CN118206895A - Photosensitive solder resist ink and method for manufacturing circuit board - Google Patents
Photosensitive solder resist ink and method for manufacturing circuit board Download PDFInfo
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- CN118206895A CN118206895A CN202211626277.6A CN202211626277A CN118206895A CN 118206895 A CN118206895 A CN 118206895A CN 202211626277 A CN202211626277 A CN 202211626277A CN 118206895 A CN118206895 A CN 118206895A
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- solder resist
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- resist ink
- photosensitive solder
- circuit board
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 70
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title description 5
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 12
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 12
- 239000004593 Epoxy Substances 0.000 claims abstract description 12
- 239000003999 initiator Substances 0.000 claims abstract description 12
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 239000000945 filler Substances 0.000 claims abstract description 9
- 239000000178 monomer Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 239000002904 solvent Substances 0.000 claims abstract description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 12
- 239000006229 carbon black Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- 239000000378 calcium silicate Substances 0.000 claims description 6
- 229910052918 calcium silicate Inorganic materials 0.000 claims description 6
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- -1 oxime ester compound Chemical class 0.000 claims description 4
- 239000005909 Kieselgur Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 239000000049 pigment Substances 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 5
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- UJOBWOGCFQCDNV-UHFFFAOYSA-N Carbazole Natural products C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- MZRQZJOUYWKDNH-UHFFFAOYSA-N diphenylphosphoryl-(2,3,4-trimethylphenyl)methanone Chemical compound CC1=C(C)C(C)=CC=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MZRQZJOUYWKDNH-UHFFFAOYSA-N 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The application provides photosensitive anti-welding ink, which comprises the following components in percentage by mass: epoxy acrylic resin, 35% -45%; 25% -35% of epoxy resin; acrylic acid monomer 15-25%; 1.0 to 5.0 percent of photopolymerization initiator; 2.0 to 6.0 percent of filler; 1.0 to 3.0 percent of solvent and 1.2 to 6.0 percent of black material. The photosensitive solder resist ink provided by the application can play a role in shielding the surface of the circuit board after exposure and can form a window with a regular shape after development by setting the content of the black pigment with a proper proportion. In addition, the application also provides a manufacturing method of the circuit board.
Description
Technical Field
The application relates to photosensitive solder resist ink and a manufacturing method of a circuit board.
Background
The RGB direct display board realizes multi-color light emission by arranging a plurality of three-color LED chips on the outer surface of the circuit substrate.
In general, in order to reduce the glossiness and reflectivity of an RGB direct display panel, a black solder resist layer is required to be provided on the outer surface of a circuit board, the black solder resist layer is formed by exposing and developing a photosensitive solder resist ink containing a black material, and a plurality of three-color LED chips are exposed from the window of the black solder resist layer.
However, the content of the black material in the photosensitive solder resist ink may affect the product yield of the RGB direct display panel, for example, if the content of the black material in the photosensitive solder resist ink is too low, the bonding pad disposed on the surface of the circuit substrate is easily exposed, so that the surface of the circuit substrate cannot be effectively shielded, and the purpose of reducing the glossiness and the reflectivity cannot be achieved; if the black material content in the photosensitive solder resist ink is too high, the problem of underexposure easily occurs in the exposure and development process, so that the inner wall of the window is greatly concave (more than 50 micrometers), and finally the yield of the RGB direct display panel is reduced.
Disclosure of Invention
In order to solve the problems in the background technology, the application provides photosensitive solder resist ink for improving the shielding property and the quality of exposure and development.
In addition, it is necessary to provide a method for manufacturing a circuit board.
A photosensitive solder resist ink, the photosensitive solder resist ink comprising, in mass percent: epoxy acrylic resin, 35% -45%; 25% -35% of epoxy resin; acrylic acid monomer 15-25%; 1.0 to 5.0 percent of photopolymerization initiator; 2.0 to 6.0 percent of filler; 1.0 to 3.0 percent of solvent and 1.6 to 6.0 percent of black material.
Further, the black material includes carbon black powder. The mass fraction of the carbon black powder is 1.6-4.8% or 4.8-6.0%.
Further, the photopolymerization initiator may be at least one selected from the group consisting of an α -hydroxy ketone compound, an acylphosphine oxide, an α -amino ketone compound, an oxime ester compound, and the like.
Further, the filler includes at least one of calcium silicate, calcium carbonate, aluminum hydroxide, diatomaceous earth, barium sulfate, and titanium dioxide.
Further, the solvent comprises carbinol acetate.
A method of manufacturing a circuit board, comprising the steps of:
the method comprises the steps of providing a circuit board to be covered, wherein the circuit board to be covered comprises a circuit substrate and at least one LED chip arranged on one side of the circuit substrate.
