CN118284238A

CN118284238A - Display device

Info

Publication number: CN118284238A
Application number: CN202311849474.9A
Authority: CN
Inventors: 孙海晙
Original assignee: LG Display Co Ltd
Current assignee: LG Display Co Ltd
Priority date: 2022-12-30
Filing date: 2023-12-29
Publication date: 2024-07-02

Abstract

The display device may include a first substrate and a second substrate. The first substrate may include an active region in which the light emitting element is disposed and an inactive region surrounding the active region. The second substrate may be disposed over the first substrate. The display device may further include an adhesive layer disposed between the first substrate and the second substrate. The display device may include a moisture barrier coating disposed to contact a portion of the first substrate, a portion of the second substrate, and a portion of the adhesive layer.

Description

Display device

Cross Reference to Related Applications

The present application claims benefits and priorities of korean patent application No. 10-2022-0191172 filed on 12 months 39 of 2022 and korean patent application No. 10-2023-0191344 filed on 26 of 12 months 2023 in republic of korea, the entire contents of which are expressly incorporated by reference.

Technical Field

The present disclosure relates to a display device, and more particularly, to a display device that minimizes permeation of moisture and oxygen, resulting in improved lifetime and reliability.

Background

Recently, as our society has been developed toward an information-based society, the field of display devices for visually expressing electric signals has been rapidly developed. Accordingly, various display devices having excellent performance in terms of thinness, light weight, and low power consumption are being developed.

Representative display devices may include liquid crystal display devices (LCDs), electrowetting display devices (EWDs), organic light emitting display devices (OLEDs), and the like.

Among the display devices, the OLED device is a self-luminous display device, and since the OLED device does not require a separate light source unlike an LCD device including a separate light source, the OLED device can be manufactured to be light and thin. In addition, the OLED device has advantages in terms of power consumption due to low voltage driving, and is excellent in terms of color realization, response speed, viewing angle, and Contrast Ratio (CR). Accordingly, OLED devices have been expected to be used in various application fields.

However, the OLED device has a limitation in that the organic layers constituting the light emitting element are very susceptible to heat, moisture and oxygen. Accordingly, an encapsulation technique for preventing moisture and oxygen from penetrating to the inside of the OLED device is being desired.

Disclosure of Invention

Accordingly, embodiments of the present disclosure are directed to a display device that substantially obviates one or more problems due to limitations and disadvantages of the related art.

An aspect of the present disclosure is to provide a display device that minimizes the introduction of moisture and oxygen through its side surfaces.

Another aspect of the present disclosure is to provide an improved display device having lifetime and reliability.

Yet another aspect of the present invention is to provide a display device that minimizes damage to a Chip On Film (COF) in a COF bonding process.

Additional features and aspects will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the inventive concepts provided herein. Other features and aspects of the inventive concept may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

To achieve these and other aspects of the inventive concept, a display device may include a first substrate and a second substrate as described in detail and in broad terms. The first substrate may include an active region in which the light emitting element is disposed and an inactive region surrounding the active region. The second substrate may be disposed over the first substrate. The display device may further include a moisture barrier coating disposed to contact a portion of the first substrate and a portion of the second substrate.

In some embodiments, the display device may further include an adhesive layer disposed between the first substrate and the second substrate. The moisture barrier coating may be disposed in contact with a portion of the adhesive layer.

In some embodiments, a moisture barrier coating may be disposed on an end of the first substrate, an end of the second substrate, and an end of the adhesive layer. The moisture barrier coating may cover at least a portion of an upper surface of the second substrate corresponding to the non-effective area.

In some embodiments, the moisture barrier coating may cover the entire upper surface of the second substrate corresponding to the active area and the inactive area.

In some embodiments, the display device may further include a passivation layer disposed over the light emitting element, the passivation layer being formed of an inorganic material.

In some embodiments, the moisture barrier coating is configured to prevent permeation of moisture and/or oxygen.

In some embodiments, the display device may further include a dam surrounding the adhesive layer and disposed in the inactive area. The dam may include a moisture absorbing layer disposed within an interior of the dam and extending along a longitudinal axis. The dam may further include a base dam surrounding the moisture absorbing layer such that the moisture absorbing layer is disposed within the base dam. The base dam may have a cylindrical shape. In other embodiments, the base dam may have a quadrangular shape, and the moisture absorbing layer may have any one of a circular shape, a quadrangular shape, and a polygonal shape. The base dam may be made of at least one of an epoxy-based sealing material and an acrylic-based sealing material, and the moisture absorbing layer may be made of a moisture absorbent. The base dam may be configured to block permeation of moisture and/or oxygen while enhancing adhesion between the first substrate and the second substrate.

In some embodiments, the display device may further include a thin film encapsulation layer disposed over the light emitting element and having a plurality of inorganic layers and a plurality of organic layers. The plurality of inorganic layers and the plurality of organic layers of the thin film encapsulation layer may be alternately disposed.

According to some embodiments, a display device may include a first substrate, a second substrate, and a side seal. The first substrate may include an active region in which the light emitting element is disposed and an inactive region surrounding the active region. The second substrate may be disposed over the first substrate. The side sealing part may be positioned such that the side sealing part covers a space between the first substrate and the second substrate, a portion of an upper surface of the second substrate, and a side surface of an end portion of the first substrate.

In some embodiments, the display device further includes a polarizing plate disposed under the first substrate and having an end positioned outside the first substrate, and a thin film encapsulation layer disposed on the light emitting element and having a plurality of inorganic layers and a plurality of organic layers. The plurality of inorganic layers and the plurality of organic layers of the thin film encapsulation layer may be alternately disposed.

In some embodiments, the side seals may include a first side seal, a second side seal, and a third side seal. The first side sealing part may be positioned to cover a portion of the upper surface of the second substrate and a space between the first substrate and the second substrate. The second side sealing part may be positioned to cover an end of the first substrate while covering a portion of an upper surface of the first substrate. The third side seal may be disposed between the first side seal and the second side seal. The first side seal may be made of a frit sealing material and the second and third side seals may be made of at least one of an epoxy-based resin and an acrylic-based resin.

In some embodiments, the display device may include a passivation layer made of an inorganic material under the thin film encapsulation layer.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the inventive concepts as claimed.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this disclosure, illustrate embodiments of the disclosure and together with the description serve to explain various principles. In the drawings:

fig. 1 is a plan view of a display device according to an example embodiment of the present disclosure.

Fig. 2 is a cross-sectional view of a sub-pixel of a display device according to an example embodiment of the present disclosure.

Fig. 3A to 3E are cross-sectional views taken along III-III' of fig. 1.

Fig. 4A to 4E are other cross-sectional views taken along III-III' of fig. 1.

Fig. 5 is a plan view of a display device according to another example embodiment of the present disclosure.

Fig. 6A and 6B are cross-sectional views taken along VI-VI' of fig. 5.

Fig. 6C and 6D are another cross-sectional view taken along VI-VI' of fig. 5.

Fig. 7 is a plan view of a display device according to still another example embodiment of the present disclosure.

