 6 has a pressure sensing portion 42, and a gap is formed between the main body 6 and the first side wall 151, so as to further reduce the influence of external force on the pressure guiding hole 43.

In some embodiments, referring to fig. 2 and 13, the sensor includes a circuit board 5, the circuit board 5 is located in the inner cavity 114, the main body portion 6 is located at one side of the circuit board 5 in the height direction Z, and the pressure detecting element 41 is electrically connected to the circuit board 5. Specifically, the circuit board 5 has a hole 51 defining a projection plane S, the projection plane S being disposed perpendicular to the height direction Z, and an orthographic projection of the hole 51 on the projection plane S is located within an orthographic projection of the main body 6 on the projection plane S.

In some embodiments, referring to fig. 10 and 12, the main body 6 has a pressure measuring groove 61, the pressure measuring groove 61 communicates with the pressure guiding hole 43, the pressure guiding part 4 includes a protruding part 49, the protruding part 49 is connected with the second connecting part 48, the protruding part 49 is at least partially located in the pressure measuring groove 61, the pressure guiding hole 43 penetrates the protruding part 49, and the pressure sensing part 42 is exposed to the pressure measuring groove 61; the first connecting portion 46, the intermediate portion 47, the second connecting portion 48, and the boss portion 49 are one piece.

In some embodiments, referring to fig. 10 and 15, the sensor includes a housing 11, a pin 72, and a temperature sensing element 71, the pin 72 and the temperature sensing element 71 being located within the housing 11, the pin 72 being electrically connected to the temperature sensing element 71; the sensor comprises a reinforcing part 7 and a protruding part 73, wherein the pin 72 is at least partially positioned in the reinforcing part 7, the sensor is provided with a height direction Z, the protruding part 73 is at least partially protruding from the reinforcing part 7 along the direction inclined to the height direction Z, and the reinforcing part 7 and the protruding part 73 are both positioned in the shell 11. Specifically, in the first direction X, the protruding portion 73 is partially located at one side of the pressure guiding portion 4.

In some embodiments, referring to fig. 2 and 15, the sensor includes a temperature detecting element 71, a circuit board 5, a first terminal 721 and a second terminal 722, the circuit board 5 is located in the first cavity 1141, the first terminal 721 and the second terminal 722 are located in the second cavity 1142, the temperature detecting element 71 is located in the temperature measuring groove 18, the first terminal 721 and the second terminal 722 are electrically connected to the temperature detecting element 71, and the first terminal 721 and the second terminal 722 are electrically connected to the circuit board 5. Specifically, another portion of the first terminal 721 and another portion of the second terminal 722 are located in the temperature measuring groove 18.

In some embodiments, referring to fig. 14, the sensor includes a temperature detecting element 71, a pin 72, and a circuit board 5, the circuit board 5 is located in an inner cavity 114, the housing 11 has a temperature measuring groove 18, the temperature measuring groove 18 is communicated with the inner cavity 114, the temperature detecting element 71 is located in the temperature measuring groove 18, the sensor has a height direction Z, the pin 72 is electrically connected with the temperature detecting element 71, the pin 72 is electrically connected with the circuit board 5, and the temperature detecting element 71 and the pressure guiding portion 4 are located on the same side of the circuit board 5 along the height direction Z; a gap is provided between the pin 72 and the lead portion 4. The influence of the pin 72 on the pressure guiding hole 43 in the pressure guiding part 4 is reduced, and the pressure detection accuracy is further improved.

In some embodiments, the sensor includes a stiffener 7, the stiffener 7 being connected to a pin 72, the pin 72 being at least partially located in the stiffener 7, there being a gap between the stiffener 7 and the crimp 4. Specifically, the influence of the reinforcing portion 7 on the pressure guiding portion 4 can be reduced by providing a gap between the reinforcing portion 7 and the pressure guiding portion 4 in the first direction X.

In some embodiments, referring to fig. 2 and 15, the sensor includes a reinforcement portion 7, a first terminal 721 portion and a second terminal 722 portion are both positioned within the reinforcement portion 7, the reinforcement portion 7 portion is positioned in the second cavity 1142, and the reinforcement portion 7 portion is positioned in the temperature measurement groove 18. Specifically, the reinforcing portion 7 includes a first fixing portion 74 and a second fixing portion 75, the first fixing portion 74 and the second fixing portion 75 are integrated, the first fixing portion 74 is located in the temperature measuring groove 18, and the second fixing portion 75 is located in the second cavity 1142.

