CN118321426B - Partitioned time-by-time type electric auxiliary forming device and process for hemispherical shell - Google Patents
Partitioned time-by-time type electric auxiliary forming device and process for hemispherical shell Download PDFInfo
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- CN118321426B CN118321426B CN202410756645.1A CN202410756645A CN118321426B CN 118321426 B CN118321426 B CN 118321426B CN 202410756645 A CN202410756645 A CN 202410756645A CN 118321426 B CN118321426 B CN 118321426B
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- 238000009434 installation Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 5
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Abstract
The invention discloses a partitioned time-by-time type electric auxiliary forming device and a process for a hemispherical shell, wherein the forming device comprises a base plate assembly, a female die assembly, a clamping assembly, a male die assembly and a hanger plate assembly fixedly connected to the top of the male die assembly and connected with a stamping power end; the die assembly comprises a die center cylinder, a die ring assembly and a die lattice electrode, and the die ring assembly and the top surface of the die center cylinder form a continuous hemispherical concave arc surface; the male die assembly comprises a male die center cylinder, a male die annular assembly and a male die lattice electrode, and the bottom surfaces of the male die annular assembly and the male die center cylinder form a continuous hemispherical convex cambered surface. According to the invention, an annular partition and time-by-time variable power-on mode is adopted, and currents with different magnitudes are supplied to different thinning areas of the plate blank so that the thinning degree of each area tends to be consistent; each functional component adopts a detachable assembly structure, so that local replacement is facilitated when local areas are damaged.
Description
Technical Field
The invention relates to the technical field of metal stamping forming, in particular to a zoned time-by-time type electric auxiliary forming device and process for a hemispherical shell.
Background
The large-size annular storage tank is a core component of the upper stage of the next generation on-orbit for a long time, has the advantages of high structural efficiency, large space volume and the like compared with the previous upper stage spherical storage tank, can greatly improve the carrying capacity of the upper stage, needs to be on-orbit for more than or equal to 6 months for a long time at the temperature ranging from-120 ℃ to 120 ℃ and under high stress in the future, has severe service conditions and brings urgent demands to the high-performance annular storage tank.
The annular storage tank is usually large in size, so that the annular storage tank is formed by splicing two hemispherical shell pieces. The hemispherical shell is manufactured by adopting a hot stamping forming process, but the traditional hot forming process has the following defects: firstly, a stamped plate blank piece needs to be heated at 750 ℃ or above for a long time, grain coarsening and performance degradation are easy to occur, and the surface roughness of a workpiece is large and can not be regulated and controlled through subsequent heat treatment, and harmful effects such as oxidization, hydrogen absorption and the like can also be generated; secondly, the manufacturing cost of the large-scale vacuum hot-pressing equipment and the high-temperature resistant die is extremely high, and once the die is locally damaged, the die is required to be replaced integrally, so that the cost is too high; and thirdly, the plate blank is required to be transferred to a stamping forming station after being heated on the heating station, the transfer process time is long, the temperature of the plate blank can be rapidly reduced, and surface oxidation and hydrogen absorption reactions are very easy to occur.
Disclosure of Invention
The zoned time-by-time type electric auxiliary forming device and process for the hemispherical shell provided by the invention adopt an electrifying auxiliary heating mode to realize rapid heating of a plate blank, and adopt an annular zoned time-by-time variable electrifying mode to introduce currents which are different in size and gradually reduce to the different thinning areas of the plate blank so as to enable the thinning degree of each area to be consistent; the forming device is formed by splicing die assembly units, so that local replacement is facilitated when local areas are damaged.
In order to solve the technical problems, the invention adopts a technical scheme that:
The zoned time-by-time type electric auxiliary forming device for the hemispherical shell comprises a base plate component, a female die component fixedly arranged on the top surface of the base plate component, a plurality of clamping components fixedly arranged on the top surface of the base plate component and uniformly distributed on the outer side of the female die component, a male die component coaxially arranged right above the female die component, and a hanger plate component fixedly connected to the top of the male die component and connected with a stamping power end;
The die assembly comprises a die center column body and a plurality of die annular assemblies sleeved on the outer side of the die center column body in a coaxially adjacent mode in sequence, each die annular assembly is formed by sequentially abutting and splicing a plurality of die assembly units, die lattice electrodes are movably inserted into the die center column body and each die assembly unit, the outer surfaces of two adjacent die assembly units positioned on the outermost ring are connected and positioned through a first connecting plate, the top surfaces of the die assembly units in the same die annular assembly form a continuous annular curved surface, and each annular curved surface of different die annular assemblies and the top surface of the die center column body form a continuous hemispherical concave curved surface;
the outer surfaces of two adjacent male die assembly units positioned on the outermost ring are connected and positioned through a second connecting plate, the bottom surfaces of the male die assembly units in the same male die annular assembly form a continuous annular curved surface, and each annular curved surface of different male die annular assemblies and the bottom surface of the male die central cylinder form a continuous hemispherical convex curved surface;
The blank piece to be formed is fixed on the top surface of the female die component by the clamping component, the edge of the blank piece is connected with one output electrode of external power supply equipment, the male die lattice electrode is connected with the other electrode of the external power supply equipment, stamping pressure is applied to the blank piece in the descending process of the male die component to enable the blank piece to be drawn and deformed, the male die lattice electrode is contacted with the top surface of the blank piece from inside to outside in a ring-by-ring mode, in a preset time period after the male die lattice electrode of each ring is contacted with the surface of the blank piece, the current in the male die lattice electrode is gradually reduced, after the bottom surface of the blank piece is stretched and deformed to be in full contact with the hemispherical concave arc surface of the female die component, the output electrode connected with the edge of the blank piece is switched to be connected with the female die lattice electrode, the male die component is matched with the female die component to enable the semi-formed piece to be kept for a preset time, and in the preset time period, and the male die lattice electrode is matched with the female die lattice electrode to enable power on to be relaxed.
Further, the female die assembly unit comprises a female die supporting piece and a female die region forming die, the top surface of the female die supporting piece is provided with a plugging groove, the bottom surface of the female die region forming die is integrally provided with a plugging block, and the plugging block is in plugging fit with the plugging groove and is fixedly connected through a screw.