Fig. 8 is a cross-sectional view taken along VIII-VIII' of fig. 7.

Fig. 9A is a perspective view showing an arrangement of a dam according to still another example embodiment of the present disclosure.

Fig. 9B is a cross-sectional view of the dam of fig. 9A.

Detailed Description

The advantages and features of the present disclosure and the method of achieving them will become apparent by referring to various exemplary embodiments that are described in detail below with the accompanying drawings. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but is to be implemented in various forms. The various exemplary embodiments are provided by way of example only so that those skilled in the art will fully understand the disclosure and scope of the present disclosure.

The shapes, sizes, ratios, angles, numbers, and the like shown in the drawings for describing the various exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. Like reference numerals generally refer to like elements throughout the specification. In addition, in the following description of the present disclosure, detailed explanation of known related art may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "comprising," having, "and" consisting of … … "as used herein are generally intended to allow for the addition of other components unless these terms are used with the term" only. Any reference to the singular may include the plural unless specifically stated otherwise.

Components are to be construed as including a generic error range even though not explicitly stated.

When terms such as "on", "above", "below" and "next" are used to describe a positional relationship between two parts, one or more parts may be located between the two parts unless these terms are used in conjunction with the terms "immediately following" or "directly.

When an element or layer is disposed "on" another element or layer, the other layer or other element may be directly on or intervening between the other element or layers.

Although the terms "first," "second," and the like are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Thus, in the technical concept of the present disclosure, a first component to be mentioned below may be a second component.

Like reference numerals generally refer to like elements throughout the specification.

For ease of description, the dimensions and thicknesses of each component shown in the figures are shown, and the present disclosure is not limited to the dimensions and thicknesses of the components shown.

Features of various embodiments of the disclosure may be partially or fully attached to each other or combined, and may be interlocked and operated in various manners technically, and the various embodiments may be performed independently or in association with each other.

Hereinafter, various exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

For convenience of description, fig. 1 illustrates a first substrate 101, a plurality of flexible films 160, a printed circuit board 170, and a moisture barrier coating 180 among the respective components of the display device 100.

Referring to fig. 1, a first substrate 101 is a supporting member for supporting other components of a display device 100. A plurality of pixels for displaying an image, a driving element for driving the plurality of pixels, and a wiring for transmitting various signals to the plurality of pixels and the driving element may be provided on the first substrate 101. The first substrate 101 may include an active area AA and an inactive area NA. The effective area AA may be an area where a plurality of pixels are disposed to substantially display an image. A plurality of sub-pixels constituting a plurality of pixels and a circuit for driving the plurality of sub-pixels may be disposed in the effective area AA. The plurality of sub-pixels may be the smallest unit constituting the effective area AA, and the light emitting element may be disposed in each of the plurality of sub-pixels. For example, an organic light emitting element including an anode electrode, an organic light emitting layer, and a cathode electrode may be disposed in each of the plurality of sub-pixels, but the present disclosure is not limited thereto. In addition, the circuit for driving the plurality of sub-pixels may include a driving element, a wiring, and the like. For example, the circuit may include a thin film transistor, a storage capacitor, a gate line, a data line, and the like, however, the present disclosure is not limited thereto.

The configuration of the plurality of sub-pixels will be described in more detail.

Referring to fig. 2, each of the plurality of sub-pixels may include a first substrate 101, an insulating inorganic layer 110, a driving element 120, a planarization layer 102, a bank 103, a passivation layer 105, a light emitting element 150, an adhesive layer 130, and a second substrate 140.

The first substrate 101 may be a support substrate on which a plurality of pixels are disposed, and may be formed of transparent glass. When manufacturing the flexible display device, the first substrate 101 may be formed of a flexible organic material such as a plastic-based material. For example, the first substrate 101 may be formed of a material such as polyimide or the like.

A plurality of insulating inorganic layers 110 may be disposed on the first substrate 101. The insulating inorganic layer 110 may include a buffer layer 111, an insulating layer 112, and a gate insulating layer 113.

The buffer layer 111 may be a functional layer for protecting various electrodes and wires from impurities such as alkali ions or the like flowing out from the first substrate 101 or a layer thereunder. As shown in fig. 2, the buffer layer 111 may have a multi-layered structure formed of a first buffer layer 111a and a second buffer layer 111 b. However, the present disclosure is not limited thereto. The buffer layer 111 may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or a plurality of layers thereof.

The buffer layer 111 may block diffusion of moisture and/or oxygen permeated into the first substrate 101. In addition, the buffer layer 111 may include multi-buffering and/or active buffering. The active buffer may protect the active layer 121 formed of a semiconductor in the assembly of the driving element 120, and may perform a function of blocking various types of defects introduced from the first substrate 101. The active buffer may be formed of amorphous silicon (a-Si) or the like.

The driving element 120 may be formed such that the active layer 121, the insulating layer 112, the gate electrode 123, the gate insulating layer 113, a source electrode (not shown), and the drain electrode 122 are sequentially disposed. The driving element 120 may be electrically coupled to the light emitting element 150 via the connection electrode 124 to transmit current or signals to the light emitting element 150.

The active layer 121 may be disposed on the buffer layer 111. The active layer 121 may be formed of polysilicon (p-Si). In some embodiments, the active layer 121 may include a predetermined region doped with impurities. In other embodiments, the active layer 121 may be formed of amorphous silicon (a-Si), or may be formed of various organic semiconductor materials such as pentacene and the like. In still further embodiments, the active layer 121 may be formed of an oxide semiconductor.

An insulating layer 112 may be disposed over the active layer 121. The insulating layer 112 may be formed of an insulating inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx), and may also be formed of an insulating organic material or the like.

The gate electrode 123 may be disposed on the insulating layer 112. The deletion electrode 123 may be formed of various conductive materials including, but not limited to, magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or an alloy thereof.

The gate insulating layer 113 may be disposed over the gate electrode 123. The gate insulating layer 113 may be formed of an insulating inorganic material, including, but not limited to, silicon oxide (SiOx) or silicon nitride (SiNx). The gate insulating layer 113 may also be formed of an insulating organic material or the like.

Contact holes for electrically coupling the source and drain electrodes 122 and the active layer 121 may be formed in the insulating layer 112 and the gate insulating layer 113. The source and drain electrodes 122 may be formed on the gate insulating layer 113 in a single-layer or multi-layer structure of an electrode material. In some embodiments, an additional passivation layer formed of an insulating inorganic material may be formed to cover the source and drain electrodes 122.

Although not shown in fig. 2, a color filter may be further disposed on the gate insulating layer 113. The color filter may be disposed to correspond to an emission region where the light emitting element 150 is disposed. In this way, when the color filter is disposed on the gate insulating layer 113, light emission of the bottom emission type display device can be more effectively performed.