In some embodiments, referring to fig. 10 and 15, the sensor includes a protrusion 73, the sensor has a height direction Z, the protrusion 73 is at least partially protruding from the reinforcement 7 in a direction oblique to the height direction Z, the sensor has a height direction Z defining a first direction X, the first direction X is perpendicular to the height direction Z, the screw 112 has a wall 16, the wall 16 is located at the periphery of the second cavity 1142, the wall 16 extends in the first direction X, the wall 16 is located between the protrusion 73 and the temperature detecting element 71 in the height direction Z, and the protrusion 73 is in contact with the wall 16. Specifically, the protruding portion 73 extends in the second direction Y.

In some embodiments, referring to fig. 10 and 11, housing 11 has a temperature measuring slot 18 and an interior cavity 114, temperature measuring slot 18 is in communication with interior cavity 114, pins 72 and reinforcement 7 are at least partially located in interior cavity 114, temperature sensing element 71 is located in temperature measuring slot 18, housing 11 has a wall 16, wall 16 is exposed to interior cavity 114, and protrusion 73 is in contact with wall 16. Specifically, a first direction X is defined, which is perpendicular to the height direction Z, along which the wall portion 16 extends, and along which the wall portion 16 is located between the protruding portion 73 and the temperature detecting element 71. Further, the protruding portion 73 is at least partially in contact with the wall portion 16.

In some embodiments, referring to fig. 10 and 15, the reinforcement portion 7 includes a first fixing portion 74 and a second fixing portion 75, the first fixing portion 74 is at least partially located in the temperature measuring groove 18, the second fixing portion 75 is located in the inner cavity 114, the first fixing portion 74 is located at one side of the second fixing portion 75 in the height direction Z, the first fixing portion 74 is connected to the second fixing portion 75, and the protruding portion 73 protrudes from the first fixing portion 74 or the second fixing portion 75. Specifically, the protruding portion 73 protrudes from the second fixing portion 75. Further, in the height direction Z, the second fixing portion 75 is located at one side of the temperature measuring groove 18, the first fixing portion 74 extends in the height direction Z, and the second fixing portion 75 extends in the height direction Z.

In some embodiments, referring to fig. 10 and 15, the reinforcement portion 7 has a first positioning notch 751 and a second positioning notch 752, the first positioning notch 751 is located on one side of the second positioning notch 752 along the height direction Z, the first positioning notch 751 is disposed opposite to the second positioning notch 752, the first positioning notch 751 is recessed from the surface of the reinforcement portion 7 into the reinforcement portion 7, and the second positioning notch 752 is recessed from the surface of the reinforcement portion 7 into the reinforcement portion 7. Specifically, a second direction Y is defined, the second direction Y is perpendicular to the first direction X, the second direction Y is perpendicular to the height direction Z, and along the second direction Y, the first positioning notch 751 is recessed from the surface of the reinforcement portion 7 to the inside of the reinforcement portion 7, and the second positioning notch 752 is recessed from the surface of the reinforcement portion 7 to the inside of the reinforcement portion 7. Further, the first positioning notch 751 and the second positioning notch 752 are distributed along the second direction Y. When the reinforcing portion 7 is processed, the pins 72 are positioned by the jig, and then the first positioning notch 751 and the second positioning notch 752 are injection-molded. Specifically, the reinforcement 7 has a columnar shape. The first fixing portion 74 has a cylindrical shape, and the second fixing portion 75 has a rectangular parallelepiped shape.

In some embodiments, referring to fig. 10 and 15, the second fixing portion 75 has a first positioning notch 751 and a second positioning notch 752, the first positioning notch 751 is located on one side of the second positioning notch 752 along the height direction Z, the first positioning notch 751 is disposed opposite to the second positioning notch 752, the first positioning notch 751 is recessed from the surface of the second fixing portion 75 into the reinforcing portion 7, and the second positioning notch 752 is recessed from the surface of the second fixing portion 75 into the reinforcing portion 7. The first fixing portion 74 has a third positioning notch 741 and a fourth positioning notch 742, the third positioning notch 741 is located at one side of the fourth positioning notch 742 along the height direction Z, the third positioning notch 741 is disposed opposite to the fourth positioning notch 742, the third positioning notch 741 is recessed from the surface of the first fixing portion 74 to the inside of the reinforcing portion 7, and the fourth positioning notch 742 is recessed from the surface of the first fixing portion 74 to the inside of the reinforcing portion 7.

