CN118215224A - Preparation method of circuit board with thick copper circuit layer - Google Patents
Preparation method of circuit board with thick copper circuit layer Download PDFInfo
- Publication number
- CN118215224A CN118215224A CN202211627752.1A CN202211627752A CN118215224A CN 118215224 A CN118215224 A CN 118215224A CN 202211627752 A CN202211627752 A CN 202211627752A CN 118215224 A CN118215224 A CN 118215224A
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit
- circuit layer
- substrate
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 67
- 239000010949 copper Substances 0.000 title claims abstract description 67
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 71
- 239000000463 material Substances 0.000 claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 claims abstract description 31
- 239000010410 layer Substances 0.000 claims description 293
- 229920002120 photoresistant polymer Polymers 0.000 claims description 26
- 239000011889 copper foil Substances 0.000 claims description 21
- 239000011241 protective layer Substances 0.000 claims description 14
- 239000004642 Polyimide Substances 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 13
- 239000012780 transparent material Substances 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 7
- 239000004973 liquid crystal related substance Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 20
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 230000002441 reversible effect Effects 0.000 abstract description 6
- 238000011161 development Methods 0.000 abstract description 5
- 230000036961 partial effect Effects 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- 239000002585 base Substances 0.000 description 19
- 230000002829 reductive effect Effects 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008719 thickening Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The application provides a preparation method of a circuit board with a thick copper circuit layer. On the basis of the circuit substrate with the circuit manufactured, the application utilizes the light transmission property of the transparent base material layer to expose the resist film in a reverse exposure mode, and then thickens the circuit through processes such as development, copper plating and the like, thereby solving the problem of exposure offset caused by multiple exposure. In addition, the application combines the reverse exposure and the forward exposure (namely double-sided exposure), and utilizes the double-sided exposure to carry out partial exposure on the resist film, and the rest of the resist film is not exposed, thereby manufacturing the circuit board with different copper thicknesses (thick copper circuit layer and thin copper circuit layer) on the same circuit layer.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a preparation method of a circuit board with a thick copper circuit layer.
Background
With the development of intelligent devices, wireless charging coils with efficient transmission characteristics are now widely used. In order to improve the transmission power and the transmission efficiency of the wireless charging coil, the wireless charging coil generally adopts a thick copper thin-line circuit board, so that the line width and the copper thickness are increased as much as possible, the line distance is reduced, and the resistance is reduced.
However, in the prior art, in order to prepare a thick copper thin line circuit board, a method of multiple etching and multiple exposure is generally adopted, so that exposure offset is easy to generate, and thus the problems of short circuit, substandard conductive performance due to reduced line sectional area, reduced reliability (performances such as cold and hot circulation, dynamic bending, resistance test and the like), service life reduction and the like are caused.
Disclosure of Invention
In view of the above, the present application provides a method for manufacturing a circuit board with a thick copper circuit layer to solve the problem of exposure offset.
An embodiment of the present application provides a method for manufacturing a circuit board having a thick copper wiring layer, including the steps of:
providing a circuit substrate, wherein the circuit substrate comprises a base material layer and a first circuit layer arranged on the surface of the base material layer, and the base material layer is made of a transparent material;
Pressing a resist film on one side of the first circuit layer, which is away from the substrate layer, wherein the resist film comprises a plurality of first parts corresponding to gaps of the first circuit layer and a plurality of second parts corresponding to patterns of the first circuit layer;
Exposing the first part on one side of the substrate layer away from the first circuit layer;
developing and removing the second part to form a plurality of windows corresponding to the pattern of the first circuit layer;
Forming a second circuit layer in contact with the first circuit layer in the window, wherein the pattern of the second circuit layer corresponds to the pattern of the first circuit layer, and the first circuit layer and the second circuit layer form a thick copper circuit layer;
The first portion is removed.
In one embodiment, the method of preparing further comprises: and a protective layer is arranged on one side of the thick copper circuit layer, which is away from the substrate layer.
In one embodiment, the first circuit layer has a thickness of 18 μm or less and the second circuit layer has a thickness of 32 μm or more.