Further, a through hole which is vertically arranged is formed in the forming die of the female die area, the female die lattice electrode is positioned in the through hole, a rebound piece mounting hole which is communicated with the through hole is formed in the bottom surface of the female die supporting piece, a rebound piece is movably arranged in the rebound piece mounting hole, and the bottom end of the female die lattice electrode is detachably inserted into the top end of the rebound piece.
Further, the rebound piece mounting hole is internally fixedly connected with a stop block, the bottom end of the rebound piece movably penetrates through the stop block, and a spring is arranged between the rebound piece and the stop block.
Further, a mounting operation hole which is communicated with the rebound piece mounting hole and is positioned below the stop block is formed in the side wall of the female die supporting piece, and the outline size of the mounting operation hole is larger than that of the stop block.
Further, a threading through groove is formed in the bottom surface of the female die supporting piece.
Further, at least one group of connecting columns is fixedly arranged on the outer side face of the forming die of the die area positioned on the outermost ring, and two ends of the first connecting plate are movably sleeved with the connecting columns positioned on the adjacent two forming dies of the die area positioned on the outermost ring respectively.
Further, the clamping assembly comprises two support columns, a guide support plate fixedly arranged at the top ends of the two support columns, a movable support plate slidably embedded in the top surface of the guide support plate, and a cylinder support fixedly connected to the top surface of the movable support plate, wherein at least one positioning cylinder is fixedly arranged on the bottom surface of the guide support plate, the output rod end of the positioning cylinder is connected with the side wall of the movable support plate, at least one clamping cylinder is fixedly arranged on the top surface of the cylinder support, and the output rod end of the clamping cylinder is fixedly connected with a clamping electrode plate.
Further, the substrate assembly comprises a plurality of substrate single elements and a plurality of substrate connecting pieces, the plurality of substrate single elements are spliced in sequence to form a square flat plate structure, the tops of the square flat plate structures are spliced to form annular embedded grooves, two adjacent substrate single elements are connected through the substrate connecting pieces, and the substrate connecting pieces are connected with the substrate single elements through screws.
Further, the hanger plate subassembly includes a plurality of hanger plate unit pieces, a plurality of hanger plate connecting piece and power articulates the piece, and a plurality of hanger plate unit pieces splice in proper order and form circular dull and stereotyped structure, connect through two at least hanger plate connecting pieces between two adjacent hanger plate unit pieces, pass through screw connection between hanger plate connecting piece and the hanger plate unit piece, and power articulates piece through screw fixed connection in circular dull and stereotyped structure's top surface center department.
The invention also provides a partition time-lapse type electric auxiliary forming process for the hemispherical shell, which is applied to a partition time-lapse type electric auxiliary forming device for the hemispherical shell, and comprises the following steps:
s1, placing a plate blank to be formed on the top surface of a female die assembly, and clamping and fixing each edge of a plate blank through each clamping assembly;
S2, connecting the edge of the plate blank with one output electrode of external power supply equipment through a clamping assembly, connecting each male die lattice electrode with the other electrode of the external power supply equipment, and starting the external power supply equipment to work;
s3, the punching power end drives the punch assembly to move downwards to the position that a punch lattice electrode in a punch central column is in contact with the central part of the top surface of the plate blank, and a preset current is introduced into the plate blank through the punch lattice electrode and an electrode connected with the edge of the plate blank, so that the plate blank is electrified and heated to a preset forming temperature;
S4, the male die assembly continues to move downwards, deformation force is applied to the central part of the plate blank, the plate blank starts to be deep-drawn and deformed, current passing through the male die lattice electrode in the male die central column body gradually decreases until the top surface of the plate blank is contacted with the male die lattice electrode in the male die assembly unit adjacent to the outer side, preset current is introduced into the plate blank through the male die lattice electrode of the ring and an electrode connected with the edge of the plate blank, heat dissipation of the plate blank is compensated, and the plate blank is electrified and heated again to a preset forming temperature;
S5, repeating the process of the step S4 until the top surface of the plate blank is contacted with a male die lattice electrode in the male die assembly unit of the outermost ring and the heat dissipation temperature compensation process of the plate blank is completed;
S6, continuously moving the male die assembly downwards to enable the plate blank piece to be deep-drawn to the maximum position to form a semi-formed piece, wherein the bottom surface of the semi-formed piece is attached to the hemispherical concave cambered surface of the female die assembly and is contacted with the end parts of the lattice electrodes of each female die;
S7, releasing the edge clamping part of the plate blank by the clamping assembly, disconnecting the plate blank from an output electrode of external power supply equipment, switching the output electrode to be connected with a female die lattice electrode, and electrifying the semi-formed part to quickly heat up by matching the male die lattice electrode and the female die lattice electrode, so that stress relaxation of the semi-formed part is completed in a pressure maintaining state;
S8, stopping working of external power supply equipment, driving the male die assembly to ascend and reset by the stamping power end, taking the semi-formed part out of the female die assembly after the semi-formed part is cooled, and cutting and polishing residual materials on the top edge of the semi-formed part to form a hemispherical shell.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the rapid heating of the plate blank is realized by adopting an electrifying auxiliary heating mode, so that the plate blank is prevented from being in a heating state for a long time, and the coarsening of grains and the performance degradation of materials are avoided, thereby ensuring that the surface forming quality of the semi-formed part is better and the molding precision is higher;
2. according to the invention, annular subareas and time-by-time variable electrifying modes are adopted to carry out annular subareas on different thinning areas of the plate blank in order to compensate heat loss of the plate blank in the corresponding annular subareas, so that the plate blank is kept in a forming temperature range in the annular subareas, meanwhile, currents with different magnitudes are introduced according to different drawing thinning amounts of different annular subareas so that the thinning degrees of all areas tend to be consistent, in the electrifying and drawing process of a single annular subarea, the introduced currents are gradually reduced so as to reduce joule heat caused by drawing thinning of the plate blank, improve the uniformity of integral deformation of the plate blank in the punching and forming process, and avoid advanced cracking of the drawing areas caused by overhigh short-time temperature, thereby improving the integral performance of formed products;
3. The invention completes the preheating before the plate blank forming and the electrifying heating in the stamping process at the stamping forming station, does not need to carry out position transfer on the plate blank, directly carries out forming operation after the preheating, and continuously and synchronously heats the plate blank in the forming process, so that the temperature of the plate blank is kept in a stable forming temperature range, the plate blank is always in a good forming performance state, and the oxidation and hydrogen absorption reaction on the surface of the plate blank caused by the rapid reduction of the temperature of the plate blank are avoided;
4. the forming device is formed by splicing the die assembly units, so that local replacement is facilitated when local areas are damaged, and the device is easy to assemble and disassemble, so that the use cost of production, maintenance, transfer and the like of the die is reduced.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a second perspective view of the present invention;
FIG. 3 is a schematic top view of the present invention;
FIG. 4 is a schematic perspective view of the present invention in a state of clamping a slab;
FIG. 5 is a schematic perspective view of the substrate assembly;
FIG. 6 is a second perspective view of the substrate assembly;
FIG. 7 is one of the schematic perspective views of the female die assembly;
FIG. 8 is a second schematic perspective view of the female die assembly;
FIG. 9 is a schematic top view of the die assembly;
FIG. 10 is a schematic perspective view of the die assembly unit;
FIG. 11 is a schematic diagram of a second perspective view of the die assembly unit;
FIG. 12 is a schematic cross-sectional structural view of the die assembly unit;
FIG. 13 is one of the schematic perspective views of the female mold support;
FIG. 14 is a second schematic perspective view of the female mold support;
FIG. 15 is one of schematic perspective views of the die section forming die;
FIG. 16 is a second schematic perspective view of the die section forming mold;
Figure 17 is a schematic perspective view of the punch assembly;
Figure 18 is a schematic diagram of a second perspective view of the punch assembly;
FIG. 19 is a perspective view of the hanger plate assembly;
FIG. 20 is one of the schematic perspective views of the clamping assembly;
FIG. 21 is a second perspective view of the clamping assembly.
