CN118068882A - Heating control method of wide temperature system - Google Patents
Heating control method of wide temperature system Download PDFInfo
- Publication number
- CN118068882A CN118068882A CN202211479851.XA CN202211479851A CN118068882A CN 118068882 A CN118068882 A CN 118068882A CN 202211479851 A CN202211479851 A CN 202211479851A CN 118068882 A CN118068882 A CN 118068882A
- Authority
- CN
- China
- Prior art keywords
- electronic component
- electronic
- temperature sensing
- temperature
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000010586 diagram Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
Landscapes
- Control Of Temperature (AREA)
Abstract
The invention relates to the technical field of wide temperature systems, and provides a heating control method of a wide temperature system, wherein the wide temperature system comprises a plurality of electronic elements, a plurality of temperature sensor groups respectively arranged on the electronic elements, a plurality of heating modules respectively arranged on the electronic elements, and a baseboard management control module, the temperature sensor groups are used for continuously generating a plurality of temperature sensing results, and the control method is implemented by the baseboard management control module and comprises the following steps: (A) Judging whether the electronic components can all operate according to the isothermal sensing result and a plurality of first threshold values corresponding to the electronic components respectively; (B) When the electronic components are judged to be capable of running, a starting signal is generated so that the wide temperature system is started; and (C) when it is determined that at least one electronic component is not operable, controlling the heating module corresponding to the at least one electronic component to heat, and repeating the step (A).
Description
[ Field of technology ]
The invention relates to the technical field of wide temperature systems, in particular to a heating control method of a wide temperature system.
[ Background Art ]
Because 5G requires ultra-high speed millimeter wave (mmWave) technology in the 24GHz to 40GHz range, 5G devices need to be deployed outdoors to overcome line of sight (LoS) propagation, blocking, and coverage challenges associated with mmWave frequencies.
Compared with indoor environment, outdoor environment condition is more severe, temperature is a primary challenge, and in countries with extreme climate, low temperature can reach minus two and thirty degrees, and most common electronic components can work in a working temperature range, so that wide-range operation temperature components of a worker rule or a army rule are needed to be selected to replace the common electronic components. Resulting in higher cost of system parts.
However, replacing all common electronic components with wide-area operating temperature components of industry or army specifications can greatly increase part costs.
[ Invention ]
It is therefore an object of the present invention to provide a method of controlling heating in a wide temperature range system capable of operating in extreme climates.
Accordingly, the present invention provides a heating control method for a wide temperature system, the wide temperature system includes a plurality of electronic components, a plurality of temperature sensor groups respectively disposed on the electronic components, a plurality of heating modules respectively disposed on the electronic components, and a baseboard management control module electrically connected to the isothermal sensor groups and the heating modules, wherein the isothermal sensor groups are used for continuously sensing temperatures of the electronic components to continuously generate a plurality of temperature sensing results respectively corresponding to the electronic components, and the control method is implemented by the baseboard management control module and includes a step (a), a step (B), and a step (C).
In the step (a), the baseboard management control module determines whether the electronic components can all operate according to the isothermal sensing result and a plurality of first threshold values corresponding to the electronic components respectively.
In the step (B), when it is determined that the electronic devices can all operate, the baseboard management control module generates a power-on signal, so that the wide temperature system is powered on.
In the step (C), when it is determined that at least one of the electronic components is not operable, the baseboard management control module controls the heating module corresponding to the at least one electronic component which is not operable to heat, and repeats the step (a).
Preferably, each temperature sensor group comprises at least one temperature sensor, each temperature sensing result comprises at least one temperature sensing value corresponding to the at least one temperature sensor respectively, wherein the step (a) comprises the following substeps: (a-1) for each electronic component, obtaining a target temperature sensing value according to the at least one temperature sensing value corresponding to the temperature sensing result of the electronic component; and (A-2) for each electronic component, determining whether the target temperature sensing value is greater than or equal to a first threshold corresponding to the electronic component, so as to determine whether the electronic component can operate, wherein if the target temperature sensing value corresponding to the electronic component is greater than or equal to the first threshold corresponding to the electronic component, the electronic component can operate.
Preferably, in the substep (a-1), the target temperature sensing value is one of a maximum value, a minimum value, and an average value of the at least one temperature sensing value corresponding to the temperature sensing result of the electronic component.
