CN118084461A - Zero-shrinkage ceramic composite material and preparation method thereof - Google Patents
Zero-shrinkage ceramic composite material and preparation method thereof Download PDFInfo
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- CN118084461A CN118084461A CN202410071241.9A CN202410071241A CN118084461A CN 118084461 A CN118084461 A CN 118084461A CN 202410071241 A CN202410071241 A CN 202410071241A CN 118084461 A CN118084461 A CN 118084461A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 59
- 239000002131 composite material Substances 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 41
- 238000005245 sintering Methods 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 32
- 238000000498 ball milling Methods 0.000 claims abstract description 23
- 239000011230 binding agent Substances 0.000 claims abstract description 16
- 229910052582 BN Inorganic materials 0.000 claims abstract description 15
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000002156 mixing Methods 0.000 claims abstract description 15
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(III) oxide Inorganic materials O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000002356 single layer Substances 0.000 claims abstract description 10
- 239000002270 dispersing agent Substances 0.000 claims abstract description 9
- 239000004014 plasticizer Substances 0.000 claims abstract description 9
- 239000002904 solvent Substances 0.000 claims abstract description 8
- 239000002002 slurry Substances 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- 238000007599 discharging Methods 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims abstract description 6
- 238000005266 casting Methods 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 claims abstract description 4
- 238000001035 drying Methods 0.000 claims description 17
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 9
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000005303 weighing Methods 0.000 claims description 6
- 238000007873 sieving Methods 0.000 claims description 5
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical group CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 235000019441 ethanol Nutrition 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 238000005469 granulation Methods 0.000 claims description 2
- 230000003179 granulation Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 238000010304 firing Methods 0.000 claims 1
- FQTCUKQMGGJRCU-UHFFFAOYSA-N n,n-diacetylacetamide Chemical group CC(=O)N(C(C)=O)C(C)=O FQTCUKQMGGJRCU-UHFFFAOYSA-N 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract description 9
- 239000007790 solid phase Substances 0.000 abstract description 8
- 239000010410 layer Substances 0.000 abstract description 5
- 239000002994 raw material Substances 0.000 abstract description 5
- 238000004100 electronic packaging Methods 0.000 abstract description 2
- 239000011268 mixed slurry Substances 0.000 abstract 1
- 229910010293 ceramic material Inorganic materials 0.000 description 11
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 10
- 230000000630 rising effect Effects 0.000 description 6
- 238000010345 tape casting Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910000416 bismuth oxide Inorganic materials 0.000 description 3
- 229910052810 boron oxide Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 3
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 3
- 239000000075 oxide glass Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000001272 pressureless sintering Methods 0.000 description 1
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- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3298—Bismuth oxides, bismuthates or oxide forming salts thereof, e.g. zinc bismuthate
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Abstract
The invention provides a zero-shrinkage ceramic composite material and a preparation method thereof. The bismuth trioxide, the boron nitride and the aluminum oxide are taken as raw materials, the pre-sintering material is obtained through ball milling, mixing and pre-sintering, the binding agent is added into the pre-sintering material, and then the pre-sintering material is granulated, pressed, molded and sintered, and the zero-shrinkage ceramic composite material is prepared through solid phase sintering, so that the shrinkage rate, the mechanical property and the thermal conductivity can be well considered; or adding solvent, dispersant, binder and plasticizer into the presintered material by casting method, ball milling to obtain uniform slurry, casting the mixed slurry to form green ceramic chips, cutting the green ceramic chips, discharging glue, sintering to obtain the zero-shrinkage ceramic composite material, wherein the shrinkage rate of the single-layer sintered chips is below 5%, and the shrinkage rate of the five-layer laminated sintered chips is below 1%. The preparation process is simple and feasible, and has wide application prospect in the field of electronic packaging, the field of precision part manufacturing and the dental field.
Description
Technical Field
The invention relates to the technical field of ceramic materials, in particular to a zero-shrinkage ceramic composite material and a preparation method thereof.
Background
With the rapid development of the information communication industry, the characteristics of electronic communication products are changed into miniaturization, integration and portability. The development of miniaturization and integration necessarily requires that the electronic ceramic substrate have higher sintering precision, heat dissipation performance and mechanical strength so as to ensure the normal performance of the electronic ceramic substrate after sintering.
