CN118263084A - Component separating device of wafer process chamber - Google Patents
Component separating device of wafer process chamber Download PDFInfo
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- CN118263084A CN118263084A CN202311577388.7A CN202311577388A CN118263084A CN 118263084 A CN118263084 A CN 118263084A CN 202311577388 A CN202311577388 A CN 202311577388A CN 118263084 A CN118263084 A CN 118263084A
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- 238000000034 method Methods 0.000 title claims abstract description 74
- 230000008569 process Effects 0.000 title claims abstract description 74
- 238000000926 separation method Methods 0.000 claims abstract description 45
- 238000009434 installation Methods 0.000 claims abstract description 16
- 230000000149 penetrating effect Effects 0.000 claims abstract description 7
- 230000003028 elevating effect Effects 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000009795 derivation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/3288—Maintenance
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a part separating device of a wafer process chamber, which comprises the following components: a base member; a housing provided above the base member and having a column shape with an upper opening; an operation shaft penetrating through a shaft installation part formed at one side part of the housing; the lifting component is connected with the operation shaft through a gear and screw assembly and moves up or down according to the rotation direction of the operation shaft; and a stopper formed at an upper end of a connecting portion protruding forward, the connecting portion being provided upright at a front end portion of the base member, and being fixed by being pressed against an upper surface of another separation target component below the separation target component when the separation target component is lifted by the lifting member. Therefore, the component separating device of the wafer process chamber according to the present invention is capable of easily, rapidly and nondeformably separating the adhered shower head, liner, etc. from the chamber cover of the wafer process chamber.
Description
Technical Field
The present invention relates to a component separating apparatus for a wafer process chamber, and more particularly, to a component separating apparatus for a wafer process chamber, which can easily separate a shower head and a liner of the wafer process chamber.
Background
The semiconductor chip is manufactured by performing an oxidation process, a photolithography process, an etching process, a deposition and ion implantation process, a metal wiring process, a testing process, a packaging process, and the like on a wafer.
In the process, the etching process and deposition and ion implantation processes are performed within a wafer process chamber (hereinafter, mixed with a "process chamber") that may form a vacuum and a plasma.
Typically, the process chamber includes a chamber body and a chamber lid. A vacuum pump is connected to the chamber body to create a vacuum within the process chamber. In addition, a showerhead is disposed at the chamber lid, the showerhead uniformly disperses the reaction gas supplied inside the process chamber over the entire area of the wafer, the showerhead being supported by the chamber lid through a liner of ceramic material.
In a state that the chamber cover is closed at the upper part of the chamber body, plasma is formed while vacuum is formed inside the process chamber, and thus a thin film is formed on the surface of the wafer.
If the above-described process is repeatedly performed a plurality of times, the components (the shower head, the liner, etc.) which are in surface contact with each other due to the high temperature and the high vacuum pressure formed in the process chamber are adhered to each other or to the chamber cover.
Therefore, in the conventional wafer process chamber, when the components are detached from the chamber cover for maintenance, the components are not easily separated, so that maintenance is difficult, the required time is increased, and when the components are forcibly separated by excessive force, the components are deformed and damaged, so that the problem of no reuse is caused.
The prior art, which is technical information that the inventors have all or learned during the derivation of the present invention, is not necessarily known to the general public before the present invention is applied.
(Prior art literature)
(Patent literature)
(Patent document 1) Korean laid-open patent publication No. 10-2007-0036844 (2007.04.04. Laid-open)
Disclosure of Invention
Problems to be solved
In view of the above problems, an object of the present invention is to provide a component separating apparatus for a wafer process chamber, which can easily separate components without deformation or damage when the components such as a shower head and a liner are adhered to each other in the wafer process chamber.
The problems to be solved by the present invention are not limited to the above-mentioned problems, and those having ordinary skill in the art to which the present invention pertains will be clearly understood from the following description.