In the figure: 1. a substrate assembly; 11. a substrate unit; 12. a substrate connection member; 2. clamping the assembly; 21. a support column; 22. a guide support plate; 23. a movable support plate; 24. a cylinder bracket; 25. positioning a cylinder; 26. a clamping cylinder; 27. clamping the electrode plate; 3. a female die assembly; 31. a female die center column; 32. a female die assembly unit; 321. a female die support; 3211. threading through grooves; 3212. installing an operation hole; 3213. a first screw hole; 3214. a second screw hole; 3215. a plug-in groove; 3216. a communication hole; 3217. a rebound member mounting hole; 322. forming a die area; 3221. a plug block; 3222. a threaded connection hole; 3223. a through hole; 3224. a connecting column; 3225. forming a curved surface in the concave die area; 323. a rebound member; 324. a stop block; 325. a spring; 33. matrix electrode of female die; 4. a male die assembly; 41. a male die center cylinder; 42. a male die assembly unit; 43. a male die lattice electrode; 5. a first connection plate; 6. a second connecting plate; 7. a plate blank; 8. a hanger plate assembly; 81. a hanger plate unit; 82. a hanger plate connection; 83. a power hanging piece.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present invention.
It is noted that when an element is referred to as being "mounted to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "or/and" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 21, a partitioned time-by-time type electric auxiliary forming device for hemispherical shell comprises a base plate component 1, a female die component 3 fixedly arranged on the top surface of the base plate component 1, a plurality of clamping components 2 fixedly arranged on the top surface of the base plate component 1 and uniformly distributed on the outer side of the female die component 3, a male die component 4 coaxially arranged right above the female die component 3, and a hanger plate component 8 fixedly connected to the top of the male die component 4 and connected with a stamping power end. During forming operation, the clamping assembly 2 clamps and fixes the edge of the plate blank 7 so that the plate blank 7 is fixedly arranged on the top surface of the female die assembly 3, and the punching power end drives the male die assembly 4 to move downwards through the hanger plate assembly 8 so as to be matched with the female die assembly 3 to finish drawing forming of the plate blank 7; before deep drawing forming is started, the plate blank 7 is electrified and heated through the matching of the male die assembly 4 and the clamping assembly 2, so that the plate blank 7 is heated to be in a better forming performance state; in the drawing forming process, the male die assembly 4 is used for carrying out annular electrifying and heating on the plate blank 7 from inside to outside, so that the forming characteristic of the plate blank 7 is reduced due to the temperature reduction at the inner side of an electrifying annular region, and the annular region is in an optimal forming state to finish local drawing, thereby enabling the forming characteristic and the thinning degree region of each annular region to be consistent; the current in a certain annular area is gradually reduced, when the next annular area of the plate blank 7 is in the state of being electrified and heated, the last annular area stops electrifying, so that the current in the plate blank 7 in the annular area is synchronously reduced in the continuous drawing and thinning process of the plate blank 7 in the annular area, the increase of the joule heat caused by the thinning of the plate blank 7 is reversely restrained, the plate blank 7 is always in a relatively stable forming temperature range, and the cracking phenomenon of the plate blank caused by the overhigh local temperature is avoided.
Because the body type of the formed object applied by the electric auxiliary forming device is larger, the corresponding volume and weight of each functional component are larger, if each functional component adopts an integral structure, the problem of inconvenient transfer and assembly exists, and because the requirement on the forming quality of a formed part is higher, once the functional component (especially the formed part) is locally damaged, the corresponding functional component needs to be integrally replaced, the problems of time and labor waste in disassembly and assembly still exist, and meanwhile, the integral structure also has the problems of difficult processing and higher use cost. Based on the problems, each function of the invention adopts a detachable assembly structure, so that the assembly and the disassembly of each functional component are convenient, and particularly, a certain assembly unit in the functional component can be directly replaced in situ when damaged, and the assembly unit is convenient to store and transfer after being integrally disassembled, thereby effectively reducing the maintenance and use cost.
The specific construction and use of the various functional components of the present invention are described in detail below.
As shown in fig. 5 and 6, the substrate assembly 1 includes a plurality of (4 in this embodiment) substrate unit elements 11 and a plurality of (4 in correspondence) substrate connection members 12, the plurality of substrate unit elements 11 are sequentially spliced to form a square flat plate structure, the top of the square flat plate structure is spliced to form a circular ring-shaped embedded groove, two adjacent substrate unit elements 11 are connected through the substrate connection members 12, and the substrate connection members 12 are connected with the substrate unit elements 11 through screws. Thus, the substrate assembly 1 forms a fixed integral structure for mounting and fixing the die assembly 3, so that the inner diameter of the annular embedded groove formed on the top surface of the substrate assembly is matched with the outer diameter of the die assembly 3.
