CN118081127A - Drilling system and method for preparing high depth-to-diameter ratio taper-free drilling by utilizing laser - Google Patents
Drilling system and method for preparing high depth-to-diameter ratio taper-free drilling by utilizing laser Download PDFInfo
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- CN118081127A CN118081127A CN202410347900.7A CN202410347900A CN118081127A CN 118081127 A CN118081127 A CN 118081127A CN 202410347900 A CN202410347900 A CN 202410347900A CN 118081127 A CN118081127 A CN 118081127A
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- 238000005553 drilling Methods 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000033001 locomotion Effects 0.000 claims abstract description 33
- 230000005540 biological transmission Effects 0.000 claims abstract description 20
- 239000011521 glass Substances 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 description 7
- 238000004891 communication Methods 0.000 description 5
- 238000004590 computer program Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
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Abstract
The invention discloses a drilling system and a method for preparing a high depth-to-diameter ratio non-taper drilling by utilizing laser, wherein the system comprises the following steps: the computer control system is used for setting the processing parameters of the GHz infrared femtosecond laser, controlling the GHz infrared femtosecond laser to emit laser and controlling the three-dimensional movement workbench to move according to the processing parameters; the GHz infrared femtosecond laser is used for emitting laser; the reflecting mirror group comprises a plurality of reflecting mirrors, and the reflecting mirrors are used for changing the transmission direction and the position of the laser beam so as to enable the laser beam to reach the preset drilling position of the three-dimensional moving workbench; and the three-dimensional moving workbench is used for bearing the target sample and drilling the target sample at a preset drilling position by moving the position. The invention adopts a laser impact type top-down working mode to realize crack-free drilling, has short single-hole processing time and greatly improves the processing efficiency. The invention has simple process, easy realization and higher practical application value.
Description
Technical Field
The invention belongs to the technical field of laser sample drilling processing, and particularly relates to a drilling system and a drilling method for preparing a taper-free drilling system with a high depth-to-diameter ratio by utilizing laser.
Background
Along with the continuous improvement of sample processing technology, corresponding products gradually develop to fine processing, and the application field is wider and wider. The processing of the sample micropores is a fine processing mode. The laser sample drilling is usually performed by passing a laser beam through a galvanometer and a field lens, focusing the beam by the field lens, controlling a beam scanning path by the galvanometer, and ablating and removing the sample layer by layer from top to bottom or from bottom to top by laser until a hole is drilled through the material. The holes formed in the mode are conical holes, and the taper is large. Meanwhile, due to layer-by-layer processing, the processing efficiency is low, the vibrating mirror controls a scanning path, the vibrating mirror precision directly influences the size precision and the minimum aperture of the finished hole, and the depth-to-diameter ratio is larger than 10: the aperture of 1 is essentially impossible to achieve.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides a drilling system and a drilling method for preparing a high depth-to-diameter ratio taper-free drilling system by utilizing laser, and relates to a process route method for drilling a sample by utilizing the laser, which can realize the high depth-to-diameter ratio and crack-free micropore processing.
In order to achieve the expected effect, the invention adopts the following technical scheme:
The invention discloses a drilling system for preparing a high depth-to-diameter ratio taper-free drilling system by utilizing laser, which comprises the following steps:
the computer control system is used for setting the processing parameters of the GHz infrared femtosecond laser, controlling the GHz infrared femtosecond laser to emit laser and controlling the three-dimensional movement workbench to move according to the processing parameters;
The GHz infrared femtosecond laser is used for emitting laser;
The reflecting mirror group comprises a plurality of reflecting mirrors, and the reflecting mirrors are used for changing the transmission direction and the position of the laser beam so as to enable the laser beam to reach the preset drilling position of the three-dimensional moving workbench;
and the three-dimensional moving workbench is used for bearing the target sample and drilling the target sample at a preset drilling position by moving the position.
Further, the wavelength of laser emitted by the GHz infrared femtosecond laser is an infrared band, the pulse width is in the femtosecond level, the pulse train frequency is in the GHz level, and the GHz infrared femtosecond laser has a pulse train mode.
Further, the mode of the GHz infrared femtosecond laser emitting laser is any one of intermittent dotting and continuous dotting.
