CN1181481C - Optical head device - Google Patents
Optical head device Download PDFInfo
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- CN1181481C CN1181481C CNB021574766A CN02157476A CN1181481C CN 1181481 C CN1181481 C CN 1181481C CN B021574766 A CNB021574766 A CN B021574766A CN 02157476 A CN02157476 A CN 02157476A CN 1181481 C CN1181481 C CN 1181481C
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Abstract
An optical head device is provided. A laser element pick-up part (7) on a frame is a cylindrical part (71), in which the cylindrical housing of first semiconductor laser element can be inserted, at the same time, a pair of grooves (72)(73) is formed on the inner wall (710) of the cylindrical part (71), in which the extending part towards both sides of the heating panel (61) of second semiconductor laser element. The entering side of the grooves (72)(73) (outer side in the inserting direction) is constituted of a guiding part (77) in which the width size and the thichness size of the opening are bigger than that of the heating panel (61), the inner of the guiding part (77) having a positioning part (78)(79) for pushing the heating panel (61) towards side walls (720)(730). The invention provide an optical head device in which any type of semiconductor laser elements different in a size and a shape can be used.
Description
Technical field
The present invention relates to the record of the optical recording media of a kind of CD of being used for, CD-R, DVD etc., the optical-head apparatus of broadcast.
Background technology
At the record of the optical recording media that is used for CD, CD-R, DVD etc., the optical-head apparatus of broadcast, will from as the ejaculation light of the semiconductor Laser device of light source by the light-conducting system object lens that lead, will be to the optical recording media of CD shape by the light pack of this object lens pack.At this moment, the tracking direction of object lens and the driving of focus direction are undertaken by lens driving apparatus.Back light from optical recording media also guides to photo detector by light-conducting system.
Here, semiconductor Laser device, object lens, light-conducting system, lens driving apparatus etc. carry on the framework that the radial direction along optical recording media scans.Therefore, form the laser diode equipped section that coincide with the semiconductor Laser device shape in the framework.Such as, traditional optical-head apparatus, general shown in Fig. 3 (A), (B), use has the semiconductor Laser device 50 (semiconductor Laser device of the 1st type) of cylinder-like shell 53, so form the cylindrical portion laser diode equipped section of the cylinder-like shell 53 that can insert semiconductor Laser device 50 in the framework.
And, as shown in Figure 4, having the 2nd type that heat sink 61 is stretched out to both sides as semiconductor Laser device, this kind semiconductor Laser device 60 (the 2nd type of semiconductor Laser device) does not have cylinder-like shell.The 2nd type semiconductor Laser device 60 is inexpensive and exothermicity is good, so as use the semiconductor Laser device 60 of the 2nd type and use resinous framework, then can realize the optical-head apparatus cost degradation, resin system framework can solve the low problem of exothermal efficiency simultaneously.
But the shape and size of aforementioned two semiconductor Laser devices have nothing in common with each other, so the semiconductor Laser device 60 that is difficult to the 2nd type carries on the cylindric laser diode equipped section that forms on traditional framework.Therefore, when using the 2nd kind of semiconductor Laser device 60,, on framework, form a pair of slot part to the both sides extension that can insert heat sink 61 as the laser diode equipped section.At this moment, following 67 of heat sink 61 becomes the 1st reference field of the luminous position of the laser chip 63 of representing heat sink 61 thickness directions, and the side end face 64 in the both sides end face 64,65 of heat sink 61 becomes the 2nd reference field of the luminous position of the laser chip 63 of representing heat sink 61 thickness directions.Therefore, slot part forms straight hole according to the size of heat sink 61, and following 67 (the 1st reference fields) of heat sink 61 and a side end face 64 (the 2nd reference field) can correctly be located in above-mentioned slot part.
And the laser diode equipped section changed by this laser diode shape the 2nd kind of semiconductor Laser device can be carried on framework, but consider from reliability or characteristic aspect, when using the 1st kind of semiconductor Laser device, then there is the problem that the 1st kind of semiconductor Laser device can't be carried on framework.
And, as forming the straight hole conform to the size of heat sink 61 laser diode equipped section as the 2nd kind of semiconductor Laser device 60 usefulness of lift-launch, then when heat sink 61 is inserted slot part, heat sink 61 is hung in sidewall in groove inside and tilts to pack into, thereby produces the light shaft offset of the 2nd kind of semiconductor Laser device 60, the problem of inclination.
Summary of the invention
In view of the above problems, the object of the invention is, a kind of optical-head apparatus that can use the semiconductor Laser device of the different type of size and dimension is provided.
And the present invention also aims to provide a kind of optical-head apparatus that is applicable to the semiconductor Laser device of the type that heat sink stretches out to both sides.
In order to address the above problem, optical-head apparatus of the present invention has at least: semiconductor Laser device; The light pack of this semiconductor Laser device ejaculation is arrived the object lens of optical recording media; Carry the framework of these object lens and aforesaid semiconductor laser diode, it is characterized in that, the aforesaid semiconductor laser diode is carried the laser diode equipped section of on described framework, using, form cylindrical portion, can insert the aforementioned cylinder-like shell of the 1st type semiconductor Laser device with cylinder-like shell, simultaneously, on the internal perisporium of aforementioned cylindrical portion, form a pair of slot part, can insert the extension to both sides of aforementioned heat sink of the semiconductor Laser device of the 2nd type that heat sink stretches out to both sides.