In one embodiment, the method for manufacturing the circuit substrate includes the steps of: providing a copper-clad plate, wherein the copper-clad plate comprises a substrate layer and a copper foil layer arranged on the surface of the substrate layer, and the transparent material comprises transparent polyimide or transparent liquid crystal high polymer; pressing a photoresist film on one side of the copper foil layer, which is away from the substrate layer; exposing the photoresist film on one side of the photoresist film, which is away from the copper foil layer, developing and etching the photoresist film, and manufacturing the copper foil layer to form a first circuit layer to obtain the circuit substrate.
An embodiment of the present application provides a method for manufacturing a circuit board having a thick copper wiring layer, including the steps of:
providing a circuit substrate, wherein the circuit substrate comprises a base material layer and a first circuit layer arranged on the surface of the base material layer, and the base material layer is made of a transparent material;
Pressing a resist film on one side of the first circuit layer, which is away from the substrate layer, and along the extending direction of the resist film, the resist film comprises a first area and a second area, wherein the first area comprises a plurality of first parts corresponding to gaps of the first circuit layer and a plurality of second parts corresponding to patterns of the first circuit layer;
Exposing the first portion and the second region on a side of the substrate layer facing away from the first wiring layer, and exposing the second region on a side of the resist film facing away from the first wiring layer;
Developing and removing the second part to form a window corresponding to part of the pattern of the first circuit layer;
Forming a second circuit layer in contact with a part of the first circuit layer in the window, wherein the first circuit layer and the part of the second circuit layer form a thick copper circuit layer, and the first circuit layer which is not in contact with the second circuit layer forms a thin copper circuit layer;
the first portion and the second region are removed.
In one embodiment, the method for manufacturing the circuit substrate includes the steps of: providing a copper-clad plate, wherein the copper-clad plate comprises a substrate layer and a copper foil layer arranged on the surface of the substrate layer, and the transparent material comprises transparent polyimide or transparent liquid crystal high polymer; pressing a photoresist film on one side of the copper foil layer, which is away from the substrate layer; exposing the photoresist film on one side of the photoresist film, which is away from the copper foil layer, developing and etching the photoresist film, and manufacturing the copper foil layer to form a first circuit layer to obtain the circuit substrate.
In one embodiment, the method for manufacturing a circuit substrate further includes the steps of: a selective organic conductive film is disposed in the gap of the first wiring layer.
In one embodiment, after the step of removing the first portion and the second region, the method further comprises: and removing the selective organic conductive film.
In one embodiment, the method of preparing further comprises: and a protective layer is arranged on one side of the thick copper circuit layer and one side of the thin copper circuit layer, which are away from the substrate layer.
In one embodiment, the first circuit layer has a thickness of 18 μm or less and the second circuit layer has a thickness of 32 μm or more.
On the basis of the circuit substrate with the circuit manufactured, the application utilizes the light transmission property of the transparent base material layer to expose the resist film in a reverse exposure mode, and then thickens the circuit through processes such as development, copper plating and the like, thereby solving the problem of exposure offset caused by multiple exposure. In addition, the application combines the reverse exposure and the forward exposure (namely double-sided exposure), and utilizes the double-sided exposure to carry out partial exposure on the resist film, and the rest of the resist film is not exposed, thereby manufacturing the circuit board with different copper thicknesses (thick copper circuit layer and thin copper circuit layer) on the same circuit layer.
Drawings
Fig. 1 to 11 are schematic cross-sectional flow diagrams of a method for manufacturing a circuit board with a thick copper circuit layer according to embodiment 1 of the present application.
Fig. 12 to 17 are schematic cross-sectional flow diagrams of the method for manufacturing a circuit board with a thick copper circuit layer according to embodiment 2 of the present application.
Fig. 18 to 24 are schematic cross-sectional flow diagrams of the method for manufacturing a circuit board with a thick copper circuit layer according to embodiment 3 of the present application.
Description of the main reference signs
Circuit boards 100, 200, 300 with thick copper wiring layers
Circuit board 10
Copper-clad plate 10a
Substrate layer 11
Copper foil layer 12
First circuit layer 13
Photoresist film 20
Resist film 30
First portion 31
Second portion 32
Windowing 33
Second circuit layer 40
Thick copper wiring layer 50
Protective layer 60
Thin copper wiring layer 70
Selective organic conductive film 80
First region 301
Second region 302
The following detailed description will further illustrate embodiments of the application in conjunction with the above-described drawings.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of the application belong. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of embodiments of the application.