Preferably, in the substep (a-2), the first threshold is a start threshold related to the minimum start temperature of the electronic component minus an actual start temperature difference of the electronic component.
Preferably, step (B) is followed by the sub-steps of: (D) For each electronic element, judging whether the electronic element needs to be heated or not according to a temperature sensing result corresponding to the electronic element and a second threshold value corresponding to the electronic element; (E) For each electronic element, when the electronic element is judged to need to be heated, controlling a heating module corresponding to the electronic element to heat; and (F) for each electronic element, when the electronic element is judged not to need heating, controlling the heating module corresponding to the electronic element to stop heating.
Preferably, each temperature sensor group comprises at least one temperature sensor, each temperature sensing result comprises at least one temperature sensing value corresponding to the at least one temperature sensor respectively, wherein the step (D) comprises the following substeps: (D-1) for each electronic component, obtaining a target temperature sensing value according to the at least one temperature sensing value corresponding to the temperature sensing result of the electronic component; and (D-2) for each electronic component, determining whether the target temperature sensing value is greater than or equal to the second threshold to determine whether the electronic component requires heating.
Preferably, in the substep (D-2), the second threshold is a stop threshold related to the maximum heating temperature of the electronic component minus an actual heating temperature difference of the component.
Preferably, step (a) comprises the sub-steps of: (a-1) for each electronic component, obtaining a target temperature sensing value according to the at least one temperature sensing value corresponding to the temperature sensing result of the electronic component; and (A-2) for each electronic component, determining whether the target temperature sensing value is greater than or equal to a first threshold corresponding to the electronic component, so as to determine whether the electronic component can operate, wherein if the target temperature sensing value corresponding to the electronic component is greater than or equal to the first threshold corresponding to the electronic component, the electronic component can operate; in sub-step (a-2), the first threshold is a start threshold related to a minimum start temperature of the electronic component minus an actual start temperature difference of the component, the actual heating temperature difference of the component being equal to or greater than the actual start temperature difference of the component.
The invention has the following effects: the heating module corresponding to the electronic components which can not be operated is controlled by the baseboard management control module to heat until the electronic components can be operated, and the electronic components can be operated in extreme climates without selecting a worker gauge or a army gauge, so that the hardware cost is greatly reduced.
[ Description of the drawings ]
FIG. 1 is a block diagram schematically illustrating a wide temperature system for implementing one embodiment of the heating control method of the wide temperature system of the present invention;
FIG. 2 is a flow chart illustrating the embodiment of the heating control method of the wide temperature system of the present invention;
FIG. 3 is a flow chart assisting FIG. 2 in illustrating sub-steps of step 22 of the described embodiment;
FIG. 4 is a flow chart assisting FIG. 2 in illustrating sub-steps of step 24 of the described embodiment; and
FIG. 5 is a schematic diagram illustrating the internal temperature and measured temperature of a plurality of electronic components of the embodiment.
The reference numerals in the figures illustrate: 1. a wide temperature system; 11. an electronic component; 12. a temperature sensor group; 121. a temperature sensor; 13. a heating module; 14. and a baseboard management control module.
[ Detailed description ] of the invention
Before the present invention is described in detail, it should be noted that in the following description, like elements are denoted by the same reference numerals.
Referring to fig. 1, a wide temperature system 1 is shown, wherein the wide temperature system 1 is used for implementing an embodiment of a heating control method of the wide temperature system of the present invention, and illustratively comprises a plurality of electronic components 11, a plurality of temperature sensor groups 12 respectively disposed on the electronic components 11, a plurality of heating modules 13 respectively disposed on the electronic components 11, and a baseboard management control module 14 electrically connected with the temperature sensor groups 12 and the heating modules 13.
The electronic components 11 are, for example, but not limited to, a central processing unit (Central Processing Unit, CPU), a platform path controller (Platform Controller Hub, PCH), an Application SPECIFIC INTEGRATED Circuit (ASIC), a Dual In-line Memory Module (DIMM), a network interface controller (Network Interface Controller, NIC).
The isothermal sensor group 12 is configured to continuously sense the temperature of the isoelectric element 11 to continuously generate a plurality of temperature sensing results corresponding to the isoelectric element 11 respectively. It is to be noted that, based on the excessive volume of a part of the electronic components, a plurality of sensors are required to measure the temperature, so each temperature sensor group 12 includes at least one temperature sensor 121, and each temperature sensing result includes at least one temperature sensing value corresponding to the at least one temperature sensor 121.