Because laser diode of the present invention equipped section is a cylindrical portion, can insert the cylinder-like shell of the 1st type semiconductor Laser device, so in the framework of the 1st kind of semiconductor Laser device can being packed into.And on the internal perisporium of cylindrical portion, form a pair of slot part, can insert the extension to both sides of heat sink of the semiconductor Laser device of the 2nd type, so as long as the extension to both sides of the heat sink of the semiconductor Laser device of the 2nd type is inserted slot part, the semiconductor Laser device of the 2nd type framework of just can packing into.Promptly, the width dimensions that comprises heat sink in the semiconductor Laser device of the 2nd type is bigger than the outside dimension of the cylinder-like shell of the semiconductor Laser device of the 1st type, utilize this characteristics, on the internal perisporium of cylindrical portion, form a pair of slot part that the semiconductor Laser device heat sink of the 2nd type is inserted, fix the semiconductor Laser device of the 2nd type by these slot parts.Therefore, the semiconductor Laser device of the semiconductor Laser device of the 1st type and the 2nd type is although its shape and size are significantly different, among the present invention, no matter the semiconductor Laser device of which kind of type can both carry on framework.Therefore, such as the cost degradation that will realize optical-head apparatus, resin system framework needs the exothermicity of semiconductor Laser device to improve, needs under the occasion of high reliability, can be contained in the semiconductor Laser device of the 1st type on the framework very much when packing the semiconductor Laser device of the 2nd type into framework because of utilizing.
Among the present invention, aforementioned cylindrical portion and aforementioned slot part are such as being formed by aforesaid frame self.At this moment, semiconductor Laser device can directly be packed in the framework.
Among the present invention, the aforesaid semiconductor laser diode also has the occasion of element bracket lift-launch on aforesaid frame by ring-type, at this moment, forms aforementioned cylindrical portion and aforementioned slot part on this element bracket.Structure like this, when carrying semiconductor Laser device on framework or carrying out optical axis adjusting etc., no matter be to use the semiconductor Laser device of the 1st different type of shape and size still is the semiconductor Laser device of the 2nd type, as long as the element bracket of the same shape of supporting has advantages such as needn't changing bearing method according to semiconductor Laser device.
Among the present invention, the reference field of the luminous position of the laser chip of the laser ejaculation direction of expression aforesaid semiconductor laser diode, in the semiconductor Laser device of aforementioned the 1st type, be formed on the end difference of the outer peripheral portion of aforementioned cylinder-like shell as ring-type, and in the semiconductor Laser device of the 2nd type, form the front end face of aforementioned heat sink, the inboard of the aforementioned cylindrical portion of aforesaid semiconductor laser diode equipped section, be provided with the 1st block with the aforementioned end difference butt of the semiconductor Laser device of described the 1st type, and at 2nd block of the inside of aforementioned slot part formation with the front end face butt of the aforementioned heat sink of the semiconductor Laser device of aforementioned the 2nd type, when being preferably in any in the semiconductor Laser device of the semiconductor Laser device that carries aforementioned the 1st type and the 2nd type, make the structure of the air conversion light source position unanimity of the ejaculation direction that makes laser.
Description of drawings
Fig. 1 is a vertical view of using the major part of optical-head apparatus of the present invention.
Fig. 2 is the key diagram that carries the framework of various optical elements in the optical-head apparatus shown in Figure 1.
Fig. 3 (A), (B) be have cylinder-like shell the 1st type semiconductor Laser device stereographic map and excise its a part of key diagram.
The stereographic map of the semiconductor Laser device of Fig. 4 the 2nd type that to be heat sink stretch out to both sides.
Fig. 5 is a key diagram of seeing the laser diode equipped section that framework shown in Figure 3 forms from open side.
Fig. 6 (A), (B), (C) are S-S ' sectional view, T-T ' sectional view, the U-U ' sectional views of laser diode shown in Figure 5 equipped section.
Fig. 7 (A), (B) are respectively for the characteristic of the T-T ' sectional view of clear and definite laser diode equipped section shown in Figure 6, U-U ' sectional view and the key diagram of modal representation.
Fig. 8 (A), (B) are from oblique the place ahead being used for of seeing semiconductor Laser device is packed into the stereographic map of element bracket of the laser diode equipped section on the framework and the stereographic map of seeing from oblique rear in the optical-head apparatus of the 2nd example of the present invention.
Fig. 9 (A), (B), (C) are that the semiconductor Laser device of the 1st type that will have cylinder-like shell seen from oblique the place ahead is packed into the stereographic map of the state in the element bracket and this state stereographic map and vertical view after the part excision of element bracket.
Figure 10 (A), (B), (C) are pack into the stereographic maps of element bracket internal state of the semiconductor Laser device of the 2nd type that heat sink is stretched out to both sides seen from oblique the place ahead, and in this state with vertical view and side view after the part excision of element bracket.
Figure 11 is the key diagram of the slot part variation of the heat sink that expression is fitted with the 2nd type semiconductor laser diode in having used optical-head apparatus of the present invention.
Embodiment
Below utilize accompanying drawing to explain to using optical-head apparatus of the present invention.