LTCC material is an important electronic ceramic material, and is mainly used in the packaging field, and the most widely used system is a glass-ceramic composite system. The low melting point of glass results in sintering even at temperatures not exceeding 1000 c, but with a large sintering shrinkage, which severely affects the accuracy of electronic circuit positioning. The self-constraining method has been commercially used to control the shrinkage of LTCCs, but this method not only increases equipment and time costs, but also adds a complex process of stripping the sacrificial layer. If the ceramic material, particularly the ceramic tape casting with a lot of binder, itself has a low or even near zero shrinkage, it can save energy to a great extent, and financial and labor costs, and can provide a good choice of materials in dental and other precision manufacturing.
Most of the zero-shrinkage ceramic materials currently under study have a high porosity despite low sintering shrinkage, which results in deterioration of thermal conductivity and mechanical properties. Thus, it is a difficult challenge to develop ceramic materials with low shrinkage, while having good thermal conductivity and mechanical properties.
Disclosure of Invention
The invention aims to provide a preparation method of a zero-shrinkage low-temperature co-fired ceramic material, and the low-temperature co-fired ceramic material prepared by the method has high heat conduction and high bending strength.
In order to achieve the above purpose, the present invention adopts the following technical scheme: a preparation method of a zero-shrinkage low-temperature co-fired ceramic material comprises the following steps:
S1, weighing alumina, bismuth trioxide and boron nitride with the mass ratio of (0.5-0.9) to (0-0.9), adding a medium, ball-milling, mixing and drying to obtain a mixed material;
S2, presintering the mixed material at 400-800 ℃ for 0.5-3 hours, adding a medium, ball-milling, mixing and drying to obtain a presintering material;
S3, adding a binder into the presintered material for granulation, sieving, and then pressing and forming; sintering the pressed material at 700-900 ℃ for 1-3h, and cooling to room temperature to obtain the zero-shrinkage ceramic composite material;
Or adding a solvent, a dispersing agent, a binder and a plasticizer into the presintered material, and ball-milling to obtain uniform slurry; casting the uniform slurry on a polyimide film, forming, drying at room temperature to form a green ceramic chip, cutting the green ceramic chip to obtain a single-layer green ceramic chip, or cutting the green ceramic chip, carrying out multilayer superposition pressing to obtain a multilayer green ceramic chip, then placing the single-layer green ceramic chip or the multilayer green ceramic chip at 400-800 ℃ for preserving heat for 0.5-3h for discharging glue, then raising the temperature to 700-900 ℃ for sintering for 1-3h, and cooling to room temperature to obtain the zero-shrinkage ceramic composite material.
The preparation method of the zero-shrinkage low-temperature co-fired ceramic material is further improved:
Preferably, the boron nitride is hexagonal boron nitride.
Preferably, the ball milling and mixing time in the step S1 is 1-8 hours, and the medium is absolute ethyl alcohol or water.
Preferably, the drying temperature in step S1 is 50-100deg.C for 2-8 hours.
Preferably, the temperature rising rate of the presintering in the step S2 is 2-5 ℃/min, and the temperature rising rate of the sintering in the step S3 is 2-5 ℃/min.
Preferably, the screen mesh screened in the step S3 is 50-200 meshes, and the pressure of compression molding is 10-100Mpa; the temperature of the superposition pressing of the multilayer green ceramic chips is 65-80 ℃ and the pressure is 9-12MPa.
Preferably, the mass ratio of the presintering material, the solvent, the dispersing agent, the binder and the plasticizer in the step S3 is 1 (0.5-2) (0.01-0.05) (0.05-0.20).
Preferably, in step S3, the solvent is ethanol or cyclohexanone, and the dispersant is triacetyl amide.
Preferably, in step S3, the binder is polyvinyl butyral, and the plasticizer is butyl benzyl phthalate or polyethylene glycol.
The second object of the present invention is to provide a zero-shrinkage low-temperature co-fired ceramic material prepared by the method for preparing a zero-shrinkage low-temperature co-fired ceramic material according to any one of the above-mentioned aspects.
