CN1181145C - Welding-resistant low-alkaline ink for developing and photosenstive imaging - Google Patents
Welding-resistant low-alkaline ink for developing and photosenstive imaging Download PDFInfo
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- CN1181145C CN1181145C CNB021342679A CN02134267A CN1181145C CN 1181145 C CN1181145 C CN 1181145C CN B021342679 A CNB021342679 A CN B021342679A CN 02134267 A CN02134267 A CN 02134267A CN 1181145 C CN1181145 C CN 1181145C
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Abstract
The present invention relates to welding-resistant low-alkaline ink for developing and photosensitive imaging, which comprises main body resin: 50 to 70 wt% of modified propenoate photosensitive oligomer of 10-20 wt% of epoxy resin, and reactive diluent: 5 to 20 wt% of multi-function propenoate, 5 to 15 wt% of photoinitiator, 7.5 to 30 wt% of stuffing, 0.5 to 1.0 wt% of pigment, and 0 of silicon oil or micro silicon oil. The welding-resistant low-alkaline ink has good performance. A printed circuit board made by the welding-resistant low-alkaline ink has the advantages of high temperature resistance and good glossiness. After the welding-resistant low-alkaline ink is treated by the high temperature of more than 260 DEG C, a color of an ink coating layer is not changed, and the ink coating layer is not carbonized, burst and fallen off. The glossiness is enhanced more than before high temperature treatment, and the appearance of printed circuit board is increased.
Description
Technical field
The present invention relates to a kind of welding-resistant low-alkaline ink for developing and photosenstive imaging.
Background technology
Computer product makes rapid progress, and electric equipment products such as Communication Equipment update development rapidly, and 21st century has been the age that the mankind enter development in Hi-Tech and utilization.Social development needs electric equipment products, and electric equipment products be unable to do without circuit card, circuit card from single face to two-sided to multilayer, the product accuracy requirement is more and more higher, to making material, particularly printed circuit board (PCB) (PCB) printing ink of circuit card, requires very strict.More in the market PCB printing ink has TAM, the Taiwan sun, Britain Gao Shi, Singapore friend connection; It is patent achievement technology of Beijing University of Chemical Technology that there are two families in China.The existing photosensitive imaging welding resistance printing ink prebake conditions time is long, and two-sided is 50-55 minute altogether, bake out temperature height (75 ℃), and production efficiency is low, and the cost height is bad with printed circuit board (PCB) poor heat resistance, glossiness that it is made.
The content of invention
The purpose of this utility model be exactly for overcome the existing photosensitive imaging welding resistance printing ink prebake conditions time long, bake out temperature is high, production efficiency printed circuit board (PCB) thermotolerance low, that make is low, the shortcoming of glossiness difference, provide a kind of prebake conditions time short, bake out temperature is low, production efficiency is high, the welding-resistant low-alkaline ink for developing and photosenstive imaging that printed circuit board (PCB) is high temperature resistant, glossiness is good made.