Example 1
Fig. 1 is the vertical view of the optical-head apparatus structure of carrying out recording played of CD, CD-R, DVD.
As shown in Figure 1, optical-head apparatus 1 has resinous framework 3, by will passing connecting portion 301,302,303 with 2 leading axle 2A, the 2B that machine is installed abreast, and this framework 3 can be moved along leading axle 2A, 2B.The optical system of explanation below constituting on this framework 3.
Promptly, the semiconductor Laser device 5 that the CD that the optical system of optical-head apparatus 1 has semiconductor Laser device 4 that the DVD that penetrates the 1st laser L1 uses, penetrate the 2nd laser L2 uses, to be directed to common light path 6 from the 1st and the 2nd laser L1, the L2 that each semiconductor Laser device 4,5 penetrates, and utilize this common light path 6 to write down, to play all CD, CD-R, DVD.
DVD plays usefulness with semiconductor Laser device 4 for DVD, and penetrating wavelength is the 1st laser L1 of 650nm or 635nm.And CD is record, the broadcast usefulness of CD and CD-R with semiconductor Laser device 5, and penetrating wavelength is the 2nd laser L2 of 780～800nm. Semiconductor Laser device 4,5 is in the same side of the light-conducting system 20 of common light path 6, is arranged to mutual optical axis L 10, L20 is parallel.
DVD directly injects light-conducting system 20 with the 1st laser L1 that semiconductor Laser device 4 penetrates.And CD injects light-conducting system 20 with the 2nd laser L2 that semiconductor Laser device 5 penetrates by diffraction grating 12.Diffraction grating 12 possesses the diffraction characteristic of regulation, will be divided into 3 light beams with the 2nd laser L2 of semiconductor Laser device 5 ejaculations from CD.
Light-conducting system 20 is made of semi-permeable mirror 21 with part reflecting face and the prism 22 with part reflecting face.Semi-permeable mirror 21 is configured to 10 one-tenth 45 heeling conditions of spending of optical axis L of the 1st laser L1 of relative semiconductor Laser device 4 ejaculations of its part reflecting face.Prism 22 is configured to 20 one-tenth 45 heeling conditions of spending of optical axis L of the 2nd laser L2 of relative semiconductor Laser device 5 ejaculations of its part reflecting face.
So in the optical-head apparatus 1 of structure, has the mirror folder 71 of maintenance object lens 8 to the objective lens device 70 of tracking direction and focus direction driving object lens 8.
Formation outer wall 356 and inwall 357 on bracket supports member 35 are provided with a pair of tracking drive magnet 83 at outer wall 356, this magnet 83 and tracking drive coil 81 relative and formation tracking magnetic circuits.Therefore, mirror folder 71 is rotated around fulcrum 91, can carry out the correction of trail-and-error.
Be provided with a pair of focusing drive magnet 84 at outer wall 356, this magnet 84 and focusing drive coil 82 relative and formation focusing magnetic circuits.Therefore, mirror folder 71 axis directions along fulcrum 91 are moved, can focus on wrong correction.
Fig. 2 is the key diagram that carries the framework of various optical elements in the optical-head apparatus shown in Figure 1.Fig. 3 (A), (B) be have cylinder-like shell the 1st type semiconductor Laser device stereographic map and excise its a part of key diagram.The stereographic map of the semiconductor Laser device of Fig. 4 the 2nd type that to be heat sink stretch out to both sides.Fig. 5 sees the key diagram that is formed on the laser diode equipped section on the framework shown in Figure 3 from open side.Fig. 6 (A), (B), (C) are S-S ' sectional view, T-T ' sectional view, the U-U ' sectional views of laser diode shown in Figure 5 equipped section.Fig. 7 (A), (B) are respectively for the characteristic of the T-T ' sectional view of clear and definite laser diode equipped section shown in Figure 6, U-U ' sectional view and the key diagram of modal representation.
In optical-head apparatus 1, DVD carries on the laser diode equipped section 7 at the lateral opening of framework 3 as shown in Figure 2 with semiconductor Laser device 4.On framework 3, form and carry the laser diode equipped section of CD with semiconductor Laser device 5, but CD is identical with the shape of semiconductor Laser device 4 with DVD with semiconductor Laser device 5 basically, so the following description only describes with the actual installation structure of semiconductor Laser device 4 DVD, omit the explanation of CD with the actual installation structure of semiconductor Laser device 5.
With semiconductor Laser device 4 spendable semiconductor Laser devices Fig. 3 (A), (B) and 2 kinds shown in Figure 4 are arranged as DVD.
At first, the semiconductor Laser device 50 of the 1st type shown in Fig. 3 (A), (B) is on discoid base 51 laser chip 52 is installed, and this laser chip 52 to be covered by metallic cylinder-like shell 53.Therefore, laser chip 52 does not contact with extraneous air.The outer circumferential side of cylinder-like shell 53 partly forms end difference 54 by the outer peripheral portion of base 51 and the edge of cylinder-like shell 53, and this end difference 54 becomes the reference field (the 3rd reference field) of the luminous position of the laser chip 52 of representing laser ejaculation direction.And the position relative with laser chip 52 becomes the window of sealing with translucent material 55 in the cylinder-like shell 53.