Compared with the prior art, the invention has the beneficial effects that:
1) The invention provides a preparation method of a zero-shrinkage ceramic composite material, which uses bismuth trioxide and boron nitride and/or aluminum oxide as raw materials, and adopts a solid-phase sintering method or a tape casting method. When bismuth trioxide is used as raw materials in combination with boron nitride and aluminum oxide, the bismuth trioxide reacts with the boron nitride at high temperature to generate boron oxide, and the boron oxide reacts with the aluminum oxide to generate aluminum borate, and the reaction is a reconfiguration type phase change reaction, and volume expansion can occur in the reaction process, so that volume shrinkage in the sintering process is compensated, and the volume is kept unchanged before and after sintering. Meanwhile, bismuth trioxide and boron oxide can generate amorphous glass, and moisten generated aluminum borate whisker to make the aluminum borate whisker become a connected whole, so that the mechanical property and the heat conducting property of the aluminum borate whisker are improved.
2) The aluminum borate ceramic prepared by the invention has low sintering shrinkage rate due to high aspect ratio, and the aluminum borate ceramic has good mechanical property, heat conduction property and oxidation resistance, so that the zero-shrinkage ceramic composite material with high heat conductivity and bending strength can be obtained. In the field of electronic packaging, precise electronic devices and dentistry, the dental field has great application prospect.
Drawings
FIG. 1 is a scanned image of a sintered sheet produced by the solid phase sintering method of example 3;
FIG. 2 is a scanned image of a sintered sheet produced by the casting method of example 4.
Detailed Description
The present invention will be further described in detail with reference to the following examples, in order to make the objects, technical solutions and advantages of the present invention more apparent, and all other examples obtained by those skilled in the art without making any inventive effort are within the scope of the present invention based on the examples in the present invention.
Example 1
The embodiment provides a method for preparing a zero-shrinkage ceramic composite material by a solid-phase sintering method, which specifically comprises the following steps:
(1) Weighing aluminum oxide and bismuth trioxide with the mass ratio of 1:0.8, ball-milling in a ball mill for 4 hours by taking absolute ethyl alcohol as a medium, uniformly mixing, wherein the rotating speed of the ball mill is 350r/min, and drying the ball-milled powder in an oven at 60 ℃ to obtain a mixed material;
(2) Presintering the mixed material at 600 ℃ for 1h, wherein the presintering temperature rising rate is 5 ℃/min, adding deionized water, performing ball milling and mixing for 4h, wherein the ball milling rotation speed is 350r/min, and drying in a 60 ℃ oven to obtain the presintering material;
(3) Adding a polyvinyl butyral binder into the presintering material, granulating, sieving with a 100-mesh sieve, pressing to form at 25MPa, sintering the pressed material at 900 ℃ for 2h, heating at a rate of 4 ℃/min, and cooling to room temperature to obtain the zero-shrinkage ceramic composite material 1.
Example 2
The embodiment provides a method for preparing a zero-shrinkage ceramic composite material by a solid-phase sintering method, which specifically comprises the following steps:
(1) Weighing aluminum oxide, bismuth trioxide and hexagonal boron nitride with the mass ratio of 1:0.8:0.3, ball-milling in a ball mill for 4 hours by taking absolute ethyl alcohol as a medium, uniformly mixing, placing the ball-milled powder into a baking oven for drying at 60 ℃ at the rotating speed of 350r/min to obtain a mixed material;
(2) Presintering the mixed material at 600 ℃ for 1h, wherein the presintering temperature rising rate is 5 ℃/min, adding deionized water, performing ball milling and mixing for 4h, wherein the ball milling rotation speed is 350r/min, and drying in a 60 ℃ oven to obtain the presintering material;
(3) Adding a polyvinyl butyral binder into the presintering material, granulating, sieving with a 100-mesh sieve, pressing to form at 25MPa, sintering the pressed material at 900 ℃ for 2h, heating at a rate of 4 ℃/min, and cooling to room temperature to obtain the zero-shrinkage ceramic composite material 2.