In some embodiments, referring to fig. 10 and 15, the pin 72 includes a first terminal 721 and a second terminal 722, the first terminal 721 and the second terminal 722 are both located in the reinforcement portion 7, the first terminal 721 is partially and fully exposed to the first positioning notch 751, and the second terminal 722 is partially and fully exposed to the second positioning notch 752. Specifically, the first terminal 721 and the second terminal 722 are electrically connected to the temperature detecting element 71, and the first terminal 721 and the second terminal 722 are electrically connected to the circuit board 5. Further, the reinforcement portion 7 is covered outside the first terminal 721 and the second terminal 722.

In some embodiments, referring to fig. 10 and 14, a gap is provided between the first fixing portion 74 and the temperature detecting element 71; the first fixing portion 74 is cylindrical or columnar, the second fixing portion 75 is rectangular or columnar, and the first fixing portion 74, the second fixing portion 75 and the protruding portion 73 are integrally formed. Specifically, the gap between the first fixing portion 74 and the pin 72 can be filled with the gap between the first fixing portion 74 and the temperature detecting element 71.

In some embodiments, referring to fig. 10 and 14, the first fixing portion 74 extends in the height direction Z, and the second fixing portion 75 extends in the height direction Z; a projection plane S is defined, the projection plane S is perpendicular to the height direction Z, and the orthographic projection of the first fixing portion 74 on the projection plane S is located in the orthographic projection of the second fixing portion 75 on the projection plane S.

In some embodiments, referring to fig. 10 and 14, the sensor includes a pressure guiding portion 4, where the pressure guiding portion 4 is formed as a single piece or separate from the housing 11, defining a first direction X, the first direction X being perpendicular to the height direction Z, along which the pressure guiding portion 4 is located on one side of the reinforcing portion 7 and the protruding portion 73, and the protruding portion 73 extends partially around the pressure guiding portion 4. Specifically, the protruding portion 73 is a ring-shaped portion.

In some embodiments, referring to fig. 2 and 8, the sensor includes a circuit board 5, the sensor has a height direction Z, and the circuit board 5 is located at one side of the temperature detecting element 71 along the height direction Z, and the pins 72 are electrically connected to the circuit board 5. Specifically, the circuit board 5 has a jack 52, the pin 72 is partially located in the jack 52, and the pin 72 is soldered to the circuit board 5; the circuit board 5 can be in contact with the reinforcement 7. When mounted, the reinforcement portion 7 can be in contact with the circuit board 5, so that the first terminal 721 and the second terminal 722 can be soldered to the circuit board 5.

In some embodiments, referring to fig. 10 and 15, a second direction Y is defined, the second direction Y being perpendicular to the height direction Z, the protruding portion 73 includes a first bump 731 and a second bump 732, and the first bump 731 and the second bump 732 are located on different sides of the reinforcing portion 7 along the second direction Y, respectively. Specifically, the first bump 731 and the second bump 732 are both in contact with the wall portion 16, the first bump 731 and the second bump 732 are located at the periphery of the guiding portion 4, further, the first bump 731 and the second bump 732 are located at the periphery of the middle portion 47, and the first bump 731, the second bump 732, the first fixing portion 74 and the second fixing portion 75 are integrated.

In some embodiments, referring to fig. 10 and 14, the housing 11 has a first sidewall 151, the first sidewall 151 is exposed to the inner cavity 114, the first sidewall 151 extends in the height direction Z, and a gap is provided between the first sidewall 151 and the reinforcement 7. Specifically, the first sidewall 151 is exposed to the second chamber 1142. Specifically, a projection plane S is defined, the projection plane S is perpendicular to the height direction Z, the orthographic projection of the reinforcement portion 7 on the projection plane S is located in the orthographic projection of the projection portion 73 on the projection plane S, and along the first direction X, the projection portion 73 is located partially between the first side wall 151 and the reinforcement portion 7.

A method of manufacturing a sensor, comprising the steps of: providing a shell 11, processing the shell 11 to form a first cavity 1141 and a second cavity 1142 which are communicated with each other, and processing the wall of the second cavity 1142 to form a temperature measuring groove 18; wherein the housing 11 comprises a sub-housing 111 and a threaded portion 112 connected to each other, the sub-housing 111 having a first cavity 1141 and the threaded portion 112 having a second cavity 1142.

Specifically, a first chamber 1141 is formed on a surface of the housing 11, a second chamber 1142 is formed on a wall of the first chamber 1141, or the first chamber 1141 and the second chamber 1142 are formed on a surface of the housing 11 at one time.