Further, the sample is any one of glass, sapphire, quartz and metal materials.
Further, the drilling system further comprises a beam expander, and the beam expander is used for expanding the laser beam emitted by the GHz infrared femtosecond laser.
Further, the drilling system further comprises a focusing mirror, the focusing mirror is used for focusing the light beams, and the laser beams emitted by the GHz infrared femtosecond laser enter the beam expander for beam expansion after the transmission direction and the positions of the laser beams are adjusted through a plurality of reflectors, and enter the focusing mirror for focusing after the transmission direction and the positions of the laser beams are adjusted through a plurality of reflectors.
Further, after being focused by a focusing mirror, the laser beam is vertically and directly arranged on the upper surface of a target sample borne by the three-dimensional moving workbench in a direction parallel to the Z axis of the three-dimensional moving workbench to obtain a focus position, and the preset drilling position of the three-dimensional moving workbench is positioned right below the focus position.
The invention also discloses a drilling method for preparing the high depth-to-diameter ratio non-taper by using laser, which is based on the drilling system, and comprises the following steps:
The computer control system sets processing parameters of the GHz infrared femtosecond laser, controls the GHz infrared femtosecond laser to emit laser, and controls the three-dimensional movement workbench to move according to the processing parameters;
And the laser beam emitted by the GHz infrared femtosecond laser reaches a preset drilling position of the three-dimensional motion workbench to drill a target sample borne by the three-dimensional motion workbench after the transmission direction and the position of the laser beam are adjusted by a plurality of reflectors.
Further, after the transmission direction and the positions of laser beams emitted by the GHz infrared femtosecond laser are adjusted through a plurality of reflectors, the laser beams vertically penetrate the upper surface of a target sample borne by the three-dimensional moving workbench in a direction parallel to the Z axis of the three-dimensional moving workbench to obtain a focus position, and a preset drilling position of the three-dimensional moving workbench is located right below the focus position.
Further, the preset drilling position of the three-dimensional moving workbench is positioned 0.03-0.06 mm below the focal position.
Compared with the prior art, the invention has the beneficial effects that: compared with micropores which cannot be realized in the prior art, the femtosecond infrared laser based on the GHz-burst mode can realize crack-free drilling by adopting a laser impact type top-down working mode, the depth-diameter ratio of the hole is larger than a first preset value (20:1 for example), the diameter of the hole is smaller than a second preset value (35 um for example), the machining time of a single hole is short and smaller than a third preset value (200 ms for example), and the machining efficiency is greatly improved. The invention has simple process, easy realization and higher practical application value.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings described below are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a drilling system for producing a high aspect ratio taper-free hole using a laser, according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the invention also discloses a drilling system for preparing the high depth-to-diameter ratio non-taper by using laser, comprising:
the computer control system is used for setting the processing parameters of the GHz infrared femtosecond laser, controlling the GHz infrared femtosecond laser to emit laser and controlling the three-dimensional movement workbench to move according to the processing parameters; specifically, laser processing parameters are set, the laser wavelength is 1035nm, the pulse width is in the femtosecond level, the laser power is 15W-100W, the number of pulses is 500-500000, the laser power and the number of pulses jointly determine the drilling depth, and the greater the power, the greater the number of pulses, the deeper the drilling depth.
The GHz infrared femtosecond laser is used for emitting laser;
In one embodiment, the wavelength of the laser emitted by the GHz infrared femtosecond laser is in an infrared band, the pulse width is in the femtosecond level, the pulse train frequency is in the GHz level, and the GHz infrared femtosecond laser has a pulse train mode. Illustratively, the GHz infrared femtosecond laser trigger wavelength is 1035nm, and light is emitted at a pulse frequency of 1.1 GHz.
In another embodiment, the GHz infrared femtosecond laser emits laser light in any one of intermittent dotting and continuous dotting. The laser light emitting mode is controlled by the upper computer software, and the intermittent laser impact or continuous laser impact mode can be adopted for drilling. The intermittent laser can set light emitting time and processing times, and the interval time between light emitting is controlled by marking control software. The aperture of the micropore can be finely adjusted in a light-emitting mode, the aperture of continuous light-emitting is slightly larger, and the thermal influence on the upper surface of the micropore is increased.
