CN118053867A - Light-emitting diode packaging structure and manufacturing method thereof - Google Patents
Light-emitting diode packaging structure and manufacturing method thereof Download PDFInfo
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- CN118053867A CN118053867A CN202211472725.1A CN202211472725A CN118053867A CN 118053867 A CN118053867 A CN 118053867A CN 202211472725 A CN202211472725 A CN 202211472725A CN 118053867 A CN118053867 A CN 118053867A
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- light emitting
- wavelength conversion
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- emitting diode
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 238000006243 chemical reaction Methods 0.000 claims abstract description 63
- 239000000084 colloidal system Substances 0.000 claims abstract description 36
- 239000012141 concentrate Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 13
- 239000003292 glue Substances 0.000 description 10
- 239000008393 encapsulating agent Substances 0.000 description 5
- 238000001723 curing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The invention provides a light-emitting diode packaging structure and a manufacturing method thereof. The LED packaging structure comprises a driving substrate, at least one light-emitting unit and a reflecting colloid. The drive substrate has a surface. The light emitting unit comprises at least one micro light emitting diode and at least one wavelength conversion layer. The micro light emitting diode is arranged on the surface of the driving substrate and is electrically connected with the driving substrate. The wavelength conversion layer covers the micro light emitting diode. The reflective colloid covers the periphery of the light-emitting unit and the driving substrate. The light emitting unit is suitable for emitting light, and the reflective colloid is suitable for reflecting the light to concentrate to the light emitting direction. The light-emitting diode packaging structure can increase the forward light-emitting quantity so as to improve the light-emitting directivity.
Description
Technical Field
The present invention relates to a light emitting structure and a method for manufacturing the same, and more particularly, to a light emitting diode package structure and a method for manufacturing the same.
Background
The existing micro light emitting diode package is mainly designed to emit light from five sides (front side and four sides). Because the size of the micro light emitting diode chip is only about 0.1mm to 0.2 mm, the micro light emitting diode chip is packaged and molded separately, then placed in the cup shell of the lead frame, and added with fluorescent powder glue for curing. If the micro light emitting diode package of 0.15 mm is to be manufactured, the micro light emitting diode chip after the individual package molding cannot be placed in the cup shell of the lead frame. In addition, if the above-mentioned five-sided light emitting micro light emitting diode package is applied to a side light incident display, light from all sides except the front side is relatively easy to enter the light guide plate, and light from all sides cannot be effectively coupled into the light guide plate, so that light coupling efficiency is low.
Disclosure of Invention
The invention is directed to a light emitting diode package structure capable of increasing forward light output.
The invention also aims at a manufacturing method of the light-emitting diode packaging structure, which is used for manufacturing the light-emitting diode packaging structure.
According to an embodiment of the invention, the light emitting diode package structure includes a driving substrate, at least one light emitting unit, and a reflective encapsulant. The drive substrate has a surface. The light emitting unit comprises at least one micro light emitting diode and at least one wavelength conversion layer. The micro light emitting diode is arranged on the surface of the driving substrate and is electrically connected with the driving substrate. The wavelength conversion layer covers the micro light emitting diode. The reflective colloid covers the periphery of the light-emitting unit and the driving substrate. The light emitting unit is suitable for emitting light, and the reflective colloid is suitable for reflecting the light to concentrate to the light emitting direction.
In the light emitting diode package structure according to the embodiment of the invention, at least one light emitting unit is a light emitting unit. The at least one micro light emitting diode comprises a plurality of micro light emitting diodes. At least one wavelength conversion layer is a wavelength conversion layer. The micro light emitting diodes are arranged on the driving substrate separately from each other. The wavelength conversion layer covers the micro light emitting diode to define a light emitting unit.
In the light emitting diode package structure according to the embodiment of the invention, at least one light emitting unit includes a plurality of light emitting units. The at least one micro light emitting diode comprises a plurality of micro light emitting diodes. The at least one wavelength conversion layer includes a plurality of wavelength conversion layers. The micro light emitting diodes are arranged on the driving substrate separately from each other. The wavelength conversion layers are separated from each other and cover the micro light emitting diodes respectively to define a light emitting unit.
In the light emitting diode package structure according to the embodiment of the present invention, the shape of the wavelength conversion layer includes an inverted trapezoid or a rectangle in cross section.
In the light emitting diode package structure according to the embodiment of the invention, the light emitting unit further includes a transparent encapsulant, encapsulates the micro light emitting diode, and is located between the micro light emitting diode and the wavelength conversion layer. The wavelength conversion layer is rectangular in cross section, and the transparent colloid is inverted trapezoidal in shape.