In some embodiments, the method of manufacturing a sensor further comprises the steps of: a through hole 14 is formed from the outside of the housing 11; wherein the through hole 14 communicates with the second chamber 1142; providing a temperature detecting member and a pressure detecting member, and placing the pressure detecting member and the temperature detecting member into the second cavity 1142; wherein, the pressure detecting part is positioned at the through hole 14, and the temperature detecting part is positioned at the temperature measuring groove 18. Further facilitating the machining of the temperature measuring slot 18 and the through hole 14.

Specifically, the pressure detecting member includes a pressure detecting element 41 and a pressure sensing portion 42; the temperature detecting member includes a first terminal 721, a second terminal 722, and a temperature detecting element 71; further, the pressure detecting element 41 is a pressure sensitive chip, and the temperature detecting element 71 is an NTC or a thermistor.

The positioning part 2 is provided, the positioning part 2 is placed in the first cavity 1141, and the positioning part 2 is elastically clamped and connected with the shell 11.

The circuit board 5 is provided, the circuit board 5 is placed in the first cavity 1141, the positioning part 2 is electrically connected with the circuit board 5, the pressure detecting member is electrically connected with the circuit board 5, and the temperature detecting member is electrically connected with the circuit board 5. A plug 31 is provided, and the plug 31 is mounted into the first cavity 1141.

A method of manufacturing a sensor, comprising the steps of: providing a housing part 1, the housing part 1 having a first face 44 and a second face 45; a first pressure guiding channel 431 is formed on the first surface 44, and a second pressure guiding channel 432 is formed on the second surface 45; wherein the first surface 44 and the second surface 45 are respectively located at different sides of the housing portion 1, and the first pressure guiding channel 431 is communicated with the second pressure guiding channel 432. Specifically, the first surface 44 and the second surface 45 are distributed along the height direction Z, the first surface 44 is exposed to the outside of the sensor, and the second surface 45 is exposed to the cavity 114.

In some embodiments, where the first face 44 and the second face 45 are located on opposite sides of the housing portion 1, respectively, the housing portion 1 includes the housing 11 and the pressure guiding portion 4, the pressure guiding portion 4 has the first face 44 and the second face 45; machining an inner cavity 114 and a through hole 14 on the shell 11, wherein the inner cavity 114 is communicated with the through hole 14; the portion of the pressure introduction portion 4 is placed in the through hole 14 and welded.

In some embodiments, the housing 11 is machined with the internal cavity 114 and the through hole 14, wherein the internal cavity 114 is in communication with the through hole 14; before the step of placing the portion of the pressure guiding portion 4 into the through hole 14 and welding, the method further comprises the steps of:

The main body 6 and the pressure detecting element 41 are provided, the pressure detecting element 41 is connected to the main body 6, the main body 6 is fitted over the pressure guiding portion 4, and the main body 6 and the pressure guiding portion 4 are welded.

The above embodiments are only for illustrating the present application and not for limiting the technical solutions described in the present application, and it should be understood that the present application should be based on those skilled in the art, and although the present application has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the present application without departing from the spirit and scope of the present application and modifications thereof should be covered by the scope of the appended claims.

Claims (10)

1. A sensor, characterized by comprising a housing part (1), a pressure detecting element (41) and a pressure sensing part (42), wherein the housing part (1) is provided with a pressure guiding hole (43), the pressure guiding hole (43) is communicated with the outside of the sensor, the pressure sensing part (42) is at least partially exposed to the pressure guiding hole (43), and the pressure detecting element (41) is connected with the pressure sensing part (42);

The pressure guiding hole (43) comprises a first pressure guiding channel (431) and a second pressure guiding channel (432), the first pressure guiding channel (431) is communicated with the second pressure guiding channel (432), the sensor is provided with a height direction (Z), a first direction (X) is defined, the first direction (X) is inclined relative to the height direction (Z), along the first direction (X), the first pressure guiding channel (431) is partially located on one side of the second pressure guiding channel (432), along the first direction (X), and the second pressure guiding channel (432) is partially located on one side of the first pressure guiding channel (431).

2. The sensor of claim 1, wherein: the shell part (1) comprises a pressure guiding part (4) and a shell (11), the shell (11) is provided with an inner cavity (114), the pressure guiding part (4), a pressure detecting element (41) and a pressure sensing part (42) are all positioned in the inner cavity (114), the pressure guiding part (4) is provided with a first pressure guiding channel (431) and a second pressure guiding channel (432), the shell (11) is provided with a through hole (14), and the pressure guiding part (4) is at least partially positioned in the through hole (14);

the flow area of the first pressure guiding channel (431) is smaller than that of the second pressure guiding channel (432), and the first direction (X) is perpendicular to the height direction (Z).