Technical scheme of the present invention: a kind of welding-resistant low-alkaline ink for developing and photosenstive imaging is characterized in that it comprises:
By weight percentage,
Matrix resin: the photosensitive oligopolymer 50-70 of modification acrylate
Resins, epoxy 10-20
Reactive diluent: polyfunctional acrylic ester 5-20
Light trigger 5-15
Filler 7.5-30
Pigment 0.5-1.0
Silicone oil 0 or trace
Wherein
Polyfunctional acrylic ester is selected from the 1-3 kind of hydroxyethyl methylacrylate, Rocryl 410, polyoxyethylene glycol mono acrylic ester, polypropylene glycol mono acrylic ester, Viscoat 295, pentaerythritol triacrylate, dipentaerythritol acrylate, glycerine methacrylic ester or methacryloyl amine;
The photosensitive oligopolymer of modification acrylate prepares by the following method:
Prescription by weight percentage
1. ethylene glycol ether acetate 25-40
2. itaconic anhydride 8-10
3. vinylbenzene 20-30
4. butyl methacrylate 15-20
5. hydroxyethyl methylacrylate 10-15
6. benzoyl peroxide 1-4
7.2,6-toluene di-tert-butyl phenol 0.3-0.5
Screening formulation is: by weight percentage
1. ethylene glycol ether acetate 40
2. itaconic anhydride 8
3. vinylbenzene 24
4. butyl methacrylate 15
5. hydroxyethyl methylacrylate 10
6. benzoyl peroxide 2.5
7.2,6-toluene di-tert-butyl phenol 0.5
The aforementioned body resin: behind 2,3,4 in the photosensitive oligopolymer preparation method's of modification acrylate the prescription, the component mixed dissolution, be added drop-wise in the there-necked flask of 1 component, temperature is 100-150 ℃, reacted 5 hours, and be cooled to 100-80 ℃ then and add component 5,6,7, continue reaction 3-4 hour, cooling discharge, promptly make the good oligopolymer of transparency, underpressure distillation improves viscosity, 10000-12000 milli pascal when its viscosity is 25 ℃. and second (measuring) with the NDJ-79 rotational viscosimeter.
Above-mentioned Resins, epoxy is WSR6101, E-44 (Wuxi resin processing plant product).
Initiator is selected from a kind of of benzophenone, anthraquinone class, bitter almond oil camphor, benzoin iso-propylether, thioxanthone or morpholine or two kinds in the welding resistance printing ink.
Filler is selected from talcum powder, height
Soil or silica powder a kind of or their mixture.
Pigment is selected for use according to the printing ink required color.
The preparation method of welding-resistant low-alkaline ink for developing and photosenstive imaging of the present invention is to be 10-15u with being pressed into fineness with three Roller machines behind above-mentioned formula material mixing together, viscosity 15000-30000 milli pascal. second/printing ink of 25 ℃ (measuring with the NDJ-79 rotational viscosimeter).
Its matrix resin composition of welding-resistant low-alkaline ink for developing and photosenstive imaging provided by the invention can not be lower than 50%, otherwise can influence film-forming properties, high thermal resistance and the glossiness of printing ink; If be higher than more than 70%, the viscosity of China ink increases, and influences printability.Resins, epoxy can not be less than 10% in printing ink, otherwise can influence the thermofixation performance, makes the ink film non-refractory, if more than 20%, then can influence developing powder.Reactive polyfunctional monomer can not be less than 5%, otherwise can influence light-cured performance, if more than 20%, can cause ink film not do, sticking film during exposure.Light trigger can not be lower than 5%, otherwise can influence light-cured performance, if more than the black stability of 15% meeting influence, and cost up.Filler is no less than 7.5%, otherwise can make the ink film became uneven of lines even, if be higher than 30%, can make China ink produce the thickening phenomenon, and the performance of influence China ink.
Welding-resistant low-alkaline ink for developing and photosenstive imaging provided by the invention, the printed circuit board (PCB) of making, high temperature resistant, glossiness good, through pyroprocessing more than 260 ℃, ink coating nondiscoloration, not carbonization, not explosion, do not come off, and glossiness has improved the outward appearance level of circuit card than without improving a lot before the pyroprocessing.
Method with ink printing circuit card of the present invention is as follows: it is screen-printed on the circuit card with 40-50T, after 80 ℃ of oven dry in 20-30 minute, is 300-500mj/cm with 5kw-7kw high pressure mercury vapour lamp exposure energy
2, use the 1-2% aqueous sodium carbonate, pressure 2.8kg/cm
2Spray developing can obtain clear image.Through 150 ℃ of thermal treatments in 1 hour, the tin stove soaked 1 minute 30 seconds more than 260 ℃ then, ink coating nondiscoloration, not carbonization, non-foaming, do not come off, again through 220 ℃ of wickings, 240 ℃ of hot blasts, blast 3kg/cm
2Handle, make high-accuracy printed circuit board.
