CN118075984A

CN118075984A - Circuit board and terminal equipment

Info

Publication number: CN118075984A
Application number: CN202410504568.0A
Authority: CN
Inventors: 吴东; 时龙飞; 殷明; 梁峰
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2024-04-25
Filing date: 2024-04-25
Publication date: 2024-05-24

Abstract

The embodiment of the application relates to the technical field of circuit board structures, and provides a circuit board and terminal equipment. The loss layer is used for consuming high-frequency electric signals and comprises a first dielectric layer or a first conductor layer, wherein the wiring layer, the first dielectric layer and the substrate are laminated in the thickness direction of the circuit board, the first dielectric layer is close to the substrate, and the wiring layer is far away from the substrate; or the wiring layer and the first conductor layer are adjacently arranged. The circuit board provided by the embodiment of the application is additionally provided with the loss layer for consuming high-frequency electric signals. The loss layer comprises a first dielectric layer or a first conductor layer, and the material performance characteristics of the first dielectric layer and the first conductor layer are utilized to consume the high-frequency electric signals so as to reduce interference of the high-frequency noise signals to other devices through the circuit board. Meanwhile, the space occupied by the loss layer in the form of a layer structure is smaller, and the space utilization rate of each device is improved.

Description

Circuit board and terminal equipment

Technical Field

The present application relates to the field of circuit board structures, and in particular, to a circuit board and a terminal device.

Background

In the terminal equipment, devices such as a switching power supply generally generate high-frequency noise signals during operation, and after the high-frequency noise signals are correspondingly coupled and transmitted in a circuit, the high-frequency noise signals affect other electromagnetic devices and the like. For example, in some scenes, terminal devices such as mobile phones and tablet computers, the densely arranged antennas can cause the interference to the camera module, and high-frequency noise signals can be transmitted to the camera module along the wiring path of the circuit board to perform signal interference on the camera module, so that the camera module has the phenomena of screen pattern, blocking, screen freezing and the like; furthermore, in other scenarios, the side antenna of the terminal device is located closer to the fingerprint circuit board, so that the fundamental wave of the side antenna enters the control motherboard through the circuit of the fingerprint circuit board to excite the reflection coefficient harmonic wave.

Aiming at the problems, the current solution is to carry out series connection of corresponding devices on a circuit to carry out filtering or change the electrical connection mode. The filter device is added to occupy space and increase cost, and the anti-interference risk of other frequency bands can be introduced with high probability when the electric connection mode is changed.

In summary, there is a need to solve the problem that the high-frequency noise source causes corresponding interference to other devices after coupling transmission.

Disclosure of Invention

The embodiment of the application provides a circuit board and terminal equipment, which can solve the technical problem that high-frequency noise sources cause corresponding interference to other devices after coupling transmission.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical scheme:

in a first aspect, the present application provides a circuit board comprising:

The substrate, which is the main part of the circuit board, is usually made of an insulating material, such as glass fiber reinforced epoxy, and the substrate provides the corresponding physical support and determines the mechanical strength and heat resistance of the circuit board.

The wiring layer is formed on the substrate and is used for transmitting current and connecting electronic devices, and usually, the number of the wiring layers is multiple, and corresponding printed circuits are also arranged on the wiring layer.

The loss layer is used for consuming high-frequency electric signals, and it is understood that the propagation mode of the low-frequency electric signals is similar to direct current transmission, so that the low-frequency electric signals are transmitted on the surface of the wiring layer, the high-frequency electric signals are transmitted in a field-like mode, and the loss layer is used for consuming the high-frequency electric signals, so that interference of the high-frequency electric signals on surrounding devices is reduced.

The loss layer comprises a first dielectric layer or a first conductor layer, and the conductivity of the first conductor layer is lower than that of the wiring layer; the material of the first dielectric layer may be strontium titanate ceramic, polysilicon, aluminum oxide ceramic, aluminum oxide, silicon nitride, polytetrafluoroethylene, mineral fibers, wood fiber cotton, rubber, etc., which belongs to a dielectric loss material, or the material of the first dielectric layer may also be a casting alloy (such as an alnico alloy, an iron-chromium-aluminum alloy, an iron-aluminum-carbon alloy, and an iron-cobalt alloy), a sintered alloy (such as a rare earth element-containing cobalt alloy, a rare earth element-containing iron alloy), a machinable alloy (such as a platinum-cobalt alloy, a manganese-aluminum-carbon alloy, a copper-nickel-iron alloy, an aluminum-manganese-silver alloy), ferrite, and an intermetallic compound, which belongs to a magnetic loss material, and the first dielectric layer is capable of generating energy loss due to movement of charges in the corresponding material when the high-frequency electric signal propagates in a field form, and is understood to convert the corresponding electric energy or electromagnetic energy into heat energy. Similarly, the first conductor layer may be made of manganese copper, copper oxide, zinc oxide, magnesium oxide, iron-clad aluminum alloy with high resistance, rare earth element-containing material, metal nitride, etc. which are low-conductivity materials, and the high-frequency electric signal generates energy loss due to movement of charges in the corresponding material when passing through the first conductor layer, so as to convert corresponding electric energy or electromagnetic energy into heat energy.

The wiring layer, the first dielectric layer and the substrate are stacked in the thickness direction of the circuit board, the first dielectric layer is close to the substrate, the wiring layer is far away from the substrate, the first dielectric layer is closer to the substrate than the wiring layer, and it is understood that the wiring layer, the first dielectric layer and the substrate are stacked in sequence in the thickness direction of the circuit board.

Or the wiring layer and the first conductor layer are adjacently arranged, and the wiring layer and the first conductor layer are positioned on the substrate, and because the first conductor layer is the conductor, the arrangement mode of the wiring layer and the first conductor layer is that the wiring layer and the first conductor can be vertically arranged relative to the substrate, or the wiring layer and the first conductor can be horizontally arranged relative to the substrate, or the wiring layer and the first conductor layer can be enclosed relative to the substrate, for example, the wiring layer is embedded in the first conductor layer or the wiring layer is enclosed by the first conductor layer. In this way, since the conductivity of the first conductor layer is lower than that of the trace layer, the low-frequency electric signal is preferentially transmitted on the surface of the trace layer, and the high-frequency electric signal is transmitted between the first conductor layer and the substrate in a field form, so that the high-frequency electric signal is consumed by the first conductor layer.