Coating photosensitive solder resist ink on one side of the circuit substrate, wherein the photosensitive solder resist ink comprises the following components in percentage by mass: epoxy acrylic resin, 35% -45%; 25% -35% of epoxy resin; acrylic acid monomer 15-25%; 1.0 to 5.0 percent of photopolymerization initiator; 2.0 to 6.0 percent of filler; 1.0 to 3.0 percent of solvent and 1.6 to 6.0 percent of black material.
Exposing and developing the photosensitive solder resist ink to form a black solder resist coating, wherein the black solder resist coating forms a window, and the LED chip is exposed out of the window to obtain the circuit board.
Further, the step of "exposing and developing the photosensitive solder resist ink to form a black solder resist cover layer" includes: and irradiating the photosensitive solder resist ink by ultraviolet light with the wavelength of 365-405 nm.
Further, the thickness of the photosensitive solder resist ink is 30-60 mu m.
Further, the black material comprises carbon black powder, and the mass fraction of the carbon black powder is 1.6-4.8% or 4.8-6.0%.
The photosensitive solder resist ink provided by the application can play a role in shielding the surface of the circuit board after exposure and can form a window with a regular shape after development by setting the content of the black pigment with a proper proportion.
Drawings
Fig. 1 is a schematic cross-sectional view of a circuit board to be covered according to an embodiment of the present application.
Fig. 2 is a schematic diagram of the circuit board to be covered shown in fig. 1 after being provided with photosensitive solder resist ink.
Fig. 3 is a schematic cross-sectional view of a circuit board according to an embodiment of the application.
Fig. 4a-4c are schematic illustrations of the inner wall of the fenestration of examples 1-2 and comparative example 1 of the present application (i.e., an enlarged view of area IV shown in fig. 3).
Fig. 5 is a top view of the circuit board shown in fig. 3.
Fig. 6A-6C are schematic views of the masking cases of examples 1-2 and comparative example 1 of the present application (i.e., an enlarged view of region VI shown in fig. 5).
Description of the main reference signs
Circuit board 100
Circuit board 200 to be covered
Circuit board 10
Inner circuit structure 11
First outer circuit layer 12
Second outer line layer 13
Hollow conductive body 14
LED chip 20
First ink layer 30
Second ink layer 31
Photosensitive plug 32
Insulating plug body 33
First black solder mask layer 34
Second black solder mask layer 35
Solder mask layers 34a, 34b, 34c
Fenestration 341, 341a, 341b, 341c
Thickness D
Depth S1, S2, S3
The application will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may be present.
The embodiment of the application provides photosensitive anti-welding ink which comprises, by mass, 35% -45% of epoxy acrylic resin; 25% -35% of epoxy resin; acrylic acid monomer 15-25%; 1.0 to 5.0 percent of photopolymerization initiator; 2.0 to 6.0 percent of filler; 1.0 to 3.0 percent of solvent and 1.6 to 6.0 percent of black material.
In this embodiment, the photopolymerization initiator may be at least one selected from the group consisting of α -hydroxy ketone compounds, acylphosphine oxides, α -amino ketone compounds, oxime ester compounds, and the like. More specifically, the photoinitiator may be at least one selected from the group consisting of 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1-hydroxycyclohexylphenyl ketone, 2,4,6 (trimethylbenzoyl) diphenyl phosphine oxide, 2-methyl-1- (4-methylthiophenyl) -2-morpholino-1-propanone, phenylbis (2, 4, 6-trimethylbenzoyl) phosphine oxide, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone, benzoin dimethyl ether, benzophenone, isopropylthioxanthone, and carbazole oxime ester.
In this embodiment, the filler may be at least one selected from the group consisting of calcium silicate, calcium carbonate, aluminum hydroxide, diatomaceous earth, barium sulfate, and titanium dioxide. The solvent is carbinol acetate (Carbitol acetate), and the black material is carbon black. In other embodiments of the present application, the black material may be titanium black or the like.
The photosensitive solder resist ink provided by the application has the advantages that the content (the mass fraction is 1.6% -6.0%) of the black pigment with a proper proportion is set, so that the photosensitive solder resist ink can play a role in shielding the surface of a circuit board after exposure and can also ensure the quality of quality development to form a regularly-shaped fenestration.