According to an embodiment of the invention, a method for manufacturing a light emitting diode package structure includes the following steps. A driving substrate and at least one micro light emitting diode are provided. The micro light emitting diode is bonded on the driving substrate, wherein the driving substrate is provided with a surface, and the micro light emitting diode is configured on the surface of the driving substrate and is electrically connected with the driving substrate. At least one wavelength conversion layer is formed to cover the micro light emitting diode to define at least one light emitting unit. A reflective colloid is formed to cover the periphery of the light emitting unit and the driving substrate. The light emitting unit is suitable for emitting light, and the reflective colloid is suitable for reflecting the light to concentrate to the light emitting direction.
In the method for manufacturing the light emitting diode package structure according to the embodiment of the invention, at least one light emitting unit is a light emitting unit. The at least one micro light emitting diode comprises a plurality of micro light emitting diodes. At least one wavelength conversion layer is a wavelength conversion layer. The micro light emitting diodes are arranged on the driving substrate separately from each other. The wavelength conversion layer covers the micro light emitting diode and the driving substrate.
In the method for manufacturing a light emitting diode package according to the embodiment of the invention, the method further includes performing a singulation process to cut the wavelength conversion layer and the driving substrate before forming the reflective colloid, so as to define a light emitting unit on the driving substrate.
In the method for manufacturing the light emitting diode package structure according to the embodiment of the invention, the method for manufacturing the light emitting diode package structure further includes providing a substrate before providing the driving substrate and the micro light emitting diode. The micro light emitting diode comprises a plurality of micro light emitting diodes, and the micro light emitting diodes are arranged on the substrate in a separated mode. A wavelength conversion material layer is formed on the substrate to cover the micro light emitting diode. The substrate is removed and a singulation process is performed to cut the wavelength converting material layer to form light emitting units. The light emitting unit includes a plurality of light emitting units. The wavelength conversion layer includes a plurality of wavelength conversion layers. The wavelength conversion layers are separated from each other and cover the micro light emitting diodes respectively to define a light emitting unit. The micro light emitting diode is bonded on the driving substrate, wherein the light emitting units are arranged on the driving substrate separately from each other.
In the method for manufacturing the light emitting diode package structure according to the embodiment of the invention, the method for forming the reflective colloid comprises the step of integrally forming the reflective colloid in a mold glue filling mode.
Based on the above, in the design of the led package structure of the present invention, the reflective colloid covers the periphery of the light emitting unit and the driving substrate, wherein the light emitting unit is adapted to emit light, and the reflective colloid is adapted to reflect light to concentrate to the light emitting direction, so that the light emitted by the light emitting unit can be emitted more intensively, and the concentrated light emitting on the front surface can be increased. Therefore, the light emitting diode packaging structure can increase the forward light output quantity so as to improve the light output directivity.
Drawings
Fig. 1 to 7 are schematic diagrams illustrating a method for manufacturing a light emitting diode package structure according to an embodiment of the invention;
Fig. 8 to 13 are schematic views illustrating a method for manufacturing a light emitting diode package structure according to another embodiment of the invention;
Fig. 14 and 15 are schematic cross-sectional views of various light emitting units according to various embodiments of the present invention.
Description of the reference numerals
10, A base material;
100a, 100b, light emitting diode package structure;
110. 110a, driving the substrate;
112, surface;
120, micro light emitting diode;
130': a layer of wavelength converting material;
130a, 130b, 130c, 130d: wavelength converting layers;
140, reflecting colloid;
150, transparent colloid;
E, light emergent direction;
L1 and L2 are light rays;
M, a die;
t is a tool;
u1, U2, U3 and U4 are luminous units.
Detailed Description
Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
The invention may be understood by reference to the following detailed description taken in conjunction with the accompanying drawings, it being noted that elements of the drawings are not necessarily drawn to actual scale in order to facilitate the reader's understanding and for the sake of brevity. In addition, the number and size of the elements in the drawings are illustrative only and are not intended to limit the scope of the invention.
Fig. 1 to 7 are schematic diagrams illustrating a method for manufacturing a light emitting diode package structure according to an embodiment of the invention. For convenience of explanation, fig. 1 and 3 are shown in cross-section, fig. 2 and 4 are top views of fig. 1 and 3, fig. 5 is a top view after fig. 4 is cut, and fig. 6 and 7 are shown in perspective view.