Example 3
The embodiment provides a method for preparing a zero-shrinkage ceramic composite material by a solid-phase sintering method, which specifically comprises the following steps:
(1) Weighing aluminum oxide, bismuth trioxide and hexagonal boron nitride with the mass ratio of 1:0.8:0.5, ball-milling in a ball mill for 4 hours by taking absolute ethyl alcohol as a medium, uniformly mixing, placing the ball-milled powder into a baking oven for drying at 60 ℃ at the rotating speed of 350r/min to obtain a mixed material;
(2) Presintering the mixed material at 600 ℃ for 1h, wherein the presintering temperature rising rate is 5 ℃/min, adding deionized water, performing ball milling and mixing for 4h, wherein the ball milling rotation speed is 350r/min, and drying in a 60 ℃ oven to obtain the presintering material;
(3) Adding a polyvinyl butyral binder into the presintering material, granulating, sieving with a 100-mesh sieve, pressing to form at 25MPa, sintering the pressed material at 900 ℃ for 2h, heating at a rate of 4 ℃/min, and cooling to room temperature to obtain the zero-shrinkage ceramic composite material 3.
FIG. 1 is a scanned image of a sintered sheet produced by the solid phase sintering method of example 3; as can be seen from FIG. 1, when the raw materials contain bismuth trioxide and boron nitride at the same time, aluminum borate whiskers are generated by the system, and bismuth oxide glass well wraps and wets the whiskers, so that a compact result is formed, and the mechanical strength and the thermal conductivity of the bismuth oxide glass are improved.
| Examples | Linear shrinkage (%) | Thermal conductivity (W/mK) | Flexural Strength (MPa) |
| 1 | 5.56％ | 6.373 | 55.05 |
| 2 | 2.57％ | 2.476 | 87.87 |
| 3 | 0.031％ | 2.883 | 125.10 |
Through testing, the low shrinkage ceramic composite material prepared by solid phase sintering in the embodiment 1-3 has the linear shrinkage of 0.031-5.56%, the thermal conductivity of 2.476-6.373W/mK and the bending strength of 55.05-125.10MPa. The linear shrinkage rate in the embodiment 3 is the lowest and is 0.031%, the bending strength is the highest and is 125MPa, so that the invention can well consider the shrinkage rate, the mechanical property and the thermal conductivity under the proper proportion of aluminum oxide, bismuth trioxide and boron nitride, and well solve the problem that the shrinkage rate and the mechanical property cannot be considered in the prior art.
Example 4
The embodiment provides a method for preparing a zero-shrinkage ceramic composite material by a tape casting method, which specifically comprises the following steps:
(1) Weighing aluminum oxide, bismuth trioxide and hexagonal boron nitride with the mass ratio of 1:0.8:0.7, ball-milling in a ball mill for 4 hours by taking absolute ethyl alcohol as a medium, uniformly mixing, placing the ball-milled powder into a baking oven for drying at 60 ℃ at the rotating speed of 350r/min to obtain a mixed material;
(2) Presintering the mixed material at 600 ℃ for 1h, wherein the presintering temperature rising rate is 5 ℃/min, adding deionized water, performing ball milling and mixing for 4h, wherein the ball milling rotation speed is 350r/min, and drying in a 60 ℃ oven to obtain the presintering material;
(3) Taking 12g of presintering material, adding 7g of ethanol and 7g of cyclohexanone, 0.396g of dispersant triethanolamine, 1.02g of binder polyvinyl butyral and 1.2g of plasticizer polyethylene glycol into the presintering material, wherein the mass ratio of the presintering material to the solvent to the dispersant to the binder to the plasticizer is 1:1.17:0.03:0.085:0.1, and ball milling to obtain uniform slurry; and (3) carrying out tape casting molding on the uniform slurry on a polyimide film, drying at room temperature to form a single-layer green ceramic chip, then heating to 600 ℃, preserving heat for 2 hours for glue discharging, continuously heating to 900 ℃ for sintering for 2 hours at a heating rate of 4 ℃/min when the glue discharging speed is 2 ℃/min, and cooling to room temperature to obtain the single-layer zero-shrinkage ceramic composite material.
Or cutting the single-layer green ceramic chips prepared in the step (3) in the embodiment 4 into the same size, stacking, pressing at 70 ℃ and 10MPa, then heating to 600 ℃ and preserving heat for 2 hours to perform glue discharging, continuously heating to 900 ℃ and sintering for 2 hours at the heating rate of 4 ℃/min, and cooling to room temperature to obtain the 5-layer laminated zero-shrinkage ceramic composite material.