The semiconductor Laser device 60 of the 2nd type shown in Figure 4 is pressed the order of auxiliary frame 62, laser chip 63 on 68 and is installed on metal heat sink 61, different with the semiconductor Laser device 50 of the 1st type, does not use cylinder-like shell.Therefore, laser chip 63 is in and the extraneous air state of contact.On heat sink 61, carry the framework 69 that surrounds auxiliary frame 62 on 68.In the semiconductor Laser device of the 2nd type, heat sink 61 stretches out to both sides, and the width dimensions of the semiconductor Laser device 60 of the 2nd type (width dimensions that comprises heat sink 61) is bigger than the outside dimension of the semiconductor Laser device 59 of the 1st type.Here, following 67 of heat sink 61 the 1st reference fields of luminous position that become the laser chip 63 of expression heat sink 61 thickness directions.In the both sides end face 64,65 of heat sink 61, a side side end face 64 becomes the 2nd reference field of the luminous position of the laser chip 63 of representing heat sink 61 Widths.And the front end face 66 of heat sink 61 becomes the 3rd reference field of the luminous position of the laser chip 63 of representing laser ejaculation direction.
Like this, although the semiconductor Laser device 60 of the semiconductor Laser device 50 of the 1st type and the 2nd type is significantly different aspect the shape and size, but this form as shown in Figure 5, form cylindrical portion 71 on the laser diode equipped section 7 of framework 3, can insert the cylinder-like shell 53 of the semiconductor Laser device 50 of the 1st type from arrow Z direction, forming on the internal perisporium 710 of cylindrical portion 71 simultaneously can be from a pair of slot part 72 to both sides extension insertion of arrow Z direction with the heat sink 61 of the semiconductor Laser device 60 of the 2nd type, 73, so that no matter the semiconductor Laser device 50 of which kind of type, 60 can both install on framework 3.
Here, in the semiconductor Laser device 60 of the 2nd type, because top 68 of heat sink 61 passes through auxiliary frame 62 laser chips 63 are installed, so slot part 72,73 is formed on cylindrical portion 71 diameters to a side and is offset roughly and heat sink 61 and the suitable position of auxiliary frame 62 thickness, is formed at the center and also can.
So the laser diode equipped section 7 of structure is shown in Fig. 5 and Fig. 6 (A), the 1st block 74 of end difference 54 (the 3rd reference field) butt of that form in the internal perisporium 710 of cylindrical portion 71 and semiconductor Laser device 50 the 1st type is a ring-type, simultaneously shown in as Fig. 5 and Fig. 6 (B), (C), the inside of slot part 72,73 forms and the 2nd block 75,76 of front end face 66 butts of the heat sink 61 of the semiconductor Laser device 60 of the 2nd type.
Shown in Fig. 5, Fig. 6 (B) and Fig. 7 (A), form introduction part 77 in the slot part 72,73, this introduction part 77 has the opening bigger than the width dimensions of heat sink 61 at entrance side (on the suction side of direction of insertion).And portion within it constitutes 1st location division 78 of heat sink 61 to the 1st sidewall (wall part) 720 pushings.Promptly, the inside at slot part 72,73, the extension of the heat sink 61 of the semiconductor Laser device 60 of the 2nd type was inserted slot part at 72,73 o'clock, become a side's of the 2nd reference field the 1st sidewall (wall part) 720 of 64 butts in side end face in the both side ends 64,65 of heat sink 61, from import is tabular surface to the inside, but the 2nd sidewall (wall part) 730 of the slot part 73 of the opposing party's of heat sink 61 65 butts in side end face, on the suction side are with than the big slightly interval of the width dimensions of heat sink 61 and the tabular surface relative with the 1st sidewall (wall part) 720.And in the 2nd sidewall (wall part) 730, side end face 65 butts of the inside of slot part 72,73 and heat sink 61, shown in the arrow X of Fig. 7 (A), the 1st location division 78 is by heat sink 61 being pressed against the pushing of the 1st on the 1st sidewall (wall part) 720 projection 731, constituting with the dip plane 738 of projection 731 in introduction part side (entrance side) adjacency with respect to the 1st pushing.
Shown in Fig. 5, Fig. 6 (C) and Fig. 7 (B), form introduction part 77 in the slot part 72,73, this introduction part 77 has the opening bigger than the gauge of heat sink 61 at entrance side (side in front of the direction of insertion).And portion within it constitutes heat sink 61 is pressed against the 2nd location division 79 on the 3rd sidewall (wall part) 723,733.Promptly, inside at slot part 72,73, the extension of the heat sink 61 of the semiconductor Laser device 60 of the 2nd type was inserted slot part at 72,73 o'clock, become the 3rd sidewall (wall part) 723,733 of following 67 butts of the 1st reference field in the heat sink 61, from import to inside is tabular surface, but the 4th sidewall (wall part) 724,734 of the slot part 73 of top 68 butts of heat sink 61, on the suction side are with than the big slightly interval of the width dimensions of heat sink 61 and the tabular surface relative with the 3rd sidewall (wall part) 723,733.And in the 4th sidewall (wall part) 724,734, top 12 butts of inside and heat sink 61, shown in the arrow Y of Fig. 7 (B), the 2nd location division 79 is by heat sink 61 being pressed against the pushing of the 2nd on the 3rd sidewall (wall part) 723,733 projection 725,735, constituting with the dip plane 729,739 of projection 725,735 in the entrance side adjacency with respect to the 2nd pushing.