The technical scheme provided by the embodiment of the application has at least the following technical effects or advantages:

The circuit board provided by the embodiment of the application is additionally provided with the loss layer for consuming high-frequency electric signals. Specifically, the loss layer comprises a first dielectric layer or a first conductor layer, and the material performance characteristics of the first dielectric layer and the first conductor layer are utilized to consume the high-frequency electric signals so as to reduce interference of the high-frequency noise signals to other devices through the circuit board. Meanwhile, the space occupied by the loss layer in the form of a layer structure is smaller, and the space utilization rate of each device is improved.

In some embodiments, the first dielectric layer includes a first dielectric layer having an imaginary permittivity greater than 0.5 or an imaginary permeability greater than 0.5.

It will be appreciated that the first dielectric layer consumes the high frequency electrical signal primarily by dielectric loss or magnetic field loss. Here, the first dielectric layer having an imaginary part of dielectric constant greater than 0.5 may be a dielectric layer made of strontium titanate ceramic, polysilicon, aluminum oxide ceramic, aluminum oxide, silicon nitride, polytetrafluoroethylene, mineral fiber, wood fiber cotton, rubber, or the like, and the first dielectric layer having an imaginary part of magnetic permeability greater than 0.5 may be a dielectric layer made of a casting alloy (e.g., aluminum nickel alloy, iron chromium aluminum alloy, iron aluminum carbon alloy, and iron cobalt alloy), a sintered alloy (e.g., rare earth element-containing cobalt alloy, rare earth element-containing iron alloy), a processable alloy (e.g., platinum cobalt alloy, manganese aluminum carbon alloy, copper nickel iron alloy, aluminum manganese silver alloy), ferrite, intermetallic compound, or the like.

In some embodiments, in a thickness direction of the circuit board, the projection of the first dielectric layer and the trace layer on the substrate at least partially coincides.

It will be appreciated that the high frequency electrical signal is transmitted in the form of a field within the circuit board and is therefore transmitted primarily between the first dielectric layer and the substrate, such that, in order to reduce interference with the low frequency electrical signal on the surface of the trace layer, then, in the thickness direction of the circuit board, the first dielectric layer and the projection of the trace layer onto the substrate at least partially overlap, where the partial overlap of the first dielectric layer and the projection of the trace layer onto the substrate means that there is a partial area of the trace layer that does not fall within the projection of the first dielectric layer in that direction, and the complete overlap of the first dielectric layer and the projection of the trace layer onto the substrate means that all of the trace layer falls within the projection of the first dielectric layer in that direction.

In some embodiments, the circuit board further includes a second dielectric layer disposed between the trace layer and the first dielectric layer, the imaginary permittivity or permeability of the second dielectric layer being greater than the imaginary permittivity or permeability of the first dielectric layer.

It is understood that the second dielectric layer consumes less high-frequency electric signals than the first dielectric layer, or the second dielectric layer does not consume high-frequency electric signals, for example, the material of the second dielectric layer may be the same as the material of the substrate, or the material of the second dielectric layer may be different from the material of the substrate, but the imaginary part of the dielectric constant or the imaginary part of the magnetic permeability of the second dielectric layer is larger than the imaginary part of the dielectric constant or the imaginary part of the magnetic permeability of the first dielectric layer. Therefore, the material of the second dielectric layer can be selected according to specific practical requirements, so that the high-frequency electric signal is consumed to a small extent.

In some embodiments, the first conductor layer has a conductivity of 7000S/m or less.

It will be appreciated that the first conductor layer has a conductivity less than or equal to 7000S/m, which means that the first conductor layer has a low current conductivity and is difficult to pass low-frequency electric signals, where the first conductor layer may be made of manganese copper, copper oxide, zinc oxide, magnesium oxide, iron-aluminum alloy with high resistance, rare earth element-containing material, metal nitride, etc., so that when the trace layer is disposed adjacent to the first conductor layer, the low-frequency electric signals tend to be transmitted on the surface of the trace layer, but not on the surface of the first conductor layer, and thus the arrangement structure of the trace layer adjacent to the first conductor layer has smaller blocking and loss of the low-frequency electric signals and larger loss of the high-frequency electric signals.

In some embodiments, the trace layer and the first conductor layer are stacked in a thickness direction of the circuit board; or in the thickness direction perpendicular to the circuit board, the wiring layer is abutted against the first conductor layer.

It will be appreciated that the trace layer is located on a side of the first conductor layer facing away from the substrate, and further, in the thickness direction of the circuit board, the trace layer, the first conductor layer and the substrate are sequentially arranged, so that the low-frequency electrical signal is transmitted on the surface of the trace layer, but not on the surface of the first conductor layer, and the high-frequency electrical signal is transmitted in the form of a field between the first conductor layer and the substrate and is gradually consumed by the first conductor layer. Or in the thickness direction perpendicular to the circuit board, the arrangement of the wiring layer and the first conductor layer in a butt joint way means that the wiring layer and the first conductor layer are arranged towards the horizontal direction, which is equivalent to arranging the laminated wiring layer and first conductor layer horizontally.

In some embodiments, one of the trace layer and the first conductor layer is provided with a recess, and the other of the trace layer and the first conductor layer is provided with a protrusion that fits the recess.

It is understood that the structural form of the concave part includes, but is not limited to, grooves, pits, blind holes, through holes, etc., and the structural form of the convex part includes, but is not limited to, ribs, columns, bumps, etc., and the connection between the routing layer and the first conductor layer is realized by utilizing the structural design of the matching of the convex and concave structures.

In some embodiments, the circuit board further includes a second conductor layer disposed between the first conductor layer and the substrate, the second conductor layer having a conductivity greater than a conductivity of the first conductor layer.

It will be appreciated that the conductivity of the second conductor layer should be greater than 7000S/m to meet the high frequency electrical signal transmitted between the first conductor layer and the substrate, or between the first conductor layer and the second conductor layer in the form of a field.

In some embodiments, the first conductor layer is at least partially disposed within the substrate, or the first dielectric layer is at least partially disposed within the substrate.

It is understood that the first conductor layer or the first dielectric layer may not be limited to be disposed on the surface of the substrate, but may be disposed in the substrate, for example, a corresponding groove structure is formed on the substrate, so as to satisfy that the first conductor layer or the first dielectric layer is further connected with the substrate.

In a second aspect, the present application provides a terminal device, including the circuit board described above.

The terminal device may also have other structures, such as a camera module, a housing, a battery, and the like.

In the technology with the circuit board, the terminal equipment provided by the embodiment of the application can reduce the influence of devices which are mainly used for transmitting high-frequency signals when in work such as a switching power supply on the signal transmission of devices which are mainly used for transmitting low-frequency signals when in work, and meanwhile, the cost is more controllable, and the design of lightening and thinning is easier to realize.

Drawings

Fig. 1 is a schematic structural diagram of a terminal device according to an embodiment of the present application;

fig. 2 is an exploded view of a terminal device according to an embodiment of the present application;

fig. 3 is a cross-sectional view of a circuit board according to a first embodiment of the present application;

fig. 4 is a cross-sectional view of a circuit board according to a second embodiment of the present application;

fig. 5 is a cross-sectional view of a circuit board according to a third embodiment of the present application;

fig. 6 is a cross-sectional view of a circuit board according to a fourth embodiment of the present application;

fig. 7 is a cross-sectional view of a circuit board according to a fifth embodiment of the present application;

Fig. 8 is a cross-sectional view of a circuit board according to a sixth embodiment of the present application;

fig. 9 is a cross-sectional view of a circuit board according to a seventh embodiment of the present application;

Fig. 10 is a cross-sectional view of a circuit board according to an eighth embodiment of the present application;

fig. 11 is a cross-sectional view of a circuit board according to a ninth embodiment of the present application;

Fig. 12 is a cross-sectional view of a circuit board according to a tenth embodiment of the present application;

Fig. 13 is a cross-sectional view of a circuit board according to an eleventh embodiment of the present application;

fig. 14 is a schematic diagram of a low-frequency band curve of a circuit board provided by the embodiment of the application under the condition that a first dielectric layer exists or not;

Fig. 15 is a schematic diagram of a high-frequency band curve of a circuit board provided by an embodiment of the present application in the presence or absence of a first dielectric layer;

FIG. 16 is a graph showing a comparison of the distribution of propagation fields of low-frequency and high-frequency electrical signals after using a first dielectric layer in a circuit board according to an embodiment of the present application;

fig. 17 is a schematic diagram of a low-frequency band curve of a circuit board provided by an embodiment of the present application in the presence or absence of a first conductor layer;

Fig. 18 is a schematic diagram of a high-frequency band curve of a circuit board provided in an embodiment of the application in the presence or absence of a first conductor layer.

Wherein, each reference sign in the figure:

1000. A terminal device;

100. a circuit board; 200. a housing; 300. a display screen; 400. A battery; 500. a camera module;

201. A middle frame; 202. a rear cover; 501. a front camera; 502. and a rear camera.

10. A substrate; 20. a wiring layer; 30. a depletion layer; 31. a first dielectric layer; 32. a first conductor layer; 33. a second dielectric layer; 34. a second conductor layer; 41. a concave portion; 42. a convex portion;

X, thickness direction of the circuit board.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present application and should not be construed as limiting the application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion.

In the description of the present application, it should be understood that the terms "length," "width," "thickness," "top," "bottom," "inner," "outer," "upper," "lower," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

The terms "first," "second," "third," "fourth," "fifth," "sixth," and the like are used solely for distinguishing between descriptions and not necessarily for indicating or implying a relative importance or implicitly indicating the number of features indicated. For example, the first deformation space and the second deformation space are merely for distinguishing between the different deformation spaces, and are not limited in their order, and the first deformation space may also be named as the second deformation space, and the second deformation space may also be named as the first deformation space, without departing from the scope of the various described embodiments. And the terms "first," "second," and the like, do not necessarily denote different quantities.

In the present application, unless explicitly specified and limited otherwise, the terms "connected," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally formed, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, "and/or" is merely one association relationship describing the association object, meaning that three relationships may exist; for example, a and/or B may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

It should be noted that, in the present application, words such as "in some embodiments," "illustratively," "for example," and the like are used to indicate examples, illustrations, or descriptions. Any embodiment or design described herein as "in some embodiments," "illustratively," "for example," should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "in some embodiments," "illustratively," "for example," and the like are intended to present related concepts in a concrete fashion.

The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent.

The circuit board is used for bearing electronic components. For example, mobile phones, tablet computers and circuit boards of computers generally include a main circuit Board and a sub circuit Board, which are electrically connected through an FPC, and therefore, connection positions for connection with the FPC, which are Board-to-Board (BTB) connectors, are disposed on the main circuit Board and the sub circuit Board.

Meanwhile, various components such as an antenna, a power amplifier, a tuning circuit, a switching power supply and the like which are mainly used for high-frequency electric signals when working, and components such as a fingerprint touch pad and a camera module which are mainly used for low-frequency electric signals when working are arranged on the circuit board. When the high-frequency electric signals are transmitted in a field mode, the coupling can be carried out at the connection point position of each component, so that the high-frequency electric signals can be transmitted in the wiring path of the circuit board, and the surrounding components are interfered.

For example, in a folding screen mobile phone, a fingerprint touch pad is generally disposed at a bending main structure of the folding screen mobile phone, the fingerprint touch pad is electrically connected with a main board through a wiring, and meanwhile, a device for emitting high-frequency electric signals such as an antenna is also disposed at the bending main structure, so that when the antenna works, high-frequency noise is coupled with the wiring of the fingerprint touch pad, and the high-frequency noise is transmitted to the main board, thereby exciting reflection coefficient harmonic waves to a control module of the main board and affecting the normal work of the main board.

For another example, in a mobile phone or a tablet computer, the densely arranged antennas can cause the same interference to the camera module, and the high-frequency noise signals can be transmitted to the camera module along the wiring path of the circuit board to perform signal interference to the camera module, so that the camera module has the phenomena of screen pattern, blocking, screen freezing and the like.