The reflecting mirror group comprises a plurality of reflecting mirrors, and the reflecting mirrors are used for changing the transmission direction and the position of the laser beam so as to enable the laser beam to reach the preset drilling position of the three-dimensional moving workbench; a plurality of 45-degree reflectors can be custom arranged according to the requirement to adjust and change the transmission direction and position of the laser beam.
And the three-dimensional moving workbench is used for bearing the target sample and drilling the target sample at a preset drilling position by moving the position. After the laser emits light, a single hole is formed on the sample through nonlinear absorption and heat accumulation, X or Y is moved for a distance, the laser emits light, and the steps are repeated to form group holes in certain arrangement.
In one embodiment, the sample is any one of glass, sapphire, quartz, a metallic material.
In one embodiment, the drilling system further comprises a beam expander for expanding the laser beam emitted by the GHz infrared femtosecond laser.
In one embodiment, the drilling system further comprises a focusing mirror, the focusing mirror is used for focusing the light beam, and the laser beam emitted by the GHz infrared femtosecond laser enters the beam expanding mirror for beam expansion after the transmission direction and the position are adjusted through a plurality of reflecting mirrors, and enters the focusing mirror for focusing after the transmission direction and the position are adjusted through a plurality of reflecting mirrors.
In another embodiment, after the laser beam is focused by the focusing mirror, the laser beam is vertically and directly irradiated on the upper surface of the target sample borne by the three-dimensional moving workbench in a direction parallel to the Z axis of the three-dimensional moving workbench to obtain a focal position, and the preset drilling position of the three-dimensional moving workbench is located right below the focal position.
Compared with micropores with a high depth-diameter ratio which cannot be realized in the prior art, the femtosecond infrared laser based on the GHz-burst mode can realize crack-free drilling by adopting a laser impact type top-down working mode, the depth-diameter ratio of the hole is larger than a first preset value (such as 20:1), the diameter of the hole is smaller than a glass micropore with a second preset value (such as 35 um), the single-hole processing time is short and smaller than a third preset value (such as 200 ms), and the processing efficiency is greatly improved. The invention has simple process, easy realization and higher practical application value.
In one embodiment, as shown in FIG. 1, the laser is a GHz infrared femtosecond laser, the laser wavelength is 1035nm, the pulse width is smaller than 350fs, and the number of pulse trains is 200. The laser beam emitted by the laser enters a beam expander 4 to expand the laser beam through the 45-degree reflectors 2 and 3. The laser beam is passed through the center of the beam expander 4 by adjusting the angles of the 45 ° mirrors 2 and 3, and is parallel to the optical axis of the beam expander 4. The laser beam after beam expansion passes through the 45-degree reflecting mirror group 5, then changes the direction and the position of the beam, enters the focusing mirror 6 for focusing, and the laser beam entering the focusing mirror is concentric and coaxial with the focusing by adjusting the lens angle of the reflecting mirror group 5. The 45 degree mirror group 5 may consist of 1-3 45 degree mirrors. The workbench of the device consists of a three-dimensional movement module and a metal adsorption jig, wherein the three-dimensional movement module can realize the movement of the workbench in three directions of XYZ, and the adsorption jig is formed by processing metal pieces. The laser light emission mode and the movement of the workbench are controlled by a computer control system 9.
A 2mm soda lime glass sample 8 was placed on a three-dimensional table 7. By moving the workbench up and down, laser light is emitted on different Z axes to strike points on the sample, the dimension of the struck points on the sample is minimum as the focal position of the focusing mirror, the corresponding Z axis position is Z0 at the moment, the optimal working focal point is that is, the preset drilling position of the three-dimensional motion workbench is Z, Z=Z0-0.03 mm, and the Z axis is adjusted to the Z position.
The drilling position directly influences whether cracks are generated on the surface and inside of the drilling hole, and when the focal position of the drilling hole is 0.03-0.06 mm lower, the cracks can be avoided, and micropores without cracks can be manufactured on the brittle material. The focusing mirror has a certain depth of focus, and it is normally understood that the focus is directly in the middle of the depth of focus, where the material is reactive. In the present invention, drilling is performed at a position of focus of the target sample surface, which is shifted downward, so that chipping and thermal influence occurring at the time of drilling can be reduced.