The heating modules 13 are, for example, heating sheets, and are attached to the electronic components 11, but not limited to, respectively.
The baseboard management control module 14 is a baseboard management controller (Baseboard Management Controller, BMC), in this embodiment, the baseboard management control module 14 includes ASPEED 2600, and the chip operating temperature range is-40C-85C, which can be operated at extreme temperatures to control the heating modules 13 to heat, but not limited to this.
Referring to fig. 1 and 2, the embodiment of how the wide temperature system 1 performs the heating control method of the wide temperature system of the present invention is described. The steps involved in the embodiments are described in detail below.
In step 21, the wide temperature system 1 is powered up.
In step 22, the baseboard management control module 14 determines whether the electronic components 11 can all operate according to the isothermal sensing result and a plurality of first thresholds corresponding to the electronic components 11. When the baseboard management control module 14 determines that the electronic components 11 can all operate, the flow proceeds to step 23; when the baseboard management control module 14 determines that at least one of the electronic components 11 is not operable, the flow proceeds to step 27. In detail, the baseboard management control module 14 determines whether each electronic component 11 in the wide temperature system 1 can be operated independently, and the process proceeds to step 23 only when each electronic component 11 meets the operable condition.
Referring to fig. 3, step 22 includes the following sub-steps:
In sub-step 221, for each electronic component 11, the baseboard management control module 14 obtains a target temperature sensing value according to the at least one temperature sensing value corresponding to the temperature sensing result of the electronic component 11. It should be noted that the target temperature sensing value is one of a maximum value, a minimum value, and an average value of the at least one temperature sensing value corresponding to the temperature sensing result of the electronic component 11, but not limited thereto.
In sub-step 222, for each electronic device 11, the baseboard management control module 14 determines whether the target temperature sensing value is greater than or equal to a first threshold value corresponding to the electronic device 11 to determine whether the electronic device 11 is operable, wherein if the baseboard management control module 14 determines that the target temperature sensing value corresponding to the electronic device 11 is greater than or equal to the first threshold value corresponding to the electronic device 11, the electronic device 11 is operable. In detail, the baseboard management control module 14 determines whether the target temperature sensing value of each electronic component 11 in the wide temperature system 1 can be operated independently, and determines that each electronic component 11 can be operated only when the target temperature sensing value of each electronic component is greater than or equal to a first threshold value.
In step 23, the baseboard management control module 14 generates a power-on signal to power on the wide temperature system 1.
In detail, the baseboard management control module 14 generates and transmits the power-on signal to a central processing unit (Central Processing Unit) (not shown) of the wide temperature system 1, so that the central processing unit performs power-on according to the power-on signal.
In step 24, for each electronic component 11, the baseboard management control module 14 determines whether the electronic component 11 needs to be heated according to the temperature sensing result corresponding to the electronic component 11 and a second threshold corresponding to the electronic component 11. When the baseboard management control module 14 determines that the electronic component 11 needs to be heated, the flow proceeds to step 25; when the baseboard management control module 14 determines that the electronic component 11 does not need to be heated, the flow proceeds to step 26.
Referring to fig. 4, step 24 includes the following sub-steps:
In sub-step 241, for each electronic component 11, the baseboard management control module 14 obtains the target temperature sensing value according to the at least one temperature sensing value corresponding to the temperature sensing result of the electronic component 11.
In sub-step 242, for each electronic component 11, the baseboard management control module 14 determines whether the target temperature sensing value is greater than or equal to the second threshold value to determine whether the electronic component 11 needs to be heated, wherein if the baseboard management control module 14 determines that the target temperature sensing value is greater than or equal to the second threshold value, the electronic component 11 is determined not to need to be heated.
In step 25, for each electronic component 11 to be heated, the baseboard management control module 14 controls the heating module 13 corresponding to the electronic component 11 to heat.
In step 26, for each electronic component 11 that does not need to be heated, the baseboard management control module 14 controls the heating module 13 corresponding to the electronic component 11 to stop heating.
It should be noted that, the isothermal sensor set 12 measures the ambient temperature of the electronic components 11, so that there is a certain difference between the measured temperature of the electronic components 11 and the internal temperature of the electronic components 11, as shown in fig. 5, for each electronic component 11, when the internal temperature of the electronic component 11 reaches a minimum starting temperature Tstart related to the electronic components, i.e. at the starting time point of the electronic component 11, the target temperature sensing value and the minimum starting temperature Tstart are different by an actual starting temperature difference H of the components, and similarly, when the internal temperature of the electronic component 11 reaches a stopping threshold value thaeater off related to the maximum heating temperature of the electronic components, i.e. at the stopping time point of the heating module 13 of the electronic component 11, the target temperature sensing value and the stopping threshold value thaeater off are different by an actual heating temperature difference P of the components, wherein the actual heating temperature difference P of the components is greater than or equal to the actual starting temperature difference H of the components, in other words, the first threshold value Tstart is the actual starting temperature difference value minus the actual starting temperature difference H of the first threshold value thaeater off. It should be noted that, the minimum starting temperature Tstart of the electronic component, the actual starting temperature difference H of the electronic component, the stop threshold value Theater off, and the actual heating temperature difference P of the electronic component 11 are different, the data can be obtained through experiments, in fig. 5, the actual starting temperature difference H of the electronic component and the actual heating temperature difference P of the electronic component are positive values, but the actual starting temperature difference H of the electronic component and the actual heating temperature difference P of the electronic component may also be negative values.
In step 27, the baseboard management control module 14 controls the heating module 13 corresponding to the at least one electronic component 11 that is not operable to heat, and repeats step 22.
It is to be noted that, in step 27, the baseboard management control module 14 does not generate the power-on signal, so that the heating module 13 of the at least one electronic component 11 heats the wide temperature system 1 in the power-off state.
In summary, in the heating control method of the wide temperature system of the present invention, the baseboard management control module 14 controls the heating modules 12 corresponding to the electronic components 11 which cannot be operated to perform heating until the electronic components 11 can be operated, so that the hardware cost is greatly reduced without selecting a worker or a army component, and the heating modules 12 corresponding to the electronic components 11 which do not need to be heated are controlled to stop heating, so as to prevent the components from being overheated.
However, the foregoing is only illustrative of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims and their equivalents.
Claims (8)
1. A heating control method of a wide temperature system, the wide temperature system including a plurality of electronic components, a plurality of temperature sensor groups respectively disposed on the electronic components, a plurality of heating modules respectively disposed on the electronic components, and a baseboard management control module electrically connected to the isothermal sensor groups and the heating modules, the isothermal sensor groups being configured to continuously sense temperatures of the electronic components to continuously generate a plurality of temperature sensing results respectively corresponding to the electronic components, the control method being implemented by the baseboard management control module and comprising the steps of:
(A) Judging whether the electronic components can all operate according to the isothermal sensing result and a plurality of first threshold values corresponding to the electronic components respectively;
(B) When the electronic components are judged to be capable of running, a starting signal is generated so that the wide temperature system is started; and
(C) When it is determined that at least one of the electronic components is not operable, controlling the heating module corresponding to the at least one electronic component which is not operable to heat, and repeating the step (a).
2. The method of claim 1, wherein each temperature sensor group comprises at least one temperature sensor, each temperature sensing result comprises at least one temperature sensing value corresponding to the at least one temperature sensor, and wherein the step (a) comprises the following sub-steps:
(a-1) for each electronic component, obtaining a target temperature sensing value according to the at least one temperature sensing value corresponding to the temperature sensing result of the electronic component; and
(A-2) for each electronic component, determining whether the target temperature sensing value is equal to or greater than a first threshold corresponding to the electronic component, so as to determine whether the electronic component is operable, wherein if it is determined that the target temperature sensing values corresponding to the electronic components are all equal to or greater than the first threshold corresponding to the electronic components, it is determined that the electronic components are operable.
3. The method of claim 2, wherein in the sub-step (a-1), the target temperature sensing value is one of a maximum value, a minimum value, and an average value of the at least one temperature sensing value corresponding to the temperature sensing result of the electronic component.
4. The method of claim 2, wherein in the substep (a-2), the first threshold is a start threshold value associated with a minimum start temperature of the electronic component minus an actual start temperature difference of the electronic component.
5. The method of claim 1, further comprising the substeps of, after step (B):
(D) For each electronic element, judging whether the electronic element needs to be heated or not according to a temperature sensing result corresponding to the electronic element and a second threshold value corresponding to the electronic element;
(E) For each electronic element, when the electronic element is judged to need to be heated, controlling a heating module corresponding to the electronic element to heat; and
(F) For each electronic element, when the electronic element is judged not to need heating, the heating module corresponding to the electronic element is controlled to stop heating.
6. The method of claim 5, wherein each temperature sensor group comprises at least one temperature sensor, each temperature sensing result comprises at least one temperature sensing value corresponding to the at least one temperature sensor, and wherein the step (D) comprises the sub-steps of:
(D-1) for each electronic component, obtaining a target temperature sensing value according to the at least one temperature sensing value corresponding to the temperature sensing result of the electronic component; and
(D-2) for each electronic component, determining whether the target temperature sensing value is greater than or equal to the second threshold value to determine whether the electronic component requires heating.
7. The method of claim 6, wherein in the sub-step (D-2), the second threshold is a stop threshold related to the maximum heating temperature of the electronic component minus an actual heating temperature difference of the electronic component.
8. The heating control method of a wide temperature system according to claim 7, wherein the step (a) includes the sub-steps of:
(a-1) for each electronic component, obtaining a target temperature sensing value according to the at least one temperature sensing value corresponding to the temperature sensing result of the electronic component; and
(A-2) for each electronic component, determining whether the target temperature sensing value is equal to or greater than a first threshold corresponding to the electronic component, so as to determine whether the electronic component is operable, wherein if it is determined that the target temperature sensing values corresponding to the electronic components are all equal to or greater than the first threshold corresponding to the electronic components, then it is determined that the electronic components are all operable;
In sub-step (a-2), the first threshold is a start threshold related to a minimum start temperature of the electronic component minus an actual start temperature difference of the component, the actual heating temperature difference of the component being equal to or greater than the actual start temperature difference of the component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211479851.XA CN118068882A (en) | 2022-11-24 | 2022-11-24 | Heating control method of wide temperature system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211479851.XA CN118068882A (en) | 2022-11-24 | 2022-11-24 | Heating control method of wide temperature system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118068882A true CN118068882A (en) | 2024-05-24 |
Family
ID=91102805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211479851.XA Pending CN118068882A (en) | 2022-11-24 | 2022-11-24 | Heating control method of wide temperature system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118068882A (en) |
-
2022
- 2022-11-24 CN CN202211479851.XA patent/CN118068882A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109782827B (en) | Heat dissipation control method and device, electronic device and computer-readable storage medium | |
| CN103821747B (en) | Fan control system, computer system and fan control method thereof | |
| US7706929B2 (en) | Preheating control system of information processing device and control method thereof | |
| CN106679076B (en) | Temperature control method and control device for frequency converter power module | |
| US20140334101A1 (en) | Fan speed control system | |
| US10018202B1 (en) | Fan control system | |
| US20070124609A1 (en) | System and method for controlling cpu overclocking | |
| US9367118B2 (en) | Computer system and operating method thereof | |
| US20230332798A1 (en) | Switching control board for air conditioning system, air conditioning system, and adaptive control method | |
| CN105302179A (en) | Thermal control method and thermal control system | |
| CN104534619A (en) | Control method of variable frequency dehumidifier and control device | |
| US9722414B2 (en) | Power distribution and information handling | |
| WO2020048418A1 (en) | Heat treatment method for terminal, apparatus, device, and storage medium | |
| CN118068882A (en) | Heating control method of wide temperature system | |
| US20180115273A1 (en) | Method for controlling a fan module of a server rack and controller unit for implementing the same | |
| US8640968B2 (en) | Temperature gain control device and method thereof | |
| US11106257B2 (en) | Over-temperature protection circuit and motherboard platform using same | |
| CN112710072B (en) | Outdoor unit temperature control method and device and air conditioner | |
| US20140314566A1 (en) | Electronic device, and control device and method for controlling fan employed in the electronic device | |
| CN103967820A (en) | Fan control method and notebook computer thereof | |
| CN104237724A (en) | Detection card and detection system for fan card | |
| CN109857232B (en) | Fan control method, system, device and computer readable storage medium | |
| TWI487844B (en) | Method for fan monitoring and server system using the same | |
| CN113849056B (en) | Fan control method and server | |
| CN117329151A (en) | Fan fault detection device and method and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination |