CN118286587A

CN118286587A - TTF electrode plate and TTF electrode array

Info

Publication number: CN118286587A
Application number: CN202410556331.7A
Authority: CN
Inventors: 史思伦
Original assignee: Shanghai Meisheng Medical Instrument Co ltd
Current assignee: Shanghai Meisheng Medical Instrument Co ltd
Filing date: 2024-05-07
Publication date: 2024-07-05

Abstract

The invention relates to a TTF electrode slice and a TTF electrode array, which comprise a dielectric layer, a conductive layer and a fixed layer which are sequentially stacked, wherein the thickness of the fixed layer is larger than that of the dielectric layer, the dielectric layer is made of a material with a dielectric constant of more than or equal to 5000, the fixed layer is made of a non-conductive material with structural strength, at least part of the conductive layer leaks out, a connecting part is arranged on a drain surface of the conductive layer, and a wire structure is connected to the connecting part. The TTF electrode plate and the TTF electrode array can reduce the thickness of the dielectric layer, improve the capacitance value and reduce the heating on the premise of ensuring the mechanical strength of the electrode plate.

Description

TTF electrode plate and TTF electrode array

Technical Field

The invention relates to the field of medical machinery, in particular to a TTF electrode plate and a TTF electrode array.

Background

In order to further improve the therapeutic effect on tumors after surgical resection of tumors, for example, to resist recurrence after brain glioma surgery, patients are usually treated by radiotherapy or chemotherapy, however, the current radiotherapy or chemotherapy has limited therapeutic effect on tumors and is easy to damage normal cells near the tumors. Along with the progress of medical science and technology, an emerging Tumor treatment method is proposed, namely Tumor electric field therapy [ Tumor TREATING FIELDS, TTF ], wherein the growth of Tumor cells is inhibited by an alternating electric field, so that the treatment of the Tumor cells is realized.

The current TTF electrode has serious defects, and mainly comprises the influences of factors such as area limitation of an electrode plate, thickness limitation of the electrode plate, heat dissipation limitation of the electrode plate, allergy limitation of an adhesive tape, multiplexing limitation of hydrogel and the like.

For the ceramic portion (dielectric layer) of the electrode sheet sandwiched between the metal layer and the hydrogel, the thinner the thickness, the lower the voltage it separates. On the one hand, the heating is correspondingly reduced, and on the other hand, the separated field strength is reduced, and the combined action of the two aspects can improve the strength of the electric field which can be applied to the inside of the target tissue. However, since the electrode sheet requires a certain breakdown voltage and a certain rigidity, the electrode sheet requires a certain thickness, which limits further thinning of the ceramic portion.

Heating is one of main factors for limiting TTF to improve field intensity, heating of the electrode plate is mainly caused by Joule effect, and heating is in direct proportion to resistance R of the electrode plate on the premise that partial pressure of the electrode plate is constant. In contrast, according to r=ρl/S, when the fixed material resistivity ρ is constant and the fixed electrode sheet size cross-sectional area S is constant, the resistance value R or the heat generation amount is proportional to the electrode sheet thickness L.

Reducing the thickness of the dielectric layer is beneficial in reducing heating and increasing the electric field strength inside the target tissue, thereby improving the therapeutic effect. However, if the thickness of the dielectric layer (ceramic layer) is reduced on the present ceramic part, there are two problems: on the one hand, the excessive thinness of the dielectric layer can lead to increased brittleness of the overall structure of the ceramic element, and thus, the ceramic element is easy to damage; on the other hand, too thin a dielectric layer may result in a reduced breakdown voltage of the dielectric layer, reducing safety.

Disclosure of Invention

The invention aims at solving the problem of reducing the thickness of a dielectric layer of an electrode plate, and provides a TTF electrode plate and a TTF electrode array, which are used for reducing the thickness of the dielectric layer, improving the capacitance value and reducing the heating on the premise of ensuring the mechanical strength (equivalent to the total thickness) of the electrode plate.

