CN118234218A - Pressure output control method and device for chip mounter - Google Patents
Pressure output control method and device for chip mounter Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000001276 controlling effect Effects 0.000 claims abstract description 38
- 230000001105 regulatory effect Effects 0.000 claims abstract description 36
- 230000004044 response Effects 0.000 claims abstract description 12
- 238000011084 recovery Methods 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 238000001179 sorption measurement Methods 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 20
- 230000008569 process Effects 0.000 claims description 19
- 238000012546 transfer Methods 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 230000008093 supporting effect Effects 0.000 claims description 11
- 238000010030 laminating Methods 0.000 claims description 7
- 238000012544 monitoring process Methods 0.000 claims description 7
- 230000033001 locomotion Effects 0.000 claims description 6
- 230000001052 transient effect Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 230000008859 change Effects 0.000 abstract description 8
- 230000007547 defect Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 6
- 230000005484 gravity Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 206010047571 Visual impairment Diseases 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000004393 visual impairment Effects 0.000 description 2
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- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 210000000003 hoof Anatomy 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000011197 physicochemical method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The invention discloses a method and a device for controlling pressure output of a chip mounter, which belong to the technical field of intelligent equipment and comprise the following steps: a plurality of pressure sensors which are uniformly distributed are arranged, real-time pressure data extruded by the chip mounter are monitored, and the pressure data are fed back after being processed; dynamically regulating and controlling a vacuum pump to provide vacuum suction to the electronic element during the patch so as to maintain the fluctuation of pressure data in a constant range; controlling the current of the annular array electromagnet, accurately controlling pressure data during the patch by the magnetic force change of the annular array electromagnet, and cutting off the vacuum suction of the vacuum pump after the patch is completed; when the positions of the patches are misplaced, instantaneous patch recovery is carried out by starting the power electromagnet, and the vacuum pumps are synchronously communicated. According to the invention, the instant patch recovery is carried out through the power electromagnet, and the vacuum pump is synchronously communicated, so that the defect that the response period of the vacuum pump is spaced can be overcome, and the operation frequency of the patch is improved.
Description
Technical Field
The invention belongs to the technical field of intelligent equipment, and particularly relates to a pressure output control method and device of a chip mounter.
Background
The chip mounter is a complex of machine-electricity-light and computer control technology, is a precise working robot, fully plays the high technical achievements of modern precise machinery, electromechanical integration, photoelectric combination and computer control technology, realizes high-speed, high-precision and intelligent electronic assembly manufacturing equipment, rapidly and accurately pastes and places various electronic elements at appointed bonding pad positions on a circuit board through the functions of moving a mounting head to pick up, displace, align, place and the like, and is generally configured behind a dispensing machine or a screen printer.
In the process of carrying out the paster operation on the electronic component by the surface mounting machine, the negative pressure is adopted to act for picking, the picking and placing control are carried out through the on-off control of the negative pressure air flow in the picking process, the paster operation is realized by matching with the height of the main arm, however, in the on-off process of the negative pressure air flow, a certain time is needed for picking up the electronic component in order to form a negative pressure adsorption state, namely, the response window period is generally based on the requirement of the adsorption pressure of the electronic component, the gas flow rate generated by the vacuum pump is limited, the gas flow rate cannot be increased through increasing the negative pressure, the formation of the negative pressure state is accelerated, and the response time of the negative pressure adsorption state is reduced. Therefore, the pick-up form of the chip mounter at present limits the working efficiency of the chip mounter to a certain extent under the working of adapting to high-speed automatic chip mounting.
The present invention has been made in view of this.
Disclosure of Invention
In order to solve the technical problems, the invention provides the following technical proposal, and the basic conception is as follows:
in a first aspect of the embodiment of the present invention, a method for controlling pressure output of a chip mounter is provided, which is characterized by comprising the following steps:
a plurality of pressure sensors which are uniformly distributed are arranged, real-time pressure data extruded by the chip mounter are monitored, and the pressure data are fed back after being processed;
Dynamically regulating and controlling a vacuum pump to provide vacuum suction to an electronic element during the patch so as to maintain the fluctuation of the pressure data in a constant range;
controlling the current of the annular array electromagnet, accurately controlling the pressure data when the annular array electromagnet is attached by the magnetic force change of the annular array electromagnet, and cutting off the vacuum suction force of the vacuum pump after the attachment is completed;
when the positions of the patches are misplaced, the power electromagnet is started to carry out instantaneous patch recovery, and the vacuum pump is synchronously communicated;
and repeating the control process of the annular array electromagnet, and re-attaching the patch.
As a further proposal of the embodiment of the invention, the pressure sensors are uniformly distributed in a ring shape and/or a polygon shape, the pressure data monitored by the pressure sensors are continuously monitored by an established data transfer node, the stress states of the pressure data in different directions are dynamically analyzed, and the dynamic warning of the adsorption state of the electronic element is carried out in the process of pasting.
As a further scheme of the embodiment of the invention, the annular array electromagnet and the power electromagnet are controlled by electromagnetic force by one current controller and/or a plurality of current controllers.
As a further scheme of the embodiment of the invention, the data transfer node, the current controller and the vacuum pump are all logically controlled by a unified dispatching terminal, and the data transfer node is dynamically alerted and fed back to the unified dispatching terminal.
As a further proposal of the embodiment of the invention, the fluctuation range of the pressure data maintained by the vacuum suction of the vacuum pump comprises 0.001-0.003kgf/cm < 2 >, and the vacuum suction of the vacuum pump is controlled to be cut off through the electromagnetic valve controlled by the unified dispatching terminal by the pipeline erection.
