CN118109800A - Air exhaust ring assembly and vapor deposition equipment - Google Patents

Abstract

The invention discloses an air extraction ring assembly and vapor deposition equipment. The vapor deposition equipment comprises a reaction cavity and a tray assembly which is positioned in the reaction cavity and used for bearing wafers; the pumping ring assembly includes: an upper air extraction ring which is arranged in the reaction cavity around the tray component; the lower air pumping ring is arranged below the upper air pumping ring in the reaction cavity and comprises 2 or 3 arc-shaped lower air pumping units distributed along the circumferential direction of the tray assembly; the exhaust pipes are arranged below the lower air extraction units in a one-to-one correspondence manner, wherein the number of the exhaust pipes is the same as that of the lower air extraction units; the upper gas pumping ring, the lower gas pumping ring and the gas exhaust pipe are combined to form a closed gas passage communicated with the inside and the outside of the reaction cavity. The invention can increase the pipe diameter of the exhaust pipe without affecting the layout of devices in the cavity, reduce the number of the exhaust pipes, meet the process requirements, reduce the processing difficulty and the processing cost and prolong the service life of the support of the air suction ring.

Description

Air exhaust ring assembly and vapor deposition equipment

Technical Field

The invention relates to the technical field of semiconductor equipment, in particular to an air extraction ring assembly and vapor deposition equipment.

Background

The formation of thin films on wafers by different gas sources is an important step in semiconductor processes, including Chemical Vapor Deposition (CVD), physical Vapor Deposition (PVD), and the like. When the vapor deposition equipment performs deposition reaction, reaction gas enters the reaction cavity through the gas inlet device, and then the residual gas after reaction is pumped out of the reaction cavity through the gas pumping ring component. The air extraction uniformity of the air extraction ring assembly is one of key factors influencing the uniformity of the thickness of the reactive film, and the air extraction ring assembly capable of uniformly extracting air is favorable for forming a stable flow field on the periphery of a wafer borne by the tray assembly, so that the uniformity of film deposition is improved, and the quality of the deposited film is ensured.

The prior art pumping ring assembly is shown in fig. 1, and comprises a hollow pumping ring 01, 4 or more exhaust pipes 02 connected to the bottom of the pumping ring 01 and a plurality of pumping ring supports 03. The technical problems of the air extraction ring assembly are as follows: 1. the exhaust pipe 02 is connected to the bottom surface of the exhaust ring 01, the pipe diameter of the exhaust pipe cannot exceed the difference between the inner diameter and the outer diameter of the bottom surface of the exhaust ring 01, and the exhaust pipe is limited by the layout of devices in the reaction cavity, and the exhaust ring 01 cannot be designed with the bottom surface with wider radial width, so that the pipe diameter and the exhaust rate of the exhaust pipe 02 are limited; 2. because of the limitation of the technical problem 1, more than 4 exhaust pipes 02 are required to be arranged for the exhaust ring assembly in the prior art to meet the requirement of the exhaust rate, and the bottom ends of the exhaust pipes 02 are required to be welded with an exhaust pipeline outside the cavity, so that the bottom ends of the exhaust pipes 02 meet the flatness of at least four surfaces, and the processing difficulty is increased; 3. in the case of having to increase the pumping rate, the diameter and radial width of the pumping ring 01 have to be increased to increase the pipe diameter of the exhaust pipe 02, but this has a series of effects on the layout of the devices in the cavity, for example, it may cause the diameter of the compression ring disposed at the top of the pumping ring 01 to be increased, thereby occupying a larger space in the cavity, and interfering with the design of the louver of the transfer port; 4. the material of gas pumping ring support 03 is ceramic, and the bottom wall of gas pumping ring 01 bottom and reaction chamber is connected respectively at its both ends, and the height is higher, so can produce great difference in temperature at equipment during operation both ends, and then influences the life of ceramic.

Disclosure of Invention

The invention aims to provide an air extraction ring assembly and vapor deposition equipment, which can increase the pipe diameter of an exhaust pipe without affecting the layout of devices in a cavity, reduce the number of the exhaust pipes, meet the requirement of a process on the air extraction rate, reduce the processing difficulty and the processing cost and prolong the service life of an air extraction ring support.

