CN118326461A - Preparation method of additive for RTF low-profile copper foil production, product and application thereof - Google Patents
Preparation method of additive for RTF low-profile copper foil production, product and application thereof Download PDFInfo
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- CN118326461A CN118326461A CN202410429348.6A CN202410429348A CN118326461A CN 118326461 A CN118326461 A CN 118326461A CN 202410429348 A CN202410429348 A CN 202410429348A CN 118326461 A CN118326461 A CN 118326461A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 103
- 239000011889 copper foil Substances 0.000 title claims abstract description 78
- 239000000654 additive Substances 0.000 title claims abstract description 25
- 230000000996 additive effect Effects 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 23
- 230000008569 process Effects 0.000 claims abstract description 19
- 239000003792 electrolyte Substances 0.000 claims abstract description 12
- WGJCBBASTRWVJL-UHFFFAOYSA-N 1,3-thiazolidine-2-thione Chemical compound SC1=NCCS1 WGJCBBASTRWVJL-UHFFFAOYSA-N 0.000 claims abstract description 9
- RVYRYLJMSWSDIG-UHFFFAOYSA-M C(CC)S(=O)(=O)[O-].[Na+].SC=1NC=CN1 Chemical compound C(CC)S(=O)(=O)[O-].[Na+].SC=1NC=CN1 RVYRYLJMSWSDIG-UHFFFAOYSA-M 0.000 claims abstract description 9
- JTEQZWNDYJRHSC-UHFFFAOYSA-N C1(=CC=CC=C1)OS(=S)(=S)CCC.[Na] Chemical compound C1(=CC=CC=C1)OS(=S)(=S)CCC.[Na] JTEQZWNDYJRHSC-UHFFFAOYSA-N 0.000 claims abstract description 9
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 claims abstract description 9
- KQESUUZXLBJROK-UHFFFAOYSA-M sodium;3-(1,1,3-trioxo-1,2-benzothiazol-2-yl)propane-1-sulfonate Chemical compound [Na+].C1=CC=C2S(=O)(=O)N(CCCS(=O)(=O)[O-])C(=O)C2=C1 KQESUUZXLBJROK-UHFFFAOYSA-M 0.000 claims abstract description 9
- 239000002131 composite material Substances 0.000 claims abstract description 6
- 229940093429 polyethylene glycol 6000 Drugs 0.000 claims abstract description 4
- 239000000243 solution Substances 0.000 claims description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 238000005303 weighing Methods 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 7
- 239000011259 mixed solution Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 238000007865 diluting Methods 0.000 claims description 3
- 230000005684 electric field Effects 0.000 claims description 3
- 238000004070 electrodeposition Methods 0.000 claims description 3
- 239000012224 working solution Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 abstract description 12
- 238000007254 oxidation reaction Methods 0.000 abstract description 12
- 239000000126 substance Substances 0.000 abstract description 6
- 239000011888 foil Substances 0.000 abstract description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 3
- 206010028980 Neoplasm Diseases 0.000 abstract description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000956 alloy Substances 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 229910001431 copper ion Inorganic materials 0.000 abstract description 3
- 238000004090 dissolution Methods 0.000 abstract description 3
- 230000002265 prevention Effects 0.000 abstract description 3
- 229910000077 silane Inorganic materials 0.000 abstract description 3
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 230000008901 benefit Effects 0.000 description 15
- 230000008054 signal transmission Effects 0.000 description 13
- 238000005516 engineering process Methods 0.000 description 10
- 238000012876 topography Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 description 5
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 239000004643 cyanate ester Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 229920001955 polyphenylene ether Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- -1 Polytetrafluoroethylene Polymers 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000002500 effect on skin Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The invention discloses a preparation method of an additive for RTF low-profile copper foil production, a product and application thereof, wherein the additive comprises 2-mercaptothiazoline, sodium phenyl dithiopropane sulfonate, sodium mercaptoimidazole propane sulfonate, tetrahydroxypropyl ethylenediamine, N- (3-sulfopropyl) -saccharin sodium salt and polyethylene glycol 6000. The composite additive ensures that copper ions in the electrolyte are uniformly deposited on the surface of the cathode so as to ensure that the surface of the copper foil is uniform and smooth and low in profile, and a series of process conditions including copper dissolution and foil production, coarsening, solidification, alloy treatment, oxidation prevention, silane and other parameters are combined and optimized, so that copper foils with different thicknesses can be produced, and the copper foil with high peel strength, high conductivity, good oxidation resistance and excellent wear resistance and extremely low profile are endowed. The size of copper tumor on the surface of the copper foil is 300-600nm; copper foil has excellent physical and chemical properties such as low profile while maintaining high peel strength, high electrical conductivity, good oxidation resistance, and excellent wear resistance.