Means for solving the problems
A component separating apparatus of a wafer process chamber according to an embodiment of the present invention includes: a base member; a housing provided above the base member and having a column shape with an upper opening; an operation shaft penetrating through a shaft installation part formed at one side part of the housing; the lifting component is connected with the operation shaft through a gear and screw assembly and moves up or down according to the rotation direction of the operation shaft; and a stopper formed at an upper end of a connecting portion protruding forward, the connecting portion being provided upright at a front end portion of the base member, and being fixed by being pressed against an upper surface of another separation target component below the separation target component when the separation target component is lifted by the lifting member.
In this case, the gear and screw assembly may include: a worm disposed on the operation shaft; a worm wheel disposed inside the housing and engaged with the worm; a female screw hole penetrating through a center portion of the turbine in an axial direction, and having a screw thread formed on an inner circumferential surface thereof; and a male screw portion formed on an outer circumferential surface of the body portion of the elevating member and screwed into the female screw hole.
In this case, the turbine is preferably provided in a state where the upper and lower surfaces thereof are supported by an upper stop ring and a lower stop ring provided on the inner peripheral surface of the casing, and the turbine is rotatable and not movable in the up-down direction.
On the other hand, the lifting member may form a head portion which is flat-plate-shaped and pushes the separation object member upward at an upper end of the main body portion located outside an upper portion of the housing.
In the lifting member, a pin hole is formed through the body portion, an anti-rotation pin is inserted into the pin hole, and both ends of the anti-rotation pin are inserted into slots formed to extend in the vertical direction on both side portions of the housing.
On the other hand, the shaft installation portion is formed on the outer peripheral surface of the housing at a position opposite to the installation position of the stopper, and the operation shaft is provided so as to penetrate through both side surfaces of the shaft installation portion, and is further provided in the right-left direction of the base member.
In the lifting member, the head portion is formed of a rectangular plate material and has the same front-rear length as the base member, and the front end portion and the rear end portion of the head portion are positioned on the same horizontal plane as the front end portion and the rear end portion of the base member, respectively.
In this case, the head portion is a flat-plate-shaped extension connecting portion extending downward from the front end portion, and engaging portions protruding forward from both sides of the lower end of the extension connecting portion.
On the other hand, the stopper is formed of a separate component separate from the connection portion, fastened to the upper end of the connection portion by a bolt, and is adjustable in protruding direction to protrude toward the rear of the base member when not in use.
ADVANTAGEOUS EFFECTS OF INVENTION
As described above, the component separating apparatus for a wafer process chamber according to the present invention can easily separate components without deformation or damage when the components such as a shower head and a liner are adhered to each other in the wafer process chamber.
The effects of the present invention are not limited to the effects mentioned above, and for other effects not mentioned, those having ordinary skill in the art to which the present invention pertains can be clearly understood from the following description.
Drawings
Fig. 1 is a front view of a component separation apparatus of a wafer process chamber according to an embodiment of the present invention.
Figure 2 is a right side view of the component separation device of the wafer processing chamber of figure 1.
Fig. 3 is a plan view of a component separation device of the wafer processing chamber of fig. 2.
FIG. 4 is a cross-sectional view of the line IV-IV of FIG. 3.
Fig. 5 to 8 are views schematically showing the use states of the component separating apparatus of the wafer process chamber of fig. 1, in which fig. 5 and 6 are views showing the states before and after separation of the shower head, respectively, and fig. 7 and 8 are views showing the states before and after separation of the liner, respectively.
Fig. 9 is a perspective view of a component separation apparatus of a wafer processing chamber according to another embodiment of the present invention.