In order to achieve the above purpose, the present invention is realized by the following technical scheme:

An exhaust ring assembly for a vapor deposition apparatus including a reaction chamber and a tray assembly positioned within the reaction chamber for carrying wafers, the exhaust ring assembly comprising:

An upper air extraction ring which is arranged in the reaction cavity around the tray component, and the ring body of the upper air extraction ring is hollow to form an upper air extraction cavity communicated with the reaction cavity;

The lower air pumping ring is arranged below the upper air pumping ring in the reaction cavity and comprises 2 or 3 arc-shaped lower air pumping units distributed along the circumferential direction of the tray assembly, the lower air pumping units are hollow to form lower air pumping cavities, and the lower air pumping cavities are separately arranged and respectively communicated with the upper air pumping cavities; and

The exhaust pipes are arranged below the lower air extraction units in a one-to-one correspondence manner, the top ends of the exhaust pipes are respectively communicated with the corresponding lower air extraction cavities, and the bottom ends of the exhaust pipes are communicated with the outside of the reaction cavities;

The upper gas pumping ring, the lower gas pumping ring and the gas exhaust pipe are combined to be communicated with the gas passage inside and outside the reaction cavity.

Optionally, the top end of each exhaust pipe is connected with the bottom surface of the corresponding lower air extraction unit, and the difference between the inner diameter and the outer diameter of the bottom surface of the lower air extraction unit is larger than the difference between the inner diameter and the outer diameter of the bottom surface of the upper air extraction ring.

Optionally, the air extraction ring assembly further comprises an air extraction ring support, and the top end of the air extraction ring support is connected with the bottom surface of the lower air extraction unit.

Optionally, a plurality of upper vent holes are formed in the bottom surface of the upper air pumping ring, and the upper air pumping cavity is communicated with each lower air pumping cavity through the upper vent holes.

Optionally, the apertures of the upper vent holes are the same, and are uniformly distributed along the circumferential direction of the upper pumping ring.

Optionally, the shape and the size of each lower air pumping unit are the same, and the lower air pumping units are uniformly distributed along the circumferential direction of the tray assembly.

Optionally, the top surface of each lower air extraction unit is abutted with the bottom surface of the upper air extraction ring, the top surface of each lower air extraction unit is provided with lower air holes matched with each upper air hole, and the number of the lower air holes of each lower air extraction unit is the same; and

After the air extraction ring assembly is installed, the upper vent holes and the lower vent holes are correspondingly aligned and connected one by one.

Optionally, each lower air extraction unit is abutted with the bottom surface of the upper air extraction ring, and the bottom surface of the upper air extraction ring is used as the top surface of the lower air extraction cavity; after the air extraction ring assembly is installed, the upper vent hole is in butt joint with the lower air extraction cavity.

Optionally, the upper air extraction ring and the lower air extraction unit and the exhaust pipe are fixed in a crimping manner.

Optionally, the pipe diameters of the exhaust pipes are the same and are larger than the difference between the inner diameter and the outer diameter of the bottom surface of the upper air extraction ring, and the arrangement positions of the exhaust pipes on the corresponding lower air extraction units are the same.

Optionally, each of the exhaust pipes is centrally disposed with respect to its corresponding lower suction unit.

Optionally, the upper air suction ring further comprises an air suction port communicated with the inner cavity of the reaction cavity, and the air suction port is an annular port or a plurality of holes uniformly distributed in the circumferential direction of the upper air suction ring.

The vapor deposition equipment comprises a reaction cavity, a tray assembly and any one of the air extraction ring assemblies; wherein,

The tray assembly is arranged in the reaction cavity and is used for bearing wafers;

the air exhaust ring component is arranged in the reaction cavity around the tray component and is communicated with the inside and the outside of the cavity of the reaction cavity.

Optionally, the device also comprises an extraluminal exhaust pipeline and an air pump; wherein,

The air pump is communicated with the bottom end of the exhaust pipe of the air exhaust ring assembly through an extra-cavity exhaust pipeline so as to uniformly collect byproducts and redundant process gas from the periphery of the wafer through the air exhaust ring assembly and discharge the byproducts and the redundant process gas out of the reaction cavity.

Optionally, the device further comprises a compression ring arranged at the top of the air extraction ring assembly and used for fixing the air extraction ring assembly; wherein,

The clamp ring comprises a transmission port arranged on the side wall of the clamp ring and is used as a passage for a wafer to enter and exit the process position.

