CN118119479A - High precision substrate polishing system - Google Patents

Abstract

The retaining ring according to one embodiment includes: a core part formed in a ring shape and including a metal material; and an injection molded portion molded around a core portion to encase the core portion, the core portion comprising: a core body formed in a ring shape; and at least one through hole formed through the core body.

Description

High precision substrate polishing system

Technical Field

The following embodiments relate to high precision substrate polishing systems.

Background

A Chemical Mechanical Polishing (CMP) process including polishing, buffing (buffing), and washing is required to manufacture the semiconductor device. The semiconductor element has a form of a multilayer structure, and a transistor element having a diffusion region is formed on the substrate layer. On the substrate layer, metal wires are electrically connected to transistor elements that are patterned and form functional elements. The patterned conductive layer is insulated from other conductive layers by insulating materials such as silicon dioxide, as is well known. As more metal layers and their associated insulating layers are formed, it is necessary to planarize the insulating material. Without planarization, it is virtually difficult to fabricate more metal layers due to many variations in surface morphology. Also, since the metal line pattern is an insulating material, the metal CPM process removes the excess metal material.

The CPM process includes a polishing process that physically grinds the substrate surface to achieve planarization. The polishing process is to physically grind a substrate by rubbing the substrate against a polishing pad having grooves on the surface. In this process, in order to prevent the substrate held by the carrier head from being pushed to the outside, a fixing ring is provided on the outside of the substrate.

On the other hand, when polishing a substrate, since the retainer ring is in contact with the polishing pad and worn away, uneven surface flatness occurs as polishing proceeds. For this purpose, a scheme is introduced in which the fixing ring is divided into a metal part and a plastic part, and the plastic part is used to form a part where abrasion occurs. However, with this structure, a phenomenon in which the plastic portion is detached from the metal portion may occur due to friction with the polishing pad.

The foregoing background art is what the inventors have learned or learned during the development of the invention and is not to be construed as necessarily the known technology disclosed to the general public before applying for the invention.

Disclosure of Invention

An object of an embodiment of the present invention is to provide a retainer ring and a substrate polishing apparatus including the retainer ring, wherein the retainer ring includes a core portion made of metal and an injection molding portion surrounding the core portion.

An object of an embodiment of the present invention is to provide a retainer ring and a substrate polishing apparatus including the retainer ring capable of preventing an injection molded part from being detached from a core part by improving a coupling force of the core part and the injection molded part.

An object of an embodiment of the present invention is to provide a retainer ring and a substrate polishing apparatus including the retainer ring, capable of preventing a core portion and an injection molded portion from cracking and/or twisting due to a difference in shrinkage of different materials.

The fixing ring according to an embodiment may include: a core part formed in a ring shape and including a metal material; and an injection molded portion molded around the core to encase the core, the core may include: a core body formed in a ring shape; and at least one through hole formed through the core body.

The injection molded part may include: an injection body having a hollow formed therein in a shape corresponding to the core portion so that the core portion is located therein; and a columnar portion inserted into the through hole and having a shape corresponding to the through hole.

The injection molded body may include: an upper side injection body located on an upper side of the core portion; and a lower side injection molded body located at a lower side of the core portion.

The columnar portion may connect the upper injection-molded body and the lower injection-molded body.

The injection molded body may further include: an inner injection molded body located inside the core portion; an outer injection molded body located outside the core portion.

The inner injection body may be formed in a stepped shape with a lower portion protruding inward than an upper portion.

The stepped surface of the inner injection-molded body may be formed to be inclined downward as it is inward.

The outer injection body may be formed in a stepped shape with an upper portion protruding further outward than a lower portion.

The outer circumferential surface of the core body may include: a first outer peripheral surface; and a second outer peripheral surface which is located on the opposite lower side than the first outer peripheral surface and is located on the opposite inner side recessed position than the first outer peripheral surface.

The through holes may be formed in plurality and arranged at intervals along the circumferential direction of the core body.

The core portion may further include: and a notch portion formed by cutting inward from the outer peripheral surface of the core body.

The cutout portion may be formed at a position communicating with the through hole.

The notched portion can prevent shape deformation due to difference in shrinkage ratio between the core portion and the injection molded portion.

The injection molded part may comprise an engineering plastic material.