In a second aspect of the embodiment of the present invention, there is provided a pressure output control device of a chip mounter, including:
A housing;
A jog end;
The micro-motion end part is positioned at the bottom of the shell and fixedly connected with the shell, and is used for communicating the shell with external gas and monitoring the laminating pressure and/or the pressing pressure when the patch is monitored and precisely controlling the laminating pressure and/or the pressing pressure;
A transient pressure regulating component;
the instantaneous pressure regulating and controlling component is positioned on the inner wall of the shell and is attached to the inner wall of the shell, and the instantaneous pressure regulating and controlling component is used for rapidly generating vacuum suction to adsorb electronic elements so as to fill the response period of the vacuum suction of the vacuum pump;
a power assembly;
the power component is respectively positioned on the surfaces of the shell and the instantaneous pressure regulating component and is used for controlling the movement of the instantaneous pressure regulating component through electromagnetic force.
As a further aspect of the embodiment of the present invention, further includes:
a constant pressure component;
the constant pressure component is positioned on the inner wall of the shell and is attached to the shell, and the constant pressure component axially slides on the inner wall of the instantaneous pressure regulating component and is used for balancing the upper limit value of the vacuum pressure of the inner wall of the shell;
the constant pressure assembly comprises a plurality of constant pressure holes formed in the inner wall of the shell, a pressing ring sliding on the inner wall of the instantaneous pressure regulating assembly is arranged at the position of each constant pressure hole in a laminating mode, and a balance ring used for balancing weights is fixed at the top of the pressing ring.
As a further scheme of the embodiment of the invention, the lower surface of the shell is provided with a mounting port for connecting the micro-motion end part, and the surface of the shell is provided with a connector for connecting the vacuum pump;
The micro-motion end part comprises a connecting part which is in threaded fixation with the mounting opening, and a pressure head is arranged on the surface of the connecting part in a sliding manner;
The inner wall of the pressure head is fixed with a beam cover which is attached and slides on the inner wall of the connecting part, and the bottom of the connecting part is fixed with a sealing ring which is matched with the limiting beam cover;
A plurality of pressure sensors are fixed on the lower surface of the sealing ring, and springs are jointly fixed between the pressure sensors and the inner wall of the pressure head;
An end shield fixed with the shell is attached and supported on the surface of the pressure head, and an annular array electromagnet for adsorbing the pressure head is arranged on the inner wall of the end shield;
the surface of the connecting part is sleeved with a sliding cylinder which is used for matching with the pressure head to slide;
The rubber ring used for being closely attached to the patch is installed at the bottom of the pressure head.
As a further scheme of the embodiment of the invention, the instantaneous pressure regulating and controlling assembly comprises a supporting ring fixed on the inner wall of the shell, a valve plate which is attached to and slides with the inner wall of the shell is supported on the upper surface of the supporting ring, a plurality of air passing holes for air flow are formed in the surface of the valve plate, and unidirectional valve plates for controlling the air flow direction are arranged on the positions of the air passing holes on the surface of the valve plate.
As a further scheme of the embodiment of the invention, the power assembly comprises a metal sheet fixed on the surface of the valve plate, and further comprises a power electromagnet fixedly matched with the metal sheet for adsorption and positioned on the inner wall of the shell, and a ring sleeve for supporting the valve plate is circumferentially arranged on the surface of the power electromagnet.
By adopting the technical scheme, the invention has the following technical effects:
According to the invention, the dynamic monitoring of the adsorption state of the electronic element is carried out by adopting a plurality of pressure sensors, the suction force of the constant vacuum pump is provided, when the positions of the patches are misplaced, the vacuum pump is communicated, and meanwhile, the power electromagnet is started to drive the valve plate to move under the cooperation of the metal sheets, so that when the valve plate moves, a negative pressure space is formed based on the lower part, and when the vacuum pump is communicated with the hollow window, the air in the shell is pumped out, so that the negative pressure effect formed by the vacuum pump and the valve plate is in seamless connection, and the defect that the response period is intermittent is overcome, so that the operation frequency of the vacuum pump is improved.
The monitoring of the adsorption state of the power element can be realized, and the abnormal record can be caused by the deviation or irregularity of one side due to the differential data of the pressure sensors, so that the calibration operation is convenient.
Through adopting annular array electro-magnet to the pressure head absorption, make it can be comparatively accurate control pressure head to the pressing force way of electric power component, spring pull pressure sensor obtains pressing force data simultaneously, and the vacuum pump cuts the intercommunication through the solenoid valve with the shell this moment, realizes the paster operation, and this kind of mode presses down simple and conveniently, and pressing force can carry out accurate regulation to accuse, is favorable to electric power component's quality assurance.
When the patch is operated, the unified dispatching terminal regulates and controls the current controller to set the flowing current of the annular array electromagnet, so that the electromagnetic force of the annular array electromagnet can be accurately regulated, the pressure head is adsorbed under the electromagnetic force, the pressure head counteracts the pressure data under the electromagnetic force, the spring is further pulled, the pressure head is reset when the pressure value of the pressure sensor is changed to return to zero, when the spring is further stretched, the pressure change data of the pressure head is in direct proportion to the applied tension of the spring, the distance of the small-amplitude applied pressure can be directly known, the applied pressure can be simultaneously mastered by combining the current of the annular array electromagnet, the small-amplitude pressing distance and the pressure can be accurately judged, accurate patch pressure control can be realized, the patch is simpler in structure, the use requirement of various conditions is realized, and the accuracy and the reliability are improved.