Compared with the prior art, the invention has the following advantages:

1. By adopting the upper and lower split air extraction ring assemblies, the lower air extraction ring can be designed into a reducing structure with narrow radial width, narrow top surface and wide bottom surface, so that the pipe diameter of an exhaust pipe can be increased under the condition that the layout of devices in a cavity is not influenced, the air extraction rate is increased, and the interference on the layout of the devices in the cavity is avoided;

2. The number of the exhaust pipes can be reduced by increasing the lower gas pumping ring and the pipe diameter of the exhaust pipes, so that the flatness requirement of the tail ends of the exhaust pipes is reduced, and the processing difficulty and the processing cost are reduced;

3. through increasing lower pumping ring, reduced the height that pumping ring supported, reduced the difference in temperature at its both ends, increased its life.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed for the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a front view of a prior art suction ring assembly;

FIG. 2 is a front cross-sectional view of a vapor deposition apparatus of the present invention;

FIG. 3 is an oblique view of the pumping ring assembly of the present invention;

FIG. 4 is a front cross-sectional view of FIG. 3;

FIG. 5 is an oblique view of the pump ring assembly and clamp ring combination of the present invention.

Detailed Description

The present invention will be further described with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present invention more apparent, and the described embodiments should not be construed as limiting the present invention, and all other embodiments obtained by those skilled in the art without making any inventive effort are within the scope of the present invention.

In the following description, reference is made to "some embodiments," "one or more embodiments," which describe a subset of all possible embodiments, but it is to be understood that "some embodiments," "one or more embodiments," can be the same subset or different subsets of all possible embodiments and can be combined with one another without conflict.

In the following description, the terms "first", "second", "third" and the like are used merely for respective similar objects and do not represent a specific ordering for the objects, it being understood that the "first", "second", "third" may be interchanged with a specific order or sequence, as allowed, to enable embodiments of the invention described herein to be practiced otherwise than as shown or described.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing embodiments of the invention only and is not intended to be limiting of the invention.

The pumping ring assembly and the vapor deposition apparatus of the present invention will be described in detail with reference to fig. 2 to 5.

Fig. 2 shows an MOCVD (metal organic chemical vapor deposition) apparatus, which comprises a reaction chamber 1 surrounded by a top wall, a bottom wall and a side wall, wherein a wafer transfer port 11 for wafers to enter and exit the chamber is formed in the side wall of the reaction chamber 1. An air inlet device 4 for introducing reaction gas into the reaction chamber 1 is arranged above the inside of the reaction chamber 1, and a tray assembly 3 for bearing and fixing wafers and a tray rotating assembly 2 arranged below the tray assembly are arranged below the air inlet device 4. A heater 8 is provided below the tray assembly 3, and the wafer on top of the tray assembly 3 may be heated to a reaction temperature by the tray assembly 3, and then a deposition reaction occurs by a reaction gas introduced into the reaction chamber 1 from the gas inlet device 4 to the surface of the wafer to form a thin film. And, the reaction chamber 1 is internally and circumferentially surrounded by the tray component 3 and is also provided with an air extraction ring component (51-54) communicated with the inside and the outside of the reaction chamber 1, the reaction chamber 1 is externally provided with an extra-cavity exhaust pipeline 7 and an air extraction pump (not shown), the air extraction ring component (51-54) is communicated with the air extraction pump through the extra-cavity exhaust pipeline 7, when the air extraction pump is started, the air extraction ring component (51-54) is used for exhausting the reaction chamber 1 from the outer Zhou Chouxi byproducts and redundant process gas of the tray component 3 through the extra-cavity exhaust pipeline 7, and the distribution condition of the gas can be changed when the air extraction is performed, so that a stable flow field is formed on the periphery of a wafer borne by the tray component 3, the reaction gas can be uniformly distributed on the surface of the wafer in the deposition process (before being extracted), and the uniformity of film deposition is improved. The top of the air extraction ring assembly (51-54) is also provided with a compression ring 6 for fixing the air extraction ring assembly, and a transmission port 61 is arranged on the side wall of the compression ring 6 at a position corresponding to the sheet conveying port 11 and is used as a passage for a wafer to enter and exit the process position.

Specifically, as shown in fig. 3 and 4, the pumping ring assembly provided by the present invention includes: the upper air extraction ring 51, the lower air extraction ring, the plurality of exhaust pipes 53 and the air extraction ring support 54, wherein the upper air extraction ring 51, the lower air extraction ring and the exhaust pipes 53 are combined to form a closed air passage communicated with the inside and the outside of the reaction cavity 1, are used for byproduct and redundant process gas from the outside Zhou Chouxi of the tray assembly 3, and are sequentially discharged out of the reaction cavity 1 through the upper air extraction cavity of the upper air extraction ring 51, each lower air extraction cavity of the lower air extraction ring and each exhaust pipe. Wherein,

The upper air extraction ring 51 is arranged around the tray assembly 3 in the reaction chamber 1, and the ring body of the upper air extraction ring is hollow to form an upper air extraction chamber communicated with the inner cavity of the reaction chamber 1.