The planarization layer 102 may be disposed over the driving element 120. In some embodiments, the planarizing layer 102 may be formed of a single layer. In other embodiments, such as shown in fig. 2, the planarization layer 102 may have a multi-layer structure composed of at least two layers including a first planarization layer 102a and a second planarization layer 102 b. The first planarizing layer 102a may be arranged to cover the driving element 120 in such a way that: so that portions of the source and drain electrodes 122 of the driving element 120 are exposed. In some embodiments, the planarization layer 102 may extend to the inactive area NA. In some embodiments, the connection electrode 124 for electrically coupling the driving element 120 and the light emitting element 150 may be disposed on the first planarization layer 102a and pass through the first planarization layer 102a. In addition, although not shown in fig. 2, various metal layers serving as electric wires/electrodes such as data wires and signal wires may be disposed on the first planarization layer 102a. In addition, a second planarization layer 102b may be disposed on the first planarization layer 102a and the connection electrode 124.

In some embodiments, in the display device 100, since the display device 100 has a higher resolution, the planarization layer 102 may be formed of two layers due to the addition of various signal lines. Thus, additional layers may be formed since it may be difficult to place all of the wires on one layer while ensuring a minimum distance therebetween. In this manner, additional layers, such as the second planarizing layer 102b, may create a margin and thus may further facilitate electrical wiring/electrode arrangement design. In addition, when a dielectric material is used for the planarizing layer 102 formed of a plurality of layers, the planarizing layer 102 can also be used to form a capacitance between metal layers.

The second planarization layer 102b may be formed to expose a portion of the connection electrode 124. Further, the drain electrode 122 of the driving element 120 and the anode 151 of the light emitting element 150 may be electrically coupled via the connection electrode 124.

The light emitting element 150 may be configured by sequentially disposing an anode 151, an organic layer 152, and a cathode 153. That is, the light emitting element 150 may be configured to include an anode 151 formed on the planarization layer 102, an organic layer 152 formed on the anode 151, and a cathode 153 formed on the organic layer 152. The organic layer 152 may be further configured by stacking a plurality of organic layers.

The anode 151 may be formed of a transparent conductive material, including, but not limited to, indium Tin Oxide (ITO), indium Zinc Oxide (IZO), or Indium Gallium Zinc Oxide (IGZO). Although it has been described that the anode 151 is formed of a transparent conductive material, the present disclosure is not limited thereto. For example, in the case of using a top emission type display device, the second substrate may be formed of a transparent material, and a reflective layer formed of an opaque conductive material having high reflectivity, such as silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof, may be added under the anode 151 such that light emitted from the organic layer 152 is reflected by the anode 151 and directed upward (i.e., in the direction of the cathode 153, which is located above the anode 151).

The bank 103 may be disposed on the planarization layer 102 in a region other than the emission region. For example, the bank 103 may have bank holes exposing the anode 151 so as to correspond to the emission regions. In some embodiments, the bank 103 may be formed of an insulating inorganic material, including, but not limited to, silicon nitride (SiNx) or silicon oxide (SiOx). In other embodiments, the bank 103 may be formed of an organic insulating material, including but not limited to BCB, acrylic resin, or imide resin. Furthermore, the bank 103 may be provided to extend to the non-effective area NA.

The organic layer 152 may be disposed on at least a portion of the anode 151 exposed by the bank 103. The organic layer 152 may include a light emitting layer, an electron injection layer, an electron transport layer, a hole injection layer, and the like. The organic layer 152 may extend to the non-active area NA.

The cathode 153 may be disposed on the organic layer 152. The cathode 153 may include one or more metal materials such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), and copper (Cu) or an alloy thereof. Alternatively, the cathode 153 may be configured by stacking a layer formed of a transparent conductive material such as Indium Tin Oxide (ITO), indium Zinc Oxide (IZO), or Indium Gallium Zinc Oxide (IGZO) and a layer formed of a metal material such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), or copper (Cu), or an alloy thereof, but the disclosure is not limited thereto. Meanwhile, in the case of the top emission type, the cathode 153 may include a transparent conductive material. For example, the cathode 153 may be formed of Indium Tin Oxide (ITO), indium Zinc Oxide (IZO), or Indium Gallium Zinc Oxide (IGZO). The cathode 153 may extend to the non-active area NA. The cathode 153 may be spaced apart from an end of the bank 103 by a predetermined distance and contact a portion of an upper surface of the bank 103.

The cap layer 104 may be disposed on the light emitting element 150. The cover layer 104 may be formed of a material having a high refractive index and high light absorption so as to reduce diffuse reflection of external light. The cap layer 104 may be an organic material layer formed of an organic material. In some embodiments, the cap layer 104 may be omitted.

A passivation layer 105 may be disposed on the cap layer 104. The passivation layer 105 may provide protection for the light emitting element 150 from external foreign materials, impact, permeation of moisture and oxygen, and the like. The passivation layer 105 may be formed of an inorganic material. For example, the passivation layer 105 may be formed of an inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx). In some embodiments, the passivation layer 105 may be omitted.

An adhesive layer 130 may be disposed on the passivation layer 105. The adhesive layer 130 may bond the first substrate 101 and the second substrate 140 to each other. In some embodiments, the adhesive layer 130 is formed of resins including, but not limited to, epoxy, phenol, amino, unsaturated polyester, polyimide, silicone, acryl, vinyl, and olefin. The adhesive layer 130 may be bonded via a high-energy curing method such as heat, ultraviolet rays, or laser, or may be bonded by a method of applying physical pressure using a Pressure Sensitive Adhesive (PSA).

The second substrate 140 may be disposed on the adhesive layer 130. The second substrate 140 may have a size smaller than that of the first substrate 101. For example, an end portion of the second substrate 140 may be positioned inside the first substrate 101. Further, the second substrate 140 may have a thermal expansion coefficient different from that of the first substrate 101. As such, the coefficient of thermal expansion thereof may be realized to be equal to or similar to that of the first substrate 101. The difference in thermal expansion coefficient can thereby prevent warpage. Accordingly, the second substrate 140 may be formed of an alloy of iron and nickel having a low thermal expansion coefficient. The second substrate 140 may have a form of foil or a metal thin film. The second substrate 140 may be thin and have a thickness equal to or greater than 50 μm and equal to or less than 500 μm. In some embodiments, the second substrate 140 may be manufactured to have a thickness of 100 μm, which may result in a volume that may be reduced, thereby minimizing warpage of the first substrate 101 caused by the second substrate 140. The second substrate 140 may also be referred to as a metal substrate.

The polarizing plate 190 may be disposed under the first substrate 101. The polarizing plate 190 may selectively transmit light to reduce reflection of external light incident on the first substrate 101. For example, in the display device 100, various metal materials applied to a semiconductor element, a wiring, a light-emitting element, and the like may be provided over the first substrate 101. Accordingly, external light incident on the first substrate 101 may be reflected from the metal material, so that the visibility of the display may be reduced. In some embodiments, external visibility of the display device 100 may be increased by providing a polarizing plate 190 preventing reflection of external light under the first substrate 101. In other embodiments, the polarizing plate 190 may be omitted. For example, the display device according to another embodiment may be a top-emission display device. In the case of the top emission display device, the polarizing plate 190 may be disposed on the top of the second substrate 140 instead of the bottom of the first substrate 101.