As shown in fig. 7 to 9, the die assembly 3 is cylindrical as a whole, and a die forming surface for drawing forming is provided at the center of the top surface. Specifically, the die assembly 3 includes a die center cylinder 31, a plurality of die annular assemblies coaxially sleeved in turn on the outer side of the die center cylinder 31, each die annular assembly is formed by sequentially adjacent splicing a plurality of die assembly units 32, namely, the overall die assembly can be regarded as being divided into a plurality of annular cylinders by a plurality of cylindrical surfaces which are vertically coaxially arranged and equidistant, then each annular cylinder is uniformly divided into a plurality of block-shaped cylinders by a plurality of vertical planes which are uniformly distributed around the axis circumference of the annular cylinder and uniformly pass through the axis, and each block-shaped main body corresponds to one die assembly unit 32. The die center column 31 and each die assembly unit 32 are movably inserted with die lattice electrodes 33, and the outer surfaces of two adjacent die assembly units 32 positioned on the outermost ring are connected and positioned through a first connecting plate 5.
Further, as shown in fig. 10 to 12, the die assembly unit 32 includes a die support 321 and a die region forming die 322. The die region forming die 322 corresponds to a section of the block cylinder having a curved surface at the top thereof, and the die support 321 corresponds to a bottom vertical section of the block cylinder. The inner surface of the region forming die 32 (die region forming curved surface 3225) in the same die ring assembly constitutes a continuous annular curved surface, and each annular curved surface of a different die ring assembly constitutes a continuous hemispherical concave curved surface. A matrix electrode 33 is disposed in each matrix region forming die 322, so that the matrix electrode 33 forms a spatial lattice structure with each layer being annularly distributed, downwardly distributed layer by layer, and inwardly shrunk layer by layer. The resistance value of each die lattice electrode 33 in the same die ring assembly is the same, and under the condition of the same input voltage, the current passing through the drawing area of the plate blank 7 corresponding to the die ring assembly is the same, even if the forming performance of each part of the plate blank 7 in the same ring area is in the same state; in the process of quickly electrifying and heating up to relax stress after the plate blank 7 is formed by drawing, the temperature distribution gradually decreasing from inside to outside can be formed in the semi-finished product of the formed part in the same electrifying time, so that the maximum stress relaxation is obtained at the center with the largest drawing stress, and the smaller stress relaxation is obtained at the edge with the smallest drawing stress.
Specifically, as shown in fig. 13 to 16, a socket slot 3215 is formed on the top surface of the female die support 321, at least one (2 as shown in fig. 13) second screw hole 3214 is formed on the outer side wall of the socket slot 3215, a socket block 3221 matching the outline of the socket slot 3215 is integrally formed on the bottom surface of the female die region forming die 322, a threaded connection hole 3222 is formed on the side surface of the socket block 3221, after the socket block 3221 is in socket fit with the socket slot 3215, the threaded connection holes 3222 are respectively matched with the second screw hole 3214, and are further fastened by screw connection, so that the socket block 3221 and the support 321 are fixedly connected into a whole.
A vertically arranged through hole 3223 is formed in the die region forming die 322, the die lattice electrode 33 is located in the through hole 3223, so that the top end of the die lattice electrode 33 protrudes above the die region forming curved surface 3225 in a non-working state, after the slab 7 is drawn and deformed, the bottom surface of the slab 7 contacts with the top end of the die lattice electrode 33 before contacting with the die region forming curved surface 3225, and after the bottom surface of the slab 7 is completely attached to the die region forming curved surface 3225, the die lattice electrode 33 descends to the position that the top end of the die lattice electrode 33 is located in the die region forming curved surface 3225 along the through hole 3223.
The bottom surface of die support 321 has seted up the resilience piece mounting hole 3217 with through-hole 3223 intercommunication, and resilience piece mounting hole 3217 internalization is provided with resilience piece 323, and the bottom of die lattice electrode 33 detachably pegs graft in the top of resilience piece 323. In order to ensure that the top end of the female lattice electrode 33 can always keep good contact with the bottom surface of the plate blank 7 in the downward moving process, and after the forming is finished, the pressed female lattice electrode 33 can be moved upward again for resetting, and a rebound piece 323 is arranged at the bottom end of the female lattice electrode 33. Specifically, the bottom surface of the female die support 321 is provided with a rebound member mounting hole 3217 communicated with the through hole 3223, the top end of the rebound member mounting hole 3217 is communicated with the bottom end of the through hole 3223 through a communication hole 3216 positioned on the bottom surface of the inserting groove 3215, the communication hole 3216 is coaxially arranged with the through hole 3223, and the aperture of the communication hole 3216 is not smaller than that of the through hole 3223, so that the bottom end of the female die lattice electrode 33 can smoothly enter the rebound member mounting hole 3217 through the communication hole 3216. The rebound member 323 is movably arranged in the rebound member mounting hole 3217, and the bottom end of the female die lattice electrode 33 is detachably inserted into the top end of the rebound member 323. The rebound member mounting hole 3217 is fixedly connected with a stop block 324, the bottom end of the rebound member 323 movably penetrates through the stop block 324, and a spring 325 is arranged between the rebound member 323 and the stop block 324. In this way, the spring 325 is in a compressed state during the process of the die lattice electrode 33 being pushed down by the bottom surface of the slab 7 and moved down, and the reaction force of the spring back member 323 can make the top end of the die lattice electrode 33 always reliably contact with the bottom surface of the slab 7.
Because the axial depth of the rebound member mounting hole 3217 is greater than the lifting distance of the die lattice electrode 33, the fixed mounting operation of the stop block 324 in the rebound member mounting hole 3217 is inconvenient, and thus, the side wall of the die support 321 is provided with a mounting operation hole 3212 which is communicated with the rebound member mounting hole 3217 and is positioned below the stop block 324, and the outline size of the mounting operation hole 3212 is greater than that of the stop block 324. The stop 324 is quickly received into the rebound member mounting bore 3217 and positioned in its mounting position by mounting operating bore 3212. The side wall of the female die supporting piece 321 is provided with a first screw hole 3213 which is positioned above the installation operation hole 3212 and is communicated with the rebound piece installation hole 3217, the side surface of the stop block 324 is also provided with a threaded connection hole matched with the first screw hole 3213, and then the stop block 324 can be fixedly connected in the female die supporting piece 321 through a screw.