The lower air extraction ring is arranged below the upper air extraction ring 51 in the reaction cavity 1, and comprises 2 or 3 arc-shaped lower air extraction units 52 distributed along the circumferential direction of the tray assembly 3, each lower air extraction unit 52 is hollow to form a lower air extraction cavity, and each lower air extraction cavity is separately arranged, i.e. adjacent lower air extraction cavities are not directly and transversely communicated, but are respectively communicated with the upper air extraction cavities upwards, so that the manufacturing cost and the manufacturing difficulty of the lower air extraction ring are saved. In some embodiments, the bottom surface of the upper pumping ring 51 is provided with a plurality of upper ventilation holes, the upper surface of the lower pumping chamber is opened to form an opening with the same cross section as the lower pumping unit 52, and when the lower pumping unit is abutted to the lower surface of the upper pumping ring 51, the upper pumping chamber is communicated with each lower pumping chamber through the upper ventilation holes, and the lower surface of the upper pumping ring 51 serves as the upper surface of the lower pumping chamber. Further, in some embodiments, the top surface of each lower air extraction unit 52 abuts against the bottom surface of the upper air extraction ring 51, the top surface of each lower air extraction unit 52 is provided with lower air holes matched with each upper air hole, and the number of the lower air holes formed on each lower air extraction unit 52 is the same; after the air extraction ring assembly is installed, the upper vent holes and the lower vent holes are aligned and connected in a one-to-one correspondence mode, and the upper air extraction cavity and the lower air extraction cavity are communicated through the upper vent holes and the lower vent holes.

The number of the exhaust pipes 53 is consistent with that of the lower air extraction units 52, the exhaust pipes 53 are arranged below the lower air extraction units 52 in a one-to-one correspondence manner, the top ends of the exhaust pipes 53 are respectively communicated with the corresponding lower air extraction cavities, and the bottom ends of the exhaust pipes are communicated with the outside of the reaction cavity 1. Preferably, in some embodiments, the top end of each exhaust pipe 53 is connected to the bottom surface of the corresponding lower exhaust unit 52, and the difference between the inner diameter and the outer diameter of the bottom surface of the lower exhaust unit 52 is greater than the difference between the inner diameter and the outer diameter of the top surface, that is, the radial width of the bottom surface of the lower exhaust unit 52 is greater than the radial width of the bottom surface of the upper exhaust ring 51, so that the diameter of the exhaust pipe 53 connected thereto can be increased due to the increased radial width of the bottom surface, thereby increasing the exhaust rate thereof; for some cases where the pumping rate must be increased, it is possible to simply increase the pipe diameter of the exhaust pipe 53 without increasing the size of the upper pumping ring 51 and the compression ring 6 thereon, thereby avoiding interference with the layout of the devices in the cavity. Further, since the pipe diameter of the exhaust pipe 53 is increased to increase the single pipe air extraction rate, the number of the exhaust pipes 53 can be further reduced to reduce the end flatness requirement thereof to reduce the processing difficulty, preferably, in some embodiments, the number of the lower air extraction units 52 is 2, and the number of the exhaust pipes 53 is also 2. The plurality of exhaust pipes 53 are connected in parallel to the same pump, and the exhaust pipes of which the number is the same as that of the air extracting units 52 are arranged, so that space occupation can be reduced, and the flow distributed to each exhaust pipe can be ensured to be large enough when the pumping force of the pump is constant.

Further, in some embodiments, the upper air extraction ring 51 and the lower air extraction unit 52, and the lower air extraction unit 52 and the air exhaust pipe 53 are fixed by pressure connection, so that the processing difficulty is low and the sealing effect is good.

The top of the pumping ring support 54 is connected with the bottom surface of the lower pumping unit 52, the bottom is supported on the bottom wall of the reaction chamber 1 and is used for supporting the pumping ring assembly, and the pumping ring support 54 is arranged below the lower pumping ring, so that the height is shortened relative to the prior art, the top of the pumping ring support 54 is far away from the upper pumping ring 51 with the highest temperature, the temperature difference at the two ends is reduced during the operation of the equipment, and the service life of the equipment is prolonged. The number of the air extraction ring supports 54 is not particularly limited, but from the viewpoints of reducing the processing difficulty and reducing the cost, the smaller the number is, the better the number is on the premise of meeting the stable support, in the embodiment, the number of the lower air extraction units 52 is 2, the number of the air extraction ring supports 54 is 4, and the number of the air extraction ring supports is 2 under each lower air extraction unit 52. The manner of fixing between the pumping ring support 54 and the bottom surface of the lower pumping unit 52 is not particularly limited in the present invention.