The following describes the embodiments of the present invention in further detail with reference to the accompanying drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification, illustrate the disclosure and together with the description serve to explain, but do not limit the disclosure. In the drawings:
fig. 1 is a flowchart of a method for controlling pressure output of a chip mounter according to an embodiment of the present invention;
fig. 2 is a control process display diagram of a pressure output control method of a chip mounter according to an embodiment of the present invention;
fig. 3 is a schematic perspective view of a pressure output control device of a chip mounter according to an embodiment of the present invention;
Fig. 4 is a schematic cross-sectional structure diagram of a pressure output control device of a chip mounter according to an embodiment of the present invention;
fig. 5 is a schematic cross-sectional view of another view angle of a pressure output control device of a chip mounter according to an embodiment of the present invention;
Fig. 6 is a schematic cross-sectional structural column diagram of a micro-motion end portion of a pressure output control device of a chip mounter according to an embodiment of the present invention;
Fig. 7 is a schematic diagram of the principle of detecting the weight of a power element and adjusting pressure data by a micro-motion end portion of a pressure output control device of a chip mounter according to an embodiment of the present invention.
Wherein the reference numerals have the following meanings:
1. a housing; 2. a mounting port; 3. a jog end; 31. a connection part; 32. sealing rings; 33. a pressure head; 34. annular array electromagnet; 35. a spring; 36. a pressure sensor; 37. a beam cover; 38. a slide cylinder; 39. an end shield; 4. a transient pressure regulating component; 41. a valve plate; 42. a support ring; 43. a wind hole; 44. a one-way valve plate; 5. a power assembly; 51. a power electromagnet; 52. a metal sheet; 53. a ring sleeve; 6. a constant pressure component; 61. a constant pressure hole; 62. a compression ring; 63. a balance ring; 7. a joint; 8. a vacuum pump; 9. a data transfer node; 10. a current controller; 11. uniformly scheduling terminals; 12. a rubber ring.
Detailed Description
In order that those skilled in the art will better understand the present invention, a detailed description of embodiments of the present invention will be provided below, together with the accompanying drawings, wherein it is evident that the embodiments described are only some, but not all, of the embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
In the process of carrying out the paster operation on the electronic component by the paster machine, the electronic component is picked up by adopting the negative pressure effect, the picking and placing control is carried out by the on-off control of the negative pressure air flow in the picking process, the paster operation is realized by matching the height of the main arm, however, in the on-off process of the negative pressure air flow, a certain time is needed for picking up the electronic component by forming the negative pressure adsorption state, namely, the response window period is realized. Therefore, the pick-up form of the chip mounter at present limits the working efficiency of the chip mounter to a certain extent under the working of adapting to high-speed automatic chip mounting.
In order to solve the technical problems, embodiments of the present invention are specifically described with reference to the accompanying drawings.
Example 1
Referring to fig. 1 and 2, fig. 1 and 2 are a flowchart and a control process showing a control method of pressure output of a chip mounter according to an embodiment of the present invention, and in combination with fig. 1 and 2, the embodiment provides a control method of pressure output of a chip mounter, including the following steps:
S101, arranging a plurality of uniformly distributed pressure sensors 36, monitoring real-time pressure data extruded by a chip mounter, and feeding back the processed pressure data;
In particular, the pressure sensor (Pressure Transducer) is a device or apparatus that senses the pressure signal and converts the pressure signal to a usable output electrical signal according to a certain law. Pressure sensors are generally composed of pressure sensitive elements and signal processing units and are widely used in various industrial self-control environments.
In particular, the plurality of pressure sensors 36 are uniformly distributed, so as to maintain a relatively stable and balanced supporting effect on the ram 33.
S102, dynamically regulating and controlling the vacuum pump 8 to provide vacuum suction force to the electronic component when the patch is applied so as to maintain the fluctuation of the pressure data in a constant range.
Specifically, the vacuum pump 8 is a device or equipment for pumping air from a pumped container by mechanical, physical, chemical or physicochemical methods to obtain vacuum, and is a device for improving, generating and maintaining vacuum in a certain closed space by various methods, which has the function of pumping gas molecules from a vacuum chamber and reducing the gas pressure in the vacuum chamber to achieve the required vacuum degree. Different vacuum system configurations are required to be selected for achieving the process indexes, the working efficiency and the equipment service life requirements of different products and different vacuum sections.
It can be understood that the vacuum suction of the vacuum pump 8 can be dynamically regulated and controlled, and the values of stopping, maintaining the working vacuum pressure and halving the working vacuum pressure are adopted in the sleep state, the running state and the standby state respectively, so that an engineer still can independently regulate and control the state of the vacuum pump 8 according to the actual production and use requirements and the factory specifications during actual use.
Specifically, maintaining pressure data to fluctuate within a constant range, the pressure data to be maintained always needs to be larger than the maximum vacuum suction value grasped by the power element.
S103, controlling the current of the annular array electromagnet 34, accurately controlling the pressure data during the pasting of the annular array electromagnet 34 by the magnetic force change of the annular array electromagnet 34, and cutting off the vacuum suction force of the vacuum pump 8 after the pasting is completed.
Specifically, an electromagnet is a device for generating electromagnetic by energizing, a conductive winding matched with the power of the electromagnet is wound outside an iron core, and a coil with current is magnetic like a magnet. When the electromagnet is electrified, the electromagnet has magnetism, and the magnetism disappears after the electromagnet is powered off, so that the electromagnet is generally made into a strip shape or a hoof shape, and the iron core is easier to magnetize.