So in the optical-head apparatus 1 of structure, the formation cylindrical portion 71 of cylinder-like shell 53 of semiconductor Laser device 50 of the 1st type of can packing in the laser diode equipped section 7 of framework 3, so, just the semiconductor Laser device 50 of the 1st type directly can be contained on the framework 3 as long as coat cementing agent after being pressed into or inserting the semiconductor Laser device 50 of the 1st type in the cylindrical portion 71.
In addition, formation can be inserted a pair of slot part 72,73 to the extension of both sides of heat sink 61 of the semiconductor Laser device 60 of the 2nd type in the internal perisporium 710 of cylindrical portion 71, so, just the semiconductor Laser device 60 of the 2nd type directly can be contained on the framework 3 as long as coat cementing agent after being pressed into or inserting the extension of the heat sink 61 of the semiconductor Laser device 60 of the 1st type in the slot part 72,73.
Promptly, in the semiconductor Laser device 60 of the 2nd type, the width dimensions that comprises heat sink 61 is bigger than the outside dimension of the cylinder-like shell 53 of the semiconductor Laser device 50 of the 1st type, utilize this characteristics, on the internal perisporium of cylindrical portion 71, form a pair of heat sink 61 slot parts 62,63 that insert the semiconductor Laser device 69 of the 2nd type, insert these slot parts 62,63 and fixing by semiconductor Laser device 60 with the 2nd type.Therefore, the semiconductor Laser device 50 of the 1st type and the semiconductor Laser device 60 of the 2nd type are although its shape and size are significantly different, in this form, no matter the semiconductor Laser device 50,60 of which kind of type can both carry on framework 3.Therefore, such as the cost degradation that will realize optical-head apparatus 1, need high exothermicity, pack the semiconductor Laser device 60 of the 2nd type into framework 3 and needs very under the occasion of high reliability, the semiconductor Laser device 50 of the 1st type can be installed on the framework 3 for utilizing resin system framework 3.
In this form, the inboard of cylindrical portion 71 is formed with the 1st block 74 with end difference 54 (the 3rd reference field) butt of the semiconductor Laser device 50 of the 1st type annularly, simultaneously at 2nd block 75,76 of the inside of slot part 72,73 formation with front end face 66 (the 3rd reference field) butt of the heat sink 61 of the semiconductor Laser device 60 of the 2nd type, no matter use which kind of semiconductor Laser device 50,60, can both make both sides' air conversion light source position unanimity.
And slot part 72,73 is provided with the introduction part 77 that opening enlarges, and make narrowed width because of the 1st pushing pushes with projection 731 and the 2nd with projection 725,735 (location division 78,79) inner, event was inserted slot part at 72,73 o'clock with the extension of the heat sink 61 of the semiconductor Laser device 60 of the 2nd type, can be easily the extension of heat sink 61 be inserted slot part 72,73, be inserted into inside simultaneously, then push with projection 725,735 with projection 731 and the 2nd pushing and locate naturally by the 1st pushing.
The extension of the semiconductor Laser device 60 of the 2nd type is inserted under the state of slot part 72,73 inside, heat sink 61 is pushed with projection 725,735 (location division 78,79) with projection 731 and the 2nd pushing by the 1st pushing, a side side end face 64 and the 1st sidewall (wall part) 720 that becomes the heat sink 61 of the 2nd reference field is close to, and the following 67 and the 3rd sidewall (wall part) 723,733 that becomes the heat sink 61 of the 1st reference field is close to.Therefore, the extension of the heat sink 61 of the semiconductor Laser device 60 of the 2nd type was inserted slot part at 72,73 o'clock, heat sink can not packed into the state that tilts, and the semiconductor Laser device 60 of the 2nd type correctly is fixed in the position of regulation at inner utilization the 1st reference field of slot part 72,73 and the 2nd reference field.
Example 2
Fig. 8 (A), (B) are in the optical-head apparatus of this form, and being used for of seeing from oblique the place ahead carried the stereographic map of element bracket of the laser diode equipped section on framework and the stereographic map of seeing from oblique rear with semiconductor Laser device.Fig. 9 (A), (B), (C) are pack into the stereographic maps of the state in the element bracket of the semiconductor Laser device of the 1st type that will have cylinder-like shell seen from oblique the place ahead, and in this state with stereographic map and vertical view after the part excision of element bracket.Figure 10 (A), (B), (C) are pack into the stereographic maps of element bracket internal state of the semiconductor Laser device of the 2nd type that heat sink is stretched out to both sides seen from oblique the place ahead, and in this state with vertical view and side view after the part excision of element bracket.
Example 1 is with the DVD directly examples of lift-launch on the laser diode equipped section of the place, side of framework 3 opening of semiconductor Laser device 4, but as described below, also DVD can be packed into semiconductor Laser device 4 and again this element bracket is carried on framework behind the element bracket of ring-type.But, in this form, though CD also carries on framework 3 with semiconductor Laser device 5, but because CD is substantially the same with semiconductor Laser device 4 shapes with semiconductor Laser device 5 and DVD, so following explanation only describes with the packaging structure of semiconductor Laser device 4 DVD, omit the explanation with the packaging structure of semiconductor Laser device 5 to CD.Have in each element that in element bracket, forms with the part of example 1 identical function and describe with identical symbol.