(Description of the reference numerals)
1: Chamber cover 1a: clamping table
2: Liner 2a: flange
3: Shower head
10: Base component
20: The housing 21: shaft installation part
22: Slot groove
30: The operation shaft 31: worm screw
40: Lifting member 41: head part
42: Body portion 43: male screw part
50: Stop 51: connecting part
52: Bolt
60: Turbine 61: female screw hole
71: Upper stop ring 72: lower stop ring
80: Anti-rotation pin
90: The locking portion 91: extension connection part
Detailed Description
In the present invention, the drawings may be exaggerated in order to distinguish, clarify, and facilitate understanding of the technology from the prior art. The terms described below are defined in consideration of functions in the present invention, and may be different depending on the intention of an operator or a user or a conventional practice, and therefore, the definition of such terms should be defined based on the technical contents throughout the present specification. On the other hand, the embodiments are merely exemplary items of the components set forth in the claims of the present invention, and do not limit the scope of the claims of the present invention, which should be interpreted based on the technical idea of the entire specification of the present invention.
Throughout the specification, when a component "comprises" a component, this means that other components may be included unless specifically stated to the contrary, and not excluding other components.
In addition, when a certain element is "connected", "contacted", or "coupled" to another element, this means not only the case of "direct connection", "direct contact", or "direct coupling", but also the case of "connection with other elements interposed therebetween", "contact with other elements interposed therebetween", or "coupling with other elements interposed therebetween". In contrast, when an element is "directly connected," "directly contacting," or "directly coupled" to another element, it is to be understood that there are no other elements in between.
In addition, when directional terms such as "front", "rear", "upper", "lower", "left", "right", "one end", "the other end", etc. are used, this is used as an example for the directional arrangement of the disclosed drawings, and therefore, no restrictive explanation is made, and when terms such as "first", "second", etc. are used, this is not to be interpreted as a restrictive explanation as terms for distinguishing respective structures.
In order to more clearly describe the features of the embodiments of the present invention, detailed descriptions will be omitted for matters well known to those having ordinary skill in the art to which the following embodiments belong. Then, detailed description will be omitted for portions in the drawings which are irrelevant to the description of the embodiments.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 is a front view of a component separation apparatus of a wafer process chamber according to an embodiment of the present invention; figure 2 is a right side view of a component separation device of the wafer processing chamber of figure 1; figure 3 is a plan view of a component separation device of the wafer processing chamber of figure 2; FIG. 4 is a cross-sectional view of the line IV-IV of FIG. 3. Fig. 5 to 8 are views schematically showing the use states of the component separating apparatus of the wafer process chamber of fig. 1, in which fig. 5 and 6 are views showing the states before and after separation of the shower head, respectively, and fig. 7 and 8 are views showing the states before and after separation of the liner, respectively. In addition, fig. 9 is a perspective view of a component separating apparatus of a wafer process chamber according to another embodiment of the present invention.
Referring to fig. 1 to 8, a component separating apparatus of a wafer process chamber according to an embodiment of the present invention includes: base member 10, housing 20, operating shaft 30, lifting member 40, and stopper 50.
The base member 10 may have a rectangular quadrangular plate shape as a structure for supporting other structures at the lowermost portion of the component separating apparatus of the wafer process chamber according to the embodiment of the present invention.
The housing 20 is a column-shaped structure provided on the upper surface of the base member 10 and having an upper opening. More specifically, the housing 20 is provided in a state of being fixed on the base member 10, and may have a cylindrical shape with an upper opening. The base member 10 and the housing 20 are preferably all formed of a metal material and welded to each other, but are not necessarily limited thereto.
The operation shaft 30 is provided to penetrate a shaft installation portion 21 formed on one side of the housing 20. More specifically, the operating shaft 30 is configured to be rotated by an operator, and to be passed through the shaft mounting portion 21 of the housing 20 in a lateral direction (a direction parallel to the ground) in accordance with a configuration in which the lifting member 40 is operated in an up-down direction in accordance with the rotation direction.
The shaft installation portion 21 is formed at one side of the housing 20 as a predetermined protruding space communicating with the inner space of the housing 20, and is integrally formed with the housing 20 or may be formed as a separate piece.
Circular through holes are formed in both side surfaces of the shaft installation portion 21, and the operation shaft 30 is installed to pass through the shaft installation portion 21 through the two through holes.