In addition, descriptions such as those related to "first," "second," and the like in this disclosure are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
Embodiments of the present application are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate configurations) of the present application. Thus, differences in the shapes of the illustrations as a result, of manufacturing processes and/or tolerances, are to be expected. Thus, embodiments of the application should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. The regions illustrated in the figures are merely schematic in nature and their shapes are not intended to illustrate the actual shape of a device and are not intended to limit the scope of the present application.
Some embodiments of the present application are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without collision.
Example 1
Referring to fig. 1 to 11, the present embodiment provides a method for manufacturing a circuit board 100 with a thick copper circuit layer, which includes the following steps S10 to S70.
In step S10, referring to fig. 1 to 5, a circuit substrate 10 is provided.
Specifically, the circuit substrate 10 may be made of a copper-clad plate 10a as shown in fig. 1. The copper-clad plate 10a comprises a substrate layer 11 and a copper foil layer 12 arranged on the surface of the substrate layer 11. The material of the substrate layer 11 is transparent, which can transmit light. The transparent material may be, but is not limited to, transparent Polyimide (PI) or transparent Liquid Crystal Polymer (LCP), etc. In this embodiment, the material of the base material layer 11 is transparent polyimide.
As shown in fig. 2, a photoresist 20 is laminated to the copper foil layer 12 on the side facing away from the base material layer 11. In this embodiment, the photoresist 20 is a dry film.
As shown in fig. 3, the photoresist 20 is exposed on a side of the photoresist 20 facing away from the copper foil layer 12 to transfer an image of the first circuit layer to the photoresist 20. UV light may be blocked with an exposure negative (not shown) to protect portions of the photoresist 20 from exposure.
As shown in fig. 4, development: i.e., the unexposed photoresist 20 is removed by the alkali solution, leaving only the exposed photoresist 20.
As shown in fig. 5, etching: the etching solution reacts with the copper foil layer 12 to remove unnecessary copper, thereby obtaining the first circuit layer 13. The photoresist 20 can be removed by stripping solution to obtain the circuit substrate 10. The circuit board 10 includes a base material layer 11 and a first circuit layer 13 provided on a surface of the base material layer 11.
In step S20, referring to fig. 6, a resist film 30 is laminated on a side of the first circuit layer 13 facing away from the substrate layer 11.
As shown in fig. 6, the resist film 30 includes a plurality of first portions 31 corresponding to the gaps of the first wiring layer 13 and a plurality of second portions 32 corresponding to the pattern of the first wiring layer 13, and the first portions 31 and the second portions 32 are alternately arranged in this order. The first portion 31 is generally hexagonal in cross-section and the second portion 32 is generally trapezoidal in cross-section. The first portion 31 completely fills the gap of the first wiring layer 13.
In step S30, referring to fig. 7, the first portion 31 is exposed on a side of the substrate layer 11 away from the first circuit layer 13.
In particular, the first portion 31 may be exposed (i.e., back-exposed) with UV light on a side of the substrate layer 11 facing away from the first wiring layer 13. Since the substrate layer 11 is made of transparent PI material, the UV light can irradiate the first portion 31 of the resist film 30 corresponding to the gap of the first circuit layer 13 through the substrate layer 11, and the second portion 32 cannot be exposed due to being blocked by the pattern of the first circuit layer 13.
In step S40, referring to fig. 8, the second portion 32 (the first portion 31 is remained) is removed by developing, so as to form a plurality of windows 33 corresponding to the pattern of the first circuit layer 13. The window 33 is a blank area formed after the second portion 32 is removed, and the window 33 corresponds to the pattern of the first circuit layer 13.
In step S50, referring to fig. 9, a second circuit layer 40 contacting the first circuit layer 13 is formed in the window 33.
Specifically, copper may be plated in the window 33 to form the second wiring layer 40. The pattern of the second circuit layer 40 corresponds to the pattern of the first circuit layer 13, and the second circuit layer 40 is equivalent to thickening the first circuit layer 13. The second circuit layer 40 and the first circuit layer 13 are in contact with each other and are in zero clearance fit, and the two layers together form a thick copper circuit layer 50.
In some embodiments, the thickness of the first circuit layer 13 is less than or equal to 18 μm, and the thickness of the second circuit layer 40 is greater than or equal to 32 μm.
In step S60, referring to fig. 10, the first portion 31 is removed. The first portion 31 may be removed with a stripping solution.