3. The sensor of claim 1, wherein: the housing part (1) is provided with a first surface (44) and a second surface (45), the second surface (45) is exposed to the inner cavity (114), the first surface (44) is exposed to the outside of the sensor, the second pressure guiding channel (432) is formed by recessing from the first surface (44) along the inner part of the housing part (1), and the second pressure guiding channel (432) is formed by recessing from the second surface (45) along the inner part of the housing part (1);

The first pressure guiding channel (431) extends along the height direction (Z), and the second pressure guiding channel (432) extends along the height direction (Z).

4. The sensor of claim 2, wherein: the pressure guiding part (4) comprises a first connecting part (46), a middle part (47) and a second connecting part (48), the middle part (47) is positioned between the first connecting part (46) and the second connecting part (48) along the height direction (Z), the first connecting part (46) is connected with the middle part (47), the second connecting part (48) is connected with the middle part (47), the first connecting part (46) is at least partially positioned in the through hole (14), the first connecting part (46) is provided with the first pressure guiding channel (431), and the second connecting part (48) is provided with the second pressure guiding channel (432);

the first connection portion (46) is connected to the housing (11).

5. The sensor of claim 4, wherein: -along the first direction (X), the first connection portion (46) is partially located on one side of the second connection portion (48), along the first direction (X), the second connection portion (48) is partially located on one side of the first connection portion (46);

Along the height direction (Z), the first pressure guiding channel (431) penetrates through the first connecting portion (46) and extends into the middle portion (47), and along the height direction (Z), the second pressure guiding channel (432) penetrates through the second connecting portion (48) and extends into the middle portion (47).

6. The sensor of claim 4, wherein: the sensor comprises a main body part (6) and a circuit board (5), wherein the main body part (6) and the circuit board (5) are both positioned in the inner cavity (114), the main body part (6) is connected with the second connecting part (48), the main body part (6) is provided with the pressure sensing part (42), the main body part (6) is positioned at one side of the circuit board (5) along the height direction (Z), and the pressure detection element (41) is electrically connected with the circuit board (5);

the circuit board (5) is provided with a hole part (51) and defines a projection surface (S), the projection surface (S) is perpendicular to the height direction (Z), and the orthographic projection of the hole part (51) on the projection surface (S) is positioned in the orthographic projection of the main body part (6) on the projection surface (S).

7. The sensor of claim 6, wherein: the main body part (6) is provided with a pressure measuring groove (61), the pressure measuring groove (61) is communicated with the second pressure guiding channel (432), the pressure guiding part (4) comprises a protruding part (49), the protruding part (49) is connected with the second connecting part (48), the protruding part (49) is at least partially positioned in the pressure measuring groove (61), the second pressure guiding channel (432) penetrates through the protruding part (49), and the pressure sensing part (42) is exposed to the pressure measuring groove (61);

The first connecting portion (46), the intermediate portion (47), the second connecting portion (48) and the protruding portion (49) are an integral piece.

8. A method of manufacturing a sensor, comprising the steps of: providing a housing part (1), wherein the housing part (1) is provided with a first surface (44) and a second surface (45);

Forming a first pressure guiding channel (431) from the first surface (44) and forming a second pressure guiding channel (432) from the second surface (45);

Wherein the first surface (44) and the second surface (45) are respectively positioned on different sides of the shell part (1), and the first pressure guiding channel (431) is communicated with the second pressure guiding channel (432).

9. The method of manufacturing a sensor according to claim 8, wherein: wherein the first surface (44) and the second surface (45) are respectively located at two opposite sides of the housing part (1), the housing part (1) comprises a shell (11) and a pressure guiding part (4), and the pressure guiding part (4) is provided with the first surface (44) and the second surface (45);

-machining the housing (11) with an inner cavity (114) and a through hole (14), wherein the inner cavity (114) communicates with the through hole (14); the pressure guiding part (4) is partially put into the through hole (14) and welded.

10. The method of manufacturing a sensor according to claim 9, wherein the housing (11) is provided with an inner cavity (114) and a through hole (14), wherein the inner cavity (114) communicates with the through hole (14); before the step of placing the pressure guiding part (4) into the through hole (14) and welding, the method further comprises the following steps:

A main body (6) and a pressure detection element (41) are provided, the pressure detection element (41) is connected to the main body (6), the main body (6) is sleeved on the pressure guiding part (4), and the main body (6) and the pressure guiding part (4) are welded.