Although not shown, a quadrangular or hexagonal column wrench operation part may be formed at a predetermined section of one side end or both side ends of the operation shaft 30, the operation shaft 30 may be rotated by a tool such as a wrench, a linear or cross-shaped tool groove may be formed at least one end section of the operation shaft 30, and further the rotation operation may be performed by a special tool such as a screwdriver structure.
The elevating member 40 is connected to the operation shaft 30 by a gear and screw assembly, and is configured to move up or down according to the rotation direction of the operation shaft 30.
The elevating member 40 is composed of a head 41 and a body 42, the head 41 is located at the upper outer side of the housing 20, and the body 42 is formed to protrude vertically downward at the bottom center of the head 41 so as to be inserted into the housing 20. That is, the elevating member 40 may be formed in a flat plate-shaped head 41 for pushing up the separation target component at an upper end of the main body 42 located outside the upper portion of the housing 20.
The head 41 may be formed in a disc shape having a larger diameter than the housing 20, the body 42 may be formed in a cylindrical shape, and a male screw portion 43 having a screw thread may be formed on an outer circumferential surface.
The gear and screw assembly includes: a worm 31 disposed on the operation shaft 30; a worm wheel 60 disposed inside the housing 20 and engaged with the worm 31; a female screw hole 61 formed to penetrate in an axial direction in a central portion of the turbine 60, and formed with a screw thread on an inner peripheral surface thereof; the male screw portion 43 is formed on the outer peripheral surface of the body portion 42 of the elevating member 40, and is screwed into the female screw hole 61.
The worm 31 may be integrally formed with the operating shaft 30 or may be manufactured as a separate piece for installation. The worm 31 is disposed at an intermediate portion of the operation shaft 30 and is located inside the shaft setting portion 21.
The worm wheel 60 is disposed laterally inside the housing 20 (which means laterally aligned gear teeth), and the gear teeth formed on the outer circumferential surface of the worm wheel 60 are engaged with the worm 31.
The turbine 60 is preferably provided in a state in which an upper stop ring 71 and a lower stop ring 72, which are press-fitted and fixed to the upper and lower surfaces of the housing 20, are rotatably and vertically immovably supported. That is, the turbine 60 is set in a state where it is not movable upward and downward, and is rotatable only about its longitudinal axis at the installation position.
The female screw is formed in the female screw hole 61 of the turbine 60, and is engaged with and corresponds to the male screw formed in the male screw portion 43 of the elevating member 40.
Accordingly, the male screw portion 43 of the elevating member 40 is inserted into and screwed into the female screw hole 61 of the turbine 60. Accordingly, the elevating member 40 can perform relative movement in the axial direction with respect to the turbine 60 by the screwing action of the female screw hole 61 and the male screw portion 43.
On the other hand, the elevating member 40 is formed by penetrating the body 42 to form a pin hole 44, and inserting an anti-rotation pin 80 into the pin hole 44, wherein both ends of the anti-rotation pin 80 can be inserted into slots 22 formed to extend in the vertical direction on both side portions of the housing 20.
More specifically, the pin hole 44 is formed in the body 42 of the lifting member 40 so as to penetrate at an upper position of the male screw portion 43, and the anti-rotation pin 80 is inserted into the pin hole 44, and at this time, the anti-rotation pin 80 is provided so as not to be separated by being pushed into the pin hole 44, and both ends protrude outward in both lateral directions of the pin hole 44 by the same length.
In this case, a pair of the slots 22 are formed at positions facing each other in the upper portion of the housing 20 (positions formed at 180 ° intervals on the circumference of the housing 20) corresponding to the anti-rotation pins 80. The slots 22 are formed in a straight line shape extending in the up-down direction, and the lengths of the pair of slots 22 are the same.
At this time, both ends of the anti-rotation pin 80 are respectively inserted into the slots 22 at the corresponding positions. Thus, the anti-rotation pin 80 can move in the up-down direction along the slot 22.