Referring to fig. 1 to 3, the embodiment of the application further provides a manufacturing method of the circuit board 100, where the circuit board 100 may be an RGB direct display board, or may be a circuit board 100 with a black solder mask layer for other types. The manufacturing method comprises the following steps:
Referring to fig. 1, a circuit board 200 to be covered is provided, and the circuit board 200 to be covered includes a circuit board 10 and at least one LED chip 20 disposed on one side of the circuit board 10. The circuit substrate 10 includes an inner circuit structure 11, a first outer circuit layer 12, a second outer circuit layer 13, and a hollow via 14. The first outer circuit layer 12 and the second outer circuit layer 13 are respectively disposed at two opposite outer sides of the inner circuit structure 11. The hollow conductive body 14 is disposed through the inner circuit structure 11, and the hollow conductive body 14 is electrically connected to the first outer circuit layer 12, the second outer circuit layer, and the inner circuit structure 11.
Referring to fig. 2, a first ink layer 30 is coated on the first outer circuit layer 12, and a second ink layer 31 is coated on the surface of the second outer circuit layer 13, wherein a part of the first ink layer 30 or a part of the second ink layer 31 fills the hollow via 14 to form a photosensitive plug 32.
In this embodiment, the thickness D of the first ink layer 30 and the second ink layer 31 is 30 to 60 μm.
Referring to fig. 3, the first ink layer 30 is exposed and developed to form a first black solder mask layer 34, the black solder mask layer 34 forms a window 341, and the LED chip 20 is exposed through the window 314, so as to obtain the circuit board 100.
In this embodiment, step S3 further includes: exposing and developing the second ink layer 31 to form a second black solder resist layer 35; and exposing the second photosensitive plugs 32 to form insulating plugs 33. The insulating plug 33 is disposed in the hollow conductive body 14 to help reduce the problem of arching of the circuit board 10 due to heat.
In this embodiment, in step S3, exposing and developing the first ink layer 30 specifically includes irradiating the first ink layer 30 with ultraviolet light having a wavelength of 365 to 405 nm. During irradiation, ultraviolet light having a wavelength of 365 to 385nm may expose the upper middle layer of the first ink layer 30, and ultraviolet light having a wavelength of 385 to 405nm may expose the lower middle layer of the first ink layer 30.
The present invention will be specifically described by way of examples.
Example 1
Preparing photosensitive solder resist ink, wherein the photosensitive ink comprises epoxy acrylic resin, and the content of the epoxy acrylic resin is 35% -45%; 25% -35% of epoxy resin; acrylic acid monomer 15-25%; 1.0 to 5.0 percent of photopolymerization initiator; 2.0 to 6.0 percent of calcium silicate; 1.0 to 3.0 percent of carbinol acetate and 4.8 to 6.0 percent of carbon black. The photosensitive solder resist ink was coated on the surface of the circuit board 200 to be covered to obtain an ink layer having a thickness of 45 μm, the ink layer was developed by exposure to ultraviolet light having a wavelength of 365 to 405nm to obtain a black solder resist cover layer 34a, the black solder resist cover layer 34a was provided with a window 341a, the shielding performance of the black solder resist cover layer 34a was observed, and the concave depth S1 of the side wall of the window 341a was measured, and the observation results were shown in table 1, fig. 4a, fig. 5, and fig. 6A.
Example 2
Preparing photosensitive solder resist ink, wherein the photosensitive ink comprises epoxy acrylic resin, and the content of the epoxy acrylic resin is 35% -45%; 25% -35% of epoxy resin; acrylic acid monomer 15-25%; 1.0 to 5.0 percent of photopolymerization initiator; 2.0 to 6.0 percent of calcium silicate; 1.0 to 3.0 percent of carbinol acetate and 1.6 to 4.8 percent of carbon black. The photosensitive solder resist ink is coated on the surface of the circuit board 200 to be covered, an ink layer with a thickness of 45 micrometers is obtained, the ink layer is developed by ultraviolet light exposure with a wavelength of 365-405 nm to obtain a black solder resist cover layer 34B, the black solder resist cover layer 34B is provided with a window 341B, the shielding performance of the black solder resist cover layer 34B is observed, the concave depth S2 of the side wall of the window 341B is measured, and the observation results are shown in table 1, fig. 4B, fig. 5 and fig. 6B.
Comparative example 1
Preparing photosensitive solder resist ink, wherein the photosensitive ink comprises epoxy acrylic resin, and the content of the epoxy acrylic resin is 35% -45%; 25% -35% of epoxy resin; acrylic acid monomer 15-25%; 1.0 to 5.0 percent of photopolymerization initiator; 2.0 to 6.0 percent of calcium silicate; 1.0 to 3.0 percent of carbinol acetate and 1.2 to 1.6 percent of carbon black. The photosensitive solder resist ink was coated on the surface of the circuit board 200 to be covered to obtain an ink layer having a thickness of 45 μm, the ink layer was developed by exposure to ultraviolet light having a wavelength of 365 to 405nm to obtain a black solder resist cover layer 34C, the black solder resist cover layer 34C was provided with a window 341C, the shielding performance of the black solder resist cover layer 34C was observed, and the concave depth S3 of the side wall of the window 341C was measured, and the observation results were shown in table 1, fig. 4C, fig. 5, and fig. 6C.