Specifically, in the moment of controlling the electromagnetic force of the annular array electromagnet 34 and the pressure of the patch, the vacuum suction is coordinated and closed, so that the patch is matched at one moment.
S104, when the positions of the patches are misplaced, the power electromagnet 51 is started to conduct instantaneous patch recovery, and the vacuum pump 8 is synchronously communicated.
Specifically, the power assembly 5 using the power electromagnet 51 can drive the transient pressure regulating and controlling assembly 4, so as to realize vacuum adsorption grabbing of the electric power element, namely the patch, and then connect the negative pressure attraction response of the vacuum pump 8, so that the connection is completed, and quick grabbing response is realized.
S105, repeating the control process of the annular array electromagnet 34, and re-attaching the patch.
According to the invention, the dynamic monitoring of the adsorption state of the electronic element is carried out by adopting a plurality of pressure sensors, the suction force of the constant vacuum pump is provided, when the positions of the patches are misplaced, the vacuum pump is communicated, and meanwhile, the power electromagnet is started to drive the valve plate to move under the cooperation of the metal sheets, so that when the valve plate moves, a negative pressure space is formed based on the lower part, and when the vacuum pump is communicated with the hollow window, the air in the shell is pumped out, so that the negative pressure effect formed by the vacuum pump and the valve plate is in seamless connection, and the defect that the response period is intermittent is overcome, so that the operation frequency of the vacuum pump is improved.
As a further scheme of the embodiment of the present invention, the pressure sensors 36 are uniformly distributed in a ring shape and/or a polygon shape, and the pressure data monitored by the pressure sensors 36 are continuously monitored by one built data transfer node 9, and the stress states of the pressure data in different directions are dynamically analyzed, and the dynamic alert of the adsorption state of the electronic component is performed in the process of attaching.
Specifically, the data transfer node 9 is configured to transfer pressure data of the pressure sensor 36 to the host computer, and the host computer can monitor the pressure data. Further, by providing the pressure sensors 36 and uniformly distributing the plurality of pressure sensors 36, the adsorption state of the power element can be controlled more uniformly when the power element is adsorbed. One side of the adsorption device is more tightly adsorbed, and the other side of the adsorption device is more floating, so that the adsorption state can be accurately provided.
As a further solution of the embodiment of the present invention, the annular array electromagnet 34 and the power electromagnet 51 are controlled by electromagnetic force by one current controller 10 and/or a plurality of current controllers 10.
Specifically, the current controller 10 may control the starting, regulating, braking and reversing of the motor by changing the wiring of the main circuit or the control circuit and changing the resistance value in the circuit in a predetermined order, thereby controlling the starting, regulating, braking and reversing of the annular array electromagnet 34 and the power electromagnet 51.
Specifically, by setting the current controller 10, the current controller 10 is controlled by a unified dispatching center, so that the electromagnetic force of the power electromagnet 51 and the annular array electromagnet 34 can be accurately regulated.
As a further scheme of the embodiment of the present invention, the data transfer node 9, the current controller 10 and the vacuum pump 8 are all logically controlled by a unified scheduling terminal 11, and the data transfer node 9 is dynamically alerted and fed back to the unified scheduling terminal 11.
Specifically, the unified scheduling terminal 11 may be the above-mentioned upper computer, or may be other control devices that can implement the same control, which is not limited herein.
Specifically, the unified scheduling terminal 11 is arranged to serve as an electrically-controlled intelligent terminal to provide logic control and man-machine interaction feedback, and is used as a logic control node for pressure output control of the chip mounter.
As a further scheme of the embodiment of the invention, the fluctuation range of the pressure data maintained by the vacuum suction force of the vacuum pump 8 comprises 0.001-0.003kgf/cm < 2 >, and the vacuum suction force of the vacuum pump 8 is controlled to be cut off through a solenoid valve controlled by the unified dispatching terminal 11 through pipeline erection.
Specifically, the suction force of the vacuum pump 8 is kept in a continuous state, so that the vacuum pump is kept in a connected suction state, and the electromagnetic valve is controlled to operate on and off so that the vacuum pump is kept in a constant suction force, so that the fluctuation range of the attaching pressure is reduced, and the whole state of the vacuum pump is kept in a relatively stable state.
Based on the method, the technical problems and related optimization proposed by the background are solved, and the following specific devices are adopted for matching.
Referring to fig. 3-7, the present embodiment further provides a pressure output control device of a chip mounter, including:
A housing 1;
Specifically, the shell 1 adopts a bucket-shaped structure, so that the effect of increasing suction force can be realized to a certain extent, and meanwhile, the inner space of the shell 1 can be kept in a relatively closed state, so that a stable negative pressure environment is created.
A jog end 3;
The micro-motion end part 3 is located at the bottom of the casing 1 and is fixedly connected with the casing 1, and is used for communicating the casing 1 with external air and laminating pressure and/or pressing pressure when monitoring the patch, and precisely controlling the laminating pressure and/or the pressing pressure.
It can be understood that the micro-motion end portion 3 has the functions of detecting the weight of the electric element, i.e. the patch, precisely controlling the pressure and the pressing distance, and stably attaching the electric element,
A transient pressure regulating and controlling component 4;
the instantaneous pressure regulating and controlling component 4 is located on the inner wall of the shell 1 and is attached to the inner wall of the shell 1, and the instantaneous pressure regulating and controlling component 4 is used for rapidly generating vacuum suction to adsorb electronic components so as to fill the response period of the vacuum suction of the vacuum pump 8.