Description
Technical Field
The invention relates to the technical field of electrolytic copper foil production and manufacturing, in particular to a preparation method of an additive for RTF low-profile copper foil production, a product and application thereof.
Background
With the development of society, people have higher and higher requirements on high frequency and high speed, and the development of blockchain, internet of things, cloud computing/servers, smart phones and the like all need the support of high frequency and high speed PCB technology. The high-frequency high-speed copper-clad plate serving as a main raw material of the high-frequency high-speed PCB is a research key point, and the quality of the copper foil, the resin and the glass fiber cloth serving as three main raw materials of the copper-clad plate directly influences the signal transmission of the PCB. Resin materials suitable for producing high-frequency high-speed copper-clad plates are many, such as Polytetrafluoroethylene (PTFE), polyphenyl ether (PPO/PPE), cyanate Ester (CE), polyimide (PI), liquid Crystal Polymer (LCP) and the like, and the corresponding dielectric property is that the dielectric constant Dk of Polytetrafluoroethylene (PTFE) is 2.1, and the dielectric loss Df is 0.0005; polyphenylene ether (PPO/PPE) had a dielectric constant Dk of 2.5 and a dielectric loss Df of 0.0007; cyanate Ester (CE) dielectric constant Dk of 2.9 and dielectric loss Df of 0.0030; polyimide (PI) has a dielectric constant Dk of 3.1 and a dielectric loss Df of 0.0028; the dielectric constant Dk of the Liquid Crystal Polymer (LCP) is 3.3, the dielectric loss Df is 0.0020, and the PTFE resin has excellent dielectric property according to the dielectric property of each material, the forming process is complex, and the PTFE resin is difficult to be applied in a large batch at present; CE. The dielectric properties of PI, LCP and the like are relatively poor, the requirements of higher and higher frequencies and high speeds are difficult to meet, and polyphenyl ether (PPO/PPE) has good dielectric properties, is suitable for hot press forming, has relatively simple production process, and is suitable for the production of a large number of high-frequency and high-speed copper-clad plates.
The electronic copper foil is used as one of indispensable basic materials of the copper-clad plate and is also a conductive material in a Printed Circuit Board (PCB), the characteristics of the copper foil have obvious influence on the performance of the PCB, and particularly when the copper foil is applied to a high-frequency high-speed circuit board, the surface morphology of the copper foil has obvious influence on the signal transmission loss of the PCB.
RTF electrolytic copper foil is used as a novel electronic material, and is highly matched with the requirements of a high-frequency high-speed circuit board by virtue of the advantages of excellent conductive performance, anti-interference performance, heat dissipation performance and the like. The high-frequency high-speed circuit board has extremely high requirements on materials, not only needs to have excellent conductive performance so as to meet the requirements of signal transmission, but also has good anti-interference performance, and reduces the influence of external interference on the signal transmission. In addition, the heat dissipation performance is also a key factor, because the high-frequency and high-speed circuit board can generate a large amount of heat in the operation process, and if the heat cannot be dissipated effectively, the performance and the service life of the circuit board can be influenced
Because of its excellent properties, RTF copper foil is widely used in China in the fields of IC packaging carrier boards, high-density interconnection technology boards, various electronic components, home appliances, communications, automobiles, new energy sources and the like. As a conductive material, an RTF copper foil plays a critical role in electronic components, such as application to a heat sink, an electromagnetic shielding material, a flexible circuit board, and the like. In addition, RTF copper foil also has huge application potential in the field of new energy sources, such as solar cell back plates, new energy automobile batteries and the like.