In the example 1, illustrated as reference Fig. 3 (A), (B) and Fig. 4, although the semiconductor Laser device 60 of the semiconductor Laser device 50 of the 1st type and the 2nd type is significantly different aspect the shape and size, but in this form, no matter be the semiconductor Laser device 50,60 of which kind of type, all can use the circular element support 40 shown in Fig. 8 (A), (B), install so that can install on the laser diode equipped section 7 on the framework shown in Figure 23.
Among Fig. 8 (A), (B), element bracket 40 has the outside dimension in the laser diode equipped section 7 that can insert framework 3.Form cylindrical portion 71 and insert towards the direction of arrow Z as shown in Figure 9 with the cylinder-like shell 53 with the semiconductor Laser device 50 of the 1st type in element bracket 40, forming on the internal perisporium 710 of cylindrical portion 71 simultaneously can be with a pair of slot part 72,73 that inserts towards the direction of arrow Z like that shown in Figure 10 (A) to the both sides extension of the heat sink 61 of the semiconductor Laser device 60 of the 2nd type.
Here, on the semiconductor Laser device 60 of the 2nd type, because top 68 of heat sink 61 is installed laser chip 63 by auxiliary frame 62,, slot part 72,73 is offset roughly and heat sink 61 and the suitable position of auxiliary frame 62 thickness so being formed on cylindrical portion 71 diameters to a side.
Like this element bracket 40 of structure shown in Fig. 8 (A) and Fig. 9 (B), is formed with the 1st block 74 with end difference 54 (the 3rd reference field) butt of the semiconductor Laser device 50 of the 1st type annularly in the internal perisporium 710 of cylindrical portion 71.
Shown in Fig. 9 (B) and Figure 10 (C), be formed on the ring-type wall 701 of location usefulness of the front end face 41 of butt element bracket 40 in the inside of the laser diode equipped section 7 of framework 3, shown in Figure 10 (B), and the location of heat sink 61 front end faces 66 of semiconductor Laser device 60 that is formed with butt the 2nd type is with wall 702 (the 2nd block).
Therefore, after being installed in the semiconductor Laser device 60 of the 2nd type on the element bracket 40, be inserted in the semiconductor Laser device equipped section 7, the then front end face 66 of heat sink 61 and wall 702 butts, the semiconductor Laser device 60 of the 2nd type penetrates direction at laser and is positioned.And when being contained in the semiconductor Laser device 50 of the 1st type on the element bracket 40, the semiconductor Laser device 50 of the 1st type is positioned in the element bracket 40 by the 1st block 74, so element bracket 40 is inserted in the laser diode equipped section 7, ring-type wall 701 butts of the front end face 41 of element bracket 40 and location usefulness then, its result, the semiconductor Laser device 50 of the 1st type penetrates direction at laser and is positioned.Therefore, even any of semiconductor Laser device 50,60 is contained on the framework 3, can both make both sides' air conversion light source position unanimity.
Shown in Figure 10 (B), in the slot part 72,73 of element bracket 40, be formed with introduction part 77, this introduction part 77 has the opening bigger than the width dimensions of heat sink 61 at entrance side (on the suction side of direction of insertion).And portion within it constitutes 1st location division 78 of heat sink 61 to the 1st sidewall (wall part) 720 pushings.Promptly, inside at slot part 72,73, the extension of the heat sink 61 of the semiconductor Laser device 60 of the 2nd type was inserted slot part at 72,73 o'clock, in the both side ends 64,65 of heat sink 61, become a side's of the 2nd reference field the 1st sidewall (wall part) 720 of 64 butts in side end face, from import to inside is tabular surface, and the 2nd sidewall (wall part) 730 of the slot part 73 of the opposing party's of heat sink 61 65 butts in side end face, on the suction side is with than the big slightly interval of the width dimensions of heat sink 61 and the tabular surface relative with the 1st sidewall (wall part) 720.And in the 2nd sidewall 730, side end face 65 butts of the inside of slot part 72,73 and heat sink 61, shown in the arrow X of Fig. 7 (A), the 1st location division 78 constitutes by heat sink 61 is pushed with the dip plane 738 of projection 731 in introduction part side (entrance side) adjacency to the 1st pushing projection 731 of the 1st sidewall (wall part) 720 pushings, with respect to the 1st.
Shown in Figure 10 (C), be formed with introduction part 77 in the slot part 72,73 of element bracket 40, this introduction part 77 has the opening bigger than the gauge of heat sink 61 at entrance side (on the suction side of direction of insertion).And portion within it constitutes 2nd location division 79 of heat sink 61 to the 3rd sidewall (wall part) 723,733 pushings.Promptly, inside at slot part 72,73, the extension of the heat sink 61 of the semiconductor Laser device 60 of the 2nd type was inserted slot part at 72,73 o'clock, become the 3rd sidewall (wall part) 723,733 of following 67 butts of the 1st reference field in the heat sink 61, from import to inside is tabular surface, and the 4th sidewall (wall part) 724,734 of the slot part 73 of top 68 butts of heat sink 61, on the suction side is with than the big slightly interval of the width dimensions of heat sink 61 and the tabular surface relative with the 3rd sidewall (wall part) 723,733.And in the 4th sidewall (wall part) 724,734, top 12 butts of inside and heat sink 61, shown in the arrow Y of Fig. 7 (B), the 2nd location division 79 constitutes by heat sink 61 is pushed with the dip plane 729,739 of projection 725,735 in the entrance side adjacency to the 2nd pushing projection 725,735 of the 3rd sidewall (wall part) 723,733 pushings, with respect to the 2nd.