The core portion may further include: a socket for connecting the retaining ring to a carrier head.

A substrate polishing apparatus according to an embodiment may include: the retaining ring of claim 1; and a carrier head connected to an upper side of the fixing ring.

According to the fixing ring of the embodiment, since the through hole is formed in the core portion, the coupling force of the core portion and the injection-molded portion can be improved, and the injection-molded portion can be prevented from being separated from the core portion.

According to the fixing ring of the embodiment, since the notch is formed in the core portion, it is possible to prevent the core portion and the injection-molded portion from cracking and/or twisting due to the difference in shrinkage of different materials.

The substrate polishing apparatus according to an embodiment may include the above-described retainer ring.

The effects of the retainer ring and the substrate polishing apparatus including the retainer ring according to an embodiment are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by a person of ordinary skill from the following description.

Drawings

Fig. 1 is a schematic diagram of a substrate polishing apparatus according to an embodiment.

Fig. 2 is a schematic cross-sectional view of a substrate carrier according to an embodiment.

Fig. 3 is a perspective view of a core portion according to an embodiment.

Fig. 4 is a plan view of a core portion according to an embodiment.

FIG. 5 is a cross-sectional view taken along line I-I of FIG. 4.

Fig. 6 is an upper perspective view of a retaining ring according to an embodiment.

Fig. 7 is a lower perspective view of a retaining ring according to an embodiment.

Fig. 8 is a plan view of a retaining ring according to an embodiment.

Fig. 9 is a cross-sectional view taken along line ii-ii of fig. 8.

Fig. 10 is a cross-sectional view taken along line iii-iii of fig. 8.

Detailed Description

This patent application claims priority from patent application Ser. No. 10-2021-0182665, filed on 12 months 20 of 2021, the entire contents of which are incorporated herein by reference.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Many modifications may be made to the embodiments, and the scope of the application is not limited or restricted to the following embodiments. It should be understood that all changes made to the embodiments, and equivalents and alternatives thereof, are within the scope of the claims.

The terminology used in the implementations is for the purpose of describing particular embodiments only and is not intended to be limiting of scope. Where not specifically stated in the context, singular expressions include plural meanings. In this specification, the terms "comprises" and "comprising," and the like, are used to specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.

All terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art without other definitions. Terms commonly used as dictionary defined should be understood as meaning in the related art, and should not be interpreted as idealized or excessively formalized meaning without being explicitly defined in the specification.

In the description with reference to the drawings, the same reference numerals are used for the same components irrespective of the reference numerals, and duplicate descriptions are omitted. In describing the embodiments, when it is judged that detailed description of the related known art will unnecessarily obscure the gist of the embodiments, detailed description thereof will be omitted.

In describing the constituent elements of the embodiment, the terms of first, second, A, B, (a), (b), and the like may be used. These terms are only used to distinguish one element from another element and are not intended to limit the nature, order, sequence, etc. of the corresponding elements. It will be understood that when one component is described in the specification as being "connected", "coupled" or "contacting" another component, the component may be directly "connected" or "contacting" the other component, but still another component may be "connected", "coupled" or "contacting" between the components.

When one component has a common function with a component of one embodiment, the same name is used to describe the component in other embodiments. In the case where the contrary is not mentioned, the description of one embodiment can be applied to other embodiments, and the detailed description is omitted for repeated matters.

Fig. 1 is a schematic diagram of a substrate polishing apparatus according to an embodiment. Fig. 2 is a schematic cross-sectional view of a substrate carrier according to an embodiment.

Referring to fig. 1 and 2, a substrate polishing apparatus 1 according to an embodiment may be used for a CMP process of a substrate W.

In one embodiment, the substrate W may be a silicon wafer (si i icon wafer) for manufacturing semiconductor devices (semiconductor). However, the type of the substrate W is not limited thereto. For example, the substrate W may include glass for a flat panel display device (FPD, F L AT PANE L D I SP L AY DEVICE) such as a liquid crystal display (LCD, l iqu ID CRYSTA L D I SP L AY), a plasma display panel (PDP, P L ASMA D I SP L AY PANE L).

In an embodiment, the substrate polishing apparatus 1 may be used to polish a substrate W. The substrate polishing apparatus 1 may include a substrate carrier 10 and a polishing unit U.