In step S70, referring to fig. 11, a protective layer 60 may be further disposed on a side of the thick copper circuit layer 50 away from the substrate layer 11, so as to obtain the circuit board 100 with a thick copper circuit layer.
In this embodiment, the protective layer 60 is a cover-lay (CVL), and in other embodiments, the protective layer 60 may be a solder mask. The protective layer 60 is used for protecting the thick copper circuit layer 50 from external moisture or foreign matter scratch, etc.
Example 2
Referring to fig. 1 to 5 and fig. 12 to 17, the present embodiment provides a method for manufacturing a circuit board 200 with a thick copper circuit layer, which includes the following steps S10 to S70.
In step S10, referring to fig. 1 to 5, a circuit substrate 10 is provided. The circuit substrate 10 includes a base material layer 11 and a first circuit layer 13 disposed on a surface of the base material layer 11, wherein the base material layer 11 is made of a transparent material, and is capable of transmitting light. The transparent material may be, but not limited to, transparent polyimide or transparent liquid crystal polymer, and in this embodiment, the material of the base material layer 11 is transparent Polyimide (PI). The preparation method of the circuit substrate 10 is the same as that in embodiment 1, and will not be described here again.
In step S20, referring to fig. 12, a resist film 30 is laminated on a side of the first circuit layer 13 facing away from the substrate layer 11.
As shown in fig. 12, the resist film 30 includes a first region 301 and a second region 302 along the extending direction of the resist film 30. In this embodiment, the first region 301 is substantially the left half of the resist film, and the second region 302 is substantially the right half of the resist film 30. The first region 301 includes a plurality of first portions 31 corresponding to gaps of the first wiring layer 13 and a plurality of second portions 32 corresponding to patterns of the first wiring layer 13, and the first portions 31 and the second portions 32 are alternately arranged in order. The first portion 31 is generally hexagonal in cross-section and the second portion 32 is generally trapezoidal in cross-section. The first portion 31 completely fills a partial gap of the first circuit layer 13. The second region 302 substantially covers the right half of the first wiring layer 13 and fills the remaining gaps of the first wiring layer 13.
In step S30, referring to fig. 13, the first portion 31 and the second region 302 are exposed on a side of the substrate layer 11 away from the first circuit layer 13, and the second region 302 is exposed on a side of the resist film 30 away from the first circuit layer 13.
In particular, the first portion 31 and the second region 302 may be exposed (i.e. back-exposed) with UV light at a side of the substrate layer 11 facing away from the first line layer 13. Since the substrate layer 11 is made of transparent PI material, the UV light can irradiate the first portion 31 of the resist film 30 corresponding to the gap of the first circuit layer 13 and part of the second region 302 (i.e., the portion of the second region 302 corresponding to the gap of the first circuit layer 13) through the substrate layer 11, and the second portion 32 cannot be exposed due to being blocked by the pattern of the first circuit layer 13. The second region 302 may be exposed (i.e., forward exposed) on a side of the resist film 30 facing away from the first circuit layer 13, and the remaining portion of the second region 302 that is not exposed (i.e., a portion corresponding to the pattern of the first circuit layer 13) may be exposed, and the second region 302 may be entirely exposed. The first region 301 may be masked with an exposure mask (not shown) to prevent the second portion 32 from being exposed.
In step S40, referring to fig. 14, the second portion 32 (the first portion 31 and the second region 302 are remained) is removed by developing, so as to form a window 33 corresponding to a part of the pattern of the first circuit layer 13. The window 33 is a blank area formed after the second portion 32 is removed, and the window 33 corresponds to a part of the pattern of the first circuit layer 13.
In step S50, referring to fig. 15, a second circuit layer 40 contacting a portion of the first circuit layer 13 is formed in the window 33.
Specifically, copper may be plated in the window 33 to form the second wiring layer 40. The pattern of the second circuit layer 40 corresponds to the pattern of a part of the first circuit layer 13, and the second circuit layer 40 is equivalent to thickening a part of the first circuit layer 13. The second wiring layer 40 and a portion of the first wiring layer 13 are in contact with each other and zero clearance fit, which together form a thick copper wiring layer 50. The remaining first wiring layer 13, which is not in contact with the second wiring layer 40, forms a thin copper wiring layer 70.
In some embodiments, the thickness of the first circuit layer 13 is less than or equal to 18 μm, and the thickness of the second circuit layer 40 is greater than or equal to 32 μm.