In order to solve the above problems, the current solution is to connect corresponding devices in series in the circuit to perform filtering, but the devices connected in series need to occupy a certain space, and meanwhile, the cost problem is caused by adding the devices; or the electric connection mode of each component is adjusted, but the anti-interference risk of other frequency bands can be introduced by changing the electric connection mode.

In view of the above, the embodiment of the application provides a circuit board with a dissipation layer for dissipating high-frequency electric signals. Specifically, the loss layer comprises a first dielectric layer or a first conductor layer, and the material performance characteristics of the first dielectric layer and the first conductor layer are utilized to consume the high-frequency electric signals so as to reduce interference of the high-frequency noise signals to other devices through the circuit board. Meanwhile, the space occupied by the loss layer in the form of a layer structure is smaller, and the space utilization rate of each device is improved.

Terminal device 1000 can include a handheld device, an in-vehicle device, a wearable device, a computing device, or other processing device connected to a wireless modem. And may also include cellular phones (cellphones), smart phones (smart phones), personal Digital Assistants (PDA) computers, tablet computers, laptop computers (laptop computers), machine Type Communication (MTC) terminals, point of sale (POS), car computers, and other terminal devices 1000 with imaging capabilities.

The embodiment of the present application is not particularly limited to the specific form of the terminal device 1000 described above. The following description will take terminal device 1000 as an example of a mobile phone for convenience of explanation and understanding.

Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of a terminal device according to an embodiment of the present application, fig. 2 is an exploded structural diagram of a terminal device according to an embodiment of the present application, and referring to fig. 1 and 2, a terminal device 1000 according to an embodiment of the present application may include a housing 200, a display 300, a circuit board 100, and a battery 400.

Among other things, the housing 200 may provide a structural frame for the terminal device, and in particular, the housing 200 includes a center 201 and a rear cover 202. A middle frame 201, a circuit board 100, and a battery 400 are provided between the display screen 300 and the rear cover 202. The circuit board 100 and the battery 400 may be disposed on the middle frame 201, for example, the circuit board 100 and the battery 400 may be disposed on a side of the middle frame 201 facing the rear cover 202, or the circuit board 100 and the battery 400 may be disposed on a side of the middle frame 201 facing the display screen 300.

It will be appreciated that the housing 200 of the terminal device 1000 provided by the present application includes, but is not limited to, the above-described structure, for example, in some other embodiments, the housing 200 may be an integral or separate housing 200 made of metal or plastic, etc. In the embodiment of the present application, the case 200 is specifically described by taking the structure of the middle frame 201 and the rear cover 202 as an example.

The battery 400 may be electrically connected to the circuit board 100 to supply power to the processor, the internal memory, the external memory, the display 300, the camera module 500, the communication module, and the like.

The display 300 may be an Organic Light-Emitting Diode (OLED) display 300 or a Liquid crystal display 300 (Liquid CRYSTAL DISPLAY, LCD).

The rear cover 202 may be a metal rear cover, a glass rear cover, a plastic rear cover, or a ceramic rear cover 202, and in the embodiment of the present application, the material of the rear cover 202 is not limited.

The middle frame 201 may include a middle plate and a rim. The frame sets up a week around the periphery of medium plate. Generally, the frame may include a top frame, a bottom frame, a left side frame, and a right side frame, where the top frame, the bottom frame, the left side frame, and the right side frame enclose a square ring structure. The middle plate can be an aluminum plate, an aluminum alloy or a magnesium alloy. The frame can be a metal frame or a ceramic frame. The metal middle plate and the frame can be clamped, welded, bonded or integrally formed, or the metal middle plate and the frame are fixedly connected through injection molding.

It should be noted that, in some other embodiments, terminal device 1000 may include, but is not limited to, the structure shown in fig. 1 and 2, and rear cover 202 may be connected to a frame to form an integrally formed housing, for example, the terminal device may include: the display 300, the metal middle plate and the housing 200, the housing 200 may be integrally formed with the bezel and the rear cover 202. Thus, the circuit board 100 and the battery 400 are located in a space surrounded by the metal middle plate and the case 200.

In the embodiment of the present application, in order to implement a shooting function, the terminal device further includes: at least one camera module 500 and a flash lamp (not shown in the figure), wherein the camera module 500 may be a front camera 501, a rear camera 502, etc., and the number of the front camera 501 and the rear camera 502 may be one or more, for example, as shown in fig. 2, in the terminal device provided by the present application, the camera module 500 includes one front camera 501 and one rear camera 502.

Wherein, the rear cover 202 is provided with an opening for installing a flash and a partial area of the rear camera 502. The front camera 501 may be arranged on the side of the middle plate facing the display 300. In the embodiment of the present application, the setting positions of the front camera 501 and the rear camera 502 include, but are not limited to, the above description. In some embodiments, the sum of the numbers of the front cameras 501 and the rear cameras 502 set in the terminal device may be 1 or N, where N is a positive integer greater than 1.

It will be appreciated that the structure illustrated in the embodiments of the present application does not constitute a specific limitation on the terminal device. In other embodiments of the application, the terminal device may include more or less components than illustrated, or certain components may be combined, or certain components may be split, or different arrangements of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

Referring to fig. 3 and fig. 7, a circuit board 100 according to an embodiment of the application includes a substrate 10, a trace layer 20 and a dissipation layer 30.

The substrate 10 is a main body portion of the circuit board 100, and is typically made of an insulating material, such as glass fiber reinforced epoxy resin, and the base material provides corresponding physical support and determines the mechanical strength and heat resistance of the circuit board 100.

The trace layer 20 is formed on the substrate 10 for transmitting current and connecting electronic devices, and typically, the trace layer 20 has a plurality of trace layers, and corresponding printed circuits are also formed on the trace layer 20, for example, the trace layer 20 may be an inner trace layer and an outer trace layer.

The depletion layer 30 is used for consuming high-frequency electric signals, and it is understood that the low-frequency electric signals propagate in a similar manner to direct current transmission, and the magnetic field formed by the low-frequency electric signals is closer to the characteristic of a static magnetic field, so that the low-frequency electric signals are transmitted on the surface of the wiring layer 20, and the high-frequency electric signals are transmitted in a field-like manner, so that the depletion layer 30 is used for depletion of the high-frequency electric signals, thereby reducing interference of the high-frequency electric signals on surrounding devices.