Referring to fig. 1 and fig. 2, in the method for manufacturing the led package structure of the present embodiment, first, a driving substrate 110 and at least one micro led (a plurality of micro leds 120 are schematically shown) are provided. Here, the driving substrate 110 is, for example, a flexible circuit board or a printed circuit board, but not limited thereto. The micro light emitting diode 120 is, for example, a plurality of blue light emitting diode chips, a plurality of red light emitting diode chips, a plurality of green light emitting diode chips, or a combination thereof.
Next, referring to fig. 1 and fig. 2, the micro light emitting diode 120 is bonded on the driving substrate 110, wherein the driving substrate 110 has a surface 112, and the micro light emitting diode 120 is disposed on the surface 112 of the driving substrate 110 and electrically connected to the driving substrate 110. Here, the micro light emitting diodes 120 are separated from each other by flip-chip bonding and are arranged in a matrix on the driving substrate 110.
Next, referring to fig. 3 and fig. 4, at least one wavelength conversion layer (schematically shown as a wavelength conversion layer 130 a) is formed on the surface 112 of the driving substrate 110 to cover the micro light emitting diode 120 and the driving substrate 110. The wavelength conversion layer 130a is a phosphor paste, and may be, for example, a yellow phosphor paste, a red phosphor paste, a green phosphor paste, a blue phosphor paste, or an yttrium aluminum garnet phosphor paste.
Next, referring to fig. 5, a singulation process is performed to cut the wavelength conversion layer 130a and the driving substrate 110 to form a plurality of light bars with predetermined lengths. Each light bar includes a driving substrate 110a and at least one light emitting unit (one light emitting unit U1 is schematically shown) on the driving substrate 110a, wherein each light emitting unit U1 includes a plurality of micro light emitting diodes 120 and a wavelength conversion layer 130a covering the micro light emitting diodes 120.
Thereafter, referring to fig. 5 and 6, a reflective colloid 140 is formed to cover the periphery of the light emitting unit U1 and the driving substrate 110a. Here, a light bar after being cut is placed in the mold M, and the mold T is used to fill the glue and cure the glue to form the reflective glue 140 covering the periphery of the light emitting unit U1 and the driving substrate 110. That is, the reflective colloid 140 is formed by molding the cup shell integrally with the mold. Here, the reflective colloid 140 is doped with reflective particles, or the colloid itself has high reflective properties. The curing method is, for example, thermal curing, moisture curing or ultraviolet curing, and may be selected according to the properties of the colloid. In one embodiment, the glue may be waterproof glue, so that the cured reflective glue 140 may also have waterproof function.
Finally, referring to fig. 6 and fig. 7, the mold M is demolded to form the light emitting diode package structure 100a. Here, the light emitting diode package structure 100a includes a driving substrate 110a, a light emitting unit U1, and a reflective encapsulant 140. The drive substrate 110a has a surface 112. The light emitting unit U1 includes a plurality of micro light emitting diodes 120 and a wavelength conversion layer 130a. Here, a wavelength conversion layer 130a covers the plurality of micro leds 120 to define a light emitting unit U1. The micro light emitting diodes 120 are disposed on the surface 112 of the driving substrate 110a separately from each other and electrically connected to the driving substrate 110a. The wavelength conversion layer 130a covers the micro light emitting diode 120. The reflective colloid 140 covers the periphery of the light emitting unit U1 and the driving substrate 110a. The light emitting unit U1 is adapted to emit light L1, and the reflective colloid 140 is adapted to reflect the light L1 to concentrate in the light emitting direction E. Therefore, the problem that the miniature light-emitting diode package in the prior art emits light to five sides is solved, the light L1 emitted by the light-emitting unit U1 can be emitted more intensively, and the front concentrated light emission can be increased like a linear light source. Therefore, the light emitting diode package structure 100a of the present embodiment can increase the forward light output to improve the light output directivity.
It should be noted that the following embodiments use the element numbers and part of the content of the foregoing embodiments, where the same numbers are used to denote the same or similar elements, and descriptions of the same technical content are omitted. For the description of the omitted parts, reference is made to the foregoing embodiments, and the following embodiments are not repeated.
Fig. 8 to 13 are schematic diagrams illustrating a method for manufacturing a light emitting diode package structure according to another embodiment of the invention. For convenience of explanation, fig. 8 and 11 are cross-sectional views, fig. 9 is a top view of fig. 8, fig. 10 is a top view after cutting fig. 9, and fig. 12 and 13 are perspective views.