Disclosure of Invention
The invention aims to provide a preparation method of an additive for producing RTF low-profile copper foil, which has the advantages of simple steps, easy control of conditions and low cost.
The invention also aims to provide the additive for producing the RTF low-profile copper foil prepared by the method and the application thereof.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the preparation method of the additive for producing the RTF low-profile copper foil comprises the following steps:
(1) The following raw materials were prepared:
2-mercaptothiazoline 20-150g/L
Sodium phenyl dithiopropane sulfonate 20-100g/L
10-100G/L sodium mercaptoimidazole propane sulfonate
20-100G/L of tetrahydroxypropyl ethylenediamine
20-150G/L N- (3-sulfopropyl) -saccharin sodium salt
Polyethylene glycol 600010-50g/L;
(2) Respectively weighing 2-mercaptothiazoline, sodium phenyl dithiopropane sulfonate, sodium mercaptoimidazole propane sulfonate, tetrahydroxypropyl ethylenediamine, N- (3-sulfopropyl) -saccharin sodium salt and polyethylene glycol 6000, and dissolving in deionized pure water to obtain a solution A, a solution B, a solution C, a solution D, a solution E and a solution F;
(3) Adding the solution A, the solution B, the solution C, the solution D, the solution E and the solution F prepared in the step (2) into a constant temperature stirring tank, and stirring for 60 minutes at a constant temperature of 50-60 ℃ to obtain a mixed solution;
(4) And (3) quantitatively diluting the mixed solution in the step (3) with deionized water to finish the preparation of the electrolyte composite additive.
An additive for producing RTF low-profile copper foil, which comprises the following raw materials:
2-mercaptothiazoline 20-150g/L
Sodium phenyl dithiopropane sulfonate 20-100g/L
10-100G/L sodium mercaptoimidazole propane sulfonate
20-100G/L of tetrahydroxypropyl ethylenediamine
20-150G/L N- (3-sulfopropyl) -saccharin sodium salt
Polyethylene glycol 600010-50g/L.
Use of an RTF very low profile copper foil additive for preparing an RTF very low profile copper foil. Adopting an electrolytic electrodeposition process, depositing metallic copper on a negative electrode under the action of circulating an electric field in a reaction tank, and winding by a unit; in the electrolytic process, the temperature of the electrolyte working solution is 50-55 ℃, the flow rate of the electrolyte is 30-60 m 3/H, and the direct current deposition is carried out under the process environment.
The invention has the beneficial effects that:
1. The composite additive ensures that copper ions in the electrolyte are uniformly deposited on the surface of a cathode (titanium roller) so as to ensure that the surface of a copper foil is uniform and smooth, has low profile (low roughness), combines and optimizes a series of process conditions, comprises parameters of copper dissolution, foil generation, coarsening, curing, alloy treatment, oxidation prevention, silane and the like, can produce copper foils with different thicknesses, and endows the copper foil with high peeling strength, higher conductivity, good oxidation resistance and excellent wear resistance and extremely low profile. The size of copper tumor on the surface of the copper foil is 300-600nm; copper foil has excellent physical and chemical properties such as low profile while maintaining high peel strength, high electrical conductivity, good oxidation resistance, and excellent wear resistance.
2. The RTF low-profile copper foil product produced by the invention has strong high-quality consistency, is established on the control of the grain structure of the raw foil anode groove, thereby ensuring the characteristics of copper bud height, copper nodule structure, peeling strength, heat resistance chemical property, dip soldering property, heat resistance, high-frequency high-speed signal transmission loss reduction and the like of the product, belongs to a copper foil special for a high-frequency high-speed substrate, has the advantages of high hardness, smooth roughened surface, good heat stability, uniform thickness and the like, and has extremely low surface profile of RTF copper foil such as oxidation resistance layer treatment technology, planarization treatment technology, nodule micro-particle technology, heat resistance layer treatment technology and the like, and has excellent dielectric characteristics such as low transmission signal loss, small impedance and the like after the copper foil is manufactured into a PCB.