So in the optical-head apparatus 1 of structure, owing in element bracket 40, be formed with the cylindrical portion 71 of cylinder-like shell 53 of the semiconductor Laser device 50 of the 1st type of can packing into, so, just the semiconductor Laser device 50 of the 1st type can be contained on the element bracket 40 as long as coat cementing agent after being pressed into or inserting the semiconductor Laser device 50 of the 1st type in the cylindrical portion 71.In addition, owing to be formed with a pair of slot part 72,73 to the extension of both sides of the heat sink 61 of the semiconductor Laser device 60 that can insert the 2nd type at the internal perisporium 710 of cylindrical portion 71, so, just the semiconductor Laser device 60 of the 2nd type can be contained on the element bracket 40 as long as coat cementing agent after being pressed into or inserting the extension of the heat sink 61 of the semiconductor Laser device 60 of the 1st type in the slot part 72,73.Therefore, although the shape and the size of the semiconductor Laser device 60 of the semiconductor Laser device 50 of the 1st type and the 2nd type are significantly different, but as long as with its element bracket 40 of packing into, promptly become the state that outside dimension is identical and shape is also roughly the same, can insert on the laser diode equipped section 7 of being fixed in framework 3 like this.
And, when carrying semiconductor Laser device on framework 3 or carrying out optical axis adjusting etc., even using the semiconductor Laser device 50 of the 1st different type of shape and size still is the semiconductor Laser device 60 of the 2nd type, as long as the element bracket 40 of the same shape of supporting has advantages such as needn't changing bearing method to each semiconductor Laser device.
In this form, because the inboard of cylindrical portion 71 forms the 1st block 74 of the end difference 54 (the 3rd reference field) of the semiconductor Laser device 50 of butt the 1st type annularly, and in laser diode equipped section 7, form wall 702 with front end face 66 (the 3rd reference field) butt of the heat sink 61 of the semiconductor Laser device 60 of the inside of the ring-type wall 701 of element bracket 40 location, slot part 72,73 and the 2nd type, even, can both make both sides' air conversion light source position unanimity so use the semiconductor Laser device 50,60 of arbitrary type.
And in element bracket 40, because slot part 72,73 is provided with the big introduction part of opening 77, on the other hand, inner width narrows down with projection 725,735 (location division 78,79) with projection 731 and the 2nd pushing because of the 1st pushing, event was inserted slot part at 72,73 o'clock with the extension of the heat sink 61 of the semiconductor Laser device 60 of the 2nd type, can be easily the extension of heat sink 61 be inserted slot part 72,73, and be inserted into inside, push with projection 725,735 with projection 731 and the 2nd pushing and locate naturally by the 1st pushing.
Other examples
Figure 11 is the key diagram that the heat sink of having used the 2nd type semiconductor laser diode of optical-head apparatus of the present invention inserts the variation of slot part.
The slot part 72,73 of element bracket 40 is formed with introduction part 77, and this introduction part 77 has the opening bigger than the gauge of heat sink 61 at entrance side (on the suction side of direction of insertion).And portion within it constitutes heat sink 61 is pressed against the 2nd location division 79 on the 3rd sidewall 723,733.The 2nd location division 79 forms the recess 728,738 that extension with the heat sink 61 of the semiconductor Laser device 60 of the 2nd type inserts slot part and became the 3rd sidewall (wall part) 723,733 of 67 butts below the 1st reference field at 72,73 o'clock in heat sink 61 inside forms as shown in figure 11; In the inside of the 4th sidewall (wall part) 724,734, also can form the 2nd pushing projection 725,735 of the entrance side that is pressed to the 3rd sidewall (wall part) 723,733 with top 12 butts of heat sink 61, with heat sink 61; Use the dip plane 729,739 of projection 725,735 with respect to the 2nd pushing in the entrance side adjacency.
Like this structure also can be applicable to the 1st sidewall (wall part) 720 and the 2nd sidewall (wall part) 730 with side end face 64,65 butts of heat sink.
As mentioned above, the laser diode equipped section of optical-head apparatus of the present invention is formed with cylindrical portion, can insert the cylinder-like shell of the 1st type semiconductor Laser device, so the 1st kind of semiconductor Laser device can be installed on the framework.And on the internal perisporium of cylindrical portion, form a pair of slot part, can insert the part of stretching out of heat sink of the semiconductor Laser device of the 2nd type to both sides, event needs only inserts slot part with the part of stretching out to both sides of the heat sink of the semiconductor Laser device of the 2nd type, and the semiconductor Laser device of the 2nd type just can be contained on the framework.Therefore, the semiconductor Laser device of the semiconductor Laser device of the 1st type and the 2nd type is although its shape and size are significantly different, among the present invention, even the semiconductor Laser device of any type can both carry on framework.