Referring to fig. 1, the non-effective area NA may be an area where an image is not displayed. Although fig. 1 illustrates that the non-effective area NA surrounds the effective area AA having a quadrangular shape, the shapes and arrangements of the effective area AA and the non-effective area NA are not limited to the example illustrated in fig. 1. For example, the active area AA and the inactive area NA may have shapes suitable for the design of the electronic apparatus in which the display device 100 is mounted. For example, the shape of the active area AA may be pentagonal, hexagonal, circular, or elliptical.

In the non-effective area NA, various wirings and circuits for driving the light emitting element of the effective area AA may be provided. For example, in the non-effective area NA, a driver IC such as a gate driver IC and a data driver IC, or a link line for transmitting signals to a plurality of sub-pixels and circuits of the effective area AA may be provided, however, the present disclosure is not limited thereto.

The display device 100 may include various additional elements for generating various signals or driving a plurality of pixels arranged in the active area AA. Additional elements for driving the pixel may include inverter circuits, multiplexers, electrostatic discharge (ESD) circuits, and the like. The display device 100 may further include additional elements related to functions other than pixel driving. For example, the display device 100 may include additional elements that provide touch sensing functionality, user authentication functionality (e.g., fingerprint recognition), multi-stage pressure sensing functionality, haptic feedback functionality, and the like. The additional elements described above may be located in the inactive area NA and/or in an external circuit connected to the connection interface.

The flexible membrane 160 may be a membrane in which various parts are disposed on a flexible base membrane. In some embodiments, each of the flexible films 160 may be a film for supplying signals to a plurality of sub-pixels and circuits of the active area AA, and may be electrically coupled to the first substrate 101. The flexible film 160 may be disposed on one end of the non-active area NA in the first substrate 101 and supply a power voltage, a data voltage, and the like to a plurality of sub-pixels and circuits of the active area AA. The display device 100 may include any suitable number of flexible films 160, depending on the particular design.

Meanwhile, driver ICs such as a gate driver IC and a data driver IC may be disposed on the flexible film 160. The driver IC may be a component that processes data for displaying an image and a driving signal for processing the data. Depending on the mounting method, the driver IC may be provided in a method such as a Chip On Glass (COG) method, a Chip On Film (COF) method, or a Tape Carrier Package (TCP) method.

The printed circuit board 170 may be disposed on one end of the flexible film 160 and connected to the flexible film 160. The printed circuit board 170 may be a component that supplies signals to the driver ICs. The printed circuit board 170 may supply various signals such as a driving signal and a data signal to the driver IC. In some embodiments, a data driver for generating data signals may be mounted on the printed circuit board 170, and the generated data signals may be supplied to the plurality of sub-pixels and circuits of the first substrate 101 through the flexible film 160. The display device 100 may include any suitable number of printed circuit boards 170, which may vary according to a particular design, but the disclosure is not limited thereto.

As described above, the display device 100 may be manufactured by combining the first substrate 101 on which the light emitting element is disposed with the second substrate 140 formed of a metal thin film and to which the adhesive layer 130 is attached. More specifically, the display device 100 may be manufactured by aligning and bonding other components constituting the first and second substrates 101 and 140 and by pattern-cutting the bonded first and second substrates 101 and 140. Such a manufacturing process may allow moisture and oxygen to be introduced through the side surface of the outer edge of the display device 100, which may cause defects in the light emitting element 150 and the like and deteriorate the reliability of the display device 100.

Accordingly, the display device 100 may further include a moisture barrier coating 180. The moisture barrier coating 180 may be disposed to cover a portion of the upper surface of the second substrate 140 of the display device 100 and cover a side surface of an end portion of the first substrate 101 along a side surface of the display device 100, thereby helping to prevent moisture and oxygen from being introduced from a side surface of an outer edge of the display device 100. The above-described moisture barrier coating 180 will be explained in more detail with reference to fig. 3A to 3E and fig. 4A to 4E.

Fig. 3A, 3C and 4A, 4C illustrate the display device 100 in the case where the passivation layer 105 is disposed over the light emitting element 150, and fig. 3B, 3D, 3E and 4B, 4D, 4E illustrate the display device 100 in the case where no passivation layer 105 is disposed over the light emitting element 150.

For convenience of description, fig. 3A to 3E and fig. 4B to 4E schematically illustrate the driving element 120 in the active area AA. The driving element 120 may include various components under the light emitting element 150. In addition, the inactive area NA may also include various components, and is schematically illustrated for ease of description.

Referring to fig. 3A, in the display device 100, the first substrate 101, the insulating inorganic layer 110, the planarization layer 102, the bank 103, the organic layer 152, the cathode 153, the capping layer 104, the passivation layer 105, the adhesive layer 130, and the second substrate 140 may be sequentially stacked and disposed.

The end of the insulating inorganic layer 110 on the first substrate 101 may be positioned between the end of the first substrate 101 and the end of the second substrate 140. In some embodiments, as shown in fig. 3A-4B, the end of the insulating inorganic layer 110 may be positioned outside the end of the adhesive layer 130. However, the present disclosure need not be so limited, and in other embodiments, the end of the insulating inorganic layer 110 may be positioned inside the end of the adhesive layer 130.

In some embodiments, the planarization layer 102, the bank 103, the organic layer 152 and the cathode 153 of the light emitting element 150, and the end portion of the cap layer 104 on the insulating inorganic layer 110 may be positioned inside the first and second substrates 101 and 140 in the non-display area NA, and the passivation layer 105 may be disposed to cover the planarization layer 102, the bank 103, the organic layer 152 and the cathode 153 of the light emitting element 150, and the end portion of the cap layer 104. The end of the adhesive layer 130 on the passivation layer 105 may be positioned between the end of the insulating inorganic layer 110 and the end of the second substrate 140, and the end of the passivation layer 105 may be positioned inside the end of the adhesive layer 130. Accordingly, at the side surface of the display device 100 according to an exemplary embodiment of the present disclosure, an end portion of the first substrate 101, an end portion of the insulating inorganic layer 110, an end portion of the adhesive layer 130, and an end portion of the second substrate 140 may be provided.

The moisture barrier coating 180 may be disposed to cover a side surface of an end portion of the first substrate 101 along a side surface of the display device 100 while covering a portion of the upper surface of the second substrate 140 in the non-effective area NA. The moisture barrier coating 180 may be disposed to correspond only to the non-active area NA. In some embodiments, the moisture barrier coating 180 may be in contact with an end of the first substrate 101, an end of the second substrate 140, an end of the insulating inorganic layer 110, and an end of the adhesive layer 130. Further, an end of the moisture blocking coating 180 on the upper surface of the second substrate 140 may be positioned between an end of the passivation layer 105 and an end of the planarization layer 102.