As described above, since the anti-rotation pin 80 is provided through the main body 42 and both ends of the anti-rotation pin 80 are inserted into the slot 22 formed in the housing 20, the elevating member 40 is not rotatable but can be moved in the up-down direction only within the range allowed by the slot 22.
Therefore, when the operator rotates the operation shaft 30, the worm 31 of the operation shaft 30 rotates and the worm wheel 60 engaged with the worm 31 rotates, and the elevating member 40 is operated to be moved up or down according to the rotation direction of the operation shaft 30 by the screw action of the female screw hole 61 of the worm wheel 60 and the male screw of the male screw portion 43 of the elevating member 40.
The stopper 50 has the following structure: the connection part 51 is formed at an upper end of the connection part 51 in a state protruding forward, and the connection part 51 is provided upright at a front end of the base member 10, and is fixed by being pressed against an upper surface of another separation object part below the separation object part when the separation object part is lifted up by the lifting member 40. More specifically, the stopper 50 is fixed to the base member 10 by the connecting portion 51 as a portion protruding laterally outward of one side surface of the base member 10. The connection portion 51 extends vertically downward at one side end portion of the stopper 50, and a lower end portion may be welded to an upper surface of the base member 10. For the stoppers 50, two in total may be provided by welding, one at each of both side ends of one side of the base member 10, and the heights of the stoppers 50 may be the same at both positions.
For the connection portion 51, it is preferable that it is made in accordance with the height of the parts to be pressurized by the stopper 50 when the part separating apparatus of the wafer process chamber according to the embodiment of the present invention is provided.
Referring now to fig. 5 to 8, a component separation process using the component separation apparatus of the wafer process chamber according to an embodiment of the present invention will be described.
First, a separation process of the shower head 3 will be described with reference to fig. 5 and 6. For insulation and heat insulation, the shower head 3 is supported by the inner diameter portion clamping table 1a of the chamber cover 1 through the inner liner 2 made of ceramic material.
The contact surfaces of the shower head 3, the inner liner 2 and the clamping table 1a of the chamber cover 1 are fine-finished and good-quality planes, because high vacuum pressures formed in the process chamber during the process are often strongly adhered to each other and stuck.
The shower head 3 shown in fig. 5 is formed as a protruding portion that protrudes partially outward in the circumferential direction from the entire substantially circular shower head 3, and the protruding portion is supported on the upper surface of the substantially circular inner liner 2 so as to protrude outward in the radial direction than the outer circumferential surface of the inner liner 2. At this time, the upper surface of the liner 2 on the side outside of the shower head 3 (precisely, the protruding portion of the shower head 3) is in an exposed state where it is not shielded by the shower head 3. In addition, the width of the protruding portion of the shower head 3 (width from top to bottom) is smaller than the interval between the stoppers 50 at two places.
Thus, if the component separating apparatus of the wafer process chamber according to the embodiment of the present invention is pushed into the space (gap) between the shower head 3 and the upper surface of the chamber cover 1 in a state where the lifting member 40 is sufficiently lowered, the stoppers 50 at both places can be caught on the upper surface of the liner 2 located outside the protruding portion side surface side of the shower head 3. In order to be able to provide such a structure, the length of the connection 51 of the stopper 50 can of course be designed with respect to the height above the liner 2 above the chamber lid 1. As such, when the component separating apparatus of the wafer process chamber according to the embodiment of the present invention is provided, the protruding portion of the shower head 3 is located between the stoppers 50 at two places.
When the operation shaft 30 is rotated to raise the lifting member 40 in the above-described state, the head 41 of the lifting member 40 is brought into close contact with the bottom surface of the protruding portion of the shower head 3, and when the lifting member 40 is continuously raised in the same direction, the shower head 3 is pushed upward by the lifting force of the lifting member 40 as shown in fig. 6, and the shower head 3 is separated from the liner 2.