As mentioned above, optical-head apparatus of the present invention as long as the part of stretching out to both sides of heat sink is inserted in a pair of slot part that is formed on the laser diode equipped section, just can be loaded onto semiconductor Laser device.And among the present invention, side constitutes the very big introduction part of opening in front of the direction of insertion of slot part, so heat sink inserts slot part easily, and becomes the posture that is pushed to another sidewall by the location division when being inserted into the depths naturally.Therefore, when heat sink is inserted slot part, can avoid heat sink to be tangled by sidewall and tilt to pack in slot part inside.And, when heat sink is inserted into the slot part depths, the pushing of the heat sink portion of being positioned, the end face and another sidewall that become reference field are close to.Therefore, semiconductor Laser device correctly can be fixed in the assigned position of slot part inside.
Claims (4)
1. an optical-head apparatus has: semiconductor Laser device at least; The light pack of this semiconductor Laser device ejaculation is arrived the object lens of optical recording media; Carry the framework of these object lens and aforesaid semiconductor laser diode, it is characterized in that,
Described semiconductor Laser device is carried the laser diode equipped section of on described framework, using, form cylindrical portion, can insert the described cylinder-like shell of the semiconductor Laser device of the 1st type with cylinder-like shell, simultaneously, on the internal perisporium of described cylindrical portion, form a pair of slot part, can insert the part of stretching out of described heat sink of the semiconductor Laser device of the 2nd type that heat sink stretches out to both sides to both sides.
2. optical-head apparatus according to claim 1, its characteristics be, described cylindrical portion and described slot part by shown in framework self form.
3. optical-head apparatus according to claim 1, its characteristics are that described cylindrical portion and described slot part are formed on the circular element support that is installed on the described framework,
The semiconductor Laser device of the semiconductor Laser device of described the 1st type or described the 2nd type carries on aforesaid frame by described element bracket.
4. according to each described optical-head apparatus in the claim 1 to 3, its characteristics are, the reference field of the luminous position of the laser chip of the laser ejaculation direction of expression semiconductor Laser device, in the semiconductor Laser device of described the 1st type, be formed on the end difference of the outer peripheral portion of described cylinder-like shell as ring-type, and in the semiconductor Laser device of the 2nd type, form the front end face of described heat sink
The inboard of the described cylindrical portion of described semiconductor Laser device equipped section, be provided with the 1st block with the described end difference butt of the semiconductor Laser device of the 1st type, and at 2nd block of the inside of described slot part formation with the front end face butt of the described heat sink of the semiconductor Laser device of described the 2nd type
With any lift-launch in the semiconductor Laser device of the semiconductor Laser device of described the 1st type and the 2nd type during in described laser diode equipped section, the air conversion light source position of the ejaculation direction of laser becomes unanimity.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001387089 | 2001-12-20 | ||
| JP2001387089A JP3779608B2 (en) | 2001-12-20 | 2001-12-20 | Optical head device |
| JP2001387688A JP3833934B2 (en) | 2001-12-20 | 2001-12-20 | Optical head device |
| JP2001387688 | 2001-12-20 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100589633A Division CN1300790C (en) | 2001-12-20 | 2002-12-20 | Optical head device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1428773A CN1428773A (en) | 2003-07-09 |
| CN1181481C true CN1181481C (en) | 2004-12-22 |
Family
ID=26625162
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021574766A Expired - Fee Related CN1181481C (en) | 2001-12-20 | 2002-12-20 | Optical head device |
| CNB2004100589633A Expired - Fee Related CN1300790C (en) | 2001-12-20 | 2002-12-20 | Optical head device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100589633A Expired - Fee Related CN1300790C (en) | 2001-12-20 | 2002-12-20 | Optical head device |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN1181481C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019066522A (en) * | 2017-09-28 | 2019-04-25 | 日本電産株式会社 | Rotary drive device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06152067A (en) * | 1992-11-10 | 1994-05-31 | Seiko Epson Corp | Semiconductor laser unit and optical head for optical memory device |
| JPH10214437A (en) * | 1997-01-31 | 1998-08-11 | Toshiba Corp | Optical unit and production therefor |
| JPH11273122A (en) * | 1998-03-20 | 1999-10-08 | Olympus Optical Co Ltd | Optical pickup |
| CN1271932A (en) * | 1999-04-28 | 2000-11-01 | 株式会社三协精机制作所 | Photo collecting device |
-
2002
- 2002-12-20 CN CNB021574766A patent/CN1181481C/en not_active Expired - Fee Related
- 2002-12-20 CN CNB2004100589633A patent/CN1300790C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1300790C (en) | 2007-02-14 |
| CN1571042A (en) | 2005-01-26 |
| CN1428773A (en) | 2003-07-09 |
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Owner name: NIDEC SANKYO CORP. Free format text: FORMER NAME OR ADDRESS: SANKYO SEIKI MFG. SEISAKUSHO K.K. |
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Address after: Nagano Patentee after: Sankyo Seiki Seisakusho KK Address before: Nagano Patentee before: Sankyo Seiki Manufacturing Co., Ltd. |
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Granted publication date: 20041222 Termination date: 20100120 |