The moisture barrier coating 180 may be formed by coating fluorine in a plasma process. For example, the moisture barrier coating 180 may be deposited on the side surface of the end portion of the first substrate 101 along the side surface of the display device by activating carbon tetrafluoride (CF ₄) gas with plasma in a vacuum chamber while covering a portion of the upper surface of the second substrate 140 of the display device 100 in a CF ₂ polymer state. Therefore, the hydrophobicity of the display device 100 may be enhanced. Thus, the moisture barrier coating 180 may prevent moisture and oxygen from penetrating through the side surfaces of the display device 100. Meanwhile, the display device of fig. 3B is a display device in which the passivation layer 105 for protecting the light emitting element 150 from external foreign substances, impact, and permeation of moisture and oxygen is omitted from the display device 100 of fig. 3A.

Referring to fig. 3B, in the non-active area NA of the display device, the insulating inorganic layer 110, the planarization layer 102, the bank 103, the organic layer 152, the cathode 153, the adhesive layer 130, and the second substrate 140 may be disposed over the first substrate 101 and extend from the active area AA. The moisture barrier coating 180 may be disposed to cover a side surface of an end portion of the first substrate 101 along a side surface of the display device 100 while covering a portion of an upper surface of the second substrate 140 in the non-effective area NA.

Further, in the display device of fig. 3C, a dam 185 is added to minimize penetration of moisture and oxygen through the side of the display device 100 of fig. 3A.

Referring to fig. 3C, the dam 185 may be disposed between the first substrate 101 and the second substrate 140 in the non-effective area NA. For example, the dam 185 may be any one of epoxy-based or acrylic-based sealing materials to which a thermal curing accelerator and a photoinitiator are added.

For example, the dam 185 is formed to surround the effective area AA in a plan view, and the first substrate 101 and the second substrate 140 may be bonded with the adhesive layer 130 to seal them. Accordingly, the dam 185 may be disposed in a region where the first substrate 101 and the second substrate 140 overlap each other. The dam 185 may block introduction of moisture and oxygen that may penetrate between the first substrate 101 and the second substrate 140 through the side surface of the display device 100.

In addition, the display device of fig. 3D has an added thin film encapsulation layer 510, as compared to the display device 100 of fig. 3A.

Referring to fig. 3D, the cap layer 104 may be disposed on the light emitting element 150, the light emitting element 150 is disposed on the first substrate 101, and the thin film encapsulation layer 510 may be disposed on the cap layer 104. The thin film encapsulation layer 510 may help to protect the light emitting element 150 from external foreign substances, impact, permeation of moisture and oxygen, and the like. The thin film encapsulation layer 510 may include a plurality of inorganic layers 511, 512, 514, and 515 and a plurality of organic layers 513 and 516. In some embodiments, the thin film encapsulation layer 510 may be configured by sequentially stacking the first inorganic layer 511, the second inorganic layer 512, the first organic layer 513, the third inorganic layer 514, the fourth inorganic layer 515, and the second organic layer 516.

The first, second, third, and fourth inorganic layers 511, 512, 514, and 515 may be formed of an inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx). The first and third inorganic layers 511 and 514 may be formed via an Atomic Layer Deposition (ALD) method, which may be performed without seams, providing good side step coverage. However, the present disclosure is not limited thereto. The first organic layer 513 and the second organic layer 516 may be formed of an organic material such as an alkylene polyethylene.

In the display device of fig. 3D, a thin film encapsulation layer 510 composed of a plurality of inorganic thin films 511, 512, 514, and 515 and a plurality of organic thin films 513 and 516 is provided over the light emitting element 150. By so doing, the light emitting element 150 can be effectively protected from moisture and oxygen that may have permeated.

In addition, the display device of fig. 3E has a dam 185 and an added thin film encapsulation layer 510, as compared to the display device 100 of fig. 3A. Accordingly, the detailed description of the display device of fig. 3E may refer to the descriptions of fig. 3C and 3D described above.

Referring to fig. 3E, the dam 185 may be disposed between the first substrate 101 and the second substrate 140 in the non-display area NA. For example, the dam 185 is formed to surround the effective area AA in a plan view, and the first substrate 101 and the second substrate 140 may be bonded to be sealed with the adhesive layer 130. Accordingly, the dam 185 may be disposed in a region where the first substrate 101 and the second substrate 140 overlap each other.

In addition, the cap layer 104 may be disposed on the light emitting element 150, and the thin film encapsulation layer 510 may be disposed on the cap layer 104. The thin film encapsulation layer 510 may include a plurality of inorganic layers 511, 512, 514, and 515 and a plurality of organic layers 513 and 516. In some embodiments, the thin film encapsulation layer 510 may be configured by sequentially stacking a first inorganic layer 511, a second inorganic layer 512, a first organic layer 513, a third inorganic layer 514, a fourth inorganic layer 515, and a second organic layer 516.

By providing the moisture barrier coating 180 covering the side surface of the end portion of the first substrate 101 while covering the portion of the upper surface of the second substrate 140 along the side surface of the display device 100 in the non-display area NA, penetration of moisture and oxygen into the inside of the display device 100 can be minimized, and reliability of the display device 100 can be improved. In some embodiments, the moisture barrier coating 180 may be positioned to extend to the active area AA.

Referring to fig. 4A to 4E, the moisture barrier coating 480 may be disposed on a side surface of an end portion of the first substrate 101 along a side surface of the display device while covering the entire upper surface of the second substrate 140. For example, the moisture barrier coating 480 may be positioned to correspond to the entire surface of the active area AA and the inactive area NA of the display device. Accordingly, the moisture barrier coating 480 may be disposed such that it covers all upper surfaces and both side surfaces of the first substrate 101 except for the lower portion of the display device 100.

Hereinafter, a display device according to another embodiment will be described.

The display device 500 shown in fig. 5 and 6A to 6D may be substantially the same as the display device 100 shown in fig. 1,2, 3A to 3E, and 4A to 4E. As such, a repetitive description thereof will be omitted. The display device 500 may further include a side sealing portion 580.

For convenience of description, fig. 6A to 6D schematically illustrate the driving element 120 in the effective area AA. The driving element 120 may include various components under the light emitting element 150. In addition, the inactive area NA may also include various components, and is schematically illustrated for convenience of description.

Referring to fig. 5to 6A to 6D, the display device 500 may include a first substrate 101, an insulating inorganic layer 110, a driving element 120, a planarization layer 102, a bank 103, a light emitting element 150, a cap layer 104, a thin film encapsulation layer 510, an adhesive layer 130, a second substrate 140, a side sealing portion 580, and a polarizing plate 590. The polarizing plate 590 may be disposed under the first substrate 101. The polarizing plate 590 may selectively transmit light to reduce reflection of external light incident on the first substrate 101. The polarizing plate 590 may have a size larger than that of the first substrate 101.