3. The roughened layer of the RTF electrolytic copper foil is an equiaxed fine crystallization spherical copper nodule structure of a uniform smooth layer by matching corresponding current density and automatic production process control under the combination of a self-grinding novel additive and an improved electroplating formula. The structure shortens the signal transmission path due to the extremely low roughness under the skin effect state that the current is concentrated on the outer surface of the copper foil conductor when the high-frequency signal is transmitted at high speed, and the copper nubs with equiaxed structures keep certain integrity of the signal and AC interference and reflection phenomena in the transmission process.
Drawings
FIG. 1 is a roughened (M-plane) topography of a copper foil, magnified 3000 times;
FIG. 2 is a roughened (M-plane) topography of a copper foil, magnified 5000 times;
FIG. 3 is a roughened (M-plane) topography of the copper foil, magnified 10000 times;
FIG. 4 is a roughened (M-plane) topography of a copper foil, magnified 20000 times;
FIG. 5 is a graph of the roughened (S-plane) surface morphology of a copper foil-magnified 3000 times;
FIG. 6 is a graph of the roughened (S-plane) surface morphology of a copper foil-magnification 5000 times;
FIG. 7 is a graph of the roughened (S-side) topography of the smooth surface of a copper foil-magnified 10000 times;
FIG. 8 is a graph of the roughened surface (S-surface) morphology of a copper foil-magnification 20000 times;
FIG. 9 is a 45 degree view angle morphology of a roughened (S-side) surface of a copper foil-magnified 3000 times;
FIG. 10 is a 45 degree view angle topography of a roughened (S-side) surface of a copper foil-magnification 5000 times;
FIG. 11 is a 45 degree view angle morphology of a roughened (S-side) surface of a copper foil-magnified 10000 times;
FIG. 12 is a 45 degree view angle morphology of a roughened (S-side) surface of a copper foil-magnification 20000 times;
FIG. 13 is a 90 degree view angle topography of a copper foil section-magnified 3000 times;
figure 14 is a 90 degree view angle topography of a copper foil section-5000 x magnification.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more clear. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
Referring to fig. 1 to 14, this embodiment provides a method for preparing an additive for producing an RTF low profile copper foil,
The following raw materials were prepared:
2-mercaptothiazoline 20-150g/L
Sodium phenyl dithiopropane sulfonate 20-100g/L
10-100G/L sodium mercaptoimidazole propane sulfonate
20-100G/L of tetrahydroxypropyl ethylenediamine
20-150G/L N- (3-sulfopropyl) -saccharin sodium salt
Polyethylene glycol 600010-50g/L;
Weighing 5Kg of 2-mercaptothiazoline, and dissolving in 20L of deionized pure water to obtain solution A;
weighing 5Kg of sodium phenyl dithiopropane sulfonate, and dissolving in 20L of deionized pure water to obtain a solution B;
weighing 5Kg of sodium mercaptoimidazole propane sulfonate, and dissolving in 20L of deionized pure water to obtain solution C;
weighing 5L of tetrahydroxypropyl ethylenediamine, and dissolving in 5L of deionized pure water to obtain a solution D;
Weighing 5Kg of N- (3-sulfopropyl) -saccharin sodium salt, and dissolving in 20L of deionized pure water to obtain a solution E;
weighing 2Kg of polyethylene glycol 6000 and dissolving in 10L of deionized pure water to obtain a solution F;
Adding the prepared solution A, solution B, solution C, solution D, solution E and solution F into a constant temperature stirring tank, and stirring for 60 minutes at a constant temperature of 50-60 ℃ to obtain a mixed solution;
And diluting the mixed solution to 100L by deionized water to finish the preparation of the electrolyte composite additive.
The composite additive ensures that copper ions in the electrolyte are uniformly deposited on the surface of a cathode (titanium roller) so as to ensure that the surface of a copper foil is uniform and smooth, has low profile (low roughness), combines and optimizes a series of process conditions, comprises parameters of copper dissolution, foil generation, coarsening, curing, alloy treatment, oxidation prevention, silane and the like, can produce copper foils with different thicknesses, and endows the copper foil with high peeling strength, higher conductivity, good oxidation resistance and excellent wear resistance and extremely low profile. The size of copper tumor on the surface of the copper foil is 300-600nm; copper foil has excellent physical and chemical properties such as low profile while maintaining high peel strength, high electrical conductivity, good oxidation resistance, and excellent wear resistance.
The roughened layer of the RTF electrolytic copper foil is an equiaxed fine crystallization spherical copper nodule structure of a uniform smooth layer by matching corresponding current density and automatic production process control under the combination of a self-grinding novel additive and an improved electroplating formula. The structure shortens the signal transmission path due to the extremely low roughness under the skin effect state that the current is concentrated on the outer surface of the copper foil conductor when the high-frequency signal is transmitted at high speed, and the copper nubs with equiaxed structures keep certain integrity of the signal and AC interference and reflection phenomena in the transmission process.
The embodiment also provides application of the RTF extremely low profile copper foil additive, wherein the RTF extremely low profile copper foil additive is used for preparing the RTF extremely low profile copper foil. Adopting an electrolytic electrodeposition process, depositing metallic copper on a negative electrode under the action of circulating an electric field in a reaction tank, and winding by a unit; in the electrolytic process, the temperature of the electrolyte working solution is 50-55 ℃, the flow rate of the electrolyte is 30-60 m 3/H, and the direct current deposition is carried out under the process environment.
The RTF low-profile copper foil product produced by the invention has strong high-quality consistency, is established on the control of the grain structure of the raw foil anode groove, thereby ensuring the characteristics of copper bud height, copper nodule structure, peeling strength, heat resistance chemical property, dip soldering property, heat resistance, high-frequency high-speed signal transmission loss reduction and the like of the product, belongs to a copper foil special for a high-frequency high-speed substrate, has the advantages of high hardness, smooth roughened surface, good heat stability, uniform thickness and the like, and has excellent dielectric characteristics such as extremely low surface profile of RTF copper foil such as oxidation resistance layer treatment technology, planarization treatment technology, nodule micro-particle technology, heat-resistant layer treatment technology and the like, and has low transmission signal loss, low impedance and the like after the copper foil is manufactured into a PCB.
The RTF low-profile electrolytic copper foil (RTF electrolytic copper foil) produced by the method has the advantages and the effects
1. Conductive performance advantage in high frequency high speed circuit board
Has extremely high conductivity, low resistivity, stable signal transmission can be maintained under high frequency conditions. In addition, the RTF electrolytic copper foil has smooth surface and small contact resistance, and is beneficial to reducing the loss in the signal transmission process. The characteristics enable the RTF electrolytic copper foil to have remarkable conductive performance advantages in a high-frequency high-speed circuit board, and can meet the requirements of high-speed data transmission and signal processing.
2. Anti-interference performance advantage in high-frequency high-speed circuit board
The high-frequency high-speed circuit board has the characteristics of high magnetic conductivity and high-frequency loss, and can effectively inhibit the influence of external electromagnetic interference on the high-frequency high-speed circuit board. In addition, the RTF electrolytic copper foil has good corrosion resistance, is not easy to be influenced by chemical environment and mechanical stress, and therefore ensures the application stability of the RTF electrolytic copper foil in a high-frequency high-speed circuit board. These advantages make RTF electrolytic copper foil have very strong anti-interference performance advantage in the high-frequency high-speed circuit board.
3. Heat dissipation performance advantage in high frequency high speed circuit board
The high-frequency high-speed circuit board has excellent heat conducting performance, can rapidly transfer out heat generated by the high-frequency high-speed circuit board, reduces the running temperature of the circuit board, and prolongs the service life of the circuit board. In addition, the RTF electrolytic copper foil has good heat resistance, can keep stable performance even in a high-temperature environment, and ensures the normal operation of a high-frequency high-speed circuit board. These characteristics make RTF electrolytic copper foil have excellent heat dispersion advantage in high frequency high speed circuit board.