As described above, the lifting member 40 is lifted up in a state where the upper surface of the liner 2 is pressurized by the stopper 50 to perform the separation operation of the shower head 3, thereby preventing the liner 2 from being lifted up together with the shower head 3 when the shower head 3 is lifted up, and thus allowing the shower head 3 and the liner 2 to be easily separated.
Next, a process of separating the liner 2 will be described with reference to fig. 7 and 8.
As shown in fig. 7 and 8, a flange 2a (formed at a portion not overlapping the shower head 3) not shown in fig. 5 and 6 may be partially protruded to the outer circumferential direction on the upper surface periphery of the liner 2, and the liner 2 may be separated from the clip 1a of the chamber cover 1 by the flange 2 a.
In separating the inner liner 2, the component separating apparatus of the wafer process chamber according to the embodiment of the present invention is disposed such that the reverse (rear) side of the component separating apparatus of the wafer process chamber according to the embodiment of the present invention faces the inner liner 2. This is because, in the case where the component separating apparatus of the wafer process chamber according to the embodiment of the present invention is disposed in the same direction as the direction in which the shower head 3 is separated, the stopper 50 protruding in the front direction is in contact with the outer circumferential surface of the inner liner 2, and thus the component separating apparatus of the wafer process chamber according to the embodiment of the present invention cannot be disposed close to the inner liner 2. That is, the reason why the component separating apparatus of the wafer process chamber according to the embodiment of the present invention is provided in the opposite direction to the direction when the showerhead 3 is separated is that the head 41 of the elevation member 40 cannot be stably positioned at the lower portion of the flange 2a of the liner 2.
Therefore, if the component separating apparatus of the wafer process chamber according to the embodiment of the present invention is brought as close to the liner 2 as possible in a state where the elevation member 40 is sufficiently lowered, with the opposite side portions of the stopper 50 directed toward the liner 2 side, the head 41 of the elevation member 40 is positioned at the lower portion of the flange 2a of the liner 2. When the operating shaft 30 is rotated and operated to raise the lifting member 40 in this state, the lifting member 40 pushes the flange 2a of the liner 2 upward, and the liner 2 moves upward and is separated from the chuck 1a of the chamber lid 1 as shown in fig. 8.
As described above, according to the component separating apparatus of the wafer process chamber of the embodiment of the present invention, the showerhead 3 and the liner 2 in a stuck state can be easily separated from the chamber cover 1 by applying only a small operation force (the operation force is increased between the worm 31 and the turbine 60) for rotating the operation shaft 30, and thus maintenance work of the process chamber can be more easily and rapidly performed.
In the component separating apparatus for a wafer process chamber according to the embodiment of the present invention, the shower head 3 and the liner 2 are not rapidly subjected to excessive force, but the elevating member 40 is slightly elevated by the action of gears and screws, and at the same time, a predetermined force can be slowly applied to the shower head 3 and the liner 2, so that the shower head 3 and the liner 2 can be safely separated without deformation, damage, or the like. Therefore, the component separating apparatus of the wafer process chamber according to the embodiment of the present invention is capable of reusing the showerhead 3 and the liner 2, and thus has an advantage of economical advantage.
In addition, the component separating apparatus of the wafer process chamber according to the embodiment of the present invention includes the stopper 50, and the stopper 50 is configured to be capable of maintaining a predetermined position against the ascending movement of the elevating member 40, so that when separating two components adhered to each other, the stopper 50 can be used to fix the component positioned relatively on the lower side, thereby preventing the component positioned on the lower side from ascending with each other when moving the component positioned on the upper side upward, and further facilitating the component separating operation.
On the other hand, fig. 9 is a perspective view of a component separating apparatus of a wafer process chamber according to another embodiment of the present invention, and a series of structures (the gear and screw assembly) for rotating the operation shaft 30 to raise the elevation member 40 are the same as those of the above-described embodiment, so that duplicate explanation is omitted and only differences are explained.