A power assembly 5;
wherein, the power component 5 is respectively positioned on the surfaces of the shell 1 and the instantaneous pressure regulating component 4, and is used for controlling the movement of the instantaneous pressure regulating component 4 through electromagnetic force.
As a further solution of the embodiment of the present invention, the pressure output control device of the chip mounter further includes:
A constant pressure component 6;
The constant pressure component 6 is located on the inner wall of the housing 1 and is attached to the housing 1, and the constant pressure component 6 axially slides on the inner wall of the instantaneous pressure regulating component 4, so as to balance the upper limit value of the vacuum pressure of the inner wall of the housing 1;
The constant voltage assembly 6 comprises a plurality of constant voltage holes 61 formed in the inner wall of the shell 1, a pressing ring 62 sliding on the inner wall of the instantaneous pressure regulating assembly 4 is arranged at the position of the constant voltage holes 61 in a fitting mode, and a balance ring 63 for balancing weights is fixed at the top of the pressing ring 62.
Further, the constant pressure hole 61 of the constant pressure assembly 6 is blocked by the pressure ring 62, and meanwhile, the blocking force of the pressure ring 62 is provided by the balance ring 63, so that the balance rings 63 with different weights can limit the maximum negative pressure suction force of the electric power device.
As a further scheme of the embodiment of the invention, the lower surface of the shell 1 is provided with a mounting port 2 for connecting the micro-motion end part 3, and the surface of the shell 1 is provided with a joint 7 for connecting the vacuum pump 8; .
Wherein, through setting up the installing port 2, can be convenient right the fine motion tip 3 is dismantled and the reservation ground of installation to play the effect of convenient dismantlement maintenance and maintenance.
The jogging end 3 comprises a connecting part 31 which is in threaded fixation with the mounting port 2, and a pressure head 33 is slidably arranged on the surface of the connecting part 31.
The inner wall of the pressure head 33 is fixed with a beam cover 37 that slides on the inner wall of the connecting portion 31, and the bottom of the connecting portion 31 is fixed with a seal ring 32 that is used for matching with the limit beam cover 37.
Specifically, a plurality of pressure sensors 36 are fixed on the lower surface of the seal ring 32, and springs 35 are fixed between the pressure sensors 36 and the inner wall of the ram 33.
It will be appreciated that the force applied to the pressure sensor 36 by the spring 35 enables displacement while maintaining a change in the pressure value, and that the change in the length of the spring 35 enables more accurate control of the pressure increase or decrease of the pressure sensor 36.
Further, an end shield 39 fixed to the housing 1 is attached to and supported by the surface of the ram 33, and an annular array electromagnet 34 for attracting the ram 33 is mounted on the inner wall of the end shield 39.
Further, the end shield 39 is operative to mount the annular array of electromagnets 34 and has a spacing and guiding engagement with the ram 33.
In addition, the surface of the connecting portion 31 is further sleeved with a sliding cylinder 38 for sliding in cooperation with the ram 33, wherein the sliding cylinder 38 is used as a cooperation sleeve inside the end shield 39 to maintain the limit sliding characteristic of the ram 33.
Further, the rubber ring 12 used for being closely attached to the patch is installed at the bottom of the pressure head 33, and the rubber ring 12 is located at the bottom of the pressure head 33, so that the attaching degree of the pressure head and the power element can be enhanced.
As a further scheme of the embodiment of the invention, the transient pressure regulating and controlling assembly 4 comprises a supporting ring 42 fixed on the inner wall of the housing 1, a valve plate 41 which is attached to and slides on the inner wall of the housing 1 is supported on the upper surface of the supporting ring 42, a plurality of air through holes 43 for air circulation are formed on the surface of the valve plate 41, and unidirectional valve plates 44 for controlling the air flow direction are arranged on the surface of the valve plate 41 at the positions of the air through holes 43. The support ring 42 carries out limit guiding on the inner wall of the compression ring 62, and simultaneously supports the valve plate 41, the valve plate 41 moves downwards, the air passing hole 43 of the one-way valve plate 44 is in an air passing state, when the valve plate 41 moves upwards, the one-way valve plate 44 keeps the air passing hole 43 in a closed state, the vacuum pump 8 pumps air flow, and the air flow pushes the one-way valve plate 44 on the surface of the air passing hole 43 to be in a communicating state.
As a further solution of the embodiment of the present invention, the power assembly 5 includes a metal sheet 52 fixed on the surface of the valve plate 41, the power assembly 5 further includes a power electromagnet 51 fixed on the inner wall of the housing 1 and matched with the metal sheet 52 for adsorption, and a ring 53 for supporting the valve plate 41 is disposed around the surface of the power electromagnet 51.
Further, the metal sheet 52 is used as an adsorption fit with the power electromagnet 51, and has the advantages of low weight, high adsorption degree, convenience in use and the like, and the power electromagnet 51 supports the valve plate 41 by using the loop 53 in the process of adsorbing the metal sheet 52 by adopting the loop 53, so that the impact is effectively prevented, and the use stability is maintained.
The theory of the method is combined with the support of the related chip mounter pressure output control device, and it can be understood that:
when the automatic control device is actually used, when the automatic control device is started by the vacuum pump 8, the vacuum pump 8 is in butt joint communication with the joint 7 through a pipeline with the on-off state controlled by the electromagnetic valve operated by the unified dispatching terminal 11, at the moment, external air flow is pumped into the shell 1 through the beam cover 37 by the vacuum pump 8, meanwhile, the air flow is pumped out through the joint 7 after the top-opening one-way valve plate 44 passes through the air passing hole 43, the mechanical arm installed on the shell 1 moves to the upper part of a corresponding electric element along with the movement of the mechanical arm, the rubber ring 12 is in contact with the corresponding electric element, at the moment, due to the action of negative pressure, the rubber ring 12 and the electric element are in a tight joint state, meanwhile, the pressure head 33 is subjected to pressure to squeeze the pressure sensor 36 through the spring 35, at the moment, the pressure data received at different positions are collected to the data transfer node 9 in a unified mode, the grasping state of the electric element is mastered by the layout position of the data transfer node 9 corresponding to the pressure sensor 36, when the pressure data at the position is lower, the pressure data at the position, the gravity center is offset possibly occurs, the gravity center is formed, the situation of uneven stress is formed, the auxiliary judgment machine vision system is carried out, the auxiliary vision system is carried out, the condition is carried out, the abnormal vision system is kept, the system is normally, the system is in operation is normally, and the system is kept in the state when the abnormal vision system is in operation, and the state is kept, and the system is in the normal operation.
Example two
Substantially the same as in embodiment one, further:
the above description is directed to the coordination between the pressure sensor 36 and the vacuum pump 8.
In a further use state, the pressure head 33 presses the spring 35 to shrink under the negative pressure adsorption state of the electric power element, at this time, by starting the annular array electromagnet 34 to adsorb the pressure head 33, the pressure applied by the spring 35 is further counteracted, so that the pressure head 33 can move and extrude the electric power element downwards, the value of the pressure sensor 36 is synchronously changed by the spring 35 based on the change of the downward moving distance of the pressure head 33, so that the pressing operation of the electric power element is realized under the condition that the adsorption of the vacuum pump 8 is not attenuated, and meanwhile, the current of the annular array electromagnet 34 is regulated and controlled by the current controller 10, so that the pressure of the pressure head 33 can be controlled, and meanwhile, the pressure sensor 36 is used for carrying out real-time control on the pressing force, so as to achieve accurate control and adjustment of the pressure.
Example III
Substantially the same as in embodiment one, further:
the above description of the accurate control of the pressure of the ram 33 is based on the pressure sensor 36 and the annular array electromagnet 34.
Based on the further extension of the two points, after the electric power element is placed, the electromagnetic valve controlled by the unified dispatching terminal 11 cuts off the communication state between the vacuum pump 8 and the connector 7, at the moment, the annular array electromagnet 34 is closed, the patch operation of the electric power element is completed, when the patch needs to be grabbed, the power electromagnet 51 is started, the adsorption metal sheet 52 is started, the metal sheet 52 is moved with the valve plate 41, at the moment, the through-air hole 43 is blocked by the one-way valve sheet 44, so that the position of the beam cover 37 forms negative pressure, the electric power element is adsorbed by matching with the rubber ring 12, and the continuous adsorption of the electric power element is replaced by the negative pressure suction of the vacuum pump 8 in the time less than one second, so that the response time is greatly improved, and the overall equipment patch speed is improved.
Based on the above three embodiments, during the use, because the electric power component is adsorbed under the negative pressure, when the internal pressure of the housing 1 reaches the allowed maximum negative pressure value, the external air flow enters the housing 1 through the constant pressure hole 61, and then the pressure ring 62 is pushed by the air flow to move upwards, the external air flow enters through the constant pressure hole 61, and when the negative pressure is smaller than the gravity of the balance ring 63, the constant pressure hole 61 is plugged by the pressure ring 62 again, so that the mode can limit the maximum suction of the use range through the gravity model of the balance ring 63, and the damage of the electric power component is avoided.
Working principle:
When the unified dispatching terminal 11 is used, the current controller 10 is started to supply power to the power electromagnet 51, so that the power electromagnet 51 adsorbs the metal sheet 52 until the valve plate 41 rapidly moves and impacts the annular sleeve 53, the power assembly 5 drives the instantaneous pressure regulating assembly 4, when the valve plate 41 rapidly moves upwards, the one-way valve plate 44 seals the air passing hole 43, the valve plate 41 of the unified dispatching terminal enters the outside air flow into the shell 1 through the connecting part 31 and the beam cover 37 of the inching end part 3, and then the electric elements are adsorbed, after the valve plate 41 contacts the annular sleeve 53, the power electromagnet 51 is powered off, so that the valve plate 41 is reset downwards under the action of gravity, and the process is instantaneous start-stop control of the power electromagnet 51.
It should be noted that, the pipe connecting the vacuum pump 8 and the joint 7 preferably adopts a bellows, and a solenoid valve directly controlled by the unified dispatching terminal 11 is disposed at the middle section of the pipe wall of the pipe, the junction of the bellows near one side of the joint 7 and the joint 7 should be kept in communication by using a tee, a non-inlet one-way valve is installed at one end of the tee, and when the valve plate 41 moves upwards, based on the closed state of the solenoid valve, the closed air flow above the valve plate 41 is discharged through the tee and the one-way valve.
In this embodiment, the vacuum pump 8 is driven by the unified dispatching terminal 11, and at the same time, the electromagnetic valve connected with the joint 7 by the vacuum pump 8 is opened, so that a negative pressure state is formed inside the housing 1, the synchronous external air flow passes through the connecting portion 31 and the beam cover 37 of the micro-motion end portion 3, enters the housing 1, and then passes through the air passing hole 43 to jack up the one-way valve plate 44, so that the air flow is pumped out through the joint 7, and the valve plate 41 moves downwards and resets under the action of gravity until contacting with the supporting ring 42.