4. Process advantage of electrolytic copper foil in high-frequency high-speed circuit board application
RTF electrolytic copper foil has various advantages in the application process of high-frequency high-speed circuit boards. Firstly, it has good plasticity and is convenient to process into circuit boards with various shapes and sizes. And secondly, the surface of the RTF electrolytic copper foil is smooth, so that the contact resistance in the welding process is reduced, and the welding quality is improved. In addition, the RTF electrolytic copper foil has good oxidation resistance, and is beneficial to improving the durability of the circuit board.
Key performance indexes of the high-frequency high-speed circuit board include signal transmission speed and loss. These criteria are affected by the crystal size, number, and density of the copper foil surface. The larger crystal size causes a decrease in signal transmission speed and an increase in loss, thereby affecting the performance of the high-frequency high-speed circuit board. The even fine crystallization reflects that the signal transmission speed and loss of the high-frequency high-speed circuit board are all in a decreasing trend; the increase of the crystallization number can lead to the increase of grain boundaries on the surface of the copper foil, increase the bonding area of the copper foil and the base material, and strengthen the peeling strength.
The above embodiments are provided to illustrate the technical concept and features of the present invention and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (4)
1. The preparation method of the additive for producing the RTF low-profile copper foil is characterized by comprising the following steps of:
(1) The following raw materials were prepared:
2-mercaptothiazoline 20-150g/L
Sodium phenyl dithiopropane sulfonate 20-100g/L
10-100G/L sodium mercaptoimidazole propane sulfonate
20-100G/L of tetrahydroxypropyl ethylenediamine
20-150G/L N- (3-sulfopropyl) -saccharin sodium salt
Polyethylene glycol 600010-50g/L;
(2) Respectively weighing 2-mercaptothiazoline, sodium phenyl dithiopropane sulfonate, sodium mercaptoimidazole propane sulfonate, tetrahydroxypropyl ethylenediamine, N- (3-sulfopropyl) -saccharin sodium salt and polyethylene glycol 6000, and dissolving in deionized pure water to obtain a solution A, a solution B, a solution C, a solution D, a solution E and a solution F;
(3) Adding the solution A, the solution B, the solution C, the solution D, the solution E and the solution F prepared in the step (2) into a constant temperature stirring tank, and stirring for 60 minutes at a constant temperature of 50-60 ℃ to obtain a mixed solution;
(4) And (3) quantitatively diluting the mixed solution in the step (3) with deionized water to finish the preparation of the electrolyte composite additive.
2. An additive for producing an RTF low profile copper foil prepared by the method of claim 1, comprising the following raw materials:
2-mercaptothiazoline 20-150g/L
Sodium phenyl dithiopropane sulfonate 20-100g/L
10-100G/L sodium mercaptoimidazole propane sulfonate
20-100G/L of tetrahydroxypropyl ethylenediamine
20-150G/L N- (3-sulfopropyl) -saccharin sodium salt
Polyethylene glycol 600010-50g/L.
3. Use of the RTF very low profile copper foil additive according to claim 2 for producing RTF very low profile copper foil.
4. The use of an RTF ultra low profile copper foil additive according to claim 3, wherein the metallic copper is deposited on the negative electrode by the electrolytic electrodeposition process under the action of the circulating electric field in the reaction tank, and is wound up by the unit; in the electrolytic process, the temperature of the electrolyte working solution is 50-55 ℃, the flow rate of the electrolyte is 30-60 m 3/H, and the direct current deposition is carried out under the process environment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410429348.6A CN118326461A (en) | 2024-04-10 | 2024-04-10 | Preparation method of additive for RTF low-profile copper foil production, product and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410429348.6A CN118326461A (en) | 2024-04-10 | 2024-04-10 | Preparation method of additive for RTF low-profile copper foil production, product and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118326461A true CN118326461A (en) | 2024-07-12 |
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|---|---|---|---|
| CN202410429348.6A Pending CN118326461A (en) | 2024-04-10 | 2024-04-10 | Preparation method of additive for RTF low-profile copper foil production, product and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118326461A (en) |
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- 2024-04-10 CN CN202410429348.6A patent/CN118326461A/en active Pending
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