In step S60, referring to fig. 16, the first portion 31 and the second region 302 are removed. The first portion 31 and the second region 302 may be removed with a stripping solution.
In step S70, referring to fig. 17, a protective layer 60 may be further disposed on the side of the thick copper circuit layer 50 and the thin copper circuit layer 70 facing away from the base material layer 11, so as to obtain the circuit board 200 with a thick copper circuit layer.
In this embodiment, the protective layer 60 is a cover-lay (CVL), and in other embodiments, the protective layer 60 may be a solder mask. The protective layer 60 is used to protect the thick copper circuit layer 50 and the thin copper circuit layer 70 from outside moisture or foreign matter scratches, etc.
Example 3
Referring to fig. 1 to 5 and fig. 18 to 24, the present embodiment provides a method for manufacturing a circuit board 300 with a thick copper circuit layer, which includes the following steps S10 to S80.
In step S10, referring to fig. 1 to 5, a circuit substrate 10 is provided. The structure and the preparation method of the circuit substrate 10 are the same as those in embodiment 1, and will not be described here again.
In step S20, referring to fig. 18, a selective organic conductive film (SOC) 80 is disposed in the gap of the first circuit layer 13. In the present embodiment, the selective organic conductive film 80 is a transparent selective organic conductive film 80. The selective organic conductive film 80 can solve the problem that the isolated wiring (for example, the rightmost wiring in fig. 18) cannot be copper plated, while ensuring the need for conductivity and avoiding the influence of the formation of unnecessary coating layers on the copper surface of the first wiring layer 13 to the reliability.
In step S30, referring to fig. 19, a resist film 30 is laminated on a side of the first circuit layer 13 facing away from the substrate layer 11.
As shown in fig. 19, the resist film 30 includes a first region 301 and a second region 302 along the extending direction of the resist film 30. In this embodiment, the first region 301 is substantially the left half of the resist film, and the second region 302 is substantially the right half of the resist film 30. The first region 301 includes a plurality of first portions 31 corresponding to gaps of the first wiring layer 13 and a plurality of second portions 32 corresponding to patterns of the first wiring layer 13, and the first portions 31 and the second portions 32 are alternately arranged in order. The first portion 31 is generally hexagonal in cross-section and the second portion 32 is generally trapezoidal in cross-section. The first portion 31 is located on a side of the selective organic conductive film 80 facing away from the base material layer 11, and completely fills a part of the gap of the first wiring layer 13. The second region 302 substantially covers the right half of the first wiring layer 13 and fills the remaining gaps of the first wiring layer 13.
In step S40, referring to fig. 20, the first portion 31 and the second region 302 are exposed on a side of the substrate layer 11 away from the first circuit layer 13, and the second region 302 is exposed on a side of the resist film 30 away from the first circuit layer 13.
In particular, the first portion 31 and the second region 302 may be exposed (i.e. back-exposed) with UV light at a side of the substrate layer 11 facing away from the first line layer 13. Since the substrate layer 11 is made of transparent PI material, the UV light can irradiate the first portion 31 of the resist film 30 corresponding to the gap of the first circuit layer 13 and part of the second region 302 (i.e., the portion of the second region 302 corresponding to the gap of the first circuit layer 13) through the substrate layer 11, and the second portion 32 cannot be exposed due to being blocked by the pattern of the first circuit layer 13. The second region 302 may be exposed (i.e., forward exposed) on a side of the resist film 30 facing away from the first circuit layer 13, and the remaining portion of the second region 302 that is not exposed (i.e., a portion corresponding to the pattern of the first circuit layer 13) may be exposed, and the second region 302 may be entirely exposed. The first region 301 may be masked with an exposure mask (not shown) to prevent the second portion 32 from being exposed.
In step S50, referring to fig. 21, the second portion 32 (the first portion 31 and the second region 302 are reserved) is removed by developing, so as to form a window 33 corresponding to a part of the pattern of the first circuit layer 13. The window 33 is a blank area formed after the second portion 32 is removed, and the window 33 corresponds to a part of the pattern of the first circuit layer 13.
In step S60, referring to fig. 22, a second circuit layer 40 contacting a portion of the first circuit layer 13 is formed in the window 33.