In an embodiment, the polishing unit U may be used to polish a surface to be polished of the substrate W. The polishing unit U may include a polishing disk T and a polishing pad P.

In one embodiment, the polishing pad P may be attached to the polishing platen T. For example, the polishing pad P may be attached to an upper portion of the polishing pad T. The polishing disk T polishes a surface to be polished of the substrate W in contact with the polishing pad P as rotating about an axis. The polishing pad T can adjust the position of the polishing pad P with respect to the floor by moving up and down. The polishing pad P may physically abrade the surface to be polished of the substrate W by contacting the surface to be polished of the substrate W. For example, the polishing pad P can comprise polyurethane (po lyurethane) material.

Referring to fig. 2, in an embodiment, a substrate carrier 10 may be used to hold a substrate W. The substrate carrier 10 may clamp and hold a substrate W to be polished, and move the held substrate W to an upper portion of the polishing pad P. The substrate carrier 10 may bring the substrate W, which is carried to the upper portion of the polishing pad, into contact with the polishing pad P to polish the substrate W. The substrate carrier 10 adjusts the frictional force between the substrate W and the polishing pad P by pressurizing the substrate W in contact with the polishing pad P, thereby determining the degree of polishing of the substrate W. The substrate carrier 10 may include a carrier head 11, a membrane 12, and a retaining ring 20.

In an embodiment, the carrier head 11 may adjust the position of the substrate W. The carrier head 11 receives power from the outside and rotates centering on an axis perpendicular to the P-face of the polishing pad. As the carrier head 11 rotates, the held substrate W can be polished while rotating in contact with the polishing pad P.

In one embodiment, the carrier head 11 may move the substrate W horizontally. For example, the carrier head 11 may move in a first direction parallel to the P-face of the polishing pad and a second direction perpendicular to the first direction. The carrier head 11 can move the substrate W on a plane parallel to the P-face of the polishing pad by the combined movement in the first direction and the second direction. As a result, the substrate W can be carried to or removed from the polishing position by the horizontal movement of the carrier head 11.

In one embodiment, the carrier head 11 may move the substrate W up and down relative to the ground. The carrier head 11 may move up and down with respect to a support portion of the substrate W to clamp/separate the substrate W or move up and down with respect to the polishing pad P to polish the substrate W.

In an embodiment, the diaphragm 12 may be connected to the carrier head 11 and form a pressure chamber C that applies pressure to the substrate W. As the pressure of the pressure chamber C formed by the diaphragm 12 changes, the pressure acting on the substrate W can be adjusted. For example, the degree to which the substrate W presses the polishing pad P may be increased by increasing the pressure of the pressure chamber C in a state where the substrate W is in contact with the polishing pad P. Diaphragm 12 may include a bottom plate that forms the bottom surface of pressure chamber C and a spacer that forms the side wall of pressure chamber C. A plurality of spacers may be formed and have different radii with respect to the center of the bottom plate, and different spaces between adjacent spacers may form the respective pressure chambers C. Different pressures may be applied to the pressure chambers C, and the substrate W portions corresponding to the respective pressure chambers C may be locally pressurized according to the pressures applied to the different pressure chambers C.

In one embodiment, the fixing ring 20 may be connected to the carrier head 11 to wrap around the held substrate W. The fixing ring 20 can prevent the substrate W from being separated from the holding position. For example, the fixing ring 20 may support a side surface of the substrate W, thereby preventing the substrate W from being detached from the substrate carrier 10 due to vibration and/or friction generated during the polishing of the substrate W.

In one embodiment, the retaining ring 20 may be directly attached or indirectly attached to the carrier head 11 via a separate coupling member. For example, the retaining ring 20 may be attached to the underside (e.g., -z-axis direction) of the carrier head 11 by a coupling (e.g., a bolt). The retaining ring 20 may include a core portion 21 and an injection molded portion 22.

Fig. 3 is a perspective view of a core portion according to an embodiment. Fig. 4 is a plan view of a core portion according to an embodiment. FIG. 5 is a cross-sectional view taken along line I-I of FIG. 4.