Setting laser processing parameters, wherein the laser wavelength is 1035nm, the pulse width is less than 350fs, the laser power is 17W, and the pulse number is 3500.
The point output mode is set by the upper computer software, and the laser light emitting mode is intermittent dotting. The intermittent light-emitting parameters are light-emitting time of 0.09ms and processing times of 600, and the end delay is 50ms.
After laser light emission, forming a single hole on a glass sample with the thickness of 2mm, moving X or Y for a distance, and repeating the above steps to form a group of holes in certain arrangement, wherein the depth of the holes on the glass is 960um, the diameter of the holes is 27um, and the depth-to-diameter ratio is 35:1.
In another embodiment, the laser wavelength of the GHz infrared femtosecond laser 1 is 1035nm, the pulse width is smaller than 350fs, and the pulse width is 1.1GHz pulse train, and the number of the pulse trains is 200. The laser beam emitted by the laser 1 passes through the 45-degree reflectors 2 and 3 and enters the beam expander 4 to expand the laser beam. The laser beam is passed through the center of the beam expander 4 by adjusting the angles of the 45 ° mirrors 2 and 3, and is parallel to the optical axis of the beam expander 4. The laser beam after beam expansion passes through the 45-degree reflecting mirror group 5, then changes the direction and the position of the beam, enters the focusing mirror 6 for focusing, and the laser beam entering the focusing mirror is concentric and coaxial with the focusing by adjusting the lens angle of the reflecting mirror group 5. The 45 degree mirror group 5 may consist of 1-3 45 degree mirrors. The workbench of the device consists of a three-dimensional movement module and a metal adsorption jig, wherein the three-dimensional movement module can realize the movement of the workbench in three directions of XYZ, and the adsorption jig is formed by processing metal pieces. The laser light emission mode and the movement of the workbench are controlled by a computer control system 9.
A 1.8mm aluminosilicate glass sample 8 was placed on the three-dimensional table 7. By moving the workbench up and down, laser light is emitted on different Z axes to strike points on the sample, the dimension of the struck points on the sample is minimum as the focal position of the focusing mirror, the corresponding Z axis position is Z0 at the moment, the optimal working focal point is Z, namely the preset drilling position of the three-dimensional motion workbench is Z, Z=Z0-0.06 mm, and the Z axis is adjusted to the Z position.
The drilling position directly influences whether cracks are generated on the surface and inside of the drilling hole, and when the focal position of the drilling hole is 0.03-0.06 mm lower, the cracks can be avoided, and micropores without cracks can be manufactured on the brittle material. The focusing mirror has a certain depth of focus, and it is normally understood that the focus is directly in the middle of the depth of focus, where the material is reactive. In the present invention, drilling is performed at a position of focus of the target sample surface, which is shifted downward, so that chipping and thermal influence occurring at the time of drilling can be reduced.
Setting laser processing parameters, wherein the laser wavelength is 1035nm, the pulse width is less than 350fs, the laser power is 18W, and the pulse number is 10000.
The point output mode is set by the upper computer software, and the laser light emitting mode is continuous dotting. The continuous light-emitting parameters are light-emitting time of 100ms and processing times of 1.
After laser light emission, forming a single hole on a glass sample with the thickness of 1.8mm, moving X or Y for a distance, and repeating the above steps to form a group of holes in certain arrangement, wherein the depth of the holes on the glass is 700um, the diameter of the holes is 30um, and the depth-to-diameter ratio is 23.3.
The invention also discloses a drilling method for preparing the high depth-to-diameter ratio non-taper by using laser, which is based on the drilling system, and comprises the following steps:
The computer control system sets processing parameters of the GHz infrared femtosecond laser, controls the GHz infrared femtosecond laser to emit laser, and controls the three-dimensional movement workbench to move according to the processing parameters;
And the laser beam emitted by the GHz infrared femtosecond laser reaches a preset drilling position of the three-dimensional motion workbench to drill a target sample borne by the three-dimensional motion workbench after the transmission direction and the position of the laser beam are adjusted by a plurality of reflectors.