The concrete mode of implementing
Further specify the present invention below in conjunction with embodiment, but should not be construed as limiting the present invention.
Embodiment 1 prescription (weight %)
Matrix resin: the photosensitive oligopolymer 57 of modification acrylate
Resins, epoxy WSR6101, E-44 (Wuxi resin processing plant product) 13
Reactive diluent: pentaerythritol triacrylate 8
Light trigger thioxanthone 5
Filler silica powder 16.5
Pigment phthalocyanine green 0.5
To be pressed into the green ink that fineness is 10u with three Roller machines behind above-mentioned formula material mixing together, viscosity is 30000 milli pascals. second/25 ℃.Gained printing ink has good performance, and the printed circuit board (PCB) of making is high temperature resistant, glossiness good, through pyroprocessing more than 260 ℃, ink coating nondiscoloration, not carbonization, not explosion, do not come off, and glossiness has improved the outward appearance level of circuit card than without improving a lot before the pyroprocessing.
Embodiment 2 prescriptions (weight %)
Matrix resin: the photosensitive oligopolymer 60 of modification acrylate
Resins, epoxy WSR6101, E-44 (Wuxi resin processing plant product) 12
Reactive diluent: Viscoat 295 9
Light trigger thioxanthone 7
Filler kaolin 11.5
Pigment iron oxide red 0.5
To be pressed into the rust printing ink that fineness is 15u with three Roller machines behind above-mentioned formula material mixing together, viscosity is 25000 milli pascals. second/25 ℃.Gained printing ink has good performance, and the printed circuit board (PCB) of making is high temperature resistant, glossiness good, through pyroprocessing more than 260 ℃, ink coating nondiscoloration, not carbonization, not explosion, do not come off, and glossiness has improved the outward appearance level of circuit card than without improving a lot before the pyroprocessing.
Embodiment 3 prescriptions (weight %)
Matrix resin: the photosensitive oligopolymer 63 of modification acrylate
Resins, epoxy WSR6101, E-44 (Wuxi resin processing plant product) 10
Reactive diluent: pentaerythritol triacrylate 5
With dipentaerythritol acrylate 5
Light trigger thioxanthone 9
Filler silica powder and talcum powder each half 7.5
Pigment carbon black 0.5
The silicone oil trace
To be pressed into the black ink that fineness is 12u with three Roller machines behind above-mentioned formula material mixing together, viscosity is 15000 milli pascals. second/25 ℃.Gained printing ink has good performance, and the printed circuit board (PCB) of making is high temperature resistant, glossiness good, through pyroprocessing more than 260 ℃, ink coating nondiscoloration, not carbonization, not explosion, do not come off, and glossiness has improved the outward appearance level of circuit card than without improving a lot before the pyroprocessing.
Claims (5)
1. welding-resistant low-alkaline ink for developing and photosenstive imaging is characterized in that it comprises: by weight percentage,
The photosensitive oligopolymer 50-70 of modification acrylate
Resins, epoxy 10-20
Polyfunctional acrylic ester 5-20
Light trigger 5-15
Filler 7.5-30
Pigment 0.5-1.0 wherein
Polyfunctional acrylic ester is selected from the 1-3 kind of hydroxyethyl methylacrylate, Rocryl 410, polyoxyethylene glycol mono acrylic ester, polypropylene glycol mono acrylic ester, Viscoat 295, pentaerythritol triacrylate, dipentaerythritol acrylate, glycerine methacrylic ester or methacryloyl amine;
The photosensitive oligopolymer of modification acrylate prepares by the following method:
Fill a prescription by weight percentage,
1. ethylene glycol ether acetate 25-40
2. itaconic anhydride 8-10
3. vinylbenzene 20-30
4. butyl methacrylate 15-20
5. hydroxyethyl methylacrylate 10-15
6. benzoyl peroxide 1-4
7. 2,6-toluene di-tert-butyl phenol 0.3-0.5
Behind 2,3,4 component mixed dissolutions in the photosensitive oligopolymer preparation method's of above-mentioned modification acrylate the prescription, be added drop-wise in the there-necked flask of 1 component, temperature is 100-150 ℃, reacts 5 hours, is cooled to 100-80 ℃ then and adds component 5,6,7, continue reaction 3-4 hour, cooling discharge is promptly made the good oligopolymer of transparency, and underpressure distillation improves viscosity, 10000-12000 milli pascal when its viscosity is 25 ℃, this viscosity is measured with the NDJ-79 rotational viscosimeter.
2. according to a kind of welding-resistant low-alkaline ink for developing and photosenstive imaging described in the claim 1, it is characterized in that it contains silicone oil.
3. according to a kind of welding-resistant low-alkaline ink for developing and photosenstive imaging described in the claim 1, it is characterized in that the preparation method's of the photosensitive oligopolymer of modification acrylate prescription is: by weight percentage,
1. ethylene glycol ether acetate 40
2. itaconic anhydride 8
3. vinylbenzene 24
4. butyl methacrylate 15
5. hydroxyethyl methylacrylate 10
6. benzoyl peroxide 2.5
7. 2,6-toluene di-tert-butyl phenol 0.5.
4. according to a kind of welding-resistant low-alkaline ink for developing and photosenstive imaging described in the claim 1, it is characterized in that initiator is selected from a kind of of benzophenone, anthraquinone class, bitter almond oil camphor, benzoin iso-propylether, thioxanthone or morpholine or two kinds.
5. according to each described a kind of welding-resistant low-alkaline ink for developing and photosenstive imaging among the claim 1-4, it is characterized in that filler is selected from the 1-3 kind of talcum powder, kaolin or silica powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021342679A CN1181145C (en) | 2002-06-28 | 2002-06-28 | Welding-resistant low-alkaline ink for developing and photosenstive imaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021342679A CN1181145C (en) | 2002-06-28 | 2002-06-28 | Welding-resistant low-alkaline ink for developing and photosenstive imaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1390898A CN1390898A (en) | 2003-01-15 |
| CN1181145C true CN1181145C (en) | 2004-12-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB021342679A Expired - Fee Related CN1181145C (en) | 2002-06-28 | 2002-06-28 | Welding-resistant low-alkaline ink for developing and photosenstive imaging |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5291893B2 (en) * | 2007-05-08 | 2013-09-18 | 太陽ホールディングス株式会社 | Photocurable resin composition and cured product thereof |
| TW201118940A (en) * | 2009-11-20 | 2011-06-01 | Holy Stone Entpr Co Ltd | Ceramic substrate manufacturing method |
| CN103571265B (en) * | 2012-08-07 | 2014-09-24 | 上海麟多祈化工科技有限公司 | Solder resist ink with low-energy ultraviolet curing performance |
| CN102766375B (en) * | 2012-08-10 | 2014-06-11 | 复旦大学 | Method for preparing low viscosity ultraviolet (UV) curing solder resist ink |
| CN103555052A (en) * | 2013-10-30 | 2014-02-05 | 合肥市华美光电科技有限公司 | High-lubricity printing ink and preparation method thereof |
| TWI559082B (en) | 2014-07-07 | 2016-11-21 | 財團法人工業技術研究院 | Biomass material and method for manufacturing the same and print circuit board |
| CN105467774B (en) * | 2015-11-30 | 2017-10-13 | 广东星弛光电科技有限公司 | A kind of mobile phone glass protection screen exposes typography |
| CN106398393A (en) * | 2016-08-31 | 2017-02-15 | 江门市阪桥电子材料有限公司 | Thermally curable white solder-resist material and preparation method thereof |
| CN108929591B (en) * | 2018-07-17 | 2021-04-27 | 广州市红太电子科技有限公司 | Light-cured liquid photosensitive ink |
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