Specifically, copper may be plated in the window 33 to form the second wiring layer 40. The pattern of the second circuit layer 40 corresponds to the pattern of a part of the first circuit layer 13, and the second circuit layer 40 is equivalent to thickening a part of the first circuit layer 13. The second wiring layer 40 and a portion of the first wiring layer 13 are in contact with each other and zero clearance fit, which together form a thick copper wiring layer 50. The remaining first wiring layer 13, which is not in contact with the second wiring layer 40, forms a thin copper wiring layer 70.
In some embodiments, the thickness of the first circuit layer 13 is less than or equal to 18 μm, and the thickness of the second circuit layer 40 is greater than or equal to 32 μm.
In step S70, referring to fig. 23, the first portion 31 and the second region 302 are removed, and the selective organic conductive film 80 is removed. The first portion 31 and the second region 302 may be removed with a stripping solution and the selectively organic conductive film 80 may be removed by a desmear process (Desmear).
In step S80, referring to fig. 24, a protective layer 60 may be further disposed on the side of the thick copper circuit layer 50 and the thin copper circuit layer 70 facing away from the base material layer 11, so as to obtain a circuit board 300 with a thick copper circuit layer. In this embodiment, the protection layer 60 is a cover-lay (CVL).
On the basis of the circuit substrate 10 with the circuit manufactured, the application utilizes the light transmission property of the transparent base material layer to expose the resist film 30 in a reverse exposure mode, and then thickens the circuit through processes such as development, copper plating and the like, thereby solving the problem of exposure deviation caused by multiple exposure. In addition, the present application combines the reverse exposure and the forward exposure (i.e., double-sided exposure), and the resist film 30 is partially exposed by double-sided exposure, and the rest of the resist film 30 is not exposed, thereby manufacturing a circuit board having different copper thicknesses (thick copper wiring layer 50 and thin copper wiring layer 70) on the same wiring layer.
The above description is of some embodiments of the application, but in practice the application is not limited to these embodiments. Other modifications and variations to the present application will be apparent to those of ordinary skill in the art in light of the present teachings.
Claims (10)
1. The preparation method of the circuit board with the thick copper circuit layer is characterized by comprising the following steps of:
providing a circuit substrate, wherein the circuit substrate comprises a base material layer and a first circuit layer arranged on the surface of the base material layer, and the base material layer is made of a transparent material;
Pressing a resist film on one side of the first circuit layer, which is away from the substrate layer, wherein the resist film comprises a plurality of first parts corresponding to gaps of the first circuit layer and a plurality of second parts corresponding to patterns of the first circuit layer;
Exposing the first part on one side of the substrate layer away from the first circuit layer;
developing and removing the second part to form a plurality of windows corresponding to the pattern of the first circuit layer;
Forming a second circuit layer in contact with the first circuit layer in the window, wherein the pattern of the second circuit layer corresponds to the pattern of the first circuit layer, and the first circuit layer and the second circuit layer form a thick copper circuit layer;
The first portion is removed.
2. The method of manufacturing of claim 1, further comprising: and a protective layer is arranged on one side of the thick copper circuit layer, which is away from the substrate layer.
3. The method of manufacturing according to claim 1 or 2, wherein the first wiring layer has a thickness of 18 μm or less and the second wiring layer has a thickness of 32 μm or more.
4. The manufacturing method according to claim 1 or 2, wherein the manufacturing method of the circuit substrate comprises the steps of:
providing a copper-clad plate, wherein the copper-clad plate comprises a substrate layer and a copper foil layer arranged on the surface of the substrate layer, and the transparent material comprises transparent polyimide or transparent liquid crystal high polymer;
pressing a photoresist film on one side of the copper foil layer, which is away from the substrate layer;
Exposing the photoresist film on one side of the photoresist film, which is away from the copper foil layer, developing and etching the photoresist film, and manufacturing the copper foil layer to form a first circuit layer to obtain the circuit substrate.
5. The preparation method of the circuit board with the thick copper circuit layer is characterized by comprising the following steps of:
providing a circuit substrate, wherein the circuit substrate comprises a base material layer and a first circuit layer arranged on the surface of the base material layer, and the base material layer is made of a transparent material;
Pressing a resist film on one side of the first circuit layer, which is away from the substrate layer, and along the extending direction of the resist film, the resist film comprises a first area and a second area, wherein the first area comprises a plurality of first parts corresponding to gaps of the first circuit layer and a plurality of second parts corresponding to patterns of the first circuit layer;
Exposing the first portion and the second region on a side of the substrate layer facing away from the first wiring layer, and exposing the second region on a side of the resist film facing away from the first wiring layer;
Developing and removing the second part to form a window corresponding to part of the pattern of the first circuit layer;
Forming a second circuit layer in contact with a part of the first circuit layer in the window, wherein the first circuit layer and the part of the second circuit layer form a thick copper circuit layer, and the first circuit layer which is not in contact with the second circuit layer forms a thin copper circuit layer;
the first portion and the second region are removed.