Further, after the transmission direction and the positions of laser beams emitted by the GHz infrared femtosecond laser are adjusted through a plurality of reflectors, the laser beams vertically penetrate the upper surface of a target sample borne by the three-dimensional moving workbench in a direction parallel to the Z axis of the three-dimensional moving workbench to obtain a focus position, and a preset drilling position of the three-dimensional moving workbench is located right below the focus position.
Further, the preset drilling position of the three-dimensional moving workbench is positioned 0.03-0.06 mm below the focal position.
The sample is placed on a three-dimensional workbench, laser light is emitted to strike points on the sample, the impact point on the sample is the focal position of a focusing lens at the minimum size by moving the workbench up and down, the corresponding Z-axis position is Z0, the optimal working focal point is Z which is the preset drilling position of the three-dimensional motion workbench, and Z=Z0- (0.03 mm-0.06 mm).
The drilling position directly influences whether cracks are generated on the surface and inside of the drilling hole, and when the focal position of the drilling hole is 0.03-0.06 mm lower, the cracks can be avoided, and micropores without cracks can be manufactured on the brittle material. The focusing mirror has a certain depth of focus, and it is normally understood that the focus is directly in the middle of the depth of focus, where the material is reactive. In the present invention, drilling is performed at a position of focus of the target sample surface, which is shifted downward, so that chipping and thermal influence occurring at the time of drilling can be reduced.
The method embodiments may be implemented in one-to-one correspondence with the foregoing system embodiments, and are not described herein.
Based on the same thought, the invention also discloses electronic equipment, which can comprise: the device comprises a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory are in communication with each other through the communication bus. The processor may invoke logic instructions in the memory to perform a method for preparing a high aspect ratio taper free drilling method using a laser, the drilling method being based on the drilling system of any of the above, the drilling method comprising:
The computer control system sets processing parameters of the GHz infrared femtosecond laser, controls the GHz infrared femtosecond laser to emit laser, and controls the three-dimensional movement workbench to move according to the processing parameters;
And the laser beam emitted by the GHz infrared femtosecond laser reaches a preset drilling position of the three-dimensional motion workbench to drill a target sample borne by the three-dimensional motion workbench after the transmission direction and the position of the laser beam are adjusted by a plurality of reflectors.
Further, the logic instructions in the memory described above may be implemented in the form of software functional units and stored in a computer-readable storage medium when sold or used as a stand-alone product. Based on this understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a usb disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
In another aspect, embodiments of the present invention further provide a computer program product comprising a computer program stored on a non-transitory computer readable storage medium, the computer program comprising program instructions which, when executed by a computer, are capable of performing a drilling method for preparing a high aspect ratio taper-free using a laser provided by the above method embodiments, the drilling method being based on any one of the drilling systems described above, the drilling method comprising:
The computer control system sets processing parameters of the GHz infrared femtosecond laser, controls the GHz infrared femtosecond laser to emit laser, and controls the three-dimensional movement workbench to move according to the processing parameters;
And the laser beam emitted by the GHz infrared femtosecond laser reaches a preset drilling position of the three-dimensional motion workbench to drill a target sample borne by the three-dimensional motion workbench after the transmission direction and the position of the laser beam are adjusted by a plurality of reflectors.
In yet another aspect, embodiments of the present invention further provide a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a processor, is implemented to perform a drilling method for preparing a high aspect ratio taper-free drilling method using a laser provided in the above embodiments, the drilling method being based on the drilling system according to any one of the above embodiments, the drilling method comprising:
The computer control system sets processing parameters of the GHz infrared femtosecond laser, controls the GHz infrared femtosecond laser to emit laser, and controls the three-dimensional movement workbench to move according to the processing parameters;
And the laser beam emitted by the GHz infrared femtosecond laser reaches a preset drilling position of the three-dimensional motion workbench to drill a target sample borne by the three-dimensional motion workbench after the transmission direction and the position of the laser beam are adjusted by a plurality of reflectors.