Because uniformity of the pumping byproducts and the redundant process gases affects uniformity of film deposition, the air channel of the pumping ring assembly needs to meet requirement of uniformity of pumping, preferably, in some embodiments, the upper pumping ring 51 is communicated with the inner cavity of the reaction chamber 1 and the pumping chamber above the reaction chamber through an air suction port 511 (fig. 5), and the air suction port 511 is an annular opening formed on the outer wall of the upper pumping ring 51 or a plurality of holes uniformly distributed along the circumferential direction of the upper pumping ring, so that the air channel between the inner cavity of the reaction chamber 1 and the upper pumping chamber meets requirement of uniformity of pumping. Further, in some embodiments, each upper vent hole of the upper air pumping ring 51 is aligned with each lower vent hole of the lower air pumping unit 52, and the apertures of each upper vent hole are the same and are uniformly distributed along the circumferential direction of the upper air pumping ring 51, so that the air passage between the upper air pumping chamber and the lower air pumping chamber meets the requirement of air pumping uniformity. Further, in some embodiments, each of the lower pumping units 52 is the same shape and size, and is uniformly distributed along the circumference of the tray assembly 3, so that each lower pumping chamber meets pumping uniformity requirements. Further, in some embodiments, the pipe diameters of the exhaust pipes 53 are the same, and the arrangement positions of the exhaust pipes 53 on the corresponding lower air extraction units 52 are the same, so that the exhaust pipes 53 meet the air extraction uniformity requirement; preferably, each of said exhaust pipes 53 is centrally arranged with respect to its corresponding lower suction unit 52.

The working principle of the air extraction ring component of the invention is as follows: the suction pump pumps air to generate negative pressure, so that byproducts and redundant process gas generated during the process in the reaction cavity 1 are uniformly sucked and discharged out of the reaction cavity 1 through the air suction port 511, the upper suction cavity, the upper vent holes, the lower suction cavities, the exhaust pipes 53, the exhaust pipelines 7 outside the cavities and the closed air passage of the suction pump; meanwhile, the closed air passage is uniformly distributed, so that the air suction speed is uniform, a stable flow field is formed on the periphery of the wafer, the reaction gas is uniformly distributed on the surface of the wafer in the deposition process, and the uniformity of film deposition is improved.

In addition, as shown in fig. 2, the present invention further provides a vapor deposition apparatus, including:

A reaction chamber 1;

the tray assembly 3 is arranged in the reaction cavity 1 and is used for bearing wafers;

Any one of the air extraction ring assemblies is arranged in the reaction cavity 1 around the tray assembly 3 and communicated with the inside and the outside of the cavity of the reaction cavity 1;

The exhaust pipe 7 outside the cavity and the air pump are communicated with the bottom end of the exhaust pipe 53 of the air exhaust ring assembly through the exhaust pipe 7 outside the cavity so as to uniformly collect byproducts and redundant process gas from the periphery of the wafer through the air exhaust ring assembly and discharge the byproducts and the redundant process gas outside the reaction cavity 1;

and, as shown in fig. 5, a compression ring 6 is arranged on the top of the pumping ring assembly and is used for fixing the pumping ring assembly; the clamp ring 6 includes a transfer port 61 disposed on a sidewall, and is used as a passage for a wafer to enter and exit a process position.

The MOCVD equipment in this embodiment is only an example, and the pumping ring assembly and the vapor deposition equipment of the present invention are applicable to any vapor deposition equipment.

The foregoing is merely exemplary embodiments of the present invention and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and scope of the present invention are included in the protection scope of the present invention.