The bottom end of the rebound member 323 is connected with the power supply end of the external power supply equipment through a power line, so that the power line is conveniently arranged and routed, and the bottom surface of the female die support member 321 is provided with a threading through groove 3211, so that the power line led out from each female die assembly unit 32 of each female die annular assembly sequentially passes through the threading through groove 3211 to the outside of the groove.
The structure and working form of the die center cylinder 31 are the same as those of the die assembly unit 32, and will not be described here.
At least one group of connecting posts 3224 are fixedly arranged on the outer side surface of the die-section forming die 322 positioned on the outermost ring, and two ends of the first connecting plate 5 are respectively movably sleeved with the connecting posts 3224 positioned on the adjacent two die-section forming dies 322 positioned on the outermost ring.
The outer surfaces of two adjacent die assembly units 32 positioned on the outermost ring are connected and positioned through the first connecting plate 5 so as to cooperate with the annular embedded groove at the top of the substrate assembly 1 to limit the radial movement of each die assembly unit 32 in the stamping forming process (when the two adjacent die assembly units 32 are radially dislocated, the linear distance between two corresponding points on the surfaces of the two adjacent die assembly units can correspondingly be increased, and the distance between the connecting positions of the two ends of the first connecting plate 5 is fixed, thereby preventing the radial relative movement trend of the two adjacent die assembly units 32), so that the forming surface of the die assembly 3 is kept intact. Specifically, at least one set of connecting columns 3224 (an upper set and a lower set as shown in fig. 13, and each set is a left set and a right set) are fixedly arranged on the outer side surface of the die region forming die 322 of the outermost ring, round holes are formed at two ends of the first connecting plate 5, the inner side surface is a concave cambered surface matched with the outer surface of the die region forming die 322 of the outermost layer, and two ends of the first connecting plate 5 are respectively movably sleeved with the connecting columns 3224 on two adjacent die region forming dies 322 of the outermost ring. After all the die assembly units 32 of the outermost ring are connected through the first connecting plate 5, the die annular assemblies of the outermost layer can be formed into a whole, the die annular assemblies can be formed into a whole through the bonding of the side walls between the adjacent die annular assemblies of the inner layer and the outer layer, and the die forming surface formed by splicing the forming curved surfaces 3225 of the die regions can also be kept intact in the stamping and drawing process of the plate blank 7 by matching the die annular assemblies with the punch assembly 4.
After the first connecting plate 5 is pulled out to the outside, the outermost die ring assembly can be disassembled, and each die assembly unit 32 can be moved to the outside or upward to be removed independently, so that the next outer die ring assembly can be disassembled. In the use process, if the female mold area forming curved surface 3225 of a female mold area forming mold 322 in a certain female mold annular component of the inner layer is damaged or the power supply circuit of a certain female mold lattice electrode 33 is failed, the female mold area forming mold 322 or the female mold component unit 32 corresponding to the female mold lattice electrode 33 can be vertically pulled out from the female mold component 3, the female mold area forming mold 322 is replaced or the power supply circuit of the female mold lattice electrode 33 is maintained, and then a new female mold component unit 32 is vertically inserted into the original position.
As shown in fig. 17 and 18, the punch assembly 4 includes a punch central cylinder 41, a plurality of punch annular assemblies coaxially sleeved on the outer side of the punch central cylinder 41 in sequence, each punch annular assembly is formed by sequentially splicing a plurality of punch assembly units 42 in a abutting mode, punch lattice electrodes 43 are movably inserted into the punch central cylinder 41 and each punch assembly unit 42, the outer surfaces of two adjacent punch assembly units 42 located on the outermost ring are connected and positioned through a second connecting plate 6, the bottom surfaces of the punch assembly units 42 in the same punch annular assembly form a continuous annular curved surface, and each annular curved surface of different punch annular assemblies and the bottom surface of the punch central cylinder 41 form a continuous hemispherical convex curved surface. In this embodiment, the structural composition and the assembly formula of the male mold component 4 and the female mold component 3 are similar, and the structural composition and the assembly formula of the male mold annular component and the female mold annular component 32 are also similar, and are not described herein again.
As shown in fig. 19, the hanger plate assembly 8 includes a plurality of hanger plate unit members 81, a plurality of (4, respectively) hanger plate connecting members 82, and a power hanging member 83, the plurality of hanger plate unit members 81 are sequentially spliced to form a circular plate structure, two adjacent hanger plate unit members 81 are connected by at least two hanger plate connecting members 82, the hanger plate connecting members 82 are connected with the hanger plate unit members 81 by screws, and the power hanging member 83 is fixedly connected to the center of the top surface of the circular plate structure by screws. In this embodiment, there are 4 hanger plate unit elements 81, and two adjacent hanger plate unit elements 81 are connected by two hanger plate connectors 82, that is, 8 hanger plate connectors 82 in total. The male die assembly 4 can be suspended right above the female die assembly 3 through the fixed connection of the power hanging piece 83 and an external power output end, and then the male die assembly 4 can be driven to move downwards through the power output end so as to apply forming pressure to the plate blank 7, and the male die assembly 4 is driven to ascend so as to realize resetting.
The hanger plate unit 81 is provided with screw coupling holes corresponding to the male mold assembly units of the male mold assembly 3, and fixedly coupled to each of the male mold assembly units 42 by coupling screws provided in the screw coupling holes. A hanging ring is fixedly arranged on the top surface of each hanging plate connecting piece 82. When a certain male module unit 42 in the male module 4 needs to be replaced, the male module unit 42 can be separated from the male annular module of the male module 4 by unscrewing the corresponding connecting screw, then is pulled out downwards, and then a new same male module unit 42 is inserted upwards into the original position and then is connected and fixed through the screw. If the punch module unit 42 to be replaced is just below the hanger plate connector 82, the hanger rings on the other 7 hanger plate connectors 82 except the hanger plate connector 82 are hung by the hanger ropes, the other 7 hanger plate connectors 82 are fixedly hung, then the hanger plate connector 82 is detached from the hanger plate unit 81, and the punch module unit 42 below the hanger plate connector 82 can be detached and replaced, and the two hanger plate unit elements 81 connected with the hanger plate connector 82 are still connected and fixed with one hanger plate connector 82 together, so that the relative position change of the two hanger plate unit elements 81 can not occur; if the punch module unit 42 to be replaced is located right under the power hanging piece 83, the 8 hanging plate connectors 82 are hung by hanging ropes, so that the hanging plate unit 81 is in a horizontal state, at this time, the power hanging piece 83 can be removed from the hanging plate unit 81, and then the punch module unit located under the power hanging piece can be removed and replaced.