It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited in order and may be performed in other orders, unless explicitly stated herein. Moreover, at least some of the steps in the flowcharts of the figures may include a plurality of sub-steps or stages that are not necessarily performed at the same time, but may be performed at different times, the order of their execution not necessarily being sequential, but may be performed in turn or alternately with other steps or at least a portion of the other steps or stages.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (10)
1. A system for preparing a high aspect ratio non-tapered drilling system using a laser, comprising:
the computer control system is used for setting the processing parameters of the GHz infrared femtosecond laser, controlling the GHz infrared femtosecond laser to emit laser and controlling the three-dimensional movement workbench to move according to the processing parameters;
The GHz infrared femtosecond laser is used for emitting laser;
The reflecting mirror group comprises a plurality of reflecting mirrors, and the reflecting mirrors are used for changing the transmission direction and the position of the laser beam so as to enable the laser beam to reach the preset drilling position of the three-dimensional moving workbench;
and the three-dimensional moving workbench is used for bearing the target sample and drilling the target sample at a preset drilling position by moving the position.
2. The drilling system of claim 1, wherein the laser wavelength emitted by the GHz infrared femtosecond laser is in the infrared band, the pulse width is in the femtosecond level, the pulse train frequency is in the GHz level, and the GHz infrared femtosecond laser has a pulse train mode.
3. The drilling system for preparing the high depth-to-diameter ratio taper-free drilling system by utilizing laser according to claim 2, wherein the mode of emitting laser by the GHz infrared femtosecond laser is either intermittent dotting or continuous dotting.
4. The system for preparing a high aspect ratio taper-free drilling system according to claim 1, wherein the sample is any one of glass, sapphire, quartz, and metal materials.
5. The drilling system for preparing the high depth-to-diameter ratio taper-free drilling system by utilizing laser according to claim 1, further comprising a beam expander, wherein the beam expander is used for expanding laser beams emitted by the GHz infrared femtosecond laser.
6. The drilling system of claim 5, further comprising a focusing mirror for focusing the light beam, wherein the laser beam emitted by the GHz infrared femtosecond laser enters the beam expander for beam expansion after the transmission direction and position of the laser beam are adjusted by the plurality of mirrors, and enters the focusing mirror for focusing after the transmission direction and position of the laser beam are adjusted by the plurality of mirrors.
7. The system for preparing the high-depth-to-diameter-ratio conicity-free drilling system by utilizing laser according to claim 6, wherein the laser beam is focused by the focusing lens and then vertically irradiates on the upper surface of a target sample borne by the three-dimensional moving workbench in a direction parallel to the Z axis of the three-dimensional moving workbench to obtain a focal position, and the preset drilling position of the three-dimensional moving workbench is located right below the focal position.
8. A method for preparing a taper-free drilling of a high aspect ratio by laser, wherein the drilling method is based on the drilling system according to any one of claims 1 to 7, the drilling method comprising:
The computer control system sets processing parameters of the GHz infrared femtosecond laser, controls the GHz infrared femtosecond laser to emit laser, and controls the three-dimensional movement workbench to move according to the processing parameters;
And the laser beam emitted by the GHz infrared femtosecond laser reaches a preset drilling position of the three-dimensional motion workbench to drill a target sample borne by the three-dimensional motion workbench after the transmission direction and the position of the laser beam are adjusted by a plurality of reflectors.
9. The method for preparing the high-depth-to-diameter-ratio taper-free drilling by utilizing the laser according to claim 8, wherein the laser beam emitted by the GHz infrared femtosecond laser is vertically irradiated on the upper surface of a target sample carried by the three-dimensional moving workbench in a direction parallel to the Z axis of the three-dimensional moving workbench to obtain a focal position after the transmission direction and the position of the laser beam are adjusted by a plurality of reflectors, and the preset drilling position of the three-dimensional moving workbench is positioned right below the focal position.
10. The method for preparing the high depth-to-diameter ratio taper-free drilling by utilizing the laser according to claim 9, wherein the preset drilling position of the three-dimensional moving workbench is positioned at 0.03-0.06 mm below the focal position.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410347900.7A CN118081127A (en) | 2024-03-26 | 2024-03-26 | Drilling system and method for preparing high depth-to-diameter ratio taper-free drilling by utilizing laser |
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|---|---|---|---|
| CN202410347900.7A CN118081127A (en) | 2024-03-26 | 2024-03-26 | Drilling system and method for preparing high depth-to-diameter ratio taper-free drilling by utilizing laser |
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