Claims (15)

1. An exhaust ring assembly for a vapor deposition apparatus comprising a reaction chamber and a tray assembly positioned within the reaction chamber for carrying wafers, the exhaust ring assembly comprising:

An upper air extraction ring which is arranged in the reaction cavity around the tray component, and the ring body of the upper air extraction ring is hollow to form an upper air extraction cavity communicated with the reaction cavity;

The lower air pumping ring is arranged below the upper air pumping ring in the reaction cavity and comprises 2 or 3 arc-shaped lower air pumping units distributed along the circumferential direction of the tray assembly, the lower air pumping units are hollow to form lower air pumping cavities, and the lower air pumping cavities are separately arranged and respectively communicated with the upper air pumping cavities; and

The exhaust pipes are arranged below the lower air extraction units in a one-to-one correspondence manner, the top ends of the exhaust pipes are respectively communicated with the corresponding lower air extraction cavities, and the bottom ends of the exhaust pipes are communicated with the outside of the reaction cavities;

The upper gas pumping ring, the lower gas pumping ring and the gas exhaust pipe are combined to be communicated with the gas passage inside and outside the reaction cavity.

2. The pumping ring assembly of claim 1,

The top ends of the exhaust pipes are respectively connected with the bottom surfaces of the corresponding lower air extraction units, and the difference between the inner diameter and the outer diameter of the bottom surfaces of the lower air extraction units is larger than the difference between the inner diameter and the outer diameter of the bottom surfaces of the upper air extraction rings.

3. The pumping ring assembly of claim 1,

The air extraction ring assembly further comprises an air extraction ring support, and the top end of the air extraction ring support is connected with the bottom surface of the lower air extraction unit.

4. The pumping ring assembly of claim 1,

The bottom surface of the upper air pumping ring is provided with a plurality of upper vent holes, and the upper air pumping cavity is communicated with each lower air pumping cavity through the upper vent holes.

5. The pumping ring assembly of claim 4,

The pore diameters of the upper vent holes are the same, and the upper vent holes are uniformly distributed along the circumferential direction of the upper pumping ring.

6. The pumping ring assembly of claim 5,

The lower air extraction units are identical in shape and size and are uniformly distributed along the circumferential direction of the tray assembly.

7. The pumping ring assembly of claim 6 wherein,

The top surface of each lower air extraction unit is abutted with the bottom surface of the upper air extraction ring, the top surface of each lower air extraction unit is provided with lower air holes matched with each upper air hole, and the number of the lower air holes of each lower air extraction unit is the same; and

After the air extraction ring assembly is installed, the upper vent holes and the lower vent holes are correspondingly aligned and connected one by one.

8. The pumping ring assembly of claim 6 wherein,

Each lower air extraction unit is abutted with the bottom surface of the upper air extraction ring, and the bottom surface of the upper air extraction ring is used as the top surface of the lower air extraction cavity; after the air extraction ring assembly is installed, the upper vent hole is in butt joint with the lower air extraction cavity.

9. The pumping ring assembly of claim 7,

The upper air extraction ring is fixed with the lower air extraction unit and the lower air extraction unit is fixed with the exhaust pipe in a crimping mode.

10. The pumping ring assembly of claim 2,

The pipe diameters of the exhaust pipes are the same and are larger than the difference between the inner diameter and the outer diameter of the bottom surface of the upper air extraction ring, and the arrangement positions of the exhaust pipes on the corresponding lower air extraction units are the same.

11. The pumping ring assembly of claim 10,

Each exhaust pipe is arranged in the middle relative to the corresponding lower air extraction unit.

12. The pumping ring assembly of claim 1,

The upper air suction ring also comprises an air suction port communicated with the inner cavity of the reaction cavity, and the air suction port is an annular port or a plurality of holes uniformly distributed in the circumferential direction of the upper air suction ring.

13. A vapor deposition apparatus, characterized in that,

Comprising a reaction chamber, a tray assembly and an extraction ring assembly according to any one of claims 1 to 12; wherein,

The tray assembly is arranged in the reaction cavity and is used for bearing wafers;

the air exhaust ring component is arranged in the reaction cavity around the tray component and is communicated with the inside and the outside of the cavity of the reaction cavity.

14. The vapor deposition apparatus according to claim 13, wherein,

The device also comprises an extracavity exhaust pipeline and an air extracting pump; wherein,

The air pump is communicated with the bottom end of the exhaust pipe of the air exhaust ring assembly through an extra-cavity exhaust pipeline so as to uniformly collect byproducts and redundant process gas from the periphery of the wafer through the air exhaust ring assembly and discharge the byproducts and the redundant process gas out of the reaction cavity.

15. The vapor deposition apparatus according to claim 13, wherein,

The clamping ring is arranged at the top of the air extraction ring assembly and used for fixing the air extraction ring assembly; wherein,

The clamp ring comprises a transmission port arranged on the side wall of the clamp ring and is used as a passage for a wafer to enter and exit the process position.