Referring to fig. 6A to 6D, an end portion of the polarizing plate 590 may be positioned outside an end portion of the first substrate 101. Accordingly, some components of the side seal 580 may be disposed on a side surface of an end portion of the first substrate 101 and a portion of an upper portion of the polarizing plate 590. The cap layer 104 may be disposed on the light emitting element 150, the light emitting element 150 is disposed on the first substrate 101, and the thin film encapsulation layer 510 may be disposed on the cap layer 104. The thin film encapsulation layer 510 may help to protect the light emitting element 150 from external foreign substances, impact, permeation of moisture and oxygen, and the like. The thin film encapsulation layer 510 may include a plurality of inorganic layers 511, 512, 514, and 515 and a plurality of organic layers 513 and 516. In some embodiments, the thin film encapsulation layer 510 may be configured by sequentially stacking the first inorganic layer 511, the second inorganic layer 512, the first organic layer 513, the third inorganic layer 514, the fourth inorganic layer 515, and the second organic layer 516.

The first, second, third, and fourth inorganic layers 511, 512, 514, and 515 may be formed of an inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx). The first and third inorganic layers 511 and 514 may be formed via an Atomic Layer Deposition (ALD) method, which may be performed without seams and thus provide good side step coverage. However, the present disclosure is not limited thereto. The first organic layer 513 and the second organic layer 516 may be formed of an organic material such as an alkylene polyethylene.

Referring to fig. 6B, the cap layer 104 may be disposed on the light emitting element 150, the passivation layer 105 formed of an insulating inorganic material may be disposed on the cap layer 104, and the thin film encapsulation layer 510 may be disposed on the passivation layer 105. In other words, two inorganic layers including the passivation layer 105 and the first inorganic layer 511 may be disposed on the cap layer 104.

Referring to fig. 6C, the dam 185 may be disposed between the first substrate 101 and the second substrate 140 in the non-effective area NA. For example, the dam 185 is formed to surround the effective area AA in a plan view, and the first substrate 101 and the second substrate 140 may be bonded with the adhesive layer 130 to seal them. Accordingly, the dam 185 may be disposed in a region where the first substrate 101 and the second substrate 140 overlap each other. The second substrate 140 may have a thermal expansion coefficient different from that of the first substrate 101. As such, the coefficient of thermal expansion thereof may be realized to be equal to or similar to that of the first substrate 101. The difference in thermal expansion coefficient can thus prevent warpage. Accordingly, the second substrate 140 may be formed of an alloy of iron and nickel having a low thermal expansion coefficient. The second substrate 140 may have a form of foil or a metal thin film. The second substrate 140 may also be referred to as a metal substrate. However, not limited thereto, and the second substrate 140 may also be made of glass or transparent plastic.

Alternatively, in fig. 6C, only the dam 185 may be provided without the thin film encapsulation layer 150.

Further, referring to fig. 6D, the display device according to another embodiment may be a top emission display device. In the case of the top emission display device, the polarizing plate 590 may be disposed on the top of the second substrate 140 instead of the bottom of the first substrate 101. In this case, the second substrate 140 may be made of glass or transparent plastic.

The display device 500 includes a thin film encapsulation layer 510, the thin film encapsulation layer 510 being formed by disposing organic layers 513 and 516 on a plurality of inorganic layers 511, 512, 514 and 515, while forming a protective layer composed of a plurality of layers to protect the light emitting element 150 with the plurality of inorganic layers 511, 512, 514 and 515, which can more effectively protect the light emitting element 150 from oxygen and foreign material.

The side seal 580 may be disposed in the inactive area NA, and may be positioned to cover a side surface of an end portion of the first substrate 101 along a side surface of an outside of the display device 500 while covering a portion of an upper surface of the second substrate 140. The side seal 580 may include a first side seal 581, a second side seal 582, and a third side seal 583.

The first side sealing part 581 may be disposed between the second substrate 140 and the first substrate 101. The first side sealing part 581 may be positioned to cover at least a portion of an upper surface of the first substrate 101 and a portion of an upper surface of the second substrate 140 along a side surface of the display device between the first substrate 101 and the second substrate 140. The first side sealing part 581 may be positioned such that it helps to prevent moisture, oxygen, or foreign matter from penetrating into the inside of the display device 500, and thus to block damage to the light emitting element 150. The first side seal 581 may be formed of a sealing material, such as a frit sealing material. The frit sealing material constituting the first side sealing part 581 may be a thermosetting agent or a laser curing agent. In some embodiments, the thermal curing agent may be a UV laser curing agent. The first side sealing part 581 may be provided such that it forms a convex curved shape at a side surface between the upper surface of the second substrate 140 and the first substrate 101.

The second side seal 582 may be disposed over the first substrate 101 and the polarizing plate 590. The second side seal 582 may be disposed to cover at least a portion of the upper surface of the polarizing plate 590 and a portion of the side surface of the end portion of the first substrate 101. The second side seal 582 may be provided to prevent cracking of the first substrate 101. The second side seal 582 may be formed of a different material than the first side seal 581. In some embodiments, the second side seal 582 may be formed of an epoxy-based resin or an acrylic-based resin having an insulating property and may be capable of being thinly applied. The epoxy or acrylic resin constituting the second side seal 582 may be a UV laser curing agent. The second side seal 582 may be disposed such that a side surface of the first substrate 101 may have a rounded angle shape or a convex curved shape.

The third side seal 583 may be disposed between the first side seal 581 and the second side seal 582. The third side seal 583 may be positioned to cover a space between the first and second side seals 581 and 582 and contact the first and second side seals 581 and 582. The third side seal 583 may further enhance the adhesion between the first side seal 581 and the second side seal 582. In addition, the third side seal 583 may cover a space between the first side seal 581 and the second side seal 582, so that moisture and oxygen may be minimized from being introduced into the inside of the display device 500. The third side seal 583 may be formed of an epoxy resin or an acrylic resin. The epoxy or acrylic resin constituting the third side seal 583 may be a UV laser curing agent.

The display device 500 may be configured such that external moisture and oxygen may be prevented from penetrating the side seal 580. In addition, in the case where moisture and oxygen may permeate the display device 500, the light emitting element 150 may be effectively protected from the moisture and oxygen by providing the thin film encapsulation layer 510 including the plurality of inorganic layers 511, 512, 514, and 515 and the plurality of organic layers 513 and 516 on the light emitting element 150.

As described above, the second substrate 140 of the display device 500 may be formed of a metal thin film. Further, due to expansion of the second substrate 140 during a driving operation at a high temperature, a protrusion or bump may be formed at an end of the second substrate 140. After the first substrate 101 and the second substrate 140 are bonded, and when they are electrically coupled with the flexible film 160 coupling the first substrate 101 and the printed circuit board 170, the flexible film 160 may contact an end portion of the second substrate 140. In conventional display devices, there are often defects in which the flexible film is recessed and thereby the wiring within the flexible film is damaged. However, in the display device 500, the side seal 580 is formed to have a convex curve shape including corners of ends of each of the first and second substrates 101 and 140 and having rounded corner shapes to help prevent line dishing and damage of the flexible film 160.

Hereinafter, a display device according to still another embodiment will be described.

The display device 700 shown in fig. 7 to 9A and 9B is substantially the same as the display device 100 in fig. 1 to 3A, 3B, 3D, 4A, 4B and 4D, and further includes a dam 780. As such, a repetitive description of substantially the same configuration will be omitted.