In addition, in the process that the valve plate 41 forms negative pressure upwards and forms negative pressure suction with the vacuum pump 8, when the vacuum suction is 15 times greater than the weight GH of the electric power element, the pressure head 33 is plugged based on the electric power element matched with the rubber ring 12, the negative pressure state formed by the action of the vacuum pump 8 or the valve plate 41 in the shell 1 is in a closed state, then external air flow passes through the constant pressure hole 61 to lift the pressure boosting ring 62 and maintain the balance ring 63 to synchronously lift, the external air flow enters the device for maintaining the internal vacuum suction at the maximum value and stably grabbing the electric power element, and when the vacuum suction is 15 times lower than G, the balance ring 63 acts on the pressure ring 62 to slide on the inner wall of the support ring 42 and cover the constant pressure hole 61 to keep sealing;
Referring to fig. 6, when the electric component attaching rubber ring 12 applies a pressure to the pressure head 33 under the negative pressure, the pressure head 33 slides on the surface of the slide cylinder 38 and the inner wall of the end shield 39, and simultaneously provides an applied pressure to the plurality of pressure sensors 36 through the plurality of springs 35 to monitor the grabbing state of the electric component, where it is known that the relationship between the pressure data Q obtained by the pressure sensors 36 and the weight GH and the negative pressure suction G1 of the electric component is that q=g1-GH, and the suction state that the vacuum suction is limited to be at the maximum value by the constant pressure component 6 is constant, the weights of the electric components are different, so that the weights of different electric components are within a range, and the negative pressure suction counteracts the weight of the electric component to obtain the weight data absorbed by the pressure sensors 36, so that the weight data of the electric component can be directly determined.
Meanwhile, when the patch operation is needed, a small pressure is needed to be provided for the patch, the current controller 10 is started through the unified dispatching terminal 11 to control the current flowing through the annular array electromagnet 34, so that the electromagnetic force of the annular array electromagnet can be changed, the pressure head 33 is adsorbed, the pressure head 33 counteracts the pressure data Q under the action of the electromagnetic force, the spring 35 is further pulled, when the pressure value of the pressure sensor 36 is changed to return to zero, the pressure head 33 is reset, when the spring 35 is further stretched, the pressure change data of the pressure head is in direct proportion to the pulling force exerted on the spring 35 by the pulling force length, the distance of the small-amplitude exerted pressure can be directly known, the exerted pressure can be simultaneously mastered by combining the current of the annular array electromagnet 34, the small-amplitude pressing distance and the pressure can be accurately judged, and accurate patch pressure control can be realized.
In summary, the scheme is controlled by three sections of the vacuum pump 8, the data transfer node 9 and the current controller 10 respectively, and under the driving of mutual cooperation, the high-frequency operation of the patch and the remarkable advantage of the combination of high-precision control are realized as a whole.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
In the present invention, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout includes three parallel schemes, for example "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The foregoing description is only of the preferred embodiments of the present application, and is not intended to limit the scope of the application, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.
Claims (10)
1. The pressure output control method of the chip mounter is characterized by comprising the following steps of:
a plurality of pressure sensors (36) which are uniformly distributed are arranged, real-time pressure data extruded by the chip mounter are monitored, and the pressure data are fed back after being processed;
a dynamic regulation vacuum pump (8) for providing vacuum suction to the electronic component during the patch to maintain the fluctuation of the pressure data in a constant range;
Controlling the current of the annular array electromagnet (34), accurately controlling the pressure data when the annular array electromagnet (34) is attached, and cutting off the vacuum suction of the vacuum pump (8) after the attachment is completed;
When the positions of the patches are misplaced, the power electromagnet (51) is started to carry out instantaneous patch recovery, and the vacuum pump (8) is synchronously communicated;
the control process of the annular array electromagnets (34) is repeated and the patch operation is resumed.
2. A chip mounter pressure output control method according to claim 1, wherein said pressure sensors (36) are uniformly distributed in a ring shape and/or a polygon shape, said pressure data monitored by said plurality of pressure sensors (36) are continuously monitored by an established data transfer node (9), and stress states of said pressure data in different directions are dynamically analyzed, and dynamic alert of an adsorption state of an electronic component is performed in a chip mounting process.
3. The pressure output control method of the chip mounter according to claim 1, wherein the annular array electromagnet (34) and the power electromagnet (51) are controlled by electromagnetic force by one current controller (10) and/or a plurality of current controllers (10).
4. A chip mounter pressure output control method according to claim 2 or 3, wherein the data transfer node (9), the current controller (10) and the vacuum pump (8) are all logically controlled by a unified scheduling terminal (11), and the data transfer node (9) is dynamically alerted and fed back to the unified scheduling terminal (11).
5. The method according to claim 4, wherein the fluctuation range of the pressure data maintained by the vacuum suction force of the vacuum pump (8) includes 0.001-0.003kgf/cm2, and the vacuum suction force of the vacuum pump (8) is controlled to be cut off by the solenoid valve controlled by the unified dispatch terminal (11) through the pipe erection.
6. A chip mounter pressure output control apparatus characterized by using a chip mounter pressure output control method as described in any of claims 1 to 5, comprising:
a housing (1);
a jog end (3);
The micro-motion end part (3) is positioned at the bottom of the shell (1) and is fixedly connected with the shell (1) and used for communicating the shell (1) with external gas and the laminating pressure and/or the pressing pressure when monitoring the patch and precisely controlling the laminating pressure and/or the pressing pressure;
A transient pressure regulating assembly (4);
The instantaneous pressure regulating and controlling component (4) is positioned on the inner wall of the shell (1) and is attached to the inner wall of the shell (1), and the instantaneous pressure regulating and controlling component (4) is used for rapidly generating vacuum suction to adsorb electronic elements so as to fill the response period of the vacuum suction of the vacuum pump (8);
a power assembly (5);
the power assembly (5) is respectively positioned on the surfaces of the shell (1) and the instantaneous pressure regulating and controlling assembly (4) and is used for controlling the movement of the instantaneous pressure regulating and controlling assembly (4) through electromagnetic force.