In order to achieve the above purpose, the invention provides a TTF electrode slice, which comprises a dielectric layer, a conductive layer and a fixed layer which are stacked in sequence, wherein the thickness of the fixed layer is larger than that of the dielectric layer, the dielectric layer is made of a material with a dielectric constant more than or equal to 5000, the fixed layer is made of a non-conductive material with structural strength, the conductive layer at least partially leaks out, a connecting part is arranged on the drain surface of the conductive layer, and a wire structure is connected to the connecting part.

Preferably, the dielectric layer has an insulation strength of not less than 2000V/mm and a thickness of not more than 1.5mm.

Preferably, the thickness of the dielectric layer is 0.1 to 1mm.

Preferably, the fixing layer is ceramic, plastic, polymer material, mica, glass or alumina.

Preferably, the whole shape of the TTF electrode plate is a round or round and round chamfer rectangle, and the diameter of the circle or the side length of the rectangle is 10-30 mm.

Preferably, the TTF electrode plate is manufactured by sintering and integrally forming, and the material melting points of the dielectric layer, the conductive layer and the fixing layer are similar.

Preferably, the form of the connection part comprises welding spots, conductive glue or conductive buckles, and the form of the wire structure comprises a single wire, a flat cable or a flexible circuit board.

Preferably, a temperature sensor is arranged on the upper surface of the fixed layer, or the temperature sensor is embedded in the surface of the fixed layer.

The invention further aims to provide a TTF electrode slice which comprises a dielectric layer, a conductive layer, a fixed layer and a second conductive layer which are sequentially stacked, wherein at least one vertical through hole is formed in the fixed layer, the conductive layer is connected with the second conductive layer through a conductive column filled in the through hole, the thickness of the fixed layer is larger than that of the dielectric layer, the dielectric layer is made of a material with a dielectric constant being more than or equal to 5000, the fixed layer is made of a non-conductive material with structural strength, the second conductive layer at least partially leaks out, a connecting part is arranged on a leakage surface of the second conductive layer, and a wire structure is connected to the connecting part.

Preferably, the conductive posts are conductive glue or metal conductor material.

Preferably, a temperature sensor is arranged on the upper surface of the fixed layer, or a temperature sensor is embedded in the surface of the fixed layer, or a temperature sensor is arranged in the through hole.

The invention also aims to provide a TTF electrode array which comprises a plurality of TTF electrode plates arranged in an array.

Based on the technical scheme, the invention has the advantages that:

the TTF electrode plate and the TTF electrode array can reduce the thickness of the dielectric layer, improve the capacitance value and reduce the heating on the premise of ensuring the mechanical strength (equivalent to the total thickness) of the electrode plate.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:

FIG. 1 is a schematic diagram of a TTF electrode sheet according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a conducting manner of a TTF electrode sheet according to an embodiment of the present invention;

FIG. 3 is a schematic diagram showing a conducting manner of a TTF electrode sheet according to another embodiment of the present invention;

FIG. 4 is a schematic diagram of a temperature measurement mode of a TTF electrode plate according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of another embodiment of the invention for measuring temperature of a TTF electrode plate;

FIG. 6 is a schematic diagram of a temperature measurement mode of a TTF electrode plate according to another embodiment of the present invention;

Fig. 7 is a schematic diagram of a TTF electrode plate conduction mode according to another embodiment of the present invention.

Detailed Description

The technical scheme of the invention is further described in detail through the drawings and the embodiments.

The invention provides a TTF electrode slice which sequentially comprises a dielectric layer, a conductive layer and a fixed layer. The dielectric layer is a layer closer to the human body, and the fixed layer is a layer farther from the human body, wherein the thickness of the fixed layer is larger than that of the dielectric layer. The conductive layer is located between the dielectric layer and the fixed layer. As shown in fig. 1-6, there is shown a preferred embodiment of the present invention.