In the component separating apparatus of the wafer process chamber according to another embodiment of the present invention, the shaft setting part 21 is located at a position opposite to the setting position of the stopper 50 in the outer circumferential surface of the housing 20, and the operation shaft 30 is provided through both side surfaces of the shaft setting part 21, and thus the operation shaft 30 may be provided along the left-right direction of the base member 10. That is, the shaft setting portion 21 is provided at a position on the opposite side of the stopper 50 (a portion of the outer peripheral surface of the housing 20 that faces rearward of the base member 10), and the operation shaft 30 is provided in the left-right direction at a rearward portion of the base member 10.
In this configuration, the operation shaft 30 is located at a position away from the stopper 50 and the connecting portion 51 (provided in front of the base member 10), and a tool or a hand of an operator operating the operation shaft 30 is not interfered with by the stopper 50 and the connecting portion 51, so that the rotation operation of the operation shaft 30 can be more easily performed.
In addition, in the component separating apparatus of the wafer process chamber according to another embodiment of the present invention, the elevation member 40 may be formed such that the head 41 is formed of a rectangular quadrangular plate material and has the same front-rear length as the base member 10 while the front end and the rear end of the head 41 are respectively positioned on the same horizontal plane as the front end and the rear end of the base member 10. That is, the head 41 of the elevating member 40 is expanded in a rectangular quadrangular plate shape, and in particular, the length of the head 41 in the front-rear direction is increased to have the same front-rear length as the base member 10, and further the front end and the rear end of the head 41 can be positioned on the same horizontal plane as the front end and the rear end of the base member 10, respectively.
In addition, in the component separating apparatus of the wafer process chamber according to another embodiment of the present invention, the stopper 50 is formed of a separate component separate from the connection part 51, fastened to the upper end of the connection part 51 with a bolt 52, and the protruding direction of the stopper 50 may be adjusted to protrude toward the rear of the base member 10 without using the stopper 50. That is, in the case where the stopper 50 is not required to be used, the bolt 52 may be loosened, and the bolt 52 may be re-tightened and fixed after rotating the stopper 50 toward the rear of the base member 10.
As described above, the stopper 50 is not protruded to the front outer side of the base member 10 in such a structure that the interference caused by the stopper 50 does not occur, and thus the component separating apparatus of the wafer process chamber according to another embodiment of the present invention can be disposed closer to the side of the component to be separated. Meanwhile, this structure is such that the lower surface of the separation target component (for example, the lower surface of the protruding portion of the shower head 3, the lower surface of the flange 2a of the liner 2) can be supported more stably by the head 41.
Further, the front end and the rear end of the head 41 of the lifting member 40 are positioned on the same horizontal plane as the front end and the rear end of the base member 10, so that the interference problem caused by the base member 10 is also reduced, and therefore, the lower surface of the separation target component can be supported more easily by the head 41.
On the other hand, in the component separating apparatus of the wafer process chamber according to another embodiment of the present invention, a flat-shaped extension connection portion 91 is formed to extend downward at the front end portion of the head 41, and locking portions 90 may be formed to protrude forward at both sides of the lower end of the extension connection portion 91. With this configuration, the locking portion 90 can be lifted and lowered integrally with the lifting member 40.
Therefore, even when the lower surface of the separation target component is at a low position where the lower surface cannot be supported by the head 41, the lower surface of the separation target component can be lifted by the locking portion 90, and the lifting member 40 can be lifted, whereby the separation target component can be separated without any problem.
As described above, the component separating apparatus for a wafer process chamber according to the present invention can easily separate components without deformation or damage when the components such as a shower head and a liner are adhered to each other in the wafer process chamber.
As described above, the present invention is described with reference to the embodiments shown in the drawings, but it should be understood that this is merely exemplary, and various modifications and equivalent other embodiments can be implemented based on general knowledge in the art to which the present technology pertains. Accordingly, the true technical scope of the present invention should be defined by the claims set forth above and the specific contents based on the above-described invention.
Industrial applicability
The present invention relates to a component separating device for a wafer process chamber, which is applicable not only to the wafer field but also to the industrial field related to component separation of a process chamber for manufacturing a display substrate, and further to all the mechanical industrial fields in which bonding can occur between other components.