Referring to fig. 3 to 5, in an embodiment, the core portion 21 may be formed in a ring shape. The core 21 is located substantially inside a retaining ring (e.g., retaining ring 20 in fig. 2). The core 21 may comprise a metallic material. For example, the core 21 may comprise a stainless steel material.

In an embodiment, the core portion may include a core body 211, a through hole 212, a notch 213, and a receptacle 214.

In an embodiment, the core body 211 may form the outer shape of the core portion 21. The core body 211 may be formed in a ring shape. The core body 211 may be formed with a through hole 212, a cutout 213, and an insertion hole 214, which will be described below.

In an embodiment, the outer circumferential surface (e.g., the surface in the +x-axis direction with reference to fig. 5) of the core body 211 may be formed in a stepped shape. For example, the outer circumferential surface of the core body 211 may include a first outer circumferential surface 211a, a second outer circumferential surface 211b, and a stepped surface 211c. The first outer circumferential surface 211a may be substantially located at an upper side (e.g., +z-axis direction) of the core body 211, and the second outer circumferential surface 211b may be substantially located at a lower side (e.g., -z-axis direction) of the core body 211. That is, the second outer peripheral surface 211b may be located on the lower side (e.g., -z-axis direction) with respect to the first outer peripheral surface 211 a. The second outer peripheral surface 211b may be recessed inward (e.g., in the-x axis direction with reference to fig. 5) relative to the first outer peripheral surface 211 a. For example, based on fig. 5, the second outer peripheral surface 211b is relatively recessed in the-x axis direction as compared with the first outer peripheral surface 211 a. The stepped surface 211c connecting the first outer peripheral surface 211a and the second outer peripheral surface 211b may be formed substantially in the horizontal direction (for example, the x-axis direction).

In an embodiment, the through hole 212 may be formed through the core body 211. For example, the through-holes 212 may be formed vertically (e.g., in the z-axis direction) through the core body 212. The through hole 212 may be formed in a substantially cylindrical shape. But this is merely an example and the shape of the through hole 212 is not limited thereto.

In an embodiment, at least one more via 212 may be formed. For example, a plurality of through holes 212 may be formed, and the plurality of through holes 212 may be arranged at intervals along the circumferential direction of the core main body 211. The plurality of through holes 212 may have substantially the same size. Or a portion of the plurality of through holes 212 may have a different size. This is merely an example and the number and/or size of vias 212 is not limited thereto.

In an embodiment, the notch 213 may be cut from the outer circumferential surface (e.g., radially outer side) of the core body 211 to the inner side (e.g., radially inner side). The cutout 213 may be formed at a position communicating with the through hole 212. For example, the notch 213 may be formed by cutting a predetermined width inward (e.g., radially inward) from an outer end (e.g., radially outer end) of the core body 211 to a position communicating with the through hole 212. One or more cut-out portions 213 may be formed. However, this is merely an example, and the number and/or shape of the cutout portions 213 are not limited thereto. The notch 213 can function to prevent shape deformation due to difference in shrinkage ratio between the core portion 21 and the injection molded portion 22.

In one embodiment, receptacles 214 may be formed through core body 211. For example, receptacles 214 may be formed vertically (e.g., in the z-axis direction) through core body 211. The insertion hole 214 may be formed in a substantially cylindrical shape. This is merely an example, however, and the shape of the receptacle 214 is not limited thereto.

In one embodiment, at least one or more receptacles 214 may be formed. For example, a plurality of insertion holes 214 may be formed, and the plurality of insertion holes 214 may be arranged at intervals in the circumferential direction of the core body 211. The receptacle 214 may be smaller in size than the through hole 212. The number of receptacles 214 may correspond to the number of through holes 212. For example, the receptacle 214 may be adjacent to the through hole 212. The insertion holes 214 and the through holes 212 may be alternately arranged in the circumferential direction of the core body 211. This is merely an example and the number and/or size of receptacles 214 is not limited thereto.

In an embodiment, the receptacle 214 may be a hole for connecting a retaining ring (e.g., retaining ring 20 of fig. 2) to the carrier head 11 (e.g., carrier head 11 of fig. 2). For example, a fastener (e.g., a bolt, etc.) may be inserted into the receptacle 214 to secure the retaining ring 20 to the carrier head 11. For example, threads may be formed on the inner peripheral surface of the insertion hole 214.

Fig. 6 is an upper perspective view of a retaining ring according to an embodiment. Fig. 7 is a lower perspective view of a retaining ring according to an embodiment. Fig. 8 is a plan view of a retaining ring according to an embodiment. Fig. 9 is a cross-sectional view taken along line ii-ii of fig. 8. Fig. 10 is a cross-sectional view taken along line iii-iii of fig. 8.

Referring to fig. 3 to 10, in an embodiment, an injection molded portion 22 is formed to encase the core portion 21. The injection-molded portion 22 may be molded around the core portion 21. For example, the injection-molded portion 22 may be molded over the entire surface of the core portion 21. For example, the injection-molded part 22 may be molded over the entire surface within the mold frame of the fixed core part 21. The injection molded part 22 may be substantially joined to the core part 21 by injection molding.

In one embodiment, the injection molded portion 22 may be formed of a different material than the core portion 21. For example, the injection molded portion 22 may comprise an engineering plastic material. For example, the injection molded portion 22 may include Polyetheretherketone (PEEK). Since the core portion 21 and the injection molding portion 22 have different materials, the core portion 21 and the injection molding portion 22 may have different shrinkage rates. Since the core portion 21 and the injection molded portion 22 have different shrinkage rates, cracks and/or warpage may occur in the core portion 21 and/or the injection molded portion 22 during cooling of the injection molded article after injection molding, but the slit 213 formed in the core portion 21 may prevent such cracks and/or warpage. For example, the space formed by the cutout 213 may serve as a buffer space for shrinkage or expansion that may occur during cooling, and thus, even if shrinkage rates of the core portion 21 and the injection-molded portion 22 are different, occurrence of cracks and/or warpage may be prevented.

In one embodiment, the injection molded portion 22 may include an injection molded body 221, a post 222, an upper receptacle 223, a bottom surface groove 224, and an inner Zhou Tongkong.

In one embodiment, the interior of the injection molded body 221 may be formed with a hollow S for the core 21 to be located therein. The shape of the hollow S may substantially correspond to the core 21. The core 21 is located in the hollow S, and the injection molded body 221 may wrap around the core 21. For example, the injection molded body 221 may be a portion injection molded on the outer side surface of the core portion 21.

In one embodiment, the injection molding body 221 may include an upper injection molding body 2211, a lower injection molding body 2212, an inner injection molding body 2213, and an outer injection molding body 2214.

In an embodiment, the upper injection body 2211 may be a portion located on the upper side (e.g., +z axis direction) of the core portion 21. The upper injection body 2211 may be a portion injection-molded substantially on the upper surface (for example, a surface in the +z-axis direction) of the core portion 21. That is, the upper injection body 2211 may constitute an upper (e.g., +z axis direction) portion of the injection body 221. For example, the upper injection body 2211 may be positioned to contact an upper face (e.g., a face in the +z axis direction) of the core portion 21.

In one embodiment, the lower injection molding 2212 may be a portion located on the lower side (e.g., -z-axis direction) of the core portion 21. The lower injection body 2212 may be a portion injection-molded substantially under the core portion 21 (e.g., -z-axis direction face). That is, the lower injection body 2212 may constitute a lower (e.g., -z-axis direction) portion of the injection body 221. For example, the lower injection molding 2212 may be positioned to contact the underside of the core 21 (e.g., -a z-axis directional face).

In one embodiment, the inner injection molding 2213 may be a portion located inside the core 21 (e.g., in the-x-axis direction with reference to fig. 9). The inner injection molding 2213 may be a portion injection molded substantially on the inner peripheral surface of the core portion 21. That is, the inner injection body 2213 may constitute an inner peripheral portion of the injection body 221. For example, the inner injection body 2213 may be positioned to contact the inner peripheral surface of the core portion 21.

In one embodiment, the inner injection body 2213 may be formed in a stepped shape such that a lower portion (e.g., -z-axis direction portion) protrudes further inward (e.g., -x-axis direction with reference to fig. 9) than an upper portion (e.g., +z-axis direction portion). For example, the inner circumferential surface of the inner injection body 2213 may include an upper inner circumferential surface 2213a, a lower inner circumferential surface 2213b, and an inner stepped surface 2213c. The lower inner circumferential surface 2213b may be formed at a position protruding further inward (for example, in the-x axis direction with reference to fig. 9) than the upper inner circumferential surface 2213 a. The inner step surface 2213c may be formed to be inclined downward (e.g., -z-axis direction) as it is inward (e.g., -x-axis direction with reference to fig. 9). However, this is merely an example, and the shape of the inner injection body 2213 is not limited thereto.

In one embodiment, the outer injection molding 2214 may be a portion located outside the core 21 (e.g., in the +x-axis direction with reference to fig. 9). The outer injection molding 2214 may be a portion injection molded substantially on the outer peripheral surface of the core portion 21. That is, the outer injection body 2214 may constitute an outer peripheral portion of the injection body 221. For example, the outer injection body 2214 may be positioned to contact the outer peripheral surface of the core portion 21.

In one embodiment, the outer injection molding 2214 is formed in a stepped shape such that an upper portion (e.g., +z-axis direction portion) protrudes further outward (e.g., +x-axis direction with reference to fig. 9) than a lower portion (e.g., -z-axis direction portion). For example, the outer circumferential surface of the outer injection body 2214 may include an upper outer circumferential surface 2214a, a lower outer circumferential surface 2214b, and an outer stepped surface 2214c. The upper outer circumferential surface 2214a may be formed at a position protruding further outward (for example, in the +x axis direction with reference to fig. 9) than the lower outer circumferential surface 2214 b. The outer stepped surface 2214c may be formed substantially in a horizontal direction (for example, an x-axis direction). However, this is merely an example, and the shape of the outer injection body 2214 is not limited thereto.

In one embodiment, the columnar portion 222 may be inserted into the through hole 212 to form a shape substantially corresponding to the through hole 212. For example, the columnar portion 222 may be a portion injection molded inside the through hole 212. The columnar portion 222 may be formed at a position corresponding to the through hole 212. The column 222 may pass through the hollow S to substantially connect the upper and lower injection-molded bodies 2211 and 2212. According to such a structure, since the injection-molded part 22 penetrates the core part 21 through the columnar part 222, the bonding force of the injection-molded part 22 with the core part 21 can be improved. Thereby, even if vibration and/or friction are generated in the polishing process, the injection molded part 22 can be prevented from being detached with respect to the core part 21. In one aspect, the columnar portion 222 may further include a recessed portion 2221 recessed from an upper surface (e.g., +z-axis direction surface) of the upper columnar portion 222 to a lower side (e.g., -z-axis direction).

In an embodiment, the upper receptacle 223 may be formed at a location in communication with the receptacle 214 of the core 21. The upper insertion hole 223 may be formed through the upper injection body 2211 of the injection part 22 so that the upper insertion hole 223 communicates with the insertion hole 214 of the core part 21. For example, the upper receptacle 223 may be larger in cross-section than the receptacle 214 of the core 21. A coupling (e.g., a bolt, etc.) may be inserted into the upper receptacle 223 and the receptacle 214 for connecting the retaining ring 20 to a carrier head (e.g., carrier head 11 of fig. 2). This is merely an example, however, and the shape of the upper insertion hole 223 is not limited thereto.

In one embodiment, the bottom surface groove 224 may be formed in a lower portion (e.g., -z-axis direction portion) of the injection molded portion 22. For example, the bottom surface groove 224 may be recessed from the lower surface (e.g., -z-axis direction surface) of the lower injection body 2212 to the upper side (e.g., +z-axis direction). The bottom surface groove 224 may be formed to extend from the inner circumferential surface to the outer circumferential surface of the injection-molded portion 22 so as to penetrate the injection-molded portion 22 in the radial direction. The bottom surface groove 224 may be inclined in a radial direction. This is merely an example, however, and the floor slots 224 may be parallel to the radial direction. A plurality of bottom surface grooves 224 may be formed. The plurality of bottom surface grooves 224 may be formed at intervals along the circumferential direction of the injection-molded part 22. The bottom surface groove 224 may serve as a passage for discharging slurry and/or particles, etc. located in the inner space formed by the fixing ring 20 to the outside of the fixing ring 20.