For convenience of description, fig. 8 schematically illustrates the driving element 120 in the active area AA. For example, the driving element 120 may include various components below the light emitting element 150. In addition, the inactive area NA may also include various components, and is schematically illustrated for convenience of description.

Referring to fig. 7 and 8, a display device 700 according to still another example embodiment of the present disclosure may include a first substrate 101, an insulating inorganic layer 110, a driving element 120, a planarization layer 102, a bank 103, an organic layer 152, and a cathode 153 of a light emitting element 150, a cap layer 104, an adhesive layer 130, a second substrate 140, and a dam 780.

The first substrate 101, the insulating inorganic layer 110, the planarization layer 102, the bank 103, the organic layer 152, and the cathode 153 of the light emitting element 150, the cap layer 104, the adhesive layer 130, and the second substrate 140 may be disposed from the active area AA to the inactive area NA. In fig. 1 to 6A, 6B, 6C and 6D, it has been described that the size of the second substrate 140 may be smaller than that of the first substrate 101. However, the display device 700 according to still another example embodiment is not limited to the above example, and the second substrate 140 may be formed to have the same or substantially the same size as the first substrate 101, and may be formed not only of a thin metal material but also of glass or transparent plastic. As described above, in the case where the second substrate 140 of the display device 700 is formed of a transparent material, the display device 700 may be a display device using top emission. In the case of the top emission type display device, the polarizing plate 190 may be disposed above the second substrate 140 instead of being disposed below the first substrate 101.

The dam 780 may be disposed between the first substrate 101 and the second substrate 140 in the non-effective area NA. That is, the dam 780 is formed to surround the effective area AA in a plan view, and the first substrate 101 and the second substrate 140 may be bonded with the adhesive layer 130 to seal them. Accordingly, the dam 780 may be disposed in a region where the first substrate 101 and the second substrate 140 overlap each other. The dam 780 may block the introduction of moisture and oxygen that may penetrate between the first substrate 101 and the second substrate 140 through the side surface of the display device 700.

Referring to fig. 9A and 9B, the dam 780 may include a base dam 781 and a moisture absorbing layer 782 disposed in the base dam 781. The base dam 781 may be disposed to contact each of the first and second substrates 101 and 140, and as shown in fig. 9A and 9B, the base dam 781 may be configured to surround the moisture absorbing layer 782 disposed therein. The base dam 781 may be formed of any one of a thermal curing agent and a UV curing agent. For example, the base dam 781 may be any one of epoxy-based or acrylic-based sealing materials to which a thermal curing accelerator and a photoinitiator are added. The base dam 781 may serve to block permeation of moisture and oxygen while enhancing adhesion between the first substrate 101 and the second substrate 140.

Referring to fig. 9A, the base dam 781 may be configured to have a cylindrical shape and be disposed on the first substrate 101. However, by positioning the second substrate 140 on the first substrate 101 coated with the base dam 781, the base dam 781 may have a quadrangular shape.

The moisture absorbing layer 782 may be disposed within the base dam 781. As shown in fig. 9A, the moisture absorbing layer 782 may be disposed in a horizontal direction within a base dam 781 disposed on the first substrate 101. In some embodiments, as shown in fig. 9A and 9B, the moisture absorbing layer 782 may have a circular cross-sectional shape within the base dam 781. However, the present disclosure is not limited thereto, and the moisture absorbing layer 782 may have any suitable shape within the base dam 781, such as a quadrangular shape or a polygonal shape. In addition, although only one moisture absorbing layer 782 is shown to be disposed within the base dam 781, the present disclosure is not limited thereto, and a plurality of moisture absorbing layers 782 may be disposed within the base dam 781 in a horizontal direction. The moisture absorbing layer 782 may be formed of a moisture absorbent. The moisture absorbing layer 782 may be formed of, for example, alkali metal oxide, silica, porous zeolite, or other organic or inorganic moisture absorbent. Examples of the moisture reactive moisture absorbent may include one or a mixture of two or more of metal powders such as alumina, metal oxide, metal salt, or phosphorus pentoxide (P2O ₅). Examples of the physical absorbent may include silica, zeolite, titania, zirconia, montmorillonite, and the like. Specific examples of the metal oxide include lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), barium oxide (BaO), calcium oxide (CaO), or magnesium oxide (MgO). In addition, examples of the metal salt may include sulfate salts such as lithium sulfate (Li ₂SO₄), sodium sulfate (Na ₂SO₄), calcium sulfate (CaSO ₄), magnesium sulfate (MgSO ₄), Cobalt sulfate (CoSO ₄), gallium sulfate (Ga ₂(SO₄)₃), titanium sulfate (Ti (SO ₄)₂) or nickel sulfate (NiSO ₄); Metal halides such as calcium chloride (CaCl ₂), magnesium chloride (MgCl ₂), strontium chloride (SrCl ₂), yttrium chloride (YCl ₃), Copper chloride (CuCl ₂), cesium fluoride (CsF), tantalum fluoride (TaF ₅), niobium fluoride (NbF ₅), lithium bromide (LiBr), calcium bromide (CaBr ₂), Cesium bromide (CeBr ₃), selenium bromide (SeBr ₄), vanadium bromide (VBr ₃), magnesium bromide (MgBr ₂), Barium iodide (BaI ₂) or magnesium iodide (MgI ₂); Or a metal chlorate such as barium perchlorate (Ba (ClO ₄)₂) or magnesium perchlorate (Mg (C1O ₄)₂). However, the present disclosure is not limited thereto the moisture absorbing layer 782 may be disposed within the base dam 781 and form at least a part of the outer shape of the dam 780 to block diffusion of moisture and oxygen permeated from the outside.

In the dam forming apparatus having the first dispenser for forming the base dam 781 and the second dispenser for forming the moisture absorbing layer 782, the moisture absorbent constituting the moisture absorbing layer 782 and the sealing material constituting the base dam 781 may be simultaneously discharged through the first discharge nozzle of the first dispenser and the second discharge nozzle of the second dispenser, whereby the dam 780 may be formed such that the moisture absorbing layer 782 is positioned inside the base dam 781. Therefore, even when the moisture absorbing layer 782 is formed in the base dam 781, a separate process for forming the moisture absorbing layer 782 may not be added.

As described above, by positioning the dam 780 including the moisture absorbing layer 782 between the first substrate 101 and the second substrate 140, adhesion between the first substrate 101 and the second substrate 140 of the display device 700 may be improved. Further, such a configuration may allow improved blocking of permeation of moisture and oxygen from the outside, so that the lifetime and reliability of the display device 700 may be improved.

Example embodiments of the present disclosure may be described as follows.

In one or more example embodiments, a display device may include a first substrate and a second substrate. The first substrate may include an active region in which the light emitting element is disposed and an inactive region surrounding the active region. The second substrate may be disposed over the first substrate. The display device may further include a moisture barrier coating layer disposed to contact a portion of the first substrate and a portion of the second substrate. The display device may further include an adhesive layer disposed between the first substrate and the second substrate. The moisture barrier coating may be disposed in contact with a portion of the adhesive layer.