The clamping assemblies 2 are arranged into four groups and are uniformly distributed in the circumferential direction of the female die assembly 3. As shown in fig. 20 and 21, the clamping assembly 2 includes two support columns 21, a guide support plate 22 fixedly arranged at the top ends of the two support columns 21, a movable support plate 23 slidably embedded in the top surface of the guide support plate 22, and a cylinder support 24 fixedly connected to the top surface of the movable support plate 23, wherein at least one positioning cylinder 25 is fixedly arranged on the bottom surface of the guide support plate 22, the output rod end of the positioning cylinder 25 is connected with the side wall of the movable support plate 23, at least one clamping cylinder 26 is fixedly arranged on the top surface of the cylinder support 24, and the output rod end of the clamping cylinder 26 is fixedly connected with a clamping electrode plate 27. In this embodiment, the bottom surface of the movable support plate 23 is slidably connected with the top surface of the guiding support plate 22 through a dovetail groove structure, the number of positioning cylinders 25 is 2, two sides of the bottom surface of the guiding support plate 22 are symmetrically arranged, a first fixing plate is fixedly arranged at the bottom of one side of the movable support plate 23 far away from the die assembly 3, the first fixing plate is fixedly connected with the output rod end of the positioning cylinder 25, and the movable support plate 23 can be pushed to be close to or far away from the die assembly 3 through the two positioning cylinders 25. The second fixed plates are fixedly arranged on two sides of the top surface of the air cylinder support 24 respectively, 2 clamping air cylinders 26 are fixedly arranged on the side surfaces of the two second fixed plates respectively, the clamping electrode plates 27 are located inside the air cylinder support 24 and located on the upper inner side of the movable support plate 23, the top surface of the clamping electrode plates 27 is fixedly connected with the output rod end of the clamping air cylinders 26, and the lifting movement of the clamping electrode plates 27 can be driven through the clamping air cylinders 26.
In actual use, the clamping electrode plate 27 is connected to an output electrode (e.g. the negative electrode) of an external power supply device. In the non-operating state, the positioning cylinder 25 positions the clamping electrode plate 27 on the side far away from the die assembly 3 so that the placing operation of the plate blank 7 on the die assembly 3 is performed, when the plate blank 7 to be formed is placed on the top surface of the die assembly 3, the edge part of the plate blank 7 is positioned on the top surface of the guide support plate 22, and then the positioning cylinder 25 drives the movable support plate 23 and the clamping cylinder 26 and the clamping electrode plate 27 thereon to move to the side close to the die assembly 3 so that the clamping electrode plate 27 is positioned right above the edge of the top surface of the plate blank 7, and then the clamping cylinder 26 drives the clamping electrode plate 27 to move downwards to match with the top surface of the guide support plate 22 so as to tightly clamp the edge part of the plate blank 7.
Each male lattice electrode 43 in the male assembly 4 is connected with another output electrode (such as an anode) of the external power supply equipment, stamping pressure is applied to the plate blank 7 in the descending process of the male assembly 4 to enable the plate blank 7 to be in deep drawing deformation, the male lattice electrodes 43 are contacted with the top surface of the plate blank 7 from inside to outside in a ring-by-ring mode, the current in the male lattice electrodes 43 is gradually reduced after the male lattice electrodes 43 of each ring are contacted with the surface of the plate blank 7, after the bottom surface of the plate blank 7 is in stretching deformation until the bottom surface of the plate blank is in full contact with the hemispherical concave arc surface of the female assembly 3, the output electrode connected with the edge of the plate blank 7 is switched to be connected with the female lattice electrode 33, the male assembly 4 is matched with the female assembly 3 to enable the semi-formed part to be kept in the preset time, and the male lattice electrodes 43 are matched with the female lattice electrode 33 to enable the semi-formed part to be electrified for stress relaxation in the preset time.
The zonal time-lapse type electric auxiliary forming process for the hemispherical shell is applied to the zonal time-lapse type electric auxiliary forming device of the hemispherical shell and is characterized by comprising the following steps of:
S1, placing a plate blank 7 to be formed on the top surface of a female die assembly 3, and clamping and fixing each edge of a plate blank 7 through each clamping assembly 2;
s2, connecting the edge of the plate blank 7 with one output electrode of external power supply equipment through the clamping assembly 2, connecting each male die lattice electrode 43 with the other electrode of the external power supply equipment, and starting the external power supply equipment to work;
S3, the punching power end drives the punch assembly 4 to move downwards to the position that a punch lattice electrode 43 in a punch central column 41 contacts with the central part of the top surface of the plate blank 7, and a preset current is introduced into the plate blank 7 through the punch lattice electrode 43 and an electrode connected with the edge of the plate blank 7, so that the plate blank 7 is electrified and heated to a preset forming temperature;
S4, the male die assembly 4 continues to move downwards, deformation force is applied to the central part of the plate blank 7, the plate blank 7 starts to be deep-drawn and deformed, current passing through the male die lattice electrode 43 in the male die central column 41 gradually decreases until the top surface of the plate blank 7 is contacted with the male die lattice electrode 43 in the male die assembly unit 42 adjacent to the outer side, preset current is introduced into the plate blank 7 through the male die lattice electrode 43 of the ring and an electrode connected with the edge of the plate blank 7, heat dissipation of the plate blank 7 is compensated, and the plate blank 7 is electrified and heated again to a preset forming temperature;
S5, repeating the process of the step S4 until the top surface of the plate blank 7 is contacted with the male die lattice electrode 43 in the male die assembly unit 42 of the outermost ring and the heat dissipation temperature compensation process of the plate blank 7 is completed;
S6, continuously moving the male die assembly 4 downwards to enable the plate blank 7 to be deep-drawn to the maximum position to form a semi-formed part, wherein the bottom surface of the semi-formed part is attached to the hemispherical concave cambered surface of the female die assembly 3 and is contacted with the end parts of the matrix electrodes 33 of the female dies;
s7, releasing the edge clamping part of the plate blank 7 by the clamping assembly 2, disconnecting the plate blank 7 from an output electrode of external power supply equipment, switching the output electrode to be connected with the female die lattice electrode 33, and electrifying the semi-formed part through the cooperation of the male die lattice electrode 43 and the female die lattice electrode 33 to quickly heat up, so that stress relaxation of the semi-formed part is completed in a pressure maintaining state;
s8, stopping working of external power supply equipment, driving the male die assembly 4 to ascend and reset by the stamping power end, taking out the semi-formed part from the female die assembly 3 after the semi-formed part is cooled, and cutting and polishing residual materials on the top edge of the semi-formed part to form a hemispherical shell.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (10)
1. A subregion time-by-time formula electricity auxiliary forming device for hemisphere shell spare, its characterized in that: the device comprises a substrate assembly (1), a female die assembly (3) fixedly arranged on the top surface of the substrate assembly (1), a plurality of clamping assemblies (2) fixedly arranged on the top surface of the substrate assembly (1) and uniformly distributed on the outer side of the female die assembly (3), a male die assembly (4) coaxially arranged right above the female die assembly (3), and a hanger plate assembly (8) fixedly connected to the top of the male die assembly (4) and connected with a stamping power end;
the die assembly (3) comprises a die center column body (31) and a plurality of die annular assemblies coaxially sleeved on the outer side of the die center column body (31) in sequence, each die annular assembly is formed by sequentially splicing a plurality of die assembly units (32) in an adjacent mode, die lattice electrodes (33) are movably inserted into the die center column body (31) and each die assembly unit (32), the outer surfaces of two adjacent die assembly units (32) positioned on the outermost ring are connected and positioned through a first connecting plate (5), the top surfaces of the die assembly units (32) in the same die annular assembly form continuous annular curved surfaces, and each annular curved surface of different die annular assemblies and the top surface of the die center column body (31) form continuous hemispherical concave curved surfaces;
The male die assembly (4) comprises a male die center column body (41) and a plurality of male die annular assemblies coaxially sleeved on the outer side of the male die center column body (41) in sequence, each male die annular assembly is formed by sequentially splicing a plurality of male die assembly units (42) in an adjacent mode, male die lattice electrodes (43) are movably inserted into the male die center column body (41) and each male die assembly unit (42), the outer surfaces of two adjacent male die assembly units (42) positioned on the outermost ring are connected and positioned through a second connecting plate (6), the bottom surfaces of the male die assembly units (42) in the same male die annular assembly form a continuous annular curved surface, and each annular curved surface of different male die annular assemblies and the bottom surface of the male die center column body (41) form a continuous hemispherical convex curved surface;
The blank piece (7) to be formed is fixed on the top surface of the die assembly (3) by the clamping assembly (2), the edge of the blank piece (7) is connected with one output electrode of external power supply equipment, the male die lattice electrode (43) is connected with the other electrode of the external power supply equipment, stamping pressure is applied to the blank piece (7) in the descending process of the male die assembly (4) to enable the blank piece (7) to be deeply deformed, the male die lattice electrode (43) is contacted with the top surface of the blank piece (7) from inside to outside in a ring-by-ring mode, the male die lattice electrodes (43) of each ring are contacted with the surface of the blank piece (7) in a preset time period, the current in the male die lattice electrode (43) is gradually reduced, after the bottom surface of the blank piece (7) is completely contacted with the hemispherical concave arc surface of the female die assembly (3), the output electrode connected with the edge of the blank piece (7) is switched to be connected with the female die electrode (33), the male die assembly (4) is matched with the female die assembly (3) to enable the semi-formed piece to be kept in a preset time period, and the female die lattice electrode (33) is electrically matched with the male die lattice electrode (43) in a loose forming mode in the preset time period.
2. A zoned time-wise electrically assisted forming apparatus for hemispherical shells according to claim 1, wherein: the female die assembly unit (32) comprises a female die supporting piece (321) and a female die region forming die (322), a plug groove (3215) is formed in the top surface of the female die supporting piece (321), a plug block (3221) is integrally arranged on the bottom surface of the female die region forming die (322), and the plug block (3221) is in plug fit with the plug groove (3215) and is fastened through screw connection.
3. A zoned time-wise electrically assisted forming apparatus for hemispherical shells according to claim 2, wherein: a vertical through hole (3223) is formed in the female die region forming die (322), the female die lattice electrode (33) is located in the through hole (3223), a rebound piece mounting hole (3217) communicated with the through hole (3223) is formed in the bottom surface of the female die supporting piece (321), a rebound piece (323) is movably arranged in the rebound piece mounting hole (3217), and the bottom end of the female die lattice electrode (33) is detachably inserted into the top end of the rebound piece (323).
4. A zoned time-wise electrically assisted forming apparatus for hemispherical shells according to claim 3, wherein: the spring rebound device is characterized in that a stop block (324) is fixedly connected in the rebound piece mounting hole (3217), the bottom end of the rebound piece (323) movably penetrates through the stop block (324), and a spring (325) is arranged between the rebound piece (323) and the stop block (324).
5. A zoned time-wise electrically assisted forming apparatus for hemispherical shells according to claim 4, wherein: and the side wall of the female die supporting piece (321) is provided with an installation operation hole (3212) which is communicated with the rebound piece installation hole (3217) and is positioned below the stop block (324), and the outline size of the installation operation hole (3212) is larger than that of the stop block (324).
6. A zoned time-wise electrically assisted forming apparatus for hemispherical shells according to any one of claims 2 to 5, wherein: at least one group of connecting columns (3224) are fixedly arranged on the outer side face of the die region forming die (322) positioned on the outermost ring, and two ends of the first connecting plate (5) are movably sleeved with the connecting columns (3224) positioned on two adjacent die region forming dies (322) positioned on the outermost ring respectively.