Claims (9)
1. A component separation apparatus for a wafer processing chamber, comprising:
A base member;
a housing provided above the base member and having a column shape with an upper opening;
An operation shaft penetrating through a shaft installation part formed at one side part of the housing;
The lifting component is connected with the operation shaft through a gear and screw assembly and moves up or down according to the rotation direction of the operation shaft; and
And a stopper formed at an upper end of a connecting portion protruding forward, the connecting portion being provided upright at a front end portion of the base member, and being fixed by being pressed against an upper surface of another separation target component below the separation target component when the separation target component is lifted by the lifting member.
2. The component separation apparatus of a wafer process chamber of claim 1, wherein,
The gear and screw assembly includes:
a worm disposed on the operation shaft;
a worm wheel disposed inside the housing and engaged with the worm;
a female screw hole penetrating through a center portion of the turbine in an axial direction, and having a screw thread formed on an inner circumferential surface thereof;
And a male screw portion formed on an outer circumferential surface of the body portion of the elevating member and screwed into the female screw hole.
3. The component separation apparatus of a wafer process chamber of claim 2, wherein,
The turbine is supported by an upper stop ring and a lower stop ring, the upper and lower surfaces of which are provided on the inner peripheral surface of the casing, and the turbine is provided in a rotatable state and in a state in which the turbine cannot move in the up-down direction.
4. The component separation apparatus of a wafer process chamber of claim 2, wherein,
The lifting member forms a head portion which is flat plate-shaped and pushes the separation object member upward at an upper end of the main body portion located outside an upper portion of the housing.
5. The component separation apparatus of a wafer process chamber of claim 2, wherein,
The lifting member is provided with a pin hole penetrating the main body part, an anti-rotation pin is inserted into the pin hole, and both ends of the anti-rotation pin are inserted into slots formed in the vertical direction on both side parts of the housing.
6. The component separation apparatus of a wafer process chamber of claim 1, wherein,
The shaft installation portion is formed on an outer peripheral surface of the housing at a position opposite to an installation position of the stopper, and the operation shaft is provided to penetrate through both side surfaces of the shaft installation portion and is further provided in a left-right direction of the base member.
7. The component separation apparatus of a wafer process chamber of claim 1, wherein,
The lifting member is formed of a rectangular quadrangular plate material, and has the same front-rear length as the base member, so that the front end and the rear end of the head are positioned on the same horizontal plane as the front end and the rear end of the base member, respectively.
8. The component separation apparatus of a wafer process chamber of claim 7, wherein,
The head part is a flat-plate-shaped extension connecting part which is formed by extending downwards at the front end part, and locking parts which are formed by protruding forwards at two sides of the lower end of the extension connecting part.
9. The component separation apparatus of a wafer process chamber of claim 1, wherein,
The stopper is formed of a separate member separate from the connection portion, fastened to an upper end of the connection portion by a bolt, and further adjusted in a protruding direction to protrude toward a rear of the base member when not in use.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020220187983A KR20240105107A (en) | 2022-12-28 | 2022-12-28 | Device for detaching parts of wafer processing chamber |
| KR10-2022-0187983 | 2022-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118263084A true CN118263084A (en) | 2024-06-28 |
Family
ID=91603183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311577388.7A Pending CN118263084A (en) | 2022-12-28 | 2023-11-23 | Component separating device of wafer process chamber |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20240105107A (en) |
| CN (1) | CN118263084A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070036844A (en) | 2005-09-30 | 2007-04-04 | 코스텍시스템(주) | Plasma enhanced chemical vapor deposition chamber for the fabrication of semiconductor and liquid crystal display panel |
-
2022
- 2022-12-28 KR KR1020220187983A patent/KR20240105107A/en not_active Application Discontinuation
-
2023
- 2023-11-23 CN CN202311577388.7A patent/CN118263084A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240105107A (en) | 2024-07-05 |
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