In some example embodiments, a moisture barrier coating may be disposed on an end of the first substrate, an end of the second substrate, and an end of the adhesive layer. The moisture barrier coating may cover at least a portion of an upper surface of the second substrate corresponding to the non-effective area.

In some example embodiments, the moisture barrier coating may cover the entire upper surface of the second substrate corresponding to the active area and the inactive area.

In some example embodiments, the display device may further include a passivation layer disposed on the light emitting element, the passivation layer being formed of an inorganic material.

In some example embodiments, the moisture barrier coating is configured to prevent permeation of moisture and/or oxygen.

In some example embodiments, the display device may further include a dam surrounding the adhesive layer and disposed in the inactive area. The dam may include a moisture absorbing layer disposed within an interior of the dam and extending along the longitudinal axis. The dam may further include a base dam surrounding the moisture absorbing layer such that the moisture absorbing layer is disposed within the base dam. The base dam may have a cylindrical shape. In other embodiments, the base dam may have a quadrangular shape, and the moisture absorbing layer may have any one of a circular, quadrangular, and polygonal shape. The base dam may be made of at least one of an epoxy-based sealing material and an acrylic-based sealing material, and the moisture absorbing layer may be made of a moisture absorbent. The base dam may be configured to block permeation of moisture and/or oxygen while enhancing adhesion between the first substrate and the second substrate.

In other example embodiments, a display device may include a first substrate, a second substrate, and a side seal. The first substrate may include an active region in which the light emitting element is disposed and an inactive region surrounding the active region. The second substrate may be disposed over the first substrate. The side sealing part may be positioned such that the side sealing part covers a space between the first substrate and the second substrate, a portion of an upper surface of the second substrate, and a side surface of an end portion of the first substrate.

In some example embodiments, the display apparatus further includes: a polarizing plate disposed under the first substrate and having an end positioned outside the first substrate; and a thin film encapsulation layer disposed on the light emitting element and having a plurality of inorganic layers and a plurality of organic layers. The plurality of inorganic layers and the plurality of organic layers of the thin film encapsulation layer may be alternately disposed.

In some example embodiments, the side seals may include a first side seal, a second side seal, and a third side seal. The first side sealing part may be positioned to cover a portion of the upper surface of the second substrate and a space between the first substrate and the second substrate. The second side sealing part may be positioned to cover an end of the first substrate while covering a portion of an upper surface of the first substrate. The third side seal may be disposed between the first side seal and the second side seal. The first side seal may be made of a frit sealing material, and the second and third side seals may be made of at least one of an epoxy-based resin and an acrylic-based resin.

In some example embodiments, the display device may include a passivation layer made of an inorganic material under the thin film encapsulation layer.

As described above, specific example embodiments of the present disclosure have been described in more detail with reference to the accompanying drawings. However, the present disclosure is not limited to the above-described exemplary embodiments, but various modifications may be made without departing from the principles of the present disclosure. Thus, the above-described example embodiments disclosed herein are to be construed as illustrative, and not restrictive, of the principles of the present disclosure, and the scope of the present disclosure is not limited to the above-described example embodiments. Accordingly, the foregoing example embodiments are not to be construed as being exhaustive in any way.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present disclosure without departing from the spirit or scope of the disclosure. Accordingly, this disclosure is intended to cover such modifications and variations of this disclosure.

Claims

1.A display device, comprising:

a first substrate including an active region in which a light emitting element is disposed and an inactive region surrounding the active region;

a second substrate disposed over the first substrate; and

A moisture barrier coating disposed in contact with a portion of the first substrate and a portion of the second substrate.

2. The display device according to claim 1, further comprising an adhesive layer provided between the first substrate and the second substrate, and

Wherein the moisture barrier coating is disposed in contact with a portion of the adhesive layer.

3. The display device according to claim 2, wherein the moisture barrier coating layer is provided on an end portion of the first substrate, an end portion of the second substrate, and an end portion of the adhesive layer.

4. The display device of claim 3, wherein the moisture barrier coating covers at least a portion of an upper surface of the second substrate corresponding to the inactive area.

5. The display device of claim 3, wherein the moisture barrier coating covers an entire upper surface of the second substrate corresponding to the active area and the inactive area.

6. The display device according to claim 1, further comprising:

and a passivation layer disposed over the light emitting element, the passivation layer being formed of an inorganic material.

7. The display device of claim 1, wherein the moisture barrier coating is configured to prevent permeation of moisture and/or oxygen.

8. The display device according to claim 2, further comprising a dam surrounding the adhesive layer and disposed in the inactive area,

Wherein the dam includes a moisture absorbing layer disposed within an interior of the dam and extending along a longitudinal axis.

9. The display device of claim 8, wherein the dam comprises a base dam surrounding the moisture absorbing layer such that the moisture absorbing layer is disposed within the base dam,

Wherein the base dam is made of at least one of an epoxy-based sealing material and an acrylic-based sealing material, and

Wherein the moisture absorbing layer is made of a moisture absorbent.

10. The display device according to claim 1, further comprising a thin film encapsulation layer provided over the light-emitting element and having a plurality of inorganic layers and a plurality of organic layers.

11. The display device according to claim 10, wherein the plurality of inorganic layers and the plurality of organic layers of the thin film encapsulation layer are alternately disposed.

12. A display device, comprising:

a second substrate disposed over the first substrate; and

A side sealing portion positioned such that the side sealing portion covers a space between the first substrate and the second substrate, a portion of an upper surface of the second substrate, and a side surface of an end portion of the first substrate.

13. The display device according to claim 12, further comprising a polarizing plate provided below the first substrate and having an end portion of the polarizing plate positioned outside the first substrate.

14. The display device according to claim 12, further comprising a thin film encapsulation layer provided over the light-emitting element and having a plurality of inorganic layers and a plurality of organic layers.

15. The display device according to claim 14, wherein the plurality of inorganic layers and the plurality of organic layers of the thin film encapsulation layer are alternately disposed.

16. The display device of claim 12, wherein the side seal comprises a first side seal positioned to cover a portion of the upper surface of the second substrate and a space between the first substrate and the second substrate, and wherein the first side seal is made of a frit seal material.

17. The display device according to claim 16, wherein the side sealing portion includes a second side sealing portion positioned to cover an end portion of the first substrate while covering a portion of an upper surface of the first substrate.

18. The display device according to claim 17, wherein the side seal portion includes a third side seal portion provided between the first side seal portion and the second side seal portion, and

Wherein the second side seal and the third side seal are made of at least one of an epoxy-based resin and an acrylic-based resin.

19. The display device according to claim 14, further comprising:

a passivation layer made of an inorganic material under the thin film encapsulation layer.

20. The display device of claim 12, further comprising a dam surrounding the adhesive layer and disposed in the inactive area, wherein the dam comprises a moisture absorbing layer disposed within an interior of the dam and extending along a longitudinal axis in a horizontal direction in the dam,

Wherein the dam includes a base dam surrounding the moisture absorbing layer such that the moisture absorbing layer is disposed within the base dam,

Wherein the moisture absorbing layer is made of a moisture absorbent.