The lossy layer 30 includes a first dielectric layer 31 or a first conductor layer 32, the first conductor layer 32 having a lower conductivity than the trace layer 20.

The material of the first dielectric layer 31 may be strontium titanate ceramic, polysilicon, aluminum oxide ceramic, aluminum oxide, silicon nitride, polytetrafluoroethylene, mineral fibers, wood fiber cotton, rubber, etc., which belongs to a dielectric loss material, or the material of the first dielectric layer 31 may also be a casting alloy (such as alnico, ferrochrome alloy, ferrochrome aluminum alloy, ferroaluminum carbon alloy, and ferrocobalt alloy), a sintering alloy (such as rare earth-containing cobalt alloy, rare earth-containing iron alloy), a machinable alloy (such as platinum cobalt alloy, manganese aluminum carbon alloy, copper nickel iron alloy, aluminum manganese silver alloy), ferrite, and intermetallic compound, which belongs to a magnetic loss material, and the first dielectric layer 31 is capable of generating energy loss due to movement of charges in the corresponding material when the high-frequency electric signal propagates in a field form, so as to convert corresponding electric energy or electromagnetic energy into heat energy.

Similarly, the first conductive layer 32 has a conductivity lower than that of the trace layer 20, so that the high-frequency electric signal is obviously consumed and blocked, and the material of the first conductive layer 32 can be manganese copper, copper oxide, zinc oxide, magnesium oxide, iron-aluminum alloy with high resistance, rare earth element-containing material, metal nitride and the like, and the material is a low-conductivity material, and is also an ohmic-loss material, and similarly, the high-frequency electric signal generates energy loss due to movement of charges in the corresponding material when passing through the first conductive layer 32, so that corresponding electric energy or electromagnetic energy is converted into heat energy.

In the thickness direction X of the circuit board 100, the trace layer 20, the first dielectric layer 31 and the substrate 10 are stacked, where the first dielectric layer 31 is close to the substrate 10, and the trace layer 20 is far away from the substrate 10, and here, the first dielectric layer 31 is closer to the substrate 10 than the trace layer 20.

It is understood that the trace layer 20, the first dielectric layer 31, and the substrate 10 are stacked in this order in the thickness direction X of the circuit board 100. The wiring layer 20 and the first dielectric layer 31 are directly connected, and the connection manner of the two includes, but is not limited to, bonding, welding, electroplating, etc., or the wiring layer 20 and the first dielectric layer 31 are indirectly connected, for example, other dielectric layers, for example, air dielectric or dielectric layers of other materials, may be arranged between the two, and the connection manner of the first dielectric layer 31 and the substrate 10 includes, but is not limited to, bonding, clamping, welding, threaded connection, etc.

As illustrated in fig. 3, the trace layer 20, the first dielectric layer 31 and the substrate 10 are stacked in the thickness direction X of the circuit board 100, and in this direction, the projection area of the first dielectric layer 31 is the same as the projection area of the substrate 10, the outline of the two are coincident, and the projection of the trace layer 20 falls completely within the projection range of the first dielectric.

Or as shown in fig. 4, in the thickness direction X of the circuit board 100, the trace layer 20, the first dielectric layer 31, and the substrate 10 are stacked, and in this direction, the projection of the trace layer 20 only partially falls within the projection range of the first dielectric.

Alternatively, as shown in fig. 5, in the thickness direction X of the circuit board 100, other dielectric layers may be added between the trace layer 20 and the first dielectric layer 31, for example, the trace layer 20 and the first dielectric layer 31 are suspended, that is, an air medium is formed between them, or a medium similar to the material of the substrate 10 may be further disposed between the trace layer 20 and the first dielectric layer 31.

To sum up, to verify that the first dielectric layer 31 is added to the circuit board 100, as shown in fig. 14, a low-frequency band curve of the circuit board 100 provided in the embodiment of the present application is shown, in which the curve marked a is a low-frequency band curve of the circuit board 100 in which the first dielectric layer 31 is not added, and the curve marked B is a low-frequency band curve of the circuit board 100 in which the first dielectric layer 31 is added, it is known that the lower the frequency of the low-frequency electric signal, the smaller the loss of the first dielectric layer 31 on the low-frequency electric signal, which means that the loss of the first dielectric layer 31 on the low-frequency electric signal is almost negligible, so that the influence of adding the first dielectric layer 31 on the circuit board 100 on the low-frequency transmission signal is smaller.

Fig. 15 is a schematic diagram of a high-frequency band curve of the circuit board 100 provided in the embodiment of the present application in the presence or absence of the first dielectric layer 31, where the curve marked a is a high-frequency band curve of the circuit board 100 in which the first dielectric layer 31 is not added, and the curve marked B is a high-frequency band curve of the circuit board 100 in which the first dielectric layer 31 is added, and it is known from the figure that, as the frequency of the high-frequency electric signal increases, the loss of the high-frequency electric signal by the first dielectric layer 31 is not linearly increased, but also the front-back variation is obvious, and the insertion loss of the high-frequency electric signal by the circuit board 100 in which the first dielectric layer 31 is increased by 25dB by comparing the high-frequency electric signal around 0.8 GHz.