FIG. 2 is a scanned image of a single-layer zero-shrinkage ceramic composite material prepared by the tape casting method, and as can be seen from FIG. 2, aluminum borate crystals are generated in the sintering process, the length is about 3 μm, the diameter is 300-500nm, and the aluminum borate whiskers are wetted by bismuth oxide glass, but because more organic matters exist in the system, the density of the aluminum borate whiskers is lower than that of a sintered sheet obtained by a tabletting method.
Through tests, the zero-shrinkage ceramic composite material prepared by pressureless sintering through a tape casting method has the shrinkage rate of a single-layer sintered sheet below 5%, the shrinkage rate of a 5-layer laminated layer below 1%, and is far lower than 15-20% of the sintering shrinkage rate of common glass ceramics, the preparation raw materials are easy to obtain, and the process is simple.
Those skilled in the art will appreciate that the foregoing is merely a few, but not all, embodiments of the invention. It should be noted that many variations and modifications can be made by those skilled in the art, and all variations and modifications which do not depart from the scope of the invention as defined in the appended claims are intended to be protected.
Claims (10)
1. The preparation method of the zero-shrinkage ceramic composite material is characterized by comprising the following steps of:
S1, weighing alumina, bismuth trioxide and boron nitride with the mass ratio of (0.5-0.9) to (0-0.9), adding a medium, ball-milling, mixing and drying to obtain a mixed material;
S2, presintering the mixed material at 400-800 ℃ for 0.5-3 hours, adding a medium, ball-milling, mixing and drying to obtain a presintering material;
S3, adding a binder into the presintered material for granulation, sieving, and then pressing and forming; sintering the pressed material at 700-900 ℃ for 1-3h, and cooling to room temperature to obtain the zero-shrinkage ceramic composite material;
Or adding a solvent, a dispersing agent, a binder and a plasticizer into the presintered material, and ball-milling to obtain uniform slurry; casting the uniform slurry on a polyimide film, forming, drying at room temperature to form a green ceramic chip, cutting the green ceramic chip to obtain a single-layer green ceramic chip, or cutting the green ceramic chip, carrying out multilayer superposition pressing to obtain a multilayer green ceramic chip, then placing the single-layer green ceramic chip or the multilayer green ceramic chip at 400-800 ℃, preserving heat, discharging glue, heating to 700-900 ℃ for 1-3h, and cooling to room temperature to obtain the zero-shrinkage ceramic composite material.
2. The method of producing a zero-shrinkage ceramic composite material of claim 1, wherein the boron nitride is hexagonal boron nitride.
3. The method for preparing the zero-shrinkage ceramic composite material according to claim 1, wherein the ball milling and mixing time in the step S1 is 1-8 hours, and the medium is absolute ethyl alcohol or water.
4. The method of producing a zero shrinkage ceramic composite according to claim 1, wherein the drying in step S1 is performed at a temperature of 50 to 100 ℃ for a time of 2 to 8 hours.
5. The method of producing a zero shrinkage ceramic composite material according to claim 1, wherein the pre-firing in step S2 has a heating rate of 2 to 5 ℃/min and the sintering in step S3 has a heating rate of 2 to 5 ℃/min.
6. The method for producing a zero shrinkage ceramic composite material according to claim 1, wherein the screen mesh screened in step S3 is 50 to 200 mesh, and the pressure of the press molding is 10 to 100Mpa; the temperature of the superposition pressing of the multilayer green ceramic chips is 65-80 ℃ and the pressure is 9-12MPa.
7. The method for preparing the zero-shrinkage ceramic composite material according to claim 1, wherein the mass ratio of the presintering material, the solvent, the dispersing agent, the binder and the plasticizer in the step S3 is 1 (0.5-2) (0.01-0.05) (0.05-0.20).
8. The method for producing a zero-shrinkage ceramic composite material according to claim 1 or 7, wherein the solvent in the step S3 is ethanol and/or cyclohexanone, and the dispersant is triacetamide.
9. The method of producing a zero shrinkage ceramic composite according to claim 1 or 7, wherein the binder in step S3 is polyvinyl butyral, and the plasticizer is butyl benzyl phthalate or polyethylene glycol.
10. A zero-shrinkage ceramic composite produced by the method of any one of claims 1-9.
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