7. The die attach machine pressure output control device of claim 6, further comprising:
a constant pressure component (6);
The constant pressure component (6) is positioned on the inner wall of the shell (1) and is attached to the shell (1), and the constant pressure component (6) axially slides on the inner wall of the instantaneous pressure regulating component (4) and is used for balancing the upper limit value of the vacuum pressure of the inner wall of the shell (1);
the constant pressure assembly (6) comprises a plurality of constant pressure holes (61) formed in the inner wall of the shell (1), a pressing ring (62) sliding on the inner wall of the instantaneous pressure regulating assembly (4) is arranged at the position of each constant pressure hole (61), and a balancing ring (63) for balancing weights is fixed at the top of each pressing ring (62).
8. A chip mounter pressure output control apparatus according to claim 6 or 7, wherein a mounting port (2) for connecting said micro-motion end portion (3) is provided on a lower surface of said housing (1), and a joint (7) for connecting said vacuum pump (8) is provided on a surface of said housing (1);
The micro-motion end part (3) comprises a connecting part (31) which is in threaded fixation with the mounting port (2), and a pressure head (33) is arranged on the surface of the connecting part (31) in a sliding manner;
The inner wall of the pressure head (33) is fixed with a beam cover (37) which is attached and slides on the inner wall of the connecting part (31), and the bottom of the connecting part (31) is fixed with a sealing ring (32) which is matched with the limiting beam cover (37);
a plurality of pressure sensors (36) are fixed on the lower surface of the seal ring (32), and springs (35) are fixed between the pressure sensors (36) and the inner wall of the pressure head (33);
An end shield (39) fixed with the shell (1) is attached and supported on the surface of the pressure head (33), and an annular array electromagnet (34) for adsorbing the pressure head (33) is arranged on the inner wall of the end shield (39);
The surface of the connecting part (31) is sleeved with a sliding cylinder (38) which is used for sliding in cooperation with the pressure head (33);
the bottom of the pressure head (33) is provided with a rubber ring (12) which is used for being closely attached to the patch.
9. The pressure output control device of the chip mounter according to claim 8, wherein the instantaneous pressure regulating assembly (4) comprises a supporting ring (42) fixed on the inner wall of the casing (1), a valve plate (41) which is attached to and slides on the inner wall of the casing (1) is supported on the upper surface of the supporting ring (42), a plurality of air passing holes (43) for air to pass through are formed in the surface of the valve plate (41), and unidirectional valve plates (44) for controlling the air flow direction are arranged on the surface of the valve plate (41) at the positions of the air passing holes (43).
10. The pressure output control device of the chip mounter according to claim 9, wherein the power assembly (5) comprises a metal sheet (52) fixed on the surface of the valve plate (41), the power assembly (5) further comprises a power electromagnet (51) fixedly matched with the metal sheet (52) for adsorption and positioned on the inner wall of the casing (1), and a ring sleeve (53) for supporting the valve plate (41) is arranged on the surface of the power electromagnet (51) in a surrounding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410361704.5A CN118234218A (en) | 2024-03-28 | 2024-03-28 | Pressure output control method and device for chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410361704.5A CN118234218A (en) | 2024-03-28 | 2024-03-28 | Pressure output control method and device for chip mounter |
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| Publication Number | Publication Date |
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| CN118234218A true CN118234218A (en) | 2024-06-21 |
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| CN202410361704.5A Pending CN118234218A (en) | 2024-03-28 | 2024-03-28 | Pressure output control method and device for chip mounter |
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|---|---|---|---|---|
| JP2006286781A (en) * | 2005-03-31 | 2006-10-19 | Yamagata Casio Co Ltd | Mounting head of electronic parts, parts mounting device, and its control method |
| JP2012069836A (en) * | 2010-09-27 | 2012-04-05 | Juki Corp | Electronic component mounting device |
| CN103889202A (en) * | 2012-12-20 | 2014-06-25 | Juki株式会社 | Electronic part installation apparatus |
| CN212544450U (en) * | 2020-05-15 | 2021-02-12 | 爱景节能科技（上海）有限公司 | Central vacuum control system of SMT chip mounter |
| CN213752642U (en) * | 2020-12-29 | 2021-07-20 | 微见智能封装技术(深圳)有限公司 | Automatic chip mounter |
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2024
- 2024-03-28 CN CN202410361704.5A patent/CN118234218A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286781A (en) * | 2005-03-31 | 2006-10-19 | Yamagata Casio Co Ltd | Mounting head of electronic parts, parts mounting device, and its control method |
| JP2012069836A (en) * | 2010-09-27 | 2012-04-05 | Juki Corp | Electronic component mounting device |
| CN103889202A (en) * | 2012-12-20 | 2014-06-25 | Juki株式会社 | Electronic part installation apparatus |
| CN212544450U (en) * | 2020-05-15 | 2021-02-12 | 爱景节能科技（上海）有限公司 | Central vacuum control system of SMT chip mounter |
| CN213752642U (en) * | 2020-12-29 | 2021-07-20 | 微见智能封装技术(深圳)有限公司 | Automatic chip mounter |
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