Referring to fig. 16, fig. 16 is a graph showing a propagation field distribution of a low-frequency electric signal and a high-frequency electric signal of the circuit board 100 according to the embodiment of the present application after the first dielectric layer 31 is used; in the figure, a schematic structure of the circuit board 100 under a simulation condition is shown, wherein the left and right ends of the circuit board 100 are a first channel and a second channel to be tested, and the simulation test condition is to add a signal transmission device between the first channel and the second channel to observe the transmission field distribution of the electric signals in each frequency band in the circuit board 100. From top to bottom, a is a schematic structural diagram of the circuit board 100 in an initial state, and B is a schematic structural diagram of a transmission field distribution of one trace in the circuit board 100 under a low-frequency electrical signal; in the figure, C is a schematic structural diagram of a transmission field distribution of the plurality of traces in the circuit board 100 under the low-frequency electrical signal; as can be seen from comparison of A, B, C, the loss of the first dielectric layer 31 to the low-frequency electrical signal (below 20M) is almost negligible, i.e., the transmission of the low-frequency electrical signal on the circuit board 100 is not affected. Further, continuing from top to bottom, D is a schematic structural diagram of the transmission field distribution of the circuit board 100 under the high-frequency electrical signal, and E is a schematic structural diagram of the transmission field distribution of the circuit board 100 under another high-frequency electrical signal; f is a schematic diagram of the transmission field distribution of the circuit board 100 under a further high-frequency electrical signal; g is a schematic structural diagram of a transmission field distribution of the circuit board 100 under a further high-frequency electric signal; since the frequency of the high-frequency electrical signal transmitted on each circuit board 100 increases gradually from top to bottom, it can be seen from comparison of D, E, F, G that the loss of the high-frequency electrical signal (less than 600M) by the first dielectric layer 31 increases with the frequency of the high-frequency electrical signal.

The trace layer 20 and the first conductor layer 32 are disposed adjacently, and the trace layer 20 and the first conductor layer 32 are disposed on the substrate 10, and since the first conductor layer 32 is both a conductor, the trace layer 20 and the first conductor layer 32 are disposed adjacently in such a manner that the trace layer 20 and the first conductor can be disposed up and down with respect to the substrate 10, or both can be disposed left and right with respect to the substrate 10, or both can be disposed around the substrate 10, for example, the trace layer 20 is embedded in the first conductor layer 32 or the trace layer 20 is surrounded by the first conductor layer 32. Thus, since the conductivity of the first conductor layer 32 is lower than that of the trace layer 20, the low-frequency electric signal is preferentially transmitted on the surface of the trace layer 20, and the high-frequency electric signal is transmitted in the form of a field between the first conductor layer 32 and the substrate 10, so as to be consumed by the first conductor layer 32.

For example, as shown in fig. 7, in the thickness direction X of the circuit board 100, the wiring layer 20, the first conductor layer 32, and the substrate 10 are stacked, and signal transmission is performed by the wiring layer 20 and the first conductor layer 32.

Illustratively, as shown in fig. 8, the trace layer 20 is disposed in parallel with the first conductor layer 32 in a thickness perpendicular to the circuit board 100, i.e., in a horizontal or side-to-side arrangement such that a portion of both the trace layer 20 and the first conductor layer 32 are in contact with the substrate 10.

Illustratively, as shown in fig. 9 and 10, the first conductor layer 32 is provided with a corresponding groove structure on either end surface, and the trace layer 20 is disposed in the groove structure, where the trace layer 20 may be partially disposed in the groove structure, or the trace structure may be disposed entirely in the groove structure.

To sum up, a first conductor layer 32 is added to the circuit board 100 for verification, as shown in fig. 17, fig. 17 is a schematic diagram of a low-frequency band curve of the circuit board 100 provided by the embodiment of the application under the condition that whether the first conductor layer 32 exists or not, the curve marked a in the figure is a low-frequency band curve of the circuit board 100 in which the first conductor layer 32 is not added, the curve marked B in the figure is a low-frequency band curve of the circuit board 100 in which the first conductor layer 32 is added, and the curve marked C in the figure is a low-frequency band curve of the circuit board 100 in which the first conductor layer 32 is added, wherein the structures of the circuit board 100 corresponding to the curve B and the curve in the figure are respectively formed by laminating the trace layer 20, the first conductor layer 32 and the substrate 10, the first conductor layer 32 is close to the substrate 10, and the first conductor layer 32, the first conductor layer 32 is far away from the substrate 10, and the frequency of the low-frequency electrical signal is lower than the substrate 10, and the lower electrical signal frequency of the electrical signal is lower than the first conductor layer 32, the lower than the first conductor layer 32 has a small influence on the low-frequency signal layer 32, and the lower loss on the first conductor layer 32 is not lower than the low-frequency conductor layer 32 is less than the low-frequency conductor layer 32, and the lower influence on the low-frequency conductor layer 32 is less than the low-frequency layer 32 is not lower than the low-frequency conductor layer is provided.

Fig. 18 is a schematic diagram of a high-frequency band curve of the circuit board 100 provided in the embodiment of the present application in the presence or absence of the first conductor layer 32, the curve marked in the drawing is a high-frequency band curve of the circuit board 100 in which the first conductor layer 32 is not added, the curve marked in the drawing is a high-frequency band curve of the circuit board 100 in which the first conductor layer 32 is added, and the curve marked in the drawing is a high-frequency band curve of the circuit board 100 in which the first conductor layer 32 is added, wherein the structure of the circuit board 100 corresponding to the curve marked in the curve is that the trace layer 20, the first conductor layer 32 and the substrate 10 are laminated, the first conductor layer 32 is close to the substrate 10, and the trace layer 32, the trace layer 20 and the substrate 10 are laminated, the first conductor layer 32 is far away from the substrate 10, as the frequency of the high-frequency electric signal increases, the loss of the first dielectric layer 31 increases linearly for the high-frequency electric signal, and the loss increases by 3dB for the high-frequency electric signal of different frequency bands, especially the loss can reach 10dB. It should be noted that, when comparing the curve B and the curve C in the drawing, it is found that the position of the first conductor layer 32 relative to the substrate 10 is also relatively important, and the loss of the high-frequency electrical signal is more significant when the first conductor layer 32 is closer to the substrate 10 than the trace layer 20.

The circuit board 100 according to the embodiment of the present application is additionally provided with a dissipation layer 30 for dissipating high-frequency electric signals. Specifically, the loss layer 30 includes a first dielectric layer 31 or a first conductor layer 32, and uses the material performance characteristics of the first dielectric layer 31 and the first conductor layer 32 to consume the high-frequency electric signal, so as to reduce interference of the high-frequency noise signal to other devices through the circuit board 100. Meanwhile, the space occupied by the loss layer 30 in the form of a layer structure is smaller, and the space utilization rate of each device is improved.

In some embodiments, the first dielectric layer 31 includes a first dielectric layer 31 having an imaginary part of dielectric constant greater than 0.5 or an imaginary part of magnetic permeability greater than 0.5.

It will be appreciated that the first dielectric layer 31 consumes the high frequency electrical signal primarily by dielectric loss or magnetic field loss. Here, the first dielectric layer 31 having an imaginary part of dielectric constant greater than 0.5 may be a dielectric layer made of strontium titanate ceramic, polysilicon, aluminum oxide ceramic, aluminum oxide, silicon nitride, polytetrafluoroethylene, mineral fiber, wood fiber cotton, rubber, or the like, and the first dielectric layer 31 having an imaginary part of magnetic permeability greater than 0.5 may be a dielectric layer made of a cast alloy (e.g., aluminum nickel alloy, iron chromium aluminum alloy, iron aluminum carbon alloy, and iron cobalt alloy), a sintered alloy (e.g., rare earth element-containing cobalt alloy, rare earth element-containing iron alloy), a machinable alloy (e.g., platinum cobalt alloy, manganese aluminum carbon alloy, copper nickel iron alloy, aluminum manganese silver alloy), ferrite, intermetallic compound, or the like.

In other embodiments, the first dielectric layer 31 may be a first dielectric layer 31 with an imaginary part of dielectric constant greater than 0.5 and an imaginary part of magnetic permeability greater than 0.5, that is, the first dielectric layer 31 is formed by a combination of dielectric loss and magnetic field loss, where the combination of dielectric loss and magnetic field loss is not limited. For example, in the thickness direction X of the circuit board 100, the number of dielectric loss medium layers and magnetic field loss medium layers is one, and both are stacked to form the first medium layer 31, or the number of dielectric loss medium layers and magnetic field loss medium layers is plural, and the respective medium layers are stacked in a certain arrangement order to form the first medium layer 31.

Referring to fig. 3 and fig. 4, in some embodiments, in a thickness direction X of the circuit board 100, the first dielectric layer 31 and the trace layer 20 are projected on the substrate 10 to be at least partially overlapped.

It will be appreciated that the high frequency electrical signal is transmitted in the form of a field within the circuit board 100, and therefore is transmitted mainly between the first dielectric layer 31 and the substrate 10, so that, in order to reduce interference with the low frequency electrical signal on the surface of the trace layer 20, then, in the thickness direction X of the circuit board 100, the projection of the first dielectric layer 31 onto the substrate 10 by the trace layer 20 is at least partially overlapped, where the projection of the first dielectric layer 31 onto the substrate 10 by the trace layer 20 is that the partial area of the trace layer 20 does not fall into the projection of the first dielectric layer 31 in this direction, and the projection of the first dielectric layer 31 onto the substrate 10 by the trace layer 20 is that the whole of the trace layer 20 falls into the projection of the first dielectric layer 31 in this direction.

As illustrated in fig. 3, the trace layer 20, the first dielectric layer 31 and the substrate 10 are stacked in this order in the thickness direction X of the circuit board 100, wherein the first dielectric layer 31 and the substrate 10 have the same width, and therefore, the projection profile of the first dielectric layer 31 on the substrate 10 in the above direction is the same as the projection profile of the substrate 10, and the projection of the trace layer 20 on the substrate 10 falls completely within the projection range of the first dielectric layer 31.

As shown in fig. 4, the trace layer 20, the first dielectric layer 31 and the substrate 10 are stacked in this order in the thickness direction X of the circuit board 100, wherein the width of the first dielectric layer 31 is smaller than the width of the substrate 10, and the projection portion of the trace layer 20 on the substrate 10 falls within the projection range of the first dielectric layer 31, that is, the projection of the trace layer 20 on the substrate 10 also falls partially on the substrate 10.

Thus, if the first dielectric layer 31 and the trace layer 20 are partially overlapped on the substrate 10, the interference of the high-frequency electrical signal on the low-frequency electrical signal on the surface of the trace layer 20 can be reduced.

Referring to fig. 5, in some embodiments, the circuit board 100 further includes a second dielectric layer 33 disposed between the trace layer 20 and the first dielectric layer 31, and an imaginary part of a dielectric constant or an imaginary part of magnetic permeability of the second dielectric layer 33 is greater than an imaginary part of a dielectric constant or an imaginary part of magnetic permeability of the first dielectric layer 31.

It is understood that the dissipation of the high-frequency electric signal by the second dielectric layer 33 is smaller than that of the first dielectric layer 31, or the high-frequency electric signal is not dissipated by the second dielectric layer 33, for example, the material of the second dielectric layer 33 may be the same as that of the substrate 10, or the material of the second dielectric layer may be different from that of the substrate 10, or the second dielectric layer 33 is an air layer, etc., but the imaginary part of the dielectric constant or the imaginary part of the magnetic permeability of the second dielectric layer 33 is larger than that of the first dielectric layer 31. Thus, the material of the second dielectric layer 33 can be selected according to specific practical requirements, so as to realize less loss of the high-frequency electrical signal.

In some embodiments, the first conductor layer 32 has a conductivity of 7000S/m or less.

It will be appreciated that the first conductor layer 32 has a conductivity less than or equal to 7000S/m, which means that the first conductor layer 32 has a low current conductivity and is difficult to pass low-frequency electric signals, where the first conductor layer 32 may be made of manganese copper, copper oxide, zinc oxide, magnesium oxide, iron-aluminum alloy, rare earth-containing material, metal nitride, or the like, so that when the trace layer 20 is disposed adjacent to the first conductor layer 32, the low-frequency electric signals tend to be transmitted on the surface of the trace layer 20, rather than on the surface of the first conductor layer 32, and thus the trace layer 20 is disposed adjacent to the first conductor layer 32 in a structure that has less blocking and wear on the low-frequency electric signals and has greater wear on the high-frequency electric signals.

Referring to fig. 7 and 8, in some embodiments, the trace layer 20 and the first conductor layer 32 are stacked in a thickness direction X of the circuit board 100; or in a direction X perpendicular to the thickness direction of the circuit board 100, the trace layer 20 is disposed in contact with the first conductor layer 32.

It will be appreciated that the trace layer 20 is located on a side of the first conductor layer 32 facing away from the substrate 10, and further, in the thickness direction X of the circuit board 100, the trace layer 20, the first conductor layer 32 and the substrate 10 are disposed in sequence, such that the low frequency electrical signal is transmitted on the surface of the trace layer 20, but not on the surface of the first conductor layer 32, and the high frequency electrical signal is transmitted in the form of a field between the first conductor layer 32 and the substrate 10 and is gradually consumed by the first conductor layer 32. Alternatively, in the thickness direction X perpendicular to the circuit board 100, the arrangement in which the trace layer 20 is in contact with the first conductor layer 32 means that the trace layer 20 and the first conductor layer 32 are arranged in the horizontal direction, which corresponds to the arrangement in which the trace layer 20 and the first conductor layer 32 are horizontally arranged.

For example, as shown in fig. 7, in the thickness direction X of the circuit board 100, the wiring layer 20, the first conductor layer 32, and the substrate 10 are sequentially stacked, and the widths of the wiring layer 20 and the first conductor layer 32 are the same.

As shown in fig. 8, the trace layer 20 and the first conductor layer 32 are arranged in parallel in a thickness direction X perpendicular to the circuit board 100, and one side of each of the first conductor layer 32 and the trace layer 20 is abutted against the substrate 10, and it is understood that the trace layer 20 and the first conductor layer 32 are disposed transversely on the substrate 10.

In other embodiments, as shown in fig. 9 and 10, a corresponding trench structure is formed on the first conductor layer 32, and a part or all of the trace layer 20 is disposed in the trench structure to form a whole with the first conductor layer 32. For example, when a portion of the trace layer 20 is disposed in the groove structure on the first conductor layer 32, and other portions of the trace layer 20 are exposed outside the groove structure of the first conductor layer 32, there may be corresponding structural interference between the trace layer 20 and the first conductor layer 32 in the structural layout, and even the trace layer 20 is completely disposed in the groove structure on the first conductor layer 32 and integrated with the first conductor layer 32.

Referring to fig. 13, in some embodiments, one of the trace layer 20 and the first conductor layer 32 is provided with a recess 41, and the other of the trace layer 20 and the first conductor layer 32 is provided with a protrusion 42 matching the recess 41.

It will be appreciated that, in order to further enhance the stability of the bonding between the trace layer 20 and the first conductor layer 32, a corresponding connection structure may be added between the trace layer 20 and the first conductor layer 32, and specifically, the structure of the recess 41 includes, but is not limited to, a groove, a pit, a blind hole, a through hole, etc., and the structure of the protrusion 42 includes, but is not limited to, a rib, a stud, a bump, etc., so that the trace layer 20 is connected to the first conductor layer 32 by using a structure design of matching the protruding and the recessed structures.

Of course, in other embodiments, the recess 41 may be provided on the trace layer 20, and the protrusion 42 may be provided on the first conductor layer 32, and similarly, the protrusion 42 and the recess 41 may be provided on the first conductor layer 32.

Referring to fig. 11, in some embodiments, the circuit board 100 further includes a second conductor layer 34 disposed between the first conductor layer 32 and the substrate 10, wherein the second conductor layer 34 has a conductivity greater than that of the first conductor layer 32.

It will be appreciated that the conductivity of the second conductor layer 34 should be greater than 7000S/m to meet the transmission of high frequency electrical signals between the first conductor layer 32 and the substrate 10, or between the first conductor layer 32 and the second conductor layer 34 in the form of a field.

Referring to fig. 6 and 12, in some embodiments, the first conductor layer 32 is at least partially disposed in the substrate 10; or the first dielectric layer 31 is at least partially disposed within the substrate 10.

It is understood that the first conductor layer 32 or the first dielectric layer 31 may not be limited to be disposed on the surface of the substrate 10, but may be disposed in the substrate 10, for example, a corresponding groove structure is formed on the substrate 10, so as to satisfy that the first conductor layer 32 or the first dielectric layer 31 is further connected with the substrate 10.

The foregoing is merely illustrative embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present application, and the application should be covered.

Claims

1. A circuit board, comprising:

a substrate;

A wiring layer;

The loss layer is used for consuming high-frequency electric signals and comprises a first dielectric layer or a first conductor layer, and the conductivity of the first conductor layer is lower than that of the wiring layer;

The wiring layer, the first dielectric layer and the substrate are stacked in the thickness direction of the circuit board, the first dielectric layer is close to the substrate, and the wiring layer is far away from the substrate; or alternatively

The routing layer and the first conductor layer are adjacently arranged, and the routing layer and the first conductor layer are positioned on the substrate.

2. The circuit board of claim 1, wherein: the first dielectric layer comprises a first dielectric layer with a dielectric constant imaginary part larger than 0.5 or a magnetic permeability imaginary part larger than 0.5.

3. The circuit board of claim 1, wherein: and in the thickness direction of the circuit board, the projection of the first dielectric layer and the wiring layer on the substrate is at least partially overlapped.

4. A circuit board according to any one of claims 1 to 3, wherein: the circuit board further comprises a second dielectric layer arranged between the wiring layer and the first dielectric layer, and the dielectric constant imaginary part or the magnetic permeability imaginary part of the second dielectric layer is larger than that of the first dielectric layer.

5. The circuit board of claim 1, wherein: the conductivity of the first conductor layer is 7000S/m or less.

6. The circuit board of claim 1, wherein: the wiring layer and the first conductor layer are stacked in the thickness direction of the circuit board; or in the thickness direction perpendicular to the circuit board, the wiring layer is abutted against the first conductor layer.

7. The circuit board of claim 6, wherein: one of the wiring layer and the first conductor layer is provided with a concave part, and the other one of the wiring layer and the first conductor layer is provided with a convex part matched with the concave part.

8. The circuit board according to any one of claims 5 to 7, wherein: the circuit board further comprises a second conductor layer arranged between the first conductor layer and the substrate, wherein the conductivity of the second conductor layer is larger than that of the first conductor layer.

9. The circuit board of claim 1, wherein: the first conductor layer is at least partially arranged in the substrate; or the first dielectric layer is at least partially arranged in the substrate.

10. A terminal device, characterized by: a circuit board comprising any of claims 1 to 9.