6. The method of manufacturing a circuit board according to claim 5, comprising the steps of:
providing a copper-clad plate, wherein the copper-clad plate comprises a substrate layer and a copper foil layer arranged on the surface of the substrate layer, and the transparent material comprises transparent polyimide or transparent liquid crystal high polymer;
pressing a photoresist film on one side of the copper foil layer, which is away from the substrate layer;
Exposing the photoresist film on one side of the photoresist film, which is away from the copper foil layer, developing and etching the photoresist film, and manufacturing the copper foil layer to form a first circuit layer to obtain the circuit substrate.
7. The method of manufacturing a circuit board according to claim 6, further comprising the steps of: a selective organic conductive film is disposed in the gap of the first wiring layer.
8. The method of manufacturing of claim 7, wherein after the step of removing the first portion and the second region, the method of manufacturing further comprises: and removing the selective organic conductive film.
9. The method of manufacturing according to claim 5, further comprising: and a protective layer is arranged on one side of the thick copper circuit layer and one side of the thin copper circuit layer, which are away from the substrate layer.
10. The method of manufacturing according to claim 5, wherein the first wiring layer has a thickness of 18 μm or less and the second wiring layer has a thickness of 32 μm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211627752.1A CN118215224A (en) | 2022-12-16 | 2022-12-16 | Preparation method of circuit board with thick copper circuit layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211627752.1A CN118215224A (en) | 2022-12-16 | 2022-12-16 | Preparation method of circuit board with thick copper circuit layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118215224A true CN118215224A (en) | 2024-06-18 |
Family
ID=91454387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211627752.1A Pending CN118215224A (en) | 2022-12-16 | 2022-12-16 | Preparation method of circuit board with thick copper circuit layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118215224A (en) |
-
2022
- 2022-12-16 CN CN202211627752.1A patent/CN118215224A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1677582B1 (en) | Multilayer printed wiring board | |
| US8707554B2 (en) | Method of manufacturing multilayer wiring substrate | |
| KR101195685B1 (en) | Wired circuit board and producing method thereof | |
| US8450617B2 (en) | Multilayer wiring substrate | |
| WO2009038950A2 (en) | Flexible circuit board, manufacturing method thereof, and electronic device using the same | |
| JP2006179606A (en) | Wiring circuit board | |
| US8377317B2 (en) | Method for manufacturing printed circuit board with thick traces | |
| US7407386B2 (en) | Wired circuit board and production method thereof | |
| CN102223753B (en) | Circuit board and production method thereof | |
| KR20110037332A (en) | A printed circuit board and a method of manufacturing the same | |
| CN108024442B (en) | Wired circuit board and method for manufacturing the same | |
| JP2024038334A (en) | Flexible printed wiring board and manufacturing method thereof | |
| JP2004266144A (en) | Flexible wiring circuit board | |
| KR20060114647A (en) | Method for producing flexible circuit board of double access type | |
| CN118215224A (en) | Preparation method of circuit board with thick copper circuit layer | |
| KR20070001110A (en) | Patterned circuits and method for making same | |
| KR20020050720A (en) | Processes for manufacturing multilayer flexible wiring boards | |
| KR20140039921A (en) | Method of manufacturing printed circuit board | |
| CN112114698A (en) | Manufacturing method of induction film, induction film and electronic equipment | |
| CN114641133A (en) | Local thick copper structure processing method, local thick copper circuit board and processing method | |
| CN113316327B (en) | Method for manufacturing golden finger of circuit board and circuit board with golden finger | |
| CN110392488B (en) | Method for manufacturing high-frequency circuit board | |
| JP7315741B2 (en) | Wiring circuit board manufacturing method and wiring circuit sheet | |
| CN110650587A (en) | Flexible circuit board and manufacturing method thereof | |
| US20210410279A1 (en) | Circuit board with high light reflectivity and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |