CN118038951A - Power supply switching circuit, device and semiconductor test system - Google Patents
Power supply switching circuit, device and semiconductor test system Download PDFInfo
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Abstract
The disclosure provides a power supply switching circuit, a device and a semiconductor test system, and relates to the technical field of semiconductors. The power supply switching circuit comprises: the input end of the power supply switching component is used for connecting each input power supply in the test system, and the power supply switching component is used for controlling the electric connection between each input power supply and each test jig in the test system under the action of a control signal; the input end of the voltage conversion component is electrically connected with the output end of the power supply switching component, the output end of the voltage conversion component is electrically connected with at least one power supply end of the test fixture, and the voltage conversion component is used for converting the input voltage of the input power supply into the preset input voltage of the test fixture. The technical problem of high testing cost of the DDR5 at present is solved, and the technical effect of reducing the testing cost of the DDR5 is achieved.
Description
Technical Field
The present disclosure relates to the field of semiconductor technologies, and in particular, to a power switching circuit, a device, and a semiconductor test system.
Background
With the continuous innovation of memory technology, each semiconductor manufacturer also continuously pushes out new products, but each series of products needs to be subjected to strict product test before being marketed, and only after all the projects are qualified in test, the products can be marketed.
However, the different series of the same product may not be very different, such as DDR4 (Synchronous Dynamic Random Access Memory, fourth generation DDR sdram) and DDR5 (Synchronous Dynamic Random Access Memory, fifth generation DDR sdram), and if DDR5 needs to be tested, each test fixture in the test system and the corresponding test process need to be redesigned or a new test fixture purchased, which results in a significant increase in test time cost.
Therefore, the current DDR5 test cost is relatively high.
Disclosure of Invention
The disclosure provides a power supply switching circuit, a device and a semiconductor test system, so as to reduce the test cost of DDR 5.
In a first aspect, an embodiment of the present disclosure provides a power switching circuit, including:
The input end of the power supply switching component is used for connecting each input power supply in the test system, and the power supply switching component is used for controlling the electric connection between each input power supply and each test jig in the test system under the action of the control signal;
the input end of the voltage conversion component is electrically connected with the output end of the power supply switching component, the output end of the voltage conversion component is electrically connected with the power supply end of at least one test fixture, and the voltage conversion component is used for converting the input voltage of an input power supply into the preset input voltage of the test fixture.
In an alternative embodiment of the present disclosure, a power switching assembly includes at least:
The input end of the first power supply switching component is used for being connected with a stabilized voltage power supply in the test system, and the output end of the first power supply switching component is electrically connected with the stabilized voltage power supply input end of each test fixture respectively;
The input end of the second power supply switching component is used for being connected with an enabling power supply in the test system, and the output end of the second power supply switching component is electrically connected with the enabling power supply input end of each test fixture.
In an alternative embodiment of the present disclosure, a power switching assembly includes:
An inductance assembly for receiving a control signal;
The control end of the switch component is connected with the inductance component in a signal way, the first end of the switch component is used for being connected with each input power supply in the test system, and the second end of the switch component is electrically connected with each test jig in the test system.
In an alternative embodiment of the present disclosure, the power supply terminal of the inductance component is electrically connected with a control word source in the test system, and the inductance component controls the switching of the switch component based on a level signal output by the control word source.
In an alternative embodiment of the disclosure, each test fixture includes at least a first test fixture, wherein a first preset input voltage of the first test fixture is equal to an input voltage of an input power supply, and a first output end of the power switching assembly is electrically connected with a power supply end of the first test fixture.
In an alternative embodiment of the disclosure, each test fixture includes at least a second test fixture, where a second preset input voltage of the second test fixture is unequal to an input voltage of the input power supply, an input end of the voltage conversion component is electrically connected to a second output end of the power supply switching component, an output end of the voltage conversion component is electrically connected to a power supply end of the second test fixture, and the voltage conversion component is configured to convert the input voltage of the connected input power supply into the second preset input voltage of the second test fixture.
In an alternative embodiment of the present disclosure, a voltage conversion assembly includes:
the input end of the controller is electrically connected with the output end of the power supply switching component, and the controller is used for converting the input voltage of an input power supply into the preset input voltage of the test fixture;
the input end of the inverter circuit is electrically connected with the output end of the controller, the output end of the inverter circuit is electrically connected with the power end of each test fixture, and the inverter circuit is used for converting direct current of preset input voltage output by the controller into alternating current.
In an alternative embodiment of the present disclosure, the power switching circuit further includes:
The first end of the first voltage stabilizing component is electrically connected with the self-boosting end of the controller, and the second end of the first voltage stabilizing component is electrically connected with the switch control end of the inverter circuit.
In an alternative embodiment of the present disclosure, the power switching circuit further includes:
The first end of the second voltage stabilizing component is electrically connected with the output end of the power supply switching component, and the second end of the second voltage stabilizing component is used for being grounded and is electrically connected with the grounding end of the controller and the grounding end of the inverter circuit respectively.
In an alternative embodiment of the present disclosure, the power switching circuit further includes:
And the first end of the overload protection component is electrically connected with the output end of the inverter circuit, and the second end of the overload protection component is electrically connected with the power supply end of each test jig.
In an alternative embodiment of the present disclosure, the power switching circuit further includes:
and the third voltage stabilizing component is connected with the inverter circuit in parallel.
In an alternative embodiment of the present disclosure, the power switching circuit further includes:
The first input end of the voltage dividing component is electrically connected with the first output end of the inverter circuit, the second input end of the voltage dividing component is electrically connected with the second output end of the inverter circuit, the first output end of the voltage dividing component is used for outputting the preset input voltage of the first potential, and the second output end of the voltage dividing component is used for outputting the preset input voltage of the second potential.
In an alternative embodiment of the present disclosure, the input voltage of the input power is the input voltage of DDR4, and the preset input voltage of the test fixture is the input voltage of DDR 5.
In a second aspect, an embodiment of the present disclosure provides a power switching device, including:
A switching device body;
The power switching circuit according to any one of the above claims, provided in the switching device body.
In a third aspect, one embodiment of the present disclosure provides a semiconductor test system comprising:
The power supply switching device;
The power end of the at least one test fixture is electrically connected with the output end of the voltage conversion component in the power supply switching device respectively.
The technical scheme of the present disclosure has the following beneficial effects:
The power supply switching circuit comprises a power supply switching component and a voltage conversion component, wherein the input end of the power supply switching component is used for connecting each input power supply in the test system, the output end of the power supply switching component is electrically connected with the input end of the voltage conversion component, and the power supply switching component is used for controlling the electrical connection between each input power supply and each test fixture in the test system under the action of a control signal so as to provide corresponding input power supply for the current test fixture; meanwhile, the input end of the voltage conversion component is electrically connected with the output end of the power supply switching component, the output end of the voltage conversion component is electrically connected with the power supply end of at least one test fixture, and the voltage conversion component is used for converting the input voltage of an input power supply into the preset input voltage of the test fixture. By the mode, when a new semiconductor device of the same type is tested, the existing power supply is converted into the preset input voltage required by each test jig in the test platform through the power supply switching circuit, and the new power supply or the new test jig is not required to be redeveloped or purchased, so that the technical problem of high testing cost of the existing DDR5 is solved, and the technical effect of reducing the testing cost of the semiconductor device of the same type is achieved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure. It will be apparent to those of ordinary skill in the art that the drawings in the following description are merely some embodiments of the present disclosure and that other drawings may be derived from these drawings without undue effort.
Fig. 1 is a schematic diagram showing a configuration of a power supply switching circuit in the present exemplary embodiment;
fig. 2 is a schematic circuit diagram showing a first power switching component in the present exemplary embodiment;
Fig. 3 is a schematic circuit diagram showing a second power switching component in the present exemplary embodiment;
Fig. 4 is a schematic diagram showing a circuit configuration of the voltage conversion assembly in the present exemplary embodiment;
Fig. 5 shows a schematic structural diagram of a power switching device in the present exemplary embodiment.
Wherein:
10. A power supply switching circuit; 100. a power switching assembly; 110. a first power switching assembly; 120. a second power switching assembly; 200. a voltage conversion assembly; u1, a controller; 210. an inverter circuit; c2, a first voltage stabilizing component; c3, a second voltage stabilizing component; 310. a third voltage stabilizing component; f1, an overload protection assembly; 400. a voltage dividing assembly; 20. a power supply switching device; 201. a housing; 202. inputting a power supply; 203. and a semiconductor socket to be tested.
Detailed Description
Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments may be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the present disclosure. However, those skilled in the art will recognize that the aspects of the present disclosure may be practiced with one or more of the specific details, or with other methods, components, devices, steps, etc. In other instances, well-known technical solutions have not been shown or described in detail to avoid obscuring aspects of the present disclosure.
The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The terms "connected," "coupled," and "connected," as used throughout this disclosure, unless otherwise indicated, all refer to both direct and indirect connections (couplings). In the description of the present disclosure, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present disclosure.
In this disclosure, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus a repetitive description thereof will be omitted. Some of the block diagrams shown in the figures are functional entities and do not necessarily correspond to physically or logically separate entities. These functional entities may be implemented in software or in one or more hardware modules or integrated circuits or in different networks and/or processor devices and/or microcontroller devices.
The flow diagrams depicted in the figures are exemplary only and not necessarily all steps are included. For example, some steps may be decomposed, and some steps may be combined or partially combined, so that the order of actual execution may be changed according to actual situations.
In the related art, with the continuous innovation of the memory technology, each semiconductor manufacturer also continuously pushes out new products, but each series of products needs to be subjected to strict product test before being marketed, and only after all the projects are qualified in test, the products can be marketed. However, the different series of the same product may not be very different, such as DDR4 (Synchronous Dynamic Random Access Memory, fourth generation DDR sdram) and DDR5 (Synchronous Dynamic Random Access Memory, fifth generation DDR sdram), and if DDR5 needs to be tested, each test fixture in the test system and the corresponding test process need to be redesigned or a new test fixture purchased, which results in a significant increase in test time cost. Therefore, the current DDR5 test cost is relatively high.
In view of the foregoing, embodiments of the present disclosure provide a power switching circuit for reducing the testing cost of DDR5, and the following details of the embodiments of the power switching circuit provided by the embodiments of the present disclosure are described with reference to the accompanying drawings:
referring to fig. 1, a power switching circuit 10 provided in an embodiment of the disclosure includes: a power switching assembly 100 and a voltage conversion assembly 200, wherein:
The input end of the power switching component 100 is used for connecting each input power supply in the test system, the output end of the power switching component 100 is electrically connected with the input end of the voltage conversion component 200, and the power switching component 100 is used for controlling the electrical connection between each input power supply and each test fixture in the test system under the action of a control signal. A test system, referred to as a platform for testing semiconductor devices, such as DDR4 and DDR5, may include one or more test jigs to perform different types of performance tests on the semiconductor devices. A semiconductor test system generally includes a plurality of input power sources for providing corresponding input power sources, such as VDD, VPP, VCC, VDDSPD, for semiconductor testing in different test tools. It should be explained that the test system can test different series of the same product, for example, DDR4 and DDR5 can be tested separately. For example, only one type of performance test can be performed on the semiconductor to be tested by one test fixture at a time, the power switching assembly 100 can switch to a target input power corresponding to the current test fixture based on the control signal, and power the current test fixture through the target input power. It should be explained that the control signal may be generated by a motherboard of the test system or may be sent by other control systems, and the embodiment of the disclosure is not specifically limited and may be specifically set according to practical situations.
The input end of the voltage conversion assembly 200 is electrically connected with the output end of the power switching assembly 100, the output end of the voltage conversion assembly 200 is electrically connected with the power end of at least one test fixture, and the voltage conversion assembly 200 is used for converting the input voltage of the input power source into the preset input voltage of the test fixture. The voltage output by the current input power supply in the test system is different from the preset input voltage actually required by the test fixture to be used for testing the semiconductor to be tested, but the input voltage required by one test fixture for testing one semiconductor to be tested is fixed, so that one voltage conversion component 200 can be set for the same input voltage or the semiconductor to be tested in the same input voltage range so as to convert the input voltage accessed by the input power supply into the corresponding preset input voltage.
The embodiment of the disclosure provides a power switching circuit 10, which comprises a power switching component 100 and a voltage conversion component 200, wherein the input end of the power switching component 100 is used for connecting each input power supply in a test system, the output end of the power switching component 100 is electrically connected with the input end of the voltage conversion component 200, and the power switching component 100 is used for controlling the electrical connection between each input power supply and each test fixture in the test system under the action of a control signal so as to provide corresponding input power supply for the current test fixture; meanwhile, the input end of the voltage conversion assembly 200 is electrically connected with the output end of the power supply switching assembly 100, the output end of the voltage conversion assembly 200 is electrically connected with the power supply end of at least one test fixture, and the voltage conversion assembly 200 is used for converting the input voltage of the input power supply into the preset input voltage of the test fixture. In this way, when testing a new semiconductor device of the same type, the existing power supply is converted into the preset input voltage required by each test fixture in the test platform through the power supply switching circuit 10, and the new power supply or the new test fixture is not required to be redeveloped or purchased, so that the technical problem of high testing cost of the existing DDR5 is solved, and the technical effect of reducing the testing cost of the semiconductor device of the same type is achieved.
Referring to fig. 2 and 3, in an alternative embodiment of the present disclosure, the power switching assembly 100 at least includes: the first power switching component 110 and the second power switching component 120, wherein:
Referring to fig. 2, the input end of the first power switching element 110 is used for connecting a voltage-stabilized power supply in the test system, for example, the vin_bulk_5v pin of DDR5 is connected to the VDD input power supply of DDR4 in the test system, the output end of the first power switching element 110 is electrically connected to the voltage-stabilized power supply input end of each test fixture, for example, the T5833ES test fixture corresponding to the vin_bulk_pin of DDR5, and the FPGA test fixture corresponding to the vin_bulk_pin of DDR 5.
Referring to fig. 3, the input end of the second power switching component 120 is used for connecting an enable power supply in the test system, for example, the pwr_en_3.3V pin of DDR5 is connected to the VPP input power supply of DDR4 in the test system, and the output end of the second power switching component 120 is electrically connected to the enable power supply input end of each test fixture, for example, the T5833ES test fixture corresponding to the pwr_en_pin of DDR5 and the FPGA test fixture corresponding to the pwr_en_pin of DDR 5.
The power switching component 100 of the disclosed embodiment includes a first power switching component 110 and a second power switching component 120, and performs independent switching control in different test tools for different stabilized voltage power supplies and enabling power supplies, so that the input voltage is more accurate, and the power switching is more reliable.
With continued reference to fig. 2 and 3, in an alternative embodiment of the present disclosure, the power switching assembly 100 includes an inductance assembly L1 and a switch assembly K1, wherein:
The inductance component L1 may be one or more (at least two) inductors, where the inductance component L1 is configured to receive a control signal, drive the inductance component L1 to work by using the control signal to generate a magnetic field, and form mutual inductance with the switch component K1 by using the magnetic field, so as to control on-off or switching of the electronic switch.
The control end of the switch component K1 is connected with the inductance component L1 in a signal mode, the first end of the switch component K1 is used for being connected with each input power supply in the test system, and the second end of the switch component K1 is electrically connected with each test jig in the test system. The switch component K1 is a multi-terminal switching electronic switch, that is, the second terminal of the switch component K1 can be switched between a plurality of test tools to connect the input power and the different test tools. It should be explained that the second end of the switch component K1 can only be electrically connected with one test fixture at a time, so as to ensure that only one test fixture works at a time, avoid mutual interference caused by simultaneous operation of a plurality of test fixtures, and further improve the reliability of the test.
The power supply switching assembly 100 of the embodiment of the disclosure includes an inductance assembly L1 and a switch assembly K1, and the switch assembly K1 is controlled by the inductance assembly L1 to be electrically connected with each test fixture in the test system, so that the power supply switching assembly is simple in structure and lower in cost.
In an alternative embodiment of the present disclosure, the power terminal of the inductance assembly L1 is electrically connected to a control word source (terminal control word) in the test system, such as via SPDVDD power connected to the MCW2.5V pin terminal of fig. 3 through fig. 2. The inductance component L1 controls the switching of the switch component K1 based on the level signal output by the control word source, and controls the magnetic field of the inductance component L1 to be generated and turned off through the level signal of the control word source, for example, the signal output by the control word source is a high level signal, the inductance component L1 generates a stronger magnetic field, and the second end of the switch component K1 is adsorbed to the connecting end of a second test fixture (for example, an FPGA test fixture); the signal output by the control word source is a low level signal, the magnetic field generated by the inductance component L1 is weakened, and the second end of the switch component K1 is switched to the connecting end of the first test fixture (for example, the T5833ES test fixture). Of course, the structure and operation of the inductance component L1 and the switch component K1 are not limited to this, and may be set according to actual circumstances.
In the embodiment, the control signal is provided for the inductance component L1 through the voltage of the control word source in the test system, the control signal is not required to be provided additionally, the structure of the power supply switching circuit is simplified, the cost is lower, and the test cost of the semiconductor test is further reduced.
In an alternative embodiment of the disclosure, each of the test tools includes at least a first test tool, where a first preset input voltage of the first test tool is equal to an input voltage of the input power, the first test tool may be, for example, a T5833ES test tool, and a first output end of the power switching assembly 100 is electrically connected to a power end of the first test tool. For example, the preset input voltage of the first test fixture is 5V and 3.3V, and the input voltage of the first test fixture is 0-5V, which can be freely adjusted, so that different semiconductors to be tested, such as DDR4 and DDR5, can be freely adjusted directly through the input voltage without further voltage conversion through the voltage conversion component 200, i.e., the power switching circuit 10 provided in the embodiment of the present disclosure can save a part of the voltage conversion components 200, and further reduce the internal resistance, power consumption and cost.
In an optional embodiment of the disclosure, each of the test tools includes at least a second test tool, where a second preset input voltage of the second test tool is not equal to an input voltage of the input power source, and the second test tool may be, for example, an FPGA test tool. The input end of the voltage conversion assembly 200 is electrically connected to the second output end of the power switching assembly 100, the output end of the voltage conversion assembly 200 is electrically connected to the power end of the second test fixture, and the voltage conversion assembly 200 is configured to convert the input voltage of the connected input power source into a second preset input voltage of the second test fixture. For example, the preset input voltages of the second test fixture FPGA are 5V and 3.3V, and the second test fixture FPGA has no two voltages, only 12V input voltage, so the 12V voltage can be converted into the required 5V and 3.3V by the voltage conversion component 200, such as a DC-DC step-down circuit or a step-down integrated chip. According to the embodiment of the disclosure, the input voltage of the input power supply is converted into the second preset input voltage of the second test fixture through the voltage conversion component 200, no additional new power supply is needed, and the required second preset input voltage can be provided for different semiconductors when the second test is performed only by converting the voltage based on the existing test system, so that the need of redevelopment or purchase of the corresponding test fixture for different semiconductors to be tested is avoided, and the test cost is greatly saved.
Referring to fig. 4, in an alternative embodiment of the present disclosure, the voltage conversion assembly 200 includes: a controller U1 and an inverter circuit 210, wherein:
The input end of the controller U1 is electrically connected to the output end of the power switching assembly 100, and the controller U1 is configured to convert the input voltage of the input power into a preset input voltage of the test fixture. The controller U1 is a voltage conversion chip, such as a power supply voltage stabilizing chip of AH8324, and converts an input voltage of 12V into an output voltage of 3.3V.
The input end of the inverter circuit 210 is electrically connected to the output end of the controller U1, the output end of the inverter circuit 210 is electrically connected to the power end of each test fixture, and the inverter circuit 210 is configured to convert the dc power of the preset input voltage output by the controller U1 into ac power, i.e. convert the digital signal into an analog signal for each test fixture.
The voltage conversion assembly 200 of the embodiment of the disclosure includes a controller U1 and an inverter circuit 210, firstly converts the input voltage of each input power source into a level signal of a preset voltage, and then converts each level signal into an alternating current which can be directly used by each test fixture through the inverter circuit 210.
With continued reference to fig. 4, in an alternative embodiment of the present disclosure, the power switching circuit 10 further includes: a first voltage stabilizing component C2, a second voltage stabilizing component C3, and a third voltage stabilizing component 310, wherein:
The first end of the first voltage stabilizing component C2 is electrically connected to the self-boosting end of the controller U1, and the second end of the first voltage stabilizing component C2 is electrically connected to the switch control end of the inverter circuit 210.
The first end of the second voltage stabilizing component C3 is electrically connected to the output end of the power switching component, and the second end of the second voltage stabilizing component C3 is grounded and electrically connected to the ground end of the controller U1 and the ground end of the inverter circuit 210, respectively.
The third voltage stabilizing component 310 is connected in parallel with the inverter circuit 210.
The first voltage stabilizing component C2, the second voltage stabilizing component C3 and the third voltage stabilizing component 310 may be composed of one or more capacitors, and the capacitors are used to prevent voltage abrupt change, so as to improve stability and safety of the treatment switching circuit.
With continued reference to fig. 4, in an alternative embodiment of the present disclosure, the power switching circuit 10 further includes: overload protection assembly F1.
The first end of the overload protection component F1 is electrically connected to the output end of the inverter circuit 210, the second end of the overload protection component F1 is electrically connected to the power end of each test fixture, and the overload protection component F1 is used for automatically cutting off when the current exceeds a preset threshold value, thereby protecting each connected test fixture and further improving the safety and reliability of the power switching circuit 10. The overload protection assembly F1 may be a fuse, etc., and is not intended to be exhaustive.
With continued reference to fig. 4, in an alternative embodiment of the present disclosure, the power switching circuit 10 further includes: a voltage divider assembly 400, wherein:
The first input end of the voltage dividing component 400 is electrically connected with the first output end of the inverter circuit 210, the second input end of the voltage dividing component 400 is electrically connected with the second output end of the inverter circuit 210, the first output end of the voltage dividing component 400 is used for outputting a preset input voltage of a first potential, and the second output end of the voltage dividing component 400 is used for outputting a preset input voltage of a second potential. The voltage dividing component 400 may be formed by two or more resistors, and the total voltage of the two output terminals of the inverter circuit 210 is divided into a preset input voltage of a first potential and a preset input voltage of a second potential according to actual potential requirements through the resistance voltage dividing performance of the resistors. It should be noted that, the number of divided voltages and the ratio of divided voltages of the first potential, the second potential, and the total voltage outputted from the inverter circuit 210 by the voltage dividing assembly 400 may be specifically set according to the actual situation, and are not specifically limited herein, and only the voltage dividing function may be implemented.
According to the embodiment of the disclosure, the voltage output by the inverter circuit 210 is divided into the preset input voltages of the first potential and the second potential according to actual needs by the voltage dividing assembly 400, so that the conversion of the voltage value is conveniently performed according to the actual needs, different semiconductors to be tested can be flexibly adapted, and the adaptability of the power supply switching circuit 10 provided by the embodiment of the disclosure can be further improved.
In an alternative embodiment of the present disclosure, the input voltage of the input power is the input voltage of DDR4, and the preset input voltage of the test fixture is the input voltage of DDR 5. That is, in the embodiment of the disclosure, through the power switching circuit 10 provided in the embodiment of the disclosure, each input power supply in the test system for testing the DDR4 is converted, so that the DDR5 can be tested based on each test fixture in the same test system at the same time, the development or repurchase of the test system and each test fixture for the DDR5 is avoided, and the test cost of the DDR5 is reduced.
Referring to fig. 5, an embodiment of the present disclosure provides a power switching device 20, including: the switching device body and the power switching circuit 10, wherein:
The adapter body provides a substrate for the power supply adapter circuit 10, such as a housing 201, each input power supply 202, a semiconductor socket 203 to be tested, a circuit carrier board (not shown in fig. 5), etc., and the adapter body may be specifically set according to actual needs, and embodiments of the present disclosure are not specifically limited.
The power switching circuit 10 of any one of the above, comprising: the power switching assembly 100 and the voltage converting assembly 200 are disposed on the adapter body. The beneficial effects of the power switching circuit 10 are described in detail in the above embodiments, and are not described herein.
According to the power switching device 20, when a new semiconductor device of the same type is tested, the existing power supply is converted into the preset input voltage required by each test fixture in the test platform through the power switching circuit 10, and new power supply or new test fixture does not need to be developed or purchased again, so that the technical problem of high testing cost of the existing DDR5 is solved, and the technical effect of reducing the testing cost of the semiconductor device of the same type is achieved.
In one embodiment of the present disclosure, there is provided a semiconductor test system including: the power switching device 20 and at least one test fixture.
The beneficial effects of the power switching device 20 are described in detail in the above embodiments, and are not described herein.
The power end of the at least one test fixture is electrically connected to the output end of the voltage conversion component 200 in the power switching device 20, for performing performance test on the semiconductor to be tested, for example, the power end may include a wafer test fixture T5833ES, a product test fixture FPGA, and the like, which are not meant to be exhaustive.
According to the embodiment of the disclosure, when a new semiconductor device of the same type is tested, the existing power supply is converted into the preset input voltage required by each test fixture in the test platform through the power supply switching circuit 10, and new power supply or new test fixture is not required to be redeveloped or purchased, so that the technical problem of high testing cost of the existing DDR5 is solved, and the technical effect of reducing the testing cost of the semiconductor device of the same type is achieved.
Those skilled in the art will appreciate that the various aspects of the present disclosure may be implemented as a system, method, or program product. Accordingly, various aspects of the disclosure may be embodied in the following forms, namely: an entirely hardware embodiment, an entirely software embodiment (including firmware, micro-code, etc.) or an embodiment combining hardware and software aspects may be referred to herein as a "circuit," module "or" system. Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following the general principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples merely represent several embodiments of the present disclosure, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that variations and modifications can be made by those skilled in the art without departing from the spirit of the disclosure, which are within the scope of the disclosure. Accordingly, the scope of protection of the present disclosure should be determined by the following claims.
Claims (15)
1. A power switching circuit, comprising:
the input end of the power supply switching component is used for connecting each input power supply in the test system, and the power supply switching component is used for controlling the electric connection between each input power supply and each test jig in the test system under the action of a control signal;
the input end of the voltage conversion component is electrically connected with the output end of the power supply switching component, the output end of the voltage conversion component is electrically connected with at least one power supply end of the test fixture, and the voltage conversion component is used for converting the input voltage of the input power supply into the preset input voltage of the test fixture.
2. The power switching circuit of claim 1, wherein the power switching assembly comprises at least:
The input end of the first power supply switching component is used for being connected with a voltage-stabilized power supply in the test system, and the output end of the first power supply switching component is electrically connected with the voltage-stabilized power supply input end of each test fixture respectively;
The input end of the second power supply switching component is used for being connected with an enabling power supply in the test system, and the output end of the second power supply switching component is electrically connected with the enabling power supply input end of each test fixture respectively.
3. The power switching circuit of claim 1, wherein the power switching assembly comprises:
an inductance assembly for receiving the control signal;
the control end of the switch assembly is in signal connection with the inductance assembly, the first end of the switch assembly is used for being connected with each input power supply in the test system, and the second end of the switch assembly is electrically connected with each test jig in the test system.
4. A power switching circuit according to claim 3 wherein the power supply terminal of the inductance component is electrically connected to a control word source in the test system, the inductance component controlling the switching of the switching component based on a level signal output by the control word source.
5. The power switching circuit of claim 1, wherein each of the test fixtures comprises at least a first test fixture, wherein a first predetermined input voltage of the first test fixture is equal to an input voltage of the input power source, and a first output terminal of the power switching assembly is electrically connected to a power terminal of the first test fixture.
6. The power switching circuit according to claim 1, wherein each of the test jigs comprises at least a second test jig, wherein a second preset input voltage of the second test jig is not equal to an input voltage of the input power source, an input end of the voltage conversion assembly is electrically connected to a second output end of the power switching assembly, an output end of the voltage conversion assembly is electrically connected to a power supply end of the second test jig, and the voltage conversion assembly is configured to convert the connected input voltage of the input power source into the second preset input voltage of the second test jig.
7. The power switching circuit according to claim 1, wherein the voltage conversion assembly comprises:
The input end of the controller is electrically connected with the output end of the power supply switching assembly, and the controller is used for converting the input voltage of the input power supply into the preset input voltage of the test fixture;
The input end of the inverter circuit is electrically connected with the output end of the controller, the output end of the inverter circuit is electrically connected with the power end of each test jig, and the inverter circuit is used for converting the direct current of the preset input voltage output by the controller into alternating current.
8. The power switching circuit according to claim 7, further comprising:
The first voltage stabilizing component is electrically connected with the self-boosting end of the controller, and the second end of the first voltage stabilizing component is electrically connected with the switch control end of the inverter circuit.
9. The power switching circuit according to claim 7, further comprising:
The first end of the second voltage stabilizing component is electrically connected with the output end of the power supply switching component, and the second end of the second voltage stabilizing component is used for being grounded and is electrically connected with the grounding end of the controller and the grounding end of the inverter circuit respectively.
10. The power switching circuit according to claim 7, further comprising:
and the first end of the overload protection component is electrically connected with the output end of the inverter circuit, and the second end of the overload protection component is electrically connected with the power supply end of each test jig.
11. The power switching circuit according to claim 7, further comprising:
and the third voltage stabilizing component is connected with the inverter circuit in parallel.
12. The power switching circuit according to claim 7, further comprising:
The first input end of the voltage dividing component is electrically connected with the first output end of the inverter circuit, the second input end of the voltage dividing component is electrically connected with the second output end of the inverter circuit, the first output end of the voltage dividing component is used for outputting a preset input voltage of a first potential, and the second output end of the voltage dividing component is used for outputting a preset input voltage of a second potential.
13. The power switching circuit according to any one of claims 1 to 12, wherein the input voltage of the input power is an input voltage of DDR4, and the preset input voltage of the test fixture is an input voltage of DDR 5.
14. A power switching device, comprising:
A switching device body;
the power switching circuit according to any one of claims 1-13, disposed on the switching device body.
15. A semiconductor test system, comprising:
The power switching device of claim 14;
The power supply end of the at least one test fixture is electrically connected with the output end of the voltage conversion component in the power supply switching device respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211394294.1A CN118038951A (en) | 2022-11-08 | 2022-11-08 | Power supply switching circuit, device and semiconductor test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211394294.1A CN118038951A (en) | 2022-11-08 | 2022-11-08 | Power supply switching circuit, device and semiconductor test system |
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| Publication Number | Publication Date |
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| CN118038951A true CN118038951A (en) | 2024-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211394294.1A Pending CN118038951A (en) | 2022-11-08 | 2022-11-08 | Power supply switching circuit, device and semiconductor test system |
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| Country | Link |
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| CN (1) | CN118038951A (en) |
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2022
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