Referring to fig. 8 and fig. 9 together, in the method for manufacturing the led package structure of the present embodiment, first, a substrate 10 is provided, wherein the substrate 10 is, for example, a temporary substrate. Next, at least one micro light emitting diode (schematically shown as a plurality of micro light emitting diodes 120) is provided on the substrate 10, wherein the micro light emitting diodes 120 are separated from each other and are arranged in a matrix on the substrate 10. Next, a wavelength conversion material layer 130' is formed on the substrate 10 to cover the micro light emitting diode 120. The wavelength conversion material layer 130' is, for example, a phosphor paste, and may be, for example, a yellow phosphor paste, a red phosphor paste, a green phosphor paste, a blue phosphor paste, or an yttrium aluminum garnet phosphor paste.
Next, referring to fig. 9 and fig. 10, the substrate 10 is removed and a singulation process is performed to cut the wavelength conversion material layer 130', thereby forming a plurality of light emitting units U2. Here, each light emitting unit U2 includes one micro light emitting diode 120 and one wavelength conversion layer 130b covering the micro light emitting diode 120. That is, the wavelength conversion layers 130b are separated from each other and cover the micro leds 120, respectively, to define a plurality of light emitting units U2.
Next, referring to fig. 11, the micro light emitting diode 120 is bonded on the driving substrate 110, wherein the light emitting units U2 are disposed on the driving substrate 110 separately from each other.
Then, referring to fig. 11 and 12, a reflective colloid 140 is formed to cover the periphery of the light emitting units U2 and the driving substrate 110. Here, the driving substrate 110 and the light emitting unit U2 bonded to the driving substrate 110 are placed in the mold M, and the mold T is filled with the glue and cured to form the reflective glue 140 covering the periphery of the light emitting unit U2 and covering the driving substrate 110. That is, the reflective colloid 140 is formed by molding the cup shell integrally with the mold.
Finally, referring to fig. 12 and fig. 13, the mold M is demolded to form the light emitting diode package structure 100b. Here, the light emitting diode package structure 100b includes a driving substrate 110, a plurality of light emitting units U2, and a reflective encapsulant 140. The drive substrate 110 has a surface 112. The plurality of light emitting units U2 include a plurality of micro light emitting diodes 120 and a plurality of wavelength conversion layers 130b. Here, a wavelength conversion layer 130b covers a micro led 120 to define a light emitting unit U2. The micro light emitting diodes 120 are disposed on the surface 112 of the driving substrate 110 separately from each other and electrically connected to the driving substrate 110. The wavelength conversion layer 130b covers the micro light emitting diode 120. The reflective colloid 140 covers the periphery of the light emitting unit U2 and the driving substrate 110. The light emitting unit U2 is adapted to emit light L2, and the reflective colloid 140 is adapted to reflect the light L2 to concentrate in the light emitting direction E. Therefore, the light L2 emitted by the light-emitting unit U2 can be emitted more intensively, and the concentrated light emission on the front surface can be increased. Therefore, the light emitting diode package structure 100b of the present embodiment can increase the forward light output to improve the light output directivity.
Fig. 14 and 15 are schematic cross-sectional views of various light emitting units according to various embodiments of the present invention. It should be noted that in the steps of fig. 5 and/or fig. 10, that is, in the process of singulation, the light emitting device may be cut into a single light bar or a single light emitting unit U3 as shown in fig. 14 by a special cutting method, wherein the shape of the wavelength conversion layer 130c is in an inverted trapezoid shape in a cross-section view, so as to increase the light emitting efficiency. In another embodiment, referring to fig. 15, the light emitting unit U4 further includes a transparent encapsulant 150 covering the micro light emitting diode 120 and located between the micro light emitting diode 120 and the wavelength conversion layer 130 d. The wavelength conversion layer 130d is rectangular in cross section, and the transparent colloid 150 is inverted trapezoidal in shape, so that the light extraction efficiency can be increased. In one embodiment, the wavelength conversion layer 130d is also a phosphor film.
In summary, in the design of the led package structure of the present invention, the reflective colloid covers the periphery of the light emitting unit and the driving substrate, wherein the light emitting unit is adapted to emit light, and the reflective colloid is adapted to reflect the light to concentrate to the light emitting direction, so that the light emitted by the light emitting unit can be emitted more intensively, and the concentrated light emitting on the front surface can be increased. Therefore, the light emitting diode packaging structure can increase the forward light output quantity so as to improve the light output directivity. In addition, when the light guide plate is coupled with the light guide plate, higher light emitting efficiency can be achieved, and the brightness performance of the display can be improved.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (10)
1. A light emitting diode package structure, comprising:
a drive substrate having a surface;
The at least one light-emitting unit comprises at least one micro light-emitting diode and at least one wavelength conversion layer, wherein the at least one micro light-emitting diode is arranged on the surface of the driving substrate and is electrically connected with the driving substrate, and the at least one wavelength conversion layer covers the at least one micro light-emitting diode; and
The reflective colloid covers the periphery of the at least one light-emitting unit and the driving substrate, wherein the at least one light-emitting unit is suitable for emitting light, and the reflective colloid is suitable for reflecting the light to concentrate to the light emitting direction.