In one embodiment, the inner Zhou Tongkong may be formed through the inner peripheral side of the injection-molded portion 22 from the underside (e.g., -z-axis direction). For example, the inner Zhou Tongkong 225 may be formed through the inner injection-molded body 2213 from a lower face (e.g., -z-axis direction face) of the inner injection-molded body 2213 to an upper direction (e.g., +z-axis direction). The inner Zhou Tongkong 225 may be formed in communication with the floor tub 224. The width of the inner Zhou Tongkong may be less than the width of the floor slot 224. For example, the inner Zhou Tongkong may be formed in a cylindrical shape. This is merely an example, however, and the shape of the inner Zhou Tongkong is not limited thereto.

In summary, the embodiments are described with limited figures, and a person of ordinary skill in the art can make various modifications and variations based on the description. For example, the described techniques may be performed sequentially, in a manner different from the described methods, and/or the components of the described systems, structures, devices, circuits, etc. may be combined or combined, or substituted or replaced with other components or equivalents, in a manner different from the described methods, to obtain appropriate results.

Accordingly, other implementations, other embodiments, and equivalents of the claims are within the scope of the following claims.

Claims (16)

1. A fixing ring is characterized in that,

Comprising the following steps:

a core part formed in a ring shape and including a metal material; and

An injection molded portion molded around the core portion to encase the core portion,

The core portion includes:

A core body formed in a ring shape; and

At least one through hole is formed through the core body.

2. The retaining ring of claim 1, wherein the retaining ring is configured to retain the retaining ring in the retaining ring,

The injection molding part includes:

an injection body having a hollow formed therein in a shape corresponding to the core portion so that the core portion is located therein; and

And a columnar portion inserted into the through hole and having a shape corresponding to the through hole.

3. The retaining ring of claim 2, wherein the retaining ring is configured to retain the retaining ring in the retaining ring,

The injection molding body comprises:

an upper side injection body located on an upper side of the core portion; and

And a lower injection molding body positioned at the lower side of the core part.

4. A retaining ring as claimed in claim 3, characterized in that,

The columnar part is connected with the upper injection molding body and the lower injection molding body.

5. A retaining ring as claimed in claim 3, characterized in that,

The injection molding body further comprises:

An inner injection molded body located inside the core portion; and

An outer injection molded body located outside the core portion.

6. The retaining ring of claim 5, wherein the retaining ring comprises a plurality of retaining rings,

The inner injection molding is formed in a stepped shape with a lower portion protruding inward than an upper portion.

7. The retaining ring of claim 6, wherein the retaining ring comprises a plurality of retaining rings,

The stepped surface of the inner injection-molded body is inclined downward as it is inward.

8. The retaining ring of claim 5, wherein the retaining ring comprises a plurality of retaining rings,

The outer injection molding is formed in a stepped shape with an upper portion protruding further outward than a lower portion.

9. The retaining ring of claim 1, wherein the retaining ring is configured to retain the retaining ring in the retaining ring,

The outer peripheral surface of the core body includes:

A first outer peripheral surface; and

And a second outer peripheral surface which is located on the opposite lower side than the first outer peripheral surface and is located on the opposite inner side recessed position than the first outer peripheral surface.

10. The retaining ring of claim 1, wherein the retaining ring is configured to retain the retaining ring in the retaining ring,

The through holes are formed in plurality and are arranged at intervals along the circumferential direction of the core body.

11. The retaining ring of claim 1, wherein the retaining ring is configured to retain the retaining ring in the retaining ring,

The core portion further comprises:

and a notch portion formed by cutting inward from the outer peripheral surface of the core body.

12. The retaining ring of claim 11,

The cutout portion is formed at a position communicating with the through hole.

13. The retaining ring of claim 12, wherein the retaining ring comprises a plurality of retaining rings,

The notched portions prevent shape deformation due to difference in shrinkage ratio between the core portion and the injection molded portion.

14. The retaining ring of claim 1, wherein the retaining ring is configured to retain the retaining ring in the retaining ring,

The injection molding part comprises engineering plastic materials.

15. The retaining ring of claim 1, wherein the retaining ring is configured to retain the retaining ring in the retaining ring,

The core portion further comprises:

a socket for connecting the retaining ring to a carrier head.

16. A substrate polishing apparatus, characterized in that,

Comprising the following steps:

The retaining ring of claim 1; and

A carrier head connected to an upper side of the stationary ring.