TABLE 1
The recessed depth of the side wall of the window refers to the maximum recessed depth of the window along the direction perpendicular to the thickness direction of the ink layer.
The shielding performance means that whether the black solder mask layer can cover the surface of the circuit board is visually observed, if the black solder mask layer can cover the surface of the circuit board completely, the black solder mask layer 34a shown in fig. 6A and the black solder mask layer 34B shown in fig. 6B can cover the surface of the circuit board completely, and the brown cover layer 34C shown in fig. 6C cannot cover the surface of the circuit board completely, so that part of the first outer circuit layer 12 is exposed.
Comparative examples 1-2 and comparative example 1 can be found that: the photosensitive solder resist ink with the carbon black mass fraction of 1.6-6.0% can achieve qualified shielding performance and can also have smaller inward concave depth (less than 22 microns) of the side wall of the window.
Further, other variations within the spirit of the present application will occur to those skilled in the art, and it is intended, of course, that such variations be included within the scope of the application as claimed herein.
Claims (10)
1. A photosensitive solder resist ink, characterized in that the photosensitive solder resist ink comprises, in mass fraction: epoxy acrylic resin, 35% -45%; 25% -35% of epoxy resin; acrylic acid monomer 15-25%; 1.0 to 5.0 percent of photopolymerization initiator; 2.0 to 6.0 percent of filler; 1.0 to 3.0 percent of solvent and 1.6 to 6.0 percent of black material.
2. The photosensitive solder resist ink of claim 1, wherein said black material comprises carbon black powder.
3. The photosensitive solder resist ink as claimed in claim 2, wherein the carbon black powder is 1.6 to 4.8% or 4.8 to 6.0% by mass.
4. The photosensitive solder resist ink of claim 1, wherein said photopolymerization initiator comprises at least one selected from the group consisting of an α -hydroxy ketone compound, an acylphosphine oxide, an α -amino ketone compound and an oxime ester compound.
5. The photosensitive solder resist ink of claim 1, wherein said filler comprises at least one of calcium silicate, calcium carbonate, aluminum hydroxide, diatomaceous earth, barium sulfate, and titanium dioxide.
6. The photosensitive solder mask ink of claim 1, wherein the solvent comprises carbinol acetate.
7. A method of manufacturing a circuit board, comprising the steps of:
Providing a circuit board to be covered, wherein the circuit board to be covered comprises a circuit substrate and at least one LED chip arranged on one side of the circuit substrate;
Coating photosensitive solder resist ink on one side of the circuit substrate, wherein the photosensitive solder resist ink comprises the following components in percentage by mass: epoxy acrylic resin, 35% -45%; 25% -35% of epoxy resin; acrylic acid monomer 15-25%; 1.0 to 5.0 percent of photopolymerization initiator; 2.0 to 6.0 percent of filler; 1.0 to 3.0 percent of solvent and 1.6 to 6.0 percent of black material;
exposing and developing the photosensitive solder resist ink to form a black solder resist coating, wherein the black solder resist coating forms a window, and the LED chip is exposed out of the window to obtain the circuit board.
8. The method of manufacturing of claim 7, wherein the step of exposing and developing the photosensitive solder resist ink to form a black solder resist layer comprises:
And irradiating the photosensitive solder resist ink by ultraviolet light with the wavelength of 365-405 nm.
9. The method of manufacturing according to claim 7, wherein the photosensitive solder resist ink has a thickness of 30 to 60 μm.
10. The method of manufacturing according to claim 7, wherein the black material includes carbon black powder of 1.6 to 4.8% or 4.8 to 6.0% by mass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211626277.6A CN118206895A (en) | 2022-12-16 | 2022-12-16 | Photosensitive solder resist ink and method for manufacturing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211626277.6A CN118206895A (en) | 2022-12-16 | 2022-12-16 | Photosensitive solder resist ink and method for manufacturing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118206895A true CN118206895A (en) | 2024-06-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211626277.6A Pending CN118206895A (en) | 2022-12-16 | 2022-12-16 | Photosensitive solder resist ink and method for manufacturing circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN118206895A (en) |
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- 2022-12-16 CN CN202211626277.6A patent/CN118206895A/en active Pending
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