2. The led package structure of claim 1, wherein the at least one light emitting unit is a light emitting unit, the at least one micro led comprises a plurality of micro leds, the at least one wavelength conversion layer is a wavelength conversion layer, the plurality of micro leds are disposed on the driving substrate separately from each other, and the wavelength conversion layer covers the plurality of micro leds to define the light emitting unit.
3. The led package structure of claim 1, wherein the at least one light emitting unit comprises a plurality of light emitting units, the at least one micro led comprises a plurality of micro leds, the at least one wavelength conversion layer comprises a plurality of wavelength conversion layers, the plurality of micro leds are disposed on the driving substrate separately from each other, and the plurality of wavelength conversion layers are separated from each other and cover the plurality of micro leds respectively to define the plurality of light emitting units.
4. The led package structure of claim 1, wherein the shape of the at least one wavelength conversion layer comprises an inverted trapezoid or rectangle in cross-section.
5. The light emitting diode package as set forth in claim 1, wherein the at least one light emitting unit further comprises:
The transparent colloid is used for coating the at least one micro light emitting diode and is positioned between the at least one micro light emitting diode and the at least one wavelength conversion layer, wherein the at least one wavelength conversion layer is rectangular in shape and the transparent colloid is inverted trapezoid in shape in cross section.
6. The manufacturing method of the light-emitting diode packaging structure is characterized by comprising the following steps:
Providing a driving substrate and at least one micro light emitting diode;
Bonding the at least one micro light emitting diode on the driving substrate, wherein the driving substrate is provided with a surface, and the at least one micro light emitting diode is configured on the surface of the driving substrate and is electrically connected with the driving substrate;
Forming at least one wavelength conversion layer to cover the at least one micro light emitting diode to define at least one light emitting unit; and
And forming a reflective colloid to cover the periphery of the at least one light-emitting unit and the driving substrate, wherein the at least one light-emitting unit is suitable for emitting light, and the reflective colloid is suitable for reflecting the light to concentrate to the light-emitting direction.
7. The method according to claim 6, wherein the at least one light emitting unit is a light emitting unit, the at least one micro light emitting diode includes a plurality of micro light emitting diodes, the at least one wavelength conversion layer is a wavelength conversion layer, the plurality of micro light emitting diodes are disposed on the driving substrate separately from each other, and the wavelength conversion layer covers the plurality of micro light emitting diodes and the driving substrate.
8. The method of manufacturing a light emitting diode package as set forth in claim 7, further comprising:
before the reflective colloid is formed, a singulation process is performed to cut the wavelength conversion layer and the driving substrate, thereby defining the light emitting unit on the driving substrate.
9. The method of manufacturing a light emitting diode package as set forth in claim 6, further comprising:
Providing a substrate before providing the driving substrate and the at least one micro light emitting diode, wherein the at least one micro light emitting diode comprises a plurality of micro light emitting diodes which are arranged on the substrate separately from each other;
forming a wavelength conversion material layer on the substrate to cover the plurality of micro light emitting diodes;
Removing the substrate and performing a singulation process to cut the wavelength conversion material layer to form at least one light emitting unit, wherein the at least one light emitting unit comprises a plurality of light emitting units, the at least one wavelength conversion layer comprises a plurality of wavelength conversion layers, and the plurality of wavelength conversion layers are separated from each other and respectively cover the plurality of micro light emitting diodes to define the plurality of light emitting units; and
And bonding the micro light emitting diodes on the driving substrate, wherein the light emitting units are arranged on the driving substrate separately from each other.
10. The method of claim 6, wherein the forming the reflective gel comprises molding the reflective gel in a mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211472725.1A CN118053867A (en) | 2022-11-17 | 2022-11-17 | Light-emitting diode packaging structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211472725.1A CN118053867A (en) | 2022-11-17 | 2022-11-17 | Light-emitting diode packaging structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118053867A true CN118053867A (en) | 2024-05-17 |
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ID=91050888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211472725.1A Pending CN118053867A (en) | 2022-11-17 | 2022-11-17 | Light-emitting diode packaging structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118053867A (en) |
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2022
- 2022-11-17 CN CN202211472725.1A patent/CN118053867A/en active Pending
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