As shown in fig. 1 and 2, the TTF electrode sheet includes a dielectric layer a1, a conductive layer a2, and a fixing layer a3 stacked in order, where the thickness of the fixing layer a3 is greater than that of the dielectric layer a1, the dielectric layer a1 is made of a material with a dielectric constant greater than or equal to 5000, the fixing layer a3 is made of a non-conductive material with structural strength, at least part of the conductive layer a2 leaks out, a connection portion a4 is provided on a drain surface of the conductive layer a2, and a wire structure a5 is connected on the connection portion.

Wherein the dielectric layer a1 should be made of an insulating high dielectric constant material, preferably a lead-free high dielectric constant ceramic material; the dielectric constant is more than or equal to 5000, preferably more than or equal to 10000; the insulation strength is more than or equal to 2000V/mm, preferably more than or equal to 4000V/mm, so as to ensure that the breakdown voltage of the dielectric layer with the thickness of 1mm is more than 4000V; the thickness should be less than or equal to 1.5mm, preferably between 0.1 and 1 mm. The conductive layer a2 should be made of a material having good conductive properties, such as copper, gold, silver, nickel, platinum, palladium, and alloys thereof. The fixing layer a3 is made of a non-conductor material with a certain structural strength, and may be ceramic, plastic, polymer material, mica, glass, alumina, etc.

Preferably, the whole shape of the TTF electrode plate is a round or round and round chamfer rectangle, and the diameter of the circle or the side length of the rectangle is 10-30 mm. The electrode sheet may preferably be circular or rectangular with gentle edges (to reduce its edge effect), preferably 15-25 mm, since excessive area may result in reduced fit to the surface of the human body, and a balance of area and fit is required.

It is noted that, since the thin dielectric layer is between the metal layer and the human body, only the thin dielectric layer is considered as a dielectric substance in the capacitor, and the capacitance value can be multiplied while the resistance value is multiplied while the partial pressure of the dielectric layer is reduced because the thickness is reduced; thus, the increased capacitance value may increase the electric field strength of the target human tissue (when the same voltage/current is applied), while the decreased resistance value and decreased voltage division may decrease heat generation (when the same voltage/current is applied); from another perspective, the applied voltage/current can be increased without increasing the heat generation, thereby increasing the electric field strength of the target tissue.

Since the electrode sheet in the conventional technical scheme at present has only a single dielectric layer, the dielectric layer plays roles of a dielectric layer and a fixed layer, and therefore, the thickness (capacitance value) is sacrificed for mechanical strength. The TTF electrode slice can reduce the thickness of the dielectric layer, improve the capacitance value and reduce the heating on the premise of ensuring the mechanical strength (equivalent to the total thickness) of the barrier electrode slice.

Further, for the production of the electrode sheet with the three-layer structure as a whole, it is necessary to improve the success rate of sintering the dielectric layer and the adhesion of the dielectric layer a1, the conductive layer a2, and the fixing layer a3, and therefore, materials with similar melting points should be selected for the three-layer structure. Preferably, the dielectric layer and the anchor layer may be made of the same material.

For the electrode sheet with the three-layer structure, if the electrode sheet is not produced as a whole, but assembled after being produced respectively, the success rate and the bonding property of the sintering of the dielectric layer a1 do not need to be considered, so that materials with dissimilar melting points can be selected for the three-layer structure. The fixing layer a2 can be made of non-conductive material with certain structural strength and high heat conduction performance, such as silicon rubber, silicon resin, aluminum oxide, boron nitride, aluminum nitride, mica, ceramic, glass and the like.

For conducting the electrode pads to an array of TTF electrodes (also referred to as a "transducer array"), initially, the conducting sites may be at exposed portions of the side conductive layers, as shown in fig. 2. The connecting part a4 can be a connecting structure such as welding spots, conductive adhesive, conductive buckles and the like; the wire structure a5 may be a wire structure such as a wire, a flat cable, a flexible circuit board, or the like.

Further, for conducting the electrode sheet and the transducer array, the conductive layer a2 may be made into a built-in structure, and only the connection portion a4 is connected with the outside, so that the insulation performance of the electrode sheet is increased, and the safety is improved.

For temperature monitoring of the electrode plate, the TTF electrode plate greatly reduces the heating of the electrode plate, and a temperature monitoring device can be omitted.

Further, for more safety, for temperature monitoring of the electrode sheet, a temperature sensor a6 may be placed on the upper surface of the fixing layer a3, as shown in fig. 4. The temperature sensor a6 is preferably a thermistor.

For temperature monitoring of the electrode sheet, a temperature sensor a6 may be further disposed on the upper surface of the fixing layer a3, and built-in, i.e., surface-embedded, may be performed as shown in fig. 5. The temperature sensor a6 may be placed in a groove or a through hole preset in the upper surface of the fixing layer a 3. Thus, the temperature sensor a6 has no protruding portion on the surface of the electrode sheet, increasing reliability. Meanwhile, as the temperature sensor a6 is built in the electrode plate, the accuracy of temperature monitoring is improved.

Of course, for temperature monitoring of the electrode sheet, the temperature detecting element may be provided on the side surface, and it is preferable to provide the temperature detecting element in the electrode sheet, as shown in fig. 6. Thus, the temperature sensor a6 has no protruding portion on the surface of the electrode sheet, increasing reliability. Meanwhile, as the temperature sensor a6 is built in the electrode plate, the accuracy of temperature monitoring is improved.

According to another embodiment of the invention, a TTF electrode sheet is further provided, which comprises a dielectric layer a1, a conductive layer a2, a fixing layer a3 and a second conductive layer a7 which are stacked in sequence, wherein at least one vertical through hole is formed in the fixing layer a3, the conductive layer and the second conductive layer a7 are connected through a conductive post a8 filled in the through hole, the thickness of the fixing layer a3 is larger than that of the dielectric layer a1, the dielectric layer a1 is made of a material with a dielectric constant being larger than or equal to 5000, the fixing layer a3 is made of a non-conductive material with structural strength, at least part of the second conductive layer a7 leaks out, a connecting part a4 is arranged on a leakage surface of the second conductive layer a7, and a wire structure a5 is connected to the connecting part.

As shown in fig. 7, the TTF electrode sheet may also divide the conductive layer into two layers, a conductive layer a2 closer to the human body and a second conductive layer a7 farther from the human body, where the second conductive layer a7 is located above the fixed layer a3 (the fixed layer a3 may still be the same material as the dielectric layer a1 or may be different). The fixing layer a3 has 1 or more through holes, preferably 1 to 5 through holes. The through hole is provided with a conductive post a8, and the conductive layer a2 and the second conductive layer a7 are electrically connected, and the conductive post a8 and the conductive layer can be made of the same material or conductive glue or other metals.

It should be noted that, since the conductive layer a2 and the second conductive layer a7 are conductive and have the same electric potential, although the conductive layer a2 and the second conductive layer a7 have the fixed layer a3 therebetween, the dielectric which actually exerts the capacitor effect is only the dielectric layer a1, and the fixed layer does not cause significant heat generation nor does it split the potential difference of the target tissue of the human body, and only the dielectric layer a1 causes heat generation and splits the potential difference.

Further, a temperature sensor a6 is arranged on the upper surface of the fixed layer a3, or the temperature sensor a6 is embedded in the surface of the fixed layer a 3. Preferably, in the present embodiment, the temperature sensor a6 may also be disposed in the through hole.

Based on the TTF electrode plates in the invention, a TTF electrode array can be manufactured, and the TTF electrode array comprises a plurality of TTF electrode plates which are arranged in an array. The TTF electrode array further includes structures such as adhesive tapes, gaskets, hydrogels, and wires (conventional structural constructions of TTF electrode arrays are well known in the art and will not be described in detail herein). The adhesive tape is attached to the corresponding body surface of the tumor part of the patient, and an alternating electric field is applied to the tumor part of the patient through the TTF electrode plate, so that the therapeutic effect is achieved.

Finally, it should be noted that the above-mentioned embodiments are only for illustrating the technical scheme of the present invention and are not limiting; while the invention has been described in detail with reference to the preferred embodiments, those skilled in the art will appreciate that: modifications may be made to the specific embodiments of the present invention or equivalents may be substituted for part of the technical features thereof; without departing from the spirit of the invention, it is intended to cover the scope of the invention as claimed.

Claims

1. A TTF electrode sheet, characterized in that: including stacking dielectric layer (a 1), conducting layer (a 2), fixed layer (a 3) that set up in proper order, wherein the thickness of fixed layer (a 3) is greater than dielectric layer (a 1), dielectric layer (a 1) is made by the material that the dielectric constant is greater than or equal to 5000, fixed layer (a 3) is made by the nonconductor material that has structural strength, conducting layer (a 2) at least part spills, be equipped with connecting portion (a 4) on the drain surface of conducting layer (a 2), be connected with wire structure (a 5) on the connecting portion.

2. The TTF electrode sheet of claim 1, wherein: the dielectric layer (a 1) has an insulation strength of not less than 2000V/mm and a thickness of not more than 1.5mm.

3. The TTF electrode sheet of claim 1, wherein: the thickness of the dielectric layer (a 1) is 0.1-1 mm.

4. The TTF electrode sheet of claim 1, wherein: the fixing layer (a 3) is made of ceramics, plastics, high polymer materials, mica, glass or alumina.

5. The TTF electrode sheet of claim 1, wherein: the whole appearance of the TTF electrode slice is round or round and round chamfering rectangle, and the diameter of the circle or the side length of the rectangle is 10-30 mm.

6. The TTF electrode sheet of claim 1, wherein: the TTF electrode plate is manufactured by sintering and integrally forming, and the material melting points of the dielectric layer (a 1), the conductive layer (a 2) and the fixing layer (a 3) are similar.

7. The TTF electrode sheet of claim 1, wherein: the form of the connecting part (a 4) comprises welding spots, conductive adhesive or conductive buckles, and the form of the wire structure (a 5) comprises a single wire, a flat cable or a flexible circuit board.

8. The TTF electrode sheet of claim 1, wherein: the upper surface of the fixed layer (a 3) is provided with a temperature sensor (a 6), or the surface of the fixed layer (a 3) is embedded with the temperature sensor (a 6).

9. A TTF electrode sheet, characterized in that: including stacking dielectric layer (a 1), conducting layer (a 2), fixed layer (a 3), second conducting layer (a 7) that set up in proper order, be equipped with at least one vertical through-hole in fixed layer (a 3), be connected through filling between conducting layer and the second conducting layer (a 7) conducting column (a 8) in the through-hole, wherein the thickness of fixed layer (a 3) is greater than dielectric layer (a 1), dielectric layer (a 1) is made by the material that the dielectric constant is greater than or equal to 5000, fixed layer (a 3) is made by the nonconductor material that has structural strength, second conducting layer (a 7) at least part spills, be equipped with connecting portion (a 4) on the drain face of second conducting layer (a 7), be connected with wire structure (a 5) on the connecting portion.

10. The TTF electrode sheet of claim 1, wherein: the conductive posts (a 8) are made of conductive glue or metal conductor materials.

11. The TTF electrode sheet of claim 1, wherein: the upper surface of the fixed layer (a 3) is provided with a temperature sensor (a 6), or the surface of the fixed layer (a 3) is embedded with the temperature sensor (a 6), or the through hole () is internally provided with the temperature sensor (a 6).

12. A TTF electrode array, characterized by: comprising a plurality of TTF electrode sheets according to any one of claims 1 to 11 arranged in an array.