7. A zoned time-wise electrically assisted forming apparatus for hemispherical shells according to any one of claims 1-5, wherein: clamping subassembly (2) are including two spinal branch daggers (21), fixed guide support board (22) that set up in two spinal branch daggers (21) top, slip inlay and locate removal backup pad (23) in guide support board (22) top surface, cylinder support (24) on removal backup pad (23) top surface of fixed connection, fixed being provided with at least one location cylinder (25) on the bottom surface of guide support board (22), the output rod end of location cylinder (25) is connected with the lateral wall of removal backup pad (23), fixed being provided with at least one clamping cylinder (26) on the top surface of cylinder support (24), the output rod end fixedly connected with clamping electrode plate (27) of clamping cylinder (26).
8. A zoned time-wise electrically assisted forming apparatus for hemispherical shells according to any one of claims 1-5, wherein: the substrate assembly (1) comprises a plurality of substrate single elements (11) and a plurality of substrate connecting pieces (12), the plurality of substrate single elements (11) are spliced in sequence to form a square flat plate structure, the tops of the square flat plate structure are spliced to form a circular embedded groove, two adjacent substrate single elements (11) are connected through the substrate connecting pieces (12), and the substrate connecting pieces (12) are connected with the substrate single elements (11) through screws.
9. A zoned time-wise electrically assisted forming apparatus for hemispherical shells according to any one of claims 1-5, wherein: the hanger plate assembly (8) comprises a plurality of hanger plate unit elements (81), a plurality of hanger plate connecting pieces (82) and a power hanging piece (83), wherein the hanger plate unit elements (81) are sequentially spliced to form a circular flat plate structure, two adjacent hanger plate unit elements (81) are connected through at least two hanger plate connecting pieces (82), the hanger plate connecting pieces (82) are connected with the hanger plate unit elements (81) through screws, and the power hanging piece (83) is fixedly connected to the center of the top surface of the circular flat plate structure through screws.
10. A zoned time-lapse electric auxiliary forming process for hemispherical shells, applied to the zoned time-lapse electric auxiliary forming device for hemispherical shells according to any one of claims 2 to 9, comprising the steps of:
S1, placing a plate blank (7) to be formed on the top surface of a female die assembly (3), and clamping and fixing all edges of the plate blank (7) through all clamping assemblies (2);
S2, connecting the edge of the plate blank (7) with one output electrode of external power supply equipment through a clamping assembly (2), connecting each male die lattice electrode (43) with the other electrode of the external power supply equipment, and starting the external power supply equipment to work;
S3, the punching power end drives the punch assembly (4) to move downwards to a punch lattice electrode (43) in a punch central column body (41) to be in contact with the center part of the top surface of the plate blank (7), and a preset current is introduced into the plate blank (7) through the punch lattice electrode (43) and an electrode connected with the edge of the plate blank (7), so that the plate blank (7) is electrified and heated to a preset forming temperature;
S4, continuously moving the male die assembly (4) downwards, applying deformation force to the central part of the plate blank (7), starting drawing deformation of the plate blank (7), gradually reducing current through a male die lattice electrode (43) in a male die central cylinder (41) until the top surface of the plate blank (7) is contacted with the male die lattice electrode (43) in a male die assembly unit (42) adjacent to the outer side, introducing preset current into the plate blank (7) through the male die lattice electrode (43) of the ring and an electrode connected with the edge of the plate blank (7), compensating heat dissipation of the plate blank (7), and enabling the plate blank (7) to be electrified and heated again to a preset forming temperature;
S5, repeating the process of the step S4 until the top surface of the plate blank (7) is contacted with a male die lattice electrode (43) in the male die assembly unit (42) of the outermost ring and the heat dissipation temperature compensation process of the plate blank (7) is completed;
S6, continuously moving the male die assembly (4) downwards to enable the plate blank (7) to be deep drawn to the maximum position to form a semi-formed part, wherein the bottom surface of the semi-formed part is attached to the hemispherical concave cambered surface of the female die assembly (3) and is contacted with the end parts of the matrix electrodes (33) of the female die;
s7, releasing the edge clamping part of the plate blank (7) by the clamping assembly (2), disconnecting the plate blank (7) from an output electrode of external power supply equipment, switching the output electrode to be connected with a female die lattice electrode (33), and electrifying the semi-formed part through the cooperation of the male die lattice electrode (43) and the female die lattice electrode (33) to quickly heat up, so that stress relaxation of the semi-formed part is completed in a pressure maintaining state;
S8, stopping working of external power supply equipment, wherein the stamping power end drives the male die assembly (4) to ascend and reset, after the semi-formed part is cooled, the semi-formed part is taken out of the female die assembly (3), and the top edge remainder of the semi-formed part is cut and polished to form a hemispherical shell.
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| CN110479843A (en) * | 2019-09-23 | 2019-11-22 | 北京航星机器制造有限公司 | A kind of shaping dies and multi-step forming method of hemispherical member |
| CN110899510A (en) * | 2019-12-16 | 2020-03-24 | 浙江普兴电子科技有限公司 | Forming device and forming method of sine type expandable metal sealing structure |
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| SU1447481A1 (en) * | 1987-04-01 | 1988-12-30 | Предприятие П/Я М-5671 | Die for drawing with heating |
| CN112974642B (en) * | 2021-02-09 | 2022-10-11 | 上海交通大学 | Electrically-assisted forming device and process for metal polar plate of fuel cell |
| CN115430755A (en) * | 2022-11-07 | 2022-12-06 | 中国航发沈阳黎明航空发动机有限责任公司 | Built-in electrode hot forming device and method based on optimized blank shape |
| CN117772880B (en) * | 2024-02-26 | 2024-05-14 | 合肥工业大学 | Dot matrix voltage-conducting edge forming process for electric auxiliary forming |
| CN118130216B (en) * | 2024-05-08 | 2024-08-06 | 合肥工业大学 | Metal plate electric auxiliary forming limit testing device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110479843A (en) * | 2019-09-23 | 2019-11-22 | 北京航星机器制造有限公司 | A kind of shaping dies and multi-step forming method of hemispherical member |
| CN110899510A (en) * | 2019-12-16 | 2020-03-24 | 浙江普兴电子科技有限公司 | Forming device and forming method of